Reinforced VPX sealed heat dissipation case

Abstract

The invention discloses a reinforced VPX sealed heat dissipation case which comprises a case frame, the interior of the case frame is divided into a functional area and an air cooling area, the functional area is connected with an upper cover plate, a lower cover plate and a front panel of the case frame, and the air cooling area wraps the other side faces of the functional area and conducts heat exchange. The functional area is provided with slots in parallel, the slots are used for inserting VPX modules, the VPX modules are fixed through fasteners, an air inlet is formed in a front panel of the case frame, a fan is arranged on a rear panel, the air inlet is communicated with the air cooling area, the bottom of the functional area is provided with a backboard printed board parallel to the rear panel, and the backboard printed board is communicated with the air cooling area. The external electric appliance ports on the front panel and the rear panel are connected through cooperation of a backboard printed board and a cable. According to the heat dissipation case, the functional area and the air cooling area of the case are completely divided and isolated, the sealing effect is good, cleaning and maintenance are convenient, aging of components and circuit boards can be effectively reduced, and the service life is greatly prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of VPX chassis equipment, in particular to a reinforced VPX sealed heat dissipation chassis. Background Art

[0002] The VPX bus is a new generation of high-speed serial bus standards proposed by the VITA organization in 2007 based on its VME bus. With the widespread application of the VPX bus in various fields, the increase in the use of VPX chassis in the field has put forward higher requirements for its environmental adaptability. As a result, there are increasingly higher requirements for the structural design of the VPX chassis. However, the current common VPX chassis have the following difficulties and defects in structural design:

[0003] (1) The heat dissipation effect of conduction cooling is not good. During the use of the VPX module, the heat of the module is mainly introduced into the chassis shell through the contact surface with the slots on both sides of the chassis, and then the heat is transferred to the air through convection heat exchange between the module and the air. With the increase in the total power of the equipment brought about by the functional integration of the VPX chassis and the increase in the external temperature environment, if the heat dissipation effect is not good, it is easy to overheat, thereby affecting the working performance and service life of the VPX module. Therefore, the simple conduction cooling structure can no longer meet the working requirements of the VPX chassis (equipment).

[0004] (2) It is difficult to achieve both air cooling and sealing functions at the same time. To solve the problem of poor heat dissipation of the VPX chassis, a fan is usually added to the chassis to meet the chassis' heat dissipation requirements through forced air cooling. However, even if dust grilles are designed at the air inlet and outlet, it is impossible to achieve complete sealing of the chassis. Moreover, the design of the dust grille will cause the air inlet and outlet to be blocked after long-term use, affecting the air cooling effect. The entry of moisture and foreign matter will also accelerate the aging of components and circuit boards, and easily cause damage.

[0005] (3) Installation and disassembly are difficult, and it is difficult to overhaul and maintain the chassis (equipment). The VPX chassis has many modules, interface boards, and backplanes, and the wiring relationships are complex, which makes assembly more complicated, especially maintenance and overhaul. The various surfaces of the chassis are mostly connected by screws or laser welding. If only screws are used for fastening, it is difficult to fully align the various surfaces of the chassis, resulting in misalignment of the upper and lower slots of the chassis, affecting the normal installation of the VPX module; if laser welding is used, the chassis is formed in one piece, which is not conducive to later overhaul and maintenance. Summary of the invention

[0006] In response to the above technical problems, the present invention proposes a reinforced VPX sealed heat dissipation chassis, which completely divides and isolates the functional area of ​​the chassis from the air cooling area, has good sealing effect, is convenient for cleaning and maintenance, can effectively reduce the aging of components and circuit boards, and greatly improves the service life.

[0007] A reinforced VPX sealed heat dissipation chassis comprises a chassis frame, wherein the interior of the chassis frame is divided into a functional area and an air-cooling area, wherein the functional area is connected to an upper cover plate, a lower cover plate and a front panel of the chassis frame, wherein the air-cooling area wraps the remaining side surfaces of the functional area and performs heat exchange, wherein slots for plugging in VPX modules are arranged in parallel in the functional area and the VPX modules are fixed by fasteners, an air inlet is arranged on the front panel of the chassis frame, a fan is arranged on the rear panel, wherein the air inlet is communicated with the air-cooling area, a back panel printed circuit board arranged parallel to the rear panel is provided at the bottom of the functional area, and the external electrical appliance ports on the front panel and the rear panel are connected by the back panel printed circuit board and cables.

[0008] As a preferred embodiment of the above technical solution, a protective cover is provided on the outer side of the backplane printed circuit board.

[0009] As a preferred embodiment of the above technical solution, the functional area is enclosed by a backplane printed circuit board, a front panel and symmetrically arranged left and right support plates, and a VPX module installation hole is opened on the front panel corresponding to the functional area, and the module installation hole is blocked by a protective cover.

[0010] As a preferred embodiment of the above technical solution, during positioning and installation, the support plate, the front panel and the upper and lower cover plates of the chassis frame are pre-positioned and installed through guide positioning pins.

[0011] As a preferred embodiment of the above technical solution, the slots are symmetrically arranged in parallel on the upper and lower cover plates.

[0012] As a preferred embodiment of the above technical solution, the air inlet channel located in the air cooling zone is arranged symmetrically with respect to the functional zone.

[0013] The beneficial effects of the present invention are:

[0014] 1. The functional area and the air-cooling area of ​​the chassis are completely separated and isolated. The functional area adopts a sealed structure design to block the aging and damage of components and circuit boards caused by the entry of moisture and foreign matter; at the same time, it solves the problem that air-cooling heat dissipation and sealing functions are difficult to achieve at the same time in most cases.

[0015] 2. The upper and lower covers adopt an integrated design of heat dissipation cold plate and VPX module slot. The heat dissipation efficiency of the VPX chassis is improved through a combination of air cooling and conduction cooling, providing a good heat dissipation environment for the VPX module.

[0016] 3. By adding guide positioning pins between the upper and lower covers, left and right baffles and the front panel of the chassis, the overall strength of the chassis is increased while achieving precise positioning when the chassis panels are spliced, reducing the difficulty of assembly. The support plates and rear panels on both sides of the air-cooling area can be removed independently, which is convenient for independent cleaning and maintenance of the air-cooling area. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the chassis frame composition of the VPX chassis described in an embodiment of the present invention.

[0018] Figure 2 Schematic diagram of the VPX chassis structure in an embodiment of the present invention.

[0019] Figure 3 This is another view of the schematic diagram of the VPX chassis structure composition described in an embodiment of the present invention.

[0020] Figure 4 Schematic diagram of the upper and lower cover plate structures in an embodiment of the present invention.

[0021] Figure 5 Schematic diagram of wind direction flow and cable connection in the air cooling zone according to an embodiment of the present invention.

[0022] Figure 6 Schematic diagram of the VPX module structure in an embodiment of the present invention.

[0023] The figure numbers are as follows: 1-chassis frame, 101-cover, 101a-heat dissipation cold plate, 102-front panel, 103-rear panel, 104-support plate, 2-functional area, 3-air cooling area, 4-VPX module, 5-slot, 6-air inlet, 7-fan, 8-backplane printed circuit board, 9-external electrical port, 10-cable, 11-protective cover, 12-baffle, 13-module mounting hole, 14-protective cover, 15-guide positioning pin, 16-air inlet channel. DETAILED DESCRIPTION

[0024] The technical solution of the present invention is described clearly and completely below in conjunction with the accompanying drawings of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] like Figures 1 to 6A reinforced VPX sealed heat dissipation chassis shown includes a chassis frame 1, the interior of the chassis frame 1 is divided into a functional area 2 and an air-cooling area 3, the functional area 2 is connected to the upper and lower cover plates 101 and the front panel 102 of the chassis frame 1, the air-cooling area 3 wraps the remaining sides of the functional area 2 and performs heat exchange, the functional area 2 is provided with slots 5 for plugging in VPX modules 4 in parallel and the VPX modules 4 are fixed by fasteners, an air inlet 6 is provided on the front panel 102 of the chassis frame 1, a fan 7 is provided on the rear panel 103, the air inlet 6 is connected to the air-cooling area 3, the bottom of the functional area 2 is a backplane printed circuit board 8 arranged parallel to the rear panel 103, and the front panel 102 and the external electrical port 9 on the rear panel 103 are connected by the backplane printed circuit board 8 and the cable 10.

[0026] It should be noted that the chassis frame 1 is composed of a front panel 102, a rear panel 103, upper and lower covers 101, left and right support plates 104 and a baffle 12. The support plate 104 can be removed independently, and a connecting cable 10 between the rear panel 103 and the backplane printed circuit board 8 is provided with a conversion plug, so that the rear panel 103 can be removed separately, thereby ensuring that the air-cooling zone 3 can be independently cleaned and maintained without disassembling the entire chassis.

[0027] The cover 101 adopts a two-in-one design of a heat dissipation cold plate 101a and a slot 5, that is, the VPX module 4 and the slot 5 on the upper and lower cover plates 101 are in close contact through a wedge-shaped locking strip, and the contact surface is coated with thermal grease. The heat dissipation cold plate 101a of the upper and lower cover plates 101 extends to the air cooling area 3 in space, and heat dissipation teeth are designed in the functional area 2 to improve the heat exchange efficiency with air convection. The heat dissipation efficiency of the VPX chassis is improved by combining conduction cooling and air cooling.

[0028] Silicon rubber sealing ropes are installed between the contact surfaces of the cover plate 101, the baffle plate 12, the front panel 102, the protective cover plate 14, and the protective cover 11. The functional area 2 of the chassis frame 1 is completely sealed and spatially isolated from the air cooling area 3, while realizing the air cooling and sealing functions of the chassis.

[0029] The external electrical interface 9 uses a waterproof and sealed connector and is equipped with a silicone rubber sealing pad. The cable 10 should be waterproof and dustproof. The gap between the protective cover 11 and the through-wall cable 10 is coated with Nanda 703 sealant to avoid the influence of the electrical connection on the sealing of the chassis functional area.

[0030] In this embodiment, a protective cover 11 is provided on the outer side of the backplane printed circuit board 8 .

[0031] In this embodiment, the functional area 2 is enclosed by a backplane printed circuit board 8, a front panel 102, and symmetrically arranged left and right support plates 104. A VPX module installation hole 13 is opened on the front panel 102 corresponding to the functional area 2, and the module installation hole 13 is blocked by a protective cover 14.

[0032] In this embodiment, during positioning and installation, the support plate 104 , the front panel 102 and the upper and lower cover plates 101 of the chassis frame 1 are pre-positioned and installed through guide positioning pins 15 .

[0033] In this embodiment, the slots 5 are symmetrically arranged on the upper and lower cover plates 101 .

[0034] In this embodiment, the air inlet channel 16 located in the air cooling area 3 is arranged symmetrically to the functional area 2 .

[0035] It is necessary to add that:

[0036] 1. For the guide locating pin 15, press one end of the upper and lower cover plates 101. It is recommended to use interference fit between the shaft and the hole to ensure positioning accuracy and improve the connection strength between the chassis panels. When assembling the guide locating pin 15 with the left and right support plates 104 and the front panel 102, it is recommended to use a medium clearance fit between the shaft and the hole to ensure that the chassis panels can be assembled and disassembled more easily and flexibly.

[0037] 2. The number of fans, air volume and other specifications of the VPX chassis need to be adjusted according to the actual overall power of the VPX chassis. The air inlet and air outlet areas need to be adjusted according to the total air volume of the chassis. If necessary, additional air inlets can be added to the removable support plates 104 on the left and right sides to improve air cooling efficiency.

[0038] 3. This embodiment uses a 19-inch rack-mounted chassis. The VPX module 4 is 3U in size. If a 6U VPX module is used, the height of the rack-mounted chassis, as well as the placement direction and number of the VPX modules 4 can be adjusted according to actual conditions, and are not limited to the module specifications and numbers shown in this embodiment.

[0039] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A reinforced VPX sealed heat dissipation chassis, characterized by: It includes a chassis frame, the interior of the chassis frame is divided into a functional area and an air-cooling area, the functional area is connected to the upper and lower cover plates and the front panel of the chassis frame, the air-cooling area wraps the remaining sides of the functional area and performs heat exchange, the functional area is provided with slots for plugging in VPX modules in parallel and the VPX modules are fixed by fasteners, the front panel of the chassis frame is provided with an air inlet, the rear panel is provided with a fan, the air inlet is connected to the air-cooling area, the bottom of the functional area is a backplane printed circuit board arranged parallel to the rear panel, and the front panel and the external electrical appliance ports on the rear panel are connected by the backplane printed circuit board and cables.

2. The reinforced VPX sealed heat dissipation chassis according to claim 1, characterized in that: A protective cover is arranged on the outer side of the backplane printed circuit board.

3. The reinforced VPX sealed heat dissipation chassis according to claim 1, characterized in that: The functional area is enclosed by a backplane printed circuit board, a front panel and symmetrically arranged left and right support plates. A VPX module installation hole is opened on the front panel directly opposite to the functional area, and the module installation hole is blocked by a protective cover.

4. The reinforced VPX sealed heat dissipation chassis according to claim 3, characterized in that: During positioning and installation, the support plate, the front panel and the upper and lower cover plates of the chassis frame are pre-positioned and installed through guide positioning pins.

5. The reinforced VPX sealed heat dissipation chassis according to claim 4, characterized in that: The slots are symmetrically arranged on the upper and lower cover plates.

6. The reinforced VPX sealed heat dissipation chassis according to claim 1, characterized in that: The air inlet channel located in the air cooling zone is arranged symmetrically to the functional zone.

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