Multilayer film type electromagnetic shielding method

Abstract

The invention relates to the technical field of electronic electromagnetic shielding methods, in particular to a multilayer film type electromagnetic shielding method which is characterized by comprising the following steps: S1, performing a simulation experiment to obtain the magnetic flux leakage quantity of an inductance model and the magnetic flux leakage quantity relationship between an inductor and a shielding layer; s2, experimental demonstration: demonstrating whether the simulation experiment conclusion is correct or not, and meanwhile, obtaining the relationship between the corresponding inductance and the magnetic flux leakage amount of the shielding layers made of different materials; and S3, according to the conclusions obtained in S1 and S2, under the corresponding inductance, the magnetic leakage is reduced by adjusting the inductance value of the shielding layer. The method comprises the following steps: acquiring an inductor model according to a simulation experiment, measuring and recording the magnetic flux leakage amount of the inductor model, arranging a shielding layer on the outer surface of the inductor, measuring the magnetic flux leakage amount of the inductor after the shielding layer is arranged, and replacing and adjusting the material of the shielding layer to obtain a shielding layer material with a good shielding effect; therefore, the leakage flux of the inductor is reduced, and the performance of the inductor is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic electromagnetic shielding methods, and in particular relates to a multi-layer thin film type electromagnetic shielding method. Background Art

[0002] Electromagnetic shielding refers to the ability of the electromagnetic energy generated by a device to neither interfere with other electronic devices nor be interfered with by the electromagnetic energy of other electronic devices in a specific working environment. With the development of electronic integration and miniaturization, the electronic components on the circuit board are becoming more and more dense, and the spacing between components is getting smaller and smaller, which requires higher and higher anti-interference ability of the device.

[0003] The traditional electromagnetic shielding method is to add a metal shell outside the electronic device and wrap it around the device. This design takes up a lot of space and is not conducive to the layout of the circuit board space. The assembly process of this metal shell and device is complicated and not conducive to automated production. Therefore, a multi-layer thin film electromagnetic shielding method is needed to solve the above problems. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a multi-layer film electromagnetic shielding method. The self-adhesive design of the multi-layer film can be directly attached to the surface of the component. The operation is simple and the degree of automation is high. The material of each layer of the film can be changed at will. The device can be shielded according to the position where it needs to be shielded, thereby achieving the best electromagnetic shielding effect to solve the problems in the existing market raised in the above background technology.

[0005] To achieve the above object, the technical solution of the present invention is as follows:

[0006] A multi-layer film type electromagnetic shielding method, characterized in that it comprises the following steps:

[0007] S1. Conduct simulation experiments to obtain the magnetic flux leakage of the inductor model and the relationship between the magnetic flux leakage of the inductor and the shielding layer;

[0008] S2. Experimental demonstration: to verify the correctness of the simulation experimental conclusions and obtain the relationship between the leakage magnetic flux of the shielding layer of different materials under the corresponding inductance;

[0009] S3. Based on the conclusions obtained from S1 and S2, under the corresponding inductance, the inductance value of the shielding layer is adjusted to reduce the leakage magnetic flux.

[0010] Through the above technical scheme, the inductor model is first obtained according to the simulation experiment, the leakage magnetic flux of the inductor model is measured and recorded, a shielding layer is set on the outer surface of the inductor, the leakage magnetic flux of the inductor after setting the shielding layer is measured, and the material of the shielding layer is replaced and adjusted to obtain a shielding layer material with better shielding effect. The thickness of the shielding layer material is further adjusted to obtain the final inductance value and the material of the shielding layer, thereby reducing the leakage magnetic flux of the inductor and improving the inductance performance.

[0011] As a preferred solution of the present invention, the simulation experiment further comprises the following steps:

[0012] S11, constructing an inductance model to obtain the magnetic leakage of the inductance model;

[0013] S12, adding a shielding layer on the surface of the inductor model to obtain the magnetic leakage after adding the shielding layer;

[0014] S13, obtaining the relationship between the shielding layer and the magnetic leakage of the inductor, that is, the shielding layer reduces the magnetic leakage.

[0015] Through the above technical solution, an inductor model is constructed. The inductor model is an integrated molded inductor. The wire diameter of the inner coil of the inductor is 0.55mm, the number of turns is 5.5 turns, the coil material is copper, the inductance value is 28*200u / H, and the leakage magnetic flux of the inductor model is 174.827T. A shielding layer is set on the outer surface of the inductor, and the leakage magnetic flux after setting the shielding layer is measured. The two leakage magnetic fluxes are compared, and it is concluded that the shielding layer can reduce the leakage magnetic flux.

[0016] As a preferred embodiment of the present invention, the experimental demonstration further comprises the following steps:

[0017] S21, setting the shielding layer materials to magnetic shielding materials and electrical shielding materials respectively;

[0018] S22, obtaining the magnetic leakage amount of the magnetic shielding material and the electrical shielding material respectively provided on the outer surface of the inductor;

[0019] S23. Record the magnetic flux leakage data of different materials, and compare the magnetic flux leakage data of different materials to find out the material that reduces the magnetic flux leakage the most.

[0020] Through the above technical solution, at least two shielding layers are set, namely a magnetic material shielding layer and an electrical material shielding layer, and the leakage magnetic flux of the two materials is measured respectively. Through comparison, the material with the largest reduction in leakage magnetic flux is obtained.

[0021] As a preferred embodiment of the present invention, the magnetic shielding material is an iron-nickel alloy or a silicon steel sheet, and the electrical shielding material is any one or more materials selected from the group consisting of copper, nickel, tin, silver, gold, aluminum and alloys.

[0022] As a preferred solution of the present invention, based on the magnetic leakage data of different materials, it is found that the magnetic leakage reduced by the magnetic shielding material is greater than the magnetic leakage reduced by the electrical shielding material.

[0023] By measuring and comparing the electrical shielding material aluminum shielding layer and the magnetic shielding material iron-nickel alloy shielding layer, it was found that the leakage magnetic flux of the electrical material aluminum shielding layer was 153.531T, and that of the iron-nickel alloy magnetic shielding material was 138.531T. By comparing the data, it was found that the leakage magnetic flux reduced by the magnetic shielding material was greater than that reduced by the electrical shielding material.

[0024] As a preferred solution of the present invention, based on the comparison of magnetic shielding materials with different magnetic inductances, including magnetic shielding materials with a magnetic inductance of 50μ and magnetic shielding materials with a magnetic inductance of 100μ, the data shows that the shielding effect of the magnetic shielding material with a magnetic inductance of 100μ is greater than that of the magnetic shielding material with a magnetic inductance of 50μ. It is concluded that the greater the magnetic inductance of the magnetic shielding material, the better the shielding effect, and the higher the reduction in leakage magnetic field.

[0025] Through the above technical solution, by comparing the magnetic shielding materials with magnetic induction of 50μ and 100μ, the magnetic leakage of the shielding layer with a magnetic induction of 50μ is 138.851T, and the magnetic leakage of the shielding layer with a magnetic induction of 100μ is 118.826T. The comparison data shows that the higher the magnetic induction, the better the shielding effect.

[0026] As a preferred solution of the present invention, the shielding layer is bonded to the outer peripheral surface of the inductor through an adhesive layer, and the adhesive layer is made of any one or more of epoxy resin, phenolic resin, and polyurethane.

[0027] As a preferred solution of the present invention, a printing layer may be further provided on the outer peripheral surface of the shielding layer, and the material of the printing layer is polyimide material.

[0028] Through the above technical solution, the printing layer is convenient for printing text or patterns on the surface, thereby improving the overall aesthetics of the product and facilitating identification.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] According to the simulation experiment, the inductor model is first obtained, the magnetic leakage of the inductor model is measured and recorded, a shielding layer is set on the outer surface of the inductor, the magnetic leakage of the inductor after the shielding layer is set is measured, the material of the shielding layer is replaced and adjusted, and the shielding layer material with better shielding effect is obtained. According to the further adjustment of the thickness of the shielding layer material, the final inductance value and the material of the shielding layer are obtained to reduce the magnetic leakage of the inductor and improve the inductor performance;

[0031] The self-adhesive design of the multi-layer film can be directly attached to the surface of components (inductors). It is easy to operate and highly automated. The material of each layer of the film can be changed at will. It can be shielded according to the location where the device needs to be shielded, thereby achieving the best electromagnetic shielding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 It is a schematic diagram of the structure of the inductor and the shielding layer of the present invention;

[0034] Figure 2 For the present invention Figure 1 The structural diagram in ;

[0035] Figure 3 For the present invention Figure 1 Schematic diagram of the local structure in. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The present invention provides the following embodiments:

[0038] Embodiment 1:

[0039] A multi-layer film type electromagnetic shielding method, characterized in that it comprises the following steps:

[0040] S1. Conduct simulation experiments to obtain the magnetic flux leakage of the inductor 1 model and the relationship between the magnetic flux leakage of the inductor 1 and the shielding layer 2;

[0041] The simulation experiment also includes the following steps:

[0042] S11, constructing an inductor 1 model to obtain the magnetic leakage amount of the inductor 1 model;

[0043] S12, adding a shielding layer 2 on the surface of the inductor 1 model, wherein the shielding layer 2 is not provided on or avoids the electrode surface, and obtaining the magnetic leakage amount after adding the shielding layer 2;

[0044] S13, obtaining the relationship between the magnetic leakage amount of the shielding layer 2 and the inductor 1, that is, the shielding layer 2 reduces the magnetic leakage amount.

[0045] Construct an inductor 1 model. The inductor 1 model is an integrated inductor 1. The inner coil diameter of the inductor 1 is 0.55 mm, the number of turns is 5.5 turns, the coil material is copper, the inductor 1 value is 28*200u / H, and the leakage magnetic flux of the inductor 1 model is 174.827T. A shielding layer 2 is set on the outer surface of the inductor 1. The leakage magnetic flux after setting the shielding layer 2 is measured. The two leakage magnetic fluxes are compared, and it is concluded that the shielding layer 2 can reduce the leakage magnetic flux.

[0046] S2. Experimental demonstration: to verify whether the conclusion of the simulation experiment is correct or not, and to obtain the relationship between the leakage magnetic flux of the shielding layer 2 of different materials under the corresponding inductance 1;

[0047] The experimental demonstration also includes the following steps:

[0048] S21, setting the materials of the shielding layer 2 to magnetic shielding materials and electrical shielding materials, respectively, the magnetic shielding materials are iron-nickel alloys and silicon steel sheets, and the electrical shielding materials are any one or more materials selected from copper, nickel, tin, silver, gold, aluminum, and alloys;

[0049] S22, obtaining the magnetic leakage amount of the magnetic shielding material and the electrical shielding material respectively arranged on the outer surface of the inductor 1, by measuring and comparing the electrical shielding material aluminum shielding layer 2 and the magnetic shielding material iron-nickel alloy shielding layer 2 respectively;

[0050] S23. Record the magnetic flux leakage data of different materials, compare the magnetic flux leakage data of different materials to obtain the material that reduces the magnetic flux leakage the most, and according to the magnetic flux leakage data of different materials, obtain that the magnetic flux leakage reduced by the magnetic shielding material is greater than the magnetic flux leakage reduced by the electrical shielding material.

[0051] The principle of magnetic shielding is that the magnetic field changes suddenly at the interface between two different magnetic permeabilities, thus causing the refraction of magnetic flux lines. The principle of electric shielding is to use highly conductive materials to reduce the distributed capacitance between the interference source and the sensor, thereby achieving a shielding effect.

[0052] At least two shielding layers 2 are set, namely a magnetic material shielding layer 2 and an electrical material shielding layer 2. The leakage magnetic flux of the electrical material aluminum shielding layer 2 is 153.531T, and the magnetic shielding material of the iron-nickel alloy is 138.531T. By comparing the data, it is found that the leakage magnetic flux reduced by the magnetic shielding material is greater than the leakage magnetic flux reduced by the electrical shielding material. By measuring the leakage magnetic flux of the two materials respectively and comparing them, the material with greater leakage magnetic reduction is found.

[0053] S3. According to the conclusions obtained from S1 and S2, under the corresponding inductance 1, the inductance value of the shielding layer 2 is adjusted to reduce the leakage magnetic flux. The specific method is: based on the comparison of magnetic shielding materials with different magnetic inductances, including magnetic shielding materials with a magnetic inductance of 50μ and magnetic shielding materials with a magnetic inductance of 100μ, the data shows that the shielding effect of the magnetic shielding material with a magnetic inductance of 100μ is greater than that of the magnetic shielding material with a magnetic inductance of 50μ. It is concluded that the greater the magnetic inductance of the magnetic shielding material, the better the shielding effect, and the higher the reduction in leakage magnetic flux. By comparing the magnetic shielding materials with magnetic inductances of 50μ and 100μ, the leakage magnetic flux of the shielding layer 2 with a magnetic inductance of 50μ is 138.851T, and the leakage magnetic flux of the shielding layer 2 with a magnetic inductance of 100μ is 118.826T. The comparison of the data shows that the higher the magnetic inductance, the better the shielding effect.

[0054] The magnetic material with μ=50 has a magnetic leakage reduction of about 9.6% compared with Cu and Sn of the same thickness;

[0055] The magnetic material with μ=100 has a magnetic leakage reduction of about 22.6% compared with Cu and Sn of the same thickness;

[0056] The shielding layer 2 is adhered to a surface of the inductor 1. There are a plurality of shielding layers 2, and the area ratio of the shielding layer 2 to one side of the inductor 1 is 45%-100%. The preferred area ratio of the shielding layer 2 to one side of the inductor 1 is 80%.

[0057] The thickness of the shielding layer 2 is 0.01-2 cm, and the preferred thickness of the shielding layer 2 is 0.125 cm.

[0058] According to the simulation experiment, the inductor 1 model is first obtained, the leakage magnetic flux of the inductor 1 model is measured and recorded, a shielding layer 2 is set on the outer surface of the inductor 1, the leakage magnetic flux of the inductor 1 after setting the shielding layer 2 is measured, the material of the shielding layer 2 is replaced and adjusted, and the shielding layer 2 material with better shielding effect is obtained. According to the further adjustment of the thickness of the shielding layer 2 material, the final inductance value and the material of the shielding layer 2 are obtained, so as to reduce the leakage magnetic flux of the inductor 1 and improve the performance of the inductor 1.

[0059] As a preferred solution of the present invention, the shielding layer 2 is bonded to the outer peripheral surface of the inductor 1 through an adhesive layer 21 , and the adhesive layer 21 is made of any one or more of epoxy resin, phenolic resin, and polyurethane.

[0060] As a preferred embodiment of the present invention, a printing layer 24 can be further provided on the outer peripheral surface of the shielding layer 2. The printing layer 24 is made of polyimide material. The printing layer 24 is convenient for printing text or patterns on the surface to improve the overall aesthetics of the product and facilitate identification.

[0061] Implementation 2:

[0062] The difference from Example 1 is that the shielding layer 2 includes: an electrical shield arranged on the upper end surface of the inductor 1 through an adhesive layer 21, and a magnetic shielding layer 23 arranged on the outside of the electrical shielding layer 22, wherein the electrical shielding layer 22 is made of copper, and the magnetic shielding layer 23 is made of iron-nickel alloy, the thickness of the electrical shielding layer 22 is 0.0625 cm, the thickness of the magnetic shielding layer 23 is 0.0625 cm, and the magnetic induction of the magnetic shielding layer 23 is 50 μ.

[0063] Implementation 3:

[0064] The difference from Example 1 is that a magnetic shielding layer 23 is bonded to any one or more of the circumferential surfaces of the inductor 1, i.e., the left, right, front, back, top and bottom, through an adhesive layer 21, and a printing layer 24 is arranged on the magnetic shielding layer 23. The material of the magnetic shielding layer 23 is iron-nickel alloy, the material of the printing layer 24 is polyimide, the thickness of the magnetic shielding layer 23 is 0.0625 cm, the thickness of the printing layer 24 is 0.0625 cm, and the magnetic induction of the magnetic shielding layer 23 is 100 μ.

[0065] According to the simulation experiment, the inductor 1 model is first obtained, the leakage magnetic flux of the inductor 1 model is measured and recorded, a shielding layer 2 is set on the outer surface of the inductor 1, the leakage magnetic flux of the inductor 1 after setting the shielding layer 2 is measured, the material of the shielding layer 2 is replaced and adjusted, and the shielding layer 2 material with better shielding effect is obtained. According to the further adjustment of the inductance value of the shielding layer 2 material, the final inductance value and material of the shielding layer 2 are obtained, so as to reduce the leakage magnetic flux of the inductor 1 and improve the performance of the inductor 1, so as to facilitate the adjustment of the material and thickness of the shielding layer 2 according to different leakage magnetic flux needs to achieve the required leakage magnetic flux.

[0066] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-layer film type electromagnetic shielding method, characterized in that , including the following steps: S1. Conduct simulation experiments to obtain the magnetic flux leakage of the inductor model and the relationship between the magnetic flux leakage of the inductor and the shielding layer; S2. Experimental demonstration: to verify the correctness of the simulation experimental conclusions and obtain the relationship between the leakage magnetic flux of the shielding layer of different materials under the corresponding inductance; S3. Based on the conclusions obtained from S1 and S2, under the corresponding inductance, the inductance value of the shielding layer is adjusted to reduce the leakage magnetic flux.

2. The multi-layer thin film electromagnetic shielding method according to claim 1, characterized in that: The simulation experiment also includes the following steps: S11, constructing an inductance model to obtain the magnetic leakage of the inductance model; S12, adding a shielding layer on the surface of the inductor model to obtain the magnetic leakage after adding the shielding layer; S13, obtaining the relationship between the shielding layer and the magnetic leakage of the inductor, that is, the shielding layer reduces the magnetic leakage.

3. The multi-layer thin film electromagnetic shielding method according to claim 2, characterized in that: The experimental demonstration also includes the following steps: S21, setting the shielding layer materials to magnetic shielding materials and electrical shielding materials respectively; S22, obtaining the magnetic leakage amount of the magnetic shielding material and the electrical shielding material respectively provided on the outer surface of the inductor; S23. Record the magnetic flux leakage data of different materials, and compare the magnetic flux leakage data of different materials to find the material with the least magnetic flux leakage.

4. The multi-layer thin film electromagnetic shielding method according to claim 3, characterized in that: The magnetic shielding material is iron-nickel alloy or silicon steel sheet, and the electrical shielding material is any one or more materials selected from copper, nickel, tin, silver, gold and alloys.

5. The multi-layer thin film electromagnetic shielding method according to claim 4, characterized in that: According to the magnetic flux leakage data of different materials, it is concluded that the magnetic flux leakage reduced by magnetic shielding materials is greater than that reduced by electrical shielding materials.

6. The multi-layer thin film electromagnetic shielding method according to claim 5, characterized in that: According to the comparison of magnetic shielding materials with different magnetic inductances, including magnetic shielding materials with a magnetic inductance of 50μ and magnetic shielding materials with a magnetic inductance of 100μ, the data shows that the shielding effect of the magnetic shielding material with a magnetic inductance of 100μ is greater than that of the magnetic shielding material with a magnetic inductance of 50μ. It can be concluded that the greater the magnetic inductance of the magnetic shielding material, the better the shielding effect, and the higher the reduction in leakage magnetic flux.

7. The multi-layer thin film electromagnetic shielding method according to claim 6, characterized in that: The shielding layer is bonded to the outer peripheral surface of the inductor through an adhesive layer, and the adhesive layer is made of any one or more of epoxy resin, phenolic resin, and polyurethane.

8. The multi-layer thin film electromagnetic shielding method according to claim 7, characterized in that: A printing layer may also be provided on the outer peripheral surface of the shielding layer, and the material of the printing layer is polyimide material.

Images