Driving circuit, display device including the same, and method for driving the same

Abstract

The invention relates to a driving circuit portion, a display device including the driving circuit portion, and a driving method of the display device. A drive circuit unit according to an embodiment of the present invention includes: a display drive unit that generates a vertical synchronization signal; and a sensor driving unit that determines a driving frequency using the vertical synchronization signal, the pulse polarity of which is inverted every time the driving frequency changes.

Description

Technical Field

[0001] The present invention relates to a driving circuit portion, a display device including the driving circuit portion, and a driving method thereof. Background Art

[0002] As information technology develops, the importance of display devices as a connection medium between users and information has attracted attention. In response to this, the use of display devices such as liquid crystal display devices (Liquid Crystal Display Devices) and organic light emitting display devices (Organic Light Emitting Display Devices) is increasing.

[0003] The display device may include a display unit for displaying an image and a sensor unit for sensing a touch position. The display unit displays a predetermined image corresponding to a drive signal supplied from a display drive unit, and the sensor unit senses an external input corresponding to a touch signal supplied from the sensor drive unit. Here, the frequency of the touch signal may be set so as not to interfere with the frequency of the drive signal. Summary of the invention

[0004] The sensor driving unit can generate various signals (e.g., touch report rate, touch signal, etc.) by using the vertical synchronization signal and / or horizontal synchronization signal supplied from the display driving unit. To this end, the sensor driving unit can count the vertical synchronization signal supplied from the display driving unit to determine the driving frequency (or frame rate) of the display device. However, when the driving frequency is determined by counting the vertical synchronization signal, the sensor driving unit can determine the driving frequency that is delayed by at least one frame period compared to the actual driving frequency of the display driving unit. When the driving frequency determined by the sensor driving unit is different from the actual driving frequency of the display driving unit, horizontal stripes, flickering and / or jitter noise, etc. may occur in the display device.

[0005] An object of the present invention is to provide a driving circuit unit capable of determining a driving frequency in real time by a sensor driving unit, a display device including the driving circuit unit, and a driving method thereof.

[0006] The technical problems of the present invention are not limited to the technical problems mentioned above, and ordinary technicians in the technical field to which the present invention belongs can clearly understand other technical problems not mentioned through the following records.

[0007] The driving circuit unit according to the embodiment of the present invention comprises: a display driving unit generating a vertical synchronization signal; and a sensor driving unit using the vertical synchronization signal to determine a driving frequency, wherein the pulse polarity of the vertical synchronization signal is reversed every time the driving frequency changes.

[0008] According to an embodiment, the display driving section includes: a display oscillator for generating a display clock signal; and a signal generating section for generating the vertical synchronization signal using a control signal supplied from the outside and the display clock signal.

[0009] According to an embodiment, when the driving frequency changes from a first frequency to a second frequency, the pulse polarity of the vertical synchronization signal changes from a logic high level to a logic low level, and when the driving frequency changes from the second frequency to a third frequency, the pulse polarity of the vertical synchronization signal changes from a logic low level to a logic high level.

[0010] According to an embodiment, when the pulse polarity of the vertical synchronization signal is inverted, the width of the first pulse is controlled corresponding to the changed driving frequency.

[0011] According to an embodiment, the width of the first pulse is set to be wider as the driving frequency is higher.

[0012] According to an embodiment, the width of the first pulse is set to be narrower as the driving frequency is higher.

[0013] According to an embodiment, the sensor driving unit includes: a polarity judgment unit, which is used to judge the pulse polarity of the vertical synchronization signal; a frequency judgment unit, which counts the width of the first pulse to generate a counting signal when the polarity judgment unit judges that the pulse polarity of the vertical synchronization signal is reversed; a touch control unit, which uses the pulse polarity of the vertical synchronization signal judged by the polarity judgment unit and at least one of the counting values ​​included in the counting signal to judge the driving frequency and generate a signal corresponding to the driving frequency; a sensor oscillator, which is used to supply a sensor clock signal to the frequency judgment unit.

[0014] According to an embodiment, the polarity determination unit generates a hold control signal when the pulse polarity of the vertical synchronization signal is maintained, and generates a change control signal when the pulse polarity of the vertical synchronization signal is inverted.

[0015] According to an embodiment, the frequency determination section generates the count signal when the change control signal is input.

[0016] According to an embodiment, the touch control section determines that the driving frequency is the same as before when the hold control signal is input, and determines the changed driving frequency using the count value when the count signal is input.

[0017] A display device according to an embodiment of the present invention includes: a display unit including pixels connected to scan lines and data lines; a sensor unit including a first sensor and a second sensor to sense external input; a display driving unit that supplies data signals to the pixels and generates a vertical synchronization signal using a control signal supplied from the outside; and a sensor driving unit that determines a driving frequency using the vertical synchronization signal and supplies a touch signal to at least one of the first sensor and the second sensor corresponding to the determined driving frequency, wherein the pulse polarity of the vertical synchronization signal is reversed whenever the driving frequency changes.

[0018] According to an embodiment, the display driving section includes: a display oscillator for generating a display clock signal; and a signal generating section for generating the vertical synchronization signal using the control signal and the display clock signal supplied from the outside.

[0019] According to an embodiment, when the pulse polarity of the vertical synchronization signal is inverted, the width of the first pulse is controlled corresponding to the changed driving frequency.

[0020] According to an embodiment, the width of the first pulse is set to become wider as the driving frequency becomes higher.

[0021] According to an embodiment, the width of the first pulse is set to become narrower as the driving frequency becomes higher.

[0022] According to an embodiment, the sensor driving unit includes: a polarity judgment unit, which is used to judge the pulse polarity of the vertical synchronization signal; a frequency judgment unit, which counts the width of the first pulse to generate a counting signal when the polarity judgment unit judges that the pulse polarity of the vertical synchronization signal is reversed; a touch control unit, which uses at least one of the pulse polarity of the vertical synchronization signal judged by the polarity judgment unit and the counting value included in the counting signal to judge the driving frequency; a sensor oscillator, which is used to supply a sensor clock signal to the frequency judgment unit.

[0023] According to an embodiment, the touch control section determines the changed driving frequency using the count value when the count signal is input.

[0024] According to an embodiment of the present invention, a driving method for a display device includes the following steps: in a display driving unit that drives pixels included in the display unit, a vertical synchronization signal whose pulse polarity is reversed whenever a driving frequency changes is generated; in a sensor driving unit that drives a sensor included in a sensor unit, the vertical synchronization signal is received from the display driving unit, and when the pulse polarity of the vertical synchronization signal is reversed, the driving frequency is determined using the width of the first pulse.

[0025] According to an embodiment, the width of the first pulse is arranged to become wider as the driving frequency increases.

[0026] According to an embodiment, the width of the first pulse is arranged to become narrower as the driving frequency increases.

[0027] According to the driving circuit unit of the embodiment of the present invention, the display device including the driving circuit unit and the driving method thereof, whenever the driving frequency changes, the display driving unit inverts the polarity of the vertical synchronization signal and can control the width of the first pulse whose polarity is changed corresponding to the driving frequency. The sensor driving unit can use the polarity of the vertical synchronization signal and the width of the first pulse to determine the driving frequency in real time, thereby improving the display quality.

[0028] However, the effects of the present invention are not limited to the above-mentioned effects and can be variously extended without departing from the concept and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a diagram showing a display device according to an embodiment of the present invention.

[0030] Figure 2 It is shown Figure 1 A cross-sectional view of an embodiment of a display device.

[0031] Figure 3 It is shown Figure 2 A diagram of an embodiment of a sensor included in a display device.

[0032] Figure 4 and Figure 5 is a diagram showing a mutual sensing period.

[0033] Figures 6 to 8 2 is a diagram for explaining a first self-sensing period and a second self-sensing period.

[0034] Fig. 9 is a diagram for explaining a sensing method according to an embodiment of the present invention.

[0035] Fig.10a is a diagram showing a vertical synchronization signal corresponding to a comparative example.

[0036] Fig.10b is shown corresponding to Fig.10a A graph of the touch report rate for the vertical sync signal.

[0037] Fig.11 It is shown Figure 1 A diagram of an embodiment of a display driving unit is shown.

[0038] Fig.12a and Figure 12b Shown from Fig.11 An embodiment of a vertical synchronization signal generated by a signal generating unit.

[0039] Figures 13a to 14b is a graph showing the width of the first pulse of polarity reversal.

[0040] Fig.15 It is shown Figure 1 A diagram of an embodiment of a sensor driving unit is shown.

[0041] Fig.16 is a flowchart showing the operation procedure of the sensor driving section.

[0042] Fig.17 is a diagram illustrating a touch report rate corresponding to a vertical synchronization signal according to an embodiment of the present invention.

[0043] Fig.18 FIG. 1 is a diagram showing a display unit and a display driving unit according to an embodiment of the present invention.

[0044] Fig.19 is a diagram for explaining a pixel according to an embodiment of the present invention.

[0045] Fig. 20 It is used to illustrate Fig.19 FIG. 1 is a diagram of an exemplary driving method of a pixel.

[0046] Figure 21 to Figure 27 It is a diagram for explaining an exemplary configuration of a display device. DETAILED DESCRIPTION

[0047] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0048] In order to clearly explain the present invention, parts not related to the explanation are omitted, and the same or similar components are given the same reference numerals throughout the specification. Therefore, the reference numerals explained above can also be used in other drawings.

[0049] Furthermore, the size and thickness of each structure shown in the drawings are arbitrarily shown for the sake of convenience, and therefore the present invention is not limited to the drawings. In the drawings, the thickness may be exaggerated in order to clearly show a plurality of layers and regions.

[0050] Furthermore, in the description, the expression "same" may mean "substantially the same". That is, it may be the same to the extent that a person with ordinary knowledge can recognize it as the same. Other expressions may also be expressions in which "substantially" is omitted.

[0051] In the accompanying drawings, a portion of the embodiments are described with respect to functional blocks, units and / or modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by logic circuits, individual components, microprocessors, hard-wired circuits, memory elements, wiring connections and other electronic circuits. It can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. For blocks, units and / or modules implemented by microprocessors or other similar hardware, software can be used to program and control to perform the various functions discussed in the present invention, and can be selectively driven by firmware and / or software. In addition, each block, unit and / or module can be implemented by dedicated hardware, or can be implemented by a combination of dedicated hardware that performs a portion of the functions and processors (e.g., one or more programmed microprocessors and related circuits) that perform other functions. In addition, in some embodiments, blocks, units and / or modules can also be physically separated into more than two separate blocks, units and / or modules that interact with each other within the scope of the concept of the present invention. In addition, in some embodiments, blocks, units and / or modules can also be physically combined into more complex blocks, units and / or modules within the scope of the concept of the present invention.

[0052] The "connection" between two components may include both electrical connection and physical connection, but is not limited thereto. For example, the "connection" used based on the circuit diagram may mean electrical connection, and the "connection" used based on the cross-sectional view and the plan view may mean physical connection.

[0053] Although the terms first, second, etc. are used to describe various components, these components are obviously not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, the first component mentioned below can obviously also be the second component within the technical concept of the present invention.

[0054] In addition, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms. In addition, each embodiment disclosed below can be implemented alone, or can be combined with at least one other embodiment to form a composite implementation.

[0055] Figure 1 is a diagram showing a display device according to an embodiment of the present invention.

[0056] Reference Figure 1 The display device 1 includes a panel 10 and a driving circuit section 20 for driving the panel 10. Also, the display device 1 may further include an application processor not shown, or may be connected to the application processor.

[0057] The panel 10 may include a display portion 110 for displaying an image and a sensor portion 120 for sensing touch, pressure, fingerprint, hovering, biometric information (or biometric features), etc. For example, the panel 10 may be equipped with pixels PX and sensors SC arranged to overlap at least a portion of the pixels PX. In one embodiment, the sensor SC may include a first sensor TX (or a driving electrode) and a second sensor RX (or a sensing electrode). In another embodiment (e.g., a self-capacitance mode), the sensor SC may be configured using one type of sensor without being distinguished as a first sensor TX and a second sensor RX.

[0058] The driving circuit unit 20 may be equipped with a display driving unit 210 (D-IC) for driving the display unit 110 and a sensor driving unit 220 (T-IC) for driving the sensor unit 120. For example, the pixel PX may display an image in units of a display frame period. For example, the sensor SC may sense a user's input in units of a sensing frame period. The sensing frame period and the display frame period may be independent of each other and may be different from each other. The sensing frame period and the display frame period may be synchronized with each other or may be asynchronous with each other.

[0059] According to an embodiment, the display portion 110 and the sensor portion 120 may be manufactured independently of each other, and then arranged and / or combined so that at least one area of ​​the display portion 110 and the sensor portion 120 overlap. Alternatively, in another embodiment, the display portion 110 and the sensor portion 120 may also be manufactured as one body. For example, the sensor portion 120 may be directly formed on at least one substrate constituting the display portion 110 (as an example, an upper substrate and / or a lower substrate of a display panel, or a thin film encapsulation layer) or other insulating layers or various functional films (as an example, an optical layer or a protective layer).

[0060] In addition, Figure 1 In the embodiment, the sensor unit 120 is shown as being arranged on the front surface (e.g., the upper surface where the image is displayed) side of the display unit 110, but the position of the sensor unit 120 is not limited thereto. For example, in another embodiment, the sensor unit 120 may also be arranged on the back side or both sides of the display unit 110. In yet another embodiment, the sensor unit 120 may also be arranged in at least one side edge region of the display unit 110.

[0061] The display portion 110 may include a display substrate 111 and a plurality of pixels PX formed on the display substrate 111. The pixels PX may be arranged in a display area DA of the display substrate 111.

[0062] The display substrate 111 may include a display area DA displaying an image and a non-display area NDA outside the display area DA. According to an embodiment, the display area DA may be arranged in the central area of ​​the display portion 110, and the non-display area NDA may be arranged in the edge area of ​​the display portion 110 in a manner of surrounding the display area DA.

[0063] The display substrate 111 may be a rigid substrate or a flexible substrate, and its material or physical properties are not particularly limited. For example, the display substrate 111 may be a rigid substrate made of organic or tempered glass, or a flexible substrate made of a plastic or metal film.

[0064] Scan lines SL and data lines DL and pixels PX connected to the scan lines SL and the data lines DL are arranged in the display area DA. The pixel PX is selected by a scan signal of a conduction level supplied from the scan line SL, receives a data signal from the data line DL, and emits light of a brightness corresponding to the data signal. Thus, an image corresponding to the data signal is displayed in the display area DA. In the present invention, the structure and driving method of the pixel PX are not particularly limited. For example, each of the pixels PX can be implemented as a pixel using a variety of currently known structures and driving methods.

[0065] Various wirings and / or embedded circuit parts connected to the pixels PX in the display area DA may be arranged in the non-display area NDA. As an example, a plurality of wirings for supplying various power supplies and control signals to the display area DA may be arranged in the non-display area NDA, and a scan driving part and the like may also be arranged in addition.

[0066] In the present invention, the type of the display unit 110 is not particularly limited. For example, the display unit 110 can be implemented as a self-luminous display panel such as an organic light emitting display panel (Organic Light Emitting Display Panel). However, when the display unit 110 is implemented as a self-luminous type, each pixel PX is not limited to the case where only organic light emitting elements must be included. For example, the light emitting element of each pixel PX can be composed of an organic light emitting element (organic light emitting diode), an inorganic light emitting element (inorganic light emitting diode), a quantum dot / well light emitting element (quantum dot / well light emitting diode), etc. It is also possible to equip each pixel PX with multiple light emitting elements. At this time, multiple light emitting elements can be connected in series, in parallel, in series and in parallel. Alternatively, the display unit 110 can be implemented as a non-luminous display panel such as a liquid crystal display panel (Liquid Crystal Display panel). When the display unit 110 is implemented as a non-luminous type, the display device 1 can be additionally equipped with a light source such as a backlight unit (Back-light Unit).

[0067] The sensor part 120 is equipped with a sensor substrate 121 and a plurality of sensors SC formed on the sensor substrate 121. The sensors SC may be arranged in a sensing area SA on the sensor substrate 121.

[0068] The sensor substrate 121 may include a sensing area SA capable of sensing a touch input, etc., and a peripheral area NSA of the outer contour of the sensing area SA. According to an embodiment, the sensing area SA may be arranged to overlap with at least one area of ​​the display area DA. As an example, the sensing area SA may be set to an area corresponding to the display area DA (e.g., an area overlapping the display area DA), and the peripheral area NSA may be set to an area corresponding to the non-display area NDA (e.g., an area overlapping the non-display area NDA). In this case, when a touch input, etc. is provided on the display area DA, the touch input may be detected by the sensor portion 120.

[0069] The sensor substrate 121 may be a rigid or flexible substrate, and in addition, may be formed using at least one layer of insulating film. Furthermore, the sensor substrate 121 may be a transparent or translucent light-transmitting substrate, but is not limited thereto. That is, in the present invention, the material and physical properties of the sensor substrate 121 are not particularly limited. For example, the sensor substrate 121 may be a rigid substrate formed using glass or tempered glass, or may be a flexible substrate formed using a thin film of plastic or metal. Furthermore, according to an embodiment, at least one substrate constituting the display unit 110 (for example, a display substrate 111, a packaging substrate and / or a thin film packaging layer) or at least one layer of insulating film or functional film arranged inside and / or outside the display unit 110 is used as the sensor substrate 121.

[0070] The sensing area SA is set as an area that can react to touch input (ie, an effective area of ​​the sensor). To this end, a sensor SC for sensing touch input, etc. may be arranged in the sensing area SA. According to an embodiment, the sensor SC may be equipped with a first sensor TX and a second sensor RX.

[0071] For example, each first sensor TX may extend along a first direction DR1. The first sensors TX may be arranged along a second direction DR2. The second direction DR2 may be different from the first direction DR1. For example, the second direction DR2 may be a direction intersecting the first direction DR1. In another embodiment, the extending direction and the arrangement direction of the first sensors TX may follow the existing structure. Each first sensor TX may be in the form of a first cell having a wider area and a first bridge having a narrower area connected. In addition, Figure 1 In the figure, each first unit is shown as a diamond shape, but can also be configured as a circle, other quadrilaterals, triangles, mesh forms, etc. For example, the first bridge portion and the first unit can be formed as a whole on the same layer. In another embodiment, the first bridge portion is formed on a different layer from the first unit, so that adjacent first units can be electrically connected.

[0072] For example, each second sensor RX may extend along the second direction DR2. The second sensors RX may be arranged along the first direction DR1. In another embodiment, the extending direction and arrangement direction of the second sensors RX may follow other existing structures. Each second sensor RX may be in the form of a second unit with a wider area and a second bridge portion with a narrower area connected. Figure 1In the figure, each second unit is shown in a diamond shape, but can also be formed in various existing shapes such as a circle, other quadrilaterals, triangles, a grid shape, etc. For example, the second bridge portion can be formed integrally with the second unit on the same layer. In another embodiment, the second bridge portion is formed on a different layer from the second unit, so that adjacent second units can be electrically connected.

[0073] According to an embodiment, each of the first sensor TX and the second sensor RX may have conductivity by including at least one of a metal substance, a transparent conductive substance, and a variety of conductive substances other than these. As an example, a plurality of first sensors TX and a plurality of second sensors RX may include at least one of a variety of metal substances including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), etc., or their alloys. At this time, the first sensor TX and the second sensor RX may be configured in a grid form. In addition, the first sensor TX and the second sensor RX may include silver nanowires (AgNW), ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), AZO (Antimony Zinc Oxide), ITZO (Indium Tin Zinc Oxide), ZnO (Zinc Oxide), SnO 2 At least one of various transparent conductive materials including tin oxide, carbon nanotube, graphene, etc. In addition, the first sensor TX and the second sensor RX may have conductivity by including at least one of the various conductive materials. Furthermore, each of the first sensor TX and the second sensor RX may be configured as a single layer or multiple layers, and the cross-sectional structure thereof is not particularly limited.

[0074] In addition, sensor lines for electrically connecting the first sensor TX and the second sensor RX to the sensor driving unit 220 and the like may be centrally arranged in the peripheral area NSA of the sensor unit 120 .

[0075] The driving circuit unit 20 may include a display driving unit 210 for driving the display unit 110 and a sensor driving unit 220 for driving the sensor unit 120. In one embodiment, the display driving unit 210 and the sensor driving unit 220 may be formed using independent integrated chips (ICs). In another embodiment, at least a portion of the display driving unit 210 and the sensor driving unit 220 may be integrated into one IC.

[0076] The display driving unit 210 is electrically connected to the display unit 110 to drive the pixels PX. For example, the display driving unit 210 may include a data driving unit and a timing control unit, and the scan driving unit may be separately mounted in the non-display area NDA of the display unit 110. In another embodiment, the display driving unit 210 may also include all or at least a part of the data driving unit, the timing control unit, and the scan driving unit.

[0077] The display driver 210 may receive image data and control signals from the application processor. A first oscillator (not shown) for generating a first clock signal may be provided inside the display driver 210. The display driver 210 may determine a driving frequency (or a frame rate) by using a synchronization signal included in the control signal, and may generate a vertical synchronization signal Vsync and a horizontal synchronization signal Hsync (see FIG. 1 ) by dividing the first clock signal. Fig.11 )'s various signals, etc.

[0078] As an example, the control signal supplied from the application processor to the display driving section 210 may include an external vertical synchronization signal and an external horizontal synchronization signal. The display driving section 210 may generate a vertical synchronization signal Vsync and a horizontal synchronization signal Hsync to be used inside the display device 1 by using the external vertical synchronization signal and the external horizontal synchronization signal. The present invention controls the vertical synchronization signal Vsync, and no signals other than these are separately shown or described.

[0079] When the driving frequency of the display device 1 changes, the display driving section 210 may change the polarity of the vertical synchronization signal Vsync. As an example, when the driving frequency changes, the display driving section 210 may change the pulse of the vertical synchronization signal Vsync from a logic high level (as an example, a high voltage) to a logic low level (as an example, a low voltage). As an example, when the driving frequency changes, the display driving section 210 may change the pulse of the vertical synchronization signal Vsync from a logic low level to a logic high level.

[0080] When the polarity of the vertical synchronization signal Vsync changes, the display driving section 210 may control the width of the first pulse of the vertical synchronization signal Vsync whose polarity is changed. Here, the width of the first pulse may be set to correspond to the driving frequency (ie, the frame rate). The vertical synchronization signal Vsync generated from the display driving section 210 may be supplied to the sensor driving section 220.

[0081] The sensor driving part 220 is electrically connected to the sensor part 120 to drive the sensor part 120. The sensor driving part 220 may include a sensor transmitting part and a sensor receiving part. According to an embodiment, the sensor transmitting part and the sensor receiving part may be integrated inside one IC, but are not limited thereto.

[0082] The sensor driving unit 220 may supply control signals to the sensor transmitting unit and the sensor receiving unit so that the sensor unit 120 may sense a touch. The sensor transmitting unit may supply a touch signal to the first sensor TX (and / or the second sensor RX), and the sensor receiving unit may receive a sensing signal corresponding to the touch signal from the second sensor RX (and / or the first sensor TX).

[0083] The sensor driving unit 220 may receive the vertical synchronization signal Vsync from the display driving unit 210, and may use the vertical synchronization signal Vsync to determine the driving frequency. When the polarity of the vertical synchronization signal Vsync is reversed, the sensor driving unit 220 may determine that the driving frequency is changed, and may use the width of the first pulse whose polarity is changed to determine the driving frequency. In this case, the sensor driving unit 220 may determine the driving frequency of the display device 1 (or the display driving unit 210) in real time.

[0084] That is, even if the driving frequency of the display device 1 is changed, the display driving unit 210 and the sensor driving unit 220 can generate various signals corresponding to the same driving frequency, thereby improving the display quality of the display device 1. The details of this will be described later.

[0085] A second oscillator for generating a second clock signal may be provided inside the sensor driving unit 220. The sensor driving unit 220 may determine the driving frequency by counting the width of the first pulse of the vertical synchronization signal Vsync whose polarity is changed using the second clock signal. The sensor driving unit 220 may divide the second clock signal supplied from the second oscillator to generate various control signals, etc. As an example, the sensor driving unit 220 may divide the second clock signal to generate a touch signal. The frequency of the touch signal may be generated in a synchronous or asynchronous manner with the horizontal synchronization signal Hsync and / or the vertical synchronization signal Vsync.

[0086] Figure 2 It is shown Figure 1 A cross-sectional view of an embodiment of a display device.

[0087] Reference Figure 1 and Figure 2 The sensor portion 120 may be stacked on the display portion 110 , and a window WIN may be stacked on the upper portion of the sensor portion 120 .

[0088] The display unit 110 may include a display substrate 111, a circuit element layer BPL formed on the display substrate 111, and a light emitting element LD formed on the circuit element layer BPL. The circuit element layer BPL may include a pixel circuit (e.g., a transistor and a capacitor) for driving the light emitting element LD of the pixel PX, a scan line SL, and a data line DL.

[0089] The sensor unit 120 may include a sensor substrate 121, a sensor SC formed on the sensor substrate 121, and a protective film 122 covering the sensor SC. Figure 2 In the embodiment of FIG. 1 , the sensor substrate 121 is shown in the form of a packaging film covering the pixels PX. In another embodiment, the sensor substrate 121 may also exist independently of the packaging film covering the pixels PX.

[0090] The window WIN is a protective component arranged at the uppermost end of the module of the display device 1, and may be a substantially transparent light-transmitting substrate. Such a window WIN may have a multilayer structure selected from an organic substrate, a plastic film, and a plastic substrate. The window WIN may include a rigid or flexible substrate, and the material constituting the window WIN is not particularly limited.

[0091] Although not shown, the display device 1 may further include a polarizing plate (or other types of anti-reflection layers) for preventing external light from being reflected between the window WIN and the sensor part 120 .

[0092] Figure 3 It is shown Figure 2 A diagram of an embodiment of a sensor included in a display device.

[0093] Reference Figures 1 to 3 , exemplarily showing the first sensors TX1, TX2, TX3, TX4 and the second sensors RX1, RX2, RX3, RX4 located in the sensing area SA. For ease of explanation, it is assumed that four first sensors TX1 to TX4 are arranged in the sensing area SA, and four second sensors RX1 to RX4 are arranged. In fact, y (for example, y is a positive integer) to p (for example, p is a positive integer greater than y) first sensors TX and second sensors RX may be arranged in the display device 1.

[0094] Description and comparison of the first sensors TX1 to TX4 and the second sensors RX1 to RX4 Figure 1 The description of the first sensor TX and the second sensor RX is the same, so the repeated description is omitted.

[0095] Figure 4 and Figure 5 is a diagram for explaining a mutual sensing period.

[0096] Reference Figures 1 to 5The mutual sensing period MSP may be a period during which the sensor unit 120 and the sensor driving unit 220 are driven in a mutual capacitance mode. Figure 4 , the driving of the sensor unit 120 and the sensor driving unit 220 is shown with an arbitrary sensor channel 222 as the center.

[0097] The sensor driving part 220 may include a sensor receiving part TSC and a sensor transmitting part TDC. In the mutual sensing period MSP, the sensor transmitting part TDC may be connected to the first sensor TX, and the sensor receiving part TSC may be connected to the second sensor RX.

[0098] The sensor receiving unit TSC may include an operational amplifier AMP, an analog-to-digital converter 224, and a processor 226. As an example, each sensor channel 222 may be implemented as an analog front end (AFE) including at least one operational amplifier AMP. The analog-to-digital converter 224 and the processor 226 may be provided in each sensor channel 222 and may be shared by a plurality of sensor channels 222.

[0099] The first input terminal IN1 of the operational amplifier AMP may be connected to the corresponding second sensor RX, and the second input terminal IN2 of the operational amplifier AMP may be connected to the reference signal REF. For example, the first input terminal IN1 may be an inverting terminal, and the second input terminal IN2 may be a non-inverting terminal. The reference signal REF may be a ground voltage or a voltage of a specific magnitude. According to an embodiment, the reference signal REF may be a signal provided by a second sensor RX different from the corresponding second sensor RX.

[0100] The analog-to-digital converter 224 may be connected to the output terminal OUT1 of the operational amplifier AMP. The analog-to-digital converter 224 may convert the output of the operational amplifier AMP into a digital sensing value and output it. The capacitor Ca and the switch SWr may be connected in parallel between the first input terminal IN1 and the output terminal OUT1.

[0101] Reference Figure 5During the mutual sensing period MSP, the sensor driving section 220 (e.g., the sensor transmitting section TDC) may sequentially supply the first touch signal (or, a signal for sensing) to the first sensors TX1 to TX4. For example, the first touch signal may be supplied twice to the first sensor TX1 (t1b and t2b), the first touch signal may be supplied twice to the first sensor TX2 (t3b and t4b), the first touch signal may be supplied twice to the first sensor TX3 (t5b and t6b), and the first touch signal may be supplied twice to the first sensor TX4 (t7b and t8b). The number of times the first touch signal is supplied to the first sensors TX1 to TX4 may be greater than twice according to an embodiment.

[0102] Each first touch signal may correspond to a rising transition and / or a falling transition. For example, the first touch signal at time point t1b may correspond to a rising transition. That is, at time point t1b, the first touch signal may rise from a low level to a high level. The first touch signal at time point t2b may correspond to a falling transition. That is, at time point t2b, the first touch signal may fall from a high level to a low level.

[0103] The sensor receiving part TSC may be equipped with a plurality of sensor channels 222 connected to a plurality of second sensors RX. Each sensor channel 222 may receive a first sensing signal (or a first sampling signal) corresponding to a first touch signal from a corresponding second sensor RX. For example, the sensor channels 222 connected to the second sensors RX1 to RX4 may independently receive a first sensing signal corresponding to a first touch signal applied to the first sensor TX1 at a time point t1b. Also, the sensor channels 222 connected to the second sensors RX1 to RX4 may independently receive a first sensing signal corresponding to a first touch signal applied to the first sensor TX1 at a time point t2b.

[0104] On the sensing area SA, the mutual capacitance between the first sensors TX1 to TX4 and the second sensors RX1 to RX4 may vary according to the position of the object OBJ such as the user's finger, etc. Accordingly, the first sensing signals received by the sensor channels 222 may also be different from each other. The difference between such first sensing signals may be used to detect the touch position of the object OBJ.

[0105] The sensor channel 222 may generate an output signal corresponding to the voltage difference between the first input terminal IN1 and the second input terminal IN2. For example, the sensor channel 222 may amplify the voltage difference between the first input terminal IN1 and the second input terminal IN2 to a level corresponding to a predetermined gain and output it.

[0106] According to an embodiment, the sensor channel 222 may be implemented as an integrator. In this case, the capacitor Ca and the switch SWr may be connected in parallel between the first input terminal IN1 and the output terminal OUT of the operational amplifier AMP. For example, the charge of the capacitor Ca may be initialized by turning on the switch SWr before receiving the first sampling signal. At the reception time point of the first sampling signal, the switch SWr may be in a cut-off state.

[0107] The analog-to-digital converter 224 converts analog signals input from each sensor channel 222 into digital signals. The processor 226 can analyze these digital signals to detect user input. The processor 226 can also be included in an application processor.

[0108] Figures 6 to 8 is a diagram for explaining the first self-sensing period and the second self-sensing period. Figure 6 In FIG. 1 , the structure of the sensor unit 120 and the sensor driving unit 220 is shown with an arbitrary sensor channel 222 as the center. The internal structure of the sensor receiving unit TSC and the sensor transmitting unit TDC can be the same as Figure 4 The situations are substantially the same. The repeated descriptions are omitted and the following descriptions are mainly based on the differences.

[0109] Reference Figures 6 to 8 , the first self-sensing period STP may be a period for driving the sensor unit 120 and the sensor driving unit 220 in the self-capacitance mode. In the first self-sensing period STP, the sensor transmitting unit TDC may be connected to the second input terminal IN2 of each sensor channel 222, and the first input terminal IN1 of each sensor channel 222 may be connected to the corresponding first sensor TX. In another embodiment, the sensor transmitting unit TDC may also be connected to the first input terminal IN1. At this time, the reference signal REF (reference Figure 4 ) may be applied to the second input terminal IN2.

[0110] Reference Figure 7 During the first self-sensing period STP, the sensor transmitting unit TDC may supply the second touch signal to the second input terminal IN2 of each sensor channel 222. At this time, according to the characteristics of the operational amplifier AMP, the second touch signal may be supplied to the first sensor TX connected to the first input terminal IN1. In one embodiment, the sensor driving unit 220 may simultaneously supply the second touch signal to the first sensors TX1 to TX4 during the first self-sensing period STP. For example, referring to Figure 7At each time point t1c, t2c, t3c, t4c, t5c, t6c, t7c, t8c, the second touch signal may be simultaneously supplied to the first sensors TX1 to TX4. At this time, the second sensors RX1 to RX4 may receive a separate reference signal (e.g., a ground voltage) or may be in a floating state. Each second touch signal may correspond to a rising transition and / or a falling transition.

[0111] The first sensors TX1 to TX4 may have self-capacitance. At this time, when the object OBJ such as the user's finger approaches the first sensors TX1 to TX4, the self-capacitance of the first sensors TX1 to TX4 may change according to the capacitance formed with the surface of the object OBJ. The second touch signal reflecting such self-capacitance may be referred to as a second sensing signal (or a second sampling signal). The difference in the second sensing signals for the first sensors TX1 to TX4 may be used to detect the touch position of the object OBJ relative to the second direction DR2 (refer to Figure 3 ).

[0112] Reference Figure 8 The second self-sensing period SRP may be a period in which the sensor section 120 and the sensor driving section 220 are driven in the self-capacitance mode. In the second self-sensing period SRP, the sensor transmitting section TDC may be connected to the second input terminal IN2 of each sensor channel 222, and the corresponding second sensor may be connected to the first input terminal IN1 of each sensor channel 222.

[0113] For example, during the second self-sensing period SRP, the sensor transmitting unit TDC may supply the third touch signal to the second input terminal IN2 of each sensor channel 222. At this time, according to the characteristics of the operational amplifier AMP, the third touch signal may be supplied to the second sensor RX connected to the first input terminal IN1. In one embodiment, the sensor driving unit 220 may simultaneously supply the third touch signal to the second sensors RX1 to RX4 during the second self-sensing period SRP. For example, referring to Figure 8 At each time point t1d, t2d, t3d, t4d, t5d, t6d, t7d, t8d, the third touch signal may be simultaneously supplied to the second sensors RX1 to RX4. At this time, the first sensors TX1 to TX4 may receive a separate reference signal (e.g., a ground voltage) or may be in a floating state. Each third touch signal may correspond to a rising transition or a falling transition.

[0114] The second sensors RX1 to RX4 may have self-capacitance. At this time, when the object OBJ such as the user's finger approaches the second sensors RX1 to RX4, the self-capacitance of the second sensors RX1 to RX4 may change according to the capacitance formed with the surface of the object OBJ. The third touch signal reflecting this self-capacitance may be referred to as a third sensing signal (or a third sampling signal). The difference in the third sensing signal for the second sensors RX1 to RX4 may be used to detect the touch position of the object OBJ relative to the first direction DR1 (refer to Figure 3 ).

[0115] As described above, the sensor driving unit 220 can drive the entire sensing area SA of the sensor unit 120 according to at least one of the mutual sensing period MSP, the first self-sensing period STP, and the second self-sensing period SRP (see Figure 5 , Figure 7 and Figure 8 ).

[0116] Fig. 9 is a diagram for explaining a sensing method according to an embodiment of the present invention.

[0117] Reference Figure 1 and Figures 4 to 9 The sensor driving unit 220 may send a driving signal to the sensing area SA of the sensor unit 120 in units of p sensors.

[0118] For example, Fig. 9 As shown, the sensor driving unit 220 may send a driving signal in units of two first sensors during the mutual sensing period MSP. In this case, p may be 2. For example, a driving signal may be supplied to two of the first sensors TX1 to TX4 at the same time, and then a driving signal may be supplied to the next two first sensors at the same time.

[0119] In an actual display device equipped with tens to hundreds of first sensors TX, p may be approximately 4. For example, drive signals may be simultaneously supplied to four first sensors TX1 to TX4, and then drive signals may be simultaneously supplied to the next four first sensors.

[0120] Fig.10a is a diagram showing a vertical synchronization signal corresponding to a comparative example. Fig.10b is shown corresponding to Fig.10a A graph of the touch report rate for the vertical sync signal. Fig.10b In , it is assumed that the touch report rate has twice the frequency compared to the driving frequency.

[0121] Reference Fig.10a, the period of the vertical synchronization signal Vsync can be set differently corresponding to the driving frequency. Here, one period of the vertical synchronization signal Vsync can correspond to the period of one frame (1Frame). As an example, when the driving frequency is set to 60Hz, the period of the vertical synchronization signal Vsync (i.e., one frame) can be approximately set to 16.6ms. As an example, when the driving frequency is set to 120Hz, the period of the vertical synchronization signal Vsync (i.e., one frame) can be approximately set to 8.3ms. The vertical synchronization signal Vsync is supplied in a pulse form, and the pulses have the same polarity (as an example, a logic high level).

[0122] Reference Fig.10b , the display driver 210 generates Fig.10a In the case of the vertical synchronization signal Vsync shown, the sensor driving unit 220 can count one cycle of the vertical synchronization signal Vsync to determine the driving frequency. In this case, the sensor driving unit 220 can determine the driving frequency by delaying at least one frame cycle compared with the actual driving frequency of the display driving unit 210.

[0123] As an example, the touch report rate may have a frequency twice that of the driving frequency. The touch report rate is the speed at which touch input coordinates are sent to an application processor, etc. The higher the touch report rate, the faster the touch input coordinates are updated, and thus the touch sensitivity may be improved.

[0124] In the case where the driving frequency determined by the sensor driving section 220 is delayed by one frame period, the frequency of the touch report rate may also be delayed by one frame period and changed. As an example, in the case where the frequency of the vertical synchronization signal Vsync generated from the display driving section 210 is 120 Hz, the sensor driving section 220 may set the touch report rate to 240 Hz after delaying one frame.

[0125] As an example, in the case where the frequency of the vertical synchronization signal Vsync generated from the display driving section 210 is 60 Hz, the sensor driving section 220 may set the touch report rate to 120 Hz after delaying one frame.

[0126] In addition, since the sensor driver 220 determines the driving frequency one frame later than the display driver 210, when the driving frequency of the display driver 210 changes from 120 Hz to 60 Hz, the touch report rate may be set to an unexpected frequency during a portion of the interval SP.

[0127] In the case where the driving frequency of the display device 1 is continuously changed, a touch report rate generated from the sensor driving part 220 may be different from a desired frequency during a plurality of frame periods, and accordingly a touch input may not be stably sensed.

[0128] In addition, the sensor driving unit 220 can generate various signals (for example, touch signals) corresponding to the vertical synchronization signal Vsync. Here, when the driving frequency determined from the sensor driving unit 220 is different from the driving frequency of the display driving unit 210, a predetermined noise (for example, horizontal stripes, flickering, jitter, etc.) may be generated in the image.

[0129] Fig.11 It is shown Figure 1 FIG. 1 is a diagram showing an embodiment of a display driving unit. Fig.11 In the drawings, only the configuration necessary for explaining the present invention is shown.

[0130] Reference Fig.11 According to an embodiment of the present invention, the display driving unit 210 may be equipped with a signal generating unit 212 and a first oscillator 214 .

[0131] The first oscillator 214 (or display oscillator) may generate a first clock signal CLK1 (or display clock signal) to be used inside the display driving section 210. Here, the first clock signal CLK1 may have a high frequency (for example, a frequency of 1 MHz or more).

[0132] The signal generating unit 212 may receive a control signal CS from the outside (for example, an application processor, etc.) The signal generating unit 212 receiving the control signal CS may divide the first clock signal CLK1 based on the control signal CS to generate a vertical synchronization signal Vsync and a horizontal synchronization signal Hsync (and a data enable signal).

[0133] As described above, the cycle of the vertical synchronization signal Vsync may correspond to a frame period. The frame period may indicate a period during which an image of one screen is displayed on the display unit 110.

[0134] The cycle of the horizontal synchronization signal Hsync may correspond to a horizontal period. The horizontal period may indicate a period for supplying data signals to pixels located in one horizontal line (eg, a pixel row where pixels connected to the same scan line are located).

[0135] Fig.12a and Figure 12b Shown from Fig.11 An embodiment of a vertical synchronization signal generated by a signal generating unit. Figures 13a to 14bis a graph showing the width of the first pulse of polarity reversal.

[0136] Reference Fig.12a and Figure 12b When the driving frequency of the display device 1 changes, the signal generating section 212 may invert (or toggle) the polarity of the vertical synchronization signal Vsync (ie, the polarity of the pulse).

[0137] As an example, when the driving frequency is changed from 120 Hz to 60 Hz, the signal generating section 212 may change the pulse polarity of the vertical synchronization signal Vsync from a logic high level (or, high voltage) to a logic low level (or, low voltage).

[0138] As an example, when the driving frequency is changed from 60 Hz to 80 Hz, the signal generating section 212 may change the pulse polarity of the vertical synchronization signal Vsync from a logic low level (or, low voltage) to a logic high level (or, high voltage).

[0139] That is, in the embodiment of the present invention, whenever the driving frequency of the display device 1 changes, the signal generating unit 212 reverses the pulse polarity of the vertical synchronization signal Vsync, and accordingly, the sensor driving unit 220 can use the pulse polarity of the vertical synchronization signal Vsync to determine whether the driving frequency has changed.

[0140] Reference Figures 13a to 14b When the pulse polarity of the vertical synchronization signal Vsync is reversed, the signal generating unit 212 may control the width of the first pulse FP corresponding to the driving frequency. In an embodiment, when the polarity of the vertical synchronization signal Vsync is reversed, the width of the first pulse FP may be set corresponding to the driving frequency.

[0141] As an example, Fig.13a and Fig.13b As shown, the signal generating section 212 may set the width of the first pulse FP to be narrower (or shorter) as the driving frequency increases. As an example, when the driving frequency is 60 Hz, the width of the first pulse FP may be set to be wider than when the driving frequency is 80 Hz. As an example, when the driving frequency is 80 Hz, the width of the first pulse FP may be set to be wider than when the driving frequency is 120 Hz. Fig.13a It can be shown that the first pulse FP is at a logic low level. Fig.13b It can be shown that the first pulse FP is at a logic high level.

[0142] As an example, Fig.14a and Fig.14bAs shown, the signal generating section 212 may set the width of the first pulse FP to become wider (or longer) as the driving frequency increases. As an example, when the driving frequency is 60 Hz, the width of the first pulse FP may be set to be narrower than when the driving frequency is 80 Hz. As an example, when the driving frequency is 80 Hz, the width of the first pulse FP may be set to be narrower than when the driving frequency is 120 Hz. Fig.14a It can be shown that the first pulse FP is at a logic low level. Fig.14b It can be shown that the first pulse FP is at a logic high level.

[0143] The sensor driving section 220 may determine the driving frequency of the display driving section 210 (or the driving frequency of the display device 1 ) by using the width of the first pulse FP of the vertical synchronization signal Vsync.

[0144] Fig.15 It is shown Figure 1 FIG. 1 is a diagram of an embodiment of a sensor driving unit shown in FIG. Fig.15 In the drawings, only the configuration necessary for explaining the present invention is shown.

[0145] Reference Fig.15 According to an embodiment of the present invention, the sensor driving unit 220 may be equipped with a polarity determination unit 221 , a frequency determination unit 223 , a touch control unit 225 and a second oscillator 228 .

[0146] The second oscillator 228 (or sensor oscillator) may generate a second clock signal CLK2 (or sensor clock signal) to be used inside the sensor driving section 220. Here, the second clock signal CLK2 may have a high frequency (for example, a frequency of 1 MHz or more).

[0147] The polarity determination part 221 may determine the polarity of the vertical synchronization signal Vsync supplied from the display driving part 210. As an example, the polarity determination part 221 may determine whether the vertical synchronization signal Vsync is at a logic low level or a logic high level.

[0148] When the pulse polarity of the vertical synchronization signal Vsync remains the same, the polarity determination section 221 may generate a hold control signal HCS and supply it to the touch control section 225. When the pulse polarity of the vertical synchronization signal Vsync changes, the polarity determination section 221 may generate a change control signal CCS and supply it to the frequency determination section 223.

[0149] As an example, the polarity determination unit 221 may be Fig.12a The first time point t1, Figure 12bAt the third time point t3, the polarity determination unit 221 generates a hold control signal HCS and supplies it to the touch control unit 225. As an example, the polarity determination unit 221 may Fig.12a The second time point t2, Figure 12b At the fourth time point t4, the change control signal CCS is generated and supplied to the frequency determination section 223.

[0150] When the change control signal CCS is supplied, the frequency determination unit 223 may count the width of the first pulse FP of the vertical synchronization signal Vsync whose polarity is inverted. As an example, the frequency determination unit 223 may include a counter and may count the width of the first pulse FP using the second clock signal CLK2 to generate a count signal COS. The count signal COS generated from the frequency determination unit 223 may be supplied to the touch control unit 225.

[0151] In an embodiment, the frequency determination unit 223 may generate the count signal COS having count values ​​different from each other corresponding to the width of the first pulse FP.

[0152] For example, Fig.13a and Fig.13b As shown, the frequency determination unit 223 may generate a count signal COS having a first count value CN1 corresponding to the first pulse FP of 60 Hz, a second count value CN2 corresponding to the first pulse FP of 80 Hz, and a third count value CN3 corresponding to the first pulse FP of 120 Hz. As an example, the second count value CN2 may be smaller than the first count value CN1. For example, the third count value CN3 may be smaller than the second count value CN2.

[0153] As an example, Fig.14a and Fig.14b As shown, the frequency determination unit 223 may generate a count signal COS having a first count value CN1a corresponding to the first pulse FP of 120 Hz, a second count value CN2a corresponding to the first pulse FP of 80 Hz, and a third count value CN3a corresponding to the first pulse FP of 120 Hz. As an example, the second count value CN2a may be smaller than the first count value CN1a. As an example, the third count value CN3a may be smaller than the second count value CN2a.

[0154] The touch control unit 225 may control the overall operation of the sensor driving unit 220. The sensor transmitting unit TDC and the sensor receiving unit TSC may be included in the touch control unit 225. The touch control unit 225 may generate various signals (for example, touch signals, etc.) by dividing the second clock signal CLK2. Here, the periods (or frequencies) of the various signals generated by the touch control unit 225 may be set differently corresponding to the driving frequency.

[0155] In an embodiment, when the hold control signal HCS is input from the polarity determination unit 221 , the touch control unit 225 may determine that the driving frequency is the same as the previous driving frequency, and may generate various signals corresponding to the previous driving frequency.

[0156] In an embodiment, when the count signal COS is input from the frequency determination unit 223, the touch control unit 225 may determine that the driving frequency has changed, and may grasp the driving frequency corresponding to the count values ​​CN and CNa included in the count signal COS. Thereafter, the touch control unit 225 may generate various signals corresponding to the changed driving frequency.

[0157] In an embodiment of the present invention, the sensor driving unit 220 can use the polarity of the vertical synchronization signal Vsync and the width of the first pulse FP to determine the driving frequency in real time. In this case, the sensor driving unit 220 and the display driving unit 210 can generate various signals corresponding to the same driving frequency, thereby improving the display quality of the display device 1.

[0158] In addition, in the embodiment of the present invention, the frequency determination unit 223 counts the width of the first pulse FP of the vertical synchronization signal Vsync only when the change control signal CCS is supplied. That is, the frequency determination unit 223 is driven only when the driving frequency changes, thereby reducing power consumption.

[0159] As an example, when the polarity of the vertical synchronization signal Vsync is the same, in order to determine the driving frequency, it is necessary to continuously count the cycle of the vertical synchronization signal Vsync. On the contrary, as in the present invention, when the polarity of the vertical synchronization signal Vsync is reversed whenever the driving frequency changes, only the width of the first pulse FP whose polarity is reversed can be counted, thereby reducing power consumption.

[0160] Fig.16 is a flowchart showing the operation procedure of the sensor driving section.

[0161] Reference Fig.16 First, the vertical synchronization signal Vsync may be input from the display driving section 210 to the sensor driving section 220 (S1600). Thereafter, the polarity determination section 221 included in the sensor driving section 220 may determine whether the pulse polarity of the vertical synchronization signal Vsync is reversed (S1602).

[0162] In step S1602, when the pulse polarity of the vertical synchronization signal Vsync is not inverted (i.e., when the pulse polarity is maintained at the same logic level), the polarity determination unit 221 may generate a hold control signal HCS and supply it to the touch control unit 225. At this time, the touch control unit 225 may generate a variety of signals corresponding to the previous driving frequency (S1604).

[0163] In step S1602, when the pulse polarity of the vertical synchronization signal Vsync is inverted (i.e., when the pulse polarity is changed to a different logic level), the polarity determination unit 221 may generate a change control signal CCS and supply it to the frequency determination unit 223. The frequency determination unit 223 receiving the change control signal CCS may count the first pulse FP to generate a count signal COS, and supply the generated count signal COS to the touch control unit 225.

[0164] The touch control part 225 receiving the count signal COS may determine the changed driving frequency using the count values ​​CN, CNa included in the count signal COS ( S1606 ), and may generate various signals corresponding to the changed driving frequency ( S1608 ).

[0165] Fig.17 is a diagram illustrating a touch report rate corresponding to a vertical synchronization signal according to an embodiment of the present invention. Fig.17 , the touch report rate is twice the driving frequency, but the embodiments of the present invention are not limited thereto. As an example, the touch report rate can be set to various frequencies in association with the driving frequency.

[0166] Reference Fig.17 , the vertical synchronization signal Vsync generated by the display driving unit 210 is supplied to the sensor driving unit 220, and the sensor driving unit 220 can use the polarity of the vertical synchronization signal Vsync and the width of the first pulse FP whose polarity is reversed to determine the driving frequency in real time. In this case, the sensor driving unit 220 can send the touch input coordinates and the like at a touch report rate corresponding to the driving frequency without frame delay.

[0167] Fig.18 FIG. 1 is a diagram showing a display unit and a display driving unit according to an embodiment of the present invention.

[0168] Reference Fig.18The display driving unit 210 may include a timing control unit 11 and a data driving unit 12, and the display unit 110 may include a scanning driving unit 13 and a light emitting driving unit 15. However, as described above, each functional unit may be integrated into one IC, or integrated into a plurality of ICs, or mounted on the display substrate 111, which may be variously configured according to the specifications of the display device 1. In addition, the timing control unit 11 may include Fig.11 The signal generating unit 212 and the first oscillator 214 are shown.

[0169] The timing control unit 11 can receive grayscale and timing signals (or, Fig.11 Here, the processor 9 may correspond to at least one of a graphics processing unit (GPU), a central processing unit (CPU), an application processor (AP), and the like.

[0170] Grayscales may be supplied in units of horizontal lines in each horizontal period. A horizontal line may represent pixels (eg, a pixel row) connected to the same scan line.

[0171] The timing control unit 11 may render grayscales in accordance with the specifications of the display device 1 (or the pixel unit 14). For example, the processor 9 may provide red grayscale, green grayscale, and blue grayscale to each unit dot. For example, in the case where the pixel unit 14 is an RGB stripe structure, the pixels may correspond to each grayscale one-to-one. In this case, it may not be necessary to render grayscales. However, for example, in the case where the pixel unit 14 is In the case of a structure, since pixels are shared between adjacent unit points, the pixels may not correspond to each grayscale one-to-one. In this case, it may be necessary to render the grayscale. The rendered or unrendered grayscale may be provided to the data driving unit 12. Furthermore, the timing control unit 11 may provide a data control signal to the data driving unit 12. Furthermore, the timing control unit 11 may provide a scan control signal to the scan driving unit 13.

[0172] The data driving part 12 may generate data voltages (or data signals) to be supplied to the data lines DL1 to DLn (eg, n is a positive integer) using the grayscale and data control signals received from the timing control part 11 .

[0173] The scanning drive unit 13 can generate a scanning signal to be supplied to the scanning lines SL0 to SLm (for example, m is a positive integer) by using a clock signal, a scanning start signal, etc. received from the timing control unit 11. The scanning drive unit 13 can sequentially supply a scanning signal having a pulse of a conduction level to the scanning lines SL0 to SLm. For example, the scanning drive unit 13 can supply a scanning signal of a conduction level to the scanning line in an active period of supplying grayscale with a cycle corresponding to a cycle of the horizontal synchronization signal Hsync. The scanning drive unit 13 may include a scanning stage formed in the form of a shift register. The scanning drive unit 13 can generate a scanning signal in a manner that sequentially passes a scanning start signal in the form of a pulse of a conduction level to the next scanning stage according to the control of the clock signal.

[0174] The light-emitting driving section 15 may generate a light-emitting signal to be supplied to the light-emitting lines EL1 to ELo (for example, o is a positive integer) using a light-emitting control signal (for example, a clock signal, a light-emitting stop signal, etc.) received from the timing control section 11. The light-emitting driving section 15 may sequentially supply a light-emitting signal having a pulse of a cut-off level to the light-emitting lines EL1 to ELo. The light-emitting driving section 15 may include a light-emitting stage configured in the form of a shift register. The light-emitting driving section 15 may generate a light-emitting signal in a manner that sequentially transmits a light-emitting stop signal in the form of a pulse of a cut-off level to the next light-emitting stage according to the control of the clock signal.

[0175] The pixel unit 14 includes pixels PX. Each pixel PX can be connected to a corresponding data line DL and a scan line SL. For example, a pixel PXij can be connected to the i-th scan line and the j-th data line. The pixel PX can include a pixel PX that emits light of a first color, a pixel PX that emits light of a second color, and a pixel PX that emits light of a third color. The first color, the second color, and the third color can be different colors from each other. For example, the first color can be one of red, green, and blue, the second color can be one of red, green, and blue except the first color, and the third color can be the remaining colors of red, green, and blue except the first color and the second color. In addition, as the first to third colors, magenta, cyan, and yellow can also be used instead of red, green, and blue.

[0176] Fig.19 is a diagram for explaining a pixel according to an embodiment of the present invention.

[0177] Reference Fig.19The pixel PXij includes transistors T1, T2, T3, T4, T5, T6, T7, a storage capacitor Cst and a light emitting element LD.

[0178] The following is an example of a circuit formed by a P-type transistor. However, a person skilled in the art can design a circuit formed by an N-type transistor by changing the polarity of the voltage applied to the gate terminal. Similarly, a person skilled in the art will be able to design a circuit formed by a combination of a P-type transistor and an N-type transistor. Transistors can be formed in various forms such as thin film transistors (TFT), field effect transistors (FET), bipolar junction transistors (BJT), etc.

[0179] A gate electrode of the first transistor T1 may be connected to the first node N1, a first electrode may be connected to the second node N2, and a second electrode may be connected to the third node N3. The first transistor T1 may be named a driving transistor.

[0180] A gate electrode of the second transistor T2 may be connected to the scan line SLi1, a first electrode may be connected to the data line DLj, and a second electrode may be connected to the second node N2. The second transistor T2 may be named a scan transistor.

[0181] A gate electrode of the third transistor T3 may be connected to the scan line SLi2, a first electrode may be connected to the first node N1, and a second electrode may be connected to the third node N3. The third transistor T3 may be named a diode-connected transistor.

[0182] A gate electrode of the fourth transistor T4 may be connected to the scan line SLi3, a first electrode may be connected to the first node N1, and a second electrode may be connected to the initialization line INTL. The fourth transistor T4 may be named a gate initialization transistor.

[0183] The gate electrode of the fifth transistor T5 can be connected to the i-th light emitting line ELi, the first electrode can be connected to the first power line ELVDDL, and the second electrode can be connected to the second node N2. The fifth transistor T5 can be named as a light emitting transistor. In another embodiment, the gate electrode of the fifth transistor T5 can also be connected to a light emitting line different from the light emitting line connected to the gate electrode of the sixth transistor T6.

[0184] The gate electrode of the sixth transistor T6 can be connected to the i-th light emitting line ELi, the first electrode can be connected to the third node N3, and the second electrode can be connected to the anode of the light emitting element LD. The sixth transistor T6 can be named as a light emitting transistor. In another embodiment, the gate electrode of the sixth transistor T6 can be connected to a light emitting line different from the light emitting line connected to the gate electrode of the fifth transistor T5.

[0185] A gate electrode of the seventh transistor T7 may be connected to the scan line SLi4, a first electrode may be connected to the initialization line INTL, and a second electrode may be connected to the anode of the light emitting element LD. The seventh transistor T7 may be named a light emitting element initialization transistor.

[0186] A first electrode of the storage capacitor Cst may be connected to the first power line ELVDDL, and a second electrode may be connected to the first node N1.

[0187] The anode of the light emitting element LD can be connected to the second electrode of the sixth transistor T6, and the cathode can be connected to the second power line ELVSSL. The light emitting element LD can be a light emitting diode. The light emitting element LD can be composed of an organic light emitting diode, an inorganic light emitting diode, a quantum dot / well light emitting diode, etc. The light emitting element LD can emit light in any one of the first color, the second color and the third color. In addition, in the present embodiment, each pixel is equipped with only one light emitting element LD, but in another embodiment, each pixel can also be equipped with multiple light emitting elements. At this time, the multiple light emitting elements can be connected in series, in parallel, in series and parallel, etc.

[0188] A first power supply voltage may be applied to the first power supply line ELVDDL, a second power supply voltage may be applied to the second power supply line ELVSSL, and an initialization voltage may be applied to the initialization line INTL. For example, the first power supply voltage may be greater than the second power supply voltage. For example, the initialization voltage may be equal to or greater than the second power supply voltage. For example, the initialization voltage may correspond to a data voltage of the minimum size among the data voltages that can be provided. In another example, the size of the initialization voltage may be smaller than the size of the data voltage that can be provided.

[0189] Fig. 20 It is used to illustrate Fig.19 FIG. 1 is a diagram of an exemplary driving method of a pixel.

[0190] In the following, for the sake of convenience, it is assumed that the scan lines SLi1, SLi2, and SLi4 are the i-th scan line SLi, and the scan line SLi3 is the i-1-th scan line SL(i-1). However, according to the embodiment, the connection relationship between the scan lines SLi1, SLi2, SLi3, and SLi4 can be various. For example, the scan line SLi4 can be the i-1-th scan line, or can also be the i+1-th scan line.

[0191] First, a light emitting signal of a cut-off level (logic high level) is applied to the i-th light emitting line ELi, a data voltage DATA(i-1)j for the i-1-th pixel is applied to the data line DLj, and a scan signal of a turn-on level (logic low level) is applied to the scan line SLi3. The high / low of the logic level may be different depending on whether the transistor is a P-type or an N-type.

[0192] At this time, since the scan signal of the off level is applied to the scan lines SLi1 and SLi2 , the second transistor T2 is in the off state and prevents the data voltage DATA(i-1)j for the i-1th pixel from being introduced into the pixel PXij.

[0193] At this time, since the fourth transistor T4 is in the on state, the first node N1 is connected to the initialization line INTL to initialize the voltage of the first node N1. Since the light emitting signal of the off level is applied to the light emitting line ELi, the transistors T5 and T6 are in the off state, and unnecessary light emission of the light emitting element LD due to the process of applying the initialization voltage is prevented.

[0194] Next, the data voltage DATAij for the i-th pixel PXij is applied to the data line DLj, and the scan signal of the on level is applied to the scan lines SLi1 and SLi2. Accordingly, the transistors T2, T1, and T3 are in the on state, and the data line DLj is electrically connected to the first node N1. Therefore, the compensation voltage obtained by subtracting the threshold voltage of the first transistor T1 from the data voltage DATAij is applied to the second electrode (i.e., the first node N1) of the storage capacitor Cst, and the storage capacitor Cst maintains a voltage corresponding to the difference between the first power supply voltage and the compensation voltage. This period can be named as a threshold voltage compensation period or a data writing period.

[0195] When the scan line SLi4 is the i-th scan line SLi, since the seventh transistor T7 is in the on state, the anode of the light emitting element LD is connected to the initialization line INTL, and the light emitting element LD is initialized to a charge amount corresponding to the voltage difference between the initialization voltage and the second power supply voltage.

[0196] Then, when a light emission signal of a turn-on level is applied to the i-th light emission line ELi, transistors T5 and T6 may be turned on, thereby forming a driving current path connecting the first power line ELVDDL, the fifth transistor T5, the first transistor T1, the sixth transistor T6, the light emitting element LD and the second power line ELVSSL.

[0197] According to the voltage maintained in the storage capacitor Cst, the amount of driving current flowing through the first electrode and the second electrode of the first transistor T1 is adjusted. The light emitting element LD emits light at a brightness corresponding to the amount of driving current. Before the light emitting signal that the light emitting element LD emits light to the cut-off level is applied to the light emitting line ELi.

[0198] When the light emitting signal is at the on level, the pixel receiving the corresponding light emitting signal may be in a display state. Therefore, the period during which the light emitting signal is at the on level may be referred to as a light emitting period EP (or a light emitting permitted period). And, when the light emitting signal is at the off level, the pixel receiving the corresponding light emitting signal may be in a non-display state. Therefore, the period during which the light emitting signal is at the off level may be referred to as a non-light emitting period NEP (or a light emitting not permitted period).

[0199] Fig. 20 The non-light emitting period NEP described in is used to prevent the pixel PXij from emitting light with an undesired brightness during the elapse of the initialization period and the data writing period.

[0200] During the period of keeping the data written to the pixel PXij (for example, one frame period), one or more non-luminous periods NEP may be provided additionally. The purpose may be to effectively express low grayscale by reducing the luminous period EP of the pixel PXij, or to smoothly blur the motion of the image.

[0201] Figure 21 to Figure 27 It is a diagram for explaining an exemplary configuration of a display device. Figure 21 to Figure 27 Reference numerals and Figures 1 to 20 The reference numerals are independent of each other.

[0202] Fig.21 is a diagram for explaining a substrate according to an embodiment of the present invention, Fig. 22 FIG. 1 is a diagram for explaining a display device according to an embodiment of the present invention.

[0203] In the following embodiments, the first direction DR1 and the second direction DR2 may be used to define the position of the plane, and the third direction DR3 may be used to define the position of the height (see Fig. 22 , Fig.23 ). The first direction DR1, the second direction DR2, and the third direction DR3 may be directions orthogonal to each other.

[0204] The substrate SUB may include a display area DA, a non-display area NDA, a first additional area ADA1, and a second additional area ADA2.

[0205] The display area DA may have a rectangular shape. Each corner of the display area DA may be an angled shape or a curved shape. Also, in the case of a circular display, the display area DA may have a circular shape. Also, the display area DA may be configured as a polygon other than a quadrilateral, an ellipse, etc. Thus, the shape of the display area DA may be set differently according to the product.

[0206] The pixels may be located on the display area DA. Depending on the type of the display device DP, each pixel may include a light emitting diode or a liquid crystal layer.

[0207] The non-display area NDA may surround the outer contour of the display area DA. For example, the non-display area NDA may have a rectangular shape. Each corner of the non-display area NDA may be an angled shape or a curved shape. Fig. 22 In the figure, it is assumed that each corner of the non-display area NDA has a curved surface shape and is illustrated. The non-display area NDA may have a round shape. Since minimizing the non-display area NDA is conducive to a narrow bezel structure, the shape of the non-display area NDA may be similar to that of the display area DA.

[0208] The first additional area ADA1 may be located between the non-display area NDA and the second additional area ADA2. The first additional area ADA1 and the non-display area NDA may be connected at a first boundary ED1. The first additional area ADA1 and the second additional area ADA2 may be connected at a second boundary ED2. The first boundary ED1 and the second boundary ED2 may extend along a first direction DR1, respectively.

[0209] The width of the first additional area ADA1 may gradually narrow from the first boundary ED1 toward the second boundary ED2. That is, the width of the first additional area ADA1 in the first direction DR1 may gradually narrow toward the second direction DR2. Accordingly, the first additional area ADA1 may include a curved first side surface RC1 and a curved second side surface RC2. The side surfaces RC1 and RC2 may bulge toward the inside of the substrate (e.g., the center of the substrate).

[0210] exist Fig. 22, the first additional area ADA1 is shown to include two side surfaces RC1 and RC2 in the first direction DR1 and the opposite direction thereof. In another embodiment, since the boundary in the first direction DR1 coincides with the boundary of the non-display area NDA, the first additional area ADA1 may also include only the first side surface RC1. In yet another embodiment, since the boundary in the opposite direction of the first direction DR1 coincides with the boundary of the non-display area NDA, the first additional area ADA1 may also include only the second side surface RC2.

[0211] The second additional area ADA2 may have a rectangular shape. Each corner of the second additional area ADA2 located in the second direction DR2 may be an angled shape or a curved shape. Fig. 22 In the figure, it is assumed that each corner in the second direction DR2 of the second additional area ADA2 is in an angled shape and is illustrated.

[0212] The encapsulation film TFE may be located on the pixel. For example, the encapsulation film TFE may cover the pixel in the display area DA, and the boundary of the encapsulation film TFE may be located in the non-display area NDA. By making the encapsulation film TFE cover the light-emitting elements and circuit elements of the pixel in the display area DA, damage caused by external moisture or impact can be prevented.

[0213] Sensing electrodes SC1, SC2 (as an example, Figure 1 The sensors TX, RX shown in the figure can be located on the packaging film TFE. The sensing electrodes SC1 and SC2 can sense touch, hovering, gesture, proximity, etc. based on the user's body. The sensing electrodes SC1 and SC2 can be configured in different shapes according to various methods such as resistive type, capacitive type, electromagnetic induction type (EM: electro-magnetic type), optical type, etc. For example, when the sensing electrodes SC1 and SC2 are configured in a capacitive manner, the sensing electrodes SC1 and SC2 can be driven in a self-capacitance mode, a mutual capacitance mode, etc.

[0214] When the sensing electrodes SC1 and SC2 are driven in mutual capacitance mode, a touch signal is sent through the sensing wiring corresponding to the first sensing electrode SC1, and the sensing signal can be received through the sensing wiring corresponding to the second sensing electrode SC2 that forms a mutual capacitance with the first sensing electrode SC1. When the user's body approaches, the mutual capacitance between the first sensing electrode SC1 and the second sensing electrode SC2 can change, and whether the user touches can be detected based on the difference in the touch signal based on this. In another embodiment, a touch signal can be sent through the sensing wiring corresponding to the second sensing electrode SC2, and a sensing signal can be received through the sensing wiring corresponding to the first sensing electrode SC1 that forms a mutual capacitance with the second sensing electrode SC2.

[0215] The pads PDE1, PDE2, and PDE3 may be located on the second additional area ADA2. The pads PDE1 and PDE3 may be connected to the sensing electrodes SC1 and SC2 located on the upper portion of the encapsulation film TFE through the sensing wirings IST1 and IST2. The pads PDE1 and PDE3 may be connected to an external touch IC (integrated chip). Furthermore, the pad PDE2 may be connected to a pixel or a driving unit of a pixel located at the lower portion of the encapsulation film TFE through the display wiring DST. The driving unit may include a scanning driving unit, a light emitting driving unit, a data driving unit, and the like. The driving unit may be located at the lower portion of the encapsulation film TFE, or may be located at an external display IC connected through the pad PDE2.

[0216] When the display device DP is driven in mutual capacitance mode, the touch IC may send a touch signal through the first sensing wiring IST1 and receive a sensing signal through the second sensing wiring IST2. In another embodiment, a touch signal may also be sent through the second sensing wiring IST2, and a sensing signal may be received through the first sensing wiring IST1. For reference, when the display device DP is driven in self-capacitance mode, there may be no difference in the driving mode of the first sensing wiring IST1 and the second sensing wiring IST2. The display wiring DST may include a control line, a data line, a power line, etc., and may provide a signal to allow the pixel to display an image. These signals may be provided from a driving unit connected to the display wiring DST.

[0217] Fig.21 The substrate SUB is bent. Fig. 22 The display device DP can be in a state where the substrate SUB is not bent. Fig. 22 In the unbent state shown, after the components are stacked on the substrate SUB, as shown in FIG. Fig.21 The ground is bent as shown.

[0218] The substrate SUB may include a first curved area BA1 extending from a first side surface RC1 of the first additional area ADA1 in a manner overlapping with the non-display area NDA. In addition, the first curved area BA1 may extend in a manner overlapping with the display area DA. That is, each display area DA, the non-display area NDA and the first additional area ADA1 may partially overlap with the first curved area BA1. The first curved area BA1 may have a width in a first direction DR1, and a length may extend along a second direction DR2. The first bending axis BX1 may be defined as a folding line extending from the center of the first curved area BA1 along the second direction DR2. According to an embodiment, unlike other surrounding parts, the first curved area BA1 may be a part where a portion of an insulating film or the like is removed and stress is reduced. According to an embodiment, the first curved area BA1 may also have the same configuration as other surrounding parts.

[0219] The substrate SUB may include a third bending area BA3 extending from the second side RC2 of the first additional area ADA1 in a manner overlapping the non-display area NDA. In addition, the third bending area BA3 may extend in a manner overlapping the display area DA. That is, each of the display area DA, the non-display area NDA, and the first additional area ADA1 may partially overlap the third bending area BA3. The third bending area BA3 may have a width in the first direction DR1, and a length may extend along the second direction DR2.

[0220] The third bending axis BX3 may be defined as a folding line extending from the center of the third bending area BA3 along the second direction DR2. According to an embodiment, the third bending area BA3 may be a portion where a portion of an insulating film or the like is removed and stress is reduced, unlike other surrounding portions. According to an embodiment, the third bending area BA3 may also have the same configuration as other surrounding portions.

[0221] The second additional area ADA2 may include a second bending area BA2. The second bending area BA2 may have a width in the second direction DR2, and a length may extend along the first direction DR1. The second bending axis BX2 may be defined as a folding line extending from the center of the second bending area BA2 along the first direction DR1. According to an embodiment, unlike other surrounding portions, the second bending area BA2 may be a portion where a portion of an insulating film or the like is removed and stress is reduced. According to an embodiment, the second bending area BA2 may also have the same configuration as other surrounding portions.

[0222] The first bending area BA1, the second bending area BA2, and the third bending area BA3 may not overlap with each other.

[0223] Here, the term "folding" means that the shape is not fixed, but can be deformed from the original shape to other shapes, including folded or curved along one or more bending axes or rolled in a scroll manner. Through the first bending area BA1 and the third bending area BA3, the width of the side frame of the display device DP in the opposite direction of the first direction DR1 and in the first direction DR1 can be reduced. And, through the second bending area BA2, the width of the side frame of the display device DP in the second direction DR2 can be reduced.

[0224] Fig.23 is corresponding to Fig. 22 An embodiment of a cross section of line II' of FIG. Assume Fig. 22 The II' line passes through the first pad PDE1 and the first sensing wiring IST1.

[0225] First, the display area DA is described. In one embodiment of the present invention, pixels PX are provided in the display area DA. Each pixel PX may include a transistor connected to a corresponding wiring in the display wiring DST, a light emitting element connected to the transistor, and a capacitor Cst. Fig.23 In the figure, for the convenience of explanation, one pixel PX is illustrated as an example.

[0226] The substrate SUB may be made of insulating materials such as glass and resin, etc. Also, the substrate SUB may be made of a flexible material so as to be bendable or foldable, and may have a single-layer structure or a multi-layer structure.

[0227] For example, the substrate SUB may include at least one of polystyrene, polyvinylalcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetate cellulose, and cellulose acetate propionate. However, the material constituting the substrate SUB may be varied, and may also be composed of fiber reinforced plastic (FRP) and the like.

[0228] For example, when the substrate SUB has a multi-layer structure, a single layer or multiple layers of an inorganic material such as silicon nitride, silicon oxide, or silicon oxynitride may be interposed between the multiple layers.

[0229] The buffer film BF may cover the substrate SUB. The buffer film BF may prevent impurities from diffusing into the channel of the transistor. The buffer film BF may be an inorganic insulating film formed using an inorganic material. For example, the buffer film BF may be formed using silicon nitride, silicon oxide, silicon oxynitride, etc., or may be omitted depending on the material and process conditions of the substrate SUB. According to an embodiment, a barrier film may also be provided.

[0230] An active film ACT may be provided on the buffer film BF. The active film ACT may be patterned to form a channel, a source electrode, and a drain electrode of a transistor, or may form wiring. The active film ACT may be formed using a semiconductor material. The active film ACT may be a semiconductor pattern formed using polycrystalline silicon, amorphous silicon, an oxide semiconductor, or the like. The channel of the transistor is a semiconductor pattern not doped with impurities, and may be an intrinsic semiconductor. The source electrode, the drain electrode, and the wiring may be a semiconductor pattern doped with impurities. As impurities, impurities such as n-type impurities, p-type impurities, and other metals may be used.

[0231] The first gate insulating film GI1 may cover the active film ACT. The first gate insulating film GI may be an inorganic insulating film formed of an inorganic material. As the inorganic material, inorganic insulating substances such as polysiloxane, silicon nitride, silicon oxide, and silicon oxynitride may be used.

[0232] The gate electrode GE of the transistor and the lower electrode LE of the capacitor Cst may be located on the first gate insulating film GI1. The gate electrode GE may overlap with a region corresponding to the channel. The gate electrode GE and the lower electrode LE may be formed of metal. For example, the gate electrode GE may be formed of at least one of metals such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the metals. Furthermore, the gate electrode GE may be formed of a single film, but is not limited thereto, and may be formed of a multi-film stack of two or more substances in the metal and the alloy.

[0233] The second gate insulating film GI2 may cover the gate electrode GE and the lower electrode LE. The second gate insulating film GI2 may be an inorganic insulating film made of an inorganic material. As the inorganic material, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, etc. may be used.

[0234] The upper electrode UE of the capacitor Cst may be located on the second gate insulating film GI2. The upper electrode UE of the capacitor Cst may be formed of a metal. For example, the upper electrode UE may be formed of at least one of metals such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or a metal alloy. Furthermore, the upper electrode UE may be formed of a single film, but is not limited thereto, and may be formed of a multi-film stack of two or more materials in a metal and an alloy.

[0235] The lower electrode LE and the upper electrode UE may form a capacitor Cst via the second gate insulating film GI2. Fig.23 In the figure, the capacitor Cst is shown as a two-layer electrode structure of a lower electrode LE and an upper electrode UE, but in other embodiments, the capacitor Cst can also be formed into a three-layer electrode structure using an active film ACT, or a three-layer electrode structure using electrodes of the same layer as the first connection pattern CNP1, or an electrode structure of four or more layers.

[0236] The interlayer insulating film ILD may cover the upper electrode UE. The interlayer insulating film ILD may be an inorganic insulating film formed of an inorganic material. As the inorganic material, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, etc. may be used.

[0237] In this embodiment, for convenience of description, the first gate insulating film GI1, the second gate insulating film GI2 and the interlayer insulating film ILD may be referred to as a first insulating film group ING1. The first insulating film group ING1 may cover a portion of the transistor. According to an embodiment, the first insulating film group ING1 may further include a buffer film BF.

[0238] The first connection pattern CNP1 may be located on the interlayer insulating film ILD and may contact the source electrode and the drain electrode of the active film ACT through contact holes formed in the interlayer insulating film ILD, the second gate insulating film GI2 , and the first gate insulating film GI1 .

[0239] The first connection pattern CNP1 may be formed of metal. For example, the source electrode and the drain electrode may be formed of at least one of metals such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of metals.

[0240] Although not shown, according to an embodiment, a passivation film may cover the first connection pattern CNP1. The passivation film may be an inorganic insulating film formed using an inorganic material. As the inorganic material, polysiloxane, silicon nitride, silicon oxide, silicon oxynitride, etc. may be used.

[0241] The first through hole film VIA1 may cover the passivation film or the transistor. The first through hole film VIA1 may be an organic insulating film made of an organic material. As the organic material, organic insulating substances such as polyacrylic acid compounds, polyimide compounds, fluorine-based carbon compounds such as Teflon, benzocyclobutene compounds, etc. may be used. The organic film may be deposited by evaporation or the like.

[0242] The second connection pattern CNP2 may be connected to the first connection pattern CNP1 through the opening of the first through-hole film VIA1. The second connection pattern CNP2 may be formed of at least one of metals such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the metals.

[0243] The second through hole film VIA2 may cover the first through hole film VIA1 and the second connection pattern CNP2. The second through hole film VIA2 may be an organic insulating film made of an organic material. As the organic material, organic insulating substances such as polyacrylic acid compounds, polyimide compounds, fluorine-based carbon compounds such as Teflon, and benzocyclobutene compounds may be used.

[0244] The first light emitting element electrode LDE1 may be connected to the second connection pattern CNP2 through the opening of the second via film VIA2. Here, according to an embodiment, the first light emitting element electrode LDE1 may be an anode of the light emitting element.

[0245] According to an embodiment, the configuration of the second through hole film VIA2 and the second connection pattern CNP2 may be omitted, and the first light emitting element electrode LDE1 may be directly connected to the first connection pattern CNP1 through the opening of the first through hole film VIA1 .

[0246] The first light emitting element electrode LDE1 may be formed using a metal film of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or an alloy thereof, and / or indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. The first light emitting element electrode LDE1 may be formed using one metal, but is not limited thereto, and may be formed using two or more metals (for example, an alloy of Ag and Mg).

[0247] When providing an image toward the bottom of the substrate SUB, the first light emitting element electrode LDE1 may be formed using a transparent conductive film. When providing an image toward the top of the substrate SUB, the first light emitting element electrode LDE1 may be formed using a metal reflective film and / or a transparent conductive film.

[0248] A pixel definition film PDL that partitions the light emitting area of ​​each pixel PX is provided on the substrate SUB on which the first light emitting element electrode LDE1 and the like are formed. The pixel definition film PDL may be an organic insulating film formed of an organic material. As the organic material, organic insulating substances such as polyacrylic acid compounds, polyimide compounds, fluorine-based carbon compounds such as Teflon, and benzocyclobutene compounds may be used.

[0249] The pixel definition film PDL may expose the upper surface of the first light emitting element electrode LDE1 and protrude from the substrate SUB along the periphery of the pixel PX. A light emitting film EML may be disposed in the pixel PX region surrounded by the pixel definition film PDL.

[0250] The light-emitting film EML may include low molecular or high molecular substances. As low molecular substances, copper phthalocyanine (CuPc), N,N-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB: N,N'-Di(naphthalene-1-yl)-N,N'-diphenyl-benzidine), tris-8-hydroxyquinolinealuminum (tris-8-hydroxyquinolinealuminum) (Alq3), etc. may be included. These substances may be formed by a vacuum deposition method. As the high molecular substance, PEDOT, polyphenylene vinyl (PPV: Poly-Phenylenevinylene) system, polyfluorene (Polyfluorene) system, etc. may be included.

[0251] The light-emitting film EML can be provided as a single layer, but can also be provided as a multi-layer including various functional layers. In the case where the light-emitting film EML is provided in multiple layers, the hole injection layer (HIL: Hole Injection Layer), the hole transport layer (HTL: Hole Transport Layer), the light-emitting layer (EML: Emission Layer), the electron transport layer (ETL: Electron Transport Layer), the electron injection layer (EIL: Electron Injection Layer), etc. can have a structure stacked in a single or composite structure. The light-emitting film EML can be formed by screen printing or inkjet printing method, laser induced thermal imaging method (LITI: Laser induced thermal imaging), etc.

[0252] According to an embodiment, at least a portion of the light emitting film EML may be integrally formed across the plurality of first light emitting element electrodes LDE1 , or may be independently provided in a manner corresponding to the plurality of first light emitting element electrodes LDE1 .

[0253] A second light emitting element electrode LDE2 may be disposed on the light emitting film EML. The second light emitting element electrode LDE2 may be disposed in each pixel PX, but may be disposed to cover most of the display area DA and may be shared by a plurality of pixels PX.

[0254] According to the embodiment, the second light emitting element electrode LDE2 can be used as a cathode or an anode. When the first light emitting element electrode LDE1 is an anode, the second light emitting element electrode LDE2 can be used as a cathode. When the first light emitting element electrode LDE1 is a cathode, the second light emitting element electrode LDE2 can be used as an anode.

[0255] The second light emitting element electrode LDE2 may be formed of a metal film such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, etc. and / or a transparent conductive film such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. In one embodiment of the present invention, the second light emitting element electrode LDE2 may be formed of a double film or more of a metal thin film, for example, a triple film of ITO / Ag / ITO.

[0256] When an image is to be provided toward the lower part of the substrate SUB, the second light emitting element electrode LDE2 can be formed using a metal reflective film and / or a transparent conductive film. When an image is to be provided toward the upper part of the substrate SUB, the second light emitting element electrode LDE2 can be formed using a transparent conductive film.

[0257] The set of the first light emitting element electrode LDE1 , the light emitting film EML and the second light emitting element electrode LDE2 may be referred to as a light emitting element.

[0258] A packaging film TFE may be provided on the second light emitting element electrode LDE2. The packaging film TFE may be formed using a single layer or multiple layers. In the present embodiment, the packaging film TFE may be formed using a first packaging film ENC1, a second packaging film ENC2, and a third packaging film ENC3. The first packaging film ENC1, the second packaging film ENC2, and the third packaging film ENC3 may be formed using organic materials and / or inorganic materials. The third packaging film ENC3 located at the outermost contour may be formed using an inorganic material. For example, the first packaging film ENC1 may be an inorganic film formed using an inorganic material, the second packaging film ENC2 may be an organic film formed using an organic material, and the third packaging film ENC3 may be an inorganic film formed using an inorganic material. In the case of inorganic materials, compared with organic materials, the penetration of moisture or oxygen is less, but the elasticity or flexibility is small, and therefore it is susceptible to cracks. The first packaging film ENC1 and the third packaging film ENC3 are formed using inorganic materials, and the second packaging film ENC2 is formed using organic materials, so that the spread of cracks can be prevented. Here, the layer made of organic material (i.e., the second packaging film ENC2) can be completely covered by the third packaging film ENC3 so that the end is not exposed to the outside. As the organic material, organic insulating substances such as polyacrylic compounds, polyimide compounds, fluorine-based carbon compounds such as Teflon, benzocyclobutene compounds, etc. can be used, and as the inorganic material, polysiloxane, silicon nitride, silicon oxide, silicon nitride oxide, etc. can be used.

[0259] The light-emitting film EML constituting the light-emitting element may be easily damaged by moisture or oxygen from the outside. The encapsulation film TFE protects the light-emitting film EML by covering the light-emitting film EML. The encapsulation film TFE covers the display area DA and may extend to the non-display area NDA outside the display area DA. However, in the case of an insulating film composed of an organic material, although it is advantageous in terms of flexibility and elasticity, moisture or oxygen is easily permeated compared to an insulating film composed of an inorganic material. In one embodiment of the present invention, in order to prevent moisture or oxygen from penetrating through the insulating film composed of an organic material, the end of the insulating film composed of an organic material may be covered by an insulating film composed of an inorganic material so as not to be exposed to the outside. For example, the first through-hole film VIA1, the second through-hole film VIA2 and the pixel definition film PDL composed of an organic material may not extend continuously to the non-display area NDA, but may be covered by the first encapsulation film ENC1. Accordingly, the upper surface of the pixel definition film PDL, the first through-hole film VIA1 , the second through-hole film VIA2 , and the side surface of the pixel definition film PDL are encapsulated by the encapsulation film TFE including an inorganic material, thereby preventing exposure to the outside.

[0260] However, the multi-layer or material of the encapsulation film TFE is not limited thereto and may be variously changed. For example, the encapsulation film TFE may include a plurality of organic material layers and a plurality of inorganic material layers alternately stacked on each other.

[0261] The first sensing electrode layer ISM1 may be located on the packaging film TFE. According to an embodiment, an additional buffer film may be provided between the first sensing electrode layer ISM1 and the packaging film TFE. The first sensing electrode layer ISM1 may be formed using a metal film such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, etc. and / or a transparent conductive film such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0262] The first sensing insulating film ISI1 may be present on the first sensing electrode layer ISM1. The first sensing insulating film ISI1 may be an inorganic insulating film made of an inorganic material. As the inorganic material, inorganic insulating substances such as polysiloxane, silicon nitride, silicon oxide, and silicon oxynitride may be used.

[0263] The second sensing electrode layer ISM2 may be present on the first sensing insulating film ISI1. The second sensing electrode layer ISM2 may be formed using a metal film such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, etc. and / or a transparent conductive film such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0264] The first sensing electrode layer ISM1 , the first sensing insulating film ISI1 , and the second sensing electrode layer ISM2 may be used to form various input sensing parts, which will be described later.

[0265] exist Fig.23 In the embodiment of the present invention, the second sensing electrode layer ISM2 may be patterned to form a first pattern IST1a of the first sensing wiring IST1. The second sensing insulating film ISI2 may be located on the second sensing electrode layer ISM2. The second sensing insulating film ISI2 may be formed using an organic film. For example, as an organic material, an organic insulating material such as a polyacrylic acid compound, a polyimide compound, a fluorine-based carbon compound such as Teflon, a benzocyclobutene compound, etc. may be used. For example, the second sensing insulating film ISI2 may also be formed using polymethyl methacrylate, polydimethylsiloxane, polyimide, acrylate, polyethylene terephthalate, polyethylene naphthalate, etc.

[0266] Next, the non-display area NDA, the first additional area ADA1 and the second additional area ADA2 are described. Fig.23 In the cross-sectional view, since the difference between the non-display area NDA and the first additional area ADA1 is not a feature, the non-display area NDA and the first additional area ADA1 will be described without distinguishing them. Hereinafter, in order to avoid repeated description, the contents that have been described will be omitted or simply described when describing the non-display area NDA and the second additional area ADA2.

[0267] The dam DAM may be located at the boundary of the second encapsulation film ENC2. For example, the dam DAM may be located between the planarization film FLT and the second encapsulation film ENC2. The dam DAM may be a multilayer structure, for example, it may include a first dam DAM1 and a second dam DAM2. For example, the first dam DAM1 and the second dam DAM2 may be formed using organic materials. The first dam DAM1 and the second dam DAM2 may correspond to any one of the first through-hole film VIA1, the second through-hole film VIA2, and the pixel definition film PDL, respectively. For example, in the case where the first dam DAM1 is formed using the same material through the same process as the first through-hole film VIA1, the second dam DAM2 may be formed using the same material through the same process as the second through-hole film VIA2 or the pixel definition film PDL. As another example, in the case where the first dam DAM1 is formed using the same material through the same process as the second through-hole film VIA2, the second dam DAM2 may be formed using the same material through the same process as the pixel definition film PDL. In addition, when a spacer is formed on the pixel definition layer PDL in the display area DA, the dam DAM may be formed of the same material as that of the spacer.

[0268] The dam DAM prevents the organic material of the second encapsulation film ENC2 with high fluidity from overflowing to the outside of the dam DAM during the process. The first encapsulation film ENC1 and the third encapsulation film ENC3 made of inorganic material extend to cover the dam DAM, thereby strengthening the adhesion with the substrate SUB or other films on the substrate SUB.

[0269] The first pad PDE1 may be located on the substrate SUB and may be separated from the planarization film FLT. The first pad PDE1 may be supported by the second insulating film group ING2. The insulating films of the second insulating film group ING2 may correspond to the insulating films of the first insulating film group ING1. The first pad PDE1 may include a first pad electrode PDE1a and a second pad electrode PDE1b. The first pad electrode PDE1a may be formed of the same material as the first connection pattern CNP1. The second pad electrode PDE1b may be formed of the same material as the second connection pattern CNP2.

[0270] The planarization film FLT is located on the substrate SUB and can be separated from the area covered by the encapsulation film TFE. The planarization film FLT can be an organic insulating film formed using an organic material. As the organic material, organic insulating substances such as polyacrylic acid compounds, polyimide compounds, fluorine-based carbon compounds such as Teflon, benzocyclobutene compounds, etc. can be used.

[0271] In the present embodiment, the planarization film FLT may be formed after forming the interlayer insulating film ILD and before forming the first connection pattern CNP1. Therefore, the planarization film FLT and the first through-hole film VIA1 may be formed by different processes from each other. According to an embodiment, the planarization film FLT and the first through-hole film VIA1 may also include different organic materials from each other.

[0272] One end of the planarization film FLT may cover the first insulating film group ING1. Also, a portion of the planarization film FLT corresponding to the second bending area BA2 may fill the first trench TCH1 between the first insulating film group ING1 and the second insulating film group ING2. Compared with organic insulating films, inorganic insulating films have high hardness and low flexibility, so the probability of cracks is relatively high. In the case of cracks in the inorganic insulating film, the cracks may propagate to the wiring on the inorganic insulating film, resulting in defects such as wiring disconnection.

[0273] Therefore, if Fig.23 As shown, by removing the inorganic insulating film from the second bending area BA2, a first trench TCH1 can be formed, and the first insulating film group ING1 and the second insulating film group ING2 can be distinguished. In this embodiment, the case where all the inorganic insulating films in the area corresponding to the first trench TCH1 are removed is shown, but in other embodiments, a part of the inorganic insulating film may remain. In this case, the remaining part of the inorganic insulating film may also disperse the bending stress by including a slit.

[0274] The second pattern IST1b of the first sensing wiring IST1 may extend on the planarization film FLT and be electrically connected to the first pad PDE1. In the present embodiment, the second pattern IST1b may be formed using the same material through the same process as the first connection pattern CNP1.

[0275] The first wiring protection film LPL1 may cover the planarization film FLT and the second pattern IST1b. And, the second wiring protection film LPL2 may cover the first wiring protection film LPL1. According to the embodiment, the formation of the second wiring protection film LPL2 may also be omitted. The first wiring protection film LPL1 and the second wiring protection film LPL2 may be formed using organic materials. The first wiring protection film LPL1 and the second wiring protection film LPL2 may correspond to any one of the first through-hole film VIA1, the second through-hole film VIA2 and the pixel definition film PDL, respectively. For example, in the case where the first wiring protection film LPL1 is formed using the same material through the same process as the first through-hole film VIA1, the second wiring protection film LPL2 may be formed using the same material through the same process as the second through-hole film VIA2 or the pixel definition film PDL. As another example, in the case where the first wiring protection film LPL1 is formed using the same material through the same process as the second through-hole film VIA2, the second wiring protection film LPL2 may be formed using the same material through the same process as the pixel definition film PDL.

[0276] The first wiring protection film LPL1 , the second wiring protection film LPL2 , and the first sensing insulating film ISI1 may include a first opening portion OPN1 exposing the second pattern IST1 b .

[0277] According to the present embodiment, the first pattern IST1a on one end of the first insulating film group ING1 and the planarization film FLT may have a height greater than that of the second pattern IST1b on the planarization film FLT corresponding to the first trench TCH1.

[0278] Therefore, the first pattern IST1a and the second pattern IST1b can be directly connected without other bridge wiring, and since there is no bridge wiring, the connection reliability between the first pattern IST1a and the second pattern IST1b is improved. In addition, since the length of the non-display area NDA can be reduced by the length of the bridge wiring, the dead space can be reduced and a thin frame can be easily achieved.

[0279] The third pattern IST1c of the first sensing wiring IST1 can connect the first pad PDE1 and the second pattern ISTb. The third pattern IST1c can be formed using the same material by the same process as the gate electrode GE of the transistor. According to an embodiment, the third pattern IST1c can also be formed using the same material by the same process as the upper electrode UE. According to an embodiment, the odd-numbered third pattern IST1c can be formed using the same material by the same process as the gate electrode GE of the transistor, and the even-numbered third pattern IST1c can be formed using the same material by the same process as the upper electrode UE. On the contrary, the even-numbered third pattern IST1c can be formed using the same material by the same process as the gate electrode GE of the transistor, and the odd-numbered third pattern IST1c can be formed using the same material by the same process as the upper electrode UE. Thus, the short circuit problem between adjacent wirings can be more effectively prevented.

[0280] The second insulating film group ING2 may include a second opening portion OPN2 exposing the third pattern IST1c. Also, the planarization film FLT may include an opening portion corresponding to the second opening portion OPN2. The second pattern IST1b may be connected to the third pattern IST1c through the second opening portion OPN2.

[0281] Fig.24 is corresponding to Fig. 22 An embodiment of a cross section taken along line II-II'. Fig. 22 The II-II' line may correspond to the first bending axis BX1. However, the same embodiment may be applied not only to the first side surface RC1 but also to the second side surface RC2.

[0282] The display wiring DST can be formed as a single-layer wiring or a multi-layer wiring using at least one of the wirings G1L, G2L, and SDL. The wiring G1L can be formed using the same material by the same process as the gate electrode GE. The wiring G2L can be formed using the same material by the same process as the upper electrode UE. The wiring SDL can be formed using the same material by the same process as the first connection pattern CNP1.

[0283] The patterns IST1a and IST2a of the sensing wirings IST1 and IST2 are located on the packaging film TFE and the first sensing insulating film ISI1 (based on the third direction DR3), and can be located between the dam DAM and the display area DA (based on the second direction DR2). The first sensing insulating film ISI1 can be located between the packaging film TFE and the sensing wirings IST1 and IST2.

[0284] Fig.25 and Fig.26FIG. 1 is a diagram for explaining sensing electrodes and bridge electrodes according to an embodiment of the present invention. Fig.26 is along Fig.25 Cross-sectional view taken along line III-III'.

[0285] The bridge electrode CP1 may be disposed on the packaging film TFE by patterning the first sensing electrode layer ISM1 .

[0286] The first sensing insulating film ISI1 covers the bridge electrode CP1 and may include a contact hole CNT exposing a portion of the bridge electrode CP1. The first sensing electrode SC1 and the second sensing electrode SC2 may be formed on the first sensing insulating film ISI1 by patterning the second sensing electrode layer ISM2. The first sensing electrode SC1 may be connected to the bridge electrode CP1 through the contact hole CNT.

[0287] By patterning the second sensing electrode layer ISM2, the second sensing electrode SC2 may have the connection pattern CP2 on the same layer. Therefore, when connecting the second sensing electrode SC2, a separate bridge electrode may not be required.

[0288] According to an embodiment, each sensing electrode SC1, SC2 may cover a plurality of pixels PX. At this time, when each sensing electrode SC1, SC2 is formed using an opaque conductive film, each sensing electrode SC1, SC2 may include a plurality of openings that can expose the covered plurality of pixels PX. For example, each sensing electrode SC1, SC2 may be formed in a grid form. When each sensing electrode SC1, SC2 is formed using a transparent conductive film, each sensing electrode SC1, SC2 may also be formed in a plate form that does not include an opening.

[0289] Fig. 27 FIG. 4 is a diagram for explaining sensing electrodes and bridge electrodes according to another embodiment of the present invention. Fig. 27 is along Fig.25 Another cross-sectional view taken along line III-III'.

[0290] The first sensing electrode SC1 and the second sensing electrode SC2 are formed by patterning the first sensing electrode layer ISM1 , and thus can be disposed on the packaging film TFE.

[0291] The first sensing insulating film ISI1 covers the first sensing electrode SC1 and the second sensing electrode SC2 , and may include a contact hole CNT exposing a portion of the first sensing electrode SC1 .

[0292] The bridge electrode CP1 may be formed by patterning the second sensing electrode layer ISM2 and may be located on the first sensing insulating film ISI1. The bridge electrode CP1 may be connected to the first sensing electrode SC1 through the contact hole CNT.

[0293] The above description is made with reference to the embodiments of the present invention, but those skilled in the art will appreciate that various modifications and changes may be made to the present invention without departing from the scope of the idea and field of the present invention as described in the claims.

Claims

1. A driving circuit unit, comprising: A display driving unit generates a vertical synchronization signal; The sensor driving unit determines the driving frequency using the vertical synchronization signal. Wherein, whenever the driving frequency changes, the pulse polarity of the vertical synchronization signal is reversed.

2. The driving circuit unit according to claim 1, wherein: The display driving unit comprises: A display oscillator for generating a display clock signal; The signal generating unit is configured to generate the vertical synchronization signal using a control signal supplied from the outside and the display clock signal.

3. The driving circuit unit according to claim 1, wherein: When the driving frequency changes from the first frequency to the second frequency, the pulse polarity of the vertical synchronization signal changes from a logic high level to a logic low level. When the driving frequency is changed from the second frequency to a third frequency, the pulse polarity of the vertical synchronization signal is changed from a logic low level to a logic high level.

4. The driving circuit unit according to claim 1, wherein: When the pulse polarity of the vertical synchronization signal is inverted, the width of the first pulse is controlled corresponding to the changed driving frequency.

5. The driving circuit unit according to claim 4, wherein: The width of the first pulse is set to become wider as the driving frequency becomes higher.

6. The driving circuit unit according to claim 4, wherein: The width of the first pulse is set to become narrower as the driving frequency becomes higher.

7. The driving circuit unit according to claim 4, wherein: The sensor driving unit comprises: A polarity determination unit, used for determining the pulse polarity of the vertical synchronization signal; a frequency determination unit, which, when the polarity determination unit determines that the pulse polarity of the vertical synchronization signal is inverted, counts the width of the first pulse to generate a count signal; a touch control unit that determines the driving frequency using at least one of the pulse polarity of the vertical synchronization signal determined by the polarity determination unit and the count value included in the count signal, and generates a signal corresponding to the driving frequency; A sensor oscillator is used to supply a sensor clock signal to the frequency determination unit.

8. The driving circuit unit according to claim 7, wherein: The polarity determination unit generates a hold control signal when the pulse polarity of the vertical synchronization signal is maintained, and generates a change control signal when the pulse polarity of the vertical synchronization signal is inverted.

9. The driving circuit unit according to claim 8, wherein: The frequency determination section generates the count signal when the change control signal is input.

10. The driving circuit unit according to claim 8, wherein: The touch control section determines that the driving frequency is the same as before when the hold control signal is input, and determines the driving frequency to be changed using the count value when the count signal is input.

11. A display device, comprising: A display portion including pixels connected to scan lines and data lines; A sensor unit, equipped with a first sensor and a second sensor to sense external input; The drive circuit unit according to any one of claims 1 to 10, The display driving unit supplies a data signal to the pixel and generates a vertical synchronization signal using a control signal supplied from the outside. The sensor driving unit supplies a touch signal to at least one of the first sensor and the second sensor in response to the determined driving frequency.

12. A method for driving a display device, comprising the following steps: In a display driving section that drives pixels included in the display section, generating a vertical synchronization signal whose pulse polarity is inverted every time a driving frequency changes; In the sensor driving section driving the sensor included in the sensor section, the vertical synchronization signal is received from the display driving section, and the driving frequency is determined using a width of a first pulse when the pulse polarity of the vertical synchronization signal is inverted.

13. The method for driving a display device according to claim 12, wherein: The width of the first pulse is set to become wider as the driving frequency increases.

14. The method for driving a display device according to claim 12, wherein: The width of the first pulse is set to become narrower as the driving frequency increases.

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