Encapsulation device capable of simultaneously adjusting epoxy encapsulation liquid amount without pump

Abstract

The invention discloses a packaging device capable of simultaneously adjusting the amount of epoxy packaging liquid without a pump, which comprises a fixed frame, sliding frames, packaging devices, an adjusting frame, a lifting plate, an adjusting air cylinder and an adjusting bolt, a plurality of sliding frames are connected to the fixed frame in a sliding manner, a plurality of packaging devices are connected to the corresponding sliding frames, and the adjusting air cylinder is connected to the lifting plate. The adjusting air cylinder is connected to the lifting plate, a piston rod is connected with the adjusting frame, the control end of the packer is connected with the lifting plate, the adjusting end of the packer is connected with the adjusting frame, and one end of the adjusting bolt penetrates through the adjusting frame and is connected with the sliding frame. The packaging device comprises a packaging pipe, a leading-out head, a feeding hole, an external thread connector pipe, a leading-out device and a quantifying device; the encapsulating device capable of adjusting the amount of the epoxy encapsulating liquid without the pump is novel in structure, convenient and practical, the epoxy encapsulating liquid can be quantitatively injected into the capacitor shell through negative pressure switching, automatic synchronous encapsulating work of multiple capacitors is achieved, and power loss and equipment maintenance cost are reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of capacitor epoxy encapsulation, and in particular relates to an encapsulation device capable of adjusting the amount of epoxy encapsulation liquid without requiring a pump. Background Art

[0002] Capacitor epoxy encapsulation refers to the process of using epoxy resin as a packaging material to seal the circuit components inside the capacitor. Epoxy resin is a polymer compound with excellent insulation properties, mechanical strength and chemical stability, so it is widely used in the packaging of electronic components; the existing packaging uses a pump to deliver epoxy resin to the inside of the capacitor, but this delivery method can only accurately inject epoxy resin into one capacitor, and batch capacitor injection of epoxy resin requires multiple injection ports, but multiple injection ports make it difficult to control the uniformity of the injection amount of each injection port, and a peristaltic pump is required for precise quantitative injection, which leads to high equipment purchase and maintenance costs. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a sealing device that does not require a pump and can adjust the amount of epoxy sealing liquid. The device has a novel structure, is convenient and practical, and can achieve quantitative injection of epoxy sealing liquid into the capacitor housing through switching of negative pressure, thereby realizing automatic synchronous sealing of multiple capacitors and reducing power loss and equipment maintenance costs.

[0004] A packaging device that can adjust the amount of epoxy packaging liquid without a pump, comprising a fixed frame, a slide, a sealing device, an adjustment frame, a lifting plate, an adjustment cylinder and an adjustment bolt, wherein several of the slides are slidably connected to the fixed frame, several of the sealing devices are connected to corresponding slides, the adjustment cylinder is connected to the lifting plate and the piston rod is connected to the adjustment frame, the control end of the sealing device is connected to the lifting plate and the adjustment end is connected to the adjustment frame, and one end of the adjustment bolt passes through the adjustment frame and is connected to the slide; the sealing device comprises a sealing tube, a guide head, a feed port, an externally threaded connector tube, a guide device and a quantitative device, both ends of the sealing tube are respectively connected to the guide head and the externally threaded connector tube, the externally threaded connector tube is connected to the slide, the feed port is opened on one end of the sealing tube near the externally threaded connector tube, the guide device and the quantitative device are arranged in the sealing tube, one end of the quantitative device passes through the externally threaded connector tube and is connected to the adjustment frame, and the guide device passes through the quantitative device and the adjustment frame and is connected to the lifting plate.

[0005] Preferably, the guide device includes a guide cone head, a sealing ring, a connecting plate, an adjusting rod, a sealing plate ring and a sealing gasket, the sealing ring is sleeved on the guide cone head, a sealing groove is provided on the guide cone head, a lower material guide hole penetrating the guide cone head is provided in the sealing groove, a sealing plate ring is provided in the sealing groove, the sealing gasket is connected to one side of the sealing plate ring close to the quantitative device, the connecting plate is connected in the sealing groove, a plurality of upper material guide holes cooperating with the sealing gasket are provided on the connecting plate, one end of the adjusting rod is connected to the connecting plate and the other end penetrates the quantitative device and is connected to the lifting plate.

[0006] Preferably, the quantitative device includes an adjusting tube, a quantitative partition ring, a quantitative sealing ring, an upper fixed ring, a floating ring and a floating sealing gasket. The quantitative sealing ring is sleeved on the quantitative partition ring. A plurality of inner wall grooves are provided on the inner wall of the quantitative partition ring. A floating sealing groove is provided on the end of the quantitative partition ring away from the outlet cone head. The upper fixed ring is connected in the floating sealing groove and is connected to the adjusting tube. A plurality of guide holes cooperating with the floating sealing gasket are provided on the upper fixed ring. The floating sealing gasket is connected to the floating ring and cooperates with the guide holes. The floating ring and the floating sealing gasket are both arranged in the floating sealing groove. One end of the adjusting tube is connected to the adjusting frame through an externally threaded connector tube.

[0007] Preferably, sealing rings are provided between the adjusting rod and the adjusting tube and between the external threaded connector tube and the adjusting tube.

[0008] Preferably, scale lines are provided on the adjusting rod.

[0009] Preferably, it comprises an epoxy encapsulating liquid box and a hose, wherein the epoxy encapsulating liquid box is arranged above the encapsulator and is connected to the feed port through the hose.

[0010] Beneficial effects:

[0011] (1) The encapsulation device of the present invention does not require a pump and can adjust the amount of epoxy encapsulation liquid. It has a novel structure, is convenient and practical, and can achieve quantitative injection of epoxy encapsulation liquid into the capacitor housing through switching of negative pressure, thereby realizing automatic synchronous encapsulation of multiple capacitors and reducing power loss and equipment maintenance costs.

[0012] (2) The encapsulation device of the present invention does not require a pump and can adjust the amount of epoxy encapsulation liquid. By adjusting the cylinder to drive the lifting plate to move up and down, the lifting plate drives several outlet devices to move up and down at the same time, so as to achieve the purpose of synchronously and quantitatively extracting the epoxy resin to encapsulate the capacitor and thus improve the processing speed.

[0013] (3) The encapsulation device of the present invention does not require a pump and can adjust the amount of epoxy encapsulation liquid. The amount of epoxy resin discharged each time is controlled by a quantitative device, and the epoxy resin is transported by floating up and down in cooperation with a floating ring, so as to achieve accurate control of the amount of epoxy resin added each time. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of capacitor epoxy encapsulation equipment;

[0015] Figure 2 It is a schematic diagram of the structure of the packetizer;

[0016] Figure 3 It is a schematic diagram of the structure of the export device and the quantitative device;

[0017] 1-fixed frame, 2-slide frame, 3-packer, 31-packer tube, 32-export head, 33-feeding port, 34-external thread connector tube, 4-adjusting frame, 5-lifting plate, 6-adjusting cylinder, 7-exporting device, 71-exporting cone head, 72-lower guide hole, 73-sealing groove, 74-sealing ring, 75-connecting plate, 76-upper guide hole, 77-adjusting rod, 78-sealing plate ring, 79-sealing gasket, 8-quantitative device, 81-adjusting tube, 82-quantitative partition ring, 83-quantitative sealing ring, 84-floating sealing groove, 85-inner wall groove, 86-upper fixed ring, 87-guide hole, 88-floating ring, 89-floating sealing gasket. DETAILED DESCRIPTION

[0018] The embodiments of the present invention are further described below with reference to the accompanying drawings.

[0019] Example 1

[0020] like Figures 1 to 3As shown; a packaging device that can adjust the amount of epoxy encapsulation liquid without a pump, including a fixed frame 1, a slide 2, a packaging device 3, an adjustment frame 4, a lifting plate 5, an adjustment cylinder 6 and an adjustment bolt, a number of the slides 2 are slidably connected to the fixed frame 1, a number of the packaging devices 3 are connected to the corresponding slides 2, the adjustment cylinder 6 is connected to the lifting plate 5 and the piston rod is connected to the adjustment frame 4, the control end of the packaging device 3 is connected to the lifting plate 5 and the adjustment end is connected to the adjustment frame 4, one end of the adjustment bolt passes through the adjustment frame 4 and is connected to the slide 2; the packaging device 3 includes a packaging tube 31, a lead-out head 32, a feed port 33, an external threaded connector tube 34, a lead-out device 7 and a quantitative device 8, and the two ends of the packaging tube 31 are respectively connected to the lead-out head 32 and the external The threaded connector tube 34 is connected, the externally threaded connector tube 34 is connected to the slide 2, the feed port 33 is opened on one end of the packaging tube 31 close to the externally threaded connector tube 34, the lead-out device 7 and the quantitative device 8 are arranged in the packaging tube 31, one end of the quantitative device 8 passes through the externally threaded connector tube 34 and is connected to the adjustment frame 4, the lead-out device 7 penetrates the quantitative device 8 and the adjustment frame 4 and is connected to the lifting plate 5; the lead-out device 7 includes a lead-out cone head 71, a sealing ring 74, a connecting plate 75, an adjusting rod 77, a sealing plate ring 78 and a sealing gasket 79, the sealing ring 74 is sleeved on the lead-out cone head 71, the lead-out cone head 71 is provided with a sealing groove 73, and the sealing groove 73 is provided with a lower guide penetrating the lead-out cone head 71 The sealing groove 73 is provided with a sealing plate ring 78, and the sealing gasket 79 is connected to the sealing plate ring 78 on one side close to the quantitative device 8. The connecting plate 75 is connected to the sealing groove 73, and the connecting plate 75 is provided with a plurality of upper guide holes 76 cooperating with the sealing gasket 79. One end of the adjusting rod 77 is connected to the connecting plate 75 and the other end passes through the quantitative device 8 and is connected to the lifting plate 5; the quantitative device 8 includes an adjusting tube 81, a quantitative partition ring 82, a quantitative sealing ring 83, an upper fixed ring 86, a floating ring 88 and a floating sealing gasket 89. The inner wall of the quantitative partition ring 82 is provided with a plurality of inner wall grooves 85, and the end of the quantitative partition ring 82 away from the lead-out cone head 71 is provided with a floating sealing groove 84. The fixed ring 86 is connected in the floating sealing groove 84 and connected to the adjusting tube 81. The upper fixed ring 86 is provided with a plurality of guide holes 87 cooperating with the floating sealing gasket 89. The floating sealing gasket 89 is connected to the floating ring 88 and cooperates with the guide holes 87. The floating ring 88 and the floating sealing gasket 89 are both arranged in the floating sealing groove 84. One end of the adjusting tube 81 passes through the external threaded connector tube 34 and is connected to the adjusting frame 4; sealing rings are arranged between the adjusting rod 77 and the adjusting tube 81 and between the external threaded connector tube 34 and the adjusting tube 81; scale lines are arranged on the adjusting rod 77; it includes an epoxy encapsulating liquid tank and a hose, and the epoxy encapsulating liquid tank is arranged above the encapsulator 3 and is connected to the feed port 33 through the hose.

[0021] The adjusting bolt is adjusted in advance, and the adjusting bolt drives the adjusting frame 4 to rise and fall, and the adjusting frame 4 drives the adjusting tube 81 to rise and fall, and the adjusting tube 81 drives the upper fixing ring 86, the quantitative sealing ring 82 and the quantitative sealing ring 83 to rise and fall to the specified height; when the capacitor is injected with epoxy resin, the lifting plate 5 is driven to rise and fall by adjusting the cylinder 6, and the lifting plate 5 drives the adjusting rods 77 of several export devices 7 to rise and fall, and then the adjusting rods 77 drive the connecting plate 75, the export cone head 71 and the sealing ring 74 to rise and fall in turn; the epoxy resin is introduced into the packaging tube 31 through the hose from the feed port 33. For ease of understanding, the interior of the packaging tube 31 is divided into three spaces, the first is the conversion space above the quantitative partition ring 82, the second is the quantitative space between the quantitative partition ring 82 and the export cone head 71, and the third is the export space below the export cone head 71; when the epoxy resin is exported, the export cone head 71 descends, and the epoxy resin in the export space is exported from the export head 32 by the thrust of the export cone head 71, and the export cone head 71 is used to export the epoxy resin. The reverse force of the outlet will make the guide hole 87 rise and block the upper guide hole 76, so as to achieve the effect of quantitative export of epoxy resin; at the same time, the decline of the export cone head 71 will gradually increase the quantitative space, and the negative pressure generated by the gradual increase of the quantitative space will make the epoxy resin in the conversion space enter the quantitative space through the guide hole 87, the floating sealing groove 84, and the inner wall groove 85, and at the same time, the epoxy resin in the epoxy resin box is sucked into the conversion space; when the export cone head 71 rises, the quantitative space is reduced, so that its internal pressure increases, and the floating ring 88 is driven to rise and block the guide hole 87, while the epoxy resin is introduced into the export space through the upper guide hole 76, the sealing groove 73 and the lower guide hole 72, so that the epoxy resin is quantitatively exported in a cycle, and the use of the pump body is reduced, the electricity and equipment maintenance costs are reduced, and the production efficiency is improved; the epoxy encapsulation liquid tank is arranged above the encapsulation device 3, so that the encapsulation liquid can be packaged with a downward pressure flow force, which is convenient for the encapsulation liquid to be exported for packaging operations.

[0022] The specific embodiments of the present invention are described in detail above, but they are only examples, and the present invention is not limited to the specific embodiments described above. For those skilled in the art, any equivalent modifications and substitutions made to the present invention are also within the scope of the present invention. Therefore, the equalization changes and modifications made without departing from the spirit and scope of the present invention are all within the scope of the present invention.

Claims

1. An encapsulation device that does not require a pump and can adjust the amount of epoxy encapsulation liquid, characterized in that: The invention comprises a fixed frame (1), a slide (2), a packer (3), an adjustment frame (4), a lifting plate (5), an adjustment cylinder (6) and an adjustment bolt. A plurality of the slides (2) are slidably connected to the fixed frame (1), a plurality of the packers (3) are connected to the corresponding slides (2), the adjustment cylinder (6) is connected to the lifting plate (5) and the piston rod is connected to the adjustment frame (4), the control end of the packer (3) is connected to the lifting plate (5) and the adjustment end is connected to the adjustment frame (4), one end of the adjustment bolt passes through the adjustment frame (4) and is connected to the slide (2); the packer (3) comprises a packing tube (31), a guide head (32) and a feed port (33). , an externally threaded connector tube (34), an outlet device (7) and a quantitative device (8), the two ends of the packaging tube (31) are respectively connected to the outlet head (32) and the externally threaded connector tube (34), the externally threaded connector tube (34) is connected to the slide (2), the feed port (33) is opened on one end of the packaging tube (31) close to the externally threaded connector tube (34), the outlet device (7) and the quantitative device (8) are arranged in the packaging tube (31), one end of the quantitative device (8) passes through the externally threaded connector tube (34) and is connected to the adjustment frame (4), and the outlet device (7) passes through the quantitative device (8) and the adjustment frame (4) and is connected to the lifting plate (5).

2. The encapsulation device according to claim 1, which does not require a pump and can adjust the amount of epoxy encapsulation liquid, is characterized in that: The outlet device (7) comprises an outlet cone head (71), a sealing ring (74), a connecting plate (75), an adjusting rod (77), a sealing plate ring (78) and a sealing gasket (79). The sealing ring (74) is sleeved on the outlet cone head (71). The outlet cone head (71) is provided with a sealing groove (73). A lower material guide hole (72) penetrating the outlet cone head (71) is provided in the sealing groove (73). A sealing plate ring (78) is provided in the sealing groove (73). The sealing gasket (79) is connected to a side of the sealing plate ring (78) close to the quantitative device (8). The connecting plate (75) is connected to the sealing groove (73). A plurality of upper material guide holes (76) cooperating with the sealing gasket (79) are provided on the connecting plate (75). One end of the adjusting rod (77) is connected to the connecting plate (75) and the other end penetrates the quantitative device (8) and is connected to the lifting plate (5).

3. The encapsulation device as claimed in claim 2, which is capable of adjusting the amount of epoxy encapsulation liquid without a pump, characterized in that: The quantitative device (8) comprises an adjusting tube (81), a quantitative partition ring (82), a quantitative sealing ring (83), an upper fixed ring (86), a floating ring (88) and a floating sealing gasket (89); the quantitative sealing ring (83) is sleeved on the quantitative partition ring (82); a plurality of inner wall grooves (85) are formed on the inner wall of the quantitative partition ring (82); a floating sealing groove (84) is formed on one end of the quantitative partition ring (82) away from the lead-out cone head (71); the upper fixed ring (86) The upper fixing ring (86) is connected to the floating sealing groove (84) and is connected to the regulating tube (81). A plurality of guide holes (87) are provided on the upper fixing ring (86) and cooperate with the floating sealing gasket (89). The floating sealing gasket (89) is connected to the floating ring (88) and cooperates with the guide holes (87). The floating ring (88) and the floating sealing gasket (89) are both arranged in the floating sealing groove (84). One end of the regulating tube (81) passes through the external threaded connector tube (34) and is connected to the regulating frame (4).

4. The encapsulation device as claimed in claim 3, which is capable of adjusting the amount of epoxy encapsulation liquid without a pump, characterized in that: Sealing rings are provided between the adjusting rod (77) and the adjusting tube (81) and between the external threaded connector tube (34) and the adjusting tube (81).

5. The encapsulation device as claimed in claim 4, which is capable of adjusting the amount of epoxy encapsulation liquid without a pump, characterized in that: The adjusting rod (77) is provided with scale lines.

6. A packaging device as claimed in claim 1 or 5, which can adjust the amount of epoxy packaging liquid without pump, characterized in that: It comprises an epoxy encapsulating liquid box and a hose. The epoxy encapsulating liquid box is arranged above the encapsulating device (3) and is connected to the feed port (33) through the hose.

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