Cutting channel copper layer indentation substrate and plastic package product

Abstract

The invention discloses a cutting channel copper layer indentation substrate and a plastic package product, the cutting channel copper layer indentation substrate comprises a substrate, a plurality of cutting channels are distributed on the substrate along the longitudinal direction and the transverse direction, and the plurality of cutting channels divide the substrate into a plurality of single products; each row of single products distributed in the first direction are connected through a lead, and the lead is located in a cutting channel between every two adjacent single products and led out from one end of the single product at the tail end of the substrate. Each single product comprises a copper layer area, the copper layer on the peripheral side of the single product is retracted in the copper layer area, and the cutting channels are located between the adjacent copper layer areas. When the substrate is designed, copper layers on four sides of a single product on the substrate are shrunk inwards, and only one lead is led out from a single side to play a conductive or grounding role, so that the copper layers of the substrate are not exposed in a cutting channel, the contact area of a blade to the copper layers during cutting is greatly reduced, and the tearing force and the stress are reduced; the problem that products are torn to be layered due to too large resistance during cutting can be solved, and meanwhile the use performance of the substrate is not affected.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and in particular to a substrate with a cut-way copper layer shrunk inward and a plastic-sealed product. Background Art

[0002] Currently, when designing a substrate, 90% of the cutting path is covered with copper layer. The copper layer has many layers and is thick. During the packaging cutting process, the blade encounters great resistance when cutting the substrate. It is affected by the shear force during cutting, which causes tearing, resulting in the extrusion of the substrate welding layer. This causes the welding layer and the copper layer to be delaminated, thus affecting product performance and causing the product to be scrapped. Summary of the invention

[0003] The present invention provides a substrate with a cut-line copper layer shrunk inward and a plastic-sealed product, aiming to solve the above-mentioned problems existing in the background technology.

[0004] The technical solution provided by the present invention is as follows:

[0005] A substrate with a cut-line copper layer retracted, comprising a substrate, on which a plurality of cut lines are distributed along a first direction and perpendicular to the first direction, and the plurality of cut lines divide the substrate into a plurality of single products;

[0006] Each row of the single products distributed along the first direction is connected by a lead wire, the lead wire is located in the cutting path between two adjacent single products, and is led out from one end of the single product at the end of the substrate;

[0007] Each of the single products comprises a copper layer region, the copper layer on the peripheral side of the single product is retracted into the copper layer region, and the cutting path is located between adjacent copper layer regions.

[0008] Furthermore, the top and bottom of the substrate are respectively a top solder resist layer and a bottom solder resist layer, a first opening layer and a second opening layer are arranged between the top solder resist layer and the bottom solder resist layer, a first copper layer is arranged between the first opening layer and the top solder resist layer, a second copper layer is arranged between the first opening layer and the second opening layer, and a third copper layer is arranged between the second opening layer and the bottom solder resist layer.

[0009] Furthermore, the lead is conductively connected to the third copper layer, and the lead is made of copper.

[0010] Furthermore, a plurality of solder balls are distributed on the surface of the single product;

[0011] The copper layer area of ​​the single product includes a first copper layer, a second copper layer and a third copper layer, a first opening layer is distributed between the first copper layer and the second copper layer, and a second opening layer is distributed between the second copper layer and the third copper layer.

[0012] Furthermore, a filler is provided at the edge of the copper layer area.

[0013] The present invention also provides a plastic encapsulation product, including a plastic encapsulation material and the above-mentioned single product plastic encapsulated in the plastic encapsulation material.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The present invention provides a substrate with a copper layer shrunk inwardly on a cutting path and a plastic-sealed product. When designing the substrate, the copper layers on four sides of a single product on the substrate are shrunk inwardly, and only one lead is led out on a single side for conducting electricity or grounding, so that the copper layer of the substrate is no longer exposed in the cutting path, thereby greatly reducing the area of ​​the copper layer contacted by the blade during cutting, and reducing the tearing force and stress. This can improve the problem of product delamination caused by too much resistance during cutting, and does not affect the performance of the substrate at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a substrate with a cut-way copper layer retracted provided by the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of a single product in an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of the cross-sectional structure of a substrate with a cut-way copper layer retracted provided by the present invention;

[0019] Figure 4 It is a schematic diagram of the structure of the plastic-sealed product mentioned in the embodiment of the present invention.

[0020] The reference numerals are as follows:

[0021] 1-substrate, 2-copper layer area, 3-single product, 4-cutting path, 5-lead, 6-solder ball, 7-filler, 8-top solder mask, 9-first copper layer, 10-first opening layer, 11-second copper layer, 12-second opening layer, 13-third copper layer, 14-bottom solder mask, 15-plastic encapsulation compound. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the embodiments described below are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0023] Therefore, the detailed description of the embodiments of the present application provided below in conjunction with the accompanying drawings is intended to represent only selected embodiments of the present application, and is not intended to limit the scope of protection claimed in the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0024] It should be understood that in the description of the embodiments of the present invention, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0025] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0026] See also Figure 1 The present invention provides a substrate with a cut-line copper layer retracted, including a substrate 1, on which a plurality of cut-line 4 are distributed along a first direction and perpendicular to the first direction, where the first direction and the perpendicular first direction are distributed in the horizontal direction and the vertical direction in the figure, and the plurality of cut-line 4 divides the substrate 1 into a plurality of single products 3, and the single products 3 are distributed in an array on the substrate 1.

[0027] Each row of single products 3 distributed in the array is connected by a lead 5. The lead 5 is located in the cutting path 4 between two adjacent single products 3 and is led out from one end of the single product 3 on the leftmost side of the substrate 1. The lead 5 plays a conductive or grounding role.

[0028] Each single product 3 includes a copper layer region 2 . The copper layer on the peripheral side of the single product 3 is retracted into the copper layer region 2 . The cutting path 4 is located between adjacent copper layer regions 2 .

[0029] In a traditional substrate, 90% of the cutting path 4 is covered with copper layer. In the design of the substrate 1 in the present application, the copper layer on the four sides of a single product 3 on the substrate is shrunk inward, and only one lead 5 is led out on one side for conducting or grounding, so that the copper layer of the substrate is no longer exposed in the cutting path 4, thereby greatly reducing the area of ​​the copper layer contacted by the blade during cutting, and reducing the tearing force and stress. This can improve the problem of too much resistance during cutting causing the product to tear and produce delamination, and at the same time does not affect the performance of the substrate.

[0030] like Figure 3 As shown, the top and bottom of the substrate 1 are respectively a top solder resist layer 8 and a bottom solder resist layer 14, a first opening layer 10 and a second opening layer 12 are distributed between the top solder resist layer 8 and the bottom solder resist layer 14, a first copper layer 9 is distributed between the first opening layer 10 and the top solder resist layer 8, a second copper layer 11 is distributed between the first opening layer 10 and the second opening layer 12, and a third copper layer 13 is distributed between the second opening layer 12 and the bottom solder resist layer 14.

[0031] Optionally, the lead 5 is conductively connected to the third copper layer 13 , and the lead 5 is made of copper.

[0032] like Figure 2 , Figure 4 As shown, a plurality of solder balls 6 are distributed on the surface of a single product 3 .

[0033] The copper layer region 2 of the single product 3 includes a first copper layer 9 , a second copper layer 11 and a third copper layer 13 . A first opening layer 10 is distributed between the first copper layer 9 and the second copper layer 11 , and a second opening layer 12 is distributed between the second copper layer 11 and the third copper layer 13 .

[0034] Optionally, fillers 7 are distributed at the edge of the copper layer area 2 .

[0035] like Figure 4 As shown, the present invention further provides a plastic encapsulation product, including a plastic encapsulation material 15 and the above-mentioned single product 3 plastic encapsulated in the plastic encapsulation material 15 .

[0036] The present invention provides a substrate with a retracted copper layer on the cutting path. The substrate is designed to retract the copper layer into the copper layer area 2 so that it does not appear in the cutting path, so that the blade does not contact the copper layer during cutting, thereby reducing the resistance, tearing force and stress of the product during cutting, thereby improving the substrate delamination problem.

[0037] The above is only the best specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A substrate with a cut-way copper layer retracted, characterized in that: A substrate is provided, wherein a plurality of cutting paths are distributed along a first direction and perpendicular to the first direction on the substrate, and the plurality of cutting paths divide the substrate into a plurality of single products; Each row of the single products distributed along the first direction is connected by a lead wire, the lead wire is located in the cutting path between two adjacent single products, and is led out from one end of the single product at the end of the substrate; Each of the single products comprises a copper layer region, the copper layer on the peripheral side of the single product is retracted into the copper layer region, and the cutting path is located between adjacent copper layer regions.

2. The substrate with inwardly slashed copper layer according to claim 1, characterized in that: The top and bottom of the substrate are respectively a top solder resist layer and a bottom solder resist layer, a first opening layer and a second opening layer are distributed between the top solder resist layer and the bottom solder resist layer, a first copper layer is distributed between the first opening layer and the top solder resist layer, a second copper layer is distributed between the first opening layer and the second opening layer, and a third copper layer is distributed between the second opening layer and the bottom solder resist layer.

3. The substrate with inwardly slashed copper layer according to claim 2, characterized in that: The lead is connected to the third copper layer, and the lead is made of copper.

4. The substrate with inwardly slashed copper layer according to any one of claims 1 to 3, characterized in that: The single product array is distributed on the substrate, and a plurality of solder balls are distributed on the surface of each single product; The copper layer area of ​​the single product includes a first copper layer, a second copper layer and a third copper layer, a first opening layer is distributed between the first copper layer and the second copper layer, and a second opening layer is distributed between the second copper layer and the third copper layer.

5. The substrate with inwardly slashed copper layer according to claim 4, characterized in that: A filler is arranged at the edge of the copper layer area.

6. A plastic-sealed product, characterized in that: It comprises a molding compound, and a single product as claimed in any one of claims 1 to 5 which is molded in the molding compound.

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