A shock absorption component of an electronic device, a preparation method thereof, an electronic device, and a back cover assembly of the electronic device

Abstract

This invention provides a vibration damping component and its manufacturing method for an electronic device, as well as an electronic device and a back cover assembly for the electronic device. The vibration damping component of the electronic device comprises, from the inside out, a zeolite porous layer and a viscoelastic polymer barrier layer. The zeolite porous layer includes a viscoelastic polymer matrix and zeolite powder dispersed within the viscoelastic polymer matrix, and the zeolite porous layer contains large pores. The vibration damping component of the electronic device provided by this invention combines viscoelastic polymer material and zeolite powder, and when placed in the gap between the back cover and the electronic device substrate, it not only achieves excellent vibration reduction, almost eliminating shell vibration of the electronic device, but also significantly improves the low-frequency acoustic performance.

Description

Technical Field

[0001] This invention relates to a shock-absorbing component and its manufacturing method for an electronic device, an electronic device, and a back cover assembly for an electronic device, belonging to the field of terminal device technology. Background Technology

[0002] With the development of technology, people have increasingly higher requirements for speakers, especially mobile phone speakers. The demand is not just for small size and sound output, but also for excellent sound quality. Sound quality is related to every aspect of speaker design and manufacturing, particularly the size of the speaker's rear cavity. Generally, a smaller rear cavity significantly reduces the low-frequency response, resulting in poorer sound quality. Therefore, it is difficult to provide good sound quality with a very small rear cavity.

[0003] To resolve the aforementioned contradictions, those skilled in the art have proposed various solutions, such as:

[0004] 1. Use a gas with better acoustic compliance instead of air for the back cavity atmosphere;

[0005] 2. Fill the rear cavity with foam such as melamine to increase acoustic compliance;

[0006] 3. Fill with porous materials such as activated carbon, zeolite, and silica to increase the volume of the virtual rear cavity and improve acoustic compliance;

[0007] 4. An open-back speaker design (see CN113364898A for details) is adopted, which connects the speaker's rear cavity to the gap in the phone, using the phone's slits as a supplementary rear cavity to further improve speaker performance, especially low-frequency performance. However, this places relatively stringent requirements on the diaphragm material; significantly reduces the controllability of the sound field; and introduces vibration from the phone's casing. CN113364898A addresses this by using a three-layer auxiliary material (a weak bonding layer, a foam layer, and a strong bonding layer) to achieve a damping effect. Although the three-layer auxiliary material reduces vibration, noticeable vibration still exists (amplitude fluctuation of approximately 1.5μm).

[0008] Therefore, providing a novel shock-absorbing component and its manufacturing method for electronic devices, as well as electronic devices and their back cover assemblies, has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0009] In order to overcome the above-mentioned shortcomings and deficiencies, one object of the present invention is to provide a shock-absorbing component for an electronic device.

[0010] Another object of the present invention is to provide a method for manufacturing the shock-absorbing component of the above-described electronic device.

[0011] Another object of the present invention is to provide an electronic device that includes the shock-absorbing component of the electronic device described above.

[0012] Another object of the present invention is to provide a back cover assembly for an electronic device that includes the shock-absorbing components of the electronic device described above.

[0013] To achieve the above objectives, the present invention provides a shock-absorbing component for an electronic device, wherein the shock-absorbing component for the electronic device comprises, from the inside out, two parts: a zeolite porous layer (inner layer) and a viscoelastic polymer barrier layer (outer layer), wherein the zeolite porous layer comprises a single layer of zeolite powder.

[0014] In this invention, "inner" and "outer" refer to the direction relative to the back cover of the electronic device, with the direction closer to the back cover being "outer" and the direction farther from the back cover being "inner".

[0015] In one specific embodiment of the shock-absorbing component of the electronic device described above in this invention, the particle size of the zeolite powder is 5-100 nm.

[0016] As a specific embodiment of the vibration damping component of the electronic device described above in this invention, the zeolite powder can be any acoustically enhanced zeolite powder commonly used in the art to prepare sound-absorbing particles, including but not limited to one or a combination of several of the following: MFI structured molecular sieves, FER structured molecular sieves, CHA structured molecular sieves, MEL structured molecular sieves, MOR structured molecular sieves, FAU structured molecular sieves, BEA molecular sieves, and LTA molecular sieves. The zeolite powder used in this invention can be directly synthesized zeolite raw powder, or it can be shaped into particles of 5-100 nm.

[0017] As a specific embodiment of the shock-absorbing component of the electronic device described above in this invention, the viscoelastic polymer material includes various viscoelastic polymer materials such as thermoplastic polyurethane elastomer (TPU), thermoplastic polyester elastomer (TPEE), polydimethylsiloxane (PDMS), silicone rubber, polyisobutylene rubber, brominated butyl rubber, or polybutadiene rubber, as well as a mixed polymer material formed by mixing at least two monomers from the monomers corresponding to the above substances. For example, in a specific embodiment of this invention, the viscoelastic polymer material matrix can be a mixed polymer material formed by vulcanizing polyisobutylene PIB45000 and brominated butyl rubber 2030. The method of mixing at least two monomers to form the mixed polymer material is a conventional method.

[0018] In addition, silicone rubber, polyisobutylene rubber and polybutadiene rubber can be vulcanized silicone rubber, polyisobutylene rubber and polybutadiene rubber, or they can be unvulcanized silicone rubber, polyisobutylene rubber and polybutadiene rubber.

[0019] As a specific embodiment of the shock-absorbing component of the electronic device described above in this invention, the shape of the shock-absorbing component of the electronic device can be changed according to the cavity of the electronic device, and the thickness is 50-1000μm.

[0020] In the vibration damping component of the electronic device provided by the present invention, the respective proportions of the zeolite porous layer and the dense viscoelastic polymer barrier layer can be adjusted, and adjustments can be made in different parts according to the differences in the mounting cavity layout within the electronic device. Preferably, the proportion of the zeolite porous layer is increased on the basis of eliminating shell vibration.

[0021] In one specific embodiment of the shock-absorbing component of the electronic device described above in this invention, the thickness ratio of the zeolite porous layer to the viscoelastic polymer barrier layer is 5x10. -6 1 to 2 x 10 -3 :1.

[0022] On the other hand, the present invention also provides a method for manufacturing the shock-absorbing component of the above-described electronic device, wherein the manufacturing method includes:

[0023] Step (1): Spread the viscoelastic polymer slurry evenly on the operating board;

[0024] Step (2): Apply an excess of zeolite powder to the surface of the viscoelastic polymer slurry and solidify it to obtain a solid sheet;

[0025] Step (3): Remove the solid sheet and vibrate to blow away the excess zeolite powder to obtain the damping component of the electronic device.

[0026] As a specific embodiment of the preparation method described above in this invention, the preparation method further includes: pre-treating the zeolite powder before step (2), wherein the pre-treating includes surface modification and / or immersing the zeolite powder in an organic small molecule solvent.

[0027] As a specific embodiment of the preparation method described above in this invention, the surface modification agent used for the surface modification includes trimethylchlorosilane and / or vinyltrimethoxysilane, etc.

[0028] The organic small molecule solvent includes one or a combination of several of the following: n-heptane, toluene, xylene, ethylbenzene, gasoline, and petroleum ether.

[0029] This invention does not specify particular requirements for surface modification and soaking operations, or the related process parameters; these can be reasonably adjusted and selected according to actual on-site operational needs. Surface modification of the zeolite powder allows for better contact between the zeolite powder and the viscoelastic polymer material, improving the mechanical strength of the interface and achieving superior acoustic performance. Immersing the zeolite powder in an organic small-molecule solvent pre-occupies the pores (mainly micropores and mesopores, and possibly a small number of macropores) of the zeolite powder, preventing these pores from being blocked by the viscoelastic polymer material during contact, thus achieving even better acoustic performance.

[0030] In step (2) of the preparation method described above, the purpose of curing and shaping is to cause the viscoelastic polymer material to undergo a certain reaction crosslinking or curing, ultimately transforming the viscoelastic polymer slurry into an elastic and stable solid form. This invention does not specify concrete requirements for the curing and shaping operations or the process parameters used; the specific curing and shaping method and process parameters can be reasonably selected and adjusted according to the actual needs of the on-site operation.

[0031] As a specific embodiment of the preparation method described above in this invention, the preparation method further includes: performing post-treatment on the damping component of the electronic device after step (3) to remove residual small organic molecule solvents. The small organic molecule solvents removed through post-treatment allow the pores of the zeolite powder to be fully exposed, facilitating the entry and exit of sound waves. This invention does not impose specific requirements on the specific operation of the post-treatment or the process parameters used; the specific post-treatment method and process parameters can be reasonably selected and adjusted according to the actual needs of the on-site operation, as long as the purpose of removing residual small organic molecule solvents is achieved.

[0032] In another aspect, the present invention also provides an electronic device, wherein the electronic device includes a back cover, an electronic device substrate, an open-back speaker, and a shock-absorbing component of the electronic device described above. The back cover is used to cover the electronic device substrate and form a mounting cavity therewith. The open-back speaker and the shock-absorbing component of the electronic device are both disposed in the mounting cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

[0033] Before placing the shock-absorbing component of the electronic device into the mounting cavity, the shock-absorbing component is cut into the corresponding shape according to the specific structure of the mounting cavity in the electronic device. Then, it is placed in the mounting cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is tightly attached to the inner layer of the back cover. The zeolite porous layer in the shock-absorbing component of the electronic device can contact the air inside the mounting cavity, and can also contact other hardware inside the mounting cavity of the electronic device except for the speaker (such as circuit board, battery and lens module when the electronic device is a mobile phone).

[0034] As a specific embodiment of the electronic device described above in this invention, the electronic device includes smartphones, TWS earphones, headphones, smart glasses, smartwatches, VR devices, AR devices, tablet computers, or thin and light laptops, etc.

[0035] In another aspect, the present invention also provides a back cover assembly for an electronic device, the electronic device including an electronic device substrate and an open-back speaker, wherein the back cover assembly includes a back cover and the aforementioned damping component of the electronic device, the back cover being used to cover the electronic device substrate and form a mounting cavity therewith, the open-back speaker and the damping component of the electronic device being disposed within the mounting cavity, and the viscoelastic polymer material barrier layer in the damping component of the electronic device being bonded to the inner layer of the back cover.

[0036] In another aspect, the present invention also provides a back cover assembly for an electronic device, the electronic device including an electronic device substrate and an open-back speaker, wherein the back cover assembly includes a back cover and the aforementioned damping component of the electronic device, the back cover being used to cover the electronic device substrate and form a mounting cavity therewith, the open-back speaker and the damping component of the electronic device being disposed within the mounting cavity, and the viscoelastic polymer material barrier layer in the damping component of the electronic device being bonded to the inner layer of the back cover.

[0037] Compared with the prior art, the beneficial technical effects achieved by the present invention include:

[0038] The vibration damping component of the electronic device provided by this invention combines a viscoelastic polymer material and zeolite powder. The zeolite powder itself has numerous micropores, allowing it to absorb sound wave energy through adsorption-desorption. The viscoelastic polymer material also exhibits significant damping effects, dissipating sound wave energy. Combining these two materials achieves both sound wave energy absorption and dissipation. Furthermore, the zeolite powder, after absorbing sound wave energy, significantly reduces the acoustic low-frequency f0, resulting in superior low-frequency performance. In addition, the small size of the zeolite molecular sieve powder facilitates rapid adsorption-desorption of air molecules, and the powder's concentration on the component surface, compared to solutions where the zeolite molecular sieve is distributed internally, results in higher application efficiency. This allows for a significantly reduced thickness while maintaining comparable damping performance, making it suitable for various electronic device environments.

[0039] The outer layer of the shock-absorbing component of the electronic device provided by the present invention is a viscoelastic polymer material barrier layer. Its material is a dense viscoelastic polymer material, which can increase structural strength and sealing performance, prevent air and sound leakage, and absorb and eliminate shell vibration to the maximum extent.

[0040] In summary, the vibration damping component of the electronic device provided by this invention combines viscoelastic polymer materials and zeolite powder, and places them in the gap between the back cover and the substrate of the electronic device. This not only creates a good vibration reduction effect, almost eliminating the shell vibration of the electronic device, but also improves the low-frequency acoustic performance to a certain extent. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of a shock-absorbing component for an electronic device provided in an embodiment of the present invention.

[0043] Figure 2 This is a schematic diagram showing the contact position of the shock-absorbing component of the electronic device provided in an embodiment of the present invention within the mobile phone mounting cavity.

[0044] Explanation of main icon numbers:

[0045] 1. Porous zeolite layer;

[0046] 2. Viscoelastic polymer barrier layer;

[0047] 100. Shock-absorbing components for electronic devices;

[0048] 200. Back cover;

[0049] 300, Open-back 1115 speaker;

[0050] 400, battery;

[0051] 500, screen;

[0052] 600. Other components. Detailed Implementation

[0053] It should be noted that the term "comprising" and any variations thereof in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0054] The "range" disclosed in this invention is given in the form of a lower limit and an upper limit. It can be one or more lower limits and one or more upper limits, respectively. A given range is defined by selecting a lower limit and an upper limit. The selected lower and upper limits define the boundaries of the particular range. All ranges defined in this way are composable, meaning that any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for specific parameters, it is also expected that ranges of 60-110 and 80-120 are also expected. Furthermore, if the listed minimum range values ​​are 1 and 2, and the listed maximum range values ​​are 3, 4, and 5, then the following ranges are all expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5.

[0055] In this invention, unless otherwise specified, the numerical range "ab" represents a shortened representation of any combination of real numbers between a and b, where a and b are both real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" have been listed in this invention, and "0-5" is simply a shortened representation of these numerical combinations.

[0056] In this invention, unless otherwise specified, all embodiments and preferred embodiments mentioned in this invention can be combined with each other to form new technical solutions.

[0057] In this invention, unless otherwise specified, all technical features and preferred features mentioned in this invention can be combined with each other to form new technical solutions.

[0058] In this invention, unless otherwise specified, all steps mentioned herein may be performed sequentially or randomly, but are preferably performed sequentially. For example, if the method includes steps (a) and (b), it means that the method may include steps (a) and (b) performed sequentially, or it may include steps (b) and (a) performed sequentially. For example, if the method may also include step (c), it means that step (c) may be added to the method in any order. For example, the method may include steps (a), (b), and (c), or it may include steps (a), (c), and (b), or it may include steps (c), (a), and (b), etc.

[0059] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying tables, drawings, and embodiments. The embodiments described below are some, but not all, embodiments of this invention, and are only used to illustrate the invention, and should not be considered as limiting the scope of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0060] Example 1

[0061] This embodiment provides a shock-absorbing component for an electronic device, which is manufactured using a method comprising the following specific steps:

[0062] Step (1): Take 16 parts by weight of polydimethylsiloxane PDMS component A (Dow Corning 184), 20 parts by weight of n-heptane and 1.6 parts by weight of curing agent PDMS component B (Dow Corning 184, component B) and mix them to obtain a uniform blend slurry. Lay the blend slurry in a metal sheet mold with a mold size of 0.5 mm thickness.

[0063] Step (2): Select MFI zeolite powder (specifically ZSM-5) with a Si / Al molar ratio of 250 and a powder size of 5nm, and lay 20g of MFI zeolite powder on the surface of the slurry in the aforementioned metal sheet mold;

[0064] Step (3): Seal the metal sheet mold and heat-cur it for 6 hours to obtain a sheet with a thickness of 0.5 mm. Remove the sheet and vibrate to blow away the excess MFI zeolite powder to obtain a solid sheet.

[0065] Step (4): Cut the solid sheet into rectangles 80.0 mm wide and 100.0 mm long to obtain the shock-absorbing component of the electronic device.

[0066] A schematic diagram of the shock-absorbing component of the electronic device obtained in this embodiment is shown below. Figure 1 As shown, it comprises, from the inside out, a zeolite porous layer 1 and a viscoelastic polymer barrier layer 2. The zeolite porous layer 1 is a single layer of MFI zeolite powder, and the viscoelastic polymer barrier layer 2 is made of PDMS. The thickness of the damping component in the electronic device is 500 μm, and the ratio of the thickness of the zeolite porous layer to the thickness of the viscoelastic polymer barrier layer is 1 x 10⁻⁶. -5 :1.

[0067] Example 2

[0068] This embodiment provides a shock-absorbing component for an electronic device, which is manufactured using a method comprising the following specific steps:

[0069] Step (1): Mix 24 parts by weight of polyisobutylene PIB45000 in an internal mixer for 30 minutes. The mixing conditions are: temperature 75℃, speed 50r / min and filling coefficient 0.8. Then add 0.2 parts by weight of sulfur in a two-roll mill to obtain a mixed slurry. Lay the mixed slurry in a metal sheet mold with a thickness of 0.4mm.

[0070] Step (2): Select FER zeolite powder with a Si / Al molar ratio of 450 and a powder size of 10 nm; mix 1000 g of FER zeolite powder with 5000 g of toluene and disperse evenly, then add 20 g of vinyltrimethoxysilane, stir at 40 °C for 4 h, filter, and disperse and wash twice with toluene to obtain surface-modified FER zeolite powder; spread 20 g of surface-modified FER zeolite powder on the surface of the slurry in the aforementioned metal sheet mold;

[0071] Step (3): Curing the aforementioned slurry under the following conditions: temperature 165℃, time 10min, pressing to obtain a vulcanized rubber thickness of 0.4mm, removing the sheet and vibrating to blow away excess FER zeolite powder, thus obtaining a solid sheet;

[0072] Step (4): Cut the solid sheet into rectangles 80.0 mm wide and 100.0 mm long to obtain the shock-absorbing component of the electronic device.

[0073] A schematic diagram of the shock-absorbing component of the electronic device obtained in this embodiment is shown below. Figure 1 As shown, it comprises, from the inside out, a zeolite porous layer 1 and a viscoelastic polymer barrier layer 2. The zeolite porous layer 1 is a single layer of FER zeolite powder, and the viscoelastic polymer barrier layer 2 is made of vulcanized polyisobutylene rubber. The thickness of the damping component in the electronic device is 400 μm, and the ratio of the thickness of the zeolite porous layer to the thickness of the viscoelastic polymer barrier layer is 2.5 x 10⁻⁶. -5:1.

[0074] Example 3

[0075] This embodiment provides a shock-absorbing component for an electronic device, the only difference between its manufacturing method and that of Embodiment 2 is:

[0076] In Example 2, the amount of polyisobutylene (PIB45000) was reduced to 12 parts by weight, and the amount of sulfur was reduced to 0.1 parts by weight. The resulting damping component for electronic devices had a thickness of 0.2 mm, wherein the ratio of the thickness of the zeolite porous layer to the thickness of the viscoelastic polymer barrier layer was 5 x 10. -5 :1.

[0077] Example 4

[0078] This embodiment provides a shock-absorbing component for an electronic device, the only difference between its manufacturing method and that of Embodiment 2 is:

[0079] The amount of polyisobutylene PIB45000 in Example 2 was reduced to 6 parts by weight, and an additional 5 parts by weight of brominated butyl rubber 2030 was added.

[0080] A schematic diagram of the shock-absorbing component of the electronic device obtained in this embodiment is shown below. Figure 1 As shown, it comprises, from the inside out, a zeolite porous layer 1 and a viscoelastic polymer barrier layer 2. The zeolite porous layer 1 is a single layer of FER zeolite powder, and the viscoelastic polymer barrier layer 2 is a mixed polymer material of polyisobutylene (PIB45000) and brominated butyl rubber 2030 after vulcanization. The thickness of the damping component of the electronic device is 300 μm, and the ratio of the thickness of the zeolite porous layer to the thickness of the viscoelastic polymer barrier layer is 3 x 10. -5 :1.

[0081] Comparative Example 1

[0082] This comparative example provides a shock-absorbing component for an electronic device, which is a PDMS film with a thickness of 0.5 mm.

[0083] Comparative Example 2

[0084] This comparative example provides a shock-absorbing component for an electronic device, which is 0.5 mm thick foam.

[0085] Performance Test Example 1

[0086] This performance test example performs acoustic tests on the damping components of the electronic devices provided in Examples 1-4 and Comparative Examples 1-2 of this invention, including:

[0087] Take a commercially available 1115 loudspeaker, remove the sealing film from the leakage port, and enlarge the leakage port into a rectangular opening with dimensions of 4.0mm*10.0mm to form an open-type 1115 loudspeaker.

[0088] To ensure the reliability of the phone assembly (preventing differences in sealant adhesion due to repeated disassembly of the phone's back cover), the structural diagram shown is selected as follows: Figure 2 The mobile phone mold shown is evaluated as a mobile phone tooling: the tooling weighs 200g and has dimensions of 17mm (length) * 85mm (width) * 9mm (thickness). It contains a structure and screws for fixing the speaker, specifically the aforementioned open-back 1115 speaker. The gap between the back cover and the body is 0.5-1.0mm (0.5mm at the narrowest point and 1.0mm at the widest). Based on the internal gap of the mobile phone, excess portions of the shock-absorbing components of the electronic devices provided in Embodiments 1-4 and Comparative Examples 1-2 are cut off to ensure a tight fit between the shock-absorbing components and the back cover of the mobile phone. Figure 2 As shown, from Figure 2 As can be seen from the image, the mobile phone fixture includes a body, a shock-absorbing component 100 for electronic devices, a back cover 200, an open-type 1115 speaker 300, a battery 400, a screen 500, and other components 600. The back cover 200 is used to cover the body and form a mounting cavity with it. The open-type 1115 speaker 300, battery 400, other components 600, and shock-absorbing component 100 for electronic devices are all located in the mounting cavity. The viscoelastic polymer material barrier layer in the shock-absorbing component 100 of the electronic device is tightly attached to the inner layer of the back cover 200, while the zeolite porous layer is in contact with the air inside the mounting cavity.

[0089] The open-back 1115 speaker is secured to the body with screws, and sealing rings are used to seal the area where the body fits against the back cover.

[0090] Acoustic performance tests were conducted on a commercially available 1115 speaker unit, a 1115 speaker with an added rear cavity, an open 1115 speaker, a mobile phone fixture with an open 1115 speaker and the shock-absorbing components of the electronic devices provided in Examples 1-4 and Comparative Examples 1-2 of this invention, and a mobile phone fixture (blank) with only an open 1115 speaker installed, using conventional methods in the art. The obtained f0 data are shown in Table 1 below.

[0091] Performance Test Example 2

[0092] This performance test example uses an amplitude measuring instrument (piezoelectric accelerometer) to conduct amplitude tests on mobile phone fixtures obtained in Performance Test Example 1, which are respectively equipped with open-type 1115 speakers and the shock-absorbing components of electronic devices provided in Examples 1-4 and Comparative Examples 1-2 of this invention, as well as a mobile phone fixture (blank) with only an open-type 1115 speaker. The tests include:

[0093] The vibration sensor, i.e., the piezoelectric accelerometer, is tightly bonded to the back cover of the mobile phone fixture using tape. Then, it is placed on a sponge to avoid direct hard contact with the table surface, which could affect the test results. There are two test signal input options: one is to use the CF 2.2 powder noise test signal, with the powder noise voltage set to 1.65V; the other is to directly use the test mobile phone, i.e., the mobile phone fixture plays the signal, in which case the volume of the test mobile phone is turned up to the maximum for testing.

[0094] The particle noise test signal is played in a loop. The test is started using an amplitude meter. The test value is not read for the first 3 seconds. Then it continues for 20 seconds. The maximum value of the test data within 20 seconds is read and recorded as the value of that test point.

[0095] Change the fixed position of the phone mold back cover and the vibration sensor, and retest the next fixed position, recording the value of the test point; in this performance test example, the phone mold back cover is divided into 9 grids, and the vibration amplitude of 9 points is measured; the maximum vibration distance range is recorded as shown in Table 1 below.

[0096] Performance Test Example 3

[0097] This performance test example uses an amplitude measuring instrument (piezoelectric accelerometer) to conduct tactile tests on mobile phone fixtures obtained in Performance Test Example 1, which are respectively equipped with an open-type 1115 speaker and the shock-absorbing components of the electronic devices provided in Examples 1-4 and Comparative Examples 1-2 of this invention, as well as a mobile phone fixture (blank) with only an open-type 1115 speaker. The tests include:

[0098] The mobile phone fixture was placed in the hands of ten testers, and then a pink noise test signal was given to the CF 2.2 speaker. The qualitative evaluation was carried out by the testers' subjective touch. The evaluation results are shown in Table 1 below.

[0099] Table 1

[0100]

[0101]

[0102] As can be seen from Table 1 above, the f0 of the 1115 speaker unit itself is around 440Hz. After adding the rear cavity, the f0 of the 1115 speaker increases to around 860Hz. After opening the 1115 speaker vent and drilling a larger vent hole, its f0 is measured to decrease to around 530Hz in an open environment.

[0103] The blank mobile phone fixture corresponds to a mobile phone fixture with only an open-back 1115 speaker installed. Its f0 was measured to be around 640Hz in a closed environment.

[0104] Compared to a blank mobile phone fixture, mobile phone fixtures equipped with the vibration damping components of the electronic devices provided in Embodiments 1-4 of this invention and an open-type 1115 speaker not only significantly reduce mobile phone vibration, but also significantly reduce acoustic f0. The reduction in f0 indicates that these mobile phone fixtures have better low-frequency performance.

[0105] Compared to the blank mobile phone fixture, the vibration of the mobile phone fixture equipped with the damping component of the electronic device provided in Comparative Example 1 and the open-type 1115 speaker is also significantly reduced. However, its acoustic f0 is significantly higher than both the blank mobile phone fixture and the mobile phone fixture equipped with the damping component of the electronic device provided in Embodiment 1 of this invention. This is because, compared to Comparative Example 1, the damping component of the electronic device provided in Embodiment 1 of this invention adds a single layer of MFI zeolite powder as a porous zeolite layer. The MFI zeolite powder itself has a large number of micropores, which can absorb sound wave energy through adsorption and desorption, thereby significantly reducing the acoustic low-frequency f0 and thus obtaining a better acoustic low-frequency effect.

[0106] Compared to the mobile phone fixtures equipped with the shock-absorbing components and open-type 1115 speakers provided in Embodiments 1-4 of this invention, although the acoustic f0 of the mobile phone fixtures equipped with 0.5mm thick foam and open-type 1115 speakers did not deteriorate significantly, their vibration reduction effect was extremely limited.

[0107] The above description is merely a specific embodiment of the present invention and should not be construed as limiting the scope of the invention. Therefore, any substitution of equivalent components or equivalent changes and modifications made within the scope of protection of this patent should still fall within the scope of this patent. Furthermore, the technical features, technical features and technical inventions, and technical inventions in this invention can be freely combined and used.

Claims

1. A shock-absorbing component for an electronic device, characterized in that, The shock-absorbing component of the electronic device comprises, from the inside out, a zeolite porous layer and a viscoelastic polymer barrier layer. The zeolite porous layer includes a single layer of zeolite powder laid on the surface of the viscoelastic polymer barrier layer, and the thickness ratio of the zeolite porous layer to the viscoelastic polymer barrier layer is 5x10. -6 1 to 2 x 10 -3 :

1.

2. The shock-absorbing component of the electronic device according to claim 1, characterized in that, The particle size of the zeolite powder is 5-100 nm.

3. The shock-absorbing component of the electronic device according to claim 1 or 2, characterized in that, The zeolite powder includes one or a combination of several of the following molecular sieves: MFI structured molecular sieve, FER structured molecular sieve, CHA structured molecular sieve, MEL structured molecular sieve, MOR structured molecular sieve, FAU structured molecular sieve, BEA molecular sieve, and LTA molecular sieve.

4. The shock-absorbing component of the electronic device according to claim 1 or 2, characterized in that, The viscoelastic polymer material includes thermoplastic polyurethane elastomer, thermoplastic polyester elastomer, polydimethylsiloxane, silicone rubber, polyisobutylene rubber, brominated butyl rubber, or polybutadiene rubber, as well as a mixed polymer material formed by mixing at least two monomers from the monomers corresponding to the above substances.

5. The shock-absorbing component of the electronic device according to claim 1 or 2, characterized in that, The thickness of the shock-absorbing component of the electronic device is 50-1000μm.

6. A method for manufacturing a shock-absorbing component for an electronic device according to any one of claims 1-5, characterized in that, The preparation method includes: Step (1): Spread the viscoelastic polymer slurry evenly on the operating board; Step (2): Apply an excess of zeolite powder to the surface of the viscoelastic polymer slurry and solidify it to obtain a solid sheet; Step (3): Remove the solid sheet and vibrate to blow away the excess zeolite powder to obtain the damping component of the electronic device.

7. The preparation method according to claim 6, characterized in that, The preparation method further includes: pre-treating the zeolite powder before step (2), wherein the pre-treating includes surface modification and / or immersing the zeolite powder in an organic small molecule solvent.

8. The preparation method according to claim 7, characterized in that, The surface modification agents used in the surface modification include trimethylchlorosilane and / or vinyltrimethoxysilane; The organic small molecule solvent includes one or a combination of several of the following: n-heptane, toluene, xylene, ethylbenzene, gasoline, and petroleum ether.

9. The preparation method according to claim 7 or 8, characterized in that, The preparation method further includes: post-processing the shock-absorbing component of the electronic device after step (3) to remove residual small organic molecule solvents.

10. An electronic device, characterized in that, The electronic device includes a back cover, an electronic device substrate, an open-back speaker, and a shock-absorbing component of the electronic device according to any one of claims 1-5. The back cover is used to cover the electronic device substrate and form a mounting cavity therewith. The open-back speaker and the shock-absorbing component of the electronic device are both disposed in the mounting cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

11. The electronic device according to claim 10, characterized in that, The electronic devices include smartphones, TWS earphones, headphones, smart glasses, smartwatches, VR devices, AR devices, tablets, or thin and light laptops.

12. A back cover assembly for an electronic device, the electronic device comprising an electronic device substrate and an open-back speaker, characterized in that, The back cover assembly includes a back cover and a damping component of the electronic device according to any one of claims 1-5. The back cover is used to cover the electronic device substrate and form a mounting cavity therewith. The open-back speaker and the damping component of the electronic device are both disposed in the mounting cavity, and the viscoelastic polymer material barrier layer in the damping component of the electronic device is bonded to the inner layer of the back cover.

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