Electronic device

Abstract

The invention provides an electronic device. An electronic device (1) through which air from the outside flows in and out is provided with: a housing provided with an air inlet (35); a fan (60) housed in the housing; a substrate (40) housed in the case; a first heat-generating component (43) mounted on the first surface of the substrate; and a second heat generating component (42) mounted on the second surface of the substrate. A first flow path and a second flow path for guiding air conveyed from the air inlet to the fan are formed in the housing. The first flow path includes a space formed on the first surface and in which the first heat-generating member is disposed, and the second flow path includes a space formed on the second surface and in which the first heat-generating member is disposed. In a direction perpendicular to the substrate, a distance between a first surface in the first flow path and a surface facing the first surface is longer than a distance between a second surface in the second flow path and a surface facing the second surface. The amount of heat generated by the first heat-generating member is greater than the amount of heat generated by the second heat-generating member.

Description

Technical Field

[0001] The present disclosure relates to an electronic device. Background Art

[0002] In the past, there is known an electronic device, which includes: a housing having an air inlet and an air outlet; and a substrate disposed in the housing and having a heat generating component mounted thereon (e.g., Patent Document 1). In particular, the electronic device described in Patent Document 1 includes a fan disposed in a hole provided in the substrate, and is configured such that air sucked from the air inlet passes through the bottom of the substrate and flows to the fan, and then air flowing out of the fan passes through the top of the substrate and flows to the air outlet.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2001-111275 Summary of the invention

[0006] However, in the electronic device described in Patent Document 1, there is room for improvement in dissipating heat generated from heat-generating components.

[0007] In view of the above problems, an object of the present disclosure is to provide an electronic device capable of effectively dissipating heat generated from a heat-generating component.

[0008] The gist of the present disclosure is as follows.

[0009] (1) An electronic device in which air from outside flows in and out of the electronic device, wherein:

[0010] The electronic device has:

[0011] a housing having an air inlet;

[0012] a fan housed in the housing;

[0013] a substrate housed in the housing;

[0014] One or more first heat generating components mounted on the first surface of the substrate; and

[0015] one or more second heat generating components mounted on a second surface of the substrate opposite to the first surface,

[0016] A first flow path and a second flow path are formed in the housing to guide the air flowing in from the air inlet toward the fan.

[0017] At least a portion of the first flow path is formed by the first surface and a first opposing surface opposing the first surface.

[0018] At least a portion of the second flow path is formed by the second surface and a second opposing surface opposing the second surface.

[0019] In a direction perpendicular to the substrate, a distance between the first surface and the first opposing surface in the first flow path is longer than a distance between the second surface and the second opposing surface in the second flow path.

[0020] The total calorific value of all the first heat generating components is greater than the total calorific value of all the second heat generating components, or the calorific value of the component with the largest calorific value among the first heat generating components is greater than the calorific value of the component with the largest calorific value among the second heat generating components.

[0021] (2) The electronic device according to (1) above, wherein:

[0022] The first opposing surface is formed by a first metal plate arranged opposite to the first surface.

[0023] The second opposing surface is formed by a second metal plate arranged opposite to the second surface.

[0024] At least a portion of the housing is formed of the first metal plate or the second metal plate.

[0025] (3) The electronic device according to (2) above, wherein:

[0026] The first metal plate is connected to at least one of the first heat generating component and the substrate by a thermally conductive first connecting member.

[0027] (4) The electronic device according to (2) or (3), wherein:

[0028] The second metal plate is connected to at least one of the second heat generating component and the substrate by a thermally conductive second connecting member.

[0029] (5) The electronic device according to (3) above, wherein:

[0030] At least a portion of the first connection member connects the first metal plate and a first wiring pattern provided on the substrate.

[0031] (6) The electronic device according to (5) above, wherein:

[0032] The first wiring pattern is electrically connected to the ground potential of the electronic device.

[0033] The first metal plate is arranged so as to overlap with at least a portion of the first heat generating component when viewed in a direction perpendicular to the substrate.

[0034] (7) The electronic device according to (4) above, wherein:

[0035] At least a portion of the second connection member connects the second metal plate and a second wiring pattern provided on the substrate.

[0036] (8) The electronic device according to (7), wherein:

[0037] The second wiring pattern is electrically connected to the ground potential of the electronic device.

[0038] The second metal plate is arranged so as to overlap with at least a portion of the second heat generating component when viewed in a direction perpendicular to the substrate.

[0039] (9) The electronic device according to (2) above, wherein:

[0040] The fan is mounted on the second metal plate, has a second fan surface opposite to the second metal plate in a direction perpendicular to the substrate and a first fan surface on the side opposite to the second fan surface, and has an inlet formed on the first fan surface and an inlet formed on the second fan surface.

[0041] The first opposing surface is also opposed to the inlet formed on the first surface of the fan, and the second opposing surface is also opposed to the inlet formed on the second surface of the fan.

[0042] A distance between an inlet formed on the first surface of the fan and the first opposing surface is longer than a distance between an inlet formed on the second surface of the fan and the second opposing surface.

[0043] (10) The electronic device according to (1) above, wherein:

[0044] The component having the largest heat generation among the first heat generating components is arranged so as to be at least partially located in a space between the air inlet and the inlet port of the fan when viewed in a direction perpendicular to the substrate.

[0045] (11) The electronic device according to (1) or (10), wherein:

[0046] The component with the largest heat generation among the second heat generating components is arranged so as to be at least partially located in a space between the air inlet and the inlet port of the fan when viewed in a direction perpendicular to the substrate.

[0047] (12) The electronic device according to (1) or (2), wherein:

[0048] The air inlet includes two air inlets, namely a first air inlet and a second air inlet, which are arranged separately from each other on the same surface of the housing.

[0049] The component with the largest heat generation among the first heat generating components is arranged so as to be at least partially located in a space between the first air inlet and the inlet of the fan when viewed in a direction perpendicular to the substrate.

[0050] The component with the largest heat generation among the second heat generating components is arranged so as to be at least partially located in a space between the second air inlet and the inlet when viewed in a direction perpendicular to the substrate.

[0051] (13) The electronic device according to (12) above, wherein:

[0052] The electronic device also has a battery disposed in the housing.

[0053] The battery is disposed so that a distance from the space between the first air inlet and the inlet is greater than a distance from the space between the second air inlet and the inlet.

[0054] Effects of the Invention

[0055] According to the present disclosure, there is provided an electronic device capable of effectively dissipating heat generated from a heat-generating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 This is a schematic perspective view of the electronic device as viewed from the front and above.

[0057] Figure 2 This is a schematic exploded perspective view of the electronic device as viewed from the front upper side.

[0058] Figure 3 This is a plan view of the front shell half as viewed from the rear.

[0059] Figure 4 This is a plan view of the substrate viewed from the rear.

[0060] Figure 5 This is a plan view of the electronic device viewed from the rear with the rear housing half and the rear metal plate removed.

[0061] Figure 6 It is an electronic device along Figure 5 A partial cross-sectional view observed along line VI-VI.

[0062] Figure 7 It is an electronic device along Figure 5 Cross-sectional view observed along line VII-VII.

[0063] Figure 8 This is a cross-sectional view schematically showing a state in which the front metal plate, the base plate, and the rear metal plate are mounted to each other using a connecting member. DETAILED DESCRIPTION

[0064] Hereinafter, the embodiment will be described in detail with reference to the drawings. In the following description, the same components are denoted by the same reference numerals.

[0065] The overall structure of electronic equipment

[0066] First, refer to Figure 1 and Figure 2 The overall structure of an electronic device 1 according to one embodiment is briefly described. The electronic device 1 is a roughly rectangular parallelepiped device having a display panel, such as a portable game console, a tablet computer, a mobile monitor, etc. In particular, in this embodiment, the electronic device 1 is a portable device that is placed on a placement surface such as the ground or a desk for use.

[0067] Figure 1 It is a schematic perspective view of the electronic device 1 as viewed from the upper front. Figure 2 1 is a schematic exploded perspective view of the electronic device 1 viewed from the front and top. Figure 1 As shown, the electronic device 1 includes a housing 10 formed in a substantially rectangular parallelepiped shape and a display panel 5 provided on one side surface of the housing 10 .

[0068] In this specification, the direction in which the display panel 5 is provided with respect to the housing 10 is referred to as the front, and the direction opposite to the front is referred to as the rear. Therefore, the display panel 5 is provided on the front surface of the housing 10. In addition, when the electronic device 1 is placed vertically to the placement surface in a normal direction, when the electronic device 1 is viewed from the front, the upper direction, the lower direction, the left direction, and the right direction are referred to as the upper direction, the lower direction, the left direction, and the right direction of the electronic device 1 and its components, respectively, and the left-right direction of the electronic device 1 is also referred to as the width direction.

[0069] like Figure 2 As shown, the electronic device 1 includes a substrate 40, a rear metal plate 50, a fan 60, a heat pipe 70, a heat sink 72, and a battery 75 in addition to the housing 10 and the display panel 5. The substrate 40, the rear metal plate 50, the fan 60, the heat pipe 70, the heat sink 72, and the battery 75 are accommodated in the housing 10.

[0070] case

[0071] Next, refer to Figure 1 to Figure 3 The housing 10 is described. Figure 1As shown, the housing 10 has a front wall 11 located at the front side of the housing 10, a rear wall 12 located at the rear side of the housing 10, and an upper wall 13, a lower wall 14, a left wall 15, and a right wall 16 located between the front wall 11 and the rear wall 12. In particular, the upper wall 13 is provided on the upper side of the housing 10, the lower wall 14 is provided on the lower side of the housing 10, the left wall 15 is provided on the left side of the housing 10, and the right wall 16 is provided on the right side of the housing 10. In the present embodiment, the upper wall 13, the lower wall 14, the left wall 15, and the right wall 16 extend in a manner perpendicular to the front wall 11 and the rear wall 12. In addition, extending vertically not only means that the walls extend strictly perpendicularly to each other, but also includes the case where they extend substantially perpendicularly. In addition, in the present embodiment, the front wall 11 and the rear wall 12 are formed to be flat. In addition, in the present embodiment, the upper wall 13, the lower wall 14, the left wall 15, and the right wall 16 are also formed to be flat.

[0072] like Figure 2 As shown, the housing 10 is mainly formed of two housing half bodies 20 and 30. The front housing half body 20 is relatively arranged at the front, and the rear housing half body 30 is relatively arranged at the rear.

[0073] like Figure 2 As shown, in the present embodiment, the front housing half body 20 mainly constitutes the front wall 11, the left wall 15 and the right wall 16 of the housing 10. In addition, the rear housing half body 30 mainly constitutes the rear wall 12, the upper wall 13 and the lower wall 14 of the housing 10. Therefore, when the rear housing half body 30 is mounted on the front housing half body 20, the housing 10 having the front wall 11, the rear wall 12, the upper wall 13, the lower wall 14, the left wall 15 and the right wall 16 is formed. In addition, the upper wall 13, the lower wall 14, the left wall 15 and the right wall 16 may be respectively constituted by any one of the front housing half body 20 and the rear housing half body 30. Therefore, the front housing half body 20 may mainly constitute the front wall 11, the upper wall 13 and the lower wall 14, and the rear housing half body 30 may mainly constitute the rear wall 12, the left wall 15 and the right wall 16. Alternatively, at least one of the upper wall 13, the lower wall 14, the left wall 15 and the right wall 16 may be formed by both the front housing half 20 and the rear housing half 30 (for example, by fitting the two housing half 20, 30 in the center in the front-rear direction).

[0074] The front housing half 20 has a front main wall 21, a left side wall 22 and a right side wall 23, which respectively constitute the front wall 11, the left wall 15 and the right wall 16 of the housing 10. Figure 2 As shown, the display panel 5 is provided on the front main wall 21. In addition, the front main wall 21 extends in a direction perpendicular to the front-back direction. The left side wall 22 extends from the left end of the front main wall 21 toward the rear. The right side wall 23 extends from the right end of the front main wall 21 toward the rear. In addition, the left side wall 22 and the right side wall 23 extend over the entire length of the front main wall 21 in the up-down direction.

[0075] The front main wall 21 of the front housing half body 20 has a groove portion 24 that is recessed toward the rear on its front side. The groove portion 24 extends over the entire front surface of the front main wall 21 except for the outer peripheral portion of the front main wall 21. In particular, the groove portion 24 extends in the up-down direction and the width direction over a length that is substantially the same as the length of the display panel 5 in the up-down direction and the width direction. In addition, the groove portion 24 is formed in such a manner that its depth is slightly longer than the length of the display panel 5 in the front-back direction.

[0076] In addition, a thermally conductive sheet 25 for a display is disposed in front of the groove 24 so as to contact the front main wall 21 (particularly the front metal plate 28 described later) at the groove 24. The thermally conductive sheet 25 for a display is a sheet material having thermal conductivity. Figure 2 As shown, in the present embodiment, the thermally conductive sheet 25 for display is arranged on the entire groove portion 24. In addition, the display panel 5 is embedded in the groove portion 24. Therefore, the thermally conductive sheet 25 for display is arranged between the display panel 5 and the front main wall 21 (particularly the front metal plate 28 described later). In addition, the thermally conductive sheet 25 for display is in contact with the rear surface of the display panel 5. Therefore, the thermally conductive sheet 25 for display is arranged in a manner of contacting the rear surface of the display panel 5 and the front main wall 21 (particularly the front metal plate 28). By arranging the thermally conductive sheet 25 for display between the display panel 5 and the front metal plate (second metal plate) 28 in this way, the heat generated by the display panel 5 can be released to the front metal plate 28 via the thermally conductive sheet for display.

[0077] In addition, if it is an element with thermal conductivity, other elements may be used instead of the thermally conductive sheet 25 for display. Therefore, thermally conductive grease may be used instead of the thermally conductive sheet 25 for display. In addition, in the present embodiment, the thermally conductive sheet 25 for display or the thermally conductive grease is in contact with the rear surface of the display panel 5, but it is also possible not to contact with the rear surface of the display panel 5 but to form a tiny air layer therebetween. Furthermore, in the present embodiment, the thermally conductive sheet 25 for display or the thermally conductive grease is arranged on the front main wall 21 at the groove portion 24, but it is also possible to arrange it on the rear surface of the display panel 5. In this case, a tiny air layer may be formed between the thermally conductive sheet 25 for display or the thermally conductive grease provided on the rear surface of the display panel 5 and the front main wall 21 at the groove portion 24.

[0078] Figure 3 This is a plan view of the front housing half 20 as viewed from the rear. Figure 3 As shown, a frame portion 26 for holding the battery 75 and a plurality of connection holes 27 are provided on the rear surface of the front main wall 21 .

[0079] The frame 26 is a roughly rectangular wall extending from the rear surface of the front main wall 21 toward the rear. The frame 26 is configured in a manner slightly larger than the outer shape of the battery 75, so that the battery 75 can be configured in the frame 26. In addition, the frame 26 has a height such that its rear end contacts the rear metal plate (first metal plate) 50. The frame 26 has two notches 26a and 26b. The first notch 26a is configured at the bottom, and the second notch 26b is configured on the fan 60 side. In the area where the notches 26a and 26b are provided, the frame 26 has a height such that its rear end does not reach the rear metal plate 50 but an opening is formed between the rear metal plate 50 and the frame 26. Therefore, air flows into the area surrounded by the frame 26 through the notches 26a and 26b and flows out of the area.

[0080] The connecting hole 27 is configured to receive a connecting member such as a screw, and is used to attach the base plate 40 or the rear metal plate 50 to the front main wall 21 (particularly the front metal plate 28). Figure 3 In the example shown, the connection hole 27 has a plurality of substrate connection holes 27a for receiving the first connection member 81 (see Figure 8 and a plurality of metal plate connecting holes 27b, which are used to receive the third connecting member 83 for mounting the rear metal plate 50.

[0081] The front shell half body 20 is formed of resin and metal. In particular, in the present embodiment, the region in the front shell half body 20 where the groove portion 24 is provided (the region located behind the groove portion 24) is formed as a metal plate. Therefore, the portion formed of metal in the front shell half body 20 is referred to as the front metal plate 28 below. Therefore, a part of the front main wall 21 in the front shell half body 20 is formed by the front metal plate 28. On the other hand, the portion of the front shell half body 20 other than the front metal plate 28 (the remaining portion of the front main wall 21, the left side wall 22 and the right side wall 23) is formed by a resin member. Therefore, the front shell half body 20 is formed by the front metal plate 28 and the resin member surrounding the front metal plate 28 (up, down, left, and right) when viewed in the front-to-back direction. In addition, in the present embodiment, the resin member is configured so as not to substantially cover the front surface and the rear surface of the front metal plate 28. In short, in the present embodiment, the front shell half body 20 is composed of the front metal plate 28 and the resin member.

[0082] In addition, the front metal plate 28 of the front shell half 20 is formed of a metal such as magnesium or aluminum. The front metal plate 28 has a plurality of openings (openings that penetrate the front metal plate 28) 29 extending in the up-down direction in a manner along the frame 26 at a portion closer to the center side than the frame 26. The plurality of openings 29 are arranged in a row in the up-down direction. In the present embodiment, the plurality of openings 29 are formed to extend over a length of more than half of the length of the front metal plate 28 in the up-down direction. Resin is embedded in each of the plurality of openings 29. Since the thermal conductivity of the resin is lower than the thermal conductivity of the metal constituting the front metal plate 28, the movement of heat through the plurality of openings 29 is suppressed by using the plurality of openings 29 and the resin thus constructed. As a result, the movement of heat from the area on the side opposite to the battery 75 relative to the opening 29 to the area where the battery 75 is arranged is suppressed, thereby suppressing unnecessary heating of the battery 75. For example, in the present embodiment, in the left-right direction based on the openings 29 arranged in the up-down direction, heat generating components such as SoC are arranged on the right side, and the battery 75 is arranged on the left side, so that the heat from the heat generating components such as SoC can be suppressed from moving through the resin embedded in the openings 29. In addition, in the present embodiment, the front metal plate 28 is provided with the opening 29 penetrating the front metal plate 28, but a groove that does not penetrate the front metal plate 28 may be provided instead of the opening 29.

[0083] In addition, in the present embodiment, the area corresponding to the groove portion 24 in the front shell half body 20 is formed of metal as the front metal plate 28. However, it is also possible that an area larger than the groove portion 24 or an area smaller than the groove portion 24 is formed of metal as the front metal plate 28. Alternatively, it is also possible that the entire front shell half body 20 is formed of metal as the front metal plate 28. Therefore, at least a part of the front shell half body is formed of the front metal plate 28. In addition, in the present embodiment, the front metal plate 28 constitutes a part of the front shell half body 20. However, the front metal plate 28 may also be a member independent of the front shell half body 20. In this case, for example, the entire front shell half body 20 is formed of resin, and the front metal plate 28 is installed at the rear of the resin front shell half body 20. In addition, the front shell half body 20 may also be composed of the front metal plate 28 and the resin member plus other members.

[0084] The rear housing half body 30 is formed of resin and has a rear main wall 31, an upper side wall 32, and a lower side wall 33. The rear main wall 31, the upper side wall 32, and the lower side wall 33 respectively constitute the rear wall 12, the upper wall 13, and the lower wall 14 of the housing 10. The rear main wall 31 extends in a direction perpendicular to the front-rear direction. The upper side wall 32 extends from the upper end of the rear main wall 31 toward the front. The lower side wall 33 extends from the lower end of the rear main wall 31 toward the front. In addition, the upper side wall 32 and the lower side wall 33 extend over the entire length of the width direction of the rear main wall 31.

[0085] The upper side wall 32 has an exhaust port 34 at a position including the center in the width direction. The exhaust port 34 is an opening for discharging the air in the housing 10, especially the air flowing out from the fan 60, to the outside of the housing 10. The exhaust port 34 passes through the upper side wall 32 and extends in the width direction. In addition, in the present embodiment, the exhaust port 34 is arranged in the center of the upper side wall 32 in the front-to-back direction. In addition, in the present embodiment, the exhaust port 34 is formed as one opening, but may also be formed as a plurality of openings. In this case, the exhaust port 34 may also be formed as a plurality of openings arranged in a row in the width direction, for example. In addition, a mesh component or the like may also be provided at the exhaust port 34 to prevent foreign matter from entering the housing 10 through the exhaust port 34.

[0086] The lower side wall 33 has two air inlets 35 respectively arranged on both sides of the center in the width direction. The air inlet 35 is an opening for sucking air from the outside of the housing 10 into the housing 10. The left air inlet (the second air inlet) 35a is arranged at a position closer to the left than the center of the side wall 33, and the right air inlet (the first air inlet) 35b is arranged at a position closer to the right than the center of the lower side wall 33. Each air inlet 35 penetrates the lower side wall 33 and extends in the width direction. In addition, in the present embodiment, each air inlet 35 is arranged in the center of the lower side wall 33 in the front-to-back direction. In addition, the two air inlets 35 are arranged at the same position as each other in the front-to-back direction. In addition, in the present embodiment, the left air inlet 35a and the right air inlet 35b are each formed as one opening, but can also be formed as a plurality of openings. In this case, each air inlet 35 can also be formed as a plurality of openings arranged in a row in the width direction, for example. In addition, a mesh member or the like may be provided at each air inlet 35 to prevent foreign matter from entering the housing 10 through the air inlet 35. In addition, in addition to the two air inlets 35 respectively arranged on both sides of the center, an air inlet 35 may be provided at the center of the width direction including the lower side wall 33, or in place of the two air inlets 35, an air inlet 35 may be provided at the center of the width direction including the lower side wall 33.

[0087] In addition, in the present embodiment, the air inlet 35 is provided on the lower side wall 33 (i.e., the lower wall 14 of the housing 10). However, the air inlet 35 may also be provided on other side walls (e.g., the upper side wall 32, the left side wall 22, and the right side wall 23 that respectively form the upper wall 13, the left wall 15, and the right wall 16 of the housing 10). That is, the plurality of air inlets 35 may be separately arranged on the same surface of the housing 10. In addition, the plurality of air inlets 35 are provided on the same side wall, i.e., the lower side wall 33 (i.e., the same side wall, i.e., the lower wall 14 of the housing 10). However, the plurality of air inlets 35 may also be separately provided on different side walls, such as the left side wall 22 and the right side wall 23 that respectively form the left wall 15 and the right wall 16 of the housing 10. In short, the plurality of air inlets 35 are separately arranged in a manner that they are located in different directions relative to the fan 60.

[0088] Display Panel

[0089] like Figure 1 and Figure 2 As shown, a display panel 5 is arranged on the front main wall 21 of the front housing half 20. In the present embodiment, the display panel 5 is arranged on substantially the entire surface of the front main wall 21 and has a flat surface. The display panel 5 is an example of a device that displays a still image or a video in accordance with a signal output from an electronic component (not shown) for image control provided in the electronic device 1. The display panel 5 is, for example, a liquid crystal display panel, an EL (Electro Luminescence) display panel, or a plasma display panel. The display panel 5 may also have a touch panel on its surface that functions as an input device.

[0090] substrate

[0091] Next, refer to Figure 2 , Figures 4 to 6 The substrate 40 will be described. The substrate 40 is an example of a member for mounting electronic components for realizing various functions of the electronic device 1 . Figure 4 It is a plan view of the substrate 40 as viewed from the rear. Figure 5 This is a plan view of the electronic device 1 viewed from the rear with the rear housing half 30 and the rear metal plate 50 removed (only the side wall is shown in cross section). Figure 6 It is an electronic device 1 along Figure 5 A partial cross-sectional view observed along line VI-VI.

[0092] The base plate 40 is disposed between the front main wall 21 and the rear main wall 31 in the front-to-back direction and extends in a direction perpendicular to the front-to-back direction. Figure 5 As shown in FIG. 1 , the base plate 40 has a shape that does not overlap with the fan 60 when viewed in the front-rear direction. In particular, in the present embodiment, Figure 2, Figure 4 and Figure 5 As shown, the base plate 40 is formed in the shape of a letter L. In addition, as shown Figure 5 As shown in FIG. 1 , the substrate 40 is arranged so as to be located on both sides of the center line C in the width direction of the electronic device 1. In particular, in this embodiment, the substrate 40 is arranged so as to be mostly located on the right side relative to the center line C in the width direction of the electronic device 1. In addition, in this embodiment, the substrate 40 is arranged so as to be located in the space between each air inlet 35 and the inlet 61 of the fan 60 when viewed in the front-rear direction. Specifically, in Figure 5 In the embodiment, the substrate 40 is located in a space X1 between a straight line L11 connecting the left end of the left air inlet 35a and the left end of the inlet 61 of the fan 60 and a straight line L1r connecting the right end of the left air inlet 35a and the right end of the inlet 61 of the fan 60. Figure 5 In the embodiment, the substrate 40 is located in a space X2 between a straight line L21 connecting the left end of the right air inlet 35b and the left end of the inlet 61 of the fan 60 and a straight line L2r connecting the right end of the right air inlet 35b and the right end of the inlet 61 of the fan 60. In addition, if the substrate 40 is arranged in a manner of being located in a space (X1, X2) between each of the plurality of air inlets 35 and the inlet 61 of the fan 60, any arrangement is acceptable. Therefore, the substrate 40 may also be arranged in a manner of being located only on one side relative to the center line C in the width direction of the electronic device 1.

[0093] In addition, if Figure 4 and Figure 5 As shown, a plurality of electronic components 41 and a shield member 44 covering a portion of the electronic components 41 are mounted on a substrate 40. In addition, the substrate 40 has a plurality of substrate openings 46 and a ground pattern 47.

[0094] The electronic component 41 is an example of an electronic component mounted on the substrate 40 to realize different functions, and is a heat-generating component that generates heat during operation. The electronic component 41 includes one or more front electronic components (second heat-generating components) 42 mounted on the front surface (second surface) of the substrate 40 and one or more rear electronic components (first heat-generating components) 43 mounted on the rear surface (the surface opposite to the front surface, first surface) of the substrate 40. Figure 4 and Figure 5 In the example shown, two front electronic components 42 are mounted on the front surface of the substrate 40, and three rear electronic components 43 are mounted on the rear surface of the substrate 40. All or part of the front electronic components 42 are arranged so as to at least partially overlap the front metal plate 28 in the front-to-back direction. All or part of the rear electronic components 43 are arranged so as to at least partially overlap the rear metal plate 50 in the front-to-back direction. In addition, the front electronic components 42 and the rear electronic components 43 are arranged so as not to overlap each other in the front-to-back direction.

[0095] exist Figure 4 and Figure 5 In the example shown, the front electronic component 42 includes a first front electronic component 42a provided at the lower left end of the substrate 40 and a second front electronic component 42b provided at a position closer to the left than the center of the substrate 40. Therefore, the first front electronic component 42a and the second front electronic component 42b are arranged at a relatively left position. As a result, at least a portion of each of the first front electronic component 42a and the second front electronic component 42b is located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60. In particular, in the present embodiment, the average calorific value or the maximum calorific value of the second front electronic component 42b is greater than the average calorific value or the maximum calorific value of the first front electronic component 42a. Therefore, among the front electronic components 42 provided at the front side of the substrate 40, the front electronic component 42 having the largest average calorific value or the largest calorific value is at least partially located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60.

[0096] In addition, in this embodiment, the first front electronic component 42a is a component including a memory or a storage IC capable of rewriting information, and the second front electronic component 42b is a component not including a memory or a storage IC capable of rewriting information. Therefore, the first front electronic component 42a is a component less heat-resistant than the second front electronic component 42b.

[0097] In addition, on the front side of the substrate 40, only one front electronic component 42 may be provided, or more than three front electronic components 42 may be provided. In addition, a part or all of the front electronic components 42 may be arranged at a relatively right position of the substrate 40. Furthermore, a part or all of the front electronic components 42 may be located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60, or none of the front electronic components 42 may be located in the space X1. In particular, in the case where the front electronic component 42 is arranged in a manner such that heat can be transferred with a component such as a shielding component, if at least a part of the component is located in the space X1, the front electronic component 42 may not be located in the space X1. In addition, the front electronic component 42 having the largest average heat generation or the largest maximum heat generation among the front electronic components 42 may not be located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60.

[0098] In addition, Figure 4 and Figure 5In the example shown, the rear electronic component 43 includes a first rear electronic component 43a disposed at a position to the right of the center of the substrate 40, a second rear electronic component 43b disposed at the right side of the first rear electronic component 43a, and a third rear electronic component 43c disposed at the lower side of the first rear electronic component 43a. Therefore, the first rear electronic component 43a, the second rear electronic component 43b, and the third rear electronic component 43c are disposed at a relatively right position. As a result, at least a part of each of the first rear electronic component 43a and the third rear electronic component 43c is located in the space X2 between the right air inlet 35b and the inlet 61 of the fan 60. In particular, in the present embodiment, the average calorific value or the maximum calorific value of the first rear electronic component 43a is greater than the average calorific value or the maximum calorific value of the second rear electronic component 43b and the third rear electronic component 43c. Therefore, among the rear electronic components 43 disposed on the rear side of the substrate 40 , the rear electronic components 43 having the largest average or maximum heating value are at least partially located in the space X2 between the right air inlet 35 b and the inlet 61 of the fan 60 .

[0099] In addition, on the rear side of the substrate 40, only one rear electronic component 43 may be provided, or two or more than four rear electronic components 43 may be provided. In addition, a part or all of the rear electronic components 43 may be arranged at a relatively left position of the substrate 40. Furthermore, a part or all of the rear electronic components 43 may be located in the space X2 between the right air inlet 35b and the inlet 61 of the fan 60, or none of the rear electronic components 43 may be located in the space X2. In particular, in the case where the rear electronic component 43 is arranged in a manner that enables heat transfer with a component such as a shielding component 44, if at least a part of the component is located in the space X2, the rear electronic component 43 may not be located in the space X2. In addition, the rear electronic component 43 having the largest average heat generation or the largest maximum heat generation among the rear electronic components 43 may not be located in the space X2 between the right air inlet 35b and the inlet 61 of the fan 60.

[0100] Furthermore, in the present embodiment, the total calorific value of all rear electronic components 43 is greater than the total calorific value of all front electronic components 42. Furthermore, in the present embodiment, the average calorific value or the maximum calorific value of the component (the first rear electronic component 43a) having a larger average calorific value or the maximum calorific value among the rear electronic components 43 is greater than the average calorific value or the maximum calorific value of the component (the second front electronic component 42b) having a larger average calorific value or the maximum calorific value among the front electronic components 42.

[0101] The shield member 44 is an example of a member for blocking noise radiated from the electronic component 41, and is formed of a metal having thermal conductivity. Figure 5 and Figure 6 As shown, the shielding member 44 is configured to cover all three rear electronic components 43. In addition, in the present embodiment, the shielding member 44 is mounted on the substrate 40 in a manner that it is in contact with the rear surface of the first rear electronic component 43a and is separated from the rear surfaces of the second rear electronic component 43b and the third rear electronic component 43c. In addition, the shielding member 44 can also be mounted on the substrate 40 in a manner that it is connected to the rear surfaces of at least any one or all of the first rear electronic component 43a, the second rear electronic component 43b, and the third rear electronic component 43c via thermally conductive grease. According to such a structure, even if the heights of the electronic components are different, the first to third rear electronic components and the shielding member 44 can be connected in a manner that allows heat transfer.

[0102] In addition, in the present embodiment, the shielding member 44 is provided in a manner covering the three rear electronic components 43. However, the shielding member 44 may be provided in a manner covering only a part of the three rear electronic components 43. In addition, in the present embodiment, one shielding member 44 is provided in a manner covering the three rear electronic components 43. However, a plurality of shielding members 44 may be provided on the substrate 40, and may be arranged in a manner covering one or more rear electronic components 43, respectively. In addition, a part of the plurality of shielding members 44 may be provided in a manner covering the front electronic component 42. In addition, the shielding member 44 is mounted on the substrate 40 in a manner of contacting the rear surface of the first rear electronic component 43a, but may also be mounted on the substrate 40 in a manner of contacting the rear surface of the second rear electronic component 43b and / or the third rear electronic component 43c in addition to the first rear electronic component 43a, or may be mounted on the substrate 40 in a manner of contacting the rear surface of the second rear electronic component 43b and / or the third rear electronic component 43c instead of the first rear electronic component 43a. In addition, the shielding member 44 may also be mounted on the substrate 40 in a manner of contacting the front surface of other electronic components such as the front electronic component 42. In addition, the shielding member 44 may also be formed in a manner of having an opening so that a portion of the electronic component 41 covered by the shielding member 44 is exposed to the outside of the shielding member 44.

[0103] In this embodiment, the shielding member 44 is mounted on the substrate 40 using a metal mounting member 45 having thermal conductivity. Figure 5 and Figure 6As shown, the mounting member 45 is arranged behind the shielding member 44 in contact with the shielding member 44, and is fixed to the substrate 40 and the front housing half body 20 by the first connecting member 81 for mounting the substrate 40 on the front housing half body 20 (particularly the front metal plate 28). When an opening is formed in the shielding member 44, the mounting member 45 can be arranged in a manner covering the opening. In this case, the mounting member 45 is used to block the noise radiated from the electronic component 41 located in the shielding member 44. In addition, in this case, the mounting member 45 can also be arranged in a manner contacting the rear surface of the electronic component 41 located in the opening of the shielding member 44. In addition, the mounting member 45 can also be formed of a material other than metal as long as it has thermal conductivity.

[0104] The opening 46 on the substrate is an opening through which the first connecting member 81 for attaching the substrate 40 to the front housing half 20 (particularly the front metal plate 28) or the second connecting member 82 for attaching the rear metal plate 50 to the substrate 40 passes. Figure 3 and Figure 4 It can be seen that the first opening 46a on the base plate through which the first connecting member 81 for mounting the base plate 40 on the front metal plate 28 passes is arranged at a position corresponding to the base plate connecting hole 27a of the front housing half 20. In addition, the second opening 46b on the base plate through which the second connecting member 82 for mounting the rear metal plate 50 on the base plate 40 passes is arranged at a position corresponding to the metal plate opening 51 provided on the rear metal plate 50. Figure 4 As shown, the number of the first substrate openings 46a is greater than the number of the second substrate openings 46b. In particular, in this embodiment, only one second substrate opening 46b is provided on the substrate 40.

[0105] The ground pattern 47 is a wiring pattern electrically connected to the ground potential of the electronic device 1. Figure 4 As shown, the ground pattern 47 is arranged so as to extend over the entire substrate 40 except for the vicinity of the first front electronic component 42a. Therefore, the ground pattern 47 is arranged so as to overlap with at least a portion of the electronic component 41 when viewed in the front-to-back direction. In particular, in the present embodiment, the ground pattern 47 is arranged so as to overlap with the ground pattern 47 all the front electronic components 42 except for the first front electronic component 42a when viewed in the front-to-back direction. Furthermore, in the present embodiment, the ground pattern 47 is arranged so as to overlap with the ground pattern 47 all the rear electronic components 43 when viewed in the front-to-back direction. In addition, when viewed in the front-to-back direction, the ground pattern 47 may be arranged so as to overlap with the ground pattern 47 all the front electronic components 42, or may be arranged so as not to overlap with the ground pattern 47 some of the rear electronic components 43. Furthermore, it may be arranged so as not to overlap with the ground pattern 47 all the front electronic components 42 and / or all the rear electronic components 43.

[0106] The ground pattern 47 is made of a conductor such as copper or silver and is formed by a common processing method (such as etching) for providing a wiring pattern on a printed circuit board. In this embodiment, the substrate 40 is formed to have multiple layers, and the ground pattern 47 is arranged on one of the layers.

[0107] In the present embodiment, the ground pattern 47 is electrically connected to the inner surface of at least a portion of the opening 46 on the substrate. In particular, in the present embodiment, the ground pattern 47 is electrically connected to the inner surface of at least a portion of the opening 46a on the first substrate. As a result, the ground pattern 47 is electrically connected to the front metal plate 28 via the first connecting member 81 inserted into the opening 46a on the first substrate. Therefore, the front metal plate 28 is electrically connected to the ground potential via the first connecting member 81. In addition, in the present embodiment, the ground pattern 47 is electrically connected to the inner surface of the opening 46b on the second substrate (when there are a plurality of openings 46b on the second substrate, it is the inner surface of at least a portion of the opening 46b on the second substrate). As a result, the ground pattern 47 is electrically connected to the rear metal plate 50 via the second connecting member 82 inserted into the opening 46b on the second substrate. Therefore, the rear metal plate 50 is electrically connected to the ground potential via the second connecting member 82.

[0108] In addition, the ground pattern 47 is connected to the inner surface of at least a part of the opening 46 on the substrate in a thermally movable manner. In particular, the ground pattern 47 is connected to the inner surface of at least a part of the first opening 46a on the substrate in a thermally movable manner. As a result, the ground pattern 47 is connected to the front metal plate 28 in a thermally movable manner via the first connecting member 81 inserted into the first opening 46a on the substrate. In addition, the ground pattern 47 is connected to the inner surface of the second opening 46b on the substrate (or the inner surface of at least a part of the second opening 46b on the substrate when there are a plurality of second openings 46b on the substrate) in a thermally movable manner. As a result, the ground pattern 47 is connected to the rear metal plate 50 in a thermally movable manner via the second connecting member 82 inserted into the second opening 46b on the substrate.

[0109] In addition, in the present embodiment, the ground pattern 47 is electrically connected to all or part of the electronic components 41 provided on the substrate 40 and is connected in a manner that allows heat transfer. Specifically, the ground pattern 47 extends to the vicinity of these electronic components 41 in a manner that contacts part of the terminals of all or part of the electronic components 41 provided on the substrate 40.

[0110] In addition, in the present embodiment, the first substrate opening 46a and the second substrate opening 46b are both connected to the same ground pattern 47, and the front electronic component 42 and the rear electronic component 43 are both connected to the same ground pattern 47. However, the substrate 40 may also have a plurality of ground patterns. In this case, the first substrate opening 46a and the second substrate opening 46b may be electrically connected to mutually different ground patterns and connected in a manner that allows heat transfer, or the front electronic component 42 and the rear electronic component 43 may be electrically connected to mutually different ground patterns and connected in a manner that allows heat transfer. In this case, at least a portion of the front electronic component 42 is arranged in a manner that overlaps with the ground pattern connected to the front electronic component 42 when viewed in the front-to-back direction. In addition, at least a portion of the rear electronic component 43 is arranged in a manner that overlaps with the ground pattern connected to the rear electronic component 43 when viewed in the front-to-back direction.

[0111] Furthermore, the substrate 40 may also have one or more wiring patterns that are different from the ground pattern 47 (not electrically connected to the ground potential of the electronic device 1). In this case, the first substrate opening 46a and / or the second substrate opening 46b may be connected to a wiring pattern different from the ground pattern 47 in addition to the ground pattern 47 or may be connected to a wiring pattern different from the ground pattern 47 instead of the ground pattern 47. In this case, the first substrate opening 46a and the second substrate opening 46b may be connected to the same wiring pattern different from the ground pattern 47 or may be connected to respective wiring patterns different from the ground pattern 47. In summary, the front metal plate 28 is electrically connected to the second wiring pattern of the substrate 40 via the first substrate opening 46a and the first connector 81 inserted into the first substrate opening 46a and connected in a heat transferable manner, and the rear metal plate 50 is electrically connected to the first wiring pattern of the substrate 40 via the second substrate opening 46b and the second connector 82 inserted into the second substrate opening 46b and connected in a heat transferable manner. Furthermore, the first wiring pattern and the second wiring pattern may be the same wiring pattern or different wiring patterns. In addition, the first wiring pattern and the second wiring pattern may be ground patterns electrically connected to the ground potential of the electronic device 1 or different wiring patterns from the ground patterns.

[0112] Similarly, the front electronic component 42 and the rear electronic component 43 may be connected to a wiring pattern different from the ground pattern 47 in addition to the ground pattern 47 or may be connected to a wiring pattern different from the ground pattern 47 instead of the ground pattern 47. At this time, the front electronic component 42 and the rear electronic component 43 may be connected to the same wiring pattern different from the ground pattern 47 or to each wiring pattern different from the ground pattern 47. To summarize the above, the front electronic component 42 is electrically connected to the first wiring pattern of the substrate 40 and is connected in a way that allows heat transfer, and the rear electronic component 43 is electrically connected to the second wiring pattern of the substrate 40 and is connected in a way that allows heat transfer. Moreover, the first wiring pattern and the second wiring pattern may be the same wiring pattern or may be wiring patterns different from each other. In addition, the first wiring pattern and the second wiring pattern may be ground patterns electrically connected to the ground potential of the electronic device 1 or may be wiring patterns different from the ground pattern.

[0113] In addition, in the present embodiment, the ground pattern 47 is formed by a common processing method, but the ground pattern 47 or other wiring patterns connected to the first substrate opening 46a and / or the second substrate opening 46b may be wiring patterns formed as a film sheet fixed to the substrate formed as a resin film. Alternatively, the ground pattern 47 or other wiring patterns connected to the first substrate opening 46a and / or the second substrate opening 46b may be wiring patterns formed by conductive ink printed between two resin films (e.g., polyester sheets).

[0114] In addition, in this embodiment, if Figure 4 As shown in the figure, the ground pattern 47 is not provided around the first front electronic component 42a. In addition, no wiring pattern other than the wiring pattern for connecting to the first front electronic component 42a is provided around the first front electronic component 42a. Therefore, the situation that heat is conducted to the first front electronic component 42a, which is not heat-resistant, via the wiring pattern provided on the substrate 40 is suppressed, and the situation that the first front electronic component 42a malfunctions due to heat is suppressed. In particular, in the present embodiment, the first front electronic component 42a is a component including a memory or a storage IC capable of rewriting information, and therefore, it is not easy to cause malfunctions due to rewriting or the like due to heat.

[0115] In addition, the substrate 40 may have a metal pattern different from the ground pattern 47 and the wiring pattern other than the ground pattern 47. The metal pattern is connected to at least one of the inner surfaces of the first substrate opening 46a and the second substrate opening 46b in a manner that allows heat transfer. Even if the substrate 40 has the ground pattern 47 or other wiring patterns, the metal pattern is not connected to the ground pattern 47 or other wiring patterns. The metal pattern allows heat of the substrate 40 to be transferred to at least one of the front metal plate 28 and the rear metal plate 50.

[0116] Rear metal plate

[0117] Next, refer to Figure 2 , Figure 6 and Figure 7 The rear metal plate 50 will be described. Figure 7 It is an electronic device 1 along Figure 5 The rear metal plate 50 is an example of a member located behind the substrate 40 for dissipating heat generated in the electronic component 41. Figure 2 As shown, the rear metal plate 50 is formed in a plate shape.

[0118] The rear metal plate 50 is formed of a metal such as magnesium or aluminum. In particular, in the present embodiment, the rear metal plate 50 is formed of a material having a higher thermal conductivity and a larger specific gravity than the front metal plate 28. Thus, for example, the front metal plate 28 is formed of magnesium and the rear metal plate 50 is formed of aluminum. In addition, in the present embodiment, when viewed in the front-rear direction, the area of ​​the rear metal plate 50 is smaller than the area of ​​the front metal plate 28.

[0119] like Figure 2 As shown, the rear metal plate 50 has a shape that hardly overlaps with the fan 60 when viewed in the front-to-back direction. In the present embodiment, the rear metal plate 50 is formed and configured in a manner that overlaps with the substrate 40 and the battery 75 when viewed in the front-to-back direction. In particular, in the present embodiment, the rear metal plate 50 is formed in the shape of the letter U in a manner that surrounds the fan 60 when viewed in the front-to-back direction. In addition, in the present embodiment, the rear metal plate 50 is configured in a manner that is located in the spaces X1 and X2 between each air inlet 35 and the inlet 61 of the fan 60 when viewed in the front-to-back direction. Specifically, the rear metal plate 50 is located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60, and is located in the space X2 between the right air inlet 35b and the inlet 61 of the fan 60.

[0120] Alternatively, the rear metal plate 50 may be partially located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60. Similarly, the rear metal plate 50 may be partially located in the space X2 between the right air inlet 35b and the inlet 61 of the fan 60.

[0121] The rear metal plate 50 has a plurality of metal plate openings 51. The metal plate openings 51 are openings through which the third connecting member 83 for attaching the rear metal plate 50 to the front housing half 20 (particularly the front metal plate 28) or the second connecting member 82 for attaching the rear metal plate 50 to the base plate 40 passes. Figure 2 and Figure 4 It can be seen that the opening 51a on the first metal plate through which the third connecting member 83 for mounting the rear metal plate 50 on the front housing half body 20 passes is arranged at a position corresponding to the metal plate connecting hole 27b of the front housing half body 20. In addition, the opening 51b on the second metal plate through which the second connecting member 82 for mounting the rear metal plate 50 on the substrate 40 passes is arranged at a position corresponding to the second substrate opening 46b provided on the substrate 40. Figure 2 As shown in FIG. 1 , the number of openings 51 a on the first metal plate is greater than the number of openings 51 b on the second metal plate. In particular, in this embodiment, only one second metal plate opening 51 b is provided on the rear metal plate 50 .

[0122] In addition, in the present embodiment, the rear metal plate 50 is formed as a member independent of the rear housing half body 30. However, the rear metal plate 50 may be formed as the rear main wall 31 of the rear housing half body 30 or a part thereof. In this case, the rear metal plate 50 is formed as a part of the rear housing half body 30 in a manner exposed on the front surface of the rear housing half body 30 formed integrally, for example. Therefore, at least a part of the housing 10 is formed by the front metal plate 28 or the rear metal plate 50.

[0123] fan

[0124] Next, refer to Figure 2 and Figure 7 The fan 60 is described. The fan 60 is a device that sucks air from an inlet 61 and discharges the sucked air from an outlet 62. In the present embodiment, the fan 60 is mounted on the front housing half body 20 (particularly the front metal plate 28) at the rear of the front housing half body 20. In particular, in the present embodiment, the fan 60 is mounted in a manner that a gap is formed between the rear surface of the front housing half body 20 and the front surface of the fan 60. In addition, the fan 60 is configured in a manner that is located above the center of the housing 10 when viewed in the front-to-back direction. The fan 60 has an inlet 61 provided on the front and rear surfaces thereof and an outlet 62 provided on the top.

[0125] The inlet 61 has a first inlet 61a provided on the rear surface side and a second inlet 61b provided on the front surface side. Figure 2 and Figure 7 As shown, the first inlet 61a and the second inlet 61b are both formed into an annular shape of the same shape. In addition, the fan 60 may also have the inlet 61 only on the rear surface side. Alternatively, the fan 60 may also have an inlet located below, on the left and / or on the right of the fan 60 in addition to the first inlet 61a and / or the second inlet 61b, or may have an inlet located below, on the left and / or on the right of the fan 60 instead of the first inlet 61a and / or the second inlet 61b.

[0126] The outlet 62 is provided above the fan 60. The outlet 62 is arranged so as to face the exhaust port 34 of the rear housing half 30. In addition, the outlet 62 may be arranged in any direction of the fan 60 as long as it faces the exhaust port 34 of the housing 10. For example, when the exhaust port 34 of the housing 10 is formed on the left wall 15 or the right wall 16 of the housing 10 (the left side wall 22 or the right side wall 23 of the front housing half 20), the fan 60 is arranged so that its outlet 62 faces the width direction.

[0127] When the fan 60 thus constructed is driven, air is sucked from the outside of the electronic device 1 into the air inlet 35 of the rear shell half 30. Then, the air sucked into the air inlet 35 is sucked into the fan 60 from the inlet 61 of the fan 60 through the shell 10. At this time, the air sucked from the left air inlet 35a mainly flows through the space X1 between the left air inlet 35a and the inlet 61 of the fan 60. Similarly, the air sucked from the right air inlet 35b mainly flows through the space X2 between the right air inlet 35b and the inlet 61 of the fan 60. The air sucked into the fan 60 is discharged from the fan 60 via the outlet 62, and the discharged air flows upward in the shell 10 and flows out to the outside of the electronic device 1 from the exhaust port 34 of the rear shell half 30. In this embodiment, since the heat sink 72 is disposed between the outlet 62 of the fan 60 and the exhaust port 34 , the air flowing out of the outlet 62 of the fan 60 flows through the heat sink 72 and then flows out of the electronic device 1 through the exhaust port 34 .

[0128] Other components

[0129] Next, refer to Figure 2 , Figures 5 to 8 The heat pipe 70 , the heat sink 72 , the battery 75 , and the connectors 81 - 83 are described.

[0130] The heat pipe 70 is an example of a member that transfers heat generated by the rear electronic component 43 to the heat sink 72. The heat pipe 70 is a pipe made of a heat-conductive metal such as copper or aluminum in which a liquid is sealed. Figure 5 and Figure 6 As shown, one end of the heat pipe 70 is arranged behind the mounting member 45 in contact with the mounting member 45. Therefore, part of the heat generated by the rear electronic component 43 moves to the heat pipe 70 via the shielding member 44 and the mounting member 45. In addition, the other end of the heat pipe 70 is connected to the heat sink 72 in a heat transfer manner. Therefore, the heat transferred through the heat pipe 70 moves to the heat sink 72.

[0131] In addition, as long as the heat generated by the rear electronic component 43 can be moved to the heat sink 72, components other than the heat pipe 70 can be used. Therefore, for example, a vacuum chamber heat spreader or the like can be used instead of the heat pipe 70. In addition, the heat pipe 70 can also be arranged in a manner that it is not in contact with the mounting member 45 but is in direct contact with the shielding member 44 or the rear electronic component 43. In short, as long as the rear electronic component 43, especially the rear electronic component 43 with the largest average heat generation or maximum heat generation, is configured to move the heat to the heat pipe 70, the heat pipe 70 can be arranged in any manner.

[0132] The heat sink 72 is an example of a heat dissipation component for dissipating heat, and releases the heat transferred via the heat pipe 70 into the air. In the present embodiment, the heat sink 72 has a plurality of heat sinks extending in the up-down direction. The heat sink 72 is connected to the heat pipe 70 in a manner that enables heat transfer. In addition, the heat sink 72 is arranged above the outlet 62 of the fan 60 and below the exhaust port 34 of the housing 10. Therefore, the heat sink 72 is arranged between the outlet 62 of the fan 60 and the exhaust port 34. In the heat sink 72 configured in this way, when the air flowing out of the outlet 62 of the fan 60 flows through between the heat sinks, the heat is transferred from the heat sink 72 to the air.

[0133] The battery 75 is a component that stores electric power. In the present embodiment, the battery 75 is a rechargeable and dischargeable secondary battery. The battery 75 supplies electric power to the electronic component 41 and the display panel 5. The battery 75 is a relatively large component in the electronic device 1 and is held in the frame 26 formed in the front housing half 20.

[0134] Furthermore, in the present embodiment, the battery 75 is configured so as to be at least partially located in the space X1 between the left air inlet 35a and the inlet 61 of the fan 60. Furthermore, the battery 75 is configured so as not to be located in the space X2 between the right air inlet 35b and the inlet 61 of the fan 60. However, the battery 75 may be configured so as to be located in either of the two spaces X1 and X2, or may be configured so as not to be located in either of them. Furthermore, the battery 75 may be configured so as to be at a distance from the space X2 between the right air inlet 35b and the inlet 61 of the fan 60 greater than the distance from the space X1 between the left air inlet 35a and the inlet 61 of the fan 60.

[0135] The connectors 81 to 83 are used to mutually mount the front housing half 20 (particularly the front metal plate 28), the base plate 40 and the rear metal plate 50. In the present embodiment, the connectors 81 to 83 are made of metal, but they may be formed of other materials as long as they are thermally conductive and electrically conductive.

[0136] Figure 8 8 is a cross-sectional view schematically showing how the front metal plate 28, the base plate 40, and the rear metal plate 50 are mounted together using the connecting members 81 to 83. Figure 8 As shown, the first connector 81 passes through the first substrate opening 46a formed on the substrate 40 and is attached to the substrate connection hole 27a of the front metal plate 28. As a result, the substrate 40 is fixed to the front metal plate 28, and the substrate 40 and the front metal plate 28 are connected in a manner that allows heat transfer. In addition, the ground pattern 47 of the substrate 40 is electrically connected to the front metal plate 28.

[0137] The second connecting member 82 passes through the second substrate opening 46b formed on the substrate 40 and the second metal plate opening 51b formed on the rear metal plate 50, and is fixed by a nut. As a result, the substrate 40 is fixed to the rear metal plate 50, and the substrate 40 and the rear metal plate 50 are connected in a manner that allows thermal transfer. In addition, the ground pattern 47 of the substrate 40 is electrically connected to the rear metal plate 50. The third connecting member 83 passes through the metal plate connecting hole 27b formed on the first metal plate 51a of the rear metal plate 50 and is mounted on the front metal plate 28. As a result, the rear metal plate 50 is fixed to the front metal plate 28, and the rear metal plate 50 and the front metal plate 28 are connected in a manner that allows thermal transfer. In addition, the rear metal plate 50 and the front metal plate 28 are electrically connected.

[0138] Relationships between components

[0139] Next, refer to Figure 6 and Figure 7 The relationship between the components of the electronic device 1 is described below. Figure 6and Figure 7 As shown, the front metal plate 28 is located in front of the substrate 40. When the fan 60 is driven, the air flowing into the housing 10 through the air inlet 35 flows to the space between the front surface (second surface) of the substrate 40 and the rear surface of the front metal plate 28. Therefore, an air flow path (second flow path. hereinafter referred to as "front flow path") 91 is formed between the front surface of the substrate 40 and the rear surface of the front metal plate 28. In addition, in the case where the front metal plate 28 is a component independent of the front main wall 21 of the front housing half body 20 as described above, the front flow path 91 is formed between the front surface of the substrate 40 and the rear surface of the front metal plate 28 or the rear surface of the front main wall 21. Therefore, the front flow path 91 is formed between the front surface of the substrate 40 and the front surface side opposite surface (second opposite surface) opposite to the front surface of the substrate 40. In other words, the front flow path 91 includes the space between the front surface of the substrate 40 and the front surface side opposite surface. The front flow path 91 guides the air that has flowed into the casing 10 through the air intake port 35 toward the inlet port 61 of the fan 60 .

[0140] like Figure 7 As shown, the front electronic components 42 are arranged in the front flow path 91. In particular, the components having the largest average or maximum calorific value among the front electronic components 42 are arranged in the front flow path 91.

[0141] In addition, if Figure 6 and Figure 7 As shown, the rear metal plate 50 and the rear main wall 31 are located behind the base plate 40. When the fan 60 is driven, the air flowing into the housing 10 through the air inlet 35 flows to the space between the rear surface (first surface) of the base plate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31. Therefore, an air flow path (first flow path. hereinafter referred to as "rear flow path") 92 is formed between the rear surface of the base plate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31. In addition, in the case where the rear metal plate 50 is formed as a whole with the rear main wall 31 of the rear housing half body 30 as described above, the rear flow path 92 is formed between the rear surface of the base plate 40 and the front surface of the rear metal plate 50. Therefore, the rear flow path 92 is formed between the rear surface of the base plate 40 and the rear surface side opposite to the rear surface of the base plate 40 (first opposite surface). In other words, the rear flow path 92 includes a space between the rear surface and the rear surface-side opposing surface of the substrate 40. The rear flow path 92 guides the air flowing into the housing 10 through the air inlet 35 toward the inlet 61 of the fan 60.

[0142] like Figure 6 As shown, the rear electronic components 43 are arranged in the rear flow path 92. In particular, the rear electronic components 43 having the largest average or maximum calorific value are arranged in the rear flow path 92.

[0143] Furthermore, in the present embodiment, in the front-to-back direction, the distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31 is longer than the distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28. Therefore, the distance in the front-to-back direction of the rear flow path 92 provided with the rear electronic component 43 having a larger heat generation is longer than the distance in the front-to-back direction of the front flow path 91 provided with the front electronic component 42 having a smaller heat generation. Figure 6 and Figure 7 In the example shown, the distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28 is constant. In addition, the distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 is constant. However, for example, in the case where the front metal plate 28 or the rear metal plate 50 has a concave-convex shape, the distance between the front surface of the substrate 40 and the rear surface of the front metal plate 28 and the distance between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 are not constant. In such a case, the average distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31 is longer than the average distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28. Alternatively, the maximum distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31 is longer than the maximum distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28.

[0144] Furthermore, the fan 60 has a rear surface 63 (the first surface of the fan) and a front surface 64 (the second surface of the fan) on the opposite side of the rear surface 63. The rear surface 63 is provided with a first inlet 61a, and the front surface 64 is provided with a second inlet 61b. Figure 7 As shown, the rear surface 63 of the fan 60 is opposite to the rear main wall 31, and the front surface 64 of the fan 60 is opposite to the front metal plate 28. In the present embodiment, the distance between the rear surface 63 of the fan 60 and the front surface 64 of the rear main wall 31 as the opposite surface is longer than the distance between the front surface 64 of the fan 60 and the rear surface of the front metal plate 28 as the opposite surface. Therefore, the distance between the first inlet 61a formed on the rear surface 63 of the fan 60 and the front surface of the rear main wall 31 (that is, the opposite surface of the rear surface 63 of the fan 60) is longer than the distance between the second inlet 61b formed on the front surface 64 of the fan 60 and the rear surface of the front metal plate 28 (that is, the opposite surface of the front surface 64 of the fan 60).

[0145] In addition, in this embodiment, if Figure 6As shown, in the area near the mounting member 45, a rear thermally conductive sheet 86 is provided between the heat pipe 70 and the rear metal plate 50. The rear thermally conductive sheet 86 is a sheet having thermal conductivity. The rear thermally conductive sheet 86 is arranged in contact with the heat pipe 70 and the rear metal plate 50. Therefore, heat moves between the mounting member 45 and the rear metal plate 50 via the rear thermally conductive sheet 86. As a result, between the rear electronic component 43, especially the first rear electronic component 43a, and the rear metal plate 50, the shielding member 44, the mounting member 45, the heat pipe 70, and the rear thermally conductive sheet 86 are arranged in layers in the front-to-rear direction, and these members are connected to each other in a manner that allows heat to move. Therefore, the shielding member 44, the mounting member 45, the heat pipe 70 and the rear thermally conductive sheet 86 function as a thermally conductive connecting member (first connecting member) that connects the rear electronic component 43, especially the first rear electronic component 43a, and the rear metal plate 50 to each other in a heat transferable manner. Therefore, when the heat generation of the rear electronic component 43, especially the first rear electronic component 43a, is large, the generated heat is transferred to the heat sink 72 via the heat pipe 70 and transferred to the rear metal plate 50 via the above-mentioned layered components.

[0146] In addition, the rear thermally conductive sheet 86 may be arranged in any manner as long as it can connect at least one rear electronic component 43 and the rear metal plate 50 in a manner that allows heat transfer. Therefore, for example, it may be arranged in a manner that contacts both the rear electronic component 43 and the rear metal plate 50. In addition, other elements may be used in place of the rear thermally conductive sheet 86 as long as they are thermally conductive elements. Therefore, thermally conductive grease may be used in place of the rear thermally conductive sheet 86.

[0147] In addition, in this embodiment, if Figure 8 As shown, the substrate 40 and the rear metal plate 50 are mounted together by the second connecting member 82 having thermal conductivity. Therefore, the substrate 40 and the rear metal plate 50 are connected to each other by the second connecting member 82 in a manner that allows heat transfer. Therefore, the second connecting member 82 functions as a thermally conductive connecting member (first connecting member) that connects the substrate 40 and the rear metal plate 50 to each other in a manner that allows heat transfer without interposing the rear electronic component 43. In addition, as the connecting member, a member other than a connecting member such as a screw or a bolt may be used as long as it is a thermally conductive member that is connected in a manner that allows heat transfer.

[0148] Furthermore, in this embodiment, if Figure 7As shown, a front thermal conductive sheet 85 is provided between the second front electronic component 42b and the front metal plate 28 in the front-to-back direction. The front thermal conductive sheet 85 is a sheet having thermal conductivity. The front thermal conductive sheet 85 is arranged in a manner of contacting the second front electronic component 42b and the front metal plate 28. Therefore, between the second front electronic component 42b and the front metal plate 28, heat moves via the front thermal conductive sheet 85. Therefore, the front thermal conductive sheet 85 functions as a thermally conductive connecting member (second connecting member) that connects the front electronic component 42 and the front metal plate 28 to each other in a manner that allows heat to move. Therefore, when the heat generated by the second front electronic component 42b is large, the generated heat is conducted to the front metal plate 28 via the front thermal conductive sheet 85.

[0149] In addition, the front thermally conductive sheet 85 may be arranged in any manner as long as it can connect at least one front electronic component 42 and the front metal plate 28 in a manner that allows heat transfer. Therefore, for example, other components having thermal conductivity may be arranged between the front electronic component 42 and the front thermally conductive sheet 85 or between the front metal plate 28 and the front thermally conductive sheet 85. In addition, other components may be used in place of the front thermally conductive sheet 85 as long as they are thermally conductive components. Therefore, thermally conductive grease may be used in place of the front thermally conductive sheet 85.

[0150] In addition, in this embodiment, if Figure 8 As shown, the substrate 40 and the front metal plate 28 are mounted together using the first connecting member 81 having thermal conductivity. Therefore, the substrate 40 and the front metal plate 28 are connected to each other by the first connecting member 81 in a manner that allows heat transfer. Therefore, the first connecting member 81 functions as a thermally conductive connecting member (second connecting member) that connects the substrate 40 and the front metal plate 28 to each other in a manner that allows heat transfer without interposing the front electronic component 42. In addition, as the connecting member, a member other than a connecting member such as a screw or a bolt may be used as long as it is a thermally conductive member that is connected in a manner that allows heat transfer.

[0151] In addition, as described above, in the present embodiment, the number of the first connecting member 81 is greater than the number of the second connecting member 82. Therefore, the first connecting member 81 is configured to be easier to conduct heat than the second connecting member. In addition, as long as the first connecting member 81 is configured to be easier to conduct heat than the second connecting member, the first connecting member 81 and the second connecting member 82 may be configured in any manner. Therefore, for example, the first connecting member 81 having a relatively large cross-sectional area and the second connecting member 82 having a relatively small cross-sectional area may be provided with the same number. Alternatively, the first connecting member 81 may be formed of a material having a higher thermal conductivity than the second connecting member 82. In this case, the number of the first connecting member 81 and the number of the second connecting member 82 may also be the same.

[0152] Furthermore, in the present embodiment, the number of the first connecting member including the first connecting member 81 and the front thermally conductive sheet 85 is greater than the number of the second connecting member including the second connecting member 82 and the rear thermally conductive sheet 86. Therefore, the first connecting member is configured to be easier to conduct heat than the second connecting member. In addition, as long as the first connecting member is configured to be easier to conduct heat than the second connecting member, the first connecting member and the second connecting member may be configured in any manner. Therefore, for example, the first connecting member having a relatively large cross-sectional area and the second connecting member having a relatively small cross-sectional area may be provided in the same number. Alternatively, the first connecting member may be formed of a material having a higher thermal conductivity than the second connecting member. In this case, the number of the first connecting member and the number of the second connecting member may be the same.

[0153] Furthermore, in this embodiment, if Figure 8 As shown, the front metal plate 28 and the rear metal plate 50 are mounted together by the third connecting member 83 having thermal conductivity. Therefore, the front metal plate 28 and the rear metal plate 50 are connected by the third connecting member 83 in a heat transferable manner. Therefore, the third connecting member 83 functions as a heat conductive connecting member (third connecting member) that connects the front metal plate 28 and the rear metal plate 50 to each other in a heat transferable manner. In addition, as the connecting member, a member other than a connecting member such as a screw or a bolt may be used as long as it is a heat conductive member that is connected in a heat transferable manner.

[0154] Effect

[0155] In the present embodiment, the distance in the front-to-back direction of the rear flow path 92 where the rear electronic component 43 generating a large amount of heat is provided is longer than the distance in the front-to-back direction of the front flow path 91 where the front electronic component 42 generating a small amount of heat is provided. Therefore, the flow rate of air flowing through the rear flow path 92 where the rear electronic component 43 generating a large amount of heat is provided is greater than the flow rate of air flowing through the front flow path 91, so that heat can be easily dissipated from the rear electronic component 43. As a result, the heat generated from the electronic component 41 generating heat can be effectively dissipated.

[0156] Furthermore, in the present embodiment, the front metal plate 28 is disposed opposite to the front surface of the substrate 40, and the rear metal plate 50 is disposed opposite to the rear surface of the substrate 40. By disposing the metal plates 28 and 50 having high thermal conductivity on the front and rear surfaces of the substrate 40, the heat generated in the electronic component 41 and the substrate 40 can be diffused, and as a result, the heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0157] Furthermore, in the present embodiment, the rear metal plate 50 is connected to the rear electronic component 43 and the substrate 40 by means of connection members such as the second connector 82 and the rear thermally conductive sheet 86. As a result, the heat of the rear electronic component 43 and the substrate 40 can be dissipated to the air flowing in the rear flow path 92 via the rear metal plate 50. Similarly, in the present embodiment, the front metal plate 28 is connected to the front electronic component 42 and the substrate 40 by means of connection members such as the first connector 81 and the front thermally conductive sheet 85. As a result, the heat of the front electronic component 42 and the substrate 40 can be dissipated to the air flowing in the front flow path 91 via the front metal plate 28.

[0158] In addition, in the present embodiment, the second connector 82 connects the rear metal plate 50 and the first wiring pattern in a manner that allows heat transfer. Similarly, the first connector 81 connects the front metal plate 28 and the second wiring pattern in a manner that allows heat transfer. As a result, since the wiring pattern provided on the substrate 40 promotes the transfer of heat, the heat of the substrate 40 can be quickly transferred to the metal plates 28 and 50 via the second connector 82 and the first connector 81.

[0159] Furthermore, in the present embodiment, the first wiring pattern and the second wiring pattern are electrically connected to the ground potential, and the rear metal plate 50 connected to the first wiring pattern overlaps with the rear electronic component 43 when viewed in the front-to-back direction, and the front metal plate 28 connected to the second wiring pattern overlaps with the front electronic component 42 when viewed in the front-to-back direction. As a result, the metal plates 28 and 50 are connected to the ground potential, and noise generated from the electronic component 41 is suppressed.

[0160] In addition, in the present embodiment, the distance between the rear surface of the fan 60 and the front surface of the rear main wall 31 as the opposite surface thereof is longer than the distance between the front surface of the fan 60 and the rear surface of the front metal plate 28 as the opposite surface thereof. As a result, the flow rate of the air flowing in the rear flow path 92 communicating with the rear surface side of the fan 60 is likely to be greater than the flow rate of the air flowing in the front flow path 91 communicating with the front surface side of the fan 60, and thus it is easy to dissipate heat from the rear electronic component 43. As a result, the heat generated from the heat-generating electronic component 41 can be effectively dissipated. In addition, in the present embodiment, the inflow port is provided on both sides of the front surface and the rear surface of the fan 60, and as a result, the situation in which the flow rate of the air in the front flow path 91 and the rear flow path 92 communicating with the front surface side and the rear surface side of the fan 60 respectively changes significantly can be suppressed, and the heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0161] Furthermore, in the present embodiment, the distance between the first inlet 61a formed on the rear surface 63 of the fan 60 and the opposite surface of the rear surface 63 of the fan 60 is longer than the distance between the second inlet 61b formed on the front surface 64 of the fan 60 and the front surface 64 of the fan 60. As a result, a wide space is formed near the inlet on the rear surface side of the fan 60, so that heat can be easily dissipated on the rear surface side of the fan 60, and thus heat can be easily dissipated from the rear electronic component 43.

[0162] Furthermore, in the present embodiment, the second front electronic component 42b having the largest average or maximum calorific value among the front electronic components 42 and the first rear electronic component 43a having the largest average or maximum calorific value among the rear electronic components 43 are arranged in the space between each of the plurality of air inlets 35 and the inlet 61 of the fan 60. As a result, the electronic component 41 having a large calorific value is arranged in the main air passage in the housing 10, so that the heat dissipation from the electronic component 41 having a large calorific value can be promoted. In particular, in the present embodiment, since the second front electronic component 42b having the largest average or maximum calorific value among the front electronic components 42 and the first rear electronic component 43a having the largest average or maximum calorific value among the rear electronic components 43 are arranged in the space between each of the air inlets 35 and the inlet 61 of the fan 60, the influence of the components having a large calorific value on each other can be suppressed to a minimum, so that the heat generated from the electronic component 41 having a large calorific value can be effectively dissipated.

[0163] In addition, in the present embodiment, the battery 75 is arranged near the space between the left air inlet 35a and the inlet 61 of the fan 60, where the front electronic component 42 having a smaller heat generation than the rear electronic component 43 is located. Since the battery 75 is a relatively large component among the components of the electronic device 1, it is easy to become a flow path resistance if it is arranged near the flow path of the air. In the present embodiment, by arranging the battery 75 away from the space between the right air inlet 35b and the inlet 61 of the fan 60, where the rear electronic component 43 having a larger heat generation is located, the air is easy to flow toward the rear electronic component 43 having a larger heat generation, so that the heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0164] Furthermore, in the present embodiment, the substrate 40 and the front metal plate 28 are connected in a heat transferable manner using a first connection member including a first connector 81 and a front heat conductive sheet 85. Since the substrate 40 and the front metal plate 28 are connected in a heat transferable manner in this way, a part of the heat of the substrate 40 can be dissipated to the air flowing in the front flow path 91 via the first connection member and the front metal plate 28. As a result, the heat of the substrate 40 is not easily dissipated to the air flowing in the rear flow path 92 where the rear electronic component 43 is arranged, and the heat dissipation to the air flowing in the rear flow path 92 of the rear electronic component 43 with a large heat generation can be promoted. Therefore, the heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0165] In addition, in the present embodiment, the number of the first connecting members including the first connecting member 81 and the front heat conductive sheet 85 is greater than the number of the second connecting members including the second connecting member 82 and the rear heat conductive sheet 86. Therefore, the first connecting member is configured to be easier to conduct heat than the second connecting member. As a result, the heat of the substrate 40 can be conducted to the front metal plate 28 more via the first connecting member. Therefore, the heat of the substrate 40 is not easily dissipated to the rear flow path 92 where the rear electronic component 43 is arranged, and the heat dissipation to the air flowing in the rear flow path 92 of the rear electronic component 43 with a larger heat generation can be promoted. Therefore, the heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0166] In addition, in the present embodiment, the first connection member including the first connection member 81 and the front thermal conductive sheet 85 is made of a material having a higher thermal conductivity than the second connection member including the second connection member 82 and the rear thermal conductive sheet 86. Therefore, the first connection member is configured to conduct heat more easily than the second connection member. As a result, the heat generated by the heat-generating electronic component 41 can be effectively dissipated.

[0167] Furthermore, in this embodiment, in addition to the first and second connection members, a third connection member is provided, and the third connection member includes a third connector 83 that connects the front metal plate 28 and the rear metal plate 50 in a heat transferable manner. As a result, heat can be dispersed in the front metal plate 28 and the rear metal plate 50, so that local heat generation can be suppressed.

[0168] In addition, in the present embodiment, the wiring pattern connected to the front electronic component 42 in a heat-transferable manner is connected to the first connecting member in a heat-transferable manner. Therefore, the heat generated by the front electronic component 42 can be transferred to the front metal plate 28 via the wiring pattern and the first connecting member. As a result, the heat generated by the front electronic component 42 can be dispersed to the front metal plate 28, and the generation of local heat can be suppressed.

[0169] In addition, in the present embodiment, the rear metal plate 50 and the front metal plate 28 are electrically connected to the ground potential, and the rear metal plate 50 overlaps with the rear electronic component 43 when viewed in the front-back direction, and the front metal plate 28 overlaps with the front electronic component 42 when viewed in the front-back direction. As a result, the metal plates 28 and 50 are connected to the ground potential, and noise generated from the electronic component 41 is suppressed.

[0170] In addition, in the present embodiment, the front electronic component 42 and the rear electronic component 43 are arranged at positions that do not overlap each other in the front-to-back direction. Thus, the heat generated in the substrate 40 is dispersed. In addition, the air flowing in from each air inlet flows toward the front electronic component 42 and the rear electronic component 43, thereby effectively dissipating the heat generated by the heat-generating electronic component 41.

[0171] Furthermore, in the present embodiment, the metal constituting the rear metal plate 50 has a lower thermal conductivity and a larger specific gravity than the metal constituting the front metal plate 28. Therefore, the metal plate on the side of the rear electronic component 43, which generates relatively more heat, has a higher thermal conductivity, and the heat is easily dispersed, and the weight of the metal plate on the side of the front electronic component 42, which generates relatively less heat, can be reduced. Therefore, the heat generated from the electronic component 41 can be effectively dissipated while suppressing the increase in the overall weight of the electronic device 1. In particular, by reducing the area of ​​the rear metal plate 50 while arranging the rear metal plate 50 in a manner opposite to the first rear electronic component 43a, which generates the most heat, the weight increase of the electronic device 1 can be suppressed while suppressing the decrease in the heat dissipation effect.

[0172] In addition, in this embodiment, the front metal plate 28 is surrounded by a resin member. If the area of ​​the metal frame is increased, it will be weaker against plastic deformation such as bending, but in this embodiment, since the front metal plate 28 is surrounded by a resin member, plastic deformation can be suppressed.

[0173] In this embodiment, the resin member is configured not to substantially cover the front and rear surfaces of the front metal plate 28. Therefore, heat can be easily dissipated forward from the front metal plate 28, and the provision of the resin member can suppress a decrease in rigidity of the electronic device 1.

[0174] In addition, in the present embodiment, the heat generated from the front electronic component 42 is dissipated via a thermally conductive sheet or the like, and the heat generated from the rear electronic component 43 is dissipated via a heat pipe or the like. In this way, by dissipating the heat generated from the rear electronic component 43 having a relatively large heat generation via a heat pipe or the like having a large heat dissipation effect, the heat generated from the front electronic component 42 having a relatively small heat generation is dissipated without using a heat pipe or the like occupying a space in the electronic device 1, thereby improving the heat dissipation effect and achieving space saving.

[0175] Although preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.

Claims

1. An electronic device, in which air from outside flows in and out of the electronic device, wherein: The electronic device has: a housing having an air inlet; a fan housed in the housing; a substrate housed in the housing; One or more first heat generating components mounted on the first surface of the substrate; and one or more second heat generating components mounted on a second surface of the substrate opposite to the first surface, A first flow path and a second flow path are formed in the housing to guide the air flowing in from the air inlet toward the fan. At least a portion of the first flow path is formed by the first surface and a first opposing surface opposing the first surface. At least a portion of the second flow path is formed by the second surface and a second opposing surface opposing the second surface. In a direction perpendicular to the substrate, a distance between the first surface and the first opposing surface in the first flow path is longer than a distance between the second surface and the second opposing surface in the second flow path. The total calorific value of all the first heat generating components is greater than the total calorific value of all the second heat generating components, or the calorific value of the component with the largest calorific value among the first heat generating components is greater than the calorific value of the component with the largest calorific value among the second heat generating components.

2. The electronic device according to claim 1, wherein: The first opposing surface is formed by a first metal plate arranged opposite to the first surface. The second opposing surface is formed by a second metal plate arranged opposite to the second surface. At least a portion of the housing is formed of the first metal plate or the second metal plate.

3. The electronic device according to claim 2, wherein: The first metal plate is connected to at least one of the first heat generating component and the substrate by a thermally conductive first connecting member.

4. The electronic device according to claim 2 or 3, wherein: The second metal plate is connected to at least one of the second heat generating component and the substrate by a thermally conductive second connecting member.

5. The electronic device according to claim 3, wherein: At least a portion of the first connection member connects the first metal plate and a first wiring pattern provided on the substrate.

6. The electronic device according to claim 5, wherein: The first wiring pattern is electrically connected to the ground potential of the electronic device. The first metal plate is arranged so as to overlap with at least a portion of the first heat generating component when viewed in a direction perpendicular to the substrate.

7. The electronic device according to claim 4, wherein: At least a portion of the second connection member connects the second metal plate and a second wiring pattern provided on the substrate.

8. The electronic device according to claim 7, wherein: The second wiring pattern is electrically connected to the ground potential of the electronic device. The second metal plate is arranged so as to overlap with at least a portion of the second heat generating component when viewed in a direction perpendicular to the substrate.

9. The electronic device according to claim 2, wherein: The fan is mounted on the second metal plate, has a second fan surface opposite to the second metal plate in a direction perpendicular to the substrate and a first fan surface on the side opposite to the second fan surface, and has an inlet formed on the first fan surface and an inlet formed on the second fan surface. The first opposing surface is also opposed to the inlet formed on the first surface of the fan, and the second opposing surface is also opposed to the inlet formed on the second surface of the fan. A distance between an inlet formed on the first surface of the fan and the first opposing surface is longer than a distance between an inlet formed on the second surface of the fan and the second opposing surface.

10. The electronic device according to claim 1, wherein: The component having the largest heat generation among the first heat generating components is arranged so as to be at least partially located in a space between the air inlet and the inlet port of the fan when viewed in a direction perpendicular to the substrate.

11. The electronic device according to claim 1 or 10, wherein: The component with the largest heat generation among the second heat generating components is arranged so as to be at least partially located in a space between the air inlet and the inlet port of the fan when viewed in a direction perpendicular to the substrate.

12. The electronic device according to claim 1 or 2, wherein: The air inlet includes two air inlets, namely a first air inlet and a second air inlet, which are arranged separately from each other on the same surface of the housing. The component with the largest heat generation among the first heat generating components is arranged so as to be at least partially located in a space between the first air inlet and the inlet of the fan when viewed in a direction perpendicular to the substrate. The component with the largest heat generation among the second heat generating components is arranged so as to be at least partially located in a space between the second air inlet and the inlet when viewed in a direction perpendicular to the substrate.

13. The electronic device according to claim 12, wherein: The electronic device also has a battery disposed in the housing. The battery phase is arranged so that a distance from a space between the first air inlet and the inlet is greater than a distance from a space between the second air inlet and the inlet.

Images