Heat dissipation structure and heat dissipation system

Abstract

The invention discloses a heat dissipation structure and a heat dissipation system, and relates to the technical field of heat dissipation device.The heat dissipation structure comprises a case used for storing servers, a plurality of first heat dissipation modules used for dissipating heat of the servers are arranged in the case, and the first heat dissipation modules divide the case into a plurality of storage spaces used for storing the servers; the first heat dissipation module comprises a containing part used for containing a server, a cavity is formed in the containing part, a feeding part and a discharging part which communicate with the cavity are arranged on the two sides of the containing part, a flow adjusting part is arranged at the communicating position of the cavity and the feeding part or / and the discharging part, and the flow adjusting part is used for controlling the flow of refrigerants entering the cavity from the feeding part. Or the flow of the refrigerant entering the discharging part from the cavity is controlled. The heat dissipation structure can solve the problems that an existing server heat dissipation structure is poor in heat dissipation effect and high in heat dissipation cost.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation equipment, and in particular to a heat dissipation structure and a heat dissipation system. Background Art

[0002] The server is the main device for processing data to provide computing power. When the server processes too many tasks or the number of visits surges, the server needs to consume more energy for operations and calculations, thereby generating more heat. In related technologies, liquid cooling, air cooling and other methods are usually used to achieve server heat dissipation. Liquid cooling will also simultaneously dissipate heat for some servers in the same group that do not need heat dissipation, resulting in unnecessary expenses and high heat dissipation costs; air cooling is equivalent to blowing the internal temperature of the server into the computer room. After long-term use, the temperature difference between the inside and outside of the server is small, and the purpose of cooling cannot be truly achieved. In addition, air cooling is noisy and has poor effects.

[0003] It can be seen that how to provide a device with good heat dissipation effect and capable of performing targeted heat dissipation on the server is a problem that needs to be solved by those skilled in the art. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a heat dissipation structure and a heat dissipation system, which can solve the problems of poor heat dissipation effect and high heat dissipation cost.

[0005] To solve the above technical problems, an embodiment of the present invention provides a heat dissipation structure, including a chassis for storing servers, wherein the chassis is provided with a plurality of first heat dissipation modules for dissipating heat for the servers, the first heat dissipation modules divide the chassis into a plurality of storage spaces for storing the servers, the first heat dissipation module includes a placement portion for placing the server, the placement portion is provided with a cavity, a feed portion and a discharge portion connected to the cavity are provided on both sides of the placement portion, and a flow regulating portion is provided at a position where the cavity is connected to the feed portion and / or the discharge portion, the flow regulating portion is used to control the flow of the refrigerant from the feed portion into the cavity, or to control the flow of the refrigerant from the cavity into the discharge portion.

[0006] In some embodiments, the placement portion includes a rectangular heat-conducting partition having the cavity, the server is in contact with the outer surface of the heat-conducting partition, a plurality of heat sinks are provided in the cavity, the peripheral sides of the heat sinks are in contact with and fixed to the inner wall of the heat-conducting partition, the heat sinks are inclined relative to the flow direction of the refrigerant in the cavity, and a plurality of first through holes for passing the refrigerant are provided on the heat sink.

[0007] In some embodiments, the feed part and the discharge part are fixedly arranged on both sides of the chassis, and the feed part and the discharge part are respectively provided with a feed port and a discharge port corresponding to the cavity, and the flow regulating part is sealed on the inner wall of the feed part corresponding to the feed port, or / and, the flow regulating part is sealed on the inner wall of the discharge part corresponding to the discharge port;

[0008] The flow regulating unit comprises:

[0009] A main board is fixedly arranged on the inner wall of the feed part and / or the inner wall of the discharge part, a plurality of second through holes for passing the refrigerant are arranged on the board surface of the main board, and a first chute and a second chute are arranged parallel to each other on the main board;

[0010] A sub-plate, wherein a plurality of third through holes for passing the refrigerant are provided on the plate surface of the sub-plate, and sliders cooperating with the first slide groove and the second slide groove are respectively provided on the sub-plate, so that the sub-plate is slidably arranged in a direction parallel to the plate surface of the main plate, the sub-plate faces the plate surface of the main plate and contacts the main plate, and during the sliding process of the sub-plate relative to the main plate, the sub-plate contacts the main plate surface;

[0011] A driving member, installed in the first slide groove or / and the second slide groove, wherein a power end of the driving member is fixedly connected to the slider to drive the secondary plate to slide relative to the main plate;

[0012] Wherein, the second through hole and the third through hole are through holes with the same diameter, and the distribution mode of the second through holes on the main board is the same as the distribution mode of the third through holes on the sub-board;

[0013] During the sliding process of the sub-plate relative to the main plate, there are at least three position states, wherein in the first position state, the second through hole is connected to the third through hole and is coaxial, in the second position state, the second through hole is connected to the third through hole and the axes of the two are staggered, and in the third position state, the second through hole is disconnected from the third through hole.

[0014] In some embodiments, the feed section corresponds to a plurality of the first heat dissipation modules, which are used to provide refrigerant for the plurality of the placement sections, and the discharge section corresponds to a plurality of the first heat dissipation modules, which are used to receive the refrigerant discharged from the plurality of the placement sections, and the feed section and the discharge section are respectively externally connected to a feed pipe and a discharge pipe.

[0015] In some embodiments, a baffle is provided in the feed section, and a plurality of hydrophobic mesh plates are provided on the baffle plate. The hydrophobic mesh plates are provided between two adjacent flow regulating sections, and a plurality of mesh holes are evenly provided on the hydrophobic mesh plates for evenly conveying refrigerant to adjacent flow regulating sections.

[0016] In some embodiments, it also includes a second heat dissipation module arranged on the rear side of the chassis, and an opening for entering and exiting the server is provided on the front side of the chassis. The second heat dissipation module includes a heat exchange tube connected to the feed part at one end and connected to the discharge part at the other end, and the heat exchange tube corresponds to the location of at least one of the storage spaces.

[0017] In some embodiments, the second heat dissipation module further includes:

[0018] A heat exchange tube fixing frame is fixed to the rear side of the chassis, and the heat exchange tube is fixedly arranged on the heat exchange tube fixing frame;

[0019] An air duct fixing frame, fixedly arranged on the heat exchange tube fixing frame or on the rear side of the chassis;

[0020] An exhaust duct is fixedly mounted on the duct fixing frame, and a plurality of exhaust ports are opened on the exhaust duct, and the exhaust ports blow air in the direction of the heat exchange tube and into the storage space;

[0021] A wind source is used to provide wind force for the exhaust pipe.

[0022] In some embodiments, the heat exchange tubes are distributed in a periodic bending pattern, the exhaust duct corresponds to the heat exchange tubes, the wind source is a centrifugal fan, and the output end of the centrifugal fan delivers wind to the exhaust duct through an air supply duct.

[0023] In some embodiments, a control module is also included, which includes a control unit and a temperature detection unit arranged inside / outside the server. The control unit is connected to the temperature detection unit and the flow regulating unit signal to control the opening of the corresponding flow regulating unit by detecting the temperature of the server.

[0024] A heat dissipation system, comprising:

[0025] The heat dissipation structure is the heat dissipation structure described above, and there are at least two heat dissipation structures;

[0026] An input component, connected to the feed parts on the plurality of heat dissipation structures, and used to provide refrigerant to the plurality of feed parts;

[0027] A reflux assembly, connected to the discharge portions on the plurality of heat dissipation structures, and used for receiving the refrigerant of the plurality of discharge portions;

[0028] The condensing component is connected to the input component and the reflux component respectively. The condensing component condenses the refrigerant in the reflux component to a preset temperature and injects the refrigerant into the heat dissipation structure through the input component to form a circulating cooling loop.

[0029] It can be seen from the above technical scheme that the beneficial effect of the present invention lies in that the chassis is divided into several storage spaces for placing servers through the first heat dissipation module. The first heat dissipation module can dissipate heat for the corresponding servers, and control the flow of refrigerant entering the placement portion through the flow regulating portion, thereby controlling the heat dissipation efficiency of the first heat dissipation module for the corresponding servers. It can selectively dissipate heat for one or more servers, solving the problem of high heat dissipation cost caused by multiple servers only having synchronous heat dissipation function. At the same time, compared with air cooling, the heat dissipation effect of the present invention is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of the structure of a heat dissipation system provided by an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of a three-dimensional structure of a heat dissipation structure provided by an embodiment of the present invention;

[0033] Figure 3 A schematic diagram of the front structure of a heat dissipation structure provided by an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of the configuration of a first heat dissipation module and a flow regulating unit provided in an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of the structure of a flow regulating unit provided in an embodiment of the present invention;

[0036] Figure 6 This is a schematic structural diagram of a second heat dissipation module provided in an embodiment of the present invention.

[0037] In the figure:

[0038] 1-heat dissipation structure; 2-reflux component; 3-input component; 4-condensation component; 5-server;

[0039] 10-chassis; 101-storage space;

[0040] 20-first heat dissipation module; 201-placing portion; 202-heat dissipation plate; 203-first through hole;

[0041] 30-feeding part; 301-feeding pipe; 302-centrifugal pump; 303-baffle; 304-hydrophobic mesh plate;

[0042] 40-discharging part; 401-discharging pipe;

[0043] 50-second heat dissipation module; 501-heat exchange tube fixing frame; 502-heat exchange tube; 503-air duct fixing frame; 504-air source; 505-air delivery duct; 506-exhaust duct;

[0044] 60-flow regulating part; 601-main board; 602-sub-board; 603-driving member; 604-first slide groove; 605-second through hole; 606-second slide groove; 607-sliding block; 608-third through hole;

[0045] 70- Temperature detection unit. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] The terms "including" and "having" in the specification of the present invention and the above-mentioned drawings, as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.

[0048] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0049] Next, a heat dissipation structure provided by an embodiment of the present invention is described in detail. Figure 2 A heat dissipation structure provided in an embodiment of the present invention includes a chassis 10 for storing a server 5. Generally speaking, a plurality of servers 5 can be stored in one chassis 10. In some embodiments, a plurality of first heat dissipation modules 20 for dissipating heat from the server 5 are provided in the chassis 10. The first heat dissipation modules 20 divide the chassis 10 into a plurality of storage spaces 101 for storing the server 5. For details, please refer to Figure 3 , the server 5 can be placed in the storage space 101, and at least one side wall of the server 5 can contact the first heat dissipation module 20, so that the server 5 is cooled by the first heat dissipation module 20. Of course, since the storage space 101 is divided by the first heat dissipation module 20, it is also possible that the upper and lower sides of the server 5 are respectively in contact with two first heat dissipation modules 20, so that the two sides of the server 5 are cooled respectively, and the heat dissipation efficiency is more efficient.

[0050] The first heat dissipation module 20 includes a placement portion 201 for placing the server 5. Figure 3 and 4 The placement part 201 has a cavity structure, and a feed part 30 and a discharge part 40 communicating with the cavity are provided on both sides of the placement part 201. Specifically, the feed part 30 and the discharge part 40 can be set as a box structure, so as to be fixed on both sides of the chassis 10. A flow regulating part 60 is provided at the position where the cavity is connected with the feed part 30 or / and the discharge part 40, and the flow regulating part 60 controls the flow of the refrigerant from the feed part 30 into the cavity, or controls the flow of the refrigerant from the cavity into the discharge part 40.

[0051] Specifically, the flow regulating part 60 can be arranged only at the inlet or outlet of the cavity, or at both the inlet and outlet of the cavity. By adjusting the opening of the flow regulating part, the flow rate of the refrigerant entering the cavity is changed. When the flow regulating part 60 is arranged only at the outlet of the cavity, the refrigerant flow rate at the outlet of the cavity can also be adjusted, thereby adjusting the flow rate of the refrigerant entering the cavity, thereby achieving targeted cooling of the server 5.

[0052] It should be pointed out that, in some embodiments, each first heat dissipation module 20 is correspondingly provided with a flow regulating unit 60 , so that each first heat dissipation module 20 can independently achieve targeted heat dissipation for the corresponding server 5 .

[0053] In summary of the above embodiments, the present invention divides the chassis 10 into a plurality of storage spaces 101 for placing the servers 5 through the first heat dissipation module 20. The first heat dissipation module 20 can dissipate heat for the corresponding servers 5, and control the flow rate of the refrigerant entering the placement portion 201 through the flow regulating unit 60, thereby controlling the heat dissipation efficiency of the first heat dissipation module 20 for the corresponding servers 5. The heat dissipation can be selectively performed for one or more servers 5, thereby solving the problem of high heat dissipation cost caused by the fact that multiple servers 5 only have synchronous heat dissipation function. At the same time, compared with air cooling, the heat dissipation effect of the present invention is better.

[0054] Please refer to Figure 4 The placement part 201 includes a rectangular heat-conducting partition with a cavity. The heat-conducting partition can be made of a heat-conducting aluminum plate or other materials. The heat-conducting partition has a plate surface that can stably place the server 5. The server 5 can contact the outer plate surface of the heat-conducting partition. The cavity is a sealed structure with an inlet and an outlet on both sides, so that the refrigerant can only enter through the inlet and be discharged through the outlet. The corresponding flow regulating part 60 is arranged at the inlet and / or outlet of the cavity.

[0055] In order to improve the heat transfer efficiency between the refrigerant and the thermally conductive partition, a plurality of heat sinks 202 may be arranged in the cavity. The circumferential sides of the heat sink 202 are in contact with and fixed to the inner wall of the thermally conductive partition. The heat sink 202 may be made of a heat dissipation aluminum plate or other material. In addition, the heat sink 202 may be arranged at an angle relative to the flow direction of the refrigerant in the cavity. For example, the heat sink 202 may be arranged at an angle of 30°, 45°, etc. to the flow direction of the refrigerant, thereby increasing the contact area between the refrigerant and the heat sink 202, allowing the refrigerant to take away the heat from the heat sink 202 and the thermally conductive partition, thereby improving the heat exchange efficiency between the refrigerant and the heat sink 202.

[0056] A plurality of first through holes 203 for passing the refrigerant are provided on the heat sink 202. At the same time, the inclination and inclination direction of the plurality of heat sinks 202 can be kept consistent, thereby improving the flow efficiency of the refrigerant in the cavity and preventing the refrigerant from staying in the cavity for a long time and affecting the heat dissipation effect.

[0057] In some embodiments, the feed portion 30 and the discharge portion 40 are fixedly disposed on both sides of the chassis 10 . Of course, the feed portion 30 and the discharge portion 40 can also serve as two side walls of the chassis 10 , thereby forming the internal space of the chassis 10 together with other panels.

[0058] On this basis, the feed part 30 and the discharge part 40 are respectively provided with a feed port and a discharge port corresponding to the cavity, and the flow regulating part 60 is sealed on the inner wall of the feed part 30 corresponding to the feed port, or / and, the flow regulating part 60 is sealed on the inner wall of the discharge part 40 corresponding to the discharge port. It should be pointed out that since there are multiple first support modules, the feed ports and discharge ports should also be multiple and consistent with the first support modules.

[0059] Specifically, the flow regulating unit 60 includes a main plate 601, a sub-plate 602 and a driving member 603. Figure 4 and Figure 5 The main board 601 is fixedly arranged on the inner wall of the feed part 30 and / or the inner wall of the discharge part 40 and is sealed with the corresponding inner wall. A plurality of second through holes 605 are arranged on the plate surface of the main board 601, so that the refrigerant can only enter the cavity through the second through holes 605, and prevent the refrigerant from leaking along the connection between the main board 601 and the inner wall.

[0060] Correspondingly, a plurality of third through holes 608 for passing the refrigerant are provided on the plate surface of the sub-plate 602. Meanwhile, a first slide groove 604 and a second slide groove 606 are provided on the main plate 601 in parallel with each other. A slider 607 cooperating with the first slide groove 604 and / or the second slide groove 606 is provided on the sub-plate 602, so that the sub-plate 602 can slide in a direction parallel to the plate surface of the main plate 601 under the cooperation of the slider 607 and the slide groove; meanwhile, the plate surface of the sub-plate 602 facing the main plate 601 can contact the main plate 601, and during the sliding process of the sub-plate 602 relative to the main plate 601, the sub-plate 602 and the main plate 601 are in surface contact, so that the refrigerant can only enter the cavity through the circulation channel formed by the second through hole 605 and the third through hole 608. Of course, a small gap can also be left on the plate surface between the sub-plate 602 and the main plate 601, so that the second through hole 605, the gap, and the third through hole 608 form a circulation channel.

[0061] Please refer to Figure 5 The driving member 603 is installed in the first slide groove 604 and / or the second slide groove 606, and the power end of the driving member 603 can be fixedly connected to the slider 607, thereby driving the auxiliary plate 602 to slide relative to the main plate 601. It should be noted that the driving member 603 can be an electric cylinder, a pneumatic cylinder or other power cylinder, and can drive the auxiliary plate 602 to slide under the action of the control signal.

[0062] In order to ensure that the opening of the flow regulating part 60 can change regularly during the adjustment process, so as to facilitate the adjustment of the refrigerant flow, the second through hole 605 and the third through hole 608 can be set as through holes with the same diameter, and the distribution mode of the second through holes 605 on the main board 601 is the same as the distribution mode of the third through holes 608 on the sub-board 602; the same distribution mode here means that: when there is a third through hole 608 that completely corresponds to a second through hole 605, other third through holes 608 can also completely correspond to other second through holes 605 one by one, wherein complete correspondence means that the second through hole 605 corresponds to the third through hole 608 coaxially.

[0063] Based on the above embodiment, when the secondary board 602 slides relative to the main board 601, there are at least three states, as follows:

[0064] In the first state, the second through hole 605 and the third through hole 608 are correspondingly connected and coaxial. At this time, the third through hole 608 can be coaxially connected with the second through hole 605 one by one, so the refrigerant can enter the cavity through the channel formed by the second through hole 605 and the third through hole 608 to the greatest extent. At this time, the opening of the flow regulating part 60 is the largest;

[0065] In the second state, the second through hole 605 is connected to the third through hole 608, but the axes of the two are staggered. At this time, the channel formed by the third through hole 608 and the second through hole 605 is staggered, resulting in a smaller flow volume of the channel, thereby reducing the opening of the flow regulating part 60;

[0066] In the third state, the second through hole 605 and the third through hole 608 are disconnected. At this time, the channel between the third through hole 608 and the second through hole 605 is closed, and because the plate surface of the main plate 601 and the sub-plate 602 are in contact, the refrigerant cannot enter the cavity through the flow regulating part 60. At this time, the flow regulating part 60 is closed.

[0067] For the above embodiment, the number of third through holes 608 can be less than or equal to the number of second through holes 605, the number of third through holes 608 can also be greater than the second through holes 605, the second through holes 605 and the third through holes 608 can also be arranged in a rectangular array, or other more regular shapes, without too many restrictions here.

[0068] In some embodiments, the feed section 30 can correspond to multiple first heat dissipation modules 20 at the same time. Similarly, the discharge section 40 also corresponds to multiple first heat dissipation modules 20. The feed section 30 provides refrigerant for multiple first heat dissipation modules 20 or the placement section 201, and the discharge section 40 receives the refrigerant discharged from multiple first heat dissipation modules 20 or the placement section 201. The feed section 30 and the discharge section 40 are respectively connected to the feed pipe 301 and the discharge pipe 401, thereby forming a circulating refrigerant in the first heat dissipation module 20 or the placement section 201, thereby improving the heat dissipation efficiency of the server 5.

[0069] For the above embodiment, the refrigerant may be a liquid refrigerant or a gas refrigerant, etc., and it is sufficient to ensure that the refrigerant has fluid properties, thereby ensuring that the refrigerant flows and exchanges heat in the first heat dissipation module 20 .

[0070] The present invention is introduced by taking common liquid refrigerant as an example. Figure 3 A baffle 303 is provided in the feed section 30, and the upper and lower ends of the baffle 303 can be connected to the upper and lower inner walls of the feed section 30 respectively, and a plurality of hydrophobic mesh plates 304 are provided on the baffle 303, and the hydrophobic mesh plates 304 are provided between two adjacent flow regulating sections 60. A plurality of mesh holes are evenly provided on the hydrophobic mesh plates 304 for evenly conveying refrigerant to the adjacent flow regulating sections 60.

[0071] In some embodiments, the heat dissipation structure 1 of the present invention further includes a second heat dissipation module 50 disposed at the rear side of the chassis 10. Figure 2 An opening is provided on the front side of the chassis 10 for facilitating the placement of the server 5. The second heat dissipation module 50 includes a heat exchange tube 502 connected to the feed portion 30 at one end and to the discharge portion 40 at the other end. The heat exchange tube 502 corresponds to the location of at least one storage space 101.

[0072] Specifically, please refer to Figure 6 The second heat dissipation module 50 further includes a heat exchange tube fixing frame 501, an air duct fixing frame 503, an exhaust duct 506 and an air source 504, wherein the heat exchange tube fixing frame 501 is fixed to the rear side of the chassis 10, and the heat exchange tube 502 is fixedly arranged on the heat exchange tube fixing frame 501. Generally speaking, under the effect of the division of the first heat dissipation module 20, multiple radiators are stacked up and down, and the corresponding heat exchange tubes 502 are also arranged from top to bottom, so that the heat exchange tubes 502 can correspond to multiple storage spaces 101 at the same time, thereby cooling multiple servers 5.

[0073] The air duct fixing frame 503 is fixedly set on the heat exchange tube fixing frame 501 or the rear side of the chassis 10, and the exhaust duct 506 is fixedly set on the air duct fixing frame 503. At the same time, a plurality of exhaust outlets are opened on the exhaust duct 506. The wind source 504 can provide wind force for the exhaust duct 506, so that the exhaust outlet can blow air in the direction of the heat exchange tube 502 and blow into the storage space 101, so that the cold energy of the refrigerant can enter the storage space 101 and the inside of the server 5, and take away the heat on the server 5.

[0074] In order to improve the heat exchange efficiency of the second heat dissipation module 50, the heat exchange tube 502 can be distributed in a periodic bending manner, and the exhaust pipe 506 is arranged corresponding to the heat exchange tube 502, that is, the heat exchange tube 502 and the exhaust pipe 506 are arranged in a serpentine shape. Figure 6 A centrifugal fan can be used as the wind source 504. The output end of the centrifuge conveys the wind to the exhaust pipe 506 through the air supply pipe 505. The exhaust pipe 506 is distributed on both sides of the air supply pipe 505. The exhaust pipe 506 can be set to a structure with one end closed, so as to ensure that the exhaust port can discharge sufficient air volume to ensure the heat exchange effect of the second heat dissipation module 50.

[0075] In addition, the present invention also includes a control module, which includes a control unit and a temperature detection unit 70 arranged inside / outside the server 5. The control unit can be connected to the temperature detection unit 70 and the flow regulating unit 60 by signal, so as to control the opening of the corresponding flow regulating unit 60 by detecting the temperature of the server 5.

[0076] In summary of the above embodiments, the heat dissipation structure 1 of the present invention includes a two-stage heat dissipation system, wherein the first-stage heat dissipation system realizes heat dissipation through the first heat dissipation module 20; and the second-stage heat dissipation system realizes heat dissipation through the combination of the first heat dissipation module 20 and the second heat dissipation module 50. Specifically, the data acquisition unit of the control module is used to obtain the real-time temperature of the server 5 from the temperature detection unit 70, the data judgment unit is used to judge in which set value range the obtained temperature value is, and the control unit is used to control the first heat dissipation module 20 or the first heat dissipation module 20 and the second heat dissipation module 50 at the same time; and in the process of controlling the operation of the first heat dissipation module 20, the opening of the corresponding flow regulating part 60 is correspondingly controlled according to the temperature of different servers 5, so as to realize targeted heat dissipation.

[0077] Specifically, in the first heat dissipation module 20, the sub-plate 602 is driven to move on the main board 601 through the driving member 603, and the position of the third through hole 608 relative to the second through hole 605 is controlled, thereby controlling the flow of refrigerant entering the first heat dissipation module 20. For servers that do not require heat dissipation, no coolant enters. For servers that require heat dissipation but the heat dissipation amount is not large, less coolant can enter, and excess coolant is left for servers 5 that require heat dissipation, thereby achieving the purpose of energy saving and heat dissipation.

[0078] Specifically, the heat exchange tube 502 in the second heat dissipation module 50 is fed through the feed part 30, and the refrigerant enters the heat exchange tube 502. A solenoid valve can be set at the entrance of the heat exchanger, and the opening and closing of the solenoid valve are controlled by the control module; the centrifugal fan is turned on to allow the air to pass through the air supply duct 505 into the exhaust pipe 506, and be discharged through the exhaust port on the exhaust pipe 506. The exhausted air exchanges heat through the heat exchange tube 502, and then is blown into the storage space 101 and the inside of the server 5 to take away the heat of the server 5.

[0079] The present invention also provides a heat dissipation system, please refer to Figure 1 The heat dissipation system includes a heat dissipation structure 1, an input component 3, a reflux component 2 and a condensation component 4. The heat dissipation structure 1 is the above-mentioned heat dissipation structure 1, and the number of heat dissipation structures 1 is at least two. The input component 3 includes an input pipe connected to the feed parts 30 on multiple heat dissipation structures 1, and can provide refrigerant for the multiple feed parts 30; the reflux component 2 includes a reflux pipe connected to the discharge parts 40 on multiple heat dissipation structures 1, and the reflux pipe is used to receive the refrigerant discharged from the multiple discharge parts 40; the condensation component 4 is respectively connected to the input pipe and the reflux pipe, and the condensation component 4 condenses the refrigerant in the reflux pipe to a preset temperature, and injects it into the heat dissipation structure 1 through the input pipe to form a circulating cooling circuit.

[0080] During the implementation process, the refrigerant is condensed to a certain temperature through the condensing equipment of the condensing component 4, and then transported through the input pipe. The temperature detection unit 70 detects which servers 5 need to be cooled, and then the centrifugal pump 302 on the chassis 10 where the server 5 is located is controlled to work, so that the refrigerant in the input pipe is transported to the feed part 30, and evenly enters the flow regulating part 60 through the hydrophobic mesh plate 304. The control module sets the opening size of the flow regulating part 60 according to the temperature range of the temperature detection unit 70, so as to control the flow rate of the refrigerant entering the first heat dissipation module 20, allowing the refrigerant to contact the inclined heat dissipation plate 202, taking away the heat from the heat conductive partition and the heat dissipation plate 202, and then discharged into the reflux pipe through the discharge pipe 401, and finally returned to the condensing component 4 for processing, and continued to be transported by the input pipe after the processing is completed, completing the circulating cooling circuit.

[0081] The above is a detailed introduction to a heat dissipation structure and heat dissipation system provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure, comprising a chassis (10) for storing a server (5), characterized in that: The chassis (10) is provided with a plurality of first heat dissipation modules (20) for dissipating heat from the server (5). The first heat dissipation modules (20) divide the chassis (10) into a plurality of storage spaces (101) for storing the servers (5). The first heat dissipation modules (20) include a placement portion (201) for placing the server (5). The placement portion (201) is provided with a cavity. A feed portion (30) and a discharge portion (40) communicating with the cavity are provided on both sides of the placement portion (201). A flow regulating portion (60) is provided at a position where the cavity communicates with the feed portion (30) or / and the discharge portion (40). The flow regulating portion (60) is used to control the flow of a refrigerant from the feed portion (30) into the cavity, or to control the flow of a refrigerant from the cavity into the discharge portion (40).

2. The heat dissipation structure according to claim 1, characterized in that: The placement portion (201) comprises a rectangular heat-conducting baffle having the cavity, the server (5) is in contact with the outer plate surface of the heat-conducting baffle, a plurality of heat sinks (202) are provided in the cavity, the circumference of the heat sink (202) is in contact with and fixed to the inner wall of the heat-conducting baffle, the heat sink (202) is arranged obliquely relative to the flow direction of the refrigerant in the cavity, and a plurality of first through holes (203) for passing the refrigerant are provided on the heat sink (202).

3. The heat dissipation structure according to claim 1, characterized in that: The feed portion (30) and the discharge portion (40) are fixedly arranged on both sides of the chassis (10); the feed portion (30) and the discharge portion (40) are respectively provided with a feed port and a discharge port corresponding to the cavity; the flow regulating portion (60) is sealed on the inner wall of the feed portion (30) corresponding to the feed port, or / and the flow regulating portion (60) is sealed on the inner wall of the discharge portion (40) corresponding to the discharge port; The flow regulating unit (60) comprises: A main board (601) is fixedly arranged on the inner wall of the feed portion (30) and / or the inner wall of the discharge portion (40), a plurality of second through holes (605) for passing the refrigerant are provided on the plate surface of the main board (601), and a first slide groove (604) and a second slide groove (606) parallel to each other are provided on the main board (601); A sub-plate (602), wherein a plurality of third through holes (608) for passing a refrigerant are provided on the plate surface of the sub-plate (602), and sliders (607) are provided on the sub-plate (602) respectively for cooperating with the first slide groove (604) and the second slide groove (606), so that the sub-plate (602) is slidably arranged along a plate surface direction parallel to the plate surface of the main plate (601), and the plate surface of the sub-plate (602) faces the main plate (601) and contacts the main plate (601), and during the sliding process of the sub-plate (602) relative to the main plate (601), the sub-plate (602) contacts the surface of the main plate (601); A driving member (603) is installed in the first slide groove (604) and / or the second slide groove (606), and a power end of the driving member (603) is fixedly connected to the slider (607) to drive the secondary plate (602) to slide relative to the main plate (601); The second through holes (605) and the third through holes (608) are through holes with the same diameter, and the distribution mode of the second through holes (605) on the main board (601) is the same as the distribution mode of the third through holes (608) on the sub-board (602); During the sliding process of the sub-plate (602) relative to the main plate (601), there are at least three position states, wherein in the first position state, the second through hole (605) is connected to the third through hole (608) and is coaxial, in the second position state, the second through hole (605) is connected to the third through hole (608) and the axes of the two are staggered, and in the third position state, the second through hole (605) is disconnected from the third through hole (608).

4. The heat dissipation structure according to claim 1, characterized in that: The feed section (30) corresponds to a plurality of the first heat dissipation modules (20) and is used to provide refrigerant for the plurality of placement sections (201); the discharge section (40) corresponds to a plurality of the first heat dissipation modules (20) and is used to receive refrigerant discharged from the plurality of placement sections (201); the feed section (30) and the discharge section (40) are respectively externally connected to a feed pipe (301) and a discharge pipe (401).

5. The heat dissipation structure according to claim 4, characterized in that: A baffle (303) is provided in the feed portion (30), and a plurality of hydrophobic mesh plates (304) are provided on the baffle plate (303). The hydrophobic mesh plates (304) are provided between two adjacent flow regulating portions (60), and a plurality of mesh holes are evenly provided on the hydrophobic mesh plates (304) for evenly conveying refrigerant to adjacent flow regulating portions (60).

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: It also includes a second heat dissipation module (50) disposed on the rear side of the chassis (10); an opening for entering and exiting the server (5) is disposed on the front side of the chassis (10); the second heat dissipation module (50) includes a heat exchange tube (502) having one end connected to the feed portion (30) and the other end connected to the discharge portion (40); the heat exchange tube (502) corresponds to the location of at least one of the storage spaces (101).

7. The heat dissipation structure according to claim 6, characterized in that: The second heat dissipation module (50) further comprises: A heat exchange tube fixing frame (501) is fixed to the rear side of the chassis (10), and the heat exchange tube (502) is fixedly arranged on the heat exchange tube fixing frame (501); An air duct fixing frame (503) fixedly arranged on the heat exchange tube fixing frame (501) or on the rear side of the chassis (10); An exhaust duct (506) is fixedly mounted on the duct fixing frame (503), and a plurality of exhaust ports are formed on the exhaust duct (506), and the exhaust ports blow air in the direction of the heat exchange tube (502) and into the storage space (101); The wind source (504) is used to provide wind force for the exhaust pipe (506).

8. The heat dissipation structure according to claim 7, characterized in that: The heat exchange tube (502) is distributed in a periodic bending pattern, the exhaust pipe (506) corresponds to the heat exchange tube (502), the wind source 504 is a centrifugal fan, and the output end of the centrifugal fan conveys wind to the exhaust pipe (506) through an air delivery duct (505).

9. The heat dissipation structure according to claim 1, characterized in that: The invention also comprises a control module, the control module comprising a control unit and a temperature detection unit (70) arranged inside / outside the server (5), the control unit being connected to the temperature detection unit (70) and the flow regulating unit (60) by signals so as to control the corresponding opening degree of the flow regulating unit (60) by detecting the temperature of the server (5).

10. A heat dissipation system, characterized in that: include: The heat dissipation structure (1) is the heat dissipation structure (1) according to any one of claims 1 to 9, and there are at least two heat dissipation structures (1); An input component (3) communicated with the feed parts (30) on the plurality of heat dissipation structures (1) and used for providing refrigerant to the plurality of feed parts (30); A reflux component (2) is communicated with the discharge portions (40) on the plurality of heat dissipation structures (1) and is used to receive the refrigerant from the plurality of discharge portions (40); A condensing component (4) is respectively connected to the input component (3) and the reflux component (2); the condensing component (4) condenses the refrigerant in the reflux component (2) to a preset temperature, and injects the refrigerant into the heat dissipation structure (1) through the input component (3), so as to form a circulating cooling circuit.

Images