Sheet positioning device, positioning method, and method for forming shield layer for electronic component

Abstract

A sheet positioning device according to the present invention is a sheet positioning device having a base material and a functional member disposed on the base material, and is provided with: a support mechanism that supports the sheet; a sheet table to which the sheet is fixed; and a detection unit that detects the position of the functional member in the surface direction in the sheet supported by the support mechanism, the sheet positioning device being configured to position the functional member on the basis of the position of the functional member detected by the detection unit, and to position the functional member on the basis of the position of the functional member detected by the detection unit. The sheet is fixed to the sheet table after completion of positioning in which the sheet is moved relative to the sheet table such that the functional member is disposed at a predetermined position relative to the sheet table.

Description

Technical Field

[0001] The present invention relates to a sheet positioning device, a positioning method, and a method for forming a shielding layer for an electronic component. Background Art

[0002] Patent document 1 discloses a conveying mechanism that fixes a release film cut into a predetermined length on a sheet stage and then conveys it to a resin molding device. In more detail, the release film is rolled out from a roll to a predetermined length, cut, and fixed to a sheet stage. Then, the release film of the predetermined length is conveyed to the resin molding device by the conveying mechanism.

[0003] Prior Art Literature Patent Literature Patent Document 1: Japanese Patent No. 6423399 Summary of the invention Problems to be solved by the invention However, the release film is not positioned with high precision relative to the sheet stage, but is only arranged on the sheet stage. Therefore, this mechanism is not suitable for equipment that requires the accuracy of the position of the release film in subsequent processes. In addition, this problem is not limited to the release film, but is a problem that may arise in the entire sheet that requires high precision positioning with respect to the sheet stage. In addition, the above-mentioned post-transport process is not limited to the resin molding device, but can also be applied to various processes.

[0004] The present invention has been made to solve the above problem, and an object of the present invention is to provide a sheet positioning device, a positioning method, and a method for forming a shielding layer for an electronic component, which can perform high-precision positioning every time a sheet is placed on a sheet stage.

[0005] Technical solutions to solve problems The sheet positioning device involved in the present invention is a sheet positioning device having a substrate and a functional part arranged on the substrate, and is provided with: a supporting mechanism that supports the sheet; a sheet stage that fixes the sheet; and a detection unit that detects the position of the functional part in the surface direction of the sheet supported by the supporting mechanism. The sheet positioning device is constructed as follows: after the sheet is positioned relatively to the sheet stage in such a way that the functional part is arranged at a prescribed position relative to the sheet stage based on the position of the functional part detected by the detection unit, the sheet is fixed to the sheet stage.

[0006] The sheet positioning method involved in the present invention is a sheet positioning method having a substrate and a functional part arranged on the substrate, comprising: a step of arranging the sheet above a sheet stage; a step of detecting the position of the functional part in the surface direction of the sheet; a step of positioning, that is, based on the detected position of the functional part, the sheet is relatively moved relative to the sheet stage in a manner such that the functional part is arranged at a prescribed position relative to the sheet stage to position the sheet; and a step of fixing the sheet to the sheet stage after the positioning is completed.

[0007] In the method for forming a shielding layer for an electronic component involved in the present invention, the functional part is an electromagnetic wave shielding part, and the forming method comprises: a step of preparing a first mold and a second mold facing each other; a step of conveying the sheet from the sheet table via a conveying mechanism after the above-mentioned positioning method, and arranging the sheet on the setting surface of the first mold with the functional part facing the second mold; a step of arranging a plurality of electronic components on the carrier at prescribed intervals; a step of arranging the carrier on the setting surface of the second mold with the electronic component facing the first mold; and a step of forming a shielding layer on the surface of the electronic component by bringing the first mold and the second mold close to each other and crimping the functional part to the surface of the electronic component.

[0008] Effects of the Invention According to the present invention, it is possible to perform high-precision positioning every time a sheet is placed on the sheet stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a top view schematically showing a resin molding device.

[0010] Figure 2 It is a cross-sectional view of an electronic component.

[0011] Figure 3 It is a cross-sectional view showing a carrier on which electronic components are arranged.

[0012] Figure 4 It is a cross-sectional view of a support member supporting a carrier.

[0013] Figure 5 It is a top view of a sheet that has been taken up from a roll.

[0014] Figure 6 yes Figure 5 Side view of.

[0015] Figure 7 is a side view of the positioning device.

[0016] Figure 8 yes Figure 7 Top view of the .

[0017] Fig. 9 It is a side view showing the operation of the positioning device.

[0018] Fig.10 It is a side view showing the operation of the positioning device.

[0019] Fig.11 It is a side view showing the operation of the positioning device.

[0020] Fig.12 It is a side view showing the operation of the positioning device.

[0021] Fig.13 It is a top view showing the operation of the positioning device.

[0022] Fig.14 It is a side view showing the operation of the positioning device.

[0023] Fig.15 This is a cross-sectional view for explaining the operation of transferring a sheet from a sheet stage to a conveying body.

[0024] Fig.16 This is a cross-sectional view for explaining the operation of transferring a sheet from a sheet stage to a conveying body.

[0025] Fig.17 This is a cross-sectional view for explaining the operation of transferring a sheet from a sheet stage to a conveying body.

[0026] Fig.18 This is a cross-sectional view for explaining the operation of transferring a sheet from a sheet stage to a conveying body.

[0027] Fig.19 It is a cross-sectional view showing the upper mold and the lower mold of module B.

[0028] Fig. 20 It is a cross-sectional view showing a shield crimping step.

[0029] Fig.21 It is a cross-sectional view showing a crimping step of a shield.

[0030] Fig. 22 It is a cross-sectional view showing a shield crimping step.

[0031] Fig.23 It is a perspective view showing the operation of another example of the positioning device.

[0032] Fig.24 It is a perspective view showing the operation of another example of the positioning device.

[0033] Fig.25 It is a perspective view showing the operation of another example of the positioning device.

[0034] Fig.26 It is a perspective view showing the operation of another example of the positioning device.

[0035] Fig. 27 This is a cross-sectional view showing another example of the lower mold of module B.

[0036] Fig.28 This is a plan view showing another example of the lower mold of module B. DETAILED DESCRIPTION

[0037] Hereinafter, one embodiment of a system for forming a shielding layer for electronic components including a sheet positioning device according to the present invention will be described in detail using the drawings. In addition, for ease of understanding, appropriate objects may be omitted or exaggerated and schematically depicted in each drawing.

[0038] <1. Configuration of a shielding layer forming system for electronic components> Figure 1 1 is a schematic top view of a system 100 for forming a shielding layer for electronic components according to the present embodiment. The system is a system for forming a shielding layer for electromagnetic waves on the surface of an electronic component. Figure 1 As shown, the system 100 has Figure 1 Module A, module B, and module C are arranged from left to right.

[0039] Figure 2 is a cross-sectional view of an electronic component formed with a shielding layer. Figure 2 As shown, the electronic component 1 includes a substrate 11 and a chip portion 12 such as an IC chip arranged on the substrate 1. The substrate 11 can be in various forms, for example, a substrate that electrically relays the motherboard on which the electronic component 1 is mounted and the chip portion 12, for example, it can be set as an intermediate layer. Specifically, it can be set as an electronic component formed by stacking a conductive pattern, a ground layer, and an insulating layer that are omitted from the figure. Moreover, as described later, a shielding layer 13 is crimped to the top surface and side surface of the chip portion 12 in the electronic component 1 and the side surface of the substrate 11. The following describes each module that constitutes the present system 100.

[0040] <2. Module A> Module A is a handler module that places multiple electronic components on a carrier. Figure 3 As shown, in the module A, a carrier 2 on which a plurality of electronic components 1 are arranged is prepared.

[0041] The carrier 2 is composed of a film, sheet or substrate that can carry the electronic component 1, and any carrier that can withstand the decompression process and heating described later can be used. For example, it can be formed of metal, glass, etc. An adhesive layer or bonding layer for bonding the electronic component 1 is formed on the surface of the carrier 2. In addition, the substrate 11 of the electronic component 1 is fixed to this adhesive layer or bonding layer.

[0042] The number of electronic components 1 arranged on the carrier 2 is not particularly limited, and may be 1 or more. In the present embodiment, the electronic components 1 are arranged in a matrix of N×M (N and M are integers of 2 or more).

[0043] like Figure 4 As shown, the carrier 2 is supported by a support member 3 formed in a plate shape and is transported to the module B. A plurality of suction ports 31 are opened on the lower surface of the support member 3, and the surface of the carrier 2 opposite to the surface on which the electronic component 1 is arranged is adsorbed. The support member 3 adsorbing the carrier 2 is transported to the module B by a transport device (not shown).

[0044] <3. Module C> Module C will be described before module B. Module C is a module in which an electromagnetic wave shielding member (functional member) is prepared to be crimped onto the surface of the electronic component 1. First, a sheet on which the shielding member is mounted will be described.

[0045] <3-1. Sheet> Figure 5 It is a top view of the rolled sheet. Figure 6 yes Figure 5 Side view of the Figure 5 and Figure 6 As shown, the sheet 4 is wound from a reel 40 and held, and includes a sheet-shaped base material 41 and a plurality of shields 42 disposed on the base material 41. As described later, the reel 40 on which the sheet is wound is rotatably held by a reel holding portion 511.

[0046] The substrate 41 may be formed of a resin film or the like as long as it has mold release properties in a manner that allows the shielding member 42 to be peeled off later. The substrate 41 preferably includes a stretchable substrate. By having stretchability, in the module B described later, when the upper mold 61 and the lower mold 62 are brought close to each other, the substrate 41 can exert its stretchability and stretch in a manner suitable for the shape of the electronic component 1. In addition, the substrate 41 may also be formed of a thermoplastic resin having a cushioning property.

[0047] The thickness of the substrate 41 is not particularly limited, and is, for example, 50 to 550 μm, preferably 50 to 400 μm, and more preferably 100 to 350 μm. In addition, the material constituting the substrate 41 is preferably thermoplastic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, more preferably cyclic olefin polymer, and particularly preferably polymethylpentene.

[0048] The shielding member 42 is formed in a rectangular shape having a width narrower than that of the substrate 41. In addition, a plurality of shielding members 42 are arranged on the substrate 41 at predetermined intervals in the unwinding direction of the roll 40. The shielding member is a sheet-like member for forming a shielding layer on the surface of the electronic component 1 to shield the electronic component 1 from electromagnetic waves. The shielding member 42 can be configured to include, for example, a binder resin, a crosslinking agent, and a conductive filler, and may further include other additives as needed.

[0049] The binder resin is preferably a thermosetting resin selected from, for example, epoxy resins, phenolic resins, alkyd resins, melamine-formaldehyde resins, acrylic resins, silicone resins, or a mixture thereof.

[0050] The crosslinking agent is used to crosslink the binder resin. Specifically, there are crosslinking agents composed of one or more of hydroxyl, phenol, carboxylic acid, amine, epoxy, isocyanate and aziridine. From the perspective of product life and reactivity, crosslinking agents composed of epoxy, phenol, hydroxyl and carboxylic acid are preferred.

[0051] Examples of the conductive filler include (1) metal powders of conductive metals such as gold, copper, silver, and nickel; (2) alloy powders of conductive metal alloys; and (3) core-shell particles of silver-plated copper powder, gold-plated copper powder, silver-plated nickel powder, and gold-plated nickel powder. The conductive filler may be in the shape of a sphere, an ellipsoid, a scale, a dendrite, a grape, and / or a needle.

[0052] <3-2. Sheet positioning device> Next, the sheet positioning device 5 provided in the module C will be described. Figure 7 is a side view of the positioning device. Figure 8 yes Figure 7 The positioning device 5 is a device for cutting a sheet 4 of a predetermined length from a roll 40 and placing it on a sheet table 52. Figure 7 and Figure 8As shown, the positioning device 5 includes: a support mechanism 51 for supporting the sheet 4, a sheet stand 52 for fixing the sheet 4, a sensor unit 53 for detecting the position of the shielding member 42 of the sheet 4, and a cutting mechanism (cutting unit) 54 for cutting the sheet 4. In addition, these components are controlled by a control unit (not shown) composed of a computer such as a PLC (programmable logic controller). These components are described in detail below. In addition, in the following, for the convenience of description, according to Figure 7 and Figure 8 The description will be made in the direction shown, but the positioning device of the present invention is not limited to this direction.

[0053] <3-2-1. Support mechanism> The support mechanism 51 includes: a roll holding portion 511 that holds the roll 40 on which the sheet 4 has been wound so as to be rotatable, and a feed portion 512 that holds the end of the sheet 4 and allows the end of the sheet 4 to move closer to and farther from the roll 40 in the left-right direction (first direction). The roll holding portion 511 includes: a bearing (not shown) that supports the roll 40 so as to be rotatable, and a drive portion (not shown) that drives the bearing. The feed portion 512 is configured to be movable in the left-right direction. Specifically, it is configured to move to the right while holding the end of the sheet 4 wound from the roll 40 by a chuck, thereby unwinding the sheet 4 from the roll 40. As shown in FIG. Figure 8 As shown, when the sheet 4 is rolled out in this manner, one shielding member 42 is exposed in the rolled out sheet 4 .

[0054] <3-2-2. Sheet stage> The sheet table 52 is formed in a rectangular shape when viewed from above, and is arranged below the sheet 4 rolled out from the reel 40. A plurality of suction ports (not shown) are formed on the upper surface of the sheet table 52, and the sheet 4 is sucked onto the upper surface of the sheet table 52 by sucking air from the suction ports. In addition, the sheet table 52 is configured to be able to move in the horizontal direction ( Figure 8 ) and transports the sheet 4 to the module B mentioned above.

[0055] <3-2-3. Sensor unit> The sensor unit 53 is arranged above the sheet 4 rolled out from the reel 40. The sensor unit 53 includes: a base 531 formed in a plate shape and supported so as to be movable up and down, and a first sensor 532 and a second sensor 533 arranged on the base 531. In addition, on the lower surface of the base 531, a first pressing portion 534 extending in the front-to-back direction is provided at the end on the left side (the reel 40 side). The first pressing portion 534 is configured to contact the vicinity of the left end of the upper surface of the sheet platform 52 as the base 531 descends. Thus, the rolled-out sheet 4 can be clamped by the sheet platform 52 and the first pressing portion 534.

[0056] The sensor unit 53 is configured to be close to the upper surface of the sheet 4 unwound from the reel 40 so as to detect the horizontal position of the shield 42. Specifically, the sensor unit 53 is configured to detect the edge extending in the left-right direction on the rear side of the shield 42 using the first sensor 532, and to detect the edge extending in the front-rear direction on the left side of the shield 42 using the second sensor 533. Then, the control unit determines whether the detected edge is arranged within a predetermined range.

[0057] <3-2-4. Cutting mechanism> The cutting mechanism 54 is configured to cut the left side of the sheet 4 rolled out from the reel 40. More specifically, it is configured to cut the portion of the rolled out sheet 4 that is only a predetermined distance away from the end edge of the left side of the exposed shielding member 42 in the front-to-back direction (second direction). That is, it is configured to cut the base material 41 between the adjacent shielding members 42. Therefore, the cutting mechanism 54 includes: a cutter 541 that cuts the sheet 4, a second pressing portion 542 that presses the sheet 4 from above, and a support portion 543 that supports the sheet 4 from below. The second pressing portion 542 and the support portion 543 are formed between the sheet stage 52 and the reel 40 and extend in the front-to-back direction.

[0058] Furthermore, when the sheet 4 is unwound, the left side of the unwound sheet 4 is pushed by the second pushing portion 542 and the supporting portion 543. In addition, on the right side of these second pushing portions 542 and the supporting portion 543, the sheet 4 is pushed by the first pushing portion 534 and the sheet stage 52. In this state, the cutter 541 is moved in the front-back direction, thereby cutting the base material 41 between the second pushing portion 542 and the first pushing portion 534. In addition, the method for cutting the sheet can be set to a method of cutting using heat such as laser, etc., in addition to the cutter 541.

[0059] <3-2-5. Operation of positioning device> Next, refer to Figures 9 to 14 The operation of the positioning device 5 constructed as described above will be described below. Fig. 9 As shown, the feed portion 512 is used to hold the end of the sheet 4 taken up from the reel 40. Fig.10 As shown in FIG. 5 , the feeder 512 is moved to the right side to unwind the sheet 4 from the reel 40 . As a result, one shield 42 in the unwinding sheet 4 is arranged above the sheet stage 52 .

[0060] Then, if Fig.11 As shown in FIG. 5 , the sensor unit 53 is lowered, and the first sensor 532 and the second sensor 533 are used to detect the position of the shielding member 42. Figure 8 As shown, the first sensor 532 and the second sensor 533 are respectively arranged on the rear side and above the left edge of the shielding member 42, and detect the positions of these edges. At this time, when the detected position of the left edge does not enter the specified range, the roll holding portion 511 and the feeding portion 512 are driven to adjust the unwinding distance of the sheet 4, thereby adjusting the left-right position of the shielding member 42. As a result, the shielding member 42 is arranged at a specified position in the left-right direction relative to the sheet stage 52.

[0061] On the other hand, if the detected rear edge position does not fall within the predetermined range, the front-rear direction position of the sheet stage 52 is adjusted. Thus, the shield 42 is arranged at a predetermined front-rear direction position relative to the sheet stage 52.

[0062] Therefore, when the shielding member 42 is arranged at a predetermined position, Fig.12 As shown, the sensor unit 53 is further lowered, and the sheet 4 is pushed by the first pushing portion 534. Thus, the substrate 41 on the left side of the shielding member 42 is clamped in the sheet 4 by the first pushing portion 534 and the sheet stage 52. At the same time, air is sucked from the upper surface of the sheet stage 52 to adsorb the sheet 4. In addition, the second pushing portion 542 is lowered relative to the support portion 543, thereby pushing the sheet 4 to the left side of the first pushing portion 534. After that, as shown in FIG. Fig.13 As shown, a portion between the first pressing portion 534 and the second pressing portion 542 in the sheet 4 is cut by a cutter 541 .

[0063] After this, if Fig.14 As shown, the sensor unit 53 is raised, and the second pressing portion 542 is separated from the supporting portion 543. Thus, the sheet 4 in the form of a sheet in which the shield 42 is accurately positioned on the sheet stage 52 is formed.

[0064] Next, the sheet 4 on the sheet table 52 is transferred to the conveying mechanism. Figure 15 to Figure 18 As shown above, after the sheet 4 is positioned on the sheet stage 52, Fig.15As shown, the conveying body 8 of the conveying mechanism is arranged above the sheet 4. The conveying body 8 is configured to be movable between the module B and the module C, and has a main body 81 having a plurality of suction ports 811 formed on the lower surface, and the suction ports 811 are used to hold the sheet 4. In addition, a first holding portion 82 for clamping the main body 81 from the side is provided on the side of the main body 81, and a second holding portion 83 capable of being raised and lowered is provided below the first holding portion 82.

[0065] like Fig.16 As shown in FIG. 1 , the conveyor 8 is positioned above the sheet stage 52 and then lowered. As a result, the lower surface of the main body 81 contacts the sheet 4 located on the sheet stage 52. In this state, as shown in FIG. Fig.17 As shown, the sheet 4 is held by air sucked from the suction port 811, and the second holding portion 83 is raised to clamp the periphery of the sheet 4 with the first holding portion 82 and the second holding portion 83. Thereafter, the suction of air in the sheet stage 52 is stopped, as shown in FIG. Fig.18 As shown in FIG. 1 , the conveyor 8 is raised. Thus, the sheet 4 is transferred from the sheet stage 52 to the conveyor 8. In this state, the conveyor 8 is moved to convey the sheet 4 to the module B.

[0066] After that, the sheet stage 52 returns to Figure 8 After reaching the initial position, the feed portion 512 is moved to the vicinity of the second pushing portion 542 to hold the end of the sheet 4 and repeat the process. Figures 9 to 18 Thus, the sheet-shaped sheets 4 positioned at a predetermined position on the sheet stage 52 are sequentially conveyed to the module B.

[0067] <4. Module B> Next, module B will be described. Module B is a module for press-bonding the shielding member 42 delivered from module C to the surface of the electronic component 1 delivered from module A. Fig.19 As shown, the module B includes an upper mold (second mold) 61 on which the carrier 2 is placed, and a lower mold (first mold) 62 on which the sheet 4 is placed, and these are placed in a chamber capable of reducing pressure. The upper mold 61 and the lower mold 62 will be described below.

[0068] <4-1. Overview of upper and lower dies> like Fig.19 As shown, the lower surface of the upper mold 61 is formed flat for placing the carrier 2, and a plurality of suction ports 611 are formed on the lower surface of the upper mold 61. The carrier 2 conveyed from the module A by the conveying device is placed on the lower surface of the upper mold 61 and is sucked.

[0069] The lower mold 62 includes a base 621 having a rectangular upper surface and a rectangular support plate 622 disposed on the upper surface of the base 621. The support plate 622 is formed to be smaller than the upper surface of the base 621, and a suction port 623 is formed in a region of the upper surface of the base 621 outside the support plate 622. The sheet 4 conveyed from the module C is adsorbed by sucking air from the suction port 623.

[0070] A plurality of rectangular recesses 624 are formed on the upper surface of the support plate 622. These recesses 624 are formed at positions facing the electronic components 1 fixed to the upper mold 61 via the carrier 2. That is, each recess 624 is formed in a rectangular shape slightly larger than the planar shape of the electronic component 1, and each electronic component 1 enters the recess 624 when the upper mold 61 and the lower mold 62 are close to each other.

[0071] <4-2. Shielding crimping process by upper die and lower die> Next, refer to Figure 20 to Figure 22 The crimping process of the shielding member is described below. Fig. 20 As shown, the carrier 2 is arranged in the upper mold 61, and the sheet 4 is arranged in the lower mold 62. After the sheet 4 is positioned on the sheet stage 52 in the module C, it is transported to the module B by the conveyor 8. When the sheet 4 is transferred from the conveyor 8 to the lower mold 62 by the positioning, the shielding member 42 of the sheet 4 is arranged to cover all the recesses 624.

[0072] Next, the pressure in the chamber is reduced. At this time, the vacuum degree in the chamber is 4000 Pa or less, preferably 2000 Pa or less, more preferably 1000 Pa or less, and further preferably 100 Pa or less. With such reduced pressure, the electronic component 1 and the shield 42 can be firmly and closely bonded.

[0073] And, if Fig.21 As shown, the upper mold 61 and the lower mold 62 are brought close to each other, and each electronic component 1 is placed in the recess 624. As a result, the shielding member 42 is in close contact with the surface (lower surface and side surface) of each electronic component 1. After that, if the upper mold 61 and the lower mold 62 are heated, the shielding member 42 in close contact with the electronic component 1 is cured, and the shielding layer 13 is formed on the lower surface and side surface of the electronic component 1. Alternatively, the upper mold 61 and the lower mold 62 may be heated in advance and then brought close to each other.

[0074] Alternatively, pressure may be applied during heating. For example, the electronic component 1 and the shield 42 may be pressurized by the upper mold 61 and the lower mold 62. The pressure at this time may be set to, for example, 1 to 10 MPa. This allows the shield layer 13 to be formed more firmly and reliably on the electronic component 1.

[0075] The heating temperature and the curing time can be appropriately set according to the conditions such as the selected adhesive resin, and can be, for example, 90 to 180 seconds at 100 to 180°C. Here, the curing time can be the time from the completion of mold fastening to the following peeling. Alternatively, the mold fastening can be performed only by pushing at normal temperature or room temperature without heating.

[0076] Moreover, if Fig. 22 As shown, when the upper mold 61 and the lower mold 62 are separated, the shielding material 42 of the sheet 4 is peeled off from the base material 41 and transferred to the electronic component 1. Thus, the electronic component 1 having the shielding layer 13 formed thereon is obtained.

[0077] Then, the carrier 2 is removed from the upper mold, and the carrier 2 carrying the electronic components 1 is separated. The separation method is not particularly limited, and for example, each electronic component 1 is grasped by a pickup device, and the electronic component and the carrier 2 are singulated together. Alternatively, the electronic component 1 and the carrier 2 can also be singulated by dicing. That is, the carrier 2 can be cut between adjacent electronic components 1 and singulated.

[0078] <5. Features> The positioning device 5 configured as described above exhibits the following effects.

[0079] (1) In the above-mentioned crimping process, in order to make the shielding member 42 accurately and closely contact the surface of each electronic component 1, it is necessary to accurately position the shielding member 42 on the lower mold 62. In the present embodiment, in the module C, the shielding member 42 is arranged at a predetermined position on the sheet stage 52, so when the sheet 4 is transferred from the sheet stage 52 to the lower mold 62, the positioning of the shielding member 42 on the lower mold 62 is already completed. Therefore, in the crimping process, it is not necessary to position the shielding member 42, and the shielding member 42 can be accurately crimped to the electronic component 1.

[0080] (2) In the present embodiment, two sensors 532 and 533 are used to detect the edges of two sides perpendicular to the shield 42. Therefore, the position of the shield 42 in the surface direction can be accurately detected. Furthermore, when the shield 42 is not within the prescribed range, at least one of the support mechanism 51 and the sheet stage 52 can be driven to arrange the shield 42 at a prescribed position on the sheet stage 52.

[0081] (3) The sensor unit 53 is provided with the first pressing portion 534, so by lowering the sensor unit 53, in addition to detecting the position of the shielding member 42, the first pressing portion 534 can be pressed against the sheet stage 52. Thus, the sheet 4 can be clamped by the first pressing portion 534 and the sheet stage 52. Therefore, when cutting, there is no need to separately provide a mechanism for pressing the sheet 4.

[0082] <6. Variations> The above describes one embodiment of the present invention, but the present invention is not limited to the above embodiment, and various changes can be made as long as they do not deviate from the main purpose. For example, the following changes can be made. In addition, the main purpose of the following variation examples can be appropriately combined.

[0083] (1) In the above embodiment, the sheet 4 is unwound from the roll 40 and the shield 42 is positioned on the sheet stage 52 before being cut to form a sheet 4. However, a single sheet 4 having one shield 42 may be prepared and positioned on the sheet stage 52.

[0084] For example Fig.23 As shown in FIG. 1 , the conveying unit 7 having four rod-shaped adsorption members 71 is moved to the initial position after the single sheets are stacked. Then, after the four corners of the single sheet 4 arranged on the top are adsorbed by the adsorption members 71, as shown in FIG. Fig.24 As shown, it is arranged above the sheet stage 52. Then, as Fig.25 As shown, the sensor unit 53 is arranged on the sheet 4 to detect the position of the shielding member 42. The detection method can adopt, for example, the method using two sensors 532 and 533 shown in the above embodiment. At this time, if the position of the shielding member 42 is not within the specified range, the conveying unit 7 is moved in the horizontal direction to position the shielding member 42 at the specified position of the sheet stage 52.

[0085] Then, after the sensor unit 53 is withdrawn from above the sheet 4, the conveying unit 7 is lowered, as shown in FIG. Fig.26 As shown, after the sheet 4 is adsorbed on the sheet stage 52, the conveying unit 7 is separated from the sheet 4. Thus, the sheet 4 after the positioning of the shielding member 42 is arranged on the sheet stage 52. After that, the conveying unit 7 returns to the initial position where the single sheet 4 is stacked, and the same process is repeated.

[0086] (2) In the above embodiment, the sheet 4 is positioned in the front-rear direction by moving the sheet stage 52 in the front-rear direction. However, the roll holding portion 511 and the feed portion 512 may be simultaneously moved in the front-rear direction while being synchronized to perform the positioning in the front-rear direction.

[0087] (3) In the above embodiment, two sensors 532 and 533 are used to detect the position of the shielding member 42. However, the type, position, and number of sensors are not particularly limited, and various types of sensors are possible as long as the position of the shielding member 42 relative to the sheet stage 52 can be detected. Therefore, the sensor may be provided not only on the base 531 but also on, for example, the sheet stage 52 or other components.

[0088] (4) In the above embodiment, the first pressing portion 534 is provided on the base 531 of the sensor unit 53 . However, the first pressing portion 534 may be provided at another location instead of the sensor unit 53 .

[0089] (5) In the above embodiment, in the module B, the electronic component 1 is placed in the upper mold 61 and the sheet 4 is placed in the lower mold 62 . However, the placement may be reversed.

[0090] (6) The lower mold 62 for arranging the sheet 4 may also be in other forms, for example, it may be set as follows Fig. 27 and Fig.28 As shown. Fig. 27 and Fig.28 As shown, the lower mold 62 is not provided with a support plate, and a recess 625 is directly formed on the upper surface of the lower mold 62. In addition, in order to suck the sheet 4, in addition to the suction port 623, a plurality of suction ports 626 are formed on the upper surface of the base 627. Fig.28 As shown, these suction ports 626 are unidirectional ( Fig.28 Between the adjacent recesses 625 (in the vertical direction), the suction ports 625 are formed in a linear shape so as to connect each other. The sheet 4 can be firmly fixed by using such linear suction ports 626. In addition, the structure of the lower mold 62 may be other than this, and the position, shape and number of the suction ports are not particularly limited as long as the sheet 4 can be firmly fixed.

[0091] (7) In the above embodiment, in the module B, the electronic component 1 is placed in the upper mold 61 and the sheet 4 is placed in the lower mold 62 . However, the placement may be reversed.

[0092] (8) In the above embodiment, an example is described in which the shielding member 42 is crimped to the electronic component 1 on the basis of placing the pre-singulated electronic component 1 on the carrier 2, but the present invention is not limited to this. For example, the semiconductor substrate is singulated by half cutting and is placed on the upper mold 61. Moreover, when the upper mold 61 and the lower mold 62 are brought close to each other on the basis of placing the sheet 4 on the lower mold 62 as described above, the shielding member can be closely attached to the groove formed by the half cutting and the top surface of the semiconductor substrate. In this way, a shielding layer can be formed. After that, by dicing along the groove, an electronic component formed with a shielding layer and singulated can be obtained.

[0093] (9) In the above embodiment, the positioning device 5 for positioning the shielding member 42 in the sheet 4 having the substrate 41 and the shielding member 42 arranged on the substrate 41 is described, but the structure of the sheet 4 is not limited to this. That is, it can be applied to the entire sheet in which a sheet-shaped functional member smaller than the substrate is arranged on the substrate. That is, it can be applied to the entire process that requires high-precision positioning of a functional member with a specified function relative to the sheet stage. In addition, the process after positioning is also applicable to various processes other than the above-mentioned crimping.

[0094] Description of symbols 1: Electronic components 2: Carrier 4: Sheet 41: Base material 42: Shielding parts (functional parts) 5: Positioning device 51: Support mechanism 52: Sheet table 53: Sensor unit (detection unit) 532, 533: Sensor 534: First pressing part 54: Cutting off mechanism.

Claims

1. A positioning device for a sheet, the sheet comprising a substrate and a sheet-shaped functional part arranged on the substrate, The positioning device comprises: a supporting mechanism that supports the sheet; a sheet stage that holds the sheet; and a detection unit that detects the position of the functional part in the surface direction of the sheet supported by the support mechanism, The sheet positioning device is configured to fix the sheet to the sheet stage after positioning is completed by moving the sheet relative to the sheet stage in such a manner that the functional component is arranged at a predetermined position relative to the sheet stage based on the position of the functional component detected by the detection unit.

2. The sheet positioning device according to claim 1, wherein: The support mechanism comprises: a roll holding portion that holds the roll after the sheet is wound up; and a feed section that unwinds the sheet while holding the end of the sheet wound by the reel; A plurality of the functional components are arranged on the base material of the sheet at intervals in the unwinding direction. The sheet positioning device further includes a cutting unit configured to cut the rolled-out sheet from the roll after the positioning of the rolled-out sheet is completed.

3. The sheet positioning device according to claim 2, wherein: The detection unit is configured to detect the position of the edge of the functional component in a first direction in which the sheet is unwound and in a second direction orthogonal to the first direction.

4. The sheet positioning device according to claim 3, wherein: The detection unit includes a pressing unit for pressing the unwound sheet. The detection unit is configured to move up and down relative to the unwound sheet. The sheet positioning device is configured such that after the positioning, the detection portion is lowered, and the cutter portion cuts the rolled-out sheet while the sheet is clamped between the pressing portion and the sheet stage.

5. The sheet positioning device according to any one of claims 1 to 4, wherein: The positioning is configured to be performed by moving at least one of the support mechanism and the sheet stage.

6. A method for positioning a sheet, the sheet comprising a substrate and a functional part arranged on the substrate, The positioning method comprises: The step of placing the sheet above the sheet table; A step of detecting the position of the functional part in the sheet in a surface direction; a step of positioning the sheet by relatively moving the sheet with respect to the sheet stage so that the functional component is arranged at a predetermined position relative to the sheet stage based on the detected position of the functional component; as well as After the positioning is completed, the sheet is fixed to the sheet stage.

7. A method for forming a shielding layer for an electronic component, wherein: The functional part is an electromagnetic wave shielding part, The forming method comprises: The step of preparing a first mold and a second mold that are opposed to each other; After the positioning method according to claim 6, a step of conveying the sheet from the sheet stage via a conveying mechanism, and placing the sheet on the installation surface of the first mold with the functional part facing the second mold; a step of arranging a plurality of electronic components at predetermined intervals on a carrier; A step of placing the carrier on a mounting surface of the second mold with the electronic component facing the first mold; as well as The step of bringing the first die and the second die close to each other and crimping the functional component to the surface of the electronic component to form a shielding layer on the surface of the electronic component.

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