Laminated ceramic electronic component

Abstract

The laminated ceramic electronic component includes a laminated body, a first external electrode, a second external electrode, and a protective layer. The laminated body has an active portion formed by alternately laminating a plurality of first dielectric layers and internal electrode layers, and covering portions located at both ends of the active portion, and has a first side surface and a second side surface. The first external electrode and the second external electrode are connected to different internal electrode layers, respectively. The protective layer is located on the first side surface and the second side surface, has the same main component as the first dielectric layer, and has a thickness of 30 [mu] m or less. The cover portion is formed by alternately laminating a plurality of second dielectric layers having the same main component as the first dielectric layer and dummy electrode layers having the same main component as the internal electrode layers, and the interval between the dummy electrode layers is 1-8 times the interval between the internal electrode layers.

Description

Technical Field

[0001] The present disclosure relates to a laminated ceramic electronic component. Background Art

[0002] A conventional multilayer ceramic electronic component is described in Patent Document 1, for example.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-169620 Summary of the invention

[0006] The laminated ceramic electronic component of the present disclosure includes:

[0007] A substantially rectangular parallelepiped laminate, the laminate comprising: an active portion formed by alternately laminating a plurality of first dielectric layers and internal electrode layers in a predetermined direction, and covering portions located at both ends of the active portion in the predetermined direction; the laminate comprising: a first surface and a second surface facing each other in the predetermined direction, a first side surface and a second side surface facing each other, and a first end surface and a second end surface facing each other;

[0008] A first external electrode is located from the first end surface to at least one of the first surface and the second surface;

[0009] A second external electrode is located from the second end surface to at least one of the first surface and the second surface; and

[0010] a protective layer, located on the first side surface and the second side surface, and having the same main component as the first dielectric layer;

[0011] The first external electrode and the second external electrode are respectively connected to different internal electrode layers;

[0012] The thickness of the protective layer is less than 30 μm;

[0013] The covering portion is formed by alternately stacking a plurality of second dielectric layers having the same main component as the first dielectric layers and dummy electrode layers having the same main component as the internal electrode layers in the specified direction, and the interval between the dummy electrode layers is greater than 1 times and less than 8 times the interval between the internal electrode layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The objects, features and advantages of the present disclosure will become more apparent from the following detailed description and accompanying drawings.

[0015] Figure 1It is a perspective view showing a multilayer ceramic capacitor according to the present embodiment.

[0016] Figure 2 Yes means Figure 1 A perspective view of a green body component of a multilayer ceramic capacitor.

[0017] Figure 3 Yes means Figure 2 Exploded three-dimensional view of the blank parts.

[0018] Figure 4 Yes means Figure 3 Side view of the blank component.

[0019] Figure 5A Yes means Figure 1 A plan view of an example of a pattern of a dummy electrode layer in a multilayer ceramic capacitor.

[0020] Figure 5B Yes means Figure 1 A plan view of an example of a pattern of a dummy electrode layer in a multilayer ceramic capacitor.

[0021] Figure 5C Yes means Figure 1 A plan view of an example of a pattern of a dummy electrode layer in a multilayer ceramic capacitor.

[0022] Fig. 6A This is a diagram showing the relationship between the interval between dummy electrode layers and the amount of deformation of the side surface of the green component.

[0023] Figure 6B It is a diagram for explaining an example of deformation of a green component and the amount of deformation of the side surface.

[0024] Figure 6C It is a diagram for explaining another example of the deformation of the green component and the amount of deformation of the side surface.

[0025] Fig. 7A Yes means Figure 1 An exploded perspective view of an example of a laminated body in a laminated ceramic capacitor.

[0026] Figure 7B Yes means Figure 1 An exploded perspective view of an example of a laminated body in a laminated ceramic capacitor.

[0027] Figure 7C Yes means Figure 1 An exploded perspective view of an example of a laminated body in a laminated ceramic capacitor.

[0028] Fig. 8A This is a perspective view showing a ceramic green sheet on which a conductive paste serving as an internal electrode layer is printed.

[0029] Figure 8B This is a perspective view showing a ceramic green sheet on which a conductive paste serving as an internal electrode layer is printed.

[0030] Figure 8C This is a perspective view showing a ceramic green sheet on which a conductive paste serving as a dummy electrode layer is printed.

[0031] Fig. 9 Yes means Fig. 8A , 8B , a three-dimensional diagram of the stacked state of ceramic green sheets of 8C.

[0032] Fig.10 It is a perspective view showing a mother laminated body.

[0033] Fig.11 It is a three-dimensional diagram showing a green body precursor.

[0034] Fig.12 It is a three-dimensional view showing a plurality of green body precursors arranged on a support sheet.

[0035] Fig.13A It is a diagram for explaining the step of forming a protective layer on the side surface of a green body precursor.

[0036] Fig. 13B It is a diagram for explaining the step of forming a protective layer on the side surface of a green body precursor.

[0037] Fig. 13C It is a diagram for explaining the step of forming a protective layer on the side surface of a green body precursor.

[0038] Fig.14 It is a perspective view showing a plurality of green body parts on which protective layers are formed.

[0039] Fig.15 It is a perspective view showing a stacked state of ceramic green sheets.

[0040] Fig.16 It is a perspective view showing a mother laminated body.

[0041] Fig.17 It is a three-dimensional diagram showing a green body precursor.

[0042] Fig.18 It is a three-dimensional view showing a plurality of green body precursors arranged on a support sheet.

[0043] Fig.19 This is a perspective view showing a multilayer ceramic capacitor.

[0044] Fig. 20 It is a perspective view showing a mother laminated body.

[0045] Fig.21 This is a perspective view showing a multilayer ceramic capacitor. DETAILED DESCRIPTION

[0046] Conventionally, as electronic devices become smaller and more functional, there is a demand for smaller electronic components mounted in the electronic devices. As an example of such electronic components, multilayer ceramic capacitors with a side length of 1 mm or less are the mainstream, but further miniaturization and higher capacitance are required.

[0047] It is known that in order to make the stacked ceramic capacitor small and large in capacity, the side edge portion (also called the protective layer) that does not contribute to the formation of capacitance is thinned. As a method for thinning the protective layer, the following method is known: a mother stack formed by stacking dielectric layers and internal electrode layers is cut, a stack is made with the internal electrode layers exposed on the side, a thin protective layer is formed on the side of the stack, and then the stack and the protective layer are fired at the same time. In such a method, as the protective layer becomes thinner, the shrinkage behavior of the capacitor forming portion (also called the active portion) and the non-capacitor forming portion (also called the covering portion) of the stack during firing is inconsistent, so the protective layer is prone to cracking. Patent document 1 discloses a stacked ceramic capacitor that reduces the inconsistency in the shrinkage behavior of the active portion and the covering portion by adjusting the particle size of the ceramic material forming the active portion and the particle size of the ceramic material forming the covering portion.

[0048] In conventional multilayer ceramic capacitors, it is difficult to control the shrinkage behavior of the active portion and the cover portion. When the protective layer is made thinner, cracks may occur in the protective layer, thereby reducing reliability.

[0049] The following will refer to the accompanying drawings to describe the embodiments of the laminated ceramic electronic components disclosed in the present invention. Hereinafter, a laminated ceramic capacitor as an example of a laminated ceramic electronic component is described, but the laminated ceramic electronic component disclosed in the present invention is not limited to the laminated ceramic capacitor, and can also be applied to laminated ceramic electronic components such as laminated piezoelectric elements, laminated thermistor elements, laminated chip coils, and ceramic multilayer substrates. The drawings used in the following description are schematic, and the number of stacking, size ratio, etc. on the drawings are not necessarily consistent with the actual. Any direction of the laminated ceramic electronic component of the embodiment can be set to the top or the bottom, but in this specification, an orthogonal coordinate system XYZ is defined in some drawings for convenience. In the following description, sometimes the positive side of the Z-axis direction is used as the top and the words such as the upper end or the lower end are used. The X-axis direction is also called the first direction or the length direction. The Y-axis direction is also called the second direction or the width direction. The Z-axis direction is also called the third direction or the height direction. In addition, in some drawings, for the convenience of illustration, the internal electrode layer and the dummy electrode layer are given a hatching line.

[0050] Figure 1 is a perspective view showing a multilayer ceramic capacitor according to this embodiment. Figure 2 Yes means Figure 1A perspective view of a green body component of a multilayer ceramic capacitor, Figure 3 Yes means Figure 2 An exploded perspective view of the blank components. Figure 4 Yes means Figure 3 Side view of the blank component. Figure 5A , 5B , 5C stands for Figure 1 A plan view of an example of a pattern of a dummy electrode layer in a multilayer ceramic capacitor of Fig. 6A is a diagram showing the relationship between the interval between dummy electrode layers and the amount of side deformation, Figure 6B FIG. 1 is a diagram illustrating an example of deformation of a green body precursor and the amount of side deformation. Figure 6C It is a diagram for explaining another example of the deformation of the green body precursor and the amount of side deformation. Figure 6B , 6C is a side view of the blank component, and Figure 4 The side view shown corresponds to . Fig. 7A , 7B , 7C means Figure 1 An exploded perspective view of an example of a laminated body in a laminated ceramic capacitor.

[0051] like Figure 1 As shown, the multilayer ceramic capacitor 1 of this embodiment includes a green body component 2 and an external electrode 3. Figure 2 , 3 As shown, the green body component 2 has: a laminate (also referred to as a green body precursor) 13 and a protective layer 6. The green body component 2 shrinks due to firing, but the structure of the green body component 2 is the same before and after firing. Figure 2 The diagrams show the green component 2 before firing, and the diagrams show the green component 2 after firing.

[0052] like Figure 3 As shown, the laminate 13 has an active portion 19 and a covering portion 20. Figure 4 As shown in FIG. 1 , the active portion 19 is composed of a plurality of first dielectric layers 4 and internal electrode layers 5 alternately stacked. The first dielectric layers 4 and the internal electrode layers 5 are stacked in a predetermined direction (third direction). The interval between the internal electrode layers 5 in the third direction may be a predetermined interval a. The covering portion 20 is located at both ends of the active portion 19 in the third direction. Figure 4 As shown, the cover 20 is composed of a plurality of layers of second dielectric layers 16 and dummy electrode layers 17 alternately stacked. The second dielectric layers 16 and dummy electrode layers 17 are stacked in the third direction. The interval between the dummy electrode layers 17 in the third direction may be a predetermined interval b. Hereinafter, the first dielectric layer 4 and the second dielectric layer 16 are sometimes collectively referred to as dielectric layers 4 and 16, and the internal electrode layer 5 and the dummy electrode layer 17 are sometimes collectively referred to as electrode layers 5 and 17.

[0053] The laminate 13 has a substantially rectangular parallelepiped shape (see Figure 2 , 3 ). The stack 13 has: a first face 7a and a second face 7b opposite to each other in the third direction, a first end face 8a and a second end face 8b opposite to each other in the first direction, and a first side face 9a and a second side face 9b opposite to each other in the second direction. The internal electrode layer 5 is exposed at the first end face 8a or the second end face 8b according to polarity. The internal electrode layer 5 is exposed at the first side face 9a and the second side face 9b. The first face 7a and the second face 7b may be orthogonal to the third direction. The first end face 8a and the second end face 8b may be orthogonal to the first direction. The first side face 9a and the second side face 9b may be orthogonal to the second direction. In the following, the first face 7a and the second face 7b are sometimes collectively referred to as main faces 7a, 7b, the first end face 8a and the second end face 8b are sometimes collectively referred to as end faces 8a, 8b, and the first side face 9a and the second side face 9b are sometimes collectively referred to as side faces 9a, 9b.

[0054] The first dielectric layer 4 is made of an insulating material. The first dielectric layer 4 can be made of a ceramic material having BaTiO3 (barium titanate), CaTiO3 (calcium titanate), SrTiO3 (strontium titanate), BaZrO3 (barium zirconate) as a main component. In addition, in this specification, "main component" refers to the component with the highest composition ratio in the material or component of interest. The composition ratio can be a content concentration (mol%).

[0055] The internal electrode layer 5 is made of a conductive material, such as a metal material mainly composed of Ni (nickel), Pd (palladium), Ag (silver), Cu (copper), or the like.

[0056] The second dielectric layer 16 is made of an insulating material. The second dielectric layer 16 can be made of a ceramic material having BaTiO3, CaTiO3, SrTiO3, BaZrO3, etc. as a main component. The second dielectric layer 16 and the first dielectric layer 4 have the same main component.

[0057] The dummy electrode layer 17 is made of a conductive material. For example, the dummy electrode layer 17 can be made of a metal material with Ni, Pd, Ag, Cu, etc. as the main component. The main component of the dummy electrode layer 17 is the same as that of the internal electrode layer 5. The pattern of the dummy electrode layer 17 (the top view shape when viewed from a direction perpendicular to the main surfaces 7a, 7b) is sufficient as long as it does not short-circuit the first external electrode 3a and the second external electrode 3b. The pattern of the dummy electrode layer 17 may be different from the pattern of the internal electrode layer 5. In the present embodiment, the pattern of the dummy electrode layer 17 is as follows: Figure 5B shown.

[0058] The external electrode 3 includes a first external electrode 3a and a second external electrode 3b. The first external electrode 3a is located from the first end face 8a to at least one of the first face 7a and the second face 7b (also referred to as an electrode forming face). The first external electrode 3a is connected to the internal electrode layer 5 exposed at the first end face 8a. The second external electrode 3b is located from the second end face 8b to the above-mentioned electrode forming face. The second external electrode 3b is connected to the internal electrode layer 5 exposed at the second end face 8b. In the case where the dummy electrode layer 17 is exposed at the first end face 8a, the first external electrode 3a can be connected to the dummy electrode layer 17 exposed at the first end face 8a. In the case where the dummy electrode layer 17 is exposed at the second end face 8b, the second external electrode 3b can be connected to the dummy electrode layer 17 exposed at the second end face 8b.

[0059] The external electrode 3 may include: a base layer connected to the stack 13 and a plated outer layer covering the base layer. The external electrode 3 may include a plated outer layer, so that the soldering of the external electrode 3 to the external substrate or external wiring becomes easy. The base layer may be formed by applying a conductive paste for the external electrode 3 on the fired green body part 2 and sintering. The base layer may also be formed by applying a conductive paste for the external electrode 3 on the green body part 2 before firing, and simultaneously firing the green body part 2 and the conductive paste. The plated outer layer may be formed, for example, using a thin film forming technique such as an electroless plating method or an electrolytic plating method. The base layer and the plated outer layer may be a single layer or a multilayer. The external electrode 3 may also not include a plated outer layer, but may include a base layer and a conductive resin layer. The base layer may include: for example, metals such as Ni, Pd, Ag, Cu, or alloys thereof. The plated outer layer may include: for example, metals such as Ni, Sn (tin), Cu, or alloys thereof.

[0060] The protective layer 6 is located on the first side surface 9a and the second side surface 9b. The protective layer 6 electrically insulates the internal electrode layers 5 with different polarities exposed on the side surfaces 9a and 9b from each other. In addition, the protective layer 6 physically protects the ends of the internal electrode layers 5 exposed on the side surfaces 9a and 9b. The thickness of the protective layer 6 is 30 μm or less. The thickness of the protective layer 6 can be 5 μm or more and 30 μm or less.

[0061] The protective layer 6 is made of a material having insulating properties. The protective layer 6 may be made of a ceramic material, in which case the protective layer 6 can have insulating properties and relatively high mechanical strength. In addition, when the protective layer 6 is made of a ceramic material, the laminate 13 and the protective layer 6 may be fired at the same time. The protective layer 6 may be made of a ceramic material having BaTiO3, CaTiO3, SrTiO3, BaZrO3, etc. as the main component. Figure 2 In FIG. 1 , the boundary between the stacked body 13 and the protective layer 6 is indicated by a two-dot chain line, but the actual boundary does not appear clearly.

[0062] When the thickness of the protective layer 6 is relatively thick, the firing shrinkage behavior of the protective layer 6 has a greater influence on the firing shrinkage behavior of the active portion 19. Therefore, the components of the internal electrode layer 5 (for example, the main components of the internal electrode layer 5) can be contained in the ceramic material constituting the protective layer 6, so that the firing shrinkage behavior of the protective layer 6 is close to the firing shrinkage behavior of the active portion 19. As a result, uniform firing shrinkage behavior is obtained over the entire green body component 2. When the thickness of the protective layer 6 is relatively thin, the electrical strength and physical strength of the protective layer 6 are easily degraded. In particular, if there are voids or conductive substances in the protective layer 6, the degradation of the characteristics of the protective layer 6 becomes obvious, resulting in a decrease in insulation resistance and a decrease in reliability. Therefore, when the thickness of the protective layer 6 is 15 μm or less, the components of the internal electrode layer 5 can be contained in the ceramic material constituting the protective layer 6. As a result, even when the thickness of the protective layer 6 is 15 μm or less, the decrease in insulation resistance and the decrease in reliability can be reduced.

[0063] The multilayer ceramic capacitor 1 has a structure in which the cover portion 20 is formed by alternately stacking a plurality of second dielectric layers 16 having the same main component as the first dielectric layer 4 and dummy electrode layers 17 having the same main component as the internal electrode layer 5, and the stacking direction of the second dielectric layer 16 and the dummy electrode layer 17 is consistent with the stacking direction of the first dielectric layer 4 and the internal electrode layer 5. As a result, the difference in shrinkage behavior between the active portion 19 and the cover portion 20 during firing of the green body component 2 can be reduced. As a result, even when the thickness of the protective layer 6 is thin (30 μm or less), cracking of the protective layer 6 can be suppressed. Therefore, according to the multilayer ceramic capacitor 1, a small-sized and large-capacitance multilayer ceramic capacitor with suppressed reliability reduction can be provided.

[0064] like Figure 5A As shown, the dummy electrode layer 17 can be located in the central part of the first direction of the covering portion 20, and is not in contact with the first external electrode 3a and the second external electrode 3b. In this case, the short circuit between the first external electrode 3a and the second external electrode 3b can be suppressed. The dummy electrode layer 17 can also be located from the first side surface 9a to the second side surface 9b. In other words, the length of the dummy electrode layer 17 and the internal electrode layer 5 in the second direction orthogonal to the first side surface 9a can be equal. The size of the dummy electrode layer 17 in the first direction can be about 1 / 4 to 2 / 3 times the size of the covering portion 20 in the first direction.

[0065] Figure 5AThe example in which the dummy electrode layer 17 is located in the center of the cover 20 in the first direction is shown, but the dummy electrode layer 17 may be located near the first end surface 8a or near the second end surface 8b. The cover 20 may include: a plurality of dummy electrode layers 17 at different positions in the first direction. The laminate 13 is obtained by cutting the mother laminate 11 (see Fig.10 , 11 ). The mother laminate 11 can be formed by laminating ceramic green sheets (hereinafter, also referred to as green sheets) for dielectric layers 4 and 16 printed with patterns to become electrode layers 5 and 17, and pressing a mother laminate precursor in a laminating direction. In the case where the covering portion 20 includes a plurality of dummy electrode layers 17 whose positions in the first direction are different from each other, when the mother laminate precursor is pressed to produce the mother laminate 11, the adhesion between the dielectric layers 4 and 16 and the electrode layers 5 and 17 can be improved, and the internal strain of the dielectric layers 4 and 16 and the electrode layers 5 and 17 can also be dispersed. As a result, the reduction in the reliability of the laminated ceramic capacitor 1 can be suppressed.

[0066] like Figure 5B As shown, the dummy electrode layer 17 may include: a first dummy electrode layer 17a and a second dummy electrode layer 17b. The first dummy electrode layer 17a extends from the first end surface 8a to the second end surface 8b. The first dummy electrode layer 17a may be connected to the first external electrode 3a. The second dummy electrode layer 17b extends from the second end surface 8b to the first end surface 8a. The second dummy electrode layer 17b may be connected to the second external electrode 3b. The first dummy electrode layer 17a and the second dummy electrode layer 17b do not contact each other, and there is a gap S between the first dummy electrode layer 17a and the second dummy electrode layer 17b. The first dummy electrode layer 17a and the second dummy electrode layer 17b may also be located from the first side surface 9a to the second side surface 9b. In other words, the lengths of the first dummy electrode layer 17a and the second dummy electrode layer 17b and the internal electrode layer 5 in the second direction orthogonal to the first side surface 9a may be equal. In this case, when viewed from a direction orthogonal to the main surfaces 7a and 7b, the dummy electrode layer 17 overlaps with the corners of the main surfaces 7a and 7b. By overlapping the dummy electrode layer 17 with the corners of the main surfaces 7a and 7b, when the mother laminate precursor is pressed to produce the mother laminate 11, the adhesion between the dielectric layers 4 and 16 and the electrode layers 5 and 17 can be improved, and the internal strain of the dielectric layers 4 and 16 and the electrode layers 5 and 17 can also be dispersed. As a result, the reduction in the reliability of the multilayer ceramic capacitor 1 can be suppressed. The size of the first dummy electrode layer 17a and the second dummy electrode layer 17b in the first direction can be about 1 / 4 to 1 / 3 times the size of the cover 20 in the first direction.

[0067] like Figure 5CAs shown, the dummy electrode layer 17 may also include: a first dummy electrode layer 17a, a second dummy electrode layer 17b, and at least one third dummy electrode layer 17c. The first dummy electrode layer 17a extends from the first end surface 8a to the second end surface 8b. The first dummy electrode layer 17a may be connected to the first external electrode 3a. The second dummy electrode layer 17b extends from the second end surface 8b to the first end surface 8a. The second dummy electrode layer 17b may be connected to the second external electrode 3b. The first dummy electrode layer 17a and the second dummy electrode layer 17b do not contact each other. The third dummy electrode layer 17c is located between the first dummy electrode layer 17a and the second dummy electrode layer 17b. The third dummy electrode layer 17c does not contact the first dummy electrode layer 17a and the second dummy electrode layer 17b.

[0068] The first dummy electrode layer 17a and the second dummy electrode layer 17b may also be located from the first side surface 9a to the second side surface 9b. In other words, the first dummy electrode layer 17a and the second dummy electrode layer 17b and the internal electrode layer 5 may have the same length in the second direction orthogonal to the first side surface 9a. In this case, when viewed from a direction orthogonal to the main surfaces 7a and 7b, the dummy electrode layer 17 overlaps with the corners of the main surfaces 7a and 7b. By overlapping the dummy electrode layer 17 with the corners of the main surfaces 7a and 7b, when the mother laminate precursor is pressed to produce the mother laminate 11, the adhesion between the dielectric layers 4 and 16 and the electrode layers 5 and 17 can be improved, and the internal strain of the dielectric layers 4 and 16 and the electrode layers 5 and 17 can also be dispersed. As a result, the reduction in the reliability of the laminated ceramic capacitor 1 can be suppressed.

[0069] The third dummy electrode layer 17c may also be located from the first side surface 9a to the second side surface 9b. In other words, the lengths of the third dummy electrode layer 17c and the internal electrode layer 5 in the second direction orthogonal to the first side surface 9a may be equal. By arranging the first dummy electrode layer 17a, the second dummy electrode layer 17b, and the third dummy electrode layer 17c from the first side surface 9a to the second side surface 9b, when the mother laminate precursor is pressed to produce the mother laminate 11, the adhesion between the dielectric layers 4, 16 and the electrode layers 5, 17 can be further improved, and the internal strain of the dielectric layers 4, 16 and the electrode layers 5, 17 can also be further dispersed. As a result, the reduction in the reliability of the laminated ceramic capacitor 1 can be further suppressed. The dimensions of the first direction of the first dummy electrode layer 17a and the second dummy electrode layer 17b may be about 1 / 4 to 1 / 3 times the dimensions of the first direction of the cover 20. The dimensions of the first direction of the third dummy electrode layer 17c may be about 1 / 4 to 1 / 2 times the dimensions of the first direction of the cover 20.

[0070] exist Figure 5BIn the dummy electrode layer 17 shown in FIG. 1 , the number of gaps S between the first dummy electrode layer 17 a and the second dummy electrode layer 17 b is one. Figure 5C In the dummy electrode layer 17 shown, the number of gaps S is increased to 2, so the possibility of short circuit between the first dummy electrode layer 17a and the second dummy electrode layer 17b can be reduced. The at least one third dummy electrode layer 17c can be a plurality of third dummy electrode layers 17c that are not in contact with each other. In this case, since the number of gaps S between the first dummy electrode layer 17a and the second dummy electrode layer 17b can be set to 3 or more, the possibility of short circuit between the first dummy electrode layer 17a and the second dummy electrode layer 17b can be further reduced. The cover portion 20 can be Figure 5B The dummy electrode layer 17 and Figure 5C The dummy electrode layers 17 shown are formed by alternately stacking the second dielectric layers 16. By alternately stacking the dummy electrode layers 17 of different patterns, the internal stress can be dispersed in the pressing step of pressing the mother laminate precursor.

[0071] Next, refer to Fig. 6A , 6B 6C, the effect of the cover portion 20 including the dummy electrode layer 17 will be described. Fig. 6A 1 is a diagram showing the relationship between the interval b between the dummy electrode layers 17 and the amount of deformation d of the side surface of the green component 2. Figure 6B , Figure 6C It is a diagram for explaining the deformation of the green component 2 and the amount of side deformation d. Fig. 6A The relationship shown in the figure is obtained by manufacturing a sample of the green component 2 and measuring the dimensions of the manufactured sample. Fig. 6A The "interval between dummy electrode layers" on the horizontal axis of the graph is the ratio b / a of the interval b between the dummy electrode layers 17 to the interval a between the internal electrode layers 5. When preparing a sample of the green body component 2, a material formed by overlapping one or more green sheets for the first dielectric layer 4 (hereinafter also referred to as dielectric layer green sheets) is used as the green sheet for the second dielectric layer 16, such as from Fig. 6A As shown in the samples corresponding to the 1st to 4th data from the right end in the figure, the ratio b / a can be made a natural number. Fig. 6A The horizontal axis of the graph can also be said to be the number of green sheets for the first dielectric layer 4 constituting one green sheet for the second dielectric layer 16. In addition, by using a green sheet thinner than the green sheet for the dielectric layer as the green sheet for the second dielectric layer 16, as shown in FIG. Fig. 6A As shown in the sample corresponding to the data on the left end of the graph, the ratio b / a can be made less than 1. Fig. 6A The vertical axis of the graph is the side deformation d in the green body component 2 after firing. Figure 6B , 6CAs shown in FIG. 1 , the side deformation amount d is the maximum dimension S between the side surfaces 9a and 9b of the green body component 2 after firing. MAX With minimum size S MIN It can be said that the smaller the side deformation amount d is, the less the difference in shrinkage behavior between the active portion 19 and the covering portion 20 is.

[0072] In addition, in order to obtain Fig. 6A The results shown were obtained using a sample (green body component 2) made from a raw sheet of a dielectric layer having a thickness of 1.0 μm. Regarding the dimensions of the green body component 2, the length was set to 1.0 mm, and the width and height were set to 0.5 mm. The thickness of the internal electrode layer 5 after printing was set to 0.8 μm. The dummy electrode layer 17 may be the same thickness as the internal electrode layer 5, or may be thicker than the internal electrode layer 5. In the case where the thickness of the dummy electrode layer 17 is too thick, a step difference caused by the dummy electrode layer 17 is formed on the main surfaces 7a and 7b of the stack 13, and the internal strain during firing may induce cracks. In order to obtain Fig. 6A The results shown show that the thickness of the dummy electrode layer 17 is adjusted to a thickness that does not induce cracking. The thickness of the dummy electrode layer 17 may be, for example, about 1.5 times or more and 2.5 times or less of the thickness of the internal electrode layer 5 .

[0073] By making the number of dummy electrode layers 17 in the cover 20 close to the number of internal electrode layers 5 in the active portion 19, the firing shrinkage behavior of the cover 20 can be made close to the firing shrinkage behavior of the active portion 19. However, the cover 20 is a portion that does not contribute to the capacitance of the multilayer ceramic capacitor 1, and if the number of dummy electrode layers 17 in the cover 20 is increased, the cost of the multilayer ceramic capacitor 1 will increase. Therefore, the number of dummy electrode layers 17 can be within a range in which the side deformation amount d does not significantly affect the quality of the multilayer ceramic capacitor 1.

[0074] For example Figure 6B As shown, the fired green body component 2 may be shaped such that both ends in the height direction (Z-axis direction) protrude in the width direction relative to the center. MAX It can be the dimension between the side surfaces 9a and 9b at the upper or lower end in the height direction. The minimum dimension S MIN It can be the dimension between the side surfaces 9a and 9b of the center portion in the height direction. Figure 6C As shown, the fired green body component 2 may also have a shape in which the center portion in the height direction protrudes in the width direction more than the two end portions. In this case, the maximum dimension S MAX It can be the dimension between the side surfaces 9a and 9b of the center portion in the height direction, and the minimum dimension S MIN It may be the dimension between the side surfaces 9a and 9b at the upper end or the lower end in the height direction.

[0075] In the case where the covering portion 20 is composed of only one or more dielectric layer green sheets, the shrinkage behavior of the active portion 19 and the covering portion 20 is likely to be inconsistent when the green body component 2 is fired. Specifically, the active portion 19 is composed of a first dielectric layer 4 having a thickness of about 0.4 μm to several μm after firing and an internal electrode layer 5 having a thickness of about 0.4 μm to 2 μm after firing, which is stacked in a total of several hundred to 1,000 layers. Therefore, compared with the covering portion 20 composed of only dielectric layer green sheets and without an electrode layer, the shrinkage amount during firing is likely to be larger. As a result, the region R (see FIG. 1 ) spanning the active portion 19 and the covering portion 20 in the protective layer 6 is Figure 6B , 6C ) is prone to rupture.

[0076] When the cover portions 20 located on the upper and lower surfaces of the active portion 19 are formed by laminating only 34 dielectric layer green sheets, the amount of side deformation d in the green body component 2 after firing is 5.1 μm. Fig. 6A As shown, when the five dummy electrode layers 17 are arranged in the covering portion 20 at intervals of 16 times the intervals between the internal electrode layers 5, the side deformation amount d is 4.0 μm. Similarly, when the five dummy electrode layers 17 are arranged in the covering portion 20 at intervals of 8 times the intervals between the internal electrode layers 5, the side deformation amount d is 2.4 μm. Similarly, when the five dummy electrode layers 17 are arranged in the covering portion 20 at intervals of 4 times the intervals between the internal electrode layers 5, the side deformation amount d is 1.6 μm. Similarly, when the five dummy electrode layers 17 are arranged in the covering portion 20 at intervals of 1 times the intervals between the internal electrode layers 5, the side deformation amount d is 1.2 μm. In addition, when the interval b between the dummy electrode layers 17 is more than 1 times the interval a between the internal electrode layers 5, the green body component 2 after sintering may also be as follows. Figure 6B Shape shown.

[0077] When a material formed by stacking one or more dielectric layer green sheets is used as the green sheet for the second dielectric layer 16, the interval b between the dummy electrode layers 17 is limited to a natural multiple of the interval a between the internal electrode layers 5. As described above, by using a green sheet thinner than the dielectric layer green sheet as the green sheet for the second dielectric layer 16, the interval b between the dummy electrode layers 17 can be made smaller than the interval a between the internal electrode layers 5. Fig. 6AAs shown in FIG. 1 , when five dummy electrode layers 17 are arranged in the cover portion 20 at intervals 0.5 times the intervals between the internal electrode layers 5, the side deformation amount d is 3.5 μm. In addition, when the interval b between the dummy electrode layers 17 is smaller than the interval a between the internal electrode layers 5, the green body component 2 after firing can be as follows: Figure 6C Shape shown.

[0078] According to the above, when the interval b between the dummy electrode layers 17 is 1 or more and 8 or less than the interval a between the internal electrode layers 5, the side deformation amount d can be made 3.0 μm or less, and as a result, the occurrence of cracks in the protective layer 6 can be effectively suppressed. In addition, if the number of dummy electrode layers 17 is increased or decreased, the value of the side deformation amount d also changes, but it is similar to Fig. 6A That is, even when the number of dummy electrode layers 17 is increased or decreased from 5, by making the interval b between the dummy electrode layers 17 not less than 1 times and not more than 8 times the interval a between the internal electrode layers 5, the occurrence of cracks in the protective layer 6 can be effectively suppressed. In addition, regarding the shape and arrangement of the dummy electrode layers 17, even when Figure 5A to Figure 5C In any of the above, by setting the interval b between the dummy electrode layers 17 to be 1 to 8 times the interval a between the internal electrode layers 5 , the occurrence of cracks in the protective layer 6 can be effectively suppressed.

[0079] When a material formed by overlapping one or more dielectric layer green sheets is used as the green sheet for the second dielectric layer 16, the interval b between the dummy electrode layers 17 is a natural number multiple of the interval a between the internal electrode layers 5. By using a material formed by overlapping one or more green sheets having a different thickness from the dielectric layer green sheet as the green sheet for the second dielectric layer 16, the interval b between the dummy electrode layers 17 can be set to r (r is a real number greater than 1) times the interval a between the internal electrode layers 5. Even when the ratio b / a is a non-integer multiple, if the interval b between the dummy electrode layers 17 is greater than 1 times and less than 8 times the interval a between the internal electrode layers 5, the side deformation amount d can be made less than 3.0 μm. As a result, the occurrence of cracks in the protective layer 6 can be effectively suppressed.

[0080] As the green sheet for the dielectric layer, for example, a green sheet having a thickness of about 1.0 μm to about 5.0 μm can be used. Since the thinner the green sheet for the dielectric layer is, the higher the active portion 19 is stacked, the greater the difference in firing shrinkage between the active portion 19 and the cover portion 20. Therefore, the condition of the interval b determined based on the green body part 2 composed of the green sheet for the dielectric layer having a thin thickness can also be applied to the green body part 2 composed of the green sheet for the dielectric layer having a thick thickness.

[0081] like Fig. 7A As shown, the stack 13 may include: Figure 5C The dummy electrode layer 17 of the pattern shown in the figure is sandwiched by the second dielectric layer 16 and formed by stacking multiple layers of the covering portion 20. Fig. 7A As shown, the cover portion 20 may be a structure in which a plurality of dummy electrode layers 17 are stacked while being staggered in the first direction. With such a structure, the internal stress can be dispersed in the pressing step of pressing the mother laminate precursor, thereby making the laminated ceramic capacitor 1 excellent in reliability.

[0082] like Figure 7B As shown, the stacked body 13 may include: Figure 5B The covering portion 20 is formed by laminating a predetermined number of second dielectric layers 16 of the dummy electrode layer 17 in the pattern shown. Figure 7B As shown, the laminate 13 may be structured such that the upper surface of the cover portion 20 located on the upper surface of the active portion 19 is the dummy electrode layer 17. According to this structure, when the external electrode 3 is formed from the end faces 8a, 8b of the laminate 13 to the first surface 7a, the external electrode 3 can be firmly bonded to the laminate 13, so that the reliability of the laminated ceramic capacitor 1 can be excellent.

[0083] like Figure 7C As shown, the stacked body 13 may include: Figure 5B The cover portion 20 is formed by laminating a predetermined number of second dielectric layers 16 of the dummy electrode layer 17 shown. Figure 7C As shown, the laminate 13 may be structured such that the upper surface of the cover 20 located on the upper surface of the active portion 19 is the dummy electrode layer 17, and the lower surface of the cover 20 located on the lower surface of the active portion 19 is the dummy electrode layer 17. According to this structure, when the external electrode 3 is formed from the end faces 8a and 8b of the laminate 13 to the first face 7a and the second face 7b, the external electrode 3 can be firmly bonded to the laminate 13, so that the reliability of the laminated ceramic capacitor 1 can be excellent. In addition, since the green body component 2 can be processed regardless of the up and down directions, the manufacturing process of the laminated ceramic capacitor 1 can be made efficient.

[0084] The main component of the dummy electrode layer 17 is the same as that of the internal electrode layer 5, so that the shrinkage behavior of the cover portion 20 can be made close to the shrinkage behavior of the active portion 19. The components other than the main component of the dummy electrode layer 17 can be adjusted according to other purposes. For example, when the dummy electrode layer 17 is composed of a metal material with Ni, Pd, Ag, Cu, etc. as the main component, it is sometimes difficult to bond the dummy electrode layer 17 to the second dielectric layer 16 during the firing of the green body component 2. Figure 7B , 7CAs shown, when at least one of the upper surface and the lower surface of the cover portion 20 is a dummy electrode layer 17, the conductive paste that becomes the dummy electrode layer 17 may be a conductive paste containing ceramic powder. Thus, when the green body component 2 is fired, the ceramic powder that becomes the conductive paste of the dummy electrode layer 17 and the ceramic powder that becomes the dielectric layer sheet of the second dielectric layer 16 are sintered, so that the fixing of the dummy electrode layer 17 to the second dielectric layer 16 can be strengthened. As a result, the dummy electrode layer 17 can be suppressed from peeling off from the second dielectric layer 16.

[0085] Next, a method for manufacturing the multilayer ceramic capacitor 1 will be described. Fig. 8A , 8B is a perspective view showing a ceramic green sheet on which a conductive paste serving as an internal electrode layer is printed. Figure 8C is a perspective view showing a ceramic green sheet on which a conductive paste serving as a dummy electrode layer is printed. Fig. 9 Yes means Fig. 8A , 8B , a three-dimensional diagram of the stacked state of ceramic green sheets of 8C. Fig.10 is a perspective view showing a mother laminate, Fig.11 is a three-dimensional diagram showing a green body precursor, Fig.12 It is a three-dimensional view showing a plurality of green body precursors arranged on a support sheet. Fig.13A , 13B 13C is a diagram for explaining the process of forming a protective layer on the side of the green body precursor, Fig.14 It is a perspective view showing a plurality of green body parts arranged on a support sheet.

[0086] First, a ceramic mixed powder obtained by adding additives to a ceramic dielectric material BaTiO3 is wet-milled and mixed using a bead mill, and then a polyvinyl butyral-based binder, a plasticizer, and an organic solvent are added and mixed to prepare a ceramic slurry.

[0087] Next, a ceramic green sheet (hereinafter also referred to as green sheet) 10 is formed on the carrier film using a die coater. The thickness of the green sheet 10 can be, for example, about 1 μm to 10 μm. By reducing the thickness of the green sheet 10, the electrostatic capacitance of the laminated ceramic capacitor 1 can be increased. The forming of the green sheet 10 is not limited to the die coater, and can also be performed using, for example, a blade coater or a gravure coater.

[0088] The main component of the green sheet 10 for the second dielectric layer 16 may be the same as that of the green sheet 10 for the first dielectric layer 4. The green sheet 10 for the second dielectric layer 16 may be formed by stacking one or more green sheets 10 for the first dielectric layer 4. The thickness of the green sheet 10 for the second dielectric layer 16 may be 8 times or less of the thickness of the green sheet 10 for the first dielectric layer 4.

[0089] Next, screen printing was used to Fig. 8A , 8B The conductive paste to be the internal electrode layer 5 is printed on the green sheet 10 for the first dielectric layer 4 in the pattern shown in FIG. Figure 8C A conductive paste to be the dummy electrode layer 17 is printed on the green sheet 10 for the second dielectric layer 16 in the pattern shown. Fig. 8A , 8B The internal electrode layer 5 is printed on the green sheet 10 for forming the first dielectric layer 4 of the active part 19. As the pattern of the internal electrode layer 5, Fig. 8A The patterns shown and Figure 8B The pattern shown, however Figure 8B The pattern shown can also be Fig. 8A The patterns shown are formed by staggering. Figure 8C The figure shows that a dummy electrode layer 17 is printed on a raw sheet 10 for forming a second dielectric layer 16 of a cover portion 20. The dummy electrode layer 17 is printed in a stripe pattern. The conductive paste that becomes the internal electrode layer 5 and the dummy electrode layer 17 may be a conductive paste containing Ni as a main component. The conductive paste that becomes the internal electrode layer 5 and the dummy electrode layer 17 may contain metals such as Pd, Cu, Ag, or alloys thereof in addition to Ni as a main component. Hereinafter, the conductive paste that becomes the internal electrode layer 5 is also referred to as the internal electrode layer 5. The conductive paste that becomes the dummy electrode layer 17 is also referred to as the dummy electrode layer 17.

[0090] The printing of the internal electrode layer 5 and the dummy electrode layer 17 is not limited to the screen printing method, and may be performed using, for example, a gravure printing method or the like.

[0091] The thickness of the internal electrode layer 5 can be, for example, about 1.0 μm or less. Thus, even when the multilayer ceramic capacitor 1 is a capacitor with a high number of stacking numbers, the occurrence of internal defects such as cracks due to internal stress can be suppressed.

[0092] Fig. 9 It is a three-dimensional diagram showing the stacking state of the raw sheets 10 printed with electrode layers 5 and 17. First, the raw sheets 10 for the second dielectric layer 16 printed with the dummy electrode layer 17 are stacked by a predetermined number of sheets. Next, the raw sheets 10 for the first dielectric layer 4 printed with the internal electrode layer 5 are alternately stacked by a predetermined number of sheets, and further, the raw sheets 10 for the second dielectric layer 16 printed with the dummy electrode layer 17 are stacked by a predetermined number of sheets. The raw sheets 10 for the first dielectric layer 4 printed with the internal electrode layer 5 can be stacked by a predetermined number of sheets while staggering the pattern of the internal electrode layer 5. The stacking of the raw sheets 10 printed with the electrode layers 5 and 17 is performed on a support sheet (not shown). The support sheet can be an adhesive release sheet that can be bonded and peeled, such as a weak adhesive sheet or a foam release sheet.

[0093] Next, the mother laminate precursor formed by laminating the green sheets 10 printed with the electrode layers 5 and 17 is pressed in the laminating direction to obtain Fig.10 The mother laminate 11 shown. The mother laminate precursor can be pressed using, for example, a hydrostatic press. In the mother laminate 11, the electrode layers 5 and 17 are embedded in layers via the green sheet 10. Fig.10 Although omitted in the figure, the support sheet used when stacking the ceramic green sheets 10 is located under the mother laminate 11. Fig.10 The dashed line shown is a planned cutting line 12 indicating a position at which the mother laminate 11 is to be cut.

[0094] Next, the mother laminate 11 is cut along the predetermined cutting line 12 using a press cutting device to obtain Fig.11 The blank precursor (laminate) 13 shown. In addition, the method of cutting the mother laminate 11 is not limited to the method using a press cutting device, and a method such as a cutting device may also be used. Since the main surface, end surface and side surface of the mother laminate 11 correspond to the main surface 7a, 7b, end surface 8a, 8b and side surface 9a, 9b of the blank precursor 13, respectively, they are marked with the same figure marks below.

[0095] Next, a tray (not shown) is prepared in which pockets for accommodating a plurality of green body precursors 13 are arranged vertically and horizontally, and a plurality of green body precursors 13 are respectively arranged in a plurality of pockets in a manner that the cut surfaces (second side surfaces 9b) of the green body precursors 13 face upward. Then, a support sheet 18 that can be bonded and peeled is covered from above the cut surfaces of the green body precursors 13, and a plurality of green body precursors 13 are fixed on the support sheet 18, and then the tray is removed.

[0096] Fig.12 A plurality of green body precursors 13 are shown fixed to a support sheet 18. The green body precursors 13 are arranged in a direction such that the cut surface (first side surface 9a) of the green body precursor 13 becomes an open surface. Fig.12 Before attaching the green sheet for the protective layer 6 to the cut surface, the cut surface may be cleaned to remove foreign matter attached to the cut surface. Foreign matter attached to the cut surface may include, for example, debris of the green sheet 10, a resin adhesive contained in the green sheet 10, and paste of the support sheet 18. The method of cleaning the cut surface may be, for example, a sandblasting method, a laser processing method, or the like.

[0097] Next, refer to Fig.13A , 13B 13C, the process of attaching a ceramic green sheet (hereinafter also referred to as green sheet) 14 for the protective layer 6 to the cut surface of the green body precursor 13 is described. Fig.13AAs shown, the raw sheet 14 formed on the resin sheet 27 is placed on the elastic sheet 24b. The resin sheet 27 is made of, for example, PET (polyethylene terephthalate), PP (polypropylene), etc., and can be a smooth sheet with a thickness of about 10μm to 40μm. The resin sheet 27 can be flexible. A release agent that makes it easy for the raw sheet 14 to be separated from the elastic sheet 24b can be applied to the surface of the resin sheet 27 opposite to the surface facing the elastic sheet 24b. The multiple green body precursors 13 fixed on the support sheet 18 are arranged so that the cut surface (first side surface 9a) faces the raw sheet 14. The support sheet 18 can be placed on the elastic sheet 24a.

[0098] A green sheet with a predetermined thickness that is easy to bond with the green body precursor 13 is prepared as the green sheet 14 for the protective layer 6. The thickness of the green sheet 14 can be, for example, 5 μm to 30 μm. The main components of the green sheet 14 and the green sheet 10 for the first dielectric layer 4 can be the same. In this way, the influence of the protective layer 6 on the characteristics of the multilayer ceramic capacitor 1 can be reduced. The composition of the green sheet 14 for the protective layer 6 and the green sheet 10 for the first dielectric layer 4 can be the same. In addition, the organic binder and the solvent are removed in the degreasing process before firing, so the green sheet 14 can be appropriately selected in consideration of the ease of forming and bonding with the green body precursor 13. The polyvinyl butyral-based binder has excellent plasticity and adhesion. In addition, the plasticity and adhesion of the polyvinyl butyral-based binder can be improved by heating to a temperature that is 30°C or higher than the glass transition temperature Tg. Therefore, the polyvinyl butyral-based binder and plasticizer having a low glass transition temperature Tg can be dissolved in a mixed solvent of ethanol and toluene, mixed and dispersed in the slip of the ceramic raw material, and the raw sheet 14 can be prepared. In addition, when the binder used in the raw sheet 14 is a polyvinyl butyral resin binder, as a plasticizer, phthalates such as dioctyl phthalate (DOP), di(2-ethylhexyl phthalate, DEHP) or dibutyl phthalate (DBP) which have good compatibility with the binder, or phosphate esters, fatty acid esters, etc. can be used.

[0099] The elastic sheets 24a and 24b may be silicone rubber sheets. The thickness of the elastic sheets 24a and 24b may be about 0.5 mm. By using the elastic sheets 24a and 24b, dimensional variations of the plurality of green body precursors 13 can be absorbed, and the multilayer ceramic capacitor 1 can be manufactured efficiently.

[0100] Then, if Fig. 13B As shown, the elastic sheet 24a on which the green body precursor 13 is placed is moved toward the elastic sheet 24b on which the raw sheet 14 is placed via the support sheet 18, and the cut surface (first side surface 9a) is pressed against the raw sheet 14. As a result, the raw sheet 14 in contact with the green body precursor 13 is pressed against the green body precursor 13. The pressing force can be, for example, 30 kg / cm 2~100kg / cm 2 The green body precursor 13 may be heated during pressing to improve the pressure-bonding property of the green body precursor 13. In this case, the pressing force can be reduced, so that the pressing deformation of the green body precursor 13 can be suppressed. Fig. 13C FIG. 1 shows a state where the green body precursor 13 to which the green sheet 14 is pressed is moved upward. Fig. 13C As shown in FIG. 2 , since the portion of the green sheet 14 that is not in contact with the first side surface 9 a remains on the resin sheet 27 , the green sheet 14 can be attached to the first side surface 9 a. Fig.13A , 13B 13C, the green sheet 14 can be attached to the second side surface 9b.

[0101] Fig.14 The green body component 2 before firing is shown, and the green sheet 14 that becomes the protective layer 6 is attached to the first side surface 9a and the second side surface 9b. The green body component 2 is degreased in a nitrogen atmosphere and fired in a hydrogen / nitrogen mixed atmosphere to produce Figure 2 The blank component 2 is shown.

[0102] Next, the fired green body component 2 is subjected to barrel grinding. The barrel grinding is performed to remove corners and burrs of the green body component 2, and known barrel grinding can be used. In this embodiment, the green body component 2 is placed in a basin filled with grinding media and water and rotated.

[0103] Next, the conductive paste that will become the base layer of the external electrode 3 is printed and applied on the end faces 8a, 8b and the main faces 7a, 7b of the green body precursor 13 of the green body component 2, and then sintered to form the base layer of the external electrode 3. Then, by forming the plated outer layer of the external electrode 3, it is possible to manufacture Figure 1 The laminated ceramic capacitor 1 shown. The main component of the conductive paste that becomes the base layer of the external electrode 3 can be Cu. The plated outer layer of the external electrode 3 can be a Ni plating layer, a Sn plating layer, or a Cu plating layer. The external electrode 3 can include: a conductive resin such as an epoxy resin containing a conductive filler such as a metal powder.

[0104] Next, include Fig. 7A , 7B , and a method for manufacturing a multilayer ceramic capacitor using the green body precursor 13 shown in 7C will be described. Fig.15 is a perspective view showing the stacking state of ceramic green sheets. Fig.16 is a perspective view showing a mother laminate, Fig.17 is a three-dimensional diagram showing a green body precursor, Fig.18 is a three-dimensional diagram showing a plurality of green body precursors arranged on a support sheet, Fig.19 This is a perspective view showing a multilayer ceramic capacitor. Fig. 20It is a perspective view showing a mother laminated body. Fig.21 This is a perspective view showing a multilayer ceramic capacitor.

[0105] Include Fig. 7A The method for manufacturing a multilayer ceramic capacitor using the green body precursor 13 shown is the same as the above-mentioned manufacturing method, and thus the description thereof will be omitted.

[0106] Next, include Figure 7B A method for manufacturing a multilayer ceramic capacitor (hereinafter referred to as a multilayer ceramic capacitor 1A) using a green body precursor 13 shown in FIG. Fig. 8A , 8B 8C are the same as the method for manufacturing the multilayer ceramic capacitor 1, and thus the description thereof is omitted. In the step of stacking the green sheet 10 on which the electrode layers 5 and 17 are printed, as shown in FIG. Fig.15 As shown, the ceramic green sheets 10 for the second dielectric layer 16 on which the dummy electrode layer 17 is printed are stacked so that the first surface 7a of the stacked body becomes the dummy electrode layer 17. Fig.16 After the mother laminate 11 is shown, the mother laminate 11 is cut to obtain Fig.17 The green body precursor 13 shown. Fig.18 As shown, the green body precursor 13 is placed on the support sheet 18 in a manner such that one of the first side surface 9a and the second side surface 9b (the first side surface 9a) is an open surface. Fig.13A , 13B , 13C, a green sheet 14 for the protective layer 6 is attached to the side surfaces 9a, 9b. Then, the green body component 2 is fired, and the fired green body component 2 is subjected to drum grinding, the corners are chamfered, and the surface oxide film of the electrode layers 5, 17 exposed on the end surfaces 8a, 8b and the side surfaces 9a, 9b of the green body precursor 13 is removed. Then, electroless Cu plating is performed on the end surfaces 8a, 8b of the green body component 2 to form a continuous base layer with the exposed portion of the electrode layers 5, 17 as the core. Then, by forming an electrolytic Ni plating layer and an electrolytic Sn plating layer on the surface of the base layer, it is possible to manufacture a Fig.19 The illustrated multilayer ceramic capacitor 1A has thin external electrodes 3 located on the end surfaces 8a, 8b and the first surface 7a.

[0107] Next, include Figure 7C A method for manufacturing a multilayer ceramic capacitor (hereinafter referred to as a multilayer ceramic capacitor 1B) using the green body precursor 13 shown will be described. Fig. 20 Shows that after cutting Figure 7C The parent laminate 11 of the green body precursor 13 is shown. Fig. 20 The first surface 7 a and the second surface 7 b of the mother laminate 11 shown in the figure serve as dummy electrode layers 17 . Fig. 20The mother laminate 11 shown can be Fig.16 The mother laminate 11 shown is manufactured by printing a dummy electrode layer 17 on the lower surface. Fig. 20 The mother laminate 11 shown in FIG. Figure 7C Then, similarly to the method for manufacturing the multilayer ceramic capacitor 1A, a green body precursor 13 as shown can be manufactured. Fig.21 The illustrated laminated ceramic capacitor 1B has thin external electrodes 3 located from end faces 8 a and 8 b to the first face 7 a and the second face 7 b. Fig. 20 The mother laminate 11 shown can be Fig.15 In the lamination step shown, the green sheet 10 is produced by turning over the lower surface.

[0108] The multilayer ceramic electronic component of the present disclosure can suppress a decrease in reliability even when the protective layer is made thinner.

[0109] The multilayer ceramic electronic component of the present disclosure can be implemented in the following configurations (1) to (8).

[0110] (1) A laminated ceramic electronic component comprising:

[0111] A substantially rectangular parallelepiped laminate, the laminate comprising: an active portion formed by alternately laminating a plurality of first dielectric layers and internal electrode layers in a predetermined direction, and covering portions located at both ends of the active portion in the predetermined direction; the laminate comprising: a first surface and a second surface facing each other in the predetermined direction, a first side surface and a second side surface facing each other, and a first end surface and a second end surface facing each other;

[0112] A first external electrode is located from the first end surface to at least one of the first surface and the second surface;

[0113] A second external electrode is located from the second end surface to at least one of the first surface and the second surface; and

[0114] a protective layer, located on the first side surface and the second side surface, and having the same main component as the first dielectric layer;

[0115] The first external electrode and the second external electrode are respectively connected to different internal electrode layers;

[0116] The thickness of the protective layer is less than 30 μm;

[0117] The covering portion is formed by alternately stacking a plurality of second dielectric layers having the same main component as the first dielectric layers and dummy electrode layers having the same main component as the internal electrode layers in the specified direction, and the interval between the dummy electrode layers is greater than 1 times and less than 8 times the interval between the internal electrode layers.

[0118] (2) In the multilayer ceramic electronic component according to the above configuration (1), the internal electrode layer and the dummy electrode layer have the same length in a direction perpendicular to the first side surface.

[0119] (3) In the multilayer ceramic electronic component described in the above structure (1) or (2), the dummy electrode layer comprises: a first dummy electrode layer extending from the first end surface to the second end surface; and a second dummy electrode layer extending from the second end surface to the first end surface;

[0120] The first dummy electrode layer and the second dummy electrode layer are electrically insulated.

[0121] (4) In the multilayer ceramic electronic component described in the above structure (3), the dummy electrode layer further comprises: at least one third dummy electrode layer;

[0122] The at least one third dummy electrode layer is located between the first dummy electrode layer and the second dummy electrode layer, and is electrically insulated from the first dummy electrode layer and the second dummy electrode layer.

[0123] (5) In the multilayer ceramic electronic component according to any one of the above structures (1) to (4), the thickness of the dummy electrode layer is 1.5 to 2.5 times the thickness of the internal electrode layer.

[0124] (6) In the multilayer ceramic electronic component according to any one of the above structures (1) to (5), the thickness of the protective layer is 5 μm or more.

[0125] The embodiments of the present disclosure have been described in detail above, but the present disclosure is not limited to the above embodiments, and various changes and improvements can be made within the scope of the present disclosure. It goes without saying that all or part of the above embodiments can be appropriately combined within the scope of non-contradiction.

[0126] Description of Reference Numerals

[0127] 1, 1A, 1B Multilayer ceramic electronic components (multilayer ceramic capacitors)

[0128] 2 Blank parts

[0129] 3 External electrodes

[0130] 3a First external electrode

[0131] 3b Second external electrode

[0132] 4 First dielectric layer

[0133] 5 Internal electrode layer

[0134] 6. Protective layer

[0135] 7a Page 1

[0136] 7b Side 2

[0137] 8a First end face

[0138] 8b Second end face

[0139] 9a First side

[0140] 9b Second side

[0141] 10 Ceramic Green Sheet

[0142] 11. Mother laminate

[0143] 12 Cutting off the predetermined line

[0144] 13. Laminated body (green body precursor)

[0145] 14 Ceramic Green Sheet

[0146] 16 Second dielectric layer

[0147] 17 Dummy electrode layer

[0148] 17a First dummy electrode layer

[0149] 17b Second dummy electrode layer

[0150] 17c Third dummy electrode layer

[0151] 18 Support sheet

[0152] 19 Active part

[0153] 20 Covering

[0154] 24a, 24b elastic sheet

[0155] 27 Resin sheet.

Claims

1. A laminated ceramic electronic component comprising: A substantially rectangular parallelepiped laminate, the laminate comprising: an active portion formed by alternately laminating a plurality of first dielectric layers and internal electrode layers in a predetermined direction, and covering portions located at both ends of the active portion in the predetermined direction; the laminate comprising: a first surface and a second surface facing each other in the predetermined direction, a first side surface and a second side surface facing each other, and a first end surface and a second end surface facing each other; A first external electrode is located from the first end surface to at least one of the first surface and the second surface; A second external electrode is located from the second end surface to at least one of the first surface and the second surface; and, a protective layer, located on the first side surface and the second side surface, and having the same main component as the first dielectric layer; The first external electrode and the second external electrode are respectively connected to different internal electrode layers; The thickness of the protective layer is less than 30 μm; The covering portion is formed by alternately stacking a plurality of second dielectric layers having the same main component as the first dielectric layers and dummy electrode layers having the same main component as the internal electrode layers in the specified direction, and the interval between the dummy electrode layers is greater than 1 times and less than 8 times the interval between the internal electrode layers. 2 . The multilayer ceramic electronic component according to claim 1 , wherein the internal electrode layer and the dummy electrode layer have the same length in a direction perpendicular to the first side surface.

3. The laminated ceramic electronic component according to claim 1 or 2, wherein the dummy electrode layer comprises: a first dummy electrode layer extending from the first end surface to the second end surface; and a second dummy electrode layer extending from the second end surface to the first end surface; The first dummy electrode layer and the second dummy electrode layer are electrically insulated.

4. The laminated ceramic electronic component according to claim 3, wherein the dummy electrode layer further comprises: at least one third dummy electrode layer; The at least one third dummy electrode layer is located between the first dummy electrode layer and the second dummy electrode layer, and is electrically insulated from the first dummy electrode layer and the second dummy electrode layer. 5 . The multilayer ceramic electronic component according to claim 1 , wherein the thickness of the dummy electrode layer is 1.5 to 2.5 times the thickness of the internal electrode layer. 6 . The multilayer ceramic electronic component according to claim 1 , wherein the protective layer has a thickness of 5 μm or more.

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