Laminated ceramic electronic component and method for manufacturing laminated ceramic electronic component

Abstract

A laminated ceramic electronic component includes: a laminated portion in which a plurality of internal electrode layers and a plurality of dielectric layers are laminated in a first direction; a pair of main surface protective layers located on both main surfaces of the laminated portion in the first direction; a pair of side surface protection layers located on both side surfaces of the laminated portion and the main surface protection layer in a second direction intersecting the first direction; plates positioned on both end sides of the main surface protection layer in a third direction intersecting the second direction; if the length of the plate in the third direction is L1 and the length in the third direction from one end surface of the laminated portion to an end portion of the internal electrode layer extending from the other end surface of the laminated portion is L2, L1 > = L2.

Description

Technical Field

[0001] The present disclosure relates to a laminated ceramic electronic component and a method for manufacturing the laminated ceramic electronic component. Background Art

[0002] A conventional multilayer ceramic electronic component is described in Patent Document 1, for example.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-209539 Summary of the invention

[0006] The laminated ceramic electronic component disclosed in the present invention comprises: a laminated portion, in which a plurality of internal electrode layers and a plurality of dielectric layers are laminated in a first direction; a pair of main surface protection layers, which are located on two main surfaces of the laminated portion in the first direction; a pair of side protection layers, which are located on two side surfaces of the laminated portion and the main surface protection layer in a second direction intersecting with the first direction; a plate, which is located on both end sides of the main surface protection layer in a third direction intersecting with the second direction; if the length of the plate in the third direction is set to L1, and the length from one end surface of the laminated portion to the end of the internal electrode layer extending from the other end surface of the laminated portion in the third direction is set to L2, then L1≥L2.

[0007] The manufacturing method of a laminated ceramic electronic component disclosed in the present invention comprises: a first step of manufacturing a mother laminate by arranging a pair of main surface protection layers on both sides of a first direction of a laminated portion in which a plurality of electrode bodies and a plurality of dielectric sheets are stacked in a first direction; a second step of pressurizing the mother laminate from the first direction; a third step of cutting the mother laminate at a surface orthogonal to a third direction intersecting the first direction to form a pair of cut end surfaces; a fourth step of cutting the mother laminate at a surface orthogonal to a second direction intersecting the third direction to form a pair of cut side surfaces; a fifth step of attaching a side protection layer body to the pair of cut side surfaces; in the first step, on the dielectric sheet of the main surface protection layer body, electrode bodies are arranged at intervals of a distance P in the third direction, and a plate body having a length of the third direction greater than the distance P is arranged at a position overlapping with the interval when viewed from the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The objects, features and advantages of the present disclosure will become more apparent from the following detailed description and accompanying drawings.

[0009] Figure 1 is a schematic diagram of a multilayer ceramic electronic component according to an embodiment of the present disclosure.

[0010] Figure 2A is a schematic diagram of a component body of an embodiment of the present disclosure.

[0011] Figure 2B It is a schematic diagram showing each structure of the component body separately.

[0012] Figure 3A It is a schematic diagram of the side surface of the blank component when the blank component is viewed from the second direction.

[0013] Figure 3B This is a schematic diagram of the side surface of the green component of the comparative example when viewed from the second direction.

[0014] Figure 4A Schematic diagram showing an example of a blank component according to an embodiment of the present disclosure.

[0015] Figure 4B It is a schematic diagram showing a modified example of the green component.

[0016] Figure 4C It is a schematic diagram showing another modified example of the green body component.

[0017] Figure 4D It is a schematic diagram showing another modified example of the green body component.

[0018] Figure 5 1 is a schematic diagram showing an end surface of a blank component according to an embodiment of the present disclosure when viewed from a third direction.

[0019] Figure 6 FIG. 1 is a schematic diagram showing a green body component according to one embodiment of the present disclosure, in which an end portion of a main surface protection layer is shown by a dotted line.

[0020] Fig. 7A It is a schematic diagram showing a modified example of a blank component according to one embodiment of the present disclosure.

[0021] Figure 7B It is a schematic diagram showing another modified example of the green body component.

[0022] Fig. 8A This is a schematic diagram showing a state where an electrode body sheet is formed on a dielectric sheet in a method for producing a multilayer ceramic electronic component according to an embodiment of the present disclosure.

[0023] Figure 8B It is a schematic diagram showing a modified example of a state in which an electrode body sheet is formed on a dielectric sheet.

[0024] Figure 8C It is a schematic diagram showing a state where a plate body is formed on a dielectric sheet.

[0025] Fig. 9 This is a schematic diagram of a mother laminated body in a method for producing a laminated ceramic electronic component according to an embodiment of the present disclosure.

[0026] Fig.10 This is a schematic diagram showing a planned cutting line of a mother laminated body in a method for producing a laminated ceramic electronic component according to an embodiment of the present disclosure.

[0027] Fig.11A This is a diagram showing a state in which green body components are arranged with their side surfaces being open in a method for producing a multilayer ceramic electronic component according to an embodiment of the present disclosure.

[0028] Fig. 11B This is a diagram showing a state where a side protector is attached to the other cut side surface of the base component.

[0029] Fig.12 This is a schematic diagram showing a step of pressing a cut side surface that will become the lower surface of a green body precursor against a side protection layer body in a method for producing a multilayer ceramic electronic component according to an embodiment of the present disclosure.

[0030] Fig.13 Schematic diagram showing a component body and a base layer according to one embodiment of the present disclosure. DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of a laminated ceramic electronic component and a method of manufacturing the laminated ceramic electronic component of the present disclosure will be described with reference to the drawings.

[0032] Conventionally, electronic components mounted on wiring boards of electronic devices have been becoming more functional and smaller. Multilayer ceramic capacitors are one example of such electronic components.

[0033] In a laminated ceramic capacitor, it is required to increase the volume of the capacitance forming part to increase the electrostatic capacitance obtained. Therefore, it is important to increase the area ratio of the internal electrodes by reducing the dielectric thickness between the internal electrode layers or reducing the edge of the outer case for protecting the internal parts.

[0034] Among methods for thinning the edge of a housing, there is known a method of cutting a mother block having internal electrode layers and ceramic green sheets alternately stacked along two orthogonal cutting lines and pasting a thin ceramic protective layer on the cut side surface where the internal electrode is exposed to form a protective layer.

[0035] For example, Patent Document 1 discloses pasting a ceramic green sheet on the cut side of a green chip or a rod-shaped green block to form a green ceramic protective layer, and then heating and pressing them together at a temperature below 200°C to improve the adhesion between the green chip or the rod-shaped green block and the ceramic protective layer.

[0036] However, in the conventional technology described in Patent Document 1, since the moisture resistance is insufficient, there is a need for a laminated ceramic electronic component having excellent moisture resistance, a laminated ceramic, and a method for producing a laminated ceramic electronic component.

[0037] Hereinafter, a laminated ceramic electronic component 1 and a method for manufacturing the laminated ceramic electronic component 1 according to an embodiment of the present disclosure will be described with reference to the accompanying drawings. In addition, a laminated ceramic capacitor as an example of the laminated ceramic electronic component 1 will be described below, but the laminated ceramic electronic component as the object of the present disclosure is not limited to the laminated ceramic capacitor, and can also be applied to various laminated ceramic electronic components such as a laminated piezoelectric element, a laminated thermistor element, a laminated chip coil, and a laminated ceramic multilayer substrate.

[0038] In addition, the figures used in the following description are schematic drawings, and the dimensional ratios on the drawings may not be consistent with the actual situation. In addition, the various embodiments described in this specification are exemplary and can be partially replaced between different embodiments and modified examples. In addition, different embodiments and modified examples can also be partially combined.

[0039] Figure 1 1 is a schematic diagram of a laminated ceramic electronic component 1 according to an embodiment of the present disclosure. The laminated ceramic electronic component 1 has a component body 2 and an external electrode 3. The shape of the component body 2 can be appropriately set. As an example, the component body 2 is a substantially rectangular parallelepiped shape. As an example, the external electrode 3 is provided on a pair of end faces of the component body 2 and is formed by extending to other faces adjacent to the end faces.

[0040] For convenience, an orthogonal coordinate system consisting of a first direction, a second direction, and a third direction is marked in the accompanying drawings. Any direction of the laminated ceramic electronic component 1 disclosed in the present invention can be the first direction, the second direction, or the third direction. However, for convenience, the stacking direction of the internal electrode layer 41 and the dielectric layer 52 described later is defined as the first direction. In addition, a direction intersecting with the first direction and roughly parallel to the short side of the component body 2 having a roughly rectangular shape is defined as a second direction. In addition, a direction intersecting with the second direction and roughly parallel to the long side of the component body 2 having a roughly rectangular shape is defined as a third direction. In addition, for convenience, the first direction is sometimes set to the up-and-down direction, the second direction is set to the left-and-right direction, and the third direction is set to the front-and-back direction.

[0041] The component body 2, which is roughly rectangular in shape, has six faces. The faces located above and below the component body 2 in the first direction are defined as principal faces, the faces located to the left and right of the component body 2 in the second direction are defined as side faces, and the faces located in front and behind the component body 2 in the third direction are defined as end faces. The definitions of the principal face, the side face, and the end face are also similarly defined in the laminated portion 4 described later that constitutes the component body 2. In addition, the definitions of the principal face, the side face, and the end face are also similarly defined in the principal face protective layer 5 described later that constitutes the component body 2. In addition, the definitions of the principal face, the side face, and the end face are also similarly defined in the green body part 23 described later that constitutes the component body 2. In addition, the definitions of the principal face, the side face, and the end face are also similarly defined in the green body precursor 210 described later before firing. In addition, the definitions of the principal face, the side face, and the end face are also similarly defined in the mother laminated body 220 described later.

[0042] The external electrode 3 has a base layer connected to the component body 2 and a plated outer layer for facilitating soldering and mounting of the external electrode 3 for external wiring. The base layer can be coated on the component body 2 after firing and fired, or it can be set on the component body 2 before firing and fired at the same time as the component body 2. The base layer and the plated outer layer can be multi-layered according to the required functions. In addition, the external electrode 3 can have a base layer and a conductive resin layer.

[0043] Figure 2A is a schematic diagram of a component body 2 according to an embodiment of the present disclosure, Figure 2B 2 is a schematic diagram showing the various structures of the component body 2 separately. Figure 2B As shown, the component body 2 has a laminated portion 4, a pair of main surface protective layers 5 located on two main surfaces of the laminated portion 4 in a first direction, and a pair of side surface protective layers 6 located on two side surfaces of the laminated portion 4 and the main surface protective layers 5 in a second direction. In addition, the laminated portion 4 and the main surface protective layers 5 are sometimes collectively referred to as a blank component 23.

[0044] Figure 2A as well as Figure 2B 1 and 2 are diagrams showing the component body 2 before firing and after firing. The component body 2 after firing shrinks due to firing, but has substantially the same structure as the component body 2 before firing.

[0045] In the stacked portion 4, a plurality of internal electrode layers 41 connected to the external electrode 3 and a plurality of dielectric layers 52 are stacked in the first direction. The dielectric layer 52 may use various ceramic dielectrics as a main component. As an example, the main component of the dielectric layer 52 is barium titanate. In addition, the internal electrode layer 41 may use various metals such as nickel, palladium, silver, copper, etc. as a main component. As an example, the main component of the internal electrode layer 41 is nickel. In addition, in the present disclosure, the main component means a component having a composition ratio of 80% or more.

[0046] The pair of main surface protection layers 5 are located in the first direction on both main surfaces of the laminated portion 4. As shown in Fig. 2 , the main surface protection layer 5 includes a dielectric layer 52 and a plate 51, and the dielectric layer 52 and the plate 51 are laminated in the first direction.

[0047] The main component of dielectric layer 52 can be set appropriately. As an example, dielectric layer 52 may have the same main component as dielectric layer 52 in laminated portion 4 .

[0048] In addition, the main component of the plate 51 can be appropriately set. For example, the main component of the plate 51 can be various metals such as nickel, palladium, silver, copper, etc., or ceramics. As an example, in one embodiment of the present disclosure, the main component of the plate 51 is the same as that of the internal electrode layer 41 of the stacked portion 4.

[0049] like Figure 2A as well as Figure 2B As shown, in one embodiment of the present disclosure, the plate 51 is located at both ends of the main surface protection layer 5 in the third direction. However, the position of the plate 51 can be any one of the two ends of the main surface protection layer 5, and is not limited to Figure 2A as well as Figure 2B As an example, Figure 2A as well as Figure 2B The plate 51 extends from both end surfaces of the main surface protection layer 5 in the third direction. Figure 2A as well as Figure 2B In the example of FIG. 5 , a portion of the plate 51 is located at both end surfaces of the main surface protection layer 5 in the third direction.

[0050] The shape of the plate 51 when viewed from the first direction can be appropriately set. Specifically, in one embodiment of the present disclosure, when viewed from the first direction, the shape of the plate 51 is a rectangle with the second direction as the long side and the third direction as the short side.

[0051] Figure 3A 2 is a schematic diagram of the side of the blank component 23 when the blank component 23 is viewed from the second direction. In the pair of main surface protection layers 5, the plate 51 is located on both sides of the main surface protection layer 5 in the third direction. Figure 3AAs shown, the plates 51 are provided at the four corners of the side surface of the green body component 23 viewed from the second direction. Thus, by locating the plates 51 at the four corners of the side surface of the green body component 23, it is possible to reduce the adhesion failure of the side protection layer 6 at the four corners of the green body component 23 before firing.

[0052] Figure 3B As a comparative example, a green body component 23 is shown in which the main surface protection layer 5 does not have the plate 51. Figure 3B In the green body component 23 shown, the main surface protection layer 5 is composed only of the dielectric layer 52. When the side protection layer 6 is bonded to the side surface of the green body component 23 before firing by pressing, the bonding failure of the side protection layer 6 is more likely to occur at the four corners than at the center of the side surface.

[0053] In the central part of the side, there is a hard structure such as the internal electrode layer 41, and it is easy to apply pressure, but there is no hard structure such as the internal electrode layer 41 at the four corners, and it is difficult to apply pressure. Therefore, in the comparative example, the pressing force at the four corners of the side of the blank component 23 is insufficient, which easily causes poor adhesion of the side protection layer 6. Although it is also possible to paste by applying a greater pressure, since the blank component 23 before firing is soft, when a greater pressure is applied, it is easy to cause deformation and interlayer delamination of the internal electrode layer 41 and the dielectric layer 52. If it is easy to cause poor adhesion between the blank component 23 and the side protection layer 6, it is easy to cause moisture to enter from the outside, which reduces moisture resistance.

[0054] In the laminated ceramic electronic component 1 of one embodiment of the present disclosure, when the side protection layer 6 is bonded to the side of the green body part 23 by the plate 51 located at the four corners of the side of the green body part 23, it is also easy to apply pressure to the four corners of the side of the green body part 23, which can reduce the poor bonding of the side protection layer 6 at the four corners of the green body part 23. In addition, the plate 51 is located on both end sides of the main surface protection layer 5 and the green body part 23, which can reduce the deformation of the internal electrode layer 41 and the dielectric layer 52 due to the pressure from the side direction of the green body part 23. Therefore, according to one embodiment of the present disclosure, a laminated ceramic electronic component with excellent moisture resistance can be provided.

[0055] like Figure 3A as well as Figure 3B As shown, in one embodiment of the present disclosure, if the length of the plate 51 in the third direction is defined as L1, and the length from one end surface of the stacking portion 4 to the end of the internal electrode layer 41 extending from the other end surface of the stacking portion 4 in the third direction is defined as L2, then preferably L1≥L2.

[0056] When manufacturing the green body component 23, after laminating the lamination portion 4 and the main surface protection layer 5, in order to improve the adhesion between the internal electrode layer 41 and the dielectric layer 52, pressure is applied from the first direction. This pressurization from the first direction makes it easier to apply pressure to a portion with more hard structures such as the internal electrode layer 41, and the adhesion is higher. On the other hand, it is more difficult to apply pressure to a portion with fewer hard structures such as the internal electrode layer 41, and the adhesion between the internal electrode layer 41 and the dielectric layer 52 is lower. If the adhesion between the internal electrode layer 41 and the dielectric layer 52 is low, it is easy to cause water to enter, which reduces moisture resistance.

[0057] The internal electrode layer 41 extends from one end face of the laminated portion 4 to the front of the other end face. In other words, in the third direction, there is a distance between one end face of the laminated portion 4 and the end of the internal electrode layer 41 extending from the other end face of the laminated portion 4, and the internal electrode layer 41 does not exist in this portion. Therefore, when the green body component 23 is viewed from the first direction, the number of stacked layers of the internal electrode layer 41 is reduced in the portions located at the two end sides in the third direction compared to other portions. Therefore, when the green body component 23 is pressurized from the first direction, it is difficult to apply pressure to the portions located at the two end sides in the third direction in the green body component 23 viewed from the first direction, and the adhesion between the internal electrode layer 41 and the dielectric layer 52 is easily reduced.

[0058] As shown in one embodiment of the present disclosure, when the plates 51 are arranged at the portions located at both ends of the green body component 23 in the third direction, it becomes easy to apply pressure to both ends of the green body component 23 in the third direction when pressurization is performed from the first direction. Therefore, the adhesion between the internal electrode layer 41 and the dielectric layer 52 at both ends of the green body component 23 in the third direction can be improved, and a laminated ceramic electronic component with excellent moisture resistance can be provided.

[0059] Furthermore, in the case where L1 ≥ L2, the plate 51 can be configured to overlap with the portion to which pressure is difficult to apply when viewed from the first direction. Therefore, when pressure is applied from the first direction, it is easier and more effective to apply pressure to both end sides of the green body component 23 in the third direction, thereby improving the adhesion between the internal electrode layer 41 and the dielectric layer 52. By improving the adhesion of both end sides of the green body component 23, it is possible to reduce the intrusion of moisture from the end side of the green body component 23, thereby providing a laminated ceramic electronic component with excellent moisture resistance. In addition, by improving the adhesion of both end sides of the green body component 23, the strength of both end sides of the green body component 23 is increased, so when the side protection layer 6 is bonded to the side of the green body component 23, it is easier and more effective to apply pressure to a large range of the four corners of the side of the green body component 23, thereby more effectively reducing the poor adhesion of the side protection layer 6 at the four corners of the green body component 23.

[0060] In addition, in the case of L1≥L2, since the length of the plate 51 located at the four corners of the side of the green body component 23 in the third direction becomes longer, when the side protection layer 6 is bonded to the side of the green body component 23, the portion where pressure is easily applied becomes larger, and the poor bonding of the side protection layer 6 at the four corners of the green body component 23 can be reduced in a wider range. In addition, in the case of L1≥L2, the deformation of the internal electrode layer 41 and the dielectric layer 52 caused by pressing from the side direction of the green body component 23 can be reduced in a wider range. Therefore, in the case of L1≥L2 as in one embodiment of the present disclosure, a laminated ceramic electronic component 1 with excellent moisture resistance can be provided.

[0061] Figure 4A to Figure 4D The following are examples and modifications of the green body component 23 in the multilayer ceramic electronic component 1 of the present disclosure. Figure 4A In one embodiment of the described blank component 23, at least a portion of the plate 51 is located on the main surface of at least one main surface protection layer 5 in the first direction. Figure 4A In one embodiment of the described blank component 23 , at least a portion of the plate 51 is located laterally of the at least one main surface protection layer 5 in the second direction.

[0062] By positioning at least a portion of the plate 51 on the main surface of at least one main surface protective layer 5 in the first direction, it is easy to apply pressure to the four corners of the side surface of the blank component 23, thereby more effectively reducing the poor adhesion of the side protective layer 6. In addition, by positioning at least a portion of the plate 51 on the side surface of at least one main surface protective layer 5 in the second direction, it is easy to apply pressure to the four corners of the side surface of the blank component 23, thereby more effectively reducing the poor adhesion of the side protective layer 6.

[0063] The green body component 23 in the laminated ceramic electronic component 1 of the present disclosure is not limited to Figure 4A For example, Figure 4B As shown in one variation of the described blank component 23 , when the main surface protection layer 5 is viewed from the first direction, the plates 51 may be located at four corners of the main surface of the main surface protection layer 5 and spaced apart from each other.

[0064] exist Figure 4B In a modified example of the blank component 23 described, at least a portion of the plate 51 is located on the main surface of at least one main surface protection layer 5 in the first direction, and at least a portion of the plate 51 is located on the side surface of at least one main surface protection layer 5 in the second direction. Therefore, since it is easy to apply pressure to the four corners of the side surface of the blank component 23, poor adhesion of the side protection layer 6 can be more effectively reduced.

[0065] Figure 4A as well as Figure 4BThis represents an example in which at least a portion of the plate 51 is located on the main surface and the side surface of at least one main surface protection layer 5, but is not limited to this example. Figure 4C As shown, the plate 51 may be a structure that is not located on the side of the main surface protection layer 5 in the second direction. In other words, the plate 51 may be located only inside the main surface protection layer 5 in the second direction. Figure 4D As shown, the plate 51 may be a structure that is not located on the main surface of the main surface protection layer 5 in the first direction. In other words, the plate 51 may be located only inside the main surface protection layer 5 in the first direction.

[0066] In the component body 2 of one embodiment of the present disclosure shown in FIG. 2 , the thickness of the plates 51 is shown to be the same, but the thickness of the plates 51 is not limited to this example, and the thickness of the plates 51 can be appropriately set. Figure 5 As shown, if the thickness of the plate 51 in the first direction is defined as T1 and the thickness of the internal electrode layer 41 is defined as T2, it is preferred that T1 ≥ T2.

[0067] In the case of such a structure, the strength of the plate 51 becomes greater than the strength of the internal electrode layer 41, and when the side protection layer 6 is bonded to the side of the green component 23, it is easy to effectively apply pressure to the four corners of the side of the green component 23, so that it is possible to more effectively reduce the poor bonding of the side protection layer 6 at the four corners of the green component 23. In addition, in the case of T1 ≥ T2, by increasing the strength of the plate 51, it is possible to more effectively reduce the deformation of the internal electrode layer 41 and the dielectric layer 52 caused by pressing from the side direction of the green component 23. Therefore, in the case of T1 ≥ T2, it is possible to provide a laminated ceramic electronic component 1 with excellent moisture resistance.

[0068] In the laminated ceramic electronic component 1 of one embodiment of the present disclosure, the portion of the main surface protection layer 5 that overlaps with the board 51 when viewed from the first direction is the main surface protection layer end 7. As an example, the main surface protection layer end 7 is Figure 6 The portion surrounded by the dotted line in the blank component 23 described in . For example, in one embodiment of the present disclosure, the volume of the plate 51 accounts for preferably 20% or more of the volume of the main surface protection layer end portion 7 .

[0069] In the case of forming such a structure, the strength of the main surface protection layer end portions 7 located at the four corners of the side surface of the green body component 23 is increased, and when the side protection layer 6 is bonded to the side surface of the green body component 23, it is easy to effectively apply pressure to the four corners of the side surface of the green body component 23, so that the bonding failure of the side protection layer 6 at the four corners of the green body component 23 can be more effectively reduced. In addition, by increasing the strength of the main surface protection layer end portions 7, the deformation of the internal electrode layer 41 and the dielectric layer 52 caused by pressing from the side direction of the green body component 23 can be more effectively reduced. Therefore, by making the ratio of the volume of the plate 51 to the volume of the main surface protection layer end portions 7 20% or more, a laminated ceramic electronic component 1 with excellent moisture resistance can be provided.

[0070] In one embodiment of the present disclosure, the main component of the plate 51 is the same as that of the internal electrode layer 41 of the laminate 4. Thus, by making the main component of the plate 51 the same or similar to that of the internal electrode layer 41, internal defects such as cracks and delamination caused by mismatching of sintering shrinkage during sintering can be reduced.

[0071] The composition of the plate 51 does not need to be completely the same as the composition of the internal electrode layer 41, and the composition can be adjusted appropriately. For example, the plate 51 can contain a ceramic component while having the composition of the internal electrode layer 41 as a main component. In this case, the amount of the ceramic component of the plate 51 can be adjusted appropriately, but as an example, the amount of the ceramic component of the plate 51 can be equal to or greater than the amount of the ceramic component contained in the internal electrode layer 41.

[0072] In the case of such a structure, the strength of the plate 51 located at the four corners of the side of the green component 23 becomes greater than the strength of the internal electrode layer 41, and when the side protection layer 6 is bonded to the side of the green component 23, it is easy to effectively apply pressure to the four corners of the side of the green component 23, so that the bonding failure of the side protection layer 6 at the four corners of the green component 23 can be more effectively reduced. In addition, by increasing the strength of the plate 51, the deformation of the internal electrode layer 41 and the dielectric layer 52 caused by pressing from the side direction of the green component 23 can be more effectively reduced. Therefore, by making the amount of the ceramic component contained in the plate 51 equal to or greater than the amount of the ceramic component contained in the internal electrode layer 41, it is possible to provide a laminated ceramic electronic component 1 with excellent moisture resistance.

[0073] In one embodiment of the present disclosure, an example is described in which the main component of the plate 51 is the same as that of the internal electrode layer 41 of the laminated part 4, but the present invention is not limited to this example. For example, the plate 51 may include a ceramic component as a main component, and other additives may be added. In addition, the plate 51 may be composed only of a ceramic component.

[0074] In one embodiment of the present disclosure, the number of stacked layers of the plates 51 in the first direction of one main surface protection layer 5 can be appropriately set. For example, the number of stacked layers of the plates 51 in the first direction can be one layer or multiple layers. As an example, the number of stacked layers of the plates 51 in the first direction of one main surface protection layer 5 can be 3 or more.

[0075] In the case of such a structure, since more plates 51 are provided at the four corners of the side surface of the green component 23, when the side protection layer 6 is bonded to the side surface of the green component 23, it is easy to effectively apply pressure to the four corners of the side surface of the green component 23, so that the poor bonding of the side protection layer 6 at the four corners of the green component 23 can be more effectively reduced. In addition, by increasing the number of stacked plates 51, the deformation of the internal electrode layer 41 and the dielectric layer 52 caused by pressing from the side direction of the green component 23 can be more effectively reduced. Therefore, by setting the number of stacked plates 51 in the first direction of one main surface protection layer 5 to 3 or more, a laminated ceramic electronic component 1 with excellent moisture resistance can be provided.

[0076] In one embodiment of the present disclosure, when viewed from the first direction, the shape of the plate 51 is a rectangle with the second direction as the long side and the third direction as the short side, but the shape of the plate 51 when viewed from the first direction can be appropriately set. For example, Fig. 7A As shown, the shape of the plate 51 when viewed from the first direction may include an elliptical shape or may be as shown in FIG. Figure 7B As shown, including triangular shapes.

[0077] The plate 51 has Fig. 7A as well as Figure 7B In the case of the structure shown in FIG. 1 , the length L1 of the plate 51 in the third direction can be defined based on any part of the plate 51. Fig. 7A as well as Figure 7B As shown, the length of the longest portion of the plate 51 in the third direction may be defined as L1.

[0078] In addition, in one embodiment of the present disclosure, although the length L2 from one end face of the stacked portion 4 to the end of the internal electrode layer 41 extending from the other end face of the stacked portion 4 in the third direction is shown as an example that is the same for multiple internal electrode layers 42, the present invention is not limited to this example. For multiple internal electrode layers 41, L2 may be constant or different.

[0079] For example, when L2 is different for a plurality of internal electrode layers 41 , the shortest one may be defined as a representative and L2 , the longest one may be defined as a representative and L2 , or the average value may be defined as a representative and L2 .

[0080] like Figure 3A As shown, in the third direction, the length from one end surface to the other end surface of the main surface protection layer 5 is defined as L3. The relative length of L1 to L3 can be appropriately set. For example, in one embodiment of the present disclosure, it can be set to L1≥(1 / 8)×L3.

[0081] In the case of such a structure, since the length of the plate 51 located at the four corners of the side of the green component 23 in the third direction becomes longer, when the side protection layer 6 is bonded to the side of the green component 23, it is easy to apply pressure in a wide range at the four corners of the side of the green component 23, so that the poor bonding of the side protection layer 6 at the four corners of the green component 23 can be more effectively reduced. In addition, in the case of L1 ≥ (1 / 4) × L3, the deformation of the internal electrode layer 41 and the dielectric layer 52 caused by pressing from the side direction of the green component 23 can be reduced in a larger range. Therefore, in the case of L1 ≥ (1 / 8) × L3 as in one embodiment of the present disclosure, a laminated ceramic electronic component 1 with excellent moisture resistance can be provided.

[0082] (Method for manufacturing multilayer ceramic electronic component)

[0083] Below, refer to Figure 8A to Figure 8C , a method for manufacturing the component body 2 and the multilayer ceramic electronic component 1 of the present disclosure will be described.

[0084] First, a dielectric sheet is arranged on a carrier film and dried to form a dielectric sheet. The thickness of the dielectric sheet 420 can be, for example, about 1 to 10 μm. The thinner the thickness of the dielectric sheet 420, the higher the electrostatic capacitance of the laminated ceramic capacitor. The arrangement of the dielectric sheet 420 is performed, for example, by using a die coater, but is not limited thereto. For example, a blade coater or a gravure coater can be used.

[0085] The dielectric sheet 420 may be made of various ceramic dielectric materials. As an example, the dielectric sheet 420 is made by wet-grinding and mixing a mixed powder of ceramics with additives added to barium titanate using a bead mill, and then mixing a polyvinyl butyral-based binder, a plasticizer, and an organic solvent into the pulverized and mixed slurry.

[0086] Next, if Fig. 8A as well as Figure 8B As shown, electrode bodies 410 which will later become internal electrode layers 41 are printed at intervals on the dielectric sheet 420 produced as described above. Fig. 8A and Figure 8BThe electrode body 410 including a metal material to be the internal electrode layer 41 is printed in two conductor patterns with different polarities. The electrode body 410 can be made of various metals. Specifically, in one embodiment of the present disclosure, the electrode body 410 is made of a conductive paste mainly composed of Ni.

[0087] As long as the characteristics as a capacitor can be ensured, the thinner the thickness of the electrode body 410 is, the more internal defects caused by internal stress can be prevented. In the case of a capacitor with a high number of stacking numbers, the thickness of the electrode body 410 can be, for example, 1.0 μm or less.

[0088] The electrode bodies 410 are printed at intervals of a distance P.

[0089] Figure 8C This means that a plate body 510, which will subsequently become a plate 51, is printed on a dielectric sheet 520 on which a main surface protective layer 5 is formed, so as to form a strip-shaped pattern. When the strip-shaped plate 51 is cut after lamination to form a blank component 23, the strip-shaped plate 51 is arranged as a continuous plate between a pair of cut side surfaces. When the length of the plate 51 in the second direction is defined as L4, L4 is greater than or equal to the distance P. However, when the plate 51 is located at the end of the dielectric sheet 520, L4 does not necessarily need to be greater than or equal to the distance P.

[0090] The plate body 510 may include various metals such as Ni, Pd, Cu, Ag, or alloys thereof. Specifically, in one embodiment of the present disclosure, the plate body 510 is made of the same conductive paste with Ni as the main component as the electrode body 410, so that the plate body 510 can be fired under the same conditions as the electrode body 410.

[0091] The printing of the electrode body 410 and the plate body 510 is performed by screen printing, but the invention is not limited to this example and may be performed by gravure printing or the like, for example.

[0092] Fig. 9 This is a perspective view schematically showing a state in which a plurality of dielectric sheets 420 printed with electrode bodies 410 and dielectric sheets 520 printed with plate bodies 510 are stacked in the first direction. One or more dielectric sheets 520 printed with plate bodies 510 are stacked, and a plurality of dielectric sheets 420 printed with electrode bodies 410 having different polarities are alternately stacked thereon, and further, one or more dielectric sheets 520 printed with plate bodies 510 are stacked. At this time, when viewed from the first direction, the plate body 510 is arranged at a position overlapping with the interval between the electrode bodies arranged at a distance P.

[0093] In addition, if Fig. 9As shown, a portion where one or more dielectric sheets 520 printed with plate bodies 510 are stacked is particularly referred to as a main surface protection layer body 50 , and a portion where a plurality of dielectric sheets 420 printed with electrode bodies 410 having different polarities are alternately stacked is referred to as a stacked body 40 .

[0094] Thus, the step of arranging a pair of main surface protection layer bodies 50 on both sides of the stacked body 40 in which the plurality of electrode bodies 410 and the plurality of dielectric sheets 420 are stacked in the first direction to produce the mother stacked body 220 is set as the first step.

[0095] Next, the mother laminate 220 is pressed from the first direction as the lamination direction to obtain Fig.10 The integrated mother laminate 220 is shown. This step is called the second step. Pressurization can be performed using a hydrostatic pressurization device, for example.

[0096] The pressure applied from the first direction is easier to apply to the portion with more interlacing such as the electrode body 410, and the adhesion between the electrode body 410 and the dielectric sheet 420 is higher. On the other hand, it is more difficult to apply pressure to the portion with fewer interlacing, and the adhesion between the electrode body 410 and the dielectric sheet 420 is lower.

[0097] In one embodiment of the present disclosure, when viewed from the first direction, the plate body 510 is arranged at a position overlapping with the interval between the electrode bodies 410 arranged at a distance P. Therefore, due to the presence of the plate body 510, during the pressurization in the second step, it becomes easy to apply pressure to a portion that is difficult to apply pressure without the plate body 510, in other words, to a portion overlapping with the interval between the electrode bodies 410, and the adhesion between the electrode body 410 and the dielectric sheet 420 in this portion can be improved.

[0098] Next, the mother laminated body 220 is cut along a plane perpendicular to a third direction intersecting the first direction. Fig.10 The cutting plane at this time is indicated by the planned cutting line 82. This step is referred to as the third step. Similarly, the mother laminate 220 is cut on a plane perpendicular to the second direction intersecting the third direction. Fig.10 The cutting plane at this time is indicated by the predetermined cutting line 81. This step is called the fourth step. In addition, either the third step or the fourth step can be performed first.

[0099] The mother laminate 220 is cut through the third step and the fourth step to obtain the green body precursor 210 which becomes the green body component 23 after firing. In addition, as a cutting method, a method using a press cutting device is given as an example, but it is not limited to this. For example, as a cutting method, a dicing saw device or the like can also be used.

[0100] Then, if Fig.11AAs shown, the green body precursor 210 before firing is arranged so that the cut side surfaces in the second direction become open surfaces, and the side protection layer body 60 is attached.

[0101] The material of the side protection layer 60 can be appropriately set, and a material that is easy to bond with the green body precursor 210 before firing and does not affect the characteristics of the product even after the firing process can be selected. For example, the composition of the ceramic raw material of the side protection layer 60 can be the same as or similar to the composition of the green body precursor 210. Since organic components such as organic binders and solvents are removed in the degreasing step before firing, a composition that is easy to bond with the green body precursor 210 can be selected as the material of the side protection layer 60.

[0102] For example, a polyvinyl butyral adhesive can be used as an organic adhesive for the side protective layer 60 in one embodiment of the present disclosure. The polyvinyl butyral adhesive has excellent plasticity and adhesion. In addition, if an adhesive with a low glass transition temperature Tg is selected, the adhesiveness with the plasticizer can be improved by heating it to 30°C above Tg. It can also be dissolved in a mixed solvent of ethanol and toluene together with a plasticizer, mixed and dispersed in a slurry of ceramic raw materials to make the side protective layer 60.

[0103] like Fig.12 As shown, the cut side surface, which is the lower surface of the green body precursor 210, is pressed against the side protection layer body 60. At this time, the side protection layer body in contact with the green body precursor 210 is bonded to the green body precursor 210.

[0104] In the cut side surface as the pasted surface, since the main surface protective layer body 50 located at the four corners is provided with a plate body 510 satisfying L1 ≥ L2, it is possible to make the pressing uniform over the entire pasted surface. Therefore, it is easy to control the pressing for pasting the side protective layer body 60, and it is possible to reduce the poor adhesion of the side protective layer body 60. In addition, when deformation occurs, the additional pressing for pasting the side protective layer body 60 to the deformed part again will cause a defect, so it is possible to paste with a lower pressing pressure than in the case where there is no plate body 510. The pressing pressure can be, for example, 30kg / cm 2 ~100kg / cm 2 within the range.

[0105] Fig.11A This indicates a state where the side protection layer 60 is attached to one cut side surface, and the side protection layer 60 is attached to the other cut side surface in the same manner. Fig. 11B Thus, the step of attaching the side protection layer 60 to the cut side surface of the green body precursor 210 before firing is made into the fifth step.

[0106] After the above steps, the component body 2 before firing can be obtained. The component body 2 before firing is degreased in a nitrogen atmosphere and fired in a hydrogen / nitrogen mixed atmosphere to obtain Figure 2A The component body 2 is shown.

[0107] After firing, as an example, a conductive paste mainly composed of copper is applied to both end surfaces of the component body 2, and then fired to form a base electrode of the external electrode 3, and then the external electrode 3 is plated with Ni, Sn, or Cu to form a substrate. Figure 1 The laminated ceramic electronic component 1 shown. A conductive resin electrode may also be added to the constituent material of the external electrode 3. In addition, the external electrode 3 is coated by immersing in a conductive paste such as Cu paste, but the external electrode 3 may also be formed by growing a metal plating layer such as Cu around the exposed metal portion of the component body 2.

[0108] Fig.13 is Figure 2A The component body 2 is made by electroless Cu plating or electrolytic Cu plating to form the base layer 31, and then, by superimposing electrolytic Ni plating and electrolytic Sn plating. However, the method for making the base layer 31 is not limited to this example. For example, both electroless Cu plating and electrolytic Cu plating can be used to make the base layer 31. In addition, a resin electrode can also be installed on the base layer 31 formed by direct plating.

[0109] According to the above-described laminated ceramic electronic component and the method for producing the laminated ceramic electronic component, it is possible to reduce poor adhesion between the laminated portion and the side protection layer, thereby providing a laminated ceramic electronic component having excellent moisture resistance.

[0110] The multilayer ceramic electronic component of the present disclosure can be implemented in the following configurations (1) to (10).

[0111] (1) A multilayer ceramic electronic component comprising:

[0112] a stacking portion in which a plurality of internal electrode layers and a plurality of dielectric layers are stacked in a first direction;

[0113] a pair of main surface protection layers, located on two main surfaces of the stacked portion in the first direction;

[0114] a pair of side protection layers, located on two sides of the stacked portion and the main surface protection layer in a second direction intersecting the first direction;

[0115] plates, located at both end sides of the main surface protection layer in a third direction intersecting the second direction;

[0116] If the length of the plate in the third direction is set to L1,

[0117] The length from one end surface of the laminated portion to the end portion of the internal electrode layer extending from the other end surface of the laminated portion in the third direction is defined as L2.

[0118] Then L1≥L2.

[0119] (2) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0120] In the first direction, the plate is located on a main surface of at least one of the main surface protection layers.

[0121] (3) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0122] In the second direction, a portion of the plate is located on the side of at least one of the main surface protection layers.

[0123] (4) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0124] If the thickness of the plate in the first direction is set to T1,

[0125] The thickness of the internal electrode layer in the first direction is set to T2,

[0126] Then T1≥T2.

[0127] (5) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0128] If the portion of the main surface protection layer that overlaps with the plate when viewed from the first direction is regarded as the end of the main surface protection layer,

[0129] The volume of the plate accounts for more than 20% of the volume of the end of the main surface protection layer.

[0130] (6) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0131] The main component of the plate is the same as the main component of the internal electrode layer.

[0132] (7) The multilayer ceramic electronic component according to the above-mentioned structure (6),

[0133] The plate has a ceramic composition,

[0134] The plate contains a ceramic component in an amount equal to or greater than an amount of the ceramic component contained in the internal electrode layer.

[0135] (8) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0136] A plurality of the plates are stacked in the first direction, and the number of stacked plates is 3 or more.

[0137] (9) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0138] The L2 is the shortest length of the lengths from one end surface of the laminated portion to the end portions of the plurality of internal electrode layers extending from the other end surface of the laminated portion in the third direction.

[0139] (10) The multilayer ceramic electronic component according to the above-mentioned structure (1),

[0140] The L1 is the longest length of the plate in the third direction.

[0141] The method for producing a multilayer ceramic electronic component disclosed herein can be implemented in the form of the following structure (11).

[0142] (11) A method for manufacturing a multilayer ceramic electronic component, comprising:

[0143] In a first step, a mother laminate is manufactured by disposing a pair of main surface protection layer bodies on both sides of a laminate having a plurality of electrode bodies and a plurality of dielectric sheets laminated in a first direction.

[0144] A second step is to pressurize the mother laminate from the first direction;

[0145] A third step is to cut the mother laminated body at a plane perpendicular to a third direction intersecting the first direction to form a pair of cut end faces;

[0146] A fourth step is to cut the mother laminate at a plane perpendicular to a second direction intersecting the third direction to form a pair of cut side surfaces;

[0147] The fifth step is to attach a side protection layer to the pair of cut sides;

[0148] In the first step,

[0149] The electrode bodies are arranged on the dielectric sheet of the main surface protection layer body at intervals of a distance P in the third direction,

[0150] When viewed from the first direction, a plate having a length in the third direction that is greater than or equal to the distance P is arranged at a position overlapping the gap.

[0151] The embodiments of the present disclosure are described in detail above, but the present disclosure is not limited to the above embodiments, and various changes and improvements can be made within the scope of the present disclosure. Of course, all or part of the above embodiments can be appropriately combined within the scope of non-contradiction.

[0152] Explanation of symbols

[0153] 1: Laminated ceramic electronic components

[0154] 2: Component body

[0155] 21: Blank parts

[0156] 210: Green body precursor

[0157] 220: Mother laminate

[0158] 3: External electrode

[0159] 31: Basal layer

[0160] 4: Lamination

[0161] 40: Laminated

[0162] 41: Internal electrode layer

[0163] 410: Electrode body

[0164] 42: Dielectric layer

[0165] 420: Dielectric sheet

[0166] 5: Main surface protection layer

[0167] 50: Main surface protective layer

[0168] 51: Board

[0169] 510: Plate body

[0170] 6: Side protection layer

[0171] 60: Side protection layer

[0172] 7: Main surface protective layer end

[0173] 81, 82: Cut off the predetermined line.

Claims

1. A laminated ceramic electronic component having: a stacking portion in which a plurality of internal electrode layers and a plurality of dielectric layers are stacked in a first direction; a pair of main surface protection layers, located on two main surfaces of the stacked portion in the first direction; a pair of side protection layers, located on two sides of the stacked portion and the main surface protection layer in a second direction intersecting the first direction; plates, located at both end sides of the main surface protection layer in a third direction intersecting the second direction; If the length of the plate in the third direction is set to L1, The length from one end surface of the laminated portion to the end portion of the internal electrode layer extending from the other end surface of the laminated portion in the third direction is defined as L2. Then L1≥L2. 2 . The multilayer ceramic electronic component according to claim 1 , wherein the plate is located on a main surface of at least one of the main surface protection layers in the first direction. 3 . The multilayer ceramic electronic component according to claim 1 , wherein a portion of the plate is located on a side surface of at least one of the main surface protection layers in the second direction.

4. The multilayer ceramic electronic component according to claim 1, wherein, assuming that a thickness of the plate in the first direction is T1, The thickness of the internal electrode layer in the first direction is set to T2, Then T1≥T2.

5. The multilayer ceramic electronic component according to claim 1, wherein a portion of the main surface protective layer that overlaps with the board when viewed from the first direction is defined as an end portion of the main surface protective layer. The volume of the plate accounts for more than 20% of the volume of the end of the main surface protection layer. 6 . The multilayer ceramic electronic component according to claim 1 , wherein a main component of the plate is the same as a main component of the internal electrode layer.

7. The laminated ceramic electronic component according to claim 6, wherein the board has a ceramic component, The plate contains a ceramic component in an amount equal to or greater than an amount of the ceramic component contained in the internal electrode layer. 8 . The multilayer ceramic electronic component according to claim 1 , wherein a plurality of said plates are stacked in the first direction, and the number of stacked plates is 3 or more. 9 . The multilayer ceramic electronic component according to claim 1 , wherein L2 is the shortest length of lengths from one end surface of the multilayer portion to ends of the plurality of internal electrode layers extending from the other end surface of the multilayer portion in the third direction. 10 . The multilayer ceramic electronic component according to claim 1 , wherein L1 is the longest length of the board in the third direction.

11. A method for manufacturing a laminated ceramic electronic component, comprising: In a first step, a mother laminate is manufactured by disposing a pair of main surface protection layer bodies on both sides of a laminate having a plurality of electrode bodies and a plurality of dielectric sheets laminated in a first direction. A second step is to pressurize the mother laminate from the first direction; A third step is to cut the mother laminated body at a plane perpendicular to a third direction intersecting the first direction to form a pair of cut end faces; A fourth step is to cut the mother laminate at a plane perpendicular to a second direction intersecting the third direction to form a pair of cut side surfaces; The fifth step is to adhere a side protection layer to the pair of cut sides; In the first step, The electrode bodies are arranged on the dielectric sheet of the main surface protection layer body at intervals of a distance P in the third direction, When viewed from the first direction, a plate having a length in the third direction that is greater than or equal to the distance P is arranged at a position overlapping the gap.

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