Wafer carrier and chemical mechanical polishing equipment

Abstract

An embodiment of the present application provides a wafer carrier and a chemical mechanical polishing apparatus. The wafer carrier includes: a platform for placing a workpiece; a swing shaft fixedly connected to the platform; a support mechanism, the swing shaft being swingably connected to the support mechanism; a base provided with a receiving hole, the support mechanism being disposed in the receiving hole, and the support mechanism being capable of providing axial buffer support for the swing shaft when the swing shaft swings along with the platform; an elastic mechanism disposed between the platform and the base for deforming when the platform swings to adaptively support the platform. During the swinging process of the platform, since the support mechanism in the present application always moves along the axial direction of the receiving hole, the platform is effectively positioned, preventing the deviation of the axis, thereby ensuring the stability of the platform during the polishing operation.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of semiconductor processing, and in particular, to a wafer carrier and a chemical mechanical polishing device. Background Art

[0002] In semiconductor processing technology, polishing is an important process. In chemical mechanical polishing, the carrier platform is an important interaction device for the polishing head to pick and place workpieces (such as wafers). During the process of picking and placing workpieces, it is required that the carrier platform swing adaptively according to the tilt of the polishing head, and the carrier platform cannot rotate around the axis.

[0003] Currently, in the related art carrier platform, during the process of the polishing head picking and placing workpieces, when the polishing head tilts and presses down, it will cause the center of the carrier platform to shift, and the work is unreliable. In addition, it will also cause the carrier platform to have a rotational amount around the axis, resulting in the shift of the position of the carrier platform. Summary of the Invention

[0004] In view of this, embodiments of the present application provide a wafer carrier and a chemical mechanical polishing device to at least partially solve the above problems.

[0005] According to a first aspect of embodiments of the present application, a wafer carrier is provided, and the device includes: a platform for placing a workpiece; a swing shaft fixedly connected to the platform; a support mechanism, the swing shaft is swingably connected to the support mechanism, a base is provided with a receiving hole, the support mechanism is disposed in the receiving hole, and when the swing shaft swings along with the platform, the support mechanism can provide axial buffer support for the swing shaft; an elastic mechanism disposed between the platform and the base for deforming when the platform swings to adaptively support the platform.

[0006] Further, in the above wafer carrier, the support mechanism includes: a swing support member movably disposed along the axial direction of the receiving hole in the receiving hole, the swing shaft is swingably connected to the swing support member; an elastic support member disposed in the receiving hole, the swing support member is in pressure contact with the elastic support member, and the elastic support member is used for deforming when the swing support member moves along the axial direction of the receiving hole to buffer and support the swing support member.

[0007] Further, in the above wafer carrier, the swing support member includes: a support seat movably disposed along the axial direction of the receiving hole in the receiving hole and in pressure contact with the elastic support member; a support body, the support body is swingably disposed on the support seat, the support body is provided with a first mounting hole, and the swing shaft is disposed in the first mounting hole.

[0008] Further, in the above-mentioned wafer carrier, the support base is provided with a second mounting hole having a spherical inner surface; the support body has a spherical outer surface, the support body is disposed in the second mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the support body and the support base are swingably connected to each other.

[0009] Further, in the above-mentioned wafer carrier, the swing support member is an angular contact bearing; the swing shaft is disposed in the inner ring of the angular contact bearing, and the outer ring of the angular contact bearing is press-fitted with the elastic support member.

[0010] Further, in the above-mentioned wafer carrier, it further includes: a bearing pressure plate, which is press-fitted to the outer ring of the angular contact bearing and connected to the base.

[0011] Further, in the above-mentioned wafer carrier, the elastic support member includes: a first support seat, which is connected to the base and covers the accommodation hole of the base; a first elastic member, which is placed in the accommodation hole and connected to the first support seat, and the swing support member is press-fitted to the first elastic member.

[0012] Further, in the above-mentioned wafer carrier, at least two columns are formed on the surface of the first support seat placed in the accommodation hole; at least two first elastic members are provided and sleeved on the columns one by one; the elastic support member further includes: a pressure plate, the pressure plate is provided with through holes corresponding to the positions of the columns, the columns pass through the through holes so that the pressure plate is press-fitted to the first elastic member, and the swing support member is press-fitted to the pressure plate.

[0013] Further, in the above-mentioned wafer carrier, the accommodation hole is a stepped hole, the stepped hole includes a first accommodation hole close to the platform and a second accommodation hole far from the platform, the diameter of the first accommodation hole is smaller than the diameter of the second accommodation hole; the swing support member is placed in the first accommodation hole; part of the elastic support member is placed in the second accommodation hole.

[0014] Further, in the above-mentioned wafer carrier, the first elastic member is any one of a spring, a spring sheet, and an elastic column.

[0015] Further, in the above-mentioned wafer carrier, it further includes: a limit pin, which is fixedly connected to the base; a swing member, the platform is swingably connected to the swing member, the swing member is provided with a columnar hole, the limit pin is partially placed in the columnar hole, and the swing member can move along the limit pin when the platform swings.

[0016] Further, in the above-mentioned wafer carrier, the swinging member includes: a mounting seat fixedly connected to the platform; a swinging body swingably disposed on the mounting seat, and the swinging body is provided with the columnar hole.

[0017] Further, in the above-mentioned wafer carrier, the mounting seat is provided with a third mounting hole having a spherical inner surface; the swinging body has a spherical outer surface, the swinging body is disposed in the third mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the swinging body and the mounting seat are swingably connected to each other.

[0018] Further, in the above-mentioned wafer carrier, the swinging member is an angular contact bearing; the limit pin is disposed on the inner ring of the angular contact bearing, and the outer ring of the angular contact bearing is fixedly connected to the platform.

[0019] Further, in the above-mentioned wafer carrier, the elastic mechanism includes: an annular airbag disposed between the platform and the base; an inflation joint communicated with the annular airbag for inflating the annular airbag with gas.

[0020] Further, in the above-mentioned wafer carrier, the surface of the base close to the platform is provided with an annular groove, and a part of the annular airbag is embedded in the annular groove.

[0021] Further, in the above-mentioned wafer carrier, the base is provided with an inflation hole, the inflation joint passes through the inflation hole, and one end of the inflation joint is communicated with the annular airbag and the other end extends out of the base for connecting with an inflation device. The elastic mechanism further includes: an annular pressing ring connected to the base, and the annular pressing ring presses the inflation interface of the annular airbag against the base to form a seal.

[0022] Further, in the above-mentioned wafer carrier, the elastic mechanism includes: at least two elastic members disposed between the platform and the base and distributed along the circumference with the axis of the platform as the center.

[0023] Further, in the above-mentioned wafer carrier, the elastic member is at least one of a spring, an elastic column, and a rubber column.

[0024] According to the second aspect of the embodiments of the present application, a chemical mechanical polishing apparatus is provided, and the apparatus includes: a polishing platen, a carrier head, a dressing device, and a liquid supply device, and further includes any one of the above-mentioned wafer carriers, and the wafer carrier is disposed on one side of the polishing platen, and the carrier head is configured to receive a wafer from the wafer carrier or transfer the wafer to the wafer carrier.

[0025] In this embodiment, when the platform is subjected to a downward pressure, the downward pressure is transmitted to the support mechanism through the swing shaft. With the action of the downward pressure, the support mechanism moves downward accordingly, and then compresses the elastic mechanism. After the downward pressure is withdrawn, the elastic mechanism, relying on its inherent resilience, restores the platform to its original position. At the same time, the support mechanism moves upward. This process enables the support mechanism to move up and down within the accommodation hole of the base, thereby achieving axial buffering and ensuring that the axial center position of the platform does not shift during the process of bearing and releasing the downward pressure.

[0026] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and cannot limit this application. Brief Description of the Drawings

[0027] By describing the exemplary embodiments of this application in more detail in conjunction with the drawings, the above and other objects, features, and advantages of this application will become more apparent. Among them, in the exemplary embodiments of this application, the same reference numerals generally represent the same components.

[0028] Figure 1 Axial sectional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0029] Figure 2 Another axial sectional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0030] Figure 3 Three-dimensional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0031] Figure 4 Partial three-dimensional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0032] Figure 5 Another three-dimensional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0033] Figure 6 Three-dimensional structure schematic diagram of the elastic mechanism in the wafer carrier stage proposed in the embodiment of this application;

[0034] Figure 7 Partial three-dimensional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0035] Figure 8 Another three-dimensional structure schematic diagram of the wafer carrier stage proposed in the embodiment of this application;

[0036] Reference Numerals:

[0037] Platform 100; fastening screw 110; swing shaft 200; shaft shoulder 210; nut 220; support mechanism 300; swing support 310; support base 311; crimping plate 311a; screw 311b; support body 312; elastic support 320; first support 321; column 321a; first elastic member 322; pressing plate 323; base 400; receiving hole 410; second receiving hole 411; elastic mechanism 500; annular airbag 510; inflation joint 520; annular pressure ring 530; limit pin 600; swing member 700; mounting seat 710; mounting seat pressing plate 711; swing body 720. Detailed implementation manners

[0038] The preferred implementation manners of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred implementation manners of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the implementation manners set forth herein. On the contrary, these implementation manners are provided to make the present application more thorough and complete, and to be able to fully convey the scope of the present application to those skilled in the art.

[0039] The terms used in the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms "a", "the" and "said" used in the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0040] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0041] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0042] Unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In chemical mechanical polishing, the carrier platform is an important interaction device for the polishing head to pick and place workpieces (such as wafers). During the process of picking and placing workpieces, it is required that the carrier platform swing adaptively according to the tilt of the polishing head, and the carrier platform cannot rotate around the axis. At present, for the carrier platform in the related art, during the process of the polishing head picking and placing workpieces, when the polishing head tilts and presses down, it will cause the center of the carrier platform to shift, resulting in unreliable work; in addition, it will also cause the carrier platform to have a rotation amount around the axis, causing the position of the carrier platform to shift.

[0044] In view of the above problems, the embodiment of the present application provides a wafer carrier capable of solving the problem of the center shift of the carrier platform.

[0045] The technical solutions of the embodiments of the present application will be described in detail below with reference to the drawings.

[0046] See Figures 1 to 3 , the wafer carrier according to an embodiment of the present application includes a platform 100, a swing shaft 200, a support mechanism 300, a base 400, and an elastic mechanism 500.

[0047] Among them, the platform 100 is used to place workpieces, such as wafers to be polished, etc. In a specific implementation, the platform 100 can be circular.

[0048] The swing shaft 200 is fixedly connected to the platform 100. When the polishing head applies an inclined downward pressure to the platform 100 causing the platform 100 to swing, the swing shaft 200 can swing synchronously with the platform 100. In a specific implementation, the platform 100 can be provided with a groove, and the upper end of the swing shaft 200 (relative to Figure 1 the state shown) can be placed in the groove. The connection between the platform 100 and the swing shaft 200 can be a fixed connection, such as being connected to the swing shaft 200 through a fastening screw 110 (see Figure 2 , 3 ), or welding, riveting, etc., or it can be a detachable connection, such as key connection, etc. The specific connection form is not limited in this embodiment.

[0049] The swing shaft 200 is swingably connected to the support mechanism 300. When the platform 100 swings, the swing shaft 200 can swing relative to the support mechanism 300 along with the platform 100. The base 400 is provided with a receiving hole 410, and the support mechanism 300 is disposed in the receiving hole 410. Moreover, when the swing shaft 200 swings along with the platform 100, the support mechanism 300 can provide axial buffer support for the swing shaft 200, enabling the swing shaft 200 to move axially.

[0050] In this embodiment, the platform 100 is placed above the base 400 (relative to Figure 1 the state shown), and the elastic mechanism 500 is disposed between the platform 100 and the base 400 and is used to deform when the platform 100 swings to adaptively support the platform 100. The elastic mechanism 500 will deform correspondingly with the swing of the platform 100 and always be in contact with the lower end surface of the platform 100 (relative to Figure 1 the state shown) to support the platform 100.

[0051] In this embodiment, when the platform 100 is subjected to an inclined downward pressure, the downward pressure is transmitted to the support mechanism 300 through the swing shaft 200, and the support mechanism 300 can provide axial buffer support for the swing shaft 200. At the same time, the elastic mechanism 500 will deform under the downward pressure to adaptively support the platform 100. When the downward pressure is withdrawn, the elastic mechanism 500 relies on the resilience force to return the platform 100 to its original position. It can be seen that during the swing of the platform 100, the support mechanism 300 can provide axial buffer support for the swing shaft 200, thus ensuring that the axial center position of the platform 100 does not shift during the process of bearing and releasing the downward pressure.

[0052] It can be seen that in this embodiment, during the swing of the platform 100, since the support mechanism 300 can always provide axial buffer support, the support mechanism 300 always effectively positions the platform 100 to prevent the offset of the axial center, thereby ensuring the stability and reliability of the platform 100 during the polishing operation.

[0053] In some embodiments, referring to Figure 1 , the support mechanism 300 includes: a swing support member 310 and an elastic support member 320. Among them, the swing support member 310 is movably disposed in the receiving hole 410 along the axial direction of the receiving hole 410, and the swing shaft 200 is swingably connected to the swing support member 310. When the platform 100 and the swing shaft 200 swing relative to the swing support member 310 together, it will drive the swing support member 310 to move axially in the receiving hole 410.

[0054] The elastic support member 320 is disposed in the receiving hole 410 and is placed below the swing support member 310 (relative to Figure 1In the state shown, the swing support member 310 is in press contact with the elastic support member 320. The elastic support member 320 is configured to deform when the swing support member 310 moves axially along the receiving hole 410, so as to cushion and support the swing support member 310.

[0055] In this embodiment, when the swing support member 310 moves downward, a downward pressure is applied to the elastic support member 320 to compress it. This compression action can absorb and relieve the impact load caused by swinging or external loads, and reduce the damage to the swing support member 310. When the swing support member 310 moves upward, the elastic support member 320 will rebound and return to the uncompressed state. This resilience helps the swing support member 310 return to the initial position and maintain the dynamic balance of the system. Since the elastic support member 320 can provide continuous support and cushioning when the swing support member 310 moves up and down, the reliability and durability of the entire support structure are improved, ensuring stable operation even under frequent swinging and load changes.

[0056] In some embodiments, the receiving hole 410 may be a stepped hole. The stepped hole includes a first receiving hole (not marked in the figure) close to the platform 100 and a second receiving hole 411 far from the platform 100. Both the first receiving hole and the second receiving hole 411 are cylindrical holes. Correspondingly, the swing shaft 200 is a cylindrical shaft; the diameter of the first receiving hole is smaller than that of the second receiving hole 411. The swing support member 310 is placed in the first receiving hole and can move axially along the first receiving hole, and the elastic support member 320 is partially placed in the second receiving hole 411.

[0057] In some embodiments, refer to Figure 1 、 Figure 2 and Figure 4 The swing support member 310 includes: a support base 311 and a support body 312. Among them, the support base 311 is movably arranged along the axis of the receiving hole 410 in the receiving hole 410 and is in press contact with the elastic support member 320. The support body 312 is swingably arranged on the support base 311, and the support body 312 is provided with a first mounting hole, and the swing shaft 200 is arranged in the first mounting hole.

[0058] In a specific implementation, the support body 312 is axially provided with a first mounting hole. The first mounting hole can be a through hole and is adapted to the swing shaft 200. The swing shaft 200 passes through the through hole. And, a shoulder 210 is formed on the lower end surface of the swing shaft 200 away from the platform 100. The shoulder 210 and the lower end surface of the support body 312 (relative to Figure 1 and Figure 2For the state shown), they are press - connected. An external thread is formed on the swing shaft 200 near the upper end surface of the platform 100. The nut 220 is connected to the swing shaft 200 through this external thread. The shaft shoulder 210 limits the swing shaft 200. The swing shaft 200 is fixed to the support body 312 by the shaft shoulder 210 and the nut 220. The swing shaft 200 can swing with the support body 312 relative to the support base 311. The end surface of the support base 311 away from the platform 100 is press - connected to the elastic support member 320. The pressing plate 311a is press - connected to the end surface of the support base 311 close to the platform 100. And the pressing plate 311a is connected to the base 400 by screws 311b.

[0059] In another specific implementation, the swing shaft 200 and the support body 312 can be thread - connected, that is, an internal thread is formed in the first mounting hole, and an external thread is formed on the swing shaft 200. The swing shaft 200 is fixed in the first mounting hole through thread - connection. An interference fit can also be provided between the swing shaft 200 and the support body 312. Of course, the swing shaft 200 and the support body 312 can also be fixedly connected by welding or other means. This embodiment does not limit the specific connection form.

[0060] The support body 312 is swingably arranged on the support base 311. In a specific implementation, the support base 311 is provided with a second mounting hole having a spherical inner surface, and the support body 312 has a spherical outer surface. The support body 312 is arranged in the second mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the support body 312 can swing relative to the support base 311.

[0061] In some embodiments, the swing support member 310 can be an angular contact bearing. The swing shaft 200 is arranged in the inner ring of the angular contact bearing, and the outer ring of the angular contact bearing is press - connected to the elastic support member 320. In a specific implementation, it can be press - connected to the outer ring of the angular contact bearing through a bearing pressing plate (not shown), and this bearing pressing plate is connected to the base 400 by screws.

[0062] In this embodiment, the cooperation between the inner ring of the angular contact bearing and the swing shaft 200 can ensure the precise positioning of the axis, prevent deviation during the swinging process, and thus ensure the swinging accuracy of the platform 100.

[0063] In some embodiments, see Figures 1 to 6 , the elastic support member 320 includes: a first support 321 and a first elastic member 322. Among them, the first support 321 is connected to the lower end surface of the base 400 (relative to Figure 1 the state shown) and covers the accommodation hole 410. The first elastic member 322 is placed in the accommodation hole 410 and connected to the first support 321. The swing support member 310 is press - connected to the first elastic member 322.

[0064] In a specific implementation, the receiving hole 410 is a through hole penetrating the base 400, and the first support 321 covers the receiving hole 410. The first elastic member 322 can be an elastic element such as rubber, spring, elastic sheet, elastic column, airbag, etc. The first elastic member 322 can be at least two, and are evenly distributed along the circumferential direction with the axis of the swing shaft 200 as the center. The first elastic member 322 can also be an annular body, and the annular body can be coaxially arranged with the swing shaft 200.

[0065] In some embodiments, referring to Figures 1 to 6 , the first elastic member 322 is a spring, and the elastic support 320 further includes: a pressing plate 323. At least two columns 321a are formed on the surface of the first support 321 placed in the receiving hole 410. The first elastic member 322 is at least two and is sleeved on the columns 321a one by one. The pressing plate 323 is provided with through holes corresponding to the positions of the columns 321a. The columns 321a pass through the through holes so that the pressing plate 323 is pressed against the first elastic member 322, and the swing support 310 is pressed against the pressing plate 323. When the swing support 310 moves axially, the first elastic member 322 will be compressed through the pressing plate 323, so that the displacement is absorbed and alleviated by the first elastic member 322.

[0066] In this embodiment, when the support base 311 is subjected to a downward pressure, the first elastic member 322 will be compressed through the pressing plate 323, so that the support base 311 moves up and down in the receiving hole 410 of the base 400, realizing axial buffering and keeping the axial position of the platform 100 unchanged.

[0067] In some embodiments, the platform 100 is a circular table, the swing shaft 200 is a cylindrical shaft, and the base 400 is a cylinder. Moreover, the swing shaft 200, the platform 100, the base 400, and the receiving hole 410 are coaxially arranged. This makes it easier to align and install each component during assembly and maintenance, reducing assembly errors. In addition, during the swinging process, the rotation center of the platform 100 is more likely to be consistent with the axis of the swing shaft 200, thereby reducing eccentric vibration and improving the stability and reliability of the entire structure.

[0068] For the loading platform in the related art, when the polishing head presses down to pick up the workpiece, the loading platform still has a rotational amount around the axis. When the polishing machine applies an inclined downward pressure to it, the loading platform rotates around the axis and its position shifts, thereby affecting the workpiece picking of the polishing machine.

[0069] Based on this, referring to Figure 1 and Figure 7, in some embodiments, it may further include: a limit pin 600 and a swing member 700. Among them, the limit pin 600 is fixedly connected to the base 400; the platform 100 is swingably connected to the swing member 700. The swing member 700 is provided with a cylindrical hole, and a part of the limit pin 600 is placed in the cylindrical hole. When the platform 100 swings, the swing member 700 can move up and down (relative to Figure 1 the state shown) along the limit pin 600.

[0070] In a specific implementation, the top of the limit pin 600 can be a spherical surface or a conical surface to reduce the friction and wear when the swing member 700 moves up and down; so that during the swinging process of the swing member 700, there will be no excessive gap between the cylindrical hole and the limit pin 600, thereby maintaining the stability of the platform 100. Specifically, the cylindrical hole of the swing member 700 can be adapted to the diameter of the limit pin 600 to prevent the swing member 700 from shaking when moving up and down.

[0071] In this embodiment, when the platform 100 swings relative to the swing member 700, the swing member 700 moves up and down relative to the limit pin 600. The limit pin 600 limits the swing member 700 and the platform 100. The interaction between the limit pin 600 and the swing member 700 effectively restricts the rotational movement of the platform 100, ensuring that the platform 100 will not generate unnecessary rotation around its center during the swinging process. In addition, the cooperation between the limit pin 600 and the swing member 700 also reduces the radial offset of the platform 100 during the swinging process, ensuring that the platform 100 always maintains its preset movement trajectory during the swinging process, and ensuring the position stability of the platform 100 during the process of the polishing machine picking and placing workpieces.

[0072] In some embodiments, referring to Figure 1 , the swing member 700 may include: a mounting seat 710 and a swing body 720. Among them, the mounting seat 710 is fixedly connected to the platform 100, the swing body 720 is swingably arranged on the mounting seat 710, and the swing body 720 is provided with a cylindrical hole.

[0073] In a specific implementation, a stepped hole is provided on the surface of the platform 100 close to the base 400. The mounting seat 710 is clamped in the stepped hole. The mounting seat pressing plate 711 presses against the mounting seat 710 and is connected to the platform 100 to limit the mounting seat 710 through the mounting seat pressing plate 711. The top end ( Figure 1 the upper end shown) of the limit pin 600 is placed in the stepped hole and there is a gap between it and the platform 100 to avoid friction between the platform 100 and the limit pin 600 when the platform 100 swings.

[0074] In a specific implementation, the mounting base 710 is provided with a third mounting hole having a spherical body or an arc-shaped inner surface, and the swinging body 720 has an outer surface of a spherical body or an arc-shaped body. The swinging body 720 is disposed in the third mounting hole, and the outer surface is adapted to the spherical inner surface so that the swinging body 720 and the mounting base 710 are swingably connected to each other.

[0075] In some embodiments, the swinging member 700 is an angular contact bearing, the limit pin 600 is disposed on the inner ring of the angular contact bearing, and the outer ring of the angular contact bearing is fixedly connected to the platform 100. Specifically, the outer ring of the angular contact bearing can be fixed to the platform 100 by crimping with a bearing pressing plate, and the bearing pressing plate limits the angular contact bearing.

[0076] In this embodiment, the angular contact bearing is a standardized mechanical component, which is convenient for maintenance and replacement; in addition, the interaction between the inner ring of the angular contact bearing and the swinging member 700 effectively limits the rotational movement of the platform 100, ensuring that the platform 100 does not generate unnecessary rotation around its center during the swinging process. At the same time, the platform 100 will not generate radial offset, maintaining the stability of the platform 100.

[0077] In some embodiments, referring to Figure 1 、 Figure 2 、 Figures 6 to 8 , the elastic mechanism 500 may include: an annular airbag 510 and an inflation joint 520. The annular airbag 510 is disposed between the platform 100 and the base 400; the inflation joint 520 is communicated with the annular airbag 510 for filling gas into the annular airbag 510.

[0078] In this embodiment, the platform 100 is supported by the annular airbag 510. The annular airbag 510 can evenly distribute the weight of the platform 100 and can provide stable support for the platform 100.

[0079] In this embodiment, an annular airbag 510 is disposed below the platform 100. When the annular airbag 510 is inflated, the platform 100 remains horizontal under no pressure; when the polishing head presses down with a certain deviation angle, the platform 100 tilts accordingly, and the annular airbag 510 can be compressed without affecting the swinging of the platform 100, ensuring that the platform 100 and the polishing head are in contact with each other.

[0080] In specific implementation, the annular airbag 510 can be arranged at a position close to the edge of the platform 100 and the base 400. The annular airbag 510 can be made of an elastic material, such as a rubber material that is wear-resistant, pressure-resistant, and tensile-resistant. This material can withstand mechanical stress and temperature changes during the working process, or can also be made of a non-elastic material, such as polytetrafluoroethylene, etc. The inflation joint 520 can be a quick-connect joint, which is convenient for operators to quickly inflate and deflate. The inflation joint 520 should have good sealing performance to prevent gas leakage.

[0081] In this embodiment, when the platform 100 swings, the annular airbag 510 can deform with the swing of the platform 100. This deformation can not only absorb and disperse the impact and vibration generated by the swing of the platform 100, thereby reducing the damage to the platform 100, but also provide a soft supporting effect to ensure the stability of the platform 100 during the swing. In addition, due to the deformation ability of the annular airbag 510, the annular airbag 510 can adapt to the attitude adjustment requirements of the platform 100 in different working environments, increasing the flexibility and adaptability of the system. At the same time, it also has good energy absorption characteristics and can play a protective role when the platform 100 is accidentally collided, improving the safety performance of the overall equipment.

[0082] Continue to refer to Figure 1 and Figure 2 , in some embodiments, an annular groove (not marked in the figure) is provided on the surface of the base 400 close to the platform 100, and a part of the annular airbag 510 is embedded in the annular groove to better fix and position the annular airbag 510.

[0083] Refer to Figure 8 , in some embodiments, the elastic mechanism 500 further includes: an annular pressing ring 530. Wherein, the base 400 is provided with an air inflation hole, the air inflation joint 520 passes through the air inflation hole, and one end of the air inflation joint 520 is communicated with the annular airbag 510, and the other end of the air inflation joint 520 extends out of the base 400 for connecting with an air inflation device. The annular pressing ring 530 is connected to the base 400, and the annular pressing ring 530 presses the air inflation interface of the annular airbag 510 against the base 400 to form a seal.

[0084] Specifically, the annular pressing ring 530 can be arranged inside the annular airbag 510 or outside the annular airbag 510. The annular pressing ring 530 can be locked on the base 400 by screws and press the lower opening of the annular airbag 510 against the base 400 to form a seal.

[0085] In this embodiment, the air inflation joint 520 is connected to the annular airbag 510 and inflates it. After inflation, the annular airbag 510 bulges, pushes the platform 100 to be placed horizontally, and can be compressed by the platform 100 in any direction to achieve buffering.

[0086] In some other embodiments, the elastic mechanism 500 includes: at least two elastic members (not shown in the figure), which are placed between the platform 100 and the base 400 and are circumferentially distributed around the axis of the platform 100.

[0087] In specific implementation, the elastic member can be any one of a spring, an elastic column, a rubber column, and an airbag, or a combination of two or more of them. The elastic members can be evenly distributed along the circumferential direction of the platform 100 with the axis of the platform 100 as the center.

[0088] In this embodiment, when the platform 100 swings, the elastic members placed at the inclined and pressed-down positions of the platform 100 are compressed, and the elastic members placed at other positions of the platform 100 are stretched, so as to always buffer and support the platform 100 during the swinging process of the platform 100, and can absorb the swinging energy and impact.

[0089] In this embodiment, when the platform 100 swings and inclines in a certain direction, the elastic members located at the inclined and pressed-down positions will be compressed. Through their internal deformation ability, these elastic members effectively absorb part of the energy and impact generated during the swinging process of the platform 100. At the same time, the elastic members located at other positions of the platform 100 are stretched due to the inclination of the platform 100. These elastic members provide additional supporting force through stretching to ensure that the platform 100 can obtain uniform and stable buffering during the entire swinging process.

[0090] It can be seen that during the swinging process of the platform 100 in the embodiment of the present application, the platform 100 is always buffered and supported by the elastic members, effectively absorbing and dispersing the swinging energy and impact, thereby improving the dynamic performance and working efficiency of the entire system.

[0091] It can be seen that in the present application, when the platform 100 swings, the platform 100 and the swing shaft 200 swing integrally relative to the support mechanism 300. At the same time, the support mechanism 300 moves up and down in the accommodation hole 410 of the base 400 to limit the axis center of the platform 100. At the same time, the swing member 700 also swings synchronously with the platform 100, and the swing member 700 moves up and down relative to the limit pin 600. Since the limit pin 600 is fixed on the base 400, the swing member 700 can only move up and down relative to the limit pin 600, that is, move along the axis of the platform 100, and the swing member 700 cannot move along the radial or circumferential direction of the platform 100. Therefore, the platform 100 cannot rotate, avoiding the rotation of the platform 100 around the center during the swinging process.

[0092] The embodiment of the present application further provides a chemical mechanical polishing device, which may include: a polishing platen, a carrier head, a dressing device, a liquid supply device, and any one of the above wafer chucks. The wafer chuck is disposed on one side of the polishing platen, and the carrier head is configured to receive a wafer from the wafer chuck or transfer the wafer to the wafer chuck. Specifically, a polishing pad may be disposed on the upper surface of the polishing platen, and the polishing pad rotates together with the polishing platen; a horizontally movable carrier head is disposed above the polishing pad, and the bottom of the carrier head sucks the wafer to be polished; the liquid supply device may be disposed above the polishing pad to disperse the polishing liquid on the surface of the polishing pad; the dressing device swings around a fixed point, and the dressing head configured thereon rotates itself and applies a downward load to dress the surface of the polishing pad. The wafer chuck may be horizontally adjacent to one side of the polishing platen, and the carrier head may transfer the wafer in the wafer chuck above the polishing pad, or the carrier head places the polished wafer in the wafer chuck for a wafer transfer device such as a robot or other turnover tool to transfer the polished wafer to the next process.

[0093] Among them, for the specific implementation process of the wafer chuck, refer to the above description, and it will not be elaborated in this embodiment.

[0094] Since the wafer chuck has the above effects, the chemical mechanical polishing device having the wafer chuck also has corresponding technical effects.

[0095] In summary, in the embodiment of the present application, the elastic mechanism 500 is used to keep the platform 100 horizontal, and it can be compressed and buffered when being swung and pressed down; the support mechanism 300 is used to realize the overall downward pressure buffering of the platform 100 to ensure that the axial center position of the platform 100 does not shift; through the limitation of the limit pin 600 and the swing member 700, the platform 100 is prevented from rotating around the axis.

[0096] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. A wafer carrier, characterized in that: include: A platform for placing workpieces; A swing shaft, fixedly connected to the center of the platform; A base with a receiving hole in the center; A support mechanism is disposed in the receiving hole, the swing shaft is swingably connected to the support mechanism, and the support mechanism provides axial buffer support for the swing shaft when the swing shaft swings with the platform; An elastic mechanism, disposed between the platform and the base, for deforming when the platform swings to adaptively support the platform; The support mechanism comprises a swing support member and an elastic support member arranged in the receiving hole, the swing support member is movable along the axial direction of the receiving hole and is pressed against the elastic support member, the elastic support member is used to deform when the swing support member moves along the axial direction of the receiving hole, so as to provide buffer support for the swing support member; the swing support member comprises a support seat and a support body, the swing shaft is arranged in a first mounting hole of the support body; the support seat is provided with a second mounting hole having a spherical inner surface, and the support body has a spherical outer surface adapted to the second mounting hole, so as to be swingably connected with the support seat; The wafer carrier also includes a limit pin fixedly connected to the base and a swinging member swingably connected to the platform; the swinging member includes a mounting seat and a swinging body, the mounting seat is fixedly connected to the platform, the limit pin is partially placed in the cylindrical hole of the swinging body, and the swinging member can move along the limit pin when the platform swings; the mounting seat is provided with a third mounting hole with a spherical inner surface, and the swinging body has a spherical outer surface adapted to the third mounting hole so as to be swingably connected to the mounting seat.

2. The wafer carrier according to claim 1, characterized in that: The swing support member is an angular bearing; The swing shaft is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is pressed against the elastic support member.

3. The wafer carrier according to claim 2, characterized in that: Also includes: A bearing pressure plate is pressed onto the outer ring of the angular bearing and connected to the base.

4. The wafer carrier according to claim 1, characterized in that: The elastic support member comprises: A first support, connected to the base and covering the receiving hole of the base; The first elastic member is placed in the accommodating hole and connected to the first support, and the swing support member is pressed against the first elastic member.

5. The wafer carrier according to claim 4, characterized in that: The surface of the first support placed in the receiving hole is formed with at least two columns; There are at least two first elastic members, which are sleeved on the pillars in a one-to-one correspondence; The elastic support member also includes: a pressing plate, the pressing plate is provided with holes corresponding to the positions of the columns, the columns are penetrated through the holes so that the pressing plate is pressed against the first elastic member, and the swing support member is pressed against the pressing plate.

6. The wafer carrier according to claim 1, characterized in that: The accommodating hole is a stepped hole, and the stepped hole includes a first accommodating hole close to the platform and a second accommodating hole away from the platform, and the diameter of the first accommodating hole is smaller than the diameter of the second accommodating hole; The swing support member is placed in the first accommodating hole; The elastic support member is partially disposed in the second accommodating hole.

7. The wafer carrier according to claim 4, characterized in that: The first elastic member is any one of a spring, a spring sheet, and an elastic column.

8. The wafer carrier according to claim 1, characterized in that: The swinging member is an angular bearing; The limiting pin is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is fixedly connected to the platform.

9. The wafer carrier according to any one of claims 1 to 8, characterized in that: The elastic mechanism comprises: An annular airbag is arranged between the platform and the base; An inflation connector is connected to the annular airbag and is used to inflate gas into the annular airbag.

10. The wafer carrier according to claim 9, characterized in that: An annular groove is formed on the surface of the base close to the platform, and the annular airbag is partially embedded in the annular groove.

11. The wafer carrier according to claim 9, characterized in that: The base is provided with an inflation hole, the inflation connector is provided through the inflation hole, and one end of the inflation connector is connected to the annular airbag, and the other end extends out of the base for connecting to the inflation device; The elastic mechanism further comprises: an annular pressing ring connected to the base, wherein the annular pressing ring presses the inflation interface of the annular airbag to the base to form a seal.

12. The wafer carrier according to any one of claims 1 to 8, characterized in that: The elastic mechanism comprises: At least two elastic members are disposed between the platform and the base and are distributed along a circumference with the axis of the platform as the center.

13. The wafer carrier according to claim 12, characterized in that: The elastic member is at least one of a spring, an elastic column and a rubber column.

14. A chemical mechanical polishing device, characterized in that: include: The polishing disk, the carrying head, the dressing device and the liquid supply device also include a wafer carrying table as described in any one of claims 1 to 13, wherein the wafer carrying table is arranged on one side of the polishing disk, and the carrying head is configured to receive the wafer from the wafer carrying table or transfer the wafer to the wafer carrying table.

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