A test device for automotive semiconductor chip packaging
By designing a compression protection device and an automatic cleaning device in the chip push-pull force testing equipment, the problems of vulnerability to push-punch knife and the impact of impurities in the test are solved, and the safety protection and testing accuracy of push-punch knife are achieved.
Patent Information
- Application Number
- CN202411867677.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2044-12-18
AI Technical Summary
In existing chip push and pull force testing equipment, the push knife lacks protective measures and is prone to damage. It is easy to stick to metal impurities during the test, affecting the accuracy of the test.
A test device including a compression protection device and an automatic cleaning device is designed. The compression protection device closes the push knife through the upper and lower guard box to prevent collision and environmental erosion; the automatic cleaning device cleans the impurities on the surface of the push knife through a cleaning brush.
It effectively protects the push knife, avoids damage and environmental erosion, and ensures the cleanliness of the push knife, improving the accuracy and reliability of the test.
Smart Images

Figure CN119321948B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip testing equipment, and in particular to a testing equipment for automotive-grade semiconductor chip packaging. Background Art
[0002] With the development of intelligent and networked automobiles, the demand for automotive semiconductor chips will continue to grow. Automotive semiconductor chips, also known as "automotive chips", are mainly used in the fields of automotive control devices, monitoring devices and electronic control devices. When producing chips, they need to be packaged and installed in a shell for semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits. After the chip is packaged, the quality of the chip package needs to be tested. Among them, the chip package push-pull force test is a key link in evaluating the quality of chip packaging.
[0003] Furthermore, in the push-pull force test of the packaged chip, a push-pull force testing machine is required to fix the chip on the carrier, and then the push knife is driven by the test module to test the chip. However, during the use of the test host, since the push knife is not provided with any protection measures, it is inevitable that the push knife will be collided with the chip during use due to the fixation of the chip, or during the maintenance, repair, and inspection of the test machine. The end of the push knife is often very fragile and will be damaged once it is collided. Therefore, the protection of the push knife is very important. In addition, the push knife will often stick to various metal impurities during the test. If these impurities are not cleaned in time, the accuracy of the next test will be seriously affected. Summary of the invention
[0004] The object of the present invention is to provide a testing device for automotive-grade semiconductor chip packaging to solve the problems raised in the above-mentioned background technology.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A test device for automotive semiconductor chip packaging, comprising a test host, a test module and a carrier table installed on the test host, a pusher for testing installed on the test module, and an integrated seat installed on the bottom side of the test module;
[0007] It also includes a clamping protection device, which is installed on the bottom side of the integrated seat, and the push knife is located in the clamping protection device, and the clamping protection device is used to protect the push knife; the clamping protection device includes two upper guard boxes, both of which are slidably installed on the integrated seat, and the bottom sides of the two upper guard boxes are movably installed with lower guard boxes for closing the push knife, and the bottom side of the integrated seat is installed with a mounting bracket, and an upper push frame is slidably installed on the mounting bracket, and two extrusion frames are movably installed on the upper push frame, and the bottom sides of the two extrusion frames are movably installed with compression strips for compressing chips through screws;
[0008] An automatic cleaning device is installed in the compression protection device, and the automatic cleaning device is used to clean the surface of the push knife; the automatic cleaning device includes a rotating base, and the rotating base is installed on one of the lower guard boxes, and a rotating frame is rotatably installed on the rotating base, and a cleaning brush is installed on the rotating frame, and the cleaning brush rotates to clean the push knife;
[0009] It also includes an active stabilization device, which is installed on the bottom side of the test host and is used to stabilize the test host; the active stabilization device includes a stabilization base, which is installed on the bottom side of the test host, and an expansion frame is installed at the four corners of the stabilization base, and a counterweight block for increasing gravity is movably installed on the expansion frame.
[0010] Furthermore, in a preferred embodiment of the present invention, the compression protection device further comprises a spreading rod, a connecting shaft is rotatably mounted on the mounting bracket, and the spreading rod is sleeved on the connecting shaft;
[0011] Two opening shafts are rotatably mounted on the opening rod, and opening slide grooves are provided on the two upper protection boxes. The two opening shafts are movably mounted in the two opening slide grooves respectively.
[0012] Further, in a preferred embodiment of the present invention, a toggle plate is installed on the connecting shaft, a push plate is installed on the top side of the upper push frame, and the upper push frame moves through the push plate to push the toggle plate to rotate;
[0013] The mounting bracket is provided with a torsion groove, the connecting shaft passes through the torsion groove, a torsion spring is installed in the torsion groove, and the other end of the torsion spring is installed on the connecting shaft.
[0014] Furthermore, in a preferred embodiment of the present invention, a plurality of retraction rods are installed on the lower protective box, a plurality of retraction grooves are opened on the bottom side of the upper protective box, and the plurality of retraction rods are movably installed in the plurality of retraction grooves respectively;
[0015] A return spring is installed at the top end of the retraction rod, the top end of the return spring is installed on the inner wall of the retraction groove, and a connecting sleeve is connected between the upper protective box and the lower protective box.
[0016] Furthermore, in a preferred embodiment of the present invention, a support spring is installed at the bottom end of the push-up frame, and the bottom end of the support spring is installed on the bottom inner wall of the extrusion frame.
[0017] Furthermore, in a preferred embodiment of the present invention, a driving gear sleeve is sleeved on the rotating frame, and a driving rack is installed on the other lower guard box, the driving rack is meshed with the driving gear sleeve, and the two lower guard boxes are closed to drive the driving rack to drive the driving gear sleeve to rotate.
[0018] Furthermore, in a preferred embodiment of the present invention, the active stabilization device further comprises a compression frame, and the compression frame is movably installed in the stabilization base;
[0019] An expansion spring is installed on the stable base, and the top end of the expansion spring is installed on the stable base.
[0020] Furthermore, in a preferred embodiment of the present invention, integrated rotating shafts are rotatably mounted at the four corners of the bottom side of the stable base, and the four unfolding frames are respectively mounted on the four integrated rotating shafts;
[0021] The four integrated rotating shafts are all sleeved with driving columns, the top side of the compression frame is installed with an adapter frame, the four corners of the adapter frame are all installed with driving rods, and the four driving rods are movably installed on the four driving columns respectively.
[0022] Furthermore, in a preferred embodiment of the present invention, an arc-shaped driving groove is provided on the driving column, one end of the driving rod extends into the driving groove, and the driving rod moves vertically downward and moves in the driving groove to drive the driving column to rotate.
[0023] Furthermore, in a preferred embodiment of the present invention, a return spring is installed on the counterweight block, and the bottom end of the return spring is installed on the bottom side of the unfolding frame.
[0024] The beneficial effects of a test device for automotive semiconductor chip packaging proposed by the present invention are:
[0025] In the present invention, by setting a compression protection device, when the push knife is not in use, the push knife is completely enclosed by two lower protective boxes and two upper protective boxes to avoid the push knife being exposed to collision or erosion by the external environment for a long time, thereby effectively ensuring the safety of the push knife.
[0026] Furthermore, in the present invention, through the setting of the automatic cleaning device, when the test module is reset and the two lower guard boxes return to their positions, one lower guard box drives the driving rack to move, and the driving rack drives the driving gear sleeve to rotate, thereby causing the cleaning brush to rotate to clean the push knife, thereby ensuring the cleanliness of the push knife and further ensuring the test effect of the push knife.
[0027] Furthermore, in the present invention, through the provision of an active stabilization device, when the test host is bumped into or tilted due to other unexpected reasons, the test host drives the stable base to be lifted, and then the four unfolding frames rotate synchronously, two of which unfold the stable base for support, and the other two unfolding frames unfold and drive the counterweight blocks to rotate and unfold synchronously, so that the two counterweight blocks pull down the stable base, thereby effectively ensuring that the stable base helps the test host to reset, avoiding the problem of the test host falling and being damaged due to accidental collision. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 A schematic diagram of the three-dimensional structure of a test device for automotive-grade semiconductor chip packaging provided by an embodiment of the present invention;
[0029] Figure 2 A schematic diagram of the structure of the connection between a test module and a compression protection device and other structures of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0030] Figure 3 A schematic diagram of the structure of the connection between an integrated socket and a mounting bracket and other structures of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0031] Figure 4 A schematic diagram of the structure of the connection between a mounting bracket and an upper push frame and other structures of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0032] Figure 5 A partial cross-sectional schematic diagram of the connection between an upper protective box and a retraction rod and other structures of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0033] Figure 6 A schematic diagram of a partial cross-sectional structure of a connection between a push-up frame and an extrusion frame and other structures of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0034] Figure 7 A schematic diagram of a partial cross-sectional structure of a mounting bracket and a toggle plate and other structures connected to a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0035] Figure 8A schematic diagram of the structure of the connection between the lower protective box and the retraction rod and other structures of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0036] Fig. 9 A test device for automotive semiconductor chip packaging provided by an embodiment of the present invention Figure 8 Schematic diagram of the structure of part A;
[0037] Fig.10 A schematic diagram of the internal structure of a stable base of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention;
[0038] Fig.11 A schematic diagram of a partial structure of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention, wherein an expansion frame and a driving column and other structures are connected;
[0039] Fig.12 A schematic cross-sectional structural diagram of a stable base for a test device for automotive-grade semiconductor chip packaging provided by an embodiment of the present invention;
[0040] Fig.13 A schematic diagram of a partial cross-sectional structure of the connection between an unfolding frame and a counterweight block and other structures of a test device for automotive-grade semiconductor chip packaging provided in an embodiment of the present invention.
[0041] In the figure: 1-test host; 2-test module; 3-push knife; 4-carrying platform; 5-integrated seat; 6-pressing protection device; 601-mounting bracket; 602-upper push frame; 603-extrusion frame; 604-pressing strip; 605-upper protective box; 606-lower protective box; 607-connecting sleeve; 608-retraction rod; 609-retraction groove; 610-return spring; 611-support spring; 612-connecting shaft; 613-opening rod; 614-opening shaft; 615-opening slide groove; 616-switching plate; 617-push plate; 618-torsion groove; 619-torsion spring; 7-automatic cleaning device; 701-rotating base; 702-rotating frame; 703-cleaning brush; 704-driving gear sleeve; 705-driving rack; 8-active stabilizing device; 801-stable base; 802-unfolding frame; 803-counterweight block; 804-reset spring; 805-integrated rotating shaft; 806-driving column; 807-compression frame; 808-opening spring; 809-adapter frame; 810-driving rod; 811-driving groove. DETAILED DESCRIPTION
[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.
[0043] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0044] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0045] In addition, in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invented product is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0046] In addition, the terms "horizontal", "vertical", "perpendicular" and the like do not mean that the components are required to be absolutely vertical, but can be slightly tilted. For example, "vertical" only means that its direction is more vertical than "horizontal", and does not mean that the structure must be completely vertical, but can be slightly tilted.
[0047] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0048] Please refer to the attached manual Figure 1-13A test device for automotive-grade semiconductor chip packaging provided by an embodiment of the present invention includes a test host 1, on which a test module 2 and a carrier 4 are installed, on which a push knife 3 for testing is installed, and on the bottom side of the test module 2, an integrated seat 5 is installed.
[0049] For further information, please refer to the attached manual. Figure 3-8 A test device for automotive-grade semiconductor chip packaging provided by an embodiment of the present invention also includes a clamping protection device 6, which is installed on the bottom side of the integrated seat 5. The push knife 3 is located in the clamping protection device 6, and the clamping protection device 6 is used to protect the push knife 3; specifically, the clamping protection device 6 includes two upper protective boxes 605, and the two upper protective boxes 605 are both slidably installed on the integrated seat 5. The bottom sides of the two upper protective boxes 605 are movably installed with lower protective boxes 606 for closing the push knife 3. A mounting bracket 601 is installed on the bottom side of the integrated seat 5, and an upper push frame 602 is slidably installed on the mounting bracket 601. Two extrusion frames 603 are movably installed on the upper push frame 602, and the bottom sides of the two extrusion frames 603 are movably installed with clamping strips 604 for compressing the chip through screws. It should be noted that, in the embodiment of the present invention, when the push knife 3 is reset, the two lower protective boxes 606 and the two upper protective boxes 605 seal the push knife 3 to prevent the push knife 3 from being exposed to collision or erosion by the external environment for a long time, thereby effectively ensuring the safety of the push knife 3.
[0050] Further specifically, in the embodiment of the present invention, an automatic cleaning device 7 is installed in the pressing protection device 6, and the automatic cleaning device 7 is used to clean the surface of the push knife 3; the automatic cleaning device 7 includes a rotating base 701, the rotating base 701 is installed on a lower guard box 606, a rotating frame 702 is rotatably installed on the rotating base 701, and a cleaning brush 703 is installed on the rotating frame 702, and the cleaning brush 703 is rotated to clean the push knife 3. It should be noted that in the embodiment of the present invention, when the test module 2 is reset and the two lower guard boxes 606 are returned to their positions, the rotating frame 702 is rotated to drive the cleaning brush 703 to clean the push knife 3, so as to ensure the cleanliness of the push knife 3 and further ensure the test quality of the chip; it should be emphasized that the length of the bristles on the cleaning brush 703 is set according to the specific situation, and when the rotating frame 702 rotates, the push knife 3 is cleaned by the bristles, and as the two lower guard boxes 606 are continuously closed, the push knife 3 will only squeeze the bristles, and will not directly contact with the cleaning brush 703, so as to avoid damaging the push knife 3.
[0051] More specifically, in the embodiment of the present invention, an active stabilization device 8 is further included, which is installed on the bottom side of the test host 1 and is used to stabilize the test host 1; the active stabilization device 8 includes a stabilization base 801, which is installed on the bottom side of the test host 1, and the four corners of the stabilization base 801 are all installed with expansion racks 802, and the expansion racks 802 are movably installed with counterweights 803 for increasing gravity. It should be noted that in the embodiment of the present invention, when the test host 1 is hit or tilted due to other unexpected reasons, the test host 1 drives the stabilization base 801 to lift, and then the four expansion racks 802 are synchronously expanded, wherein two expansion racks 802 are expanded to support the stabilization base 801, and the other two expansion racks 802 are expanded to drive the counterweights 803 to rotate and expand synchronously, so that the two counterweights 803 pull down the stabilization base 801, and then the stabilization base 801 can help the test host 1 to reset, avoiding the problem of the test host 1 falling and being damaged due to accidental collision.
[0052] For further information, please refer to the attached manual. Figure 3-8 , a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention, the pressing protection device 6 also includes a propping rod 613, a connecting shaft 612 is rotatably mounted on the mounting bracket 601, and the propping rod 613 is sleeved on the connecting shaft 612;
[0053] In addition, two spreading shafts 614 are rotatably mounted on the spreading rod 613, and two upper guard boxes 605 are provided with spreading chute 615, and the two spreading shafts 614 are movably mounted in the two spreading chute 615. It should be noted that in the embodiment of the present invention, when the toggle plate 616 is pushed, the toggle plate 616 drives the connecting shaft 612 to rotate, and then the connecting shaft 612 drives the spreading rod 613 to rotate, and the spreading rod 613 drives the two upper guard boxes 605 to slide and unfold through the two spreading shafts 614, and the two spreading shafts 614 slide in the two spreading chute 615.
[0054] More specifically, in the embodiment of the present invention, a toggle plate 616 is installed on the connecting shaft 612, and a push plate 617 is installed on the top side of the upper push frame 602. The upper push frame 602 moves through the push plate 617 to push the toggle plate 616 to rotate; in addition, a torsion groove 618 is provided on the mounting bracket 601, and the connecting shaft 612 passes through the torsion groove 618. A torsion spring 619 is installed in the torsion groove 618, and the other end of the torsion spring 619 is installed on the connecting shaft 612. It should be noted that in the embodiment of the present invention, when the test module 2 drives the push knife 3 to move downward for testing, the pressing strip 604 drives the upper push frame 602 to move upward, and the upper push frame 602 moves upward to drive the push plate 617 to push the toggle plate 616 to rotate, and the toggle plate 616 drives the propping rod 613 to rotate through the connecting shaft 612, and drives the torsion spring 619 to be stressed.
[0055] More specifically, in the embodiment of the present invention, a plurality of retraction rods 608 are installed on the lower protective box 606, a plurality of retraction grooves 609 are provided on the bottom side of the upper protective box 605, and the plurality of retraction rods 608 are movably installed in the plurality of retraction grooves 609 respectively; a return spring 610 is installed at the top end of the retraction rod 608, and the top end of the return spring 610 is installed on the inner wall of the retraction groove 609, and a connecting sleeve 607 is connected between the upper protective box 605 and the lower protective box 606. It should be noted that in the embodiment of the present invention, when the test module 2 continues to move downward, the lower protective box 606 is squeezed by the pressing strip 604, so that the lower protective box 606 moves in the plurality of retraction grooves 609 through the plurality of retraction rods 608, and drives the plurality of return springs 610 to be stressed.
[0056] Please continue to refer to the instruction manual Figure 3-8 , more specifically, in the embodiment of the present invention, a support spring 611 is installed at the bottom end of the upper push frame 602, and the bottom end of the support spring 611 is installed on the bottom inner wall of the extrusion frame 603. It should be noted that in the embodiment of the present invention, when the test module 2 continues to move downward, the extrusion frame 603 is squeezed and moves on the upper push frame 602, and drives the support spring 611 to be contracted under force.
[0057] For further information, please refer to the attached manual. Fig. 9 , a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention, a driving gear sleeve 704 is sleeved on the rotating frame 702, and a driving rack 705 is installed on the other lower guard box 606, the driving rack 705 is meshed with the driving gear sleeve 704, the two lower guard boxes 606 are closed, and the driving rack 705 drives the driving gear sleeve 704 to rotate. It should be noted that in the embodiment of the present invention, when the two lower guard boxes 606 return to their positions, one lower guard box 606 drives the driving rack 705 to move, and the driving rack 705 drives the driving gear sleeve 704 to rotate, so that the driving gear sleeve 704 drives the rotating frame 702 to rotate, and when the rotating frame 702 rotates, it drives the cleaning brush 703 to clean the push knife 3.
[0058] Please refer to the instruction manual Figure 10-13 Furthermore, in the test equipment for automotive semiconductor chip packaging provided by the embodiment of the present invention, the active stabilization device 8 also includes a compression frame 807, which is movably installed in the stable base 801; a spreading spring 808 is installed on the stable base 801, and the top of the spreading spring 808 is installed on the stable base 801. It should be noted that in the embodiment of the present invention, when the test host 1 drives the stable base 801 to lift up, the compression frame 807 can be automatically extended by the tensile force of the spreading spring 808.
[0059] More specifically, in the embodiment of the present invention, integrated rotating shafts 805 are rotatably mounted at the four corners of the bottom side of the stable base 801, and the four unfolding frames 802 are respectively mounted on the four integrated rotating shafts 805; in addition, driving columns 806 are sleeved on the four integrated rotating shafts 805, and an adapter frame 809 is mounted on the top side of the compression frame 807, and driving rods 810 are mounted at the four corners of the adapter frame 809, and the four driving rods 810 are respectively movably mounted on the four driving columns 806. It should be noted that in the embodiment of the present invention, when the compression frame 807 moves, it drives the adapter frame 809 to move, and the adapter frame 809 drives the four driving rods 810 to move synchronously, so that the four driving rods 810 synchronously drive the four driving columns 806 to rotate, and the driving column 806 rotates to drive the unfolding frame 802 to rotate and unfold through the integrated rotating shaft 805, so as to achieve the purpose of synchronous unfolding of the four unfolding frames 802.
[0060] Please continue to refer to the instruction manual Figure 10-13 More specifically, in the embodiment of the present invention, a driving groove 811 is provided in an arc shape on the driving column 806, one end of the driving rod 810 extends into the driving groove 811, and the driving rod 810 moves vertically downward and moves in the driving groove 811 to drive the driving column 806 to rotate. It should be noted that in the embodiment of the present invention, when the driving rod 810 moves, the driving rod 810 moves in the driving groove 811, and because the driving groove 811 is arranged in an arc shape, the driving rod 810 moves in the driving groove 811, so that the driving column 806 can rotate, and then the driving column 806 drives the unfolding frame 802 to rotate through the integrated rotating shaft 805.
[0061] Please refer to the attached manual Figure 1-13 Specifically, in the embodiment of the present invention, a return spring 804 is installed on the counterweight 803, and the bottom end of the return spring 804 is installed on the bottom side of the unfolding frame 802. It should be noted that in the embodiment of the present invention, after the unfolding frame 802 is rotated and unfolded, the return spring 804 helps the counterweight 803 to automatically return to its original position, thereby stabilizing the test host 1.
[0062] In summary, the working principle of a test device for automotive semiconductor chip packaging provided by an embodiment of the present invention is:
[0063] When the test module 2 drives the push knife 3 to move downward for testing, the two clamping strips 604 clamp the chip so that the chip or the chip with the substrate will not tilt up during the test of the push knife 3, thereby ensuring the quality of the test. At the same time, when the test module 2 continues to move downward, the clamping strip 604 drives the upper push frame 602 to move upward, and the upper push frame 602 moves upward to drive the push plate 617 to drive the toggle plate 616 to rotate. The toggle plate 616 drives the expansion rod 613 to rotate through the connecting shaft 612, and drives the torsion spring 619 to be stressed. The expansion rod 613 rotates and drives the two upper guard boxes 605 to slide and unfold through the two expansion shafts 614. At the same time, the two expansion shafts 614 slide in the two expansion slide grooves 615, and the two upper guard boxes 605 unfold through The multiple retraction rods 608 drive the two lower protective boxes 606 to unfold, and the push knife 3 can be exposed for use. In addition, when the test module 2 continues to move downward, the lower protective box 606 is squeezed by the compression strip 604, so that the lower protective box 606 moves in the multiple retraction grooves 609 through the multiple retraction rods 608, and drives the multiple return springs 610 to be stressed. Therefore, before the push knife 3 contacts the chip, the lower protective box 606 has been opened to avoid the problem that the lower protective box 606 affects the push knife 3. Therefore, when the push knife 3 is reset, the two lower protective boxes 606 and the two upper protective boxes 605 close the push knife 3 to avoid the push knife 3 being exposed for a long time and being hit or corroded by the external environment, and effectively ensure the safety of the push knife 3.
[0064] Further, when the test module 2 is reset so that the two lower guard boxes 606 return to their positions, one lower guard box 606 drives the driving rack 705 to move, and the driving rack 705 drives the driving gear sleeve 704 to rotate, so that the driving gear sleeve 704 drives the rotating frame 702 to rotate, and when the rotating frame 702 rotates, it drives the cleaning brush 703 to clean the push knife 3;
[0065] Furthermore, when the test host 1 is hit or tilted due to other unexpected reasons, the test host 1 drives the stable base 801 to lift. If the tilt of the test host 1 is large, the compression frame 807 extends under the resilience of the stretching spring 808. At this time, the compression frame 807 moves to drive the adapter frame 809 to move, and the adapter frame 809 simultaneously drives the four driving rods 810 to move. The four driving rods 810 move in the four driving grooves 811. Since the driving grooves 811 are arranged in an arc shape, the four driving rods 810 synchronously drive the four driving columns 806 to rotate when moving. The driving columns 806 rotate and drive the unfolding frames 802 to rotate through the integrated rotating shaft 805. Two unfolding frames 802 are unfolded to support the stable base 801, and the other two unfolding frames 802 are unfolded to drive the counterweight blocks 803 to rotate and unfold synchronously, so that the two counterweight blocks 803 pull down the stable base 801, and then the stable base 801 helps the test host 1 to reset, thereby avoiding the problem of the test host 1 falling and being damaged due to accidental collision.
[0066] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A test device for automotive semiconductor chip packaging, characterized in that: It includes a test host, on which a test module and a bearing platform are installed, on which a push knife for testing is installed, and on the bottom side of which an integrated seat is installed; It also includes a clamping protection device, which is installed on the bottom side of the integrated seat, and the push knife is located in the clamping protection device, and the clamping protection device is used to protect the push knife; the clamping protection device includes two upper guard boxes, both of which are slidably installed on the integrated seat, and the bottom sides of the two upper guard boxes are movably installed with lower guard boxes for closing the push knife, and the bottom side of the integrated seat is installed with a mounting bracket, and an upper push frame is slidably installed on the mounting bracket, and two extrusion frames are movably installed on the upper push frame, and the bottom sides of the two extrusion frames are movably installed with compression strips for compressing chips through screws; An automatic cleaning device is installed in the compression protection device, and the automatic cleaning device is used to clean the surface of the push knife; the automatic cleaning device includes a rotating base, and the rotating base is installed on one of the lower guard boxes, and a rotating frame is rotatably installed on the rotating base, and a cleaning brush is installed on the rotating frame, and the cleaning brush rotates to clean the push knife; It also includes an active stabilization device, which is installed on the bottom side of the test host and is used to stabilize the test host; the active stabilization device includes a stabilization base, which is installed on the bottom side of the test host, and the four corners of the stabilization base are all installed with an expansion frame, and the expansion frame is movably installed with a counterweight block for increasing gravity; The compression protection device further comprises a spreading rod, a connecting shaft is rotatably mounted on the mounting bracket, and the spreading rod is sleeved on the connecting shaft; Two opening shafts are rotatably mounted on the opening rod, and opening slide grooves are provided on the two upper protection boxes, and the two opening shafts are movably mounted in the two opening slide grooves respectively; A toggle plate is installed on the connecting shaft, and a push plate is installed on the top side of the upper push frame. The upper push frame moves through the push plate to push the toggle plate to rotate; The mounting bracket is provided with a torsion groove, the connecting shaft passes through the torsion groove, a torsion spring is installed in the torsion groove, and the other end of the torsion spring is installed on the connecting shaft; A plurality of retraction rods are installed on the lower protective box, a plurality of retraction grooves are opened on the bottom side of the upper protective box, and the plurality of retraction rods are movably installed in the plurality of retraction grooves respectively; A return spring is installed at the top end of the retraction rod, and the top end of the return spring is installed on the inner wall of the retraction groove, and a connecting sleeve is connected between the upper protective box and the lower protective box; A support spring is installed at the bottom end of the push-up frame, and the bottom end of the support spring is installed on the inner wall of the bottom side of the extrusion frame; A driving gear sleeve is sleeved on the rotating frame, and a driving rack is installed on the other lower guard box. The driving rack is meshed with the driving gear sleeve. When the two lower guard boxes are closed, the driving rack drives the driving gear sleeve to rotate.
2. The test equipment for automotive semiconductor chip packaging according to claim 1, characterized in that: The active stabilization device further comprises a compression frame, which is movably mounted in the stabilization base; An expansion spring is installed on the stable base, and the top end of the expansion spring is installed on the stable base.
3. The test equipment for automotive semiconductor chip packaging according to claim 2, characterized in that: The four corners of the bottom side of the stable base are all rotatably mounted with integrated rotating shafts, and the four unfolding frames are respectively mounted on the four integrated rotating shafts; The four integrated rotating shafts are all sleeved with driving columns, the top side of the compression frame is installed with an adapter frame, the four corners of the adapter frame are all installed with driving rods, and the four driving rods are movably installed on the four driving columns respectively.
4. The test equipment for automotive semiconductor chip packaging according to claim 3, characterized in that: The driving column is provided with an arc-shaped driving groove, one end of the driving rod extends into the driving groove, and the driving rod moves vertically downward and in the driving groove to drive the driving column to rotate.
5. The test equipment for automotive semiconductor chip packaging according to claim 4, characterized in that: A return spring is installed on the counterweight block, and the bottom end of the return spring is installed on the bottom side of the unfolding frame.
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