Product verification method and system

Abstract

The invention provides a product verification method and system, and the method comprises the steps: fixing a to-be-detected product, and determining a target position of a target device in the to-be-detected product; selecting an adaptive windowing cutter based on the thickness of the molding compound at the target device, and determining windowing sample parameters according to the thickness of the molding compound and the size of the target device; performing windowing treatment on the target position through the windowing cutter according to the windowing sample parameters, and removing a target device; and a preset substitute is welded to the position where the target device is removed, and the to-be-detected product provided with the substitute is tested and verified. According to the invention, the electrical verification of any component or chip in the SIP finished product can be realized.

Description

Technical Field

[0001] The present invention relates to the field of system detection technology, and more specifically, to a product verification method and system using mechanical window opening. Background Art

[0002] SIP packaging (System In a Package) mainly integrates multiple functional wafers, including functional wafers of components such as processors and memories, into one package based on application scenarios, the number of packaging substrate layers and other factors, thereby realizing a packaging solution with basic complete functions. Electronic products based on SIP packaging need to undergo relevant testing and verification before packaging is completed or before leaving the factory to ensure that the product performance meets the requirements.

[0003] At present, swap verification usually refers to a method applied in the field of computer science and software testing to verify whether the exchange of data or information is performed correctly. Swap verification of product system-level packaging usually includes two methods:

[0004] First, the SIP finished product is removed from the PCB by tapping, the IC components are manually taken out, soldered to the auxiliary detection product, and then placed in the socket fixture for electrical testing. This is mainly used to verify the functionality of the removed IC. This method cannot be used for LCR products, that is, it is impossible to replace a component in the SiP finished product and then perform electrical verification on the finished product.

[0005] Second: Remove the PCB from the SIP finished product by tapping it, then use laser assistance to take out the IC / LCR components that need to be tested, solder them to the auxiliary testing product, and then put them into the slot fixture for electrical testing, mainly to verify the functionality of the IC / LCR. This method generates high heat and is easy to damage components. It is also impossible to replace a component in the SIP finished product and then perform electrical verification on the finished product.

[0006] However, since IC / LCR components are wrapped in plastic packaging materials, existing verification methods cannot perform swap verification on specific one or more components without destroying other packaging structures. Summary of the invention

[0007] In view of the above problems, the purpose of the present invention is to provide a product verification method and system to solve the problems existing in the existing SIP product verification, such as easy damage to the product and inability to perform electrical verification after replacing any components.

[0008] The product verification method provided by the present invention includes: fixing the product to be inspected and determining the target position of the target device in the product to be inspected; selecting an appropriate window opening tool based on the thickness of the plastic packaging material at the target device, and determining the window opening sample parameters according to the thickness of the plastic packaging material and the size of the target device; performing window opening processing on the target position according to the window opening sample parameters by the window opening tool, and removing the target device; welding a preset substitute at the position after the target device is removed, and testing and verifying the product to be inspected with the substitute.

[0009] In addition, an optional technical solution is to select an appropriate window opening tool based on the thickness of the plastic packaging material at the target device, and determine the window opening sample parameters according to the thickness of the plastic packaging material and the size of the target device, including: when the thickness of the plastic packaging material is less than a preset value, select a milling cutter with an effective end length greater than the thickness of the plastic packaging material as the window opening tool; the window opening sample parameters include the width, length and thickness of the window; wherein the width and length of the window are not less than the size of the target device.

[0010] In addition, an optional technical solution is that when the thickness of the plastic packaging material is greater than the preset value, a first tool and a first window opening parameter are selected; the target position is pre-windowed by the first tool according to the first window opening parameter to form a first window opening groove; a second tool and a second window opening parameter are selected, and the first window opening groove is pre-windowed by the second tool according to the second window opening parameter to remove the target device.

[0011] In addition, an optional technical solution is that the size of the first tool is larger than the size of the second tool.

[0012] In addition, an optional technical solution is that the size of the first window opening groove is larger than the window opening size of the second tool; and the window opening size of the second tool is larger than the size of the target device.

[0013] In addition, an optional technical solution is to remove the target device and weld a preset replacement at the position after the target device is removed, including: when the thickness of the solder ball layer below the main copper layer of the target device is less than a preset threshold, remove the target device and retain the main copper layer of the target device; remove the main copper layer by picking a needle to leak out the solder ball layer located below the main copper layer; after pre-treating the solder ball layer, weld and fix the preset replacement.

[0014] In addition, an optional technical solution is that the pretreatment includes: cleaning the surface of the solder ball layer by an air gun, then applying flux on the surface of the solder ball layer, and performing ball planting on the flux.

[0015] In addition, an optional technical solution is to remove the target device and the body copper layer when the thickness of the solder ball layer below the body copper layer of the target device is not less than the preset threshold.

[0016] In addition, an optional technical solution is that the preset threshold is 30-50um.

[0017] On the other hand, the present invention also provides a product verification system, including: a position determination unit, used to fix the product to be inspected and determine the target position of the target device in the product to be inspected; a tool and parameter determination unit, used to select an appropriate window opening tool based on the thickness of the plastic packaging material at the target device, and determine the window opening sample parameters according to the thickness of the plastic packaging material and the size of the target device; a window opening unit, used to perform window opening processing on the target position according to the window opening sample parameters through the window opening tool, and remove the target device; a verification unit, used to weld a preset substitute at the position after the target device is removed, and test and verify the product to be inspected with the substitute.

[0018] By utilizing the above-mentioned product verification method and system, it is possible to select an appropriate window opening tool and window opening sample parameters according to the thickness of the plastic packaging material at the target device to be verified, and then use the window opening tool to perform window opening processing on the target position according to the window opening sample parameters. This allows components at any position and with a larger plastic packaging thickness to be replaced and electrically verified, with low cost and high verification efficiency, and is applicable to the verification of various types of devices such as LCR components and chips.

[0019] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0021] Figure 1 is a flow chart of a product verification method according to an embodiment of the present invention;

[0022] Figure 2 Detailed flowchart of a product verification method according to an embodiment of the present invention.

[0023] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0024] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0025] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] It will be understood by those skilled in the art that, unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that the term "and / or" used herein includes any unit and all combinations of one or more associated listed items.

[0027] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art in the art to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless defined as herein.

[0028] To describe the product verification method and system in the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] Figure 1 The schematic flow of the product verification method according to the embodiment of the present invention is shown.

[0030] like Figure 1 As shown, the product verification method of the embodiment of the present invention at least includes the following steps:

[0031] S100: Fixing the product to be inspected and determining the target position of the target device in the product to be inspected.

[0032] Specifically, the products to be inspected may include SIP finished products or other types of packaged electronic products. Before verification, the products to be inspected can be fixed on the verification carrier by means of devices such as beeswax or a fixed base, and the target position of the target device in the products to be inspected can be determined by an external verification system. The position information can be directly displayed on the display screen of the verification system so that the operator can understand or adjust the position of the target device in a timely manner.

[0033] The specific target device may be an LCR component or an IC chip or other components in the product to be tested.

[0034] S200: Selecting an appropriate window opening tool based on the thickness of the molding compound at the target device, and determining window opening sample parameters according to the thickness of the molding compound and the size of the target device.

[0035] Specifically, this step may further include: judging the thickness of the plastic encapsulation material, when the thickness of the plastic encapsulation material is less than a preset value, directly selecting a milling cutter whose end effective length is greater than the thickness of the plastic encapsulation material as a window opening tool, and directly opening the window. This situation is applicable to products with a smaller thickness of the plastic encapsulation material, and the target device can be replaced by a one-time mechanical window opening. Among them, the window opening sample parameters may include the width, length and thickness of the window opening; wherein the width and length of the window opening are not less than the size of the target device, thereby ensuring that the target device can be completely exposed through the window opening, which is convenient for subsequent removal and replacement operations.

[0036] In addition, when the thickness of the plastic packaging material is greater than the preset value, a one-time cutting will place higher requirements on the tool, increase the window opening verification cost, and also affect the accuracy of the window opening. Therefore, multiple tools of different sizes can be used for multiple window opening processes. For example, the first tool and the first window opening parameter can be selected first, so that the first tool performs pre-window opening processing on the target position according to the first window opening parameter to form a first window opening groove; then, the second tool and the second window opening parameter are selected, so that the second tool performs re-window opening processing on the first window opening groove according to the corresponding second window opening parameter, so that the target device can be effectively removed.

[0037] It should be noted that, under normal circumstances, the size of the first tool is larger than that of the second tool. In addition, the size of the first window groove (including length and width) will be larger than the window size of the second tool. In other words, the size of the first window groove needs to be slightly larger to facilitate the secondary window opening process of the second tool, and the window size of the second tool needs to be slightly larger than the size of the target device, so that the target device can be effectively and completely removed and the installation of a replacement can be facilitated.

[0038] It can be seen that the specific window opening depth of the first tool and the window opening depth of the second tool can be set in combination with the thickness of the plastic packaging material. Usually, the window opening depth of the first tool will be slightly larger, which can provide favorable conditions for the window opening of the second tool; in addition, for the case where the thickness of the plastic packaging material is greater, multiple window opening processes can also be performed, and are not limited to the above-mentioned two window opening cases.

[0039] S300: performing window opening processing on the target position according to the window opening sample parameters by using the window opening tool, and removing the target device.

[0040] Specifically, this step may further include: judging the thickness of the solder ball layer (or solder layer) under the target device of the product to be inspected, and adopting different removal operations for the target device according to different thicknesses. Among them, when the thickness of the solder ball layer under the main copper layer of the target device is less than the preset threshold, when removing the target device, the main copper layer of the target device may be retained in advance to prevent the solder ball layer from being damaged when the target device and the main copper layer are removed at the same time, thereby affecting the welding of the substitute; therefore, the target device may be removed in advance, and then the main copper layer may be removed by a pick to leak out the solder ball layer under the main copper layer; finally, after pre-processing the solder ball layer, the preset substitute is fixed by welding, which can ensure the effective welding of the substitute and the reliable transmission of the verification signal.

[0041] Furthermore, when the thickness of the solder ball layer below the main copper layer of the target device is not less than the preset threshold, the target device and the main copper layer can be directly removed. In this case, the separate removal operation of the main copper layer can be saved, and the effective welding conduction between the solder ball layer and subsequent substitutes will not be affected.

[0042] In a specific embodiment of the present invention, the preset threshold value can be set to 30-50um, preferably, the preset threshold value can be set to 40um. When the thickness of the solder ball layer is less than 40um, the main copper layer needs to be retained, otherwise a window can be directly opened to the solder ball layer to facilitate subsequent soldering operations. The thickness of the solder ball layer can be understood as the vertical distance from the bottom of the body of the surface mount device to the bottom of the pin. The thickness of the plastic encapsulation material or the thickness of the solder ball layer may vary in different products or different devices of the same product, and can be flexibly set according to the product to be tested and the verification requirements.

[0043] In addition, the above-mentioned process of pretreating the solder ball layer mainly includes cleaning the surface of the solder ball layer with an air gun, then applying flux on the surface of the solder ball layer, and planting the ball on the flux. The main consideration for whether the ball planting is needed is whether the thickness of the solder ball layer can meet the welding requirements. If it is too thin to be welded, the ball planting is required, and then alcohol or other cleaning agents are used to clean the residual flux after the ball planting. Then new flux can be reapplied, and a qualified replacement can be placed in the welding area with the assistance of tweezers for welding.

[0044] S400: Weld a preset substitute device at the position after the target device is removed, and perform test verification on the product to be inspected with the substitute device.

[0045] Specifically, after placing the substitute in the welding area, a hot air gun can be used for heating treatment to complete the welding of the substitute and the product to be tested. Finally, the product after replacing the target device is electrically verified through an external verification system to determine whether there is a problem with the target device.

[0046] It should be noted that in the product verification method of the embodiment of the present invention, a milling cutter can be selected as the tool used for window opening. During the mechanical window opening process, a preliminary length judgment can be made within the commonly used size range of the milling cutter, that is, after the product is fixed, the thickness of the plastic packaging material and the effective length of the end of the commonly used milling cutter are first judged. If the thickness of the plastic packaging material is greater than the effective length of the end of the milling cutter, a milling cutter of appropriate size can be selected and installed according to the local window opening sample parameters, and then the parameters can be confirmed and the window opening can be performed; if the thickness of the plastic packaging material is not greater than the effective length of the end of the milling cutter, the window opening sample parameters can be directly input and the corresponding milling cutter can be installed to perform the window opening operation.

[0047] As a specific example, the product verification method of the present invention will be described in detail below in conjunction with an embodiment, wherein: Figure 2 The detailed process of the product verification method according to the embodiment of the present invention is shown.

[0048] like Figure 2 As shown, the product verification method in the embodiment of the present invention includes:

[0049] S110: First, fix the product to be tested on the verification carrier with beeswax, and then input the local window sample parameters into the verification system. The target device must be included in this range. The specific size can be based on the measurement results of the actual target device. The size measurement of the target device can be completed with the assistance of an external system.

[0050] S120: Install a milling cutter with a size of 0.39 mm, which is smaller than the size of the target device;

[0051] S130: Use a 0.39mm milling cutter to perform local mechanical window opening, thinning the plastic packaging material by 500um. The size after window opening is 1.218*1.092um (length*width);

[0052] S140: inputting fixed-point windowing sample parameters, wherein the windowing sample parameters are based on the measurement results of the actual target device;

[0053] S150: Install a milling cutter with a size of 0.2 mm, which is smaller than the size of the target device;

[0054] S160: Use a 0.2mm milling cutter to perform fixed-point mechanical windowing, remove the target device and retain the main copper layer to facilitate welding of Golden products;

[0055] S170: Use a pick needle to remove the copper layer of the main body and leak out the solder ball layer, use an air gun to clean the surface of the solder ball layer, apply flux and perform ball planting;

[0056] S180: Use alcohol to clean the residual flux from ball planting, then reapply new flux, use tweezers to place the Golden product into the welding area, use a hot air gun to heat to 280 degrees, and complete the welding in 20 seconds.

[0057] S190: Test and verify the product to be tested with alternatives through an external verification system.

[0058] Corresponding to the above-mentioned product verification method, the present invention also provides a product verification system, including: a position determination unit, used to fix the product to be inspected and determine the position of the target device in the product to be inspected; a tool and parameter determination unit, used to select an appropriate window opening tool based on the thickness of the plastic packaging material at the target device, and determine the window opening sample parameters according to the thickness of the plastic packaging material and the size of the target device; a window opening unit, used to perform window opening processing on the target position according to the window opening sample parameters through the window opening tool, and remove the target device; a verification unit, used to weld a preset substitute at the position after the target device is removed, and test and verify the product to be inspected with the substitute.

[0059] It should be noted that the embodiments of the above-mentioned product verification system can refer to the description in the embodiment of the product verification method, which will not be repeated here.

[0060] According to the product verification method and system of the present invention, the number of window openings and the window opening tool and window opening sample parameters suitable for each window opening can be selected according to the thickness of the plastic packaging material at the target device to be verified and the size of the target device, and then the window opening tool is used to perform at least one window opening process on the target position according to the window opening sample parameters. It can realize the replacement and electrical verification of devices at any position and with a large plastic packaging thickness, and can solve the problem that the existing SIP products cannot replace LCR and IC components to complete electrical verification. The verification cost is low and the efficiency is high, and it can be applicable to various types of device verification scenarios such as LCR components and chips.

[0061] The product verification method and system according to the present invention are described as an example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various improvements can be made to the product verification method and system proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A product verification method, characterized in that: include: Fixing the product to be inspected and determining the target position of the target device in the product to be inspected; Selecting an appropriate window opening tool based on the thickness of the plastic encapsulation material at the target device, and determining the window opening sample parameters according to the thickness of the plastic encapsulation material and the size of the target device; Performing window opening processing on the target position according to the window opening sample parameters by using the window opening tool, and removing the target device; The preset substitute is welded at the position after the target device is removed, and the product to be tested with the substitute is tested and verified.

2. The product verification method according to claim 1, characterized in that: Based on the thickness of the plastic encapsulation material at the target device, an appropriate window opening tool is selected, and according to the thickness of the plastic encapsulation material and the size of the target device, the window opening sample parameters are determined, including: When the thickness of the plastic packaging material is less than a preset value, a milling cutter whose end effective length is greater than the thickness of the plastic packaging material is selected as a window opening tool; The window sample parameters include the width, length and thickness of the window; wherein the width and length of the window are not less than the size of the target device.

3. The product verification method according to claim 2, characterized in that: When the thickness of the plastic packaging material is greater than the preset value, selecting a first tool and a first window opening parameter; Performing a pre-windowing process on the target position according to the first windowing parameter by using the first tool to form a first windowing groove; A second tool and a second windowing parameter are selected, and the first windowing groove is subjected to a windowing process by the second tool according to the second windowing parameter to remove the target device.

4. The product verification method according to claim 3, characterized in that: The size of the first tool is greater than the size of the second tool.

5. The product verification method according to claim 3, characterized in that: The size of the first window opening groove is larger than the window opening size of the second tool; and the window opening size of the second tool is larger than the size of the target device.

6. The product verification method according to claim 1, characterized in that: The method of removing the target device and welding the preset replacement device at the position after the target device is removed includes: When the thickness of the solder ball layer below the body copper layer of the target device is less than a preset threshold, removing the target device and retaining the body copper layer of the target device; Removing the main copper layer by a pick needle to expose the solder ball layer below the main copper layer; After pre-processing the solder ball layer, the preset replacement is fixed by welding.

7. The product authentication method according to claim 6, characterized in that: The pretreatment includes: cleaning the surface of the solder ball layer by an air gun, then applying soldering flux on the surface of the solder ball layer, and performing ball planting on the soldering flux.

8. The product authentication method according to claim 6, characterized in that: When the thickness of the solder ball layer below the body copper layer of the target device is not less than the preset threshold, the target device and the body copper layer are removed.

9. The product authentication method according to claim 6, characterized in that: The preset threshold is 30-50um.

10. A product authentication system, characterized in that: include: A position determination unit, used to fix the product to be detected and determine the target position of the target device in the product to be detected; A tool and parameter determination unit, used to select an appropriate window opening tool based on the thickness of the plastic packaging material at the target device, and determine the window opening sample parameters according to the thickness of the plastic packaging material and the size of the target device; A window opening unit, used to perform a window opening process on the target position according to the window opening sample parameters by using the window opening tool, and remove the target device; The verification unit is used to weld a preset substitute at the position after the target device is removed, and to test and verify the product to be tested with the substitute.

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