Connecting rod type wafer edge searching and positioning mechanism

Abstract

The invention relates to a connecting rod type wafer edge searching and positioning mechanism which comprises a track substrate and a wafer suction cup installed in the middle of the track substrate. A centering rotating disc is installed between the transmission base plate and the track base plate, a second servo motor is installed on one side of the bottom of the transmission base plate, the driving end of the top of the second servo motor is connected with a driving gear located above the transmission base plate, and the driving gear is meshed with a driven gear installed at the bottom of the centering rotating disc; a plurality of connecting rod assemblies are evenly distributed on the centering rotary disc in the circumferential direction. The method can be compatible with six-inch and eight-inch wafer operation at the same time. According to the invention, the connecting rod type clamping jaw is used for fitting the wafer center of the wafer through the shape precision of the wafer through a single shaft to position the wafer, and the action is completed without using the linkage of three motion shafts XY theta of the wafer calibrator.

Description

Technical Field

[0001] The present invention relates to the technical field related to wafer processing, and in particular to a connecting rod type wafer edge finding and positioning mechanism. Background Art

[0002] During the fully automatic processing of wafers, the wafer robot usually places the wafer from the carrying container on the wafer calibrator by adsorption. The imaging system on the calibrator identifies and photographs the wafer as a whole to determine its position, and then the linkage displacement of the three motion axes X\Y\θ (where the θ motion axis represents rotation around the Z axis) moves the center of the wafer to be concentric with the origin set by the system. The imaging system uses the recognition and photography method again to grab the positioning flat edge of the six-inch wafer or the positioning point of the eight-inch wafer, and then the wafer robot moves to the center of the circle set by the system to transport the wafer to the processing stage. The current wafer calibrator is extremely expensive in the equipment evaluation plan, and the overall cost of the imaging equipment is controlled; the control process is complicated and cumbersome, and the three motion axes X\Y\θ need to be linked and used in conjunction with the imaging system. If there is a system operation error or axis control abnormality, it is easy to cause positioning failure and increase the risk of damage during transportation; the calibrator manufacturing process is complicated, the supply time of the parts used is long, and the equipment manufacturing cycle is difficult to control.

[0003] In view of the above-mentioned defects, the designer has actively carried out research and innovation in order to create a connecting rod type wafer edge finding and positioning mechanism to make it more valuable for industrial use. Summary of the invention

[0004] In order to solve any of the above technical problems, the purpose of the present invention is to provide a connecting rod type wafer edge finding and positioning mechanism.

[0005] To achieve the above object, the present invention adopts the following technical solution:

[0006] A connecting rod type wafer edge finding and positioning mechanism comprises a track substrate and a wafer suction cup installed in the middle of the track substrate;

[0007] The bottom of the track base plate is connected to the transmission base plate below through a power connection plate, a centering turntable is installed between the transmission base plate and the track base plate, a second servo motor is installed on one side of the bottom of the transmission base plate, a driving end at the top of the second servo motor is connected to a driving gear located above the transmission base plate, and the driving gear is meshed with a driven gear installed at the bottom of the centering turntable;

[0008] A number of connecting rod assemblies are evenly distributed along the circumferential direction on the centering turntable, and the connecting rod assembly includes a guide sleeve, a connecting rod and a sliding shaft. The inner bottom of the connecting rod is rotatably installed on the centering turntable, and the sliding shaft is rotatably installed on the outer top of the connecting rod. A sliding shaft following groove is opened on the track base plate directly above the sliding shaft, and the sliding shaft is located in the sliding shaft following groove. A guide sleeve is installed on the top of the sliding shaft, and the guide sleeve is located above the track base plate.

[0009] As a further improvement of the present invention, a centering spindle is installed at the bottom of the wafer suction cup, and the bottom of the centering spindle passes through the track substrate, the centering turntable and the transmission substrate in sequence. A stepper motor is installed on the other side of the transmission substrate through a stepper motor mounting plate, and the driving end at the bottom of the stepper motor is connected to the bottom of the centering spindle through an active synchronous pulley, a synchronous belt and a driven synchronous pulley in sequence.

[0010] As a further improvement of the present invention, the centering spindle is installed on the track base plate through a first tapered roller bearing, the centering spindle is installed on the centering turntable through a second tapered roller bearing, and the centering spindle is installed on the transmission base plate through a first deep groove ball bearing.

[0011] As a further improvement of the present invention, a bearing pressure ring is installed at the bottom of the first tapered roller bearing and the second tapered roller bearing and is locked by a first locking nut, and a bearing pressure ring is installed at the bottom of the first deep groove ball bearing and is locked by a second locking nut.

[0012] As a further improvement of the present invention, a rotary joint is installed at the bottom of the centering spindle, and a shaft ring is installed on the centering spindle above the driven synchronous pulley.

[0013] As a further improvement of the present invention, a sensor detection unit is arranged on one side of the track substrate, the sensor detection unit includes a sensor drive assembly and a sensor assembly, the sensor drive assembly includes a reducer and a first servo motor, the reducer is installed at the bottom of one side of the track substrate through a reducer mounting member, the first servo motor is installed at the bottom of the reducer, the top of the reducer is connected to the sensor bracket located above the track substrate through a coupling, the sensor assembly is installed on the sensor bracket, and the sensor assembly includes a scanning sensor receiving end and a scanning sensor transmitting end that are adapted to each other from bottom to top.

[0014] As a further improvement of the present invention, the stepper motor mounting plate is mounted on the transmission base plate through a tensioning block.

[0015] As a further improvement of the present invention, a sensing sheet is installed on the centering turntable, a photoelectric sensor matched with the sensing sheet is installed on the transmission substrate below the sensing sheet, and limit blocks are installed on the transmission substrate on both sides of the photoelectric sensor.

[0016] As a further improvement of the present invention, the bottom of the sliding shaft is mounted on the connecting rod through two first gaskets, and at least one second deep groove ball bearing is mounted on the sliding shaft above the connecting rod, and the second deep groove ball bearing is located in the sliding shaft follower groove.

[0017] As a further improvement of the present invention, the inner bottom of the connecting rod is installed on the connecting pin, the bottom of the connecting pin is installed in the pin hole on the centering turntable below, a bushing hole is opened in the centering turntable above the pin hole, an oil-free bushing is installed on the connecting pin in the bushing hole, a second gasket is installed above the oil-free bushing, and spacers are installed on the connecting pins on the upper and lower sides of the inner bottom of the connecting rod and locked by sliding shaft nuts.

[0018] By means of the above scheme, the present invention has at least the following advantages:

[0019] The present invention is compatible with both six-inch and eight-inch wafer operations.

[0020] The present invention uses a connecting rod type clamp to position the wafer by accurately fitting the wafer center through the wafer shape through a single axis, and no longer uses the X\Y\θ three motion axes of the wafer calibrator to complete this action.

[0021] The present invention uses a sensor to scan the entire shape of the wafer to obtain the positioning flat edge of a six-inch wafer or the positioning point of an eight-inch wafer. The calibrator's imaging system no longer needs to take a picture of the entire wafer for identification. The imaging system is not used and the cost is low. Compared with wafer calibrators of the same level, the overall cost is about one-third of that of the calibrator.

[0022] The structure of the present invention is easy to install, and the mechanical positioning accuracy is accurate and reliable. It will not cause problems such as excessive positioning error or positioning failure due to abnormal control system, and provides great convenience for the overall development of the equipment.

[0023] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a structural schematic diagram of a connecting rod type wafer edge finding and positioning mechanism of the present invention;

[0026] Figure 2 yes Figure 1 Schematic diagram of the internal structure;

[0027] Figure 3 yes Figure 1 Schematic diagram of the structure of the middle connecting rod assembly.

[0028] The meanings of the various reference numerals in the figures are as follows.

[0029] Track substrate 1, connecting rod assembly 2, wafer suction cup 3, scanning sensor receiving end 4, scanning sensor transmitting end 5, 6-coupling, 7-reducer mounting, 8-reducer, 9-first servo motor, 10-driving gear, 11-second servo motor, 12-driven gear, 13-tensioning block, 14-synchronous belt, 15-limiting block, transmission substrate 16, centering turntable 17, 18-photoelectric sensor, 19-sensor sheet, centering spindle 20, 21-first tapered roller bearing, 22-second tapered roller bearing Tapered roller bearing, 23-stepping motor, 24-first locking nut, 25-stepping motor mounting plate, 26-first deep groove ball bearing, 27-driving synchronous pulley, 28-second locking nut, 29-shaft collar, 30-driven synchronous pulley, 31-rotating joint, guide sleeve 32, 33-second deep groove ball bearing, 34-first gasket, connecting rod 35, sliding shaft 36, 37-second gasket, 38-oil-free bushing, 39-connecting pin, 40-spacer, 41-sliding shaft nut, power connecting plate 42. DETAILED DESCRIPTION

[0030] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0032] like Figure 1 to Figure 3 As shown, a connecting rod type wafer edge finding and positioning mechanism comprises a track substrate 1 and a wafer suction cup 3 installed in the middle of the track substrate 1;

[0033] The bottom of the track substrate 1 is connected to the transmission substrate 16 below through the power connection plate 42, a centering turntable 17 is installed between the transmission substrate 16 and the track substrate 1, a second servo motor 11 is installed on one side of the bottom of the transmission substrate 16, the driving end of the top of the second servo motor 11 is connected to the driving gear 10 located above the transmission substrate 16, and the driving gear 10 is meshed with the driven gear 12 installed at the bottom of the centering turntable 17;

[0034] A plurality of connecting rod assemblies 2 are evenly distributed along the circumferential direction on the centering turntable 17, and the connecting rod assembly 2 includes a guide sleeve 32, a connecting rod 35 and a sliding shaft 36. The inner bottom of the connecting rod 35 is rotatably mounted on the centering turntable 17, and the sliding shaft 36 is rotatably mounted on the outer top of the connecting rod 35. A sliding shaft follower groove is opened on the track substrate 1 directly above the sliding shaft 36, and the sliding shaft 36 is located in the sliding shaft follower groove. A guide sleeve 32 is installed on the top of the sliding shaft 36, and the guide sleeve 32 is located above the track substrate 1.

[0035] Preferably, a centering spindle 20 is installed at the bottom of the wafer suction cup 3, and the bottom of the centering spindle 20 passes through the track substrate 1, the centering turntable 17 and the transmission substrate 16 in sequence. A stepper motor 23 is installed on the other side of the transmission substrate 16 through a stepper motor mounting plate 25. The driving end at the bottom of the stepper motor 23 is connected to the bottom of the centering spindle 20 through an active synchronous pulley 27, a synchronous belt 14 and a driven synchronous pulley 30 in sequence.

[0036] Preferably, the centering spindle 20 is mounted on the track substrate 1 through a first tapered roller bearing 21 , the centering spindle 20 is mounted on the centering turntable 17 through a second tapered roller bearing 22 , and the centering spindle 20 is mounted on the transmission substrate 16 through a first deep groove ball bearing 26 .

[0037] Preferably, a bearing pressure ring is installed at the bottom of the first tapered roller bearing 21 and the second tapered roller bearing 22 and is locked by a first locking nut 24 , and a bearing pressure ring is installed at the bottom of the first deep groove ball bearing 26 and is locked by a second locking nut 28 .

[0038] Preferably, a rotary joint 31 is installed at the bottom of the centering spindle 20 , and a shaft collar 29 is installed on the centering spindle 20 above the driven synchronous pulley 30 .

[0039] Preferably, a sensor detection unit is provided on one side of the track substrate 1, the sensor detection unit includes a sensor drive assembly and a sensor assembly, the sensor drive assembly includes a reducer 8 and a first servo motor 9, the reducer 8 is installed at the bottom of one side of the track substrate 1 through a reducer mounting member 7, the first servo motor 9 is installed at the bottom of the reducer 8, the top of the reducer 8 is connected to the sensor bracket located above the track substrate 1 through a coupling 6, the sensor assembly is installed on the sensor bracket, and the sensor assembly includes, from bottom to top, a scanning sensor receiving end 4 and a scanning sensor transmitting end 5 that are adapted to each other.

[0040] Preferably, the stepper motor mounting plate 25 is mounted on the transmission base plate 16 via a tensioning block 13 .

[0041] Preferably, a sensing sheet 19 is installed on the centering turntable 17 , a photoelectric sensor 18 matched with the sensing sheet 19 is installed on the transmission base plate 16 below the sensing sheet 19 , and limit blocks 15 are installed on the transmission base plate 16 on both sides of the photoelectric sensor 18 .

[0042] Preferably, the bottom of the sliding shaft 36 is mounted on the connecting rod 35 through two first gaskets 34, and at least one second deep groove ball bearing 33 is mounted on the sliding shaft 36 above the connecting rod 35, and the second deep groove ball bearing 33 is located in the sliding shaft follower groove.

[0043] Preferably, the inner bottom of the connecting rod 35 is installed on the connecting pin 39, the bottom of the connecting pin 39 is installed in the pin hole on the centering turntable 17 below, a bushing hole is opened in the centering turntable 17 above the pin hole, an oil-free bushing 38 is installed on the connecting pin 39 in the bushing hole, and a second gasket 37 is installed above the oil-free bushing 38. Spacers 40 are installed on the connecting pins 39 on the upper and lower sides of the inner bottom of the connecting rod 35 and are locked by sliding shaft nuts 41.

[0044] The positional relationship and connection relationship between the components of the present invention are as follows:

[0045] The main body of the present invention is connected to the device structure using the present invention through the track substrate 1, and all other parts of the present invention are directly or indirectly connected to the track substrate 1. Among them, the connecting rod assembly 2 is composed of Figure 3 The guide sleeve 32 is connected to the end of the sliding shaft 36 by bolts, and the second deep groove ball bearing 33, the first gasket 34 and the sliding shaft 36 are connected by matching and then formed into a matching connection; the second gasket 37 (oil-free gasket), the oil-free bushing 38 and the spacer 40 are connected as shown in FIG. Figure 3After the positional relationship shown forms a fitting connection with the connecting pin 39, the whole and the connecting rod 35 form a connecting rod component under the threaded connection of the sliding shaft nut 41, and its second gasket 37 and oil-free bushing 38 form a fitting connection with the centering turntable 17, and the second deep groove ball bearing 33 forms a sliding fitting connection with the track substrate 1.

[0046] After the first tapered roller bearing 21 is embedded in the center of the main track substrate 1, the centering spindle 20 is matched with the first tapered roller bearing 21, and then connected to the track substrate 1 by bolts, and then connected to the transmission substrate 16 by bolts. The first deep groove ball bearing 26 is embedded in the center of the transmission substrate 16 to provide auxiliary support for the centering spindle 20. At the same time, the second locking nut 28 is connected to the centering spindle 20 by threads, and then pressed against the inner ring of the bearing on the first deep groove ball bearing 26. Thus, the centering spindle 20 is completely fixed under the support of the above components. Figure 2 As shown, after the second tapered roller bearing 22 is embedded in the centering turntable 17, the two are matched and connected, and then the inner ring of the second tapered roller bearing 22 is pressed into Figure 2 After the centering spindle 20 is positioned at the shoulder position shown, the first locking nut 24 is connected to the centering spindle 20 by threaded connection and then pressed against the inner ring of the second tapered roller bearing 22, so that the centering turntable 17 is connected to the centering spindle 20 by rotation under the action of the bearing, and at the same time, the second deep groove ball bearings 33 on the six connecting rod assemblies 2 connected thereto cooperate with the six linear tracks (i.e., the sliding shaft follower grooves) on the track substrate 1 to achieve the displacement form transformation from circular motion to linear motion. After the driven gear 12 is positioned on the boss at the center of the centering turntable 17, it is connected to the centering turntable 17 by bolts; after the driving gear 10 is connected to the output shaft of the second servo motor 11, the radial stop screw of the gear is screwed in and pressed against the output shaft of the servo motor, and after a reliable connection is achieved, the second servo motor 11 is connected to the transmission substrate 16 by a matching connection and a bolt connection, so that the circumferential power of the centering turntable 17 is reliably connected.

[0047] like Figure 2As shown, the centering spindle 20 is fixed with bearings at both ends to achieve the degree of freedom fixed except rotation. After the collar 29 is matched with the centering spindle 20, the inner diameter of the collar is changed by bolt locking, so as to achieve a tight fit connection with the centering spindle 20. The rear end face of the driven synchronous pulley 30 is inserted into the centering spindle 20 and is in close contact with the end face of the collar 29. After its inner diameter forms a matching connection with the centering spindle 20, three stop screws evenly distributed on the circumference are screwed in and pressed on the circumference of the centering spindle 20, so as to achieve a tight connection between the driven synchronous pulley 30 and the centering spindle 20. After the stepper motor 23 and the stepper motor 25 mounting plate are connected with ordinary bolts, the driving synchronous pulley 27 is installed on the output shaft of the stepper motor 23, and the stepper motor mounting plate 25 is connected with the transmission base plate 16 by bolts. The synchronous belt 14 completes power transmission with the driving synchronous pulley 27 and the driven synchronous pulley 30 through belt drive. After the scanning sensor receiving end 4 and the scanning sensor transmitting end 5 are fixed on the track substrate 1 through the adjusting connecting rod, the power transmission connection is completed by the coupling 6 and the output shaft of the reducer 8. After the reducer 8 and the first servo motor 9 are connected in the form of positioning fit and bolts, the track substrate 1 and the reducer 8 are fixedly connected by the reducer mounting part 7. The scanning sensor receiving end 4 and the scanning sensor transmitting end 5 are two components of the wafer scanning sensor. Here, in order to realize the automated operation process of the equipment, the power provided by the first servo motor 9 is mainly used to prevent the scanning sensor and the clamp (i.e., the guide sleeve 32) from having position interference when the clamp automatically clamps the wafer by the principle of the swing arm.

[0048] Working principle and working process of the present invention:

[0049] The present invention is compatible with the edge-finding and positioning functions of six-inch wafers and eight-inch wafers. The structural working parameters corresponding to wafers of different sizes can be set and retrieved when the equipment performs an automated operation process. When the eight-inch wafer is in operation, the wafer is placed on the wafer suction cup 3 by the wafer robot. At this time, the center position of the wafer is uncertain, and the second servo motor 11 needs to rotate to drive the centering turntable 17 to rotate. The connecting rod assembly 2 connected thereto by cooperation pulls one end under the rotation of the centering turntable 17, and the other end of the connecting rod is connected to the linear track of the track substrate 1. The displacement is converted into linear motion. The ends of the six connecting rod assemblies 2 distributed in a circle move linearly toward the center of the track substrate 1 at the same time, and the diameter of the circle formed by the six guide sleeves 32 is reduced, pushing the eight-inch wafer to the center position of the track substrate 1.

[0050] After completing the wafer positioning of the above-mentioned actions, the equipment automation process starts the vacuum signal. After the wafer is adsorbed by the wafer suction cup 3, the second servo motor 11 reverses, driving the centering turntable 17 to reverse, and the six connecting rod assemblies 2 are fully opened, and the center of the wafer is no longer constrained. At this time, due to the vacuum adsorption effect of the wafer suction cup 3, the wafer will not produce other displacements. The first servo motor 9 rotates to move the scanning sensor receiving end 4 and the scanning sensor transmitting end 5 to the upper and lower sides of the wafer in the form of a swing arm action. At the same time, the light spot emitted and received by the scanning sensor is about half blocked by the wafer. At this time, the stepper motor 23 rotates, and under the drive of the synchronous belt 14, the centering spindle 20 rotates synchronously, driving the eight-inch wafer to rotate at the same speed. Because when the wafer rotates outside the positioning point, the length of the light spot blocked by the wafer is fixed, and the analog value formed by the light spot length received by the scanning sensor receiving end 4 is fixed. When the positioning point of the eight-inch wafer rotates to the positioning point and the scanning sensor When the light spots emitted by the transmitting end 5 overlap, the length of the light spots blocked by the wafer changes because the positioning point at that location is similar to a gap, and the analog value of the light spot length received by the scanning sensor receiving end 4 changes. After the equipment system judges, the current angle position of the stepper motor 23 is the position of the eight-inch wafer positioning point. At this time, the eight-inch wafer has completed all positioning actions. The system records the position and rotates the stepper motor 23 a certain angle to the wafer to be transported position, and then the system disconnects the vacuum signal, the adsorption force of the wafer suction cup 3 disappears, and the wafer is transported to the processing carrier by the wafer robot for the next operation process.

[0051] When processing a six-inch wafer, the principle of locating the center of the wafer is exactly the same as that of an 8-inch wafer. The rotation angle of the second servo motor 11 is different from that of the 8-inch wafer. This part can be completed by calling the 6-inch processing parameters when the equipment performs a fully automatic operation process. After completing the positioning of the center of the wafer, the flat edge position of the six-inch wafer needs to be determined. The positioning reference points of the six-inch wafer and the eight-inch wafer are quite different. The eight-inch is a semicircular notch-shaped positioning point, while the six-inch wafer is a positioning flat edge. After the wafer is completely adsorbed by the wafer suction cup 3, the first servo motor 9 rotates to move the scanning sensor receiving end 4 and the scanning sensor transmitting end 5 to the upper and lower sides of the wafer in the form of a swing arm action. At the same time, the light spot emitted and received by the scanning sensor is about half blocked by the wafer. At this time, the stepper motor 23 rotates, and under the drive of the synchronous belt 14, the centering spindle 20 rotates synchronously, driving the six-inch wafer to rotate at the same speed. Because when the wafer rotates outside the positioning flat edge, the light spot The length blocked by the wafer is fixed, and the analog value formed by the spot length received by the scanning sensor receiving end 4 is fixed. When the flat edge of the six-inch wafer rotates to the point where the analog value of the spot length received by the scanning sensor receiving end 4 changes, the system records the position of the stepper motor 23 as the first endpoint position of the flat edge; then the stepper motor 23 continues to rotate, and when the analog value of the spot length received by the scanning sensor receiving end 4 is the same as the position of the previous analog value, the system records the position of the stepper motor 23 as the second endpoint position of the flat edge, and then takes the midpoint position of the two recorded positions, that is, the 6-inch wafer completes all flat edge positioning, and then proceeds to the next operation process.

[0052] The present invention uses a simple connecting rod structure, various machined parts and edge scanning sensors to accurately combine to achieve the centering and edge finding function of the wafer, completely replacing the expensive and long-delivery wafer aligner. After continuous testing, this mechanical connecting rod centering structure has a final centering accuracy of about 0.05 after wafer centering, and a repeatability accuracy of 0.01.

[0053] The flat edge angle positioning accuracy of the six-inch wafer reaches 0.05 degrees, and the repeat positioning accuracy reaches 0.01 degrees; the positioning point finding accuracy of the eight-inch wafer reaches 0.08 degrees, and the repeat positioning accuracy reaches 0.04 degrees.

[0054] The timing starts from the placement of the wafer on the device to complete centering and positioning of the flat edge or positioning point, with a cumulative time of about 8 seconds. The operation efficiency is relatively high, and the mechanical structure positioning greatly improves the operation accuracy, saving time for the overall processing efficiency of the equipment.

[0055] The present invention does not use an imaging system, has simple control, is easy to debug, greatly saves time and material costs, and makes a huge contribution to the overall cost control of the equipment. Its cost and efficiency win a certain degree of market competitive advantage for the equipment.

[0056] The wafer is positioned by using a connecting rod-type clamp to accurately fit the wafer center through a single axis using the wafer shape. The three motion axes of the wafer calibrator X\Y\θ are no longer used to complete this action. The sensor scans the overall shape of the wafer to obtain the positioning flat edge of the six-inch wafer or the positioning point of the eight-inch wafer. The calibrator's imaging system no longer takes a picture of the entire wafer for recognition. The imaging system is not used, and the cost is low. Compared with the wafer calibrator of the same level, the overall cost is about one-third. The mechanical positioning accuracy is accurate and reliable, and there will be no problems such as excessive positioning error or positioning failure due to abnormal control system.

[0057] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0058] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A connecting rod type wafer edge finding and positioning mechanism, comprising a track substrate (1) and a wafer suction cup (3) mounted on the middle part of the track substrate (1); characterized in that: The bottom of the track substrate (1) is connected to the transmission substrate (16) below via a power connection plate (42); a centering turntable (17) is installed between the transmission substrate (16) and the track substrate (1); a second servo motor (11) is installed on one side of the bottom of the transmission substrate (16); a driving end at the top of the second servo motor (11) is connected to a driving gear (10) located above the transmission substrate (16); and the driving gear (10) is meshed with a driven gear (12) installed at the bottom of the centering turntable (17); A plurality of connecting rod assemblies (2) are evenly distributed along the circumferential direction on the centering turntable (17), and the connecting rod assembly (2) comprises a guide sleeve (32), a connecting rod (35) and a sliding shaft (36). The inner bottom of the connecting rod (35) is rotatably mounted on the centering turntable (17), and the sliding shaft (36) is rotatably mounted on the outer top of the connecting rod (35). A sliding shaft follower groove is provided on the track substrate (1) directly above the sliding shaft (36), and the sliding shaft (36) is located in the sliding shaft follower groove. A guide sleeve (32) is installed on the top of the sliding shaft (36), and the guide sleeve (32) is located above the track substrate (1).

2. The connecting rod type wafer edge finding and positioning mechanism according to claim 1, characterized in that: A centering spindle (20) is installed at the bottom of the wafer suction cup (3), and the bottom of the centering spindle (20) passes through a track substrate (1), a centering turntable (17) and a transmission substrate (16) in sequence. A stepper motor (23) is installed on the other side of the transmission substrate (16) through a stepper motor mounting plate (25), and the driving end at the bottom of the stepper motor (23) is connected to the bottom of the centering spindle (20) through an active synchronous pulley (27), a synchronous belt (14) and a driven synchronous pulley (30) in sequence.

3. The connecting rod type wafer edge finding and positioning mechanism as claimed in claim 2, characterized in that: The centering spindle (20) is mounted on the track base plate (1) via a first tapered roller bearing (21), the centering spindle (20) is mounted on the centering turntable (17) via a second tapered roller bearing (22), and the centering spindle (20) is mounted on the transmission base plate (16) via a first deep groove ball bearing (26).

4. The connecting rod type wafer edge finding and positioning mechanism as claimed in claim 3, characterized in that: A bearing pressure ring is installed at the bottom of the first tapered roller bearing (21) and the second tapered roller bearing (22) and is locked by a first locking nut (24), and a bearing pressure ring is installed at the bottom of the first deep groove ball bearing (26) and is locked by a second locking nut (28).

5. The connecting rod type wafer edge finding and positioning mechanism as claimed in claim 2, characterized in that: A rotary joint (31) is installed at the bottom of the centering spindle (20), and a shaft ring (29) is installed on the centering spindle (20) above the driven synchronous pulley (30).

6. The connecting rod type wafer edge finding and positioning mechanism as claimed in claim 1, characterized in that: A sensor detection unit is arranged on one side of the track substrate (1), the sensor detection unit comprises a sensor drive assembly and a sensor assembly, the sensor drive assembly comprises a reducer (8) and a first servo motor (9), the reducer (8) is mounted on the bottom of one side of the track substrate (1) via a reducer mounting member (7), the first servo motor (9) is mounted on the bottom of the reducer (8), the top of the reducer (8) is connected to a sensor bracket located above the track substrate (1) via a coupling (6), the sensor assembly is mounted on the sensor bracket, and the sensor assembly comprises, from bottom to top, a scanning sensor receiving end (4) and a scanning sensor transmitting end (5) which are adapted to each other.

7. The connecting rod type wafer edge finding and positioning mechanism according to claim 1, characterized in that: The stepper motor mounting plate (25) is mounted on the transmission base plate (16) via a tensioning block (13).

8. The connecting rod type wafer edge finding and positioning mechanism according to claim 1, characterized in that: A sensing sheet (19) is mounted on the centering turntable (17), a photoelectric sensor (18) adapted to the sensing sheet (19) is mounted on a transmission base plate (16) below the sensing sheet (19), and limit blocks (15) are mounted on the transmission base plate (16) on both sides of the photoelectric sensor (18).

9. The connecting rod type wafer edge finding and positioning mechanism according to claim 1, characterized in that: The bottom of the sliding shaft (36) is mounted on the connecting rod (35) via two first washers (34), and at least one second deep groove ball bearing (33) is mounted on the sliding shaft (36) above the connecting rod (35), and the second deep groove ball bearing (33) is located in the sliding shaft follower groove.

10. The connecting rod type wafer edge finding and positioning mechanism according to claim 1, characterized in that: The inner bottom of the connecting rod (35) is mounted on a connecting pin (39), and the bottom of the connecting pin (39) is mounted in a pin hole on a centering turntable (17) below. A bushing hole is provided in the centering turntable (17) above the pin hole. An oil-free bushing (38) is mounted on the connecting pin (39) in the bushing hole. A second gasket (37) is mounted above the oil-free bushing (38). Spacers (40) are mounted on the connecting pins (39) on both upper and lower sides of the inner bottom of the connecting rod (35) and are locked by means of a sliding shaft nut (41).

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