Electronic component pin bending system

Abstract

The invention discloses an electronic component pin bending system, and relates to the technical field of electronic component processing. The electronic component pin bending system comprises a bending device. The bending device comprises a first positioning mechanism and a bending driving mechanism, the first positioning mechanism is used for positioning a main body of the electronic element, the pin of the electronic element can extend out of the side surface of the first positioning mechanism in a positioning state, and the bending driving mechanism can press downwards or upwards so as to bend the pin of the electronic element in the positioning state. Through the arrangement of the bending device, the pins can be automatically bent according to the requirement of the bending direction of the pins, in the bending process, the electronic elements are installed on the corresponding first positioning mechanisms to be positioned, the corresponding pins are pushed by the bending driving mechanisms to be bent so as to deform, and the bending efficiency of the pins can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component processing, and in particular to an electronic component pin bending system. Background Art

[0002] For many electronic components with pins, their pins may need to be bent for subsequent testing and other operations. For example, the application of TO94 packaged automotive magnetic sensor products requires the chip plastic package to stand on the PCB board, and the Hall sensor inside the chip is used to test the current conduction of the adjacent wires. Many end customers choose to bend the four pins of the TO94 product into different shapes and then mount them on the PCB board, thereby improving the stability and convenience of the sensor during operation and achieving the purpose of mass production automation. At present, there are two main solutions for bending the pins: L-type and V-type.

[0003] Among them, when the pins are bent, in one process, manual operation is required, and the bending efficiency is low.

[0004] Therefore, how to improve the pin bending efficiency is a technical problem that technical personnel in this field currently need to solve. Summary of the invention

[0005] In view of this, an object of the present invention is to provide an electronic component pin bending system, which can improve the pin bending efficiency.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A system for bending pins of electronic components comprises a bending device; the bending device comprises a first positioning mechanism and a bending drive mechanism, the first positioning mechanism is used to position the main body of the electronic component, and in the positioned state, the pins of the electronic component can extend out of the side of the first positioning mechanism, and the bending drive mechanism can press down or press up to bend the pins of the electronic component in the positioned state.

[0008] Preferably, the two bending devices are respectively a first bending device and a second bending device arranged in parallel; the bending drive mechanism in the first bending device is used to press down the pins of the electronic components in a bent and positioned state, and the bending drive mechanism in the second bending device is used to press up the pins of the electronic components in a bent and positioned state.

[0009] Preferably, the bending drive mechanism includes a positioning knife, a bending driver and a bending knife connected to the bending driver, and the positioning knife is arranged above the first positioning mechanism or in parallel on the side of the first positioning mechanism; the bending driver can drive the bending knife to move toward the side of the positioning knife to press the pins of the electronic components.

[0010] Preferably, it also includes a loading device arranged in parallel with the bending device; the loading device includes a material tray module and a loading robot, the material tray module has a plurality of material troughs arranged in parallel to place electronic components respectively, and the loading robot is used to take out the electronic components from the material troughs and transfer them to the set device.

[0011] Preferably, a visual recognition component is provided on the loading robot to identify electronic components.

[0012] Preferably, it also includes a cutting device arranged in parallel with the bending device; the cutting device includes a second positioning mechanism, a cutting support table, a cutter driver and a cutter; the cutting support table is fixed to the side of the second positioning mechanism, the second positioning mechanism is used to position the main body of the electronic component, and in the positioned state, the pins of the electronic component can extend out of the side of the cutting support table; the cutter is connected to the cutter driver so that under the drive of the cutter driver, the cutter can cut off the part of the pin that extends out of the side of the cutting support table.

[0013] Preferably, it also includes a product detection device arranged in parallel with the bending device, and the product detection device includes a third positioning mechanism and a test component. The third positioning mechanism is used to position the main body of the electronic component, and in the positioned state, the test component can detect whether the pin meets the preset standard.

[0014] Preferably, at least one of the first positioning mechanism, the second positioning mechanism, and the third positioning mechanism is a clamping positioning mechanism;

[0015] The clamping and positioning mechanism includes a positioning support platform, a positioning baffle, a positioning block and a positioning block driver. The positioning baffle is fixed above one side of the positioning support platform, and the positioning block is slidably connected above the positioning support platform. The positioning block can move toward the positioning baffle under the drive of the positioning block driver to clamp and position the main body of the electronic component through the cooperation of the positioning baffle and the positioning block.

[0016] Preferably, the clamping and positioning mechanism further comprises a positioning suction nozzle arranged on the positioning support platform to suck the main body of the electronic component downwards.

[0017] Preferably, the positioning block is provided with a first positioning groove facing the positioning stop bar, so as to be engaged with the positioning stop bar to position the main body of the electronic component;

[0018] And / or, a second positioning groove facing the positioning block is provided on the positioning baffle to engage with the positioning block to position the main body of the electronic component.

[0019] The electronic component pin bending system provided by the present invention comprises a bending device; the bending device comprises a first positioning mechanism and a bending drive mechanism, the first positioning mechanism is used to position the main body of the electronic component, and in the positioned state, the pin of the electronic component can extend out of the side of the first positioning mechanism, and the bending drive mechanism can press down or press up to bend the pin of the electronic component in the positioned state.

[0020] By setting up the bending device, the pins can be automatically bent according to the bending direction requirements of each pin. During the bending process, the electronic components are installed on the corresponding first positioning mechanism and positioned. The corresponding pins are pushed to bend and deform with the help of the bending drive mechanism, which can improve the bending efficiency of the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0022] Figure 1 It is a structural diagram of a chip with L-shaped pins;

[0023] Figure 2 It is a structural diagram of a chip with V-shaped pins;

[0024] Figure 3 This is a schematic structural diagram of a feeding device in a specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0025] Figure 4 It is a structural schematic diagram of the clamping and positioning mechanism in the specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0026] Figure 5 This is a schematic structural diagram of a cutting device in a specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0027] Figure 6 This is a schematic structural diagram of the cutting device after cutting the pins in the first specific embodiment of the electronic component pin bending system provided by the present invention;

[0028] Figure 7 It is a schematic structural diagram of a positioning knife of a first bending device in a specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0029] Figure 8 It is a schematic structural diagram of a bending knife of a first bending device in a specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0030] Fig. 9 A schematic diagram of the structure of the bending knife of the first bending device in the specific embodiment 1 of the electronic component pin bending system provided by the present invention initially pressing down the pin;

[0031] Fig.10 A schematic diagram of the structure of the bending knife of the first bending device in the specific embodiment 1 of the electronic component pin bending system provided by the present invention pushing the pin horizontally;

[0032] Fig.11 This is a schematic structural diagram of a first bending device in a specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0033] Fig.12 This is a schematic structural diagram of the first bending device in the specific embodiment 1 of the electronic component pin bending system provided by the present invention after the pin is bent downward;

[0034] Fig.13 It is a structural schematic diagram of the second bending device in the specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0035] Fig.14 It is a partial structural schematic diagram of the second bending device in the specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0036] Fig.15 This is a schematic structural diagram of a product detection device in a specific embodiment 1 of the electronic component pin bending system provided by the present invention;

[0037] Fig.16 This is a structural diagram of a specific embodiment 1 of the electronic component pin bending system provided by the present invention.

[0038] Reference numerals:

[0039] Bending device 1, first bending device 11, second bending device 12, first positioning mechanism 13, positioning knife 14, first positioning knife 141, first side surface 1411, second positioning knife 142, second side surface 1421, bending knife 15, first bending knife 151, second bending knife 152;

[0040] Electronic component 2, main body 21, pin 22;

[0041] Feeding device 3, material tray module 31, material trough 311, feeding robot 32;

[0042] Product detection device 4, OS test probe 41, third positioning mechanism 42;

[0043] Cutting device 5, second positioning mechanism 51, cutting support table 52, third side surface 521, cutting knife 53, waste collection box 54;

[0044] Clamping and positioning mechanism 6, positioning support platform 61, positioning stop bar 62, positioning block 63, first positioning groove 631, positioning suction nozzle 64, guide rail 65, positioning rod 66, buffer spring 67, positioning claw 68, positioning claw driver 69, positioning block driver 610. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] The core of the present invention is to provide an electronic component pin bending system, which can improve the pin bending efficiency.

[0047] The electronic component pin bending system provided by the present invention, in the specific embodiment 1, please refer to Figures 3 to 16 , including a bending device 1, which is used to implement the pin bending process.

[0048] Among them, the bending device 1 includes a first positioning mechanism 13 and a bending drive mechanism. The first positioning mechanism 13 is used to position the main body 21 of the electronic component 2, and in the positioned state, the pins 22 of the electronic component 2 can extend out of the side of the first positioning mechanism 13, and the bending drive mechanism can press down or press up to bend the pins 22 of the electronic component 2 in the positioned state.

[0049] Among them, Figure 1 and Figure 2 As shown, the electronic component 2 is a chip, specifically a vehicle-mounted sensor chip, more specifically a TO94 packaged product, and the main body 21 of the electronic component 2 is a plastic package of the chip. In other embodiments, other electronic components 2 may also be used.

[0050] In this embodiment, through the setting of the bending device 1, the pins 22 can be automatically bent according to the bending direction requirements of each pin 22. During the bending process, the electronic component 2 is installed on the corresponding first positioning mechanism 13 and positioned. The corresponding pin 22 is pushed to bend and deformed with the help of the bending drive mechanism, which can improve the bending efficiency of the pin 22.

[0051] Furthermore, the two bending devices 1 in the electronic component pin bending system are respectively a first bending device 11 and a second bending device 12 arranged in parallel. The bending drive mechanism in the first bending device 11 is used to press down the pin 22 of the electronic component 2 in a bent and positioned state, and the bending drive mechanism in the second bending device 12 is used to press up the pin 22 of the electronic component 2 in a bent and positioned state, so that the pin 22 can be bent in different directions by the two bending devices 1.

[0052] Among them, in this embodiment, Fig.16 As shown, four bending devices 1 are provided, namely, two first bending devices 11 and two second bending devices 12, wherein, starting one of the first bending devices 11 and one of the second bending devices 12 can realize the bending of the pins of the electronic components with L-shaped pins; starting two first bending devices 11 and two second bending devices 12 can realize the bending of the pins of the electronic components with V-shaped pins. Of course, in other embodiments, only one or more than two can be provided according to the bending requirements of the pins 22.

[0053] Further, the bending drive mechanism includes a positioning knife 14, a bending drive, and a bending knife 15 connected to the bending drive. The positioning knife 14 is arranged above the first positioning mechanism 13 or arranged in parallel on the side of the first positioning mechanism 13. The bending drive can drive the bending knife 15 to move toward the side of the positioning knife 14 to press the pin 22 of the electronic component 2.

[0054] Among them, the positioning knife 14 is used to position the bent portion of the pin 22, and the shape and angle of the positioning knife 14 can be adaptively set according to the bending requirements of the pin 22, such as Figure 7 As shown, the top of the side surface of the positioning knife 14 for positioning the bending part of the pin 22 has a chamfer R, and the side surface is inclined relative to the horizontal plane and has an angle θ1. In addition, the size of the bending knife 1 can also be set according to the bending requirements of the pin 22, such as Figure 8 As shown, its side surface includes an angle θ2 relative to the horizontal plane.

[0055] The movement direction of the bending knife 15 driven by the bending driver may be a straight line, an arc or a broken line, which can be set according to needs, as long as the pin 22 can be pressed to the side of the positioning knife 14 to achieve bending.

[0056] Among them, in the first bending device 11: Fig.11 As shown, the positioning knife 14 is a first positioning knife 141, the bending knife 15 is a first bending knife 151, the bending driver is a first bending driver, and the first positioning knife 141 is fixed to the side of the first positioning mechanism 13; in the second bending device 12: Fig.13As shown, the positioning knife 14 is the second positioning knife 142 , the bending knife 15 is the second bending knife 152 , the bending driver is the second bending driver, and the second positioning knife 142 is fixed above the second positioning mechanism 51 .

[0057] for Figure 1 The L-shaped pin shown in the figure is bent and formed, and the two middle pins 22 are as follows: Figures 7 to 11 As shown, the position on the pin 22 that needs to be bent is aligned above the first side surface 1411 of the first positioning knife 141, as shown in FIG. Fig. 9 As shown, the first bending knife 151 is driven by the first bending driver to first press down the portion of the pin 22 that protrudes out of the first side surface 1411 of the first positioning knife 141, and then Fig.10 As shown, the first bending knife 151 moves closer to the first side surface 1411 of the first positioning knife 141 ( Fig.10 The pin 22 moves leftward in the middle of the first side surface 1411 so that the turning point of the pin 22 is in contact with the top of the first side surface 1411 and is accurately bent.

[0058] Afterwards, for the two pins 22 on both sides, specifically Fig.13 and Fig.14 As shown, the position on the pin 22 that needs to be bent is aligned below the second side surface 1421 of the second positioning knife 142, and the second bending knife 152, driven by the second bending driver, first presses the part of the pin 22 that protrudes out of the second side surface 1421 of the second positioning knife 142, and then the second bending knife 152 moves closer to the second side surface 1421 of the second positioning knife 142, so that the turning point of the pin 22 fits the top of the second side surface 1421 and is accurately bent.

[0059] For Figure 2 The V-shaped pins shown have two turns on each pin 22. Fig.16 In the system shown in , each first bending device 11 and each second bending device 12 are respectively used to form a turning point, wherein the pin 22 that needs to be pressed down passes through the two first bending devices 11 in sequence to realize two downward turning points in two steps, and the pin 22 that needs to be pressed up passes through the two second bending devices 12 in sequence to realize two upward turning points in two steps. Of course, in other embodiments, the two turning points of the pin 22 can be realized in one first bending device 11 or one second bending device 12. At this time, the top surface of the positioning knife 14 can be provided with a bending edge at the joint with the side surface and the middle part of the side surface, that is, two bending edges are formed, which are respectively used to locate the two turning points of the V-shaped pin. The first bending knife 151 and the second bending knife 152 can be evenly divided into two actions to make the pin 22 bend once at each of the two bending edges to form a V shape.

[0060] In this embodiment, by providing a positioning knife 14 in the bending device 1, the turning position of the pin 22 can be accurately defined, the bending accuracy can be improved, a higher yield can be achieved, and the maximum economic value can be obtained.

[0061] Furthermore, the electronic component pin bending system further comprises a feeding device 3 arranged in parallel with the bending device 1, such as Figure 2 As shown, it is applied to the loading process, and is used to provide the electronic component 2 whose pin 22 is to be bent. The loading device 3 includes a tray module 31 (i.e., a Tray module) and a loading robot 32. The tray module 31 has a plurality of material troughs 311 arranged in parallel to place the electronic components 2 respectively. The loading robot 32 is used to take out the electronic components 2 from the material troughs 311 and transfer them to a set device. Preferably, a visual recognition component is provided on the loading robot 32 to identify the electronic components 2. In addition, the loading robot 32 picks up the material through the loading nozzle on it. In other embodiments, the material can also be picked up by setting a fixture.

[0062] In this embodiment, the feeding method of the electronic components 2 is that the material tray module 31 feeds the bending device 1 or other devices, and different electronic components 2 can be placed in different material slots 311. The electronic components 2 are separated from each other by the material slots 311 in the material tray module 31, so as to avoid mutual squeezing and crossing between the pins 22 of the electronic components 2, and to avoid damage to the pins 22 before bending to the greatest extent. In addition, the loading robot 32 will first identify the chip position by vision, and accurately locate the specific structure on the electronic component 2, such as the plastic package of the chip, and then the electronic component 2 will be sucked up by the equipped loading robot 32, which can improve the accuracy and efficiency of loading.

[0063] Furthermore, if Figure 5 , Figure 6 and Fig.16 As shown, the electronic component pin bending system also includes a cutting device 5 arranged in parallel with the bending device 1, which is used to implement the pin cutting process. For the electronic component 2 whose pin 22 length needs to be adjusted, the pin 22 is cut to the length required by the customer, and the cutting device 5 is used to cut the pin 22. This process can be performed before the pin bending process, such as Fig.16 As shown, specifically, the cutting device 5 and each bending device 1 can be arranged linearly, and the cutting device 5 is arranged at one end. Of course, for the electronic component 2 that does not need to adjust the length of the pin 22, this process can also be omitted.

[0064] The cutting device 5 includes a second positioning mechanism 51, a cutting support table 52, a cutter driver and a cutter 53. As required, the loading robot 32 can place the electronic component 2 taken on the first positioning mechanism 13 of the bending device 1 or the second positioning mechanism 51 of the cutting device 5. The cutting support table 52 is fixed to the side of the second positioning mechanism 51. The second positioning mechanism 51 is used to position the body 21 of the electronic component 2, and in the positioned state, the pins 22 of the electronic component 2 can extend out of the side of the cutting support table 52. The cutter 53 is connected to the cutter driver so that under the drive of the cutter driver, the cutter 53 can cut off the part of the pin 22 extending out of the side of the cutting support table 52.

[0065] like Figure 5 As shown, after the main body 21 of the electronic component 2 is fixed by the second positioning mechanism 51, the portion of the pin 22 close to the main body 21 rests on the second positioning mechanism 51 and the cutting support table 52, and the remaining portion extends out from the third side 521 of the cutting support table 52. The position on the pin 22 that needs to be cut is aligned with the top of the third side 521 of the cutting support table 52. The cutter 53 can be driven by the cutter driver to cut off the portion of the pin 22 extending out of the third side 521 along the third side 521, thereby realizing automatic adjustment of the length of the pin 22.

[0066] In addition, a waste collection box 54 is also provided in the cutting device 5 , which is located below the cutter 53 and can directly receive the waste pins 22 cut by the cutter 53 .

[0067] Furthermore, the electronic component pin bending system also includes a product inspection device 4 arranged in parallel with the bending device 1, which is used in the inspection process to detect the qualification of the electronic component 2. This is performed after the pin bending process, and unusable electronic components 2 can be disposed of in time.

[0068] like Fig.15As shown, the product inspection device 4 includes a third positioning mechanism 42 and a test assembly. The third positioning mechanism 42 is used to position the main body 21 of the electronic component 2, and in the positioned state, the test assembly can detect whether the pin 22 meets the preset standard. The preset standard can be set according to the structure of the test assembly and the content to be measured: for example, the test assembly performs AOI (Auto Optical Inspection) test on the size of the electronic component 2 through visual inspection, and accordingly, the preset standard is the preset standard size range of the pin 22, so as to select the electronic component 2 whose size of the pin 22 is processed and formed to meet the customer's requirements, and finally enter the tape for shipment; or, the test assembly can be used for OS (Open-Short) + Leakage test, and the test assembly can specifically include an OS test probe 41 to detect the internal situation of the pin 22 and select the electronic component 2 whose internal structure is not damaged during the pin 22 molding process.

[0069] Furthermore, the first positioning mechanism 13 , the second positioning mechanism 51 , and the third positioning mechanism 42 may adopt the same clamping positioning mechanism 6 .

[0070] like Figure 5 , Fig.11 and Fig.13 As shown, the clamping and positioning mechanism 6 includes a positioning support platform 61, a positioning stop bar 62, a positioning block 63 and a positioning block driver 610. The positioning stop bar 62 is fixed above one side of the positioning support platform 61, and the positioning block 63 is slidably connected above the positioning support platform 61. The positioning block driver 610 can be a cylinder, and in other embodiments, it can also be a motor. The positioning block 63 can move toward the positioning stop bar 62 under the drive of the positioning block driver 610, so as to clamp and position the main body 21 of the electronic component 2 through the positioning stop bar 62 and the positioning block 63. Optionally, a guide rail 65 can be set on the positioning support platform 61, and the positioning block 63 is slidably connected to the guide rail 65 to linearly guide the positioning block 63.

[0071] In this embodiment, the clamping and positioning mechanism 6 can be adapted to the positioning of the main body 21 of various types of electronic components 2 by clamping and positioning. Figure 5 As shown, the chip is placed on the positioning support platform 61, and the positioning block 63 moves toward the chip. When the positioning block 63 moves into place, the positioning block 63 and the positioning stop bar 62 cooperate to clamp the plastic package of the chip, ensuring that the chip is reliably fixed.

[0072] Furthermore, if Figure 5 As shown, the clamping and positioning mechanism 6 also includes a positioning suction nozzle 64 disposed on the positioning support platform 61, specifically a vacuum suction nozzle, to suck the main body 21 of the electronic component 2 downward to ensure the stability of the placement of the electronic component 2.

[0073] Furthermore, if Figure 5 , Fig.11 and Fig.13 As shown, the first positioning groove 631 facing the positioning stop bar 62 is provided on the positioning block 63 to engage with the positioning stop bar 62 to position the main body 21 of the electronic component 2. Specifically, the first positioning groove 631 of the positioning block 63 is arranged close to the positioning stop bar 62 to conform to the main body 21 of the electronic component 2, which can ensure that each time the electronic component is installed, it is located at a fixed position on the positioning support platform 61. Optionally, the first positioning groove 631 is provided on the positioning block 63 in the first positioning mechanism 13 and the second positioning mechanism 51. Of course, in other embodiments or other clamping and positioning mechanisms 6, the second positioning groove facing the positioning block 63 can also be provided on the positioning stop bar 62 to engage with the positioning block 63 to position the main body 21 of the electronic component 2.

[0074] Furthermore, if Figure 4 As shown, the clamping and positioning mechanism 6 may further include a positioning clamping claw driver 69 and a positioning clamping claw 68 connected to the positioning clamping claw driver, which can clamp the main body 21 of the electronic component 2 in a direction perpendicular to the movement of the positioning block 63 to cooperate with the positioning block 63 and the positioning stop bar 62 to fully position the main body 21 of the electronic component 2, thereby further increasing the types of electronic components 2 that can be positioned. Specifically, Fig.15 As shown, the third positioning mechanism 42 is not provided with the first positioning groove 631 and the second positioning groove, but is provided with the above-mentioned positioning jaw driver 69 and positioning jaw 68 to comprehensively position the main body 21 of the electronic component 2 .

[0075] Further, the positioning blocks 63 in the first positioning mechanism 13, the second positioning mechanism 51 and the third positioning mechanism 42 can be driven by the same positioning block driver 610. Optionally, in order to ensure the stability of the movement of each positioning block 63, as Figure 4 As shown, each positioning support platform 61 can be provided with a sliding block, on which a sliding hole is provided to slidably connect the positioning rod 66 , and a buffer spring 67 is sleeved on the positioning rod 66 , and the buffer spring 67 is pressed between the positioning block 63 and the positioning rod 66 .

[0076] Of course, in other embodiments, the first positioning mechanism 13, the second positioning mechanism 51, and the third positioning mechanism 42 may also adopt other forms of positioning structures for positioning. For example, a positioning platform is directly set up, and a positioning groove matching the main body 21 of the electronic component 2 is set on it, and the main body 21 of the electronic component 2 is directly placed in the positioning groove to achieve positioning.

[0077] The electronic component pin bending system in this embodiment is applied to the pin bending of L-shaped pin chips (BV products). The working principle includes: the loading robot 32 sucks the chip from the material slot 311 of the material tray module 31, and transports it to the second positioning mechanism 51 of the cutting device 5 to accurately position the chip. The positioning method is that after the chip is placed in the corresponding position, the end of the plastic package body away from the pin 22 is pushed by the positioning block 63 to limit the chip to a set position. After the product is positioned, the part of the pin 22 that exceeds the set size is cut off by the up and down movement of the cutter 53, so that the pin 22 of the chip is cut into the length required by the customer. After that, the electronic component 2 is placed on the first positioning mechanism 13 of the first bending device 11, and the two middle pins 22 are bent first. Specifically, the pin is formed by the two-step movement of the second bending knife 152: the first step is the downward movement, and the second step is the left and right movement. The two pins 22 can be bent separately or at the same time. Afterwards, the electronic component 2 is placed on the first positioning mechanism 13 of the second bending device 12 to bend the two pins 22 on both sides. The principle is the same as that of the two middle pins, except that the pressing action is changed to the pushing action of the second bending knife 152.

[0078] The electronic component pin bending system in this embodiment has the following advantages: the tray feeding mode can reduce the yield loss by more than 10%; it has a unique bending process. When bending the pins, different pins 22 are bent by separate process angle bending modes, which can improve the stability of the equipment and can independently debug and control the size of each pin 22.

[0079] It should be noted that when an element is referred to as "fixed" to another element, it may be directly on the other element or there may be an element in the middle. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an element in the middle at the same time. In addition, in the description of the present invention, unless otherwise specified, "multiple", "multiple roots", "multiple groups" mean two or more.

[0080] The terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0081] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0083] The electronic component pin bending system provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. An electronic component pin bending system, characterized in that: The invention comprises a bending device (1); the bending device (1) comprises a first positioning mechanism (13) and a bending drive mechanism, the first positioning mechanism (13) being used to position a main body (21) of an electronic component (2), and in a positioned state, a pin (22) of the electronic component (2) can extend out of a side surface of the first positioning mechanism (13), and the bending drive mechanism can press down or press up to bend the pin (22) of the electronic component (2) in the positioned state.

2. The electronic component pin bending system according to claim 1, characterized in that: The two bending devices (1) are respectively a first bending device (11) and a second bending device (12) arranged in parallel; the bending drive mechanism in the first bending device (11) is used to press down the pins (22) of the electronic component (2) in a bent and positioned state, and the bending drive mechanism in the second bending device (12) is used to press up the pins (22) of the electronic component (2) in a bent and positioned state.

3. The electronic component pin bending system according to claim 1, characterized in that: The bending drive mechanism comprises a positioning knife (14), a bending drive, and a bending knife (15) connected to the bending drive; the positioning knife (14) is arranged above the first positioning mechanism (13) or arranged in parallel on the side of the first positioning mechanism (13); the bending drive can drive the bending knife (15) to move toward the side of the positioning knife (14) to press the pin (22) of the electronic component (2).

4. The electronic component pin bending system according to claim 1, characterized in that: It also includes a loading device (3) arranged in parallel with the bending device (1); the loading device (3) includes a tray module (31) and a loading robot (32); the tray module (31) has a plurality of troughs (311) arranged in parallel to place the electronic components (2) respectively; the loading robot (32) is used to take out the electronic components (2) from the troughs (311) and transfer them to a set device.

5. The electronic component pin bending system according to claim 4, characterized in that: The loading robot (32) is provided with a visual recognition component to recognize the electronic component (2).

6. The electronic component pin bending system according to any one of claims 1 to 5, characterized in that: The invention also comprises a cutting device (5) arranged in parallel with the bending device (1); the cutting device (5) comprises a second positioning mechanism (51), a cutting support platform (52), a cutter driver and a cutter (53); the cutting support platform (52) is fixed to the side of the second positioning mechanism (51), the second positioning mechanism (51) is used to position the main body (21) of the electronic component (2), and in the positioned state, the pin (22) of the electronic component (2) can extend out of the side of the cutting support platform (52); the cutter (53) is connected to the cutter driver, so that under the drive of the cutter driver, the cutter (53) can cut off the part of the pin (22) extending out of the side of the cutting support platform (52).

7. The electronic component pin bending system according to claim 6, characterized in that: It also includes a product detection device (4) arranged in parallel with the bending device (1), the product detection device (4) including a third positioning mechanism (42) and a test component, the third positioning mechanism (42) is used to position the main body (21) of the electronic component (2), and in the positioned state, the test component can detect whether the pin (22) meets a preset standard.

8. The electronic component pin bending system according to claim 7, characterized in that: At least one of the first positioning mechanism (13), the second positioning mechanism (51), and the third positioning mechanism (42) is a clamping positioning mechanism (6); The clamping and positioning mechanism (6) comprises a positioning support platform (61), a positioning baffle (62), a positioning block (63) and a positioning block driver (610); the positioning baffle (62) is fixed above one side of the positioning support platform (61); the positioning block (63) is slidably connected above the positioning support platform (61); and the positioning block (63) can move toward the positioning baffle (62) under the drive of the positioning block driver (610) so as to clamp and position the main body (21) of the electronic component (2) through the cooperation of the positioning baffle (62) and the positioning block (63).

9. The electronic component pin bending system according to claim 8, characterized in that: The clamping and positioning mechanism (6) also includes a positioning suction nozzle (64) disposed on the positioning support platform (61) for sucking the main body (21) of the electronic component (2) downward.

10. The electronic component pin bending system according to claim 8, characterized in that: The positioning block (63) is provided with a first positioning groove (631) facing the positioning stop bar (62) so as to be engaged with the positioning stop bar (62) to position the main body (21) of the electronic component (2); And / or, a second positioning groove facing the positioning block (63) is provided on the positioning blocking strip (62) to engage with the positioning block (63) to position the main body (21) of the electronic component (2).

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