A progressive semiconductor chip production device and working method thereof

Abstract

The present invention relates to the field of chip processing technology, and in particular to a progressive semiconductor chip production device and a working method thereof. It comprises a production platform, on which a limiting feeding mechanism is provided; and on which a laser processing mechanism is provided. The present invention controls a plurality of groups of limiting rods to drive a plurality of groups of limiting rings to fix the silicon crystal rods. The laser ranging module arranged in the annular array at the bottom of the supporting disk detects the horizontal state of the silicon crystal rods in real time and makes real-time adjustments. It controls a plurality of groups of limiting rings to descend synchronously to drive the silicon crystal rods to move vertically downward. At the same time, it cooperates with the laser processing mechanism to perform the ring-type laser cutting on the bottom of the silicon crystal rod. After repeated alternation for several times, the progressive slicing of the silicon crystal rods is completed. This not only improves the efficiency of the existing round wafer slicing work, but also realizes the real-time deviation correction of the silicon crystal rods, avoids the influence of the finished product yield when the offset occurs, and improves the working quality of the production equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular relates to a progressive semiconductor chip production device and a working method thereof. Background Art

[0002] In electronics, chips are a way to miniaturize circuits. The process flow is roughly wafer manufacturing, wafer processing, circuit production, testing and packaging. In the manufacturing process of round wafers, the ground and polished silicon crystal rods need to be sliced ​​to form silicon crystal raw sheets, which are round wafers.

[0003] After searching, in the prior art, China Patent Publication No.: CN113042885A, Publication Date: 2021.06.29, discloses an effective round wafer laser slicing device, including a base, a support rod, a driving mechanism, a slicing mechanism, a clamping mechanism and a pushing mechanism. The effective round wafer laser slicing device clamps the workpiece through the clamping mechanism, operates the driving mechanism, and the driving mechanism drives the slicing mechanism and the pushing mechanism to operate intermittently, thereby pushing and slicing the workpiece. Compared with the existing clamping mechanism, the clamping mechanism adopts a flexible clamping for the workpiece, avoiding rigid clamping and scratching the workpiece, and protecting the workpiece. Compared with the existing slicing device, the device realizes the pushing of the workpiece and the movement of the laser cutter through an output end, saving energy. At the same time, the slicing mechanism and the pushing mechanism adopt linkage to realize online pushing and slicing of the workpiece, thereby improving efficiency. Moreover, the linkage adopts a purely mechanical structure, avoiding the use of electronic components such as sensors, and improving the stability and service life of the device.

[0004] But the device still has the following defects:

[0005] When the device is slicing round wafers, it is unable to monitor the offset of the silicon crystal rod in real time and make real-time adjustments. As a result, once the silicon crystal rod is offset during slicing, errors will occur in the subsequently cut wafers, thereby reducing the working quality of the device. Summary of the invention

[0006] In view of the above problems, the present invention provides a progressive semiconductor chip production device, comprising a production platform, a rotating seat is provided at the top edge of one side of the production platform; the top of the rotating seat is connected to a mechanical arm through transmission; the output end of the mechanical arm is connected to a limited position feeding mechanism through transmission; a laser processing mechanism is provided on the production platform; a material storage mechanism is movably penetrated on the top of the production platform;

[0007] The position-limiting feeding mechanism comprises a supporting disc; the bottom of the supporting disc is provided with a plurality of groups of first chutes distributed in a circular array; each group of the first chutes is provided with a group of position-limiting rods;

[0008] A group of limiting rings are movably sleeved on the outer wall of each group of limiting rods; a plurality of groups of laser ranging modules are distributed in a circular array at the bottom center of the supporting disc;

[0009] The limited loading mechanism is controlled to drive the silicon crystal rod to descend vertically for progressive laser slicing. During the process, real-time monitoring is performed to ensure that the silicon crystal rod remains horizontal.

[0010] Furthermore, a plurality of groups of first electric push rods are distributed in a circular array in the production platform; a group of universal balls are transmission-connected to the output end of each group of the first electric push rods; one end of each group of universal balls away from the first electric push rods is hinged to the bottom of the laser processing mechanism; a lifting cavity is opened in the production platform; and the top-view cross-section of the lifting cavity is a circular ring.

[0011] Furthermore, a protective cover is movably penetrated through the top of the lifting chamber; the top cross-section of the protective cover is circular; a power chamber is arranged in the production platform; a second electric push rod is arranged on the top inner wall of the power chamber; an air intake block and an air outlet block are arranged on the top of the production platform; the air intake block and the air outlet block are movably fitted on the outer wall of the protective cover and are movably connected with the protective cover; the air intake block and the air outlet block are located at different heights.

[0012] Furthermore, a plurality of groups of limiting grooves are provided in a circular array on the outer wall of each group of the limiting rings; a first sealing ring is provided at the bottom of the supporting disc; a second motor is provided on the top inner wall of each group of the limiting rods; a second screw rod is transmission-connected to the output end of each group of the second motors; and one end of each group of the second screw rods away from the corresponding group of the second motors is rotatably connected to the bottom inner wall of the limiting rod.

[0013] Furthermore, a group of second sliding grooves are opened on the inner wall of each group of the limiting rods; a group of second sliding blocks are slidably connected in each group of the second sliding grooves; each group of the second sliding blocks are threadedly connected to a corresponding group of second screw rods; and each group of the second sliding blocks are transmission connected to a corresponding group of limiting rings.

[0014] Furthermore, the laser processing mechanism includes an annular electric guide rail; a laser cutting assembly and an optical attenuator are symmetrically connected to the inner wall of the annular electric guide rail; a swing arm is connected to the inner wall of the annular electric guide rail; and a gasket placer is connected to the output end of the swing arm.

[0015] Furthermore, the laser cutting assembly includes a clamp; a level sensor is provided on the top of the clamp; and a laser cutter is provided at the center of a side wall of the clamp away from the annular electric guide rail.

[0016] Furthermore, two groups of support plates are symmetrically connected to the output end of the clamp; two groups of gas springs are symmetrically provided on the opposite side walls of the two groups of support plates; two groups of protective shells are symmetrically connected to the opposite ends of the two groups of gas springs; and a group of second sealing rings is provided on the inner wall of each group of protective shells.

[0017] Furthermore, the material storage mechanism includes a material storage tube; a lifting plate is slidably connected to the material storage tube in a vertical direction; a movable through groove is opened at the center of the bottom inner wall of the material storage tube; the output end of the second electric push rod movably passes through the movable through groove and abuts against the bottom of the lifting plate.

[0018] A working method of a progressive semiconductor chip production device, the working method comprising:

[0019] The control limit feeding mechanism fixes the silicon crystal rod and transfers it to the laser processing mechanism.

[0020] Control the laser processing mechanism to perform horizontal laser cutting on silicon crystal rods;

[0021] The cut wafers are stacked in the storage mechanism.

[0022] The control limit feeding mechanism drives the silicon ingot to descend vertically.

[0023] Repeat steps 2-4 several times.

[0024] Complete the progressive laser slicing of silicon crystal rods.

[0025] The beneficial effects of the present invention are:

[0026] 1. By controlling several groups of limit rods to drive several groups of limit rings to fix the silicon crystal rod, the laser ranging module set in the circular array at the bottom of the supporting disk detects the horizontal state of the silicon crystal rod in real time and makes real-time adjustments, controls several groups of limit rings to descend synchronously to drive the silicon crystal rod to move vertically downward, and cooperates with the laser processing mechanism to perform ring-type laser cutting on the bottom of the silicon crystal rod. After repeated several times, the progressive slicing of the silicon crystal rod is completed, which not only improves the efficiency of the existing round wafer slicing work, but also realizes the real-time deviation correction of the silicon crystal rod, avoids the impact on the finished product yield when the offset occurs, and improves the working quality of the production equipment.

[0027] 2. The two sets of support plates are driven to move toward the opposite side by controlling the clamp, so that the two sets of protective shells are pressed against each other under the elastic action of the two sets of gas springs to wrap the laser cutter. At the same time, the two sets of protective shells will bring in nitrogen at the same time. The two sets of second sealing rings can prevent nitrogen leakage, so that when the production equipment is idle, the laser cutter can be protected by the two sets of protective shells to avoid external damage, and stored in inert gas, which can prevent equipment aging, improve the protection performance of the production equipment and increase the service life.

[0028] 3. By controlling the protective cover to rise and contact the bottom of the limit feeding mechanism, the slicing area is in a sealed state, and then nitrogen is filled into the protective cover through the air inlet block. After the air is discharged through the air outlet block, the air inlet block and the air outlet block are connected through the corresponding fan equipment, so that the nitrogen in the slicing area is in a swirling flow state of nitrogen. The swirling flow nitrogen will quickly take away the heat generated by the laser processing mechanism during operation, and it is convenient to recycle the nitrogen after the slicing is completed, which extends the continuous working time of the production equipment while reducing the economic cost.

[0029] 4. During the progressive slicing process, the wafer will fall on the top of the lifting plate of the storage mechanism, and then the swing arm will be controlled to drive the gasket placer to move to the top of the storage mechanism, and a flexible gasket will be placed on the top of the wafer. Then the output end of the second electric push rod will drop, and the lifting plate will drive the wafer and the flexible gasket down into the storage tube. The operation will be repeated several times so that several groups of wafers are stacked and stored in the storage tube. Finally, the storage tube will be taken out and the wafer will be processed for the next step. While realizing progressive slicing, it avoids the collision of wafers and improves the use effect of production equipment.

[0030] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It shows a schematic structural diagram of a production device according to an embodiment of the present invention;

[0033] Figure 2 A schematic cross-sectional view of a production device according to an embodiment of the present invention is shown;

[0034] Figure 3 It shows a schematic structural diagram of a production device according to an embodiment of the present invention when it is working;

[0035] Figure 4 A schematic diagram of the structure of the position-limiting feeding mechanism according to an embodiment of the present invention is shown as a bottom view;

[0036] Figure 5A schematic top view of a cross-sectional view of a position-limiting feeding mechanism according to an embodiment of the present invention is shown;

[0037] Figure 6 A cross-sectional schematic diagram of a limiting rod according to an embodiment of the present invention is shown;

[0038] Figure 7 A schematic structural diagram of a laser processing mechanism according to an embodiment of the present invention is shown;

[0039] Figure 8 A schematic structural diagram of a laser cutting assembly according to an embodiment of the present invention is shown;

[0040] Fig. 9 A schematic cross-sectional view of a material storage box according to an embodiment of the present invention is shown.

[0041] In the figure: 1, production platform; 2, rotating seat; 3, mechanical arm; 4, limited feeding mechanism; 5, laser processing mechanism; 6, first electric push rod; 7, universal ball; 8, lifting chamber; 9, protective cover; 10, electric slide; 11, storage mechanism; 12, power chamber; 13, second electric push rod; 14, air inlet block; 15, air outlet block; 401, support disc; 402, first slide slot; 403, limit rod; 404, limit ring; 405, laser ranging module; 406, first sealing ring; 407, first adjustment chamber; 408, support column; 409, first motor; 41 0. first screw rod; 411. first slider; 412. second slide groove; 413. second motor; 414. second screw rod; 415. second slider; 501. annular electric guide rail; 502. laser cutting assembly; 503. optical attenuator; 504. swing arm; 505. gasket placer; 5021. clamp; 5022. level sensor; 5023. laser cutter; 5024. support plate; 5025. gas spring; 5026. protective shell; 5027. second sealing ring; 1101. storage tube; 1102. lifting plate; 1103. movable through groove. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] The embodiment of the present invention provides a progressive semiconductor chip production device, including a production platform 1. For example, Figure 1 , Figure 2 and Figure 3As shown, a rotating seat 2 is provided at one side edge of the top of the production platform 1; a mechanical arm 3 is transmission-connected to the top of the rotating seat 2; a limited position feeding mechanism 4 is transmission-connected to the output end of the mechanical arm 3; a laser processing mechanism 5 is provided on the production platform 1; a plurality of groups of first electric push rods 6 are distributed in a circular array in the production platform 1; a group of universal balls 7 are transmission-connected to the output end of each group of the first electric push rods 6; and one end of each group of the universal balls 7 away from the first electric push rods 6 is hinged to the bottom of the laser processing mechanism 5;

[0044] Specifically, a lifting chamber 8 is provided in the production platform 1; the top view cross section of the lifting chamber 8 is circular; a protective cover 9 is movably penetrated through the top of the lifting chamber 8; the top view cross section of the protective cover 9 is circular and is made of transparent glass; a plurality of groups of electric slides 10 are distributed in a circular array on the inner wall of the lifting chamber 8 away from the laser processing mechanism 5; the output ends of the plurality of groups of electric slides 10 are transmission-connected to the protective cover 9;

[0045] Specifically, a material storage mechanism 11 is movably penetrated through the top of the production platform 1; a power chamber 12 is provided in the production platform 1; a second electric push rod 13 is provided on the top inner wall of the power chamber 12; the output end of the second electric push rod 13 is transmission-connected with the material storage mechanism 11; an air intake block 14 and an air outlet block 15 are provided on the top of the production platform 1; the air intake block 14 and the air outlet block 15 are movably fitted on the outer wall of the protective cover 9, and are movably connected with the protective cover 9; the air intake block 14 and the air outlet block 15 are located at different heights.

[0046] When wafer slicing is being performed, the cooperation between the rotating seat 2 and the mechanical arm 3 drives the position limiting feeding mechanism 4 to clamp the silicon crystal rod and transfer it to the laser processing mechanism 5, and then controls several groups of electric slides 10 to drive the protective cover 9 to rise and contact the bottom of the position limiting feeding mechanism 4, so that the slicing area is in a sealed state, and then nitrogen is filled into the protective cover 9 through the air intake block 14, and then the air is discharged through the air outlet block 15, and the air intake block 14 is connected with the air outlet block 15 through the corresponding fan equipment.

[0047] The nitrogen in the slicing area is in a swirling flow state of nitrogen, and then the laser processing mechanism 5 is controlled to start laser cutting from the bottom of the silicon crystal rod. At the same time, the limit feeding mechanism 4 is controlled to drive the silicon crystal rod to descend, and progressive slicing is performed. The cut round wafers are placed in the storage mechanism 11 in sequence, which improves the working efficiency of the production equipment. At the same time, the flowing nitrogen will quickly take away the heat generated by the laser processing mechanism 5 when it is working, and it is convenient to recycle the nitrogen after the slicing is completed, which extends the continuous working time of the production equipment and reduces the economic cost.

[0048] For example, Figure 4 , Figure 5and Figure 6 As shown, the limiting feeding mechanism 4 includes a supporting disc 401; a plurality of first slide grooves 402 are arranged in a circular array at the bottom of the supporting disc 401; a group of limiting rods 403 are arranged in each group of the first slide grooves 402; a group of limiting rings 404 are movably sleeved on the outer wall of each group of the limiting rods 403; a plurality of limiting grooves are arranged in a circular array on the outer wall of each group of the limiting rings 404, and the materials are rubber; a plurality of laser ranging modules 405 are arranged in a circular array at the center of the bottom of the supporting disc 401; a first sealing ring 406 is arranged at the bottom of the supporting disc 401; the bottom of the first sealing ring 406 movably contacts the top of the protective cover 9;

[0049] Specifically, a first adjustment cavity 407 is provided in the support disc 401; a support column 408 is provided at the center of the bottom inner wall of the first adjustment cavity 407; a plurality of groups of first motors 409 are distributed in a circular array on the inner wall of the first adjustment cavity 407; a group of first screw rods 410 are transmission-connected to the output end of each group of the first motors 409; one end of each group of the first screw rods 410 away from the corresponding group of the first motors 409 is rotationally connected to the outer wall of the support column 408; a plurality of groups of first sliders 411 are slidably connected to the bottom inner wall of the first adjustment cavity 407; each group of the first sliders 411 is threadedly connected to the corresponding group of the first screw rods 410;

[0050] Specifically, each group of the first sliders 411 is transmission connected with a corresponding group of limiting rods 403; a second motor 413 is provided on the top inner wall of each group of the limiting rods 403; a second screw rod 414 is transmission connected to the output end of each group of the second motor 413; one end of each group of the second screw rod 414 away from the corresponding group of the second motor 413 is rotationally connected to the bottom inner wall of the limiting rod 403; a group of second sliding grooves 412 are opened on the inner wall of each group of the limiting rods 403; a group of second sliders 415 are slidably connected in each group of the second sliding grooves 412; each group of the second sliders 415 is threadedly connected with a corresponding group of the second screw rods 414; each group of the second sliders 415 is transmission connected with a corresponding group of limiting rings 404.

[0051] By controlling a plurality of groups of first motors 409 to drive the first screw rod 410 to rotate, under the threaded connection relationship between the first screw rod 410 and the first slider 411, the plurality of groups of first sliders 411 drive the plurality of groups of limit rods 403 to move toward the direction of the central axis of the supporting disk 401, so that the two side edges of the corresponding limit grooves on the outer walls of the plurality of groups of limit rings 404 abut against the outer wall of the silicon crystal rod to fix the silicon crystal rod, and the laser ranging module 405 arranged in a circular array at the bottom of the supporting disk 401 can detect the horizontal state of the silicon crystal rod in real time, and can keep the silicon crystal rod in a horizontal state during the slicing process by controlling the lifting and lowering of the corresponding limit ring 404, and at the same time control the synchronous descent of the plurality of groups of limit rings 404, so that the silicon crystal rod can be sliced ​​progressively in the vertical direction, avoiding the need for mobile cutting by the laser cutting mechanism, thereby improving the working quality of the production equipment and the working efficiency of the production equipment.

[0052] For example, Figure 7 As shown, the laser processing mechanism 5 includes an annular electric guide rail 501; a plurality of groups of universal balls 7 are hinged at the bottom of the annular electric guide rail 501; a laser cutting assembly 502 and an optical attenuator 503 are symmetrically connected to the inner wall of the annular electric guide rail 501; a swing arm 504 is connected to the inner wall of the annular electric guide rail 501; and a gasket placer 505 is connected to the output end of the swing arm 504.

[0053] For example, Figure 8 As shown, the laser cutting assembly 502 includes a clamp 5021; a horizontal sensor 5022 is provided on the top of the clamp 5021; a laser cutter 5023 is provided at the center of a side wall of the clamp 5021 away from the annular electric guide rail 501; two groups of support plates 5024 are symmetrically connected to the output end of the clamp 5021; two groups of gas springs 5025 are symmetrically provided on the opposite side walls of the two groups of support plates 5024; two groups of protective shells 5026 are symmetrically connected to the opposite ends of the two groups of gas springs 5025; a group of second sealing rings 5027 is provided on the inner wall of each group of protective shells 5026.

[0054] For example, Fig. 9 As shown, the material storage mechanism 11 includes a material storage tube 1101; a lifting plate 1102 is slidably connected to the material storage tube 1101 in a vertical direction; a movable through groove 1103 is opened at the center of the bottom inner wall of the material storage tube 1101; the output end of the second electric push rod 13 movably passes through the movable through groove 1103 and abuts against the bottom of the lifting plate 1102.

[0055] When the wafer is slicing, the silicon crystal rod reaches the top of the storage mechanism 11, and the horizontal sensor 5022 can detect the horizontal state of the laser cutter 5023 in real time, and adjust the horizontal state of the laser cutter 5023 by controlling the extension and retraction of several groups of first electric push rods 6. When the laser cutter 5023 and the silicon crystal rod reach the horizontal state at the same time, the flatness of the wafer can be guaranteed during cutting.

[0056] After the preparation work is completed, the laser cutter 5023 emits laser rays to penetrate through the silicon crystal rod, and the extension of the laser is blocked by the optical attenuator 503, and then the annular electric guide rail 501 is controlled to rotate 180° to complete the cutting of the wafer, and the wafer falls on the top of the lifting plate 1102 of the storage mechanism 11, and then the swing arm 504 is controlled to drive the gasket placer 505 to move to the top of the storage mechanism 11, and a flexible gasket is placed on the top of the wafer. Then the output end of the second electric push rod 13 descends, and the lifting plate 1102 drives the wafer and the flexible gasket to descend into the storage tube 1101. The operation is repeated several times, so that several groups of wafers are stacked and stored in the storage tube 1101. Finally, the storage tube 1101 is taken out, and the next step of processing is carried out on the wafer. While realizing progressive slicing, it avoids the collision of wafers with each other, thereby improving the use effect of the production equipment.

[0057] When the production equipment completes the slicing work, the clamp 5021 is first controlled to drive the two groups of support plates 5024 to move toward the opposite side, so that the two groups of protective shells 5026 are pressed together under the elastic action of the two groups of gas springs 5025 to wrap the laser cutter 5023. At the same time, the two groups of protective shells 5026 will bring in nitrogen at the same time, and the two groups of second sealing rings 5027 can prevent nitrogen leakage, so that when the production equipment is idle, the laser cutter 5023 can be protected by the two groups of protective shells 5026 to avoid damage from external forces, and stored in inert gas to avoid equipment aging, thereby improving the protection performance of the production equipment and increasing its service life.

[0058] By controlling several groups of limit rods 403 to drive several groups of limit rings 404 to fix the silicon crystal rod, the laser ranging module 405 set in the circular array at the bottom of the supporting disk 401 detects the horizontal state of the silicon crystal rod in real time and makes real-time adjustments, controls several groups of limit rings 404 to descend synchronously to drive the silicon crystal rod to move vertically downward, and cooperates with the laser processing mechanism 5 to perform ring-type laser cutting on the bottom of the silicon crystal rod. After repeated several times, the progressive slicing of the silicon crystal rod is completed, which not only improves the efficiency of the existing round wafer slicing work, but also realizes the real-time correction of the silicon crystal rod, avoids the impact on the finished product yield when the offset occurs, and improves the working quality of the production equipment.

[0059] By controlling the clamp 5021 to drive the two groups of support plates 5024 to move toward the opposite side, the two groups of protective shells 5026 are pressed together under the elastic action of the two groups of gas springs 5025 to wrap the laser cutter 5023. At the same time, the two groups of protective shells 5026 will bring in nitrogen at the same time. The two groups of second sealing rings 5027 can prevent nitrogen leakage, so that when the production equipment is idle, the laser cutter 5023 can be protected by the two groups of protective shells 5026 to avoid external damage, and stored in inert gas to prevent equipment aging, thereby improving the protection performance of the production equipment and increasing the service life.

[0060] By controlling the protective cover 9 to rise and contact the bottom of the limiting feeding mechanism 4, the slicing area is in a sealed state, and then nitrogen is filled into the protective cover 9 through the air inlet block 14. After the air is discharged through the air outlet block 15, the air inlet block 14 and the air outlet block 15 are connected through the corresponding fan equipment, so that the nitrogen in the slicing area is in a swirling flow state of nitrogen. The swirling flow nitrogen will quickly take away the heat generated by the laser processing mechanism 5 when it is working, and it is convenient to recycle the nitrogen after the slicing is completed, thereby extending the continuous working time of the production equipment and reducing the economic cost.

[0061] During the progressive slicing process, the wafer will fall on the top of the lifting plate 1102 of the storage mechanism 11, and then the swing arm 504 will be controlled to drive the gasket placer 505 to move to the top of the storage mechanism 11, and a flexible gasket will be placed on the top of the wafer. Then the output end of the second electric push rod 13 will descend, and the lifting plate 1102 will drive the wafer and the flexible gasket to descend into the storage tube 1101. The operation is repeated several times, so that several groups of wafers are stacked and stored in the storage tube 1101. Finally, the storage tube 1101 is taken out and the wafer is processed for the next step. While realizing progressive slicing, it avoids the collision of wafers with each other, thereby improving the use effect of the production equipment.

[0062] Based on the above-mentioned progressive semiconductor chip production equipment, an embodiment of the present invention further proposes a working method for the progressive semiconductor chip production equipment. Exemplarily, the working method includes:

[0063] The control limit feeding mechanism fixes the silicon crystal rod and transfers it to the laser processing mechanism.

[0064] Control the laser processing mechanism to perform horizontal laser cutting on silicon crystal rods;

[0065] The cut wafers are stacked in the storage mechanism.

[0066] The control limit feeding mechanism drives the silicon ingot to descend vertically.

[0067] Repeat steps 2-4 several times.

[0068] Complete the progressive laser slicing of silicon crystal rods.

[0069] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A progressive semiconductor chip production device, comprising a production platform (1), characterized in that: A rotating seat (2) is provided at one side edge of the top of the production platform (1); the top of the rotating seat (2) is transmission-connected to a mechanical arm (3); the output end of the mechanical arm (3) is transmission-connected to a limited position feeding mechanism (4); a laser processing mechanism (5) is provided on the production platform (1); a material storage mechanism (11) is movably penetrated through the top of the production platform (1); A lifting chamber (8) is provided in the production platform (1); the cross section of the lifting chamber (8) is in the shape of a circular ring when viewed from above; a protective cover (9) is movably passed through the top of the lifting chamber (8); the cross section of the protective cover (9) is in the shape of a circular ring when viewed from above; an air inlet block (14) and an air outlet block (15) are provided on the top of the production platform (1); the air inlet block (14) and the air outlet block (15) are both movably attached to the outer wall of the protective cover (9) and are movably connected to the protective cover (9); the air inlet block (14) and the air outlet block (15) are located at different heights; The laser processing mechanism (5) comprises an annular electric guide rail (501); a laser cutting assembly (502) and an optical attenuator (503) are symmetrically connected to the inner wall of the annular electric guide rail (501); the laser cutting assembly (502) comprises a clamp (5021); a laser cutter (5023) is provided at the center of a side wall of the clamp (5021) away from the annular electric guide rail (501); two groups of support plates (5024) are symmetrically connected to the output end of the clamp (5021); two groups of gas springs (5025) are symmetrically provided on opposite side walls of the two groups of support plates (5024); and two groups of protective shells (5026) are symmetrically connected to opposite ends of the two groups of gas springs (5025); The position-limiting feeding mechanism (4) comprises a supporting disc (401); a plurality of groups of first slide grooves (402) are arranged in a circular array at the bottom of the supporting disc (401); and a group of position-limiting rods (403) are arranged in each group of the first slide grooves (402); A group of limiting rings (404) are movably sleeved on the outer wall of each group of limiting rods (403); a plurality of groups of laser distance measuring modules (405) are arranged in a circular array at the bottom center of the supporting disc (401); The limited loading mechanism (4) is controlled to drive the silicon crystal rod to descend vertically for progressive laser slicing, and real-time monitoring is performed during the process to ensure that the silicon crystal rod remains in a horizontal state.

2. The progressive semiconductor chip production equipment according to claim 1, characterized in that: A plurality of groups of first electric push rods (6) are arranged in a circular array in the production platform (1); the output end of each group of the first electric push rods (6) is transmission-connected to a group of universal balls (7); and one end of each group of the universal balls (7) away from the first electric push rods (6) is hinged to the bottom of the laser processing mechanism (5).

3. The progressive semiconductor chip production equipment according to claim 2, characterized in that: A power chamber (12) is provided in the production platform (1); a second electric push rod (13) is provided on the top inner wall of the power chamber (12).

4. The progressive semiconductor chip production equipment according to claim 1, characterized in that: The outer wall of each group of the limiting rings (404) is provided with a plurality of limiting grooves in a circular array; the bottom of the supporting disc (401) is provided with a first sealing ring (406); the top inner wall of each group of the limiting rods (403) is provided with a second motor (413); the output end of each group of the second motors (413) is transmission-connected with a second screw rod (414); and one end of each group of the second screw rods (414) away from the corresponding group of the second motors (413) is rotationally connected to the bottom inner wall of the limiting rod (403).

5. The progressive semiconductor chip production equipment according to claim 4, characterized in that: A group of second sliding grooves (412) are provided on the inner wall of each group of the limiting rods (403); a group of second sliding blocks (415) are slidably connected in each group of the second sliding grooves (412); each group of the second sliding blocks (415) are threadedly connected to a corresponding group of second screw rods (414); and each group of the second sliding blocks (415) are transmission-connected to a corresponding group of limiting rings (404).

6. The progressive semiconductor chip production equipment according to claim 1, characterized in that: A swing arm (504) is transmission-connected to the inner wall of the annular electric guide rail (501); and a gasket placement device (505) is transmission-connected to the output end of the swing arm (504).

7. The progressive semiconductor chip production equipment according to claim 1, characterized in that: A level sensor (5022) is provided on the top of the clamp (5021).

8. The progressive semiconductor chip production equipment according to claim 1, characterized in that: A group of second sealing rings (5027) is provided on the inner wall of each group of the protective shells (5026).

9. The progressive semiconductor chip production equipment according to claim 3, characterized in that: The material storage mechanism (11) comprises a material storage tube (1101); a lifting plate (1102) is slidably connected in a vertical direction inside the material storage tube (1101); a movable through slot (1103) is provided at the center of the inner wall at the bottom of the material storage tube (1101); the output end of the second electric push rod (13) movably passes through the movable through slot (1103) and contacts the bottom of the lifting plate (1102).

10. A working method of the progressive semiconductor chip production equipment according to any one of claims 1 to 9, characterized in that: The working method comprises: Step 1: Control the limited feeding mechanism to fix the silicon crystal rod and transfer it to the laser processing mechanism. Step 2, controlling the laser processing mechanism to perform horizontal laser cutting on the silicon crystal rod; Step 3: The cut wafers are stacked in the storage mechanism. Step 4: Control the limited feeding mechanism to drive the silicon ingot to descend vertically. Repeat steps 2-4 several times. Complete the progressive laser slicing of silicon crystal rods.

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