Heating device and chemical vapor deposition equipment
By designing a heating device that includes heating, insulation and cooling components, the problems of high heating energy consumption and difficulty in temperature field control of existing high-temperature chemical vapor deposition equipment are solved, achieving more efficient heating and lower energy consumption, and at the same time Protects other components of the device.
Patent Information
- Application Number
- CN202411565751.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-01-21
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The heating devices of existing high-temperature chemical vapor deposition equipment have problems such as high heating energy consumption and difficulty in controlling the temperature field, and other components of the equipment are easily damaged under high temperature conditions.
A heating device including a heating component, an insulation component and a cooling component is designed. The heating component is electrically heated by introducing electrode rods through vacuum, the insulation component uses heat insulation and a uniform temperature plate for insulation, and the cooling component is cooled through a cooling mandrel and a water-cooling box.
By accurately controlling the temperature of the heater, heating energy consumption is reduced, and other components of the equipment are protected through the cooling component, reducing cost consumption and improving coating quality.
Smart Images
Figure CN119332231A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of vacuum coating, and in particular to a heating device and chemical vapor deposition equipment. Background Art
[0002] Chemical vapor deposition is a technology that, under certain temperature conditions, interacts between mixed gases or between mixed gases and the surface of a substrate to form a thin film coating of metal or compound on the surface of the substrate, thereby modifying the surface of the material to meet special performance requirements such as wear resistance, oxidation resistance, corrosion resistance, and specific electrical, optical, and tribological properties.
[0003] The high-temperature chemical vapor deposition (HTCVD) coating system is specially used for growing silicon carbide (SiC) epitaxial layers. It uses a unique thermal catalytic coating technology to achieve efficient deposition of SiC epitaxial films at temperatures up to 1650°C. SiC epitaxial layers are commonly used in applications such as semiconductor devices, power electronic devices, and sensors. The supported coating substrates include 4-inch, 6-inch, and 8-inch wafers.
[0004] In the prior art, the core device of high-temperature chemical vapor deposition equipment is a heating device. The heating methods used in the existing heating devices are mainly induction heating and far-infrared heating. These heating methods have problems such as high heating energy consumption and difficulty in temperature field control. In addition, the existing heating device is not equipped with a cooling system. Under high temperature conditions, other components of the chemical vapor deposition equipment are easily damaged by the high temperature. Summary of the invention
[0005] The purpose of the present invention is to provide a heating device and chemical vapor deposition equipment to solve the problems of high heating energy consumption and difficulty in temperature field control in induction heating and far-infrared heating in the prior art; other components of the chemical vapor deposition equipment are easily damaged by high temperature, thereby reducing the energy consumption of the heating device and damage to other components, reducing costs, improving the accuracy of temperature field control of the heating device, and improving the quality of wafer coating.
[0006] To achieve this object, the present invention adopts the following technical solutions:
[0007] In one aspect, a heating device is provided, comprising:
[0008] A heating component, the heating component comprising a heater, a vacuum introduction electrode rod, a conductive column and a graphite electrode rod, the vacuum introduction electrode rod, the conductive column, the graphite electrode rod and the heater are electrically connected in sequence from bottom to top, and the vacuum introduction electrode rod can be connected to an external power source, so that the heater is heated after being powered on;
[0009] A heat preservation component, the heat preservation component comprises a placement seat, a temperature-averaging plate and a heat insulation member, the placement seat is used to carry the heater, the heat insulation member is arranged around the placement seat, and the temperature-averaging plate is used to carry the wafer carrier and is arranged above the heater;
[0010] A cooling assembly, the cooling assembly includes a cooling core shaft and a water cooling box, the cooling core shaft is arranged outside the conductive column, the peripheral wall of the cooling core shaft is provided with a first cavity, the conductive column and the vacuum introduction electrode rod are partially placed in the water cooling box, the inner wall of the water cooling box is provided with a second cavity, and the first cavity and the second cavity can both be connected to and discharge cooling liquid.
[0011] As an optional technical solution for the heating device, the heating assembly also includes a first electrode clamp, an insulating clamp and an insulating support block, one end of the first electrode clamp is connected to the top of the vacuum introduction electrode rod, and the other end is connected to the bottom of the conductive column, and the insulating clamp is sleeved on the outside of the first electrode clamp; the insulating support block is provided with multiple and is fixed to the outside of the connection between the conductive column and the first electrode clamp by fasteners, so that the outside of the first electrode clamp is insulated.
[0012] As an optional technical solution for the heating device, the heating assembly also includes a second electrode clamp, a blocking support block and an insulating cover shell, one end of the second electrode clamp is connected to the top of the conductive column, and the other end is connected to the bottom of the graphite electrode rod, the blocking support block is arranged at the bottom of the second electrode clamp, and the insulating cover shell is arranged at the top of the second electrode clamp, so as to insulate the outside of the second electrode clamp.
[0013] As an optional technical solution of the heating device, the heating component also includes an insulating ring and an insulating sleeve, the insulating ring is sleeved on the outside of the conductive column, and the insulating sleeve is sleeved on the outside of the graphite electrode rod.
[0014] As an optional technical solution for the heating device, the heat preservation component also includes a bottom mounting seat, one side of the bottom mounting seat is detachably connected to the placement seat, and the other side of the bottom mounting seat is detachably connected to the cooling core shaft.
[0015] As an optional technical solution of the heating device, the cooling assembly further includes a sealed outer shaft, and the sealed outer shaft is sleeved on the outside of the cooling core shaft.
[0016] As an optional technical solution for the heating device, the heat preservation component also includes a heat insulation component mounting seat, one side of the heat insulation component mounting seat is detachably connected to the heat insulation component, and the other side of the heat insulation component mounting seat is detachably connected to the sealing outer shaft.
[0017] As an optional technical solution for the heating device, the cooling assembly further comprises a water-cooling placement seat, and the water-cooling placement seat is arranged on the top of the sealed outer shaft so as to be detachably connected to the equipment frame.
[0018] As an optional technical solution for the heating device, the cooling assembly further includes a water storage baffle, and the water storage baffles are multiple and are arranged in the first cavity at staggered intervals.
[0019] On the other hand, a chemical vapor deposition device is provided, comprising a vacuum device, a gas introduction device and the above-mentioned heating device.
[0020] Beneficial effects of the present invention:
[0021] The present application provides a heating device and chemical vapor deposition equipment, the heating device includes a heating component, a heat preservation component and a cooling component, the heating component includes a heater, a vacuum introduction electrode rod, a conductive column and a graphite electrode rod, the vacuum introduction electrode rod, the conductive column, the graphite electrode rod and the heater are electrically connected in sequence from bottom to top, the vacuum introduction electrode rod can be connected to an external power supply so that the heater is heated after being powered on; the heat preservation component includes a placement seat, a temperature equalizing plate and a heat insulating member, the placement seat is used to carry the heater, the heat insulating member is arranged around the placement seat, the temperature equalizing plate is used to carry the wafer carrier and is arranged above the heater; the cooling component includes a cooling mandrel and a water cooling box, the cooling mandrel is arranged outside the conductive column, the cooling mandrel is provided with a first cavity on the peripheral wall, the conductive column and the vacuum introduction electrode rod are partially placed in the water cooling box, the inner wall of the water cooling box is provided with a second cavity, the first cavity and the second cavity can both be connected to and drain out cooling liquid. The heater is electrically heated by introducing electrode rods through vacuum, and the temperature of the heater can be controlled by controlling the current passed through, thereby improving the accuracy of the heater temperature field control; the heater is insulated by the insulation component to prevent the temperature provided by the heater from dissipating too quickly, thereby reducing the energy consumption of the heater; the outside of the heating device is cooled by the cooling component to avoid damage to other components of the chemical vapor deposition equipment, thereby reducing cost consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.
[0023] Figure 1 is a first isometric view of a partial structure of a heating device provided in an embodiment of the present invention;
[0024] Figure 2 is a first cross-sectional view of a partial structure of a heating device provided by an embodiment of the present invention;
[0025] Figure 3 is a second cross-sectional view of a partial structure of a heating device provided by an embodiment of the present invention;
[0026] Figure 4 is a third cross-sectional view of a partial structure of a heating device provided by an embodiment of the present invention;
[0027] Figure 5 is a fourth cross-sectional view of a partial structure of a heating device provided by an embodiment of the present invention;
[0028] Figure 6 It is a second isometric view of a partial structure of the heating device provided in an embodiment of the present invention.
[0029] In the figure:
[0030] 1. Wafer carrier;
[0031] 10. Heating assembly; 11. Heater; 12. Vacuum introduction electrode rod; 13. Conductive column; 131. Insulating ring; 14. Graphite electrode rod; 141. Insulating sleeve; 15. First electrode clamp; 151. Insulating clamp; 152. Insulating support block; 16. Second electrode clamp; 161. Blocking support block; 162. Insulating cover; 17. Ceramic insulating block;
[0032] 20. Insulation assembly; 21. Placement seat; 22. Temperature equalization plate; 23. Insulation element; 24. Bottom mounting seat; 25. Insulation element mounting seat; 26. Guide column; 27. Positioning pin;
[0033] 30. Cooling assembly; 31. Cooling mandrel; 32. Water cooling box; 33. Sealed outer shaft; 34. Water cooling seat; 35. Cooling liquid inlet and outlet interface. DETAILED DESCRIPTION
[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0037] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0038] The high-temperature chemical vapor deposition (HTCVD) coating system is specially used for growing silicon carbide (SiC) epitaxial layers. It uses a unique thermal catalytic coating technology and can achieve efficient deposition of SiC epitaxial films at temperatures up to 1650°C. SiC epitaxial layers are generally used in applications such as semiconductor devices, power electronic devices, and sensors. The supported coating substrates include 4-inch, 6-inch, and 8-inch wafers. In the prior art, the core device of the high-temperature chemical vapor deposition equipment is the heating device. The heating methods used in the existing heating devices are mainly induction heating and far-infrared heating. These heating methods have problems such as high heating energy consumption and difficulty in temperature field control. In addition, the existing heating device is not equipped with a cooling system. Under high temperature conditions, other components of the chemical vapor deposition equipment are easily damaged by high temperature.
[0039] To solve the above problems, this embodiment provides a chemical vapor deposition device, including a vacuum device, a gas introduction device and a heating device. Figure 1-Figure 6The heating device includes a heating component 10, a heat preservation component 20 and a cooling component 30; the heating component 10 includes a heater 11 (for example, an electromagnetic heater or a resistance heater, etc.), a vacuum introduction electrode rod 12, a conductive column 13 and a graphite electrode rod 14, the vacuum introduction electrode rod 12, the conductive column 13, the graphite electrode rod 14 and the heater 11 are electrically connected in sequence from bottom to top, and the vacuum introduction electrode rod 12 can be connected to an external power supply, so that the heater 11 is heated after being powered on; the heat preservation component 20 includes a placement seat 21, a temperature equalizing plate 22 and an insulation The heat component 23, the placement seat 21 is used to carry the heater 11, the heat insulating component 23 is arranged around the placement seat 21, and the temperature plate 22 is used to carry the wafer carrier 1 and is arranged above the heater 11; the cooling component 30 includes a cooling mandrel 31 and a water cooling box 32, the cooling mandrel 31 is arranged outside the conductive column 13, and the peripheral wall of the cooling mandrel 31 is provided with a first cavity, the conductive column 13 and the vacuum introduction electrode rod 12 are partially placed in the water cooling box 32, and the inner wall of the water cooling box 32 is provided with a second cavity, and the first cavity and the second cavity can both be connected to and output cooling liquid. Specifically, the heat insulating component 23 is set as a heat insulating felt. In other embodiments, the heat insulating component 23 can also be set as a combination of a shell and a heat insulating glue to achieve the functions of heat insulation and heat preservation.
[0040] The heater 11 is electrically heated by introducing the electrode rod 12 through vacuum, and the temperature of the heater 11 can be controlled by controlling the current supplied, thereby improving the accuracy of temperature field control of the heater 11; the heater 11 is insulated by the insulation component 20 to prevent the temperature provided by the heater 11 from dissipating too quickly, thereby reducing the energy consumption of the heater 11; the outside of the heating device is cooled by the cooling component 30 to avoid damage to other components of the chemical vapor deposition equipment, thereby reducing cost consumption.
[0041] Specifically, the vacuum introduction electrode rod 12 includes an electrode, an external flange and an insulating layer. The insulating layer is arranged on the outside of the electrode, and the flange is arranged on the outside of the insulating layer. When the vacuum introduction electrode rod 12 is connected to an external power supply, the external flange will not be conductive, thereby avoiding damage to components connected to the external flange and improving the safety of the heating component 10.
[0042] Furthermore, the heating assembly 10 also includes a first electrode clamp 15, an insulating clamp 151 and an insulating support block 152. One end of the first electrode clamp 15 is connected to the top of the vacuum introduction electrode rod 12, and the other end is connected to the bottom of the conductive column 13. The insulating clamp 151 is sleeved on the outside of the first electrode clamp 15; the insulating support block 152 is provided with multiple and is fixed to the outside of the connection between the conductive column 13 and the first electrode clamp 15 by fasteners, so that the first electrode clamp 15 is insulated from the outside. In this embodiment, the insulating clamp 151 and the insulating support block 152 can be set to ceramic materials. In other embodiments, the insulating clamp 151 and the insulating support block 152 can be set to quartz material or high temperature resistant plastic.
[0043] Specifically, the first electrode clamp 15 is arranged in the water cooling box 32, and the water cooling box 32 is set to a vacuum environment. The conductive column 13 and the first electrode clamp 15 are both made of molybdenum material. The first electrode clamp 15 clamps the top of the vacuum introduction electrode rod 12 and the bottom of the conductive column 13 through molybdenum bolts; two insulating clamps 151 are set, which are relatively arranged on both sides of the middle section of the first electrode clamp 15, which can provide an insulating environment for the first electrode clamp 15 to prevent foreign objects from conducting the first electrode clamp 15 and causing sparks.
[0044] Furthermore, two first electrode clamps 15 are provided, and the insulating support block 152 is provided in two upper and lower parts, which are fixed to the connection between the first electrode clamp 15 and the conductive column 13 by bolts and wrap the connection to prevent direct discharge and conduction on the side where the two first electrode clamps 15 are close to each other.
[0045] Furthermore, the heating assembly 10 further includes a second electrode clamp 16, a blocking support block 161 and an insulating cover 162, one end of the second electrode clamp 16 is connected to the top of the conductive column 13, and the other end is connected to the bottom of the graphite electrode rod 14, the blocking support block 161 is arranged at the bottom of the second electrode clamp 16 (between the second electrode clamp 16 and the bottom mounting seat 24), and the insulating cover 162 is arranged at the top of the second electrode clamp 16, so as to insulate the outside of the second electrode clamp 16. Specifically, the blocking support block 161 is used to support the second electrode clamp 16, and the second electrode clamp 16 is connected to the conductive column 13 and the graphite electrode rod 14 by clamping.
[0046] Furthermore, two second electrode clamps 16 are provided, and a guard is provided on the edge of the insulating cover 162 to cover the two second electrode clamps 16 inside the guard. An insulating guard plate is protruding in the middle of the insulating cover 162 to separate the two second electrode clamps 16 to prevent direct discharge and conduction on the side where the two second electrode clamps 16 are close to each other.
[0047] Furthermore, the heating assembly 10 further includes an insulating ring 131 and an insulating sleeve 141, wherein the insulating ring 131 is sleeved outside the conductive column 13, and the insulating sleeve 141 is sleeved outside the graphite electrode rod 14. Specifically, the insulating ring 131 is fixed on the insulating support block 152; and the insulating sleeve 141 is fixed on the insulating cover 162.
[0048] Furthermore, the graphite electrode rod 14 is connected to the heater 11 by bolts, and graphite gaskets are provided between the bolts and the heater 11 and between the heater 11 and the graphite electrode rod 14 to avoid damage to the heater 11 and the graphite electrode rod 14 .
[0049] Furthermore, the heat preservation assembly 20 further includes a bottom mounting seat 24, one side of the bottom mounting seat 24 is detachably connected to the placement seat 21, and the other side is detachably connected to the cooling mandrel 31. Specifically, since the temperature at this connection is relatively high, the bottom mounting seat 24 is connected to the placement seat 21 and the cooling mandrel 31 by bolts made of molybdenum material to resist high temperatures.
[0050] Furthermore, the insulation component 20 also includes a positioning pin 27, a countersunk screw hole is provided at the outer edge of the bottom mounting seat 24, a threaded section is provided on the positioning pin 27, and the positioning pin 27 is screwed to the countersunk screw hole through a thread; blind holes are evenly spaced at the bottom edge of the placement seat 21 and correspond one-to-one to the positioning pins 27, and the placement seat 21 is positioned and placed on the upper part of the bottom mounting seat 24 through the positioning pins 27; a plurality of grooves are provided on the top of the placement seat 21, and a ceramic insulating block 17 is placed in the groove, and the heater 11 is placed on the ceramic insulating block 17 to prevent the heater 11 from creeping at high temperature and contacting the placement seat 21 to generate sparks; a circle of protruding edge guard is provided at the upper edge of the placement seat 21, which can better prevent the heat loss of the heater 11, make the temperature difference between the heating edge temperature and the center temperature smaller, and reduce the energy consumption of the heater 11.
[0051] Furthermore, the heat insulation assembly 20 further includes a heat insulation mounting seat 25, one side of the heat insulation mounting seat 25 is detachably connected to the heat insulation 23, and the other side is detachably connected to the sealing outer shaft 33. Specifically, a threaded hole is provided at the top of the sealing outer shaft 33, and the sealing outer shaft 33 is connected to the heat insulation mounting seat 25 by bolts. Specifically, the heat insulation mounting seat 25 can be set as a combination of heat insulation felt or a shell and heat insulation glue to achieve the functions of heat insulation and heat preservation.
[0052] Furthermore, the insulation component 20 also includes a guide column 26, a threaded hole is provided at the edge of the insulation component mounting seat 25, a threaded section is provided at the bottom of the guide column 26, the guide column 26 is fixedly connected to the edge of the insulation component mounting seat 25 by threads, the insulation component mounting seat 25 is provided with a through hole corresponding to the guide column 26, the insulation component 23 is guided by the guide column 26, so that the insulation component 23 is placed on the insulation component mounting seat 25, the top of the guide column 26 passes through the insulation component 23 and the top is exposed, the lower part of the temperature equalizing plate 22 is provided with a guide hole and corresponds to the guide column 26 one by one, the exposed top of the guide column 26 serves as a guide support for the temperature equalizing plate 22, and the lower part of the outer edge of the temperature equalizing plate 22 is provided with a protruding step, the inner side of the step is positioned in coordination with the outer ring of the insulation component 23, so that the temperature equalizing plate 22 can be fixed and stabilized.
[0053] Furthermore, a threaded hole is provided on the top of the cooling core shaft 31, and a countersunk hole corresponding to the cooling core shaft 31 is provided on the lower part of the bottom mounting seat 24, and the bottom mounting seat 24 is connected to the cooling core shaft 31 by bolts; two upper and lower flange interfaces are provided on the lower part of the cooling core shaft 31, and opposing cooling liquid inlet and outlet interfaces 35 are provided between the two flange interfaces. The cooling assembly 30 also includes a water storage baffle, and the water storage baffles are multiple and staggered and spaced in the first cavity, so that the cooling liquid can effectively flow evenly through the cooling core shaft 31, thereby improving the cooling effect.
[0054] Furthermore, the cooling assembly 30 further includes a water cooling seat 34, which is disposed on the top of the sealing outer shaft 33 to be detachably connected to the equipment frame. The cooling assembly 30 further includes a sealing outer shaft 33, which is sleeved on the outside of the cooling core shaft 31. Specifically, two circles of water cooling channels are arranged inside and outside the bottom of the water-cooling placement seat 34, which can cool the cooling liquid to the greatest extent and improve the cooling effect and safety performance. Flange interfaces are arranged at the upper and lower ends of the sealed outer shaft 33. The flange interface on the upper side of the cooling core shaft 31 is connected to the flange interface at the lower end of the sealing outer shaft 33. The flange interface at the upper end of the sealing outer shaft 33 is connected to the flange interface on the lower side of the water-cooling placement seat 34. The flange interface on the lower side of the cooling core shaft 31 is connected to the flange interface on the upper end of the water-cooling box 32. Two flange interfaces are arranged at the bottom of the water-cooling box 32, which are respectively connected to the flange interfaces of the two vacuum introduction electrode rods 12. The cooling liquid channels are evenly arranged in the second cavity. The introduced cooling liquid flows through the high-temperature area along the second cavity, which can effectively prevent scalding of personnel and damage to high-temperature-resistant parts such as cables.
[0055] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.
Claims
1. A heating device, characterized in that: include: A heating component (10), the heating component (10) comprising a heater (11), a vacuum introduction electrode rod (12), a conductive column (13) and a graphite electrode rod (14), the vacuum introduction electrode rod (12), the conductive column (13), the graphite electrode rod (14) and the heater (11) being electrically connected in sequence from bottom to top, the vacuum introduction electrode rod (12) being able to be connected to an external power source, so that the heater (11) is heated after being energized; A heat preservation component (20), the heat preservation component (20) comprising a placement seat (21), a temperature-averaging plate (22) and a heat insulation member (23), the placement seat (21) being used to carry the heater (11), the heat insulation member (23) being arranged around the placement seat (21), and the temperature-averaging plate (22) being used to carry the wafer carrier (1) and being arranged above the heater (11); A cooling assembly (30), the cooling assembly (30) comprising a cooling mandrel (31) and a water cooling box (32), the cooling mandrel (31) being arranged outside the conductive column (13), the peripheral wall of the cooling mandrel (31) being provided with a first cavity, the conductive column (13) and the vacuum introduction electrode rod (12) being both partially placed in the water cooling box (32), the inner wall of the water cooling box (32) being provided with a second cavity, the first cavity and the second cavity being capable of receiving and discharging cooling liquid.
2. The heating device according to claim 1, characterized in that The heating assembly (10) further comprises a first electrode clamp (15), an insulating clamp (151) and an insulating support block (152); one end of the first electrode clamp (15) is connected to the top of the vacuum introduction electrode rod (12), and the other end is connected to the bottom of the conductive column (13); the insulating clamp (151) is sleeved on the outside of the first electrode clamp (15); the insulating support block (152) is provided with a plurality of fasteners and is fixed to the outside of the connection between the conductive column (13) and the first electrode clamp (15) by fasteners, so that the outside of the first electrode clamp (15) is insulated.
3. The heating device according to claim 1, characterized in that: The heating assembly (10) further comprises a second electrode clamp (16), a blocking support block (161) and an insulating cover (162); one end of the second electrode clamp (16) is connected to the top of the conductive column (13), and the other end is connected to the bottom of the graphite electrode rod (14); the blocking support block (161) is arranged at the bottom of the second electrode clamp (16), and the insulating cover (162) is arranged at the top of the second electrode clamp (16), so that the second electrode clamp (16) is externally insulated.
4. The heating device according to claim 1, characterized in that The heating component (10) further comprises an insulating ring (131) and an insulating sleeve (141), wherein the insulating ring (131) is sleeved on the outside of the conductive column (13), and the insulating sleeve (141) is sleeved on the outside of the graphite electrode rod (14).
5. The heating device according to any one of claims 1 to 4, characterized in that: The heat preservation component (20) further comprises a bottom mounting seat (24), one side of the bottom mounting seat (24) being detachably connected to the placement seat (21), and the other side of the bottom mounting seat (24) being detachably connected to the cooling core shaft (31).
6. The heating device according to any one of claims 1 to 4, characterized in that: The cooling component (30) further comprises a sealed outer shaft (33), wherein the sealed outer shaft (33) is sleeved on the outside of the cooling core shaft (31).
7. The heating device according to claim 6, characterized in that The heat-insulating component (20) further comprises a heat-insulating component mounting seat (25), one side of the heat-insulating component mounting seat (25) being detachably connected to the heat-insulating component (23), and the other side of the heat-insulating component mounting seat (25) being detachably connected to the sealing outer shaft (33).
8. The heating device according to claim 6, characterized in that The cooling assembly (30) further comprises a water-cooling placement seat (34), wherein the water-cooling placement seat (34) is arranged on the top of the sealing outer shaft (33) so as to be detachably connected to the equipment frame.
9. The heating device according to any one of claims 1 to 4, characterized in that: The cooling assembly (30) also includes a water storage baffle, which is in plurality and arranged in a staggered manner in the first cavity.
10. A chemical vapor deposition device, characterized in that: The invention comprises a vacuum device, a gas introduction device and a heating device as described in any one of claims 1 to 9.