Testing device and testing method applied to high-voltage test of chip

By designing a high -voltage test device that places the device in the insulation oil, the test accuracy and safety of the testing channels in the existing technology have solved the inaccurate testing and device damage in the existing technology, and achieved higher test accuracy and safety.

CN119335325APending Publication Date: 2025-01-21BEIJING SMART ENERGY RES INST +1
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202310878688.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-07-18
Publication Date
2025-01-21

AI Technical Summary

Technical Problem

Existing high-voltage power devices, high-voltage testing devices are prone to conductive channels during the test, which affects the accuracy of the test and may damage the semiconductor devices.

Method used

A test device is designed. The device places the device in the insulating oil for high -voltage testing. It is contacting the device through the probe to avoid the emergence of air electrostatic and conductive channels. The device includes a fever tablet, test oil slot, probe, and probe, and test the insulating oil in the oil slot to ensure the accuracy and safety of the test.

Benefits of technology

By placing the device in the insulated oil for high -voltage testing, the emergence of the conductive channel is eliminated, the accuracy of the test is improved, and the device is damaged in the high -pressure test process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119335325A_ABST
    Figure CN119335325A_ABST
Patent Text Reader

Abstract

The invention provides a testing device and a testing method applied to a chip high-voltage test, and belongs to the technical field of semiconductor production, and the testing device comprises an objective table capable of heating, a testing oil groove, a probe seat and a probe. The test oil tank is arranged on the objective table; the probe seat is arranged outside the test oil groove, and the probe is arranged on the probe seat; in the testing process, insulating oil is contained in the testing oil groove, and the probe makes contact with a device placed in the testing oil groove. According to the testing device, the device is placed in the insulating oil for high-voltage testing, the occurrence of a conductive channel in the testing process can be avoided, the testing is ensured, the testing precision is improved, and the device is prevented from being damaged in the high-voltage testing process.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production technology, and in particular to a testing device, a chip testing device and a testing method for high-voltage testing of a chip. Background Art

[0002] High-voltage power devices such as high-voltage MOSFET, IGBT, high-voltage Schottky diode, and high-voltage fast recovery diode have the characteristics of high withstand voltage. In recent years, their application scope has been continuously expanded, and the demand and output have also been continuously increasing. High-voltage power devices require high-voltage testing during the production process to screen out defective products.

[0003] In the existing high-voltage test device for high-voltage power devices, the devices are usually in the atmosphere during the test process. Due to the limited distance between the test probe and the substrate of the power device, air ionization is prone to occur during the high-voltage parameter test, and then a conductive channel is formed between the test probe and the substrate of the power device. Especially when testing voltages of 2500 V and above, the phenomenon of conductive channels is more obvious. The existence of conductive channels seriously affects the accuracy of the test, and in severe cases, it may even cause damage to the semiconductor device.

[0004] Therefore, it is necessary to improve the existing chip high voltage testing device to overcome the defects of the prior art. Summary of the invention

[0005] In order to overcome the problems existing in the related art, one of the purposes of the present invention is to provide a test device for high-voltage testing of chips. The test device can prevent the emergence of conductive channels during the test process by placing the device in insulating oil for high-voltage testing, thereby ensuring that the test accuracy is improved and preventing the device from being damaged during the high-voltage test.

[0006] A test device for high voltage testing of a chip, comprising: Heatable stage; A test oil tank, the test oil tank is arranged on the stage; A probe seat and a probe, wherein the probe seat is arranged outside a test oil tank, and the probe is arranged on the probe seat; during a test, the test oil tank contains insulating oil, and the probe contacts a device placed in the test oil tank.

[0007] In a preferred technical solution of the present invention, it also includes a chassis, which is arranged at the bottom of the stage, and the probe seat is movably arranged on the chassis.

[0008] In a preferred technical solution of the present invention, the probe and the probe seat are connected via a direction adjustment device.

[0009] In a preferred technical solution of the present invention, a plurality of probe seats are arranged around the test oil tank, and one probe is arranged on each probe seat.

[0010] In a preferred technical solution of the present invention, the bottom of the test oil tank is sealed and the top is provided with an opening, and the bottom of the test oil tank is made of heat-conducting material.

[0011] In a preferred technical solution of the present invention, the test oil tank is a cylindrical structure with openings at both ends, and the loading platform and the opening at the bottom of the test oil tank are sealed with each other.

[0012] In a preferred technical solution of the present invention, an oil tank cover is provided on the top of the test oil tank, and the oil tank cover is made of high temperature resistant insulating material; a test hole for the probe to pass through is provided on the oil tank cover.

[0013] In a preferred technical solution of the present invention, the height A of the test oil tank is greater than 3 cm; during the test, the depth of the insulating oil contained in the test oil tank is greater than 3 cm, and the distance between the surface of the insulating oil and the top of the test oil tank is greater than 2 cm.

[0014] In a preferred technical solution of the present invention, the length of the probe is greater than 5 cm.

[0015] In a preferred technical solution of the present invention, a lifting device is provided at the bottom of the loading platform, and a heating device is provided in the loading platform.

[0016] A second object of the present invention is to provide a chip testing method, which is implemented based on the testing device for chip high voltage testing as described above; The test method comprises the following steps: Connect the probes of the test device to the test equipment; Place the device under test in the test oil tank; Add insulating oil into the test oil tank; Adjust the position of the probe holder and the probe, and make the probe contact the test electrode of the device to be tested Heat the insulating oil, apply the required test voltage between the probe and the stage through the power supply, and read the test results.

[0017] The beneficial effects of the present invention are: The present invention provides a test device for high-voltage testing of chips, which includes a heatable stage, a test oil tank, a probe seat and a probe. The test oil tank is arranged on the stage; the probe seat is arranged outside the test oil tank, and the probe is arranged on the probe seat; during the test, the test oil tank contains insulating oil, and the probe contacts the device placed in the test oil tank. The stage can heat the insulating oil in the test oil tank to reach the test temperature. By placing the device in insulating oil for high-voltage testing, the test device can prevent the appearance of conductive channels during the test, ensure the test accuracy is improved, and prevent the device from being damaged during the high-voltage test.

[0018] The present application also provides a chip testing device and a testing method implemented based on the testing device as described above. During the high-voltage test of the power device, no conductive channel will appear between the probe and the power device. This ensures the accuracy of the high-voltage test of the power device and can also prevent the power device from being damaged during the high-voltage test. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view of a test device for high voltage testing of a chip provided by the present invention; Figure 2 is a top view of a test device for high voltage testing of a chip provided by the present invention; Figure 3 Is a top view of the oil tank cover provided by the present invention; Figure 4 is a top view of the card slot provided by the present invention; Figure 5 It is a cross-sectional view of the card slot provided by the present invention.

[0020] Reference numerals: 11. Probe; 12. Chassis; 13. Oil tank cover; 14. Probe holder; 15. Test oil tank; 16. Power device; 17. Stage; 18. Card slot. Implementation

[0021] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0022] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "the" and "the" used in the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0023] It should be understood that although the terms "first", "second", "third", etc. may be used to describe various information in the present invention, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0024] In the existing high-voltage test device for high-voltage power devices, the device is usually in an atmospheric environment during the test process. Due to the limited distance between the test probe and the substrate of the power device, air ionization is prone to occur during the high-voltage parameter test, thereby forming a conductive channel between the test probe and the substrate of the power device. The existence of the conductive channel seriously affects the accuracy of the test, and in severe cases may even cause damage to the semiconductor device. In order to overcome the defects of the prior art, the present application proposes a test device for high-voltage testing of chips. Example

[0025] like Figure 1-Figure 3 As shown, the test device applied to high voltage test of a chip includes: The heating stage 17 is realized by a heating device disposed in the stage 17 , and the heating device may be an electric heating rod disposed inside the stage 17 .

[0026] The test oil tank 15 is also included, and the test oil tank 15 is arranged on the stage 17; the cross section of the test oil tank 15 can be circular, rectangular or irregular. The test oil tank 15 is used to hold insulating oil and is heated by the stage 17. Therefore, except for the bottom, the other parts of the test oil tank 15 are made of high temperature resistant insulating material, and the high temperature resistant insulating material can withstand a high temperature of at least 300°C.

[0027] The test device further includes a probe holder 14 and a probe 11. The probe holder 14 is arranged outside a test oil tank 15, and the probe 11 is arranged on the probe holder 14. During the test, the test oil tank 15 contains insulating oil, and the probe 11 contacts the device placed in the test oil tank 15. In the actual test, during the test, the probe 11 and the stage 17 apply a target voltage to the power device 16 in the test oil tank 15.

[0028] The above-mentioned test device for high-voltage testing of chips includes a heatable stage 17, a test oil tank 15, a probe seat 14 and a probe 11. The test oil tank 15 is arranged on the stage 17; the probe seat 14 is arranged outside the test oil tank 15, and the probe 11 is arranged on the probe seat 14; during the test, the test oil tank 15 contains insulating oil, and the probe 11 contacts the device placed in the test oil tank 15. The stage 17 can heat the insulating oil in the test oil tank 15 to reach the test temperature. The test device can prevent the appearance of conductive channels during the test process by placing the device in insulating oil for high-voltage testing, thereby ensuring that the test accuracy is improved and preventing the device from being damaged during the high-voltage test.

[0029] The test device further comprises a chassis 12, which is disposed at the bottom of the stage 17, and the probe seat 14 is movably disposed on the chassis 12. The chassis 12 is the basic structure of the test device, and is used to carry various components.

[0030] In a more preferred embodiment, the probe 11 is connected to the probe base 14. The probe base 14 can move in a horizontal direction to adapt to the testing of different power devices 16.

[0031] Furthermore, a plurality of probe seats 14 are arranged around the test oil tank 15, and a probe 11 is arranged on each probe seat 14. The probe seat 14 is movably arranged on the chassis 12, and the arrangement of a plurality of probe seats 14 enables the device to test different power devices 16.

[0032] In one embodiment, the bottom of the test oil tank 15 is sealed and the top is provided with an opening, and the bottom of the test oil tank 15 is made of a heat-conducting material. In this embodiment, the bottom of the test oil tank 15 is sealed and has a firm structure. The stage 17 heats the insulating oil contained in the test oil tank 15 by heating the bottom of the test oil tank 15.

[0033] In a more preferred embodiment, an oil tank cover 13 is provided on the top of the test oil tank 15, and the oil tank cover 13 is made of high temperature resistant insulating material; the oil tank cover 13 is provided with a test hole for the probe 11 to pass through. Multiple test holes can be provided on the oil tank cover 13, so that the probe 11 can pass through different test holes and extend into the test oil tank 15 according to different requirements to contact the power device 16 to be tested.

[0034] Furthermore, the height A of the test oil tank 15 is greater than 3 cm; during the test, the depth of the insulating oil contained in the test oil tank 15 is greater than 3 cm, and the distance between the surface of the insulating oil and the top of the test oil tank 15 is greater than 2 cm. Furthermore, the length of the probe 11 is greater than 5 cm. In order to ensure that the power device 16 to be tested can be completely covered by the insulating oil during the test, it is necessary to ensure that the depth of the insulating oil contained in the test oil tank 15 is greater than 3 cm.

[0035] Furthermore, a lifting device is provided at the bottom of the stage 17, and a heating device is provided in the stage 17. The lifting device can be fixed on the chassis 12, and the setting of the lifting device enables the stage 17 to be raised and lowered, and the distance between the probe and the stage can be controlled, and whether the needle contacts the device can be controlled.

[0036] The present application also provides a chip testing device and a testing method implemented based on the testing device as described above. During the high-voltage test of the power device 16, no conductive channel will appear between the probe 11 and the power device 16. This ensures the accuracy of the high-voltage test of the power device 16 and can also prevent the power device 16 from being damaged during the high-voltage test.

[0037] The test method includes the following steps: S100, connecting the probe 11 of the testing device to the testing equipment; the testing equipment can read the test result.

[0038] S200 , placing the device under test in the test oil tank 15 ; the device under test is placed at the bottom of the test oil tank 15 .

[0039] S300, adding insulating oil into the test oil tank 15; the depth of the insulating oil in the test oil tank 15 is greater than 3 cm.

[0040] S400, adjusting the positions of the probe holder 14 and the probe 11, and making the probe 11 contact with the test electrode of the device to be tested; S500 , heating the insulating oil, applying a required test voltage between the probe 11 and the stage 17 through a power supply, and reading the test result. In actual applications, the insulating oil is heated through the stage 17 . Example

[0041] This embodiment only describes the differences from Embodiment 1, and the remaining technical features are the same as those of the above embodiment.

[0042] In this embodiment, the test device includes a heatable stage 17, a test oil tank 15, a probe seat 14 and a probe 11. The test oil tank 15 is arranged on the stage 17; the probe seat 14 is arranged outside the test oil tank 15, and the probe 11 is arranged on the probe seat 14. Different from Example 1, the test oil tank 15 is a cylindrical structure with openings at both ends, and the stage 17 and the opening at the bottom of the test oil tank 15 are sealed to each other. More specifically, the stage 17 and the test oil tank 15 are sealed to each other through a card slot 18.

[0043] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings. In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0044] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this application. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A test device for high voltage testing of a chip, characterized in that: include: A heatable stage (17); A test oil tank (15), wherein the test oil tank (15) is arranged on the object carrier (17); A probe seat (14) and a probe (11), wherein the probe seat (14) is arranged outside a test oil tank (15), and the probe (11) is arranged on the probe seat (14); during a test process, the test oil tank (15) contains insulating oil, and the probe (11) contacts a device placed in the test oil tank (15).

2. The test device for high voltage chip testing according to claim 1, characterized in that: It also comprises a chassis (12), wherein the chassis (12) is arranged at the bottom of the object carrier (17), and the probe seat (14) is movably arranged on the chassis (12).

3. The test device for high voltage chip testing according to claim 2, characterized in that: The probe (11) and the probe seat (14) are connected via a direction adjustment device.

4. The test device for high voltage chip testing according to claim 2, characterized in that: A plurality of probe seats (14) are arranged on the periphery of the test oil tank (15), and one probe (11) is arranged on each of the probe seats (14).

5. The test device for high voltage testing of a chip according to any one of claims 1 to 4, characterized in that: The bottom of the test oil tank (15) is sealed and the top is provided with an opening. The bottom of the test oil tank (15) is made of heat-conducting material.

6. The test device for high voltage testing of a chip according to any one of claims 1 to 4, characterized in that: The test oil tank (15) is a cylindrical structure with openings at both ends, and the loading platform (17) and the opening at the bottom of the test oil tank (15) are sealed to each other.

7. The test device for high voltage chip testing according to claim 5, characterized in that: An oil tank cover (13) is provided on the top of the test oil tank (15), and the oil tank cover (13) is made of high-temperature resistant insulating material; a test hole for the probe (11) to pass through is provided on the oil tank cover (13).

8. The test device for high voltage testing of a chip according to any one of claims 1 to 4, characterized in that: The height A of the test oil tank (15) is greater than 3 cm; during the test, the depth of the insulating oil contained in the test oil tank (15) is greater than 3 cm, and the distance between the surface of the insulating oil and the top of the test oil tank (15) is greater than 2 cm.

9. The test device for high voltage testing of a chip according to any one of claims 1 to 4, characterized in that: The length of the probe (11) is greater than 5 cm.

10. The test device for high voltage testing of a chip according to any one of claims 1 to 4, characterized in that: A lifting device is provided at the bottom of the loading platform (17), and a heating device is provided in the loading platform (17).

11. A chip testing method, characterized in that: The test method is implemented based on the test device for chip high voltage testing as described in any one of claims 1 to 10; The test method comprises the following steps: Connecting a probe (11) of the test device to the test equipment; Placing the device to be tested in a test oil tank (15); Adding insulating oil into the test oil tank (15); The positions of the probe seat (14) and the probe (11) are adjusted so that the probe (11) contacts the test electrode of the device to be tested. The insulating oil is heated, and a required test voltage is applied between the probe (11) and the stage (17) through a power supply, and the test result is read.