High-precision automatic positioning and inspection system for chip

Abstract

The invention relates to the technical field of chip inspection and testing, in particular to a high-precision automatic positioning and inspection system for chips, which comprises a storage warehouse for storing a plurality of material boxes loaded with a plurality of to-be-tested chips; the intelligent trolley is used for receiving an instruction of the server and transferring and conveying the material box between the testing machine and the storage warehouse; the testing machine is used for realizing automatic grabbing of the wafer and automatic testing of a chip on the wafer; the test machine comprises the following modules: a test program calling module, which is used for obtaining product parameters and test programs; the test data storage module is used for generating a test data file and storing a test result; the comparison module is used for comparing the test result with a standard result; the map display module is used for obtaining and displaying a map; and the comparison module is also used for comparing whether the test data file is correspondingly consistent with the map or not. According to the invention, the personnel risk and the labor cost can be reduced, the coordinates of the test data are automatically compared, the yield is improved, and the test risk is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip inspection and testing, and in particular to a high-precision automatic chip positioning and inspection system. Background Art

[0002] Although the existing traditional testing technology has achieved semi-automatic testing of chips and improved the testing quality and efficiency, the following problems still exist:

[0003] 1. When the chip product to be tested in the existing system changes, it is necessary to manually re-enter the test program, set the test program, and manually replenish the materials in the test equipment. This not only significantly increases the labor cost, but also increases the uncertainty of the test results to a certain extent due to the influence of human subjective factors.

[0004] 2. There is no intuitive test result detection after testing the chip. If the continuous current operation is performed directly, there will be test risks. Summary of the invention

[0005] The purpose of the present invention is to provide a high-precision automated chip positioning and inspection system, which can reduce personnel risks and labor costs, and automatically compare the coordinates of test data, thereby improving the yield and reducing test risks.

[0006] In order to achieve the above-mentioned purpose, a high-precision automatic positioning and inspection system for chips is provided, including: a test machine, a storage warehouse, an intelligent car and a server;

[0007] Storage warehouse: used to store a plurality of boxes loaded with a plurality of chips to be tested; a plurality of layers of wafers are loaded in the storage unit of the box; an electronic tag is provided on the box, and the electronic tag is associated with and stores the ID information of the wafers in the box;

[0008] Smart car: used to receive server instructions to transfer and transport the material boxes between the testing machine and the storage warehouse;

[0009] Tester: used to realize automatic grabbing of wafers and automatic testing of chips on wafers; a material box conveying mechanism and a material box supporting platform are provided on one side of the tester, and the material box is transferred from the intelligent trolley to the material box supporting platform by the material box conveying mechanism, and the tester realizes automatic grabbing of wafers on the material box supporting platform; the material box supporting platform is used to place the material box and is provided with an inductive reading device corresponding to the inductive identification device; the tester includes the following modules:

[0010] Retrieving test program module: used to retrieve product parameters and test programs of the chip product to be tested on the corresponding wafer from the server through the identified ID information;

[0011] Test data storage module: used to automatically generate test data files and store test results during the test process;

[0012] Comparison module: used to compare the test results with the standard results to obtain qualified or unqualified test results;

[0013] A map display module is used to display a map on the display of the tester according to the product parameters and test procedures of the chip product to be tested; the map is a wafer graphic enlarged at a set ratio, and a plurality of rectangular frames corresponding to each chip on the wafer to be tested are arranged in the wafer graphic, and each rectangular frame is configured with a coded coordinate (X, Y), indicating the chip in the Xth row and the Yth column in the wafer to be tested; before the test, the rectangular frame is configured as a first color, and after the corresponding chip product is tested, it is configured to be divided into two colors according to the test result, and when the test result is passed, the rectangular frame displays green, otherwise it displays red;

[0014] Comparison module: It is also used to compare the test results of each chip product in the test data file with the color displayed on the map wafer graphic to see if they correspond; if the comparison is correct, the subsequent wafer unloading action will be carried out, otherwise the corresponding chip product will be reported as an error.

[0015] Furthermore, the testing machine includes a loading and unloading robot, a probe station, a test head module, a drive module, a controller, a display and a barcode scanner; a material box positioning area is provided on the material box support platform for carrying and positioning the material box, and the barcode scanner is arranged on one side of the material box positioning area for scanning the electronic label on the material box to detect whether the material box is placed correctly; the test head module is located directly above the probe station, the probe station is used to carry the wafer, and the drive module is located below the probe station for driving the probe station to move in the XYZR axis direction. The loading and unloading robot is used to take out the wafer in the material box located in the material box positioning area and place it on the probe station. After the wafer test is completed, the wafer is taken away from the probe station and put back into the material box. The controller is electrically connected to the loading and unloading robot, the probe station, the test head module, the drive module, the display and the barcode scanner.

[0016] Furthermore, the test head module includes a test machine head, a test circuit board and a probe card. The test circuit board is mounted on the test machine head and electrically connected to the probe card. The probe card contacts the chip product on the wafer to achieve conduction.

[0017] Furthermore, the test data storage module includes the following submodules:

[0018] Position adjustment submodule: used to transfer the wafer to the probe table through the loading and unloading robot, and move the probe table to the position where the CCD camera collects images through the driving module, and then calculate the center position of the wafer and the arrangement direction of the chip products according to the collected images, and rotate the probe table so that the arrangement direction of the chip products is in the same direction as the X-axis;

[0019] Test submodule: It is used to move the probe station through the drive module during testing so that the probe card on the test head module can accurately contact the chip product on the wafer, start the test program to test, and obtain the test results; then decide whether to retest or make dot marks based on the test results, complete the test of a chip product, and then control the drive module to move the probe station to the next chip product position in the same direction of the X-axis to continue testing. After testing a row of chip products, move to the Y-axis to change another row until all chip products are tested.

[0020] Further, the storage warehouse includes a plurality of storage units for storing material boxes, the material boxes are loaded with a plurality of layers of wafers and placed in the storage units, each storage unit is configured with a number, and each storage unit area is provided with a sensing device, the sensing device includes but is not limited to an electronic tag, an IC card, an ID card, a magnetic stripe, a QR code, a bar code or a contact unit;

[0021] The server issues instructions to the smart car to extract a material box loaded with a specified chip product according to the production schedule;

[0022] The smart car extracts a material box loaded with a specified chip product from a storage warehouse according to the sensing identification device and instructions.

[0023] Furthermore, a sensing unit for sensing the ID of each wafer is provided in the probe station of the test machine; the ID information of the wafer is obtained by sensing the wafer through the sensing unit, and the controller includes the following modules:

[0024] ID comparison and analysis module: used to compare the ID information with the ID information of the product that needs to be tested currently to determine whether they are consistent. If they are consistent, the test program is carried out. If they are inconsistent, it means that the wafer does not belong to the chip product that needs to be tested currently, and the wafer is removed.

[0025] Furthermore, the test machine is also provided with a communication module, which is used to communicate with the server and send the test data file, the Map corresponding to the test data file, and the comparison data obtained by comparing the test data file with the Map by the comparison module to the server.

[0026] Furthermore, the server includes the following modules:

[0027] Alarm prompt module: used to obtain the preset yield threshold, calculate the yield according to the test data file, compare and analyze the yield threshold with the calculated yield, and generate an alarm prompt message if they are inconsistent; it is also used to generate an alarm prompt message when the comparison data between the test data file and the Map is inconsistent; it is also used to generate an alarm prompt message when the analysis result of the ID comparison analysis module is inconsistent.

[0028] Principles and advantages:

[0029] 1. After all chips on the same wafer are tested, the test control system 16 compares the display results on the wafer graphics with the test results in the internally generated test data file one by one. The principle of comparison is that the good and bad codes on the Map are fixed, for example: fail and pass, and the TRUE and FALSE in the test data of the test machine represent pass and fail respectively, and each character is followed by a corresponding coordinate code. Through the standardized coordinate definition file in the SESGEM protocol, it is found whether the corresponding coordinate is associated with the corresponding code in the Map. If an abnormality is found, the system will perform the relevant error code and notify the engineer to eliminate the cause. If the comparison is correct, the subsequent unloading action will be carried out, otherwise the corresponding chip will be reported as an error; after the operation is completed, the loading and unloading robot will take the wafer that has been tested from the probe station and then put it back into the material box; repeat the above steps to complete the automatic test of all wafers in the material box; finally, the intelligent car will put the material box that has been tested back into the storage warehouse to complete a cycle of testing actions. Among them, after the test is completed, this solution directly compares the measured data with the coordinates in the generated Map graphic, which significantly reduces the risk of test anomalies.

[0030] 2. When the wafer is placed in the material box, it may be placed in the wrong material box due to various reasons. Therefore, in order to ensure that each wafer entering the probe station is the chip product currently being tested, the tester is equipped with a sensing unit that senses the ID of each wafer. The sensing unit senses the wafer to obtain the ID information of the wafer. The controller compares the ID information with the product ID information that the system currently needs to test to determine whether they are consistent. If they are consistent, the test program can be performed. If they are inconsistent, it means that the wafer does not belong to the product that needs to be tested currently, and the tester will perform the wafer ejection process.

[0031] 3. This solution processes chip product information, as well as various equipment information, status and other data one by one according to the process steps, so as to ensure that the accounts and materials are consistent, and each module is closely connected to achieve an accurate production process, realize highly automated production, reduce the impact of human factors, reduce labor costs and the probability of problems, and thus reduce testing risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a logic block diagram of a chip high-precision automatic positioning and inspection system according to an embodiment of the present invention;

[0033] Figure 2 This is the logic block diagram of the test machine. DETAILED DESCRIPTION

[0034] The following is further described in detail through specific implementation methods:

[0035] The figure marks in the drawings of the specification include: system 1, storage warehouse 2, smart car 3, server 4, material box 5, probe card storage 6, material box positioning area 11, loading and unloading robot 12, probe station 13, test machine module 14, test machine head 141, test circuit board 142, probe card 143 drive module 15, controller 16, display 17, barcode scanner 18.

[0036] Example

[0037] A high-precision automatic positioning and inspection system for chips 1, basically as follows Figure 1 As shown, the system 1 includes: a testing machine, a storage warehouse 2, an intelligent car 3 and a server 4. The testing machine and the intelligent car 3 are both connected to the server 4 via remote communication.

[0038] Storage warehouse 2: used to store multiple boxes 5 loaded with several chips to be tested; the storage unit of the box 5 is loaded with several layers of wafers; the box 5 is provided with an electronic tag, which is associated with and stores the ID information of the wafers in the box 5; after the wafers are stored in a box 5, the server 4 will bind the chip product ID with the box 5, and by scanning the electronic tag, the chip product ID in the box 5 can be obtained. The database of the server 4 is configured with product parameters, test procedures and product ID information corresponding to all chip products to be tested.

[0039] The storage warehouse 2 includes a plurality of storage units for storing the material boxes 5, wherein the material boxes 5 are loaded with a plurality of layers of wafers and placed in the storage units, each storage unit is configured with a number, and each storage unit area is provided with a sensing device, and the sensing device includes but is not limited to an electronic tag, an IC card, an ID card, a magnetic stripe, a QR code, a bar code or a contact unit;

[0040] The server 4 issues an instruction to the smart car 3 to extract the material box 5 loaded with the specified chip product according to the production schedule;

[0041] Smart car 3: used to receive instructions from server 4 to transfer material box 5 between testing machine and storage warehouse 2; the smart car 3 extracts material box 5 loaded with specified chip products from storage warehouse 2 according to the induction recognition device and instructions. The induction recognition device is used to identify the induction device, so that the smart car 3 can accurately extract the material box 5 specified by the server 4.

[0042] Tester: used to realize automatic grabbing of wafers and automatic testing of chips on wafers; a material box 5 conveying mechanism and a material box 5 supporting platform are set on one side of the tester, and the material box 5 is transferred from the smart car 3 to the material box 5 supporting platform by the material box 5 conveying mechanism, and the tester realizes automatic grabbing of wafers on the material box 5 supporting platform; the material box 5 supporting platform is used to place the material box 5 and is provided with a reading device for reading the electronic tag to detect whether the material box 5 is placed correctly, including whether the position is correct and whether the material box 5 is extracted correctly. The reading device is a barcode scanner 18.

[0043] The testing machine includes a loading and unloading robot 12, a probe station 13, a test head module, a driving module, a controller 16, a display 17 and a barcode scanner 18; a material box positioning area 11 is provided on the support platform of the material box 5 for carrying and positioning the material box 5, and the barcode scanner 18 is arranged on one side of the material box positioning area 11 for scanning the electronic label on the material box 5 to detect whether the material box 5 is placed correctly; the test head module is located directly above the probe station 13, and the probe station 13 is used to carry the wafer. The probe station 13 is provided with a sensing unit for sensing the ID of each wafer; the ID information of the wafer is obtained by sensing the wafer through the sensing unit. The driving module is located below the probe station 13 and is used to drive the probe station 13 to move in the XYZR axis direction. The loading and unloading robot 12 is used to take out the wafer in the material box 5 located in the material box positioning area 11 and place it on the probe station 13. After the wafer test is completed, the wafer is taken out from the probe station 13 and placed back into the material box 5. The controller 16 is electrically connected to the loading and unloading robot 12, the probe station 13, the test head module, the driving module, the display 17 and the barcode scanning gun 18.

[0044] The test head module includes a test head 141, a test circuit board 142 and a probe card. The test circuit board 142 is mounted on the test head 141 and electrically connected to the probe card. The probe card contacts the chip product on the wafer to achieve conduction.

[0045] The driving module is a four-axis motion platform, which is used to realize the horizontal XY movement, Z lifting and R rotation of the wafer stage. The horizontal movement of the X-axis is mainly used to accurately move the wafer stage to the next test position to realize the feeding of the chip product to be tested; the Y-axis is mainly used for the line change of the chip product to be tested during the test process; the Z-axis mainly controls the contact and separation of the probe card and the chip product to be tested by controlling the height of the probe stage 13. In addition, the Z-axis can also control the precise focus of the CCD camera; the R-axis can rotate the wafer within a certain range, which is mainly used for angle adjustment to ensure that the arrangement of the chip to be tested on the probe stage 13 is in the same direction as the X or Y axis.

[0046] The controller 16 includes the following modules:

[0047] Retrieving test program module: used to retrieve product parameters and test programs of the chip product to be tested on the corresponding wafer from the database of server 4 through the identified ID information;

[0048] Test data storage module: used to automatically generate test data files and store test results during the test process;

[0049] The test data storage module includes the following submodules:

[0050] Position adjustment submodule: used to transfer the wafer to the probe station 13 through the loading and unloading robot 12, and move the probe station 13 to the position where the CCD camera collects images through the driving module, and then calculate the center position of the wafer and the arrangement direction of the chip products according to the collected images, and rotate the probe station 13 so that the arrangement direction of the chip products is in the same direction as the X-axis;

[0051] Test submodule: used to move the probe station 13 through the drive module during testing so that the probe card on the test head module can accurately contact the chip product on the wafer, start the test program to test, and obtain the test results; then decide whether to retest or make dot marks based on the test results, complete the test of a chip product, and then control the drive module to move the probe station 13 to the next chip product position in the same direction of the X-axis to continue testing. After testing a row of chip products, move to the Y-axis to change another row until all chip products are tested.

[0052] Comparison module: used to compare the test results with the standard results to obtain qualified or unqualified test results;

[0053] Map display module: used to display a map on the display 17 of the tester according to the product parameters and test procedures of the chip product to be tested; the map is a wafer graphic enlarged at a set ratio, and a plurality of rectangular frames corresponding to each chip on the wafer to be tested are arranged in the wafer graphic, and each rectangular frame is configured with a coded coordinate (X, Y), indicating the chip in the Xth row and the Yth column in the wafer to be tested; before the test, the rectangular frame is configured as a first color, and after the corresponding chip product is tested, it is configured to be divided into two colors according to the test result, and when the test result is passed, the rectangular frame displays green, otherwise it displays red;

[0054] Comparison module: It is also used to compare the test results of each chip product in the test data file with the color displayed on the map wafer graphic to see if they correspond; if the comparison is correct, the subsequent wafer unloading action will be carried out, otherwise the corresponding chip product will be reported as an error.

[0055] ID comparison and analysis module: used to compare the ID information with the ID information of the product that needs to be tested currently to determine whether they are consistent. If they are consistent, the test program is carried out. If they are inconsistent, it means that the wafer does not belong to the chip product that needs to be tested currently, and the wafer is removed.

[0056] The communication module is used to communicate with the server 4 , and is used to send the test data file, the Map corresponding to the test data file, and the comparison data obtained by the comparison module comparing the test data file with the Map to the server 4 .

[0057] Alarm prompt module: used to obtain the preset yield threshold, calculate the yield according to the test data file, compare and analyze the yield threshold with the calculated yield, and generate an alarm prompt message if they are inconsistent; it is also used to generate an alarm prompt message when the comparison data between the test data file and the Map is inconsistent; it is also used to generate an alarm prompt message when the analysis result of the ID comparison analysis module is inconsistent.

[0058] Embodiment 2

[0059] The difference between the second embodiment and the first embodiment is that the system 1 further includes:

[0060] Probe card storage 6: used to store various probe cards, which are stored in separate probe boxes, and the probe boxes are provided with electronic labels; Probe Card is a key component in semiconductor manufacturing and is used in the wafer test process. It serves as an interface between the tester and the chip under test (bare chip (Die)), and is mainly responsible for the preliminary measurement of electrical performance before chip segmentation and packaging, as well as screening of potential defective chips for subsequent packaging engineering. Moreover, it is a customized consumable device, and each product requires the supplier to customize the design based on the input information provided by the chip design company. Therefore, different wafers use different probe cards. The probe card cannot be placed in an environment that is too high or too low in temperature, cannot be placed in a humid environment, and cannot be placed in an environment with corrosive chemicals. The probe card needs to be placed in a room temperature, dry, clean environment, and stored in a sturdy container. Avoid severe vibration to avoid displacement of the needle tip position.

[0061] Smart car: used to receive server instructions to transfer the probe box between the test machine and the probe card storage; the smart car extracts the probe box loaded with the specified probe card from the probe card storage according to the induction recognition device and instructions. The induction recognition device is used to identify the electronic tag, so that the smart car can accurately extract the probe box specified by the server.

[0062] The material box support platform is used to place the installation position of the probe box, and is provided with a reading device for reading the electronic tag to detect whether the material box is placed correctly, including whether the position is correct and whether the probe box is extracted correctly. The electronic tag also stores the remaining test times and the last maintenance time of the probe card.

[0063] The material box support platform is provided with a probe box transport mechanism for transferring the probe box from the intelligent vehicle to the material box support platform, and for opening the probe box and transferring it to the test head module, or transferring it from the test head module to the probe box. The probe box transport mechanism is a manipulator.

[0064] Probe image acquisition module: used to obtain a probe image of the probe card by photographing the probe card through a camera when the probe box transport mechanism transfers the probe card;

[0065] Probe test times analysis module: used to obtain the remaining test times of the probe card, and to obtain the actual measured number of chip products of each wafer according to the test file of each wafer. When the test program is started for testing, if the test fails, it will be retested. If it passes, it will be marked once, and if it fails, it will be marked as the number of retests + 1, so the actual measured number can be obtained. And the remaining test times are updated according to the actual measured number, and the actual measured number and the remaining test times are written into the electronic label of the probe box. That is, the server database stores the corresponding data records.

[0066] Probe maintenance analysis module: used to calculate the number of maintenance analysis inspections of the probe card in the remaining time according to the remaining number of tests (for example, the probe card needs to be inspected a total of 5 times in the subsequent time), and then calculate the specific number of inspections for photographing and analyzing the probe card (for example, the 200,000th time, a maintenance inspection and analysis is required), and when the calculated specific number of inspections is reached, the probe card is photographed by the probe image acquisition module to obtain a probe image of the probe card, and the offset degree of the probe card needle tip is predicted by the preset neural network model analysis, and the offset degree includes the horizontal reference offset value; if the offset degree reaches the preset threshold, a maintenance reminder message is generated according to the current time; the neural network model adopts a convolutional neural network.

[0067] Inspection times optimization module: used to generate maintenance time trend analysis charts based on maintenance reminder information, last maintenance time, and historical data, and estimate the next maintenance time; and according to the time threshold from receiving maintenance reminder information and completing maintenance, analyze the next maintenance time to calculate the time length, and then analyze the remaining number of probe card tests until the next maintenance based on the time length and the average detection speed of the probe card. It is also used to optimize the number of maintenance analysis checks of the probe maintenance analysis module according to the remaining number of tests. The purpose is to detect the probe card just when it reaches its limit, reduce the number of maintenance analysis checks, and avoid the probe card detection delaying the detection efficiency of the chip product.

[0068] Usually a probe card needs regular maintenance to ensure that it achieves the expected effect. Each probe card needs to be checked for position reference and horizontal reference value after about 25,000 uses, and after a shorter number of uses, all probes need to be replaced after about 250,000 uses. The general standard maintenance procedures include chemical cleaning (probe card needles will be attached to some contaminants after a period of use, such as foreign debris, dust, etc.), adjustment of horizontal reference and position reference, etc. After removing the probe card for adjustment or cleaning each time, it must be cleaned with special agents and dried to ensure the electronic performance of the probe card.

[0069] If the probe tip position is offset after a period of use, it may cause contact disconnection and short circuit, and damage the protective layer around the pad; if it is contaminated or the horizontal reference is deviated, it may cause high impedance, contact short circuit, high leakage current, inconsistent parameter measurement, signal and power conduction failure, etc. These problems will lead to a decrease in test yield and cause unnecessary losses. Therefore, the probe card should be regularly maintained to avoid these problems as much as possible and minimize the losses.

[0070] The above is only an embodiment of the present invention. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicality of the patent. The protection scope required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A high-precision automatic chip positioning and inspection system, characterized in that: include: Testing machines, storage warehouses, smart cars and servers; Storage warehouse: used to store multiple boxes loaded with several chips to be tested; The storage unit of the material box is loaded with several layers of wafers; the material box is provided with an electronic tag, and the electronic tag is associated with and stores the ID information of the wafers in the material box; Smart car: used to receive server instructions to transfer and transport the material boxes between the testing machine and the storage warehouse; Tester: used to realize automatic grabbing of wafers and automatic testing of chips on wafers; a material box conveying mechanism and a material box supporting platform are arranged on one side of the tester, and the material box is transferred from the intelligent trolley to the material box supporting platform through the material box conveying mechanism, and the tester realizes automatic grabbing of wafers on the material box supporting platform; The material box support platform is used to place the material box and is provided with a reading device for reading the electronic tag; the testing machine includes the following modules: Retrieving test program module: used to retrieve product parameters and test programs of the chip product to be tested on the corresponding wafer from the server through the identified ID information; Test data storage module: used to automatically generate test data files and store test results during the test process; Comparison module: used to compare the test results with the standard results to obtain qualified or unqualified test results; A map display module is used to display a map on the display of the tester according to the product parameters and test procedures of the chip product to be tested; the map is a wafer graphic enlarged at a set ratio, and a plurality of rectangular frames corresponding to each chip on the wafer to be tested are arranged in the wafer graphic, and each rectangular frame is configured with a coded coordinate (X, Y), indicating the chip in the Xth row and the Yth column in the wafer to be tested; before the test, the rectangular frame is configured as a first color, and after the corresponding chip product is tested, it is configured to be divided into two colors according to the test result, and when the test result is passed, the rectangular frame displays green, otherwise it displays red; Comparison module: It is also used to compare the test results of each chip product in the test data file with the color displayed on the map wafer graphic to see if they correspond; if the comparison is correct, the subsequent wafer unloading action will be carried out, otherwise the corresponding chip product will be reported as an error.

2. A chip high-precision automatic positioning and inspection system according to claim 1, characterized in that: The testing machine includes a loading and unloading robot, a probe station, a test head module, a drive module, a controller, a display and a barcode scanner; a material box positioning area is provided on the material box support platform for carrying and positioning the material box, and the barcode scanner is arranged on one side of the material box positioning area for scanning the electronic label on the material box to detect whether the material box is placed correctly; the test head module is located directly above the probe station, the probe station is used to carry the wafer, and the drive module is located below the probe station for driving the probe station to move in the XYZR axis direction. The loading and unloading robot is used to take out the wafer in the material box located in the material box positioning area and place it on the probe station. After the wafer test is completed, the wafer is taken away from the probe station and put back into the material box. The controller is electrically connected to the loading and unloading robot, the probe station, the test head module, the drive module, the display and the barcode scanner.

3. A chip high-precision automatic positioning and inspection system according to claim 2, characterized in that: The test head module includes a test machine head, a test circuit board and a probe card. The test circuit board is mounted on the test machine head and electrically connected to the probe card. The probe card contacts the chip product on the wafer to achieve conduction.

4. The high-precision automatic chip positioning and inspection system according to claim 3, characterized in that: The test data storage module includes the following submodules: Position adjustment submodule: used to transfer the wafer to the probe table through the loading and unloading robot, and move the probe table to the position where the CCD camera collects images through the driving module, and then calculate the center position of the wafer and the arrangement direction of the chip products according to the collected images, and rotate the probe table so that the arrangement direction of the chip products is in the same direction as the X-axis; Test submodule: It is used to move the probe station through the drive module during testing so that the probe card on the test head module can accurately contact the chip product on the wafer, start the test program to test, and obtain the test results; then decide whether to retest or make dot marks based on the test results, complete the test of a chip product, and then control the drive module to move the probe station to the next chip product position in the same direction of the X-axis to continue testing. After testing a row of chip products, move to the Y-axis to change another row until all chip products are tested.

5. The high-precision automatic chip positioning and inspection system according to claim 1, characterized in that: The storage warehouse includes a plurality of storage units for storing material boxes, wherein the material boxes are loaded with a plurality of layers of wafers and placed in the storage units, each storage unit is configured with a number, and each storage unit area is provided with a sensing device, wherein the sensing device includes but is not limited to an electronic tag, an IC card, an ID card, a magnetic stripe, a QR code, a bar code or a contact unit; The server issues instructions to the smart car to extract a material box loaded with a specified chip product according to the production schedule; The smart car extracts a material box loaded with a specified chip product from a storage warehouse according to the sensing identification device and instructions.

6. The high-precision automatic chip positioning and inspection system according to claim 2, characterized in that: The probe station of the test machine is provided with a sensing unit for sensing the ID of each wafer; the ID information of the wafer is obtained by sensing the wafer through the sensing unit, and the controller includes the following modules: ID comparison and analysis module: used to compare the ID information with the ID information of the product that needs to be tested currently to determine whether they are consistent. If they are consistent, the test program is carried out. If they are inconsistent, it means that the wafer does not belong to the chip product that needs to be tested currently, and the wafer is removed.

7. A chip high-precision automatic positioning and inspection system according to claim 6, characterized in that: The test machine is also provided with a communication module, which is used to communicate with the server and send the test data file, the Map corresponding to the test data file, and the comparison data obtained by comparing the test data file with the Map by the comparison module to the server.

8. The high-precision automatic chip positioning and inspection system according to claim 7, characterized in that: The server includes the following modules: Alarm prompt module: used to obtain the preset yield threshold, calculate the yield according to the test data file, compare and analyze the yield threshold with the calculated yield, and generate an alarm prompt message if they are inconsistent; it is also used to generate an alarm prompt message when the comparison data between the test data file and the Map is inconsistent; it is also used to generate an alarm prompt message when the analysis result of the ID comparison analysis module is inconsistent.

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