Server mainboard stress simulation method and device and electronic equipment

Abstract

The invention relates to the technical field of computers, and discloses a server mainboard stress simulation method and device and electronic device.The method comprises the steps that according to an original design document, physical characteristics of all entity devices on a simulation server mainboard are determined; according to the in-board maximum word size of the original design document and the physical characteristics of each entity device, the bit number and word size of each entity device are adjusted to obtain the target bit number of each entity device; in the original design document, the target bit number of each entity device is adjusted to the center position of the entity device, so that a target design document of the simulation server mainboard is obtained; according to the target design document of the simulation server mainboard, stress simulation of the simulation server mainboard is carried out to obtain a stress simulation result of the simulation server mainboard. By adjusting the device bit number in the design document to a proper size and adjusting the device bit number to the center position of the entity device, automatic and efficient generation of the mainboard design document is realized, and a foundation is laid for improving stress simulation efficiency and accuracy.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a server motherboard stress simulation method, device and electronic equipment. Background Art

[0002] At present, during the production and assembly process of server motherboards, the circuit boards inside electronic products are prone to deformation under stress. Excessive deformation will cause cracking and damage of components on the circuit board, cracking of solder balls, and warping of circuits, which will seriously affect the performance of the server motherboard. Therefore, in the design of server motherboards, it is generally necessary to perform stress simulation on the layout of the main components of the motherboard.

[0003] In related technologies, in order to ensure the stress simulation effect of the server motherboard, technical personnel usually provide motherboard design documents, manually adjust the position numbers of major components to the center of the entity in the motherboard design, and classify and highlight the position numbers and position information of major components, which helps to better understand the structure and layout of the motherboard during the stress simulation process, so as to carry out stress simulation work.

[0004] However, since structural stress simulation requires simulation of different motherboard designs, technicians need to provide multiple motherboard design documents. In addition, server motherboards are large in scale and have many components, which can easily be screened out and missed, which is not conducive to ensuring the efficiency and accuracy of stress simulation. Summary of the invention

[0005] The present application provides a server motherboard stress simulation method, device and electronic equipment to solve the defects that the motherboard design documents provided by the related technology cannot guarantee the stress simulation efficiency and accuracy.

[0006] The first aspect of the present application provides a server motherboard stress simulation method, comprising:

[0007] Obtaining the original design document of the simulation server mainboard and the maximum font size of the original design document on the mainboard;

[0008] Determining the physical characteristics of each physical device on the simulation server mainboard according to the original design document;

[0009] According to the maximum font size in the board of the original design document and the physical characteristics of each physical device, the font size of the bit number of each physical device is adjusted to obtain the target bit number of each physical device;

[0010] In the original design document, the target bit number of each physical device is adjusted to the center position of the physical device to obtain the target design document of the simulation server motherboard;

[0011] According to the target design document of the simulated server mainboard, a stress simulation of the simulated server mainboard is performed to obtain a stress simulation result of the simulated server mainboard.

[0012] In an optional implementation, adjusting the font size of the bit number of each physical component according to the maximum font size in the board of the original design document and the physical characteristics of each physical component to obtain the target bit number of each physical component includes:

[0013] Generating a plurality of text block fonts according to a size relationship between a maximum font size in a board of the original design document and a preset target font size;

[0014] For any of the physical devices, selecting a target text block font of the physical device from the plurality of text block fonts according to the physical characteristics of the physical device;

[0015] According to the target text block font, the font size of the bit number of the physical device is adjusted to obtain the target bit number of each of the physical devices.

[0016] In an optional implementation, for any of the physical devices, selecting a target text block font of the physical device from the plurality of text block fonts according to the physical characteristics of the physical device includes:

[0017] Close the design layer in the original design document and only keep the target device bit number layer;

[0018] Screening the bit numbers of physical devices on the target device bit number layer to obtain a device bit number screening result;

[0019] Determine the design file frame range of the target device bit number layer according to the range coordinates represented by the device bit number screening result;

[0020] Generate a device bit number list of the target device bit number layer according to the device bit number screening result within the board frame range of the design file;

[0021] Circularly extracting device numbers from the device number list; wherein the device numbers correspond to physical devices one by one;

[0022] For any extracted device number, according to the unique identifier of the physical device corresponding to the device number, determine the device rotation angle and device mirror information of the physical device corresponding to the device number;

[0023] According to the device rotation angle and device mirror information of the physical device, correct the device rotation angle of the physical device to obtain a device target rotation angle of the physical device;

[0024] Determining physical frame coordinate information of the physical device according to a device target rotation angle of the physical device;

[0025] Determining a device size value of the physical device according to the physical frame coordinate information of the physical device;

[0026] According to the device size value, selecting a target text block font of the physical device from the plurality of text block fonts;

[0027] The physical characteristics of the physical device include a device rotation angle, device mirror information and a device size value of the physical device.

[0028] In an optional implementation manner, in the original design document, the target bit number of each of the physical devices is adjusted to the center position of the physical device to obtain the target design document of the simulation server motherboard, including:

[0029] Determining the center position coordinates of the physical device according to the physical frame coordinate information of the physical device;

[0030] In the original design document, according to the center position coordinates of each physical device, the target bit number of each physical device is adjusted to the center position of the physical device to obtain the target design document of the simulation server motherboard.

[0031] In an optional implementation, performing stress simulation of the simulated server mainboard according to the target design document of the simulated server mainboard includes:

[0032] Obtaining stress simulation requirements of the simulation server motherboard;

[0033] According to the stress simulation requirements, calling the stress simulation file generation script;

[0034] Based on the stress simulation file generation script, a target stress access file of the simulation server mainboard is generated according to the target design document of the simulation server mainboard and the stress simulation file standard file;

[0035] The stress simulation of the simulation server mainboard is performed according to the target stress access file of the simulation server mainboard.

[0036] In an optional implementation, the script is generated based on the stress simulation file, and the target stress access file of the simulation server motherboard is generated according to the target design document of the simulation server motherboard and the stress simulation file standard file, including:

[0037] Based on the stress simulation file generation script, determine the stress simulation access file content display requirements of the simulation server motherboard;

[0038] According to the stress simulation file standard file and the stress simulation access file content display requirements of the simulation server motherboard, the target content in the target design document is highlighted to obtain the target stress access file of the simulation server motherboard;

[0039] Wherein, the target content at least includes information of the device to be stressed for simulation.

[0040] In an optional embodiment, the method further includes:

[0041] The file name of the target stress access file of the simulation server mainboard is determined according to the device classification information and board information represented by the target design document of the simulation server mainboard.

[0042] A second aspect of the present application provides a server motherboard stress simulation device, comprising:

[0043] An acquisition module, used to acquire the original design document of the simulation server mainboard and the maximum font size of the original design document on the mainboard;

[0044] A determination module, used to determine the physical characteristics of each entity device on the simulation server mainboard according to the original design document;

[0045] A font size adjustment module, used for adjusting the font size of the bit number of each physical device according to the maximum font size in the board of the original design document and the physical characteristics of each physical device, so as to obtain the target bit number of each physical device;

[0046] A position adjustment module, used for adjusting the target bit number of each of the physical devices to the center position of the physical device in the original design document, so as to obtain a target design document of the simulation server motherboard;

[0047] The simulation module is used to perform stress simulation of the simulation server mainboard according to the target design document of the simulation server mainboard to obtain the stress simulation result of the simulation server mainboard.

[0048] A third aspect of the present application provides an electronic device, comprising: at least one processor and a memory;

[0049] The memory stores computer-executable instructions;

[0050] The at least one processor executes the computer-executable instructions stored in the memory, so that the at least one processor performs the method described in the first aspect and various possible designs of the first aspect.

[0051] A fourth aspect of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions. When a processor executes the computer-executable instructions, the method described in the first aspect and various possible designs of the first aspect are implemented.

[0052] The technical solution of this application has the following advantages:

[0053] The present application provides a server motherboard stress simulation method, device and electronic device, the method comprising: obtaining the original design document of the simulated server motherboard and the maximum font size in the original design document; determining the physical characteristics of each entity device on the simulated server motherboard according to the original design document; adjusting the font size of the bit number of each entity device according to the maximum font size in the original design document and the physical characteristics of each entity device to obtain the target bit number of each entity device; in the original design document, adjusting the target bit number of each entity device to the center position of the entity device to obtain the target design document of the simulated server motherboard; performing stress simulation of the simulated server motherboard according to the target design document of the simulated server motherboard to obtain the stress simulation result of the simulated server motherboard. The method provided by the above scheme realizes the automatic and efficient generation of the motherboard design document by adjusting the device bit number in the design document to an appropriate size and adjusting it to the center position of the entity device, laying a foundation for improving the efficiency and accuracy of stress simulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technical descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0055] Figure 1 This is a schematic diagram of the structure of the server motherboard stress simulation system based on the embodiment of the present application;

[0056] Figure 2 A schematic diagram of a process flow of a server motherboard stress simulation method provided in an embodiment of the present application;

[0057] Figure 3 A schematic flow chart of an exemplary server motherboard stress simulation method provided in an embodiment of the present application;

[0058] Figure 4 A schematic flow chart of another exemplary server motherboard stress simulation method provided in an embodiment of the present application;

[0059] Figure 5 A schematic diagram of the structure of a server motherboard stress simulation device provided in an embodiment of the present application;

[0060] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0061] The above drawings have shown clear embodiments of the present application, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0063] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the following embodiments, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0064] With the development of cloud computing applications, informatization has gradually covered all areas of society. People's daily work and life are increasingly communicated through the Internet, the amount of network data is also increasing, and the performance requirements for servers are also higher. However, during the production and assembly of server motherboards (such as the assembly and connection process between circuit boards and other components of electronic equipment) and reliability testing (such as roller testing, drop testing, etc.), the circuit boards inside electronic products are prone to deformation under stress. Excessive deformation can cause cracking and damage of components on the circuit board, cracking of solder balls, and warping of circuits, which will seriously affect the performance of the server motherboard and easily cause a lot of design rework and economic losses. Therefore, in the PCB design stage, the layout of the main components of the PCB board is carried out for stress simulation, and unreasonable layouts are promptly reminded, and PCB designers are guided to adjust the PCB layout, component positions, board selection, etc. to achieve the best structural performance. Avoiding problems caused by unreasonable design is a very important part of PCB design. For PCB design engineers, how to adjust the position numbers of some important components in the PCB design manuscript to the center of the entity, and classify the position numbers and position information of the main components and highlight different colors to generate a PDF document and pass it to the structural stress engineer is a very time-consuming, labor-intensive and inaccurate task.

[0065] In the related technology, the current PCB design software Cadence does not support automatic adjustment of device numbers to the center of the device. Engineers can only adjust manually and manually filter the device information to be exported, and then manually highlight the color and distinguish the existing color of the original package geometry / assembly layer, and then export the PDF file. In addition, since structural stress simulation requires simulation of different devices, PCB engineers need to provide multiple documents. Since the server motherboard is large in scale and has many devices, it is easy to miss the screening, which is time-consuming, labor-intensive and inaccurate.

[0066] In view of the above problems, the embodiment of the present application provides a server motherboard stress simulation method, device and electronic device, the method comprising: obtaining the original design document of the simulated server motherboard and the maximum font size in the original design document; determining the physical characteristics of each entity device on the simulated server motherboard according to the original design document; adjusting the font size of the bit number of each entity device according to the maximum font size in the original design document and the physical characteristics of each entity device to obtain the target bit number of each entity device; in the original design document, adjusting the target bit number of each entity device to the center position of the entity device to obtain the target design document of the simulated server motherboard; performing stress simulation of the simulated server motherboard according to the target design document of the simulated server motherboard to obtain the stress simulation result of the simulated server motherboard. The method provided by the above scheme realizes the automatic and efficient generation of the motherboard design document by adjusting the device bit number in the design document to an appropriate size and adjusting it to the center position of the entity device, laying a foundation for improving the efficiency and accuracy of stress simulation.

[0067] The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0068] First, the structure of the server motherboard stress simulation system on which this application is based is described:

[0069] The server motherboard stress simulation method, device and electronic device provided in the embodiments of the present application are suitable for generating motherboard design documents for server motherboard stress simulation. Figure 1 The figure is a schematic diagram of the structure of the server motherboard stress simulation system based on the embodiment of the present application, which mainly includes a server motherboard, a data acquisition device and a server motherboard stress simulation device. The data acquisition device is used to use the server motherboard as a simulated server motherboard, and collect its original design document and the maximum font size in the original design document, and then send the collected data to the server motherboard stress simulation device. The server motherboard stress simulation device is used to generate a target design document based on the obtained data, and perform stress simulation of the server motherboard based on the target design document.

[0070] The embodiment of the present application provides a server motherboard stress simulation method for generating a motherboard design document for use in server motherboard stress simulation to improve the efficiency and accuracy of subsequent stress simulation. The execution subject of the embodiment of the present application is an electronic device, such as a server, a desktop computer, a laptop computer, a tablet computer, and other electronic devices that can be used for server motherboard stress simulation.

[0071] like Figure 2 FIG. 1 is a flow chart of a server motherboard stress simulation method provided in an embodiment of the present application, and the method includes:

[0072] Step 201, obtaining the original design document of the simulation server mainboard and the maximum font size of the original design document.

[0073] Among them, the maximum font size in the original design document is actually the maximum font size of the device position number. The original design document is provided by the design engineer of the simulation server motherboard (PCB board). In the original design document, the position numbers of the physical devices are different in size, and the position numbers are used to identify the locations of the physical devices (components).

[0074] Step 202, determining the physical characteristics of each entity device on the simulation server mainboard according to the original design document.

[0075] The physical characteristics of the entity device at least include information such as its installation position on the simulation server mainboard and its own size.

[0076] Step 203, adjusting the font size of the bit number of each physical component according to the maximum font size in the original design document and the physical characteristics of each physical component, so as to obtain the target bit number of each physical component.

[0077] Specifically, the font size adjustment strategy for the target bit number can be determined based on the size relationship between the maximum font size in the board and the preset target font size, and then according to the determined font size adjustment strategy for the target bit number and the physical characteristics of each physical device, the bit number font size of each physical device is adjusted to obtain the target bit number of each physical device.

[0078] Step 204, in the original design document, adjust the target bit number of each physical device to the center position of the physical device to obtain the target design document of the simulated server motherboard.

[0079] It should be noted that the center position of the physical device is the actual center position of the main components on the PCB board. In PCB design, adjusting the bit numbers of important components to the entity will help structural stress engineers better understand the structure and layout of the PCB board, so as to perform stress simulation and improve the reliability and performance of the server motherboard.

[0080] Step 205 , performing stress simulation of the simulated server mainboard according to the target design document of the simulated server mainboard to obtain a stress simulation result of the simulated server mainboard.

[0081] Specifically, for the stress simulation process of the simulated server motherboard, a finite element model (FiniteElement Model, referred to as: FEM) is first established. Professional CAD software or finite element analysis software is used to import the target design document of the simulated server motherboard and create a finite element model. The model should include the geometry, material properties and boundary conditions of the motherboard. Then define the material properties, that is, assign material properties such as elastic modulus, Poisson's ratio, etc. to each component (component) in the model. These properties can be obtained from the material database or measured based on the actual material. According to the actual situation, determine the type of load (such as gravity, thermal expansion, etc.) and boundary conditions (such as fixed support, constraints, etc.) applied to the motherboard. This information can be determined by experimental data, design requirements or experience. Divide the finite element model into appropriate mesh units to ensure accurate simulation of the mechanical behavior of the motherboard. The quality and density of the mesh have an important influence on the accuracy of the simulation results. Run the finite element analysis solver to calculate the stress distribution and deformation of the motherboard under given loads and boundary conditions. Analyze the stress results obtained by solving and determine the stress concentration area, maximum stress value and deformation on the motherboard. Visualization tools can be used to intuitively display the results. Based on the stress simulation results, evaluate whether the motherboard design meets the requirements. If there is stress concentration or excessive deformation, you can consider design optimization, such as changing the shape of the component, adding support or strengthening the structure. Verify and repeat: Simulate the optimized design again to verify the improvement effect. If necessary, repeat the optimization and verification steps until the design requirements are met. Finally, based on the simulation results, evaluate the reliability and durability of the motherboard, and provide corresponding reports and suggestions.

[0082] On the basis of the above embodiments, since the server mainboard includes a large number of components and the target sizes of the bit numbers of different components are different, in order to ensure the accuracy of the target bit numbers of each physical device, as an implementable method, in one embodiment, according to the maximum font size in the board of the original design document and the physical characteristics of each physical device, the bit number font size of each physical device is adjusted to obtain the target bit number of each physical device, including:

[0083] Step 2031, generating a plurality of text block fonts according to the size relationship between the maximum font size in the original design document and the preset target font size;

[0084] Step 2032, for any physical device, select a target text block font of the physical device from a plurality of text block fonts according to the physical characteristics of the physical device;

[0085] Step 2033, adjusting the font size of the bit number of each physical device according to the target text block font to obtain the target bit number of each physical device.

[0086] For example, when the preset target font size is 58, the size comparison function can be used to determine the size relationship between the maximum font size (maxTextBlock) in the board and 58. If the font size is smaller than 58, then 6 new text block fonts are automatically created based on the maxTextBlock size by adding +1, +2, +3, +4, +5, +6 (the width of a single character in the design unit of the silk-screen font, the height of a single character in the design unit, the spacing between text lines in the design unit, the spacing between continuous characters in the design unit, and the design unit width of the stroke used to draw the character are set according to the current process requirements in the industry); otherwise, 6 new text block fonts are automatically created based on the maxTextBlock size by adding -0, -1, -2, -3, -4, -5.

[0087] Further, in one embodiment, the design layer in the original design document can be closed, and only the target device bit number layer is retained; the bit number of the physical device is screened on the target device bit number layer to obtain the device bit number screening result; the design file frame range of the target device bit number layer is determined according to the range coordinates represented by the device bit number screening result; according to the device bit number screening result within the design file frame range, a device bit number list of the target device bit number layer is generated; the device bit number is extracted from the device bit number list in a loop; wherein the device bit number corresponds to the physical device one-to-one; for any extracted device bit number, according to the physical device unique identifier corresponding to the device bit number, the device rotation angle and device mirror information of the physical device corresponding to the device bit number are determined; according to the device rotation angle and device mirror information of the physical device, the device rotation angle of the physical device is corrected to obtain the device target rotation angle of the physical device; according to the device target rotation angle of the physical device, the physical frame coordinate information of the physical device is determined; according to the physical frame coordinate information of the physical device, the device size value of the physical device is determined; according to the device size value, the target text block font of the physical device is screened from a number of text block fonts.

[0088] The physical characteristics of the physical device include a device rotation angle, device mirror information, and a device size value of the physical device.

[0089] It should be noted that the target device number layer includes the UA1 layer and the UA2 layer. The UA1 layer refers to Res des / assembly_top (top layer device number layer), package geometry / assembly_top (top layer device physical border layer), and boardgepmetry / design_outline (PCB board outer border); the UA2 layer refers to Res des / assembly_bottom (bottom layer device number layer), package geometry / assembly_bottom (botton layer device physical border layer), and boardgepmetry / design_outline (PCB board outer border).

[0090] Furthermore, the center position coordinates of the physical device can be determined based on the physical border coordinate information of the physical device; in the original design document, the target position number of each physical device is adjusted to the center position of the physical device based on the center position coordinates of each physical device to obtain the target design document of the simulated server motherboard.

[0091] Specifically, close all design layers of the design draft; open the UA1 layer and the UA2 layer, and filter the font text; obtain the range coordinates of the design file frame, the lower left: (leftx, lefty) and the upper right (rigX, rigY) Box is recorded as ((leftx, lefty), (rigX, rigY)); obtain all text information within the BOX range, recorded as textlist; loop to get the elements of textlist recorded as item, obtain the device unique identifier corresponding to the item recorded as symboldbid, obtain the rotation angle rotation of the device according to symboldbid, and whether it is mirrored is recorded as mirrottype (NO, which means no, indicating that the device is on the top layer. Yes means yes, indicating that the device is on the bottom layer); if mirrottype = NO, and if rotation is equal to 0 degrees or 180 degrees, reassign rotation to 0 degrees, otherwise assign rotation to = 90 degrees; if mirrottype =yes, and if rotation is equal to 0 degrees or 180 degrees, reassign rotation = 0 degrees, otherwise assign rotation = 180 degrees; get the entity border size of symboldbid and record it as symbolsize, the corresponding lower left horizontal coordinate is marked as ax, the vertical coordinate ay, the upper right horizontal coordinate is marked as bx, and the upper right vertical coordinate is marked as by, then the center coordinate of the device is (ax+bx / 2ay+by / 2); take bx-ax=hor, by-ay=ver; record the minimum edge value of the entity as size, if hor>ver, then size=ver, otherwise size=hor; call module setRefdesChangeTextBlock, adjust the font size of item, and obtain the unique identifier newtextid (target number) of the new device bit number; move newtextid to the center coordinate of the device (ax+bx / 2ay+by / 2) to fully adapt all device bit numbers in the PCB board to the center of the device.

[0092] Among them, Figure 3 As shown, it is a flow chart of an exemplary server motherboard stress simulation method provided in an embodiment of the present application, such as Figure 3 The method shown is as follows Figure 2 An exemplary implementation of the method shown is shown, and the implementation principles of the two are the same and will not be repeated here.

[0093] Exemplarily, if the maximum font size in the original design document is smaller than the preset target font size, the target text block font screening logic of the physical device is as follows:

[0094] A. If size (device size value) <= 100, then adjust the font size of textdbid to maxTextBlock+1, that is, the font size of the target text block is maxTextBlock+1;

[0095] B. If size>100 and size<=300, then adjust the font size of textdbid to maxTextBlock+2;

[0096] C. If size>300 and size<=500, then adjust the font size of textdbid to maxTextBlock+3;

[0097] D. If size>500 and size<=700, then adjust the font size of textdbid to maxTextBlock+4;

[0098] E. If size>700 and size<=1000, then adjust the font size of textdbid to maxTextBlock+5;

[0099] F. If size>1000, then adjust the font size of textdbid to maxTextBlock+6.

[0100] If the maximum font size in the original design document is not less than the preset target font size, the target text block font screening logic of the physical device is as follows:

[0101] A. If size <= 100, then adjust the font size of textdbid to maxTextBlock-5;

[0102] B. If size>100 and size<=300, then adjust the font size of textdbid to maxTextBlock-4;

[0103] C. If size>300 and size<=500, then adjust the font size of textdbid to maxTextBlock-3;

[0104] D. If size>500 and size<=700, then adjust the font size of textdbid to maxTextBlock-2;

[0105] E. If size>700 and size<=1000, then adjust the font size of textdbid to maxTextBlock-1;

[0106] F. If size>1000, then adjust the font size of textdbid to maxTextBlock-0.

[0107] On the basis of the above embodiments, in order to further facilitate the subsequent stress simulation operation and further improve the stress simulation efficiency, as Figure 4 As shown, it is a flow chart of another exemplary server motherboard stress simulation method provided in an embodiment of the present application. As an implementable manner, in one embodiment, according to the target design document of the simulated server motherboard, the stress simulation of the simulated server motherboard is performed, including:

[0108] Step 2051, obtaining the stress simulation requirement of the simulation server motherboard;

[0109] Step 2052, calling a stress simulation file generation script according to the stress simulation requirement;

[0110] Step 2053, based on the stress simulation file generation script, generating a target stress access file of the simulation server mainboard according to the target design document of the simulation server mainboard and the stress simulation file standard file;

[0111] Step 2054: perform stress simulation of the simulation server mainboard according to the target stress access file of the simulation server mainboard.

[0112] It should be noted that the stress simulation file generation script can be called in the preset script library. The preset script library has preset stress simulation file generation scripts that can meet various stress simulation requirements. The stress simulation requirements include which components on the PCB board currently need to be stress simulated. Therefore, by calling the stress simulation file generation script corresponding to the stress simulation requirements of the simulation server motherboard, the target stress access file corresponding to the target design document is generated based on the stress simulation file generation script in accordance with the data format of the stress simulation file standard file, so as to obtain the target stress access file that meets the stress simulation requirements of the simulation server motherboard.

[0113] Specifically, according to the type of device to be stressed, the device list can be automatically obtained in the target design document of the simulation server motherboard, and stored in symboltoplist and symbolbotlist for subsequent use. Specifically, all levels can be closed; UA1 and UA2 levels can be opened; symbols (component symbols) can be filtered; the package list of symboltype type in all boards can be obtained, and the top layer and bottom layer can be distinguished as resultlist = {symboltoplistsymbolbotlist}. Finally, a script is generated based on the stress simulation file, and the target stress access file of the simulation server motherboard is generated according to the design information of the device to be simulated represented by the resultlist and the standard file of the stress simulation file.

[0114] Specifically, in one embodiment, the file name of the target stress access file of the simulation server mainboard may also be determined according to the device classification information and board information represented by the target design document of the simulation server mainboard.

[0115] Among them, the device classification information at least includes the device type, such as resistors, capacitors, chips and connectors. The devices in the same target stress access file generally have the same stress simulation requirements or the same device type. For example, all the devices in a target stress access file are connectors. The board information at least includes the board model.

[0116] Specifically, in one embodiment, a script can be generated based on the stress simulation file to determine the stress simulation access file content display requirements of the simulation server motherboard; according to the stress simulation file standard file and the stress simulation access file content display requirements of the simulation server motherboard, the target content in the target design document is highlighted to obtain the target stress access file of the simulation server motherboard.

[0117] Among them, the target content at least includes the device information to be stress simulated, and highlighting the target content is specifically highlighting, such as highlighting all connectors on the board (device information to be stress simulated) so that the connector information can be quickly located when the connector stress simulation is performed subsequently.

[0118] Specifically, you can record the PDF export script provided by Cadence, record the standard template as standard.scr; automatically create an empty script in the project root directory and record it as exportpdf.scr; obtain the negative film UA1 and UA2; refer to the standard template (stress simulation file standard file) format, and print it to exportpdf.scr in a loop; the exported file name is replaced by the parameter variable filename; the standard template negative film name is changed to UA1 and UA2; generate a new exportpdf.scr; use the call script command to directly execute the exportpdf.scr script information. After successful execution, a PDF file (target stress access file) with the file name filename is automatically generated in the same directory as the board file, and exportpdf.scr is deleted. That is, first define a function named GenerateScrFun, which accepts a parameter filename, which indicates the name of the PDF file to be generated. The function first reads the content of the standard template file standard.scr, replaces the FILENAME in it with the specified file name, and replaces UA1 and UA2 with the actual negative film name. Then, write the modified content to the newly created exportpdf.scr file. Next, use the subprocess.run function to execute the exportpdf.scr script to generate a PDF file (target stress access file). Finally, delete the exportpdf.scr file.

[0119] Specifically, the font colors of the top layer position number can be obtained and recorded as topcolor and botcolor respectively; according to the input requirements of the stress simulation file name, the exported file name is recorded as filename according to the device classification, board information and other organizational definitions; call the GetSymbolListByType module that automatically obtains the device list according to the device name to obtain the device lists toplist and botlist that need to be exported; if the topcolor and botcolor colors are not equal, the toplist device is automatically highlighted with the botcolor color, and the botlist device is automatically highlighted with the topcolor color, otherwise the toplist and botlist devices are highlighted with the average value of topcolor and botcolor, and then GenerateScrFun is directly called to generate a PDF file named filename; then the highlighted device is unhighlighted, and so on, until all the PCB information that needs to be exported is completed. In actual applications, engineers can directly obtain the generated PCB file information in the same directory as the PCB board file and provide it to stress simulation engineers.

[0120] The server motherboard stress simulation method provided by the embodiment of the present application obtains the original design document of the simulated server motherboard and the maximum font size in the original design document; according to the original design document, the physical characteristics of each entity device on the simulated server motherboard are determined; according to the maximum font size in the original design document and the physical characteristics of each entity device, the bit number font size of each entity device is adjusted to obtain the target bit number of each entity device; in the original design document, the target bit number of each entity device is adjusted to the center position of the entity device to obtain the target design document of the simulated server motherboard; according to the target design document of the simulated server motherboard, the stress simulation of the simulated server motherboard is performed to obtain the stress simulation result of the simulated server motherboard. The method provided by the above scheme realizes the automatic and efficient generation of the motherboard design document by adjusting the device bit number in the design document to an appropriate size and adjusting it to the center position of the entity device, laying a foundation for improving the efficiency and accuracy of stress simulation. In addition, according to the requirements of the structural stress simulation engineer, it can automatically classify and export multiple PCB file information named according to the naming rules after highlighting, saving manpower, improving work efficiency and improving the design quality of PCB boards.

[0121] An embodiment of the present application provides a server mainboard stress simulation device, which is used to execute the server mainboard stress simulation method provided in the above embodiment.

[0122] like Figure 5 , which is a schematic diagram of the structure of a server motherboard stress simulation device provided by an embodiment of the present application. The server motherboard stress simulation device 50 comprises: an acquisition module 501 , a determination module 502 , a font size adjustment module 503 , a position adjustment module 504 and a simulation module 505 .

[0123] Among them, the acquisition module is used to obtain the original design document of the simulation server mainboard and the maximum font size in the original design document; the determination module is used to determine the physical characteristics of each entity device on the simulation server mainboard according to the original design document; the font size adjustment module is used to adjust the bit number font size of each entity device according to the maximum font size in the original design document and the physical characteristics of each entity device to obtain the target bit number of each entity device; the position adjustment module is used to adjust the target bit number of each entity device to the center position of the entity device in the original design document to obtain the target design document of the simulation server mainboard; the simulation module is used to perform stress simulation of the simulation server mainboard according to the target design document of the simulation server mainboard to obtain the stress simulation result of the simulation server mainboard.

[0124] Regarding the server motherboard stress simulation device in this embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0125] The server motherboard stress simulation device provided in the embodiment of the present application is used to execute the server motherboard stress simulation method provided in the above embodiment. Its implementation method and principle are the same and will not be repeated here.

[0126] An embodiment of the present application provides an electronic device for executing the server mainboard stress simulation method provided in the above embodiment.

[0127] like Figure 6 FIG. 6 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device 60 includes: at least one processor 61 and a memory 62 .

[0128] The memory stores computer-executable instructions; at least one processor executes the computer-executable instructions stored in the memory, so that the at least one processor executes the server motherboard stress simulation method provided in the above embodiment.

[0129] The electronic device provided in the embodiment of the present application is used to execute the server motherboard stress simulation method provided in the above embodiment. Its implementation method and principle are the same and will not be repeated here.

[0130] An embodiment of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the server motherboard stress simulation method provided in any of the above embodiments is implemented.

[0131] The storage medium containing computer executable instructions provided in the embodiment of the present application can be used to store computer executable instructions of the server motherboard stress simulation method provided in the aforementioned embodiment. Its implementation method and principle are the same and will not be repeated here.

[0132] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0133] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0134] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0135] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to perform some steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program code.

[0136] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A server motherboard stress simulation method, characterized in that: include: Obtaining the original design document of the simulation server mainboard and the maximum font size of the original design document on the mainboard; Determining the physical characteristics of each physical device on the simulation server mainboard according to the original design document; According to the maximum font size in the board of the original design document and the physical characteristics of each physical device, the font size of the bit number of each physical device is adjusted to obtain the target bit number of each physical device; In the original design document, the target bit number of each of the physical devices is adjusted to the center position of the physical device to obtain the target design document of the simulation server motherboard; According to the target design document of the simulated server mainboard, a stress simulation of the simulated server mainboard is performed to obtain a stress simulation result of the simulated server mainboard.

2. The method according to claim 1, characterized in that The adjusting the font size of the bit number of each physical device according to the maximum font size in the board of the original design document and the physical characteristics of each physical device to obtain the target bit number of each physical device includes: Generating a plurality of text block fonts according to a size relationship between a maximum font size in a board of the original design document and a preset target font size; For any of the physical devices, selecting a target text block font of the physical device from the plurality of text block fonts according to the physical characteristics of the physical device; According to the target text block font, the font size of the bit number of the physical device is adjusted to obtain the target bit number of each of the physical devices.

3. The method according to claim 2, characterized in that The step of selecting a target text block font of any of the physical devices from the plurality of text block fonts according to the physical characteristics of the physical device includes: Close the design layer in the original design document and only keep the target device bit number layer; Screening the bit numbers of physical devices on the target device bit number layer to obtain a device bit number screening result; Determine the design file frame range of the target device bit number layer according to the range coordinates represented by the device bit number screening result; Generate a device bit number list of the target device bit number layer according to the device bit number screening result within the board frame range of the design file; Circularly extracting device numbers from the device number list; wherein the device numbers correspond to physical devices one by one; For any extracted device number, according to the unique identifier of the physical device corresponding to the device number, determine the device rotation angle and device mirror information of the physical device corresponding to the device number; According to the device rotation angle and device mirror information of the physical device, correct the device rotation angle of the physical device to obtain a device target rotation angle of the physical device; Determining physical frame coordinate information of the physical device according to a device target rotation angle of the physical device; Determining a device size value of the physical device according to the physical frame coordinate information of the physical device; According to the device size value, selecting a target text block font of the physical device from the plurality of text block fonts; The physical characteristics of the physical device include a device rotation angle, device mirror information and a device size value of the physical device.

4. The method according to claim 3, characterized in that In the original design document, the target bit number of each physical device is adjusted to the center position of the physical device to obtain the target design document of the simulation server motherboard, including: Determining the center position coordinates of the physical device according to the physical frame coordinate information of the physical device; In the original design document, according to the center position coordinates of each physical device, the target bit number of each physical device is adjusted to the center position of the physical device to obtain the target design document of the simulation server motherboard.

5. The method according to claim 1, characterized in that: The step of performing stress simulation of the simulated server mainboard according to the target design document of the simulated server mainboard includes: Obtaining stress simulation requirements of the simulation server motherboard; According to the stress simulation requirements, calling the stress simulation file generation script; Based on the stress simulation file generation script, a target stress access file of the simulation server mainboard is generated according to the target design document of the simulation server mainboard and the stress simulation file standard file; The stress simulation of the simulation server mainboard is performed according to the target stress access file of the simulation server mainboard.

6. The method according to claim 5, characterized in that The generating script based on the stress simulation file generates a target stress access file of the simulation server mainboard according to the target design document of the simulation server mainboard and the stress simulation file standard file, including: Based on the stress simulation file generation script, determine the stress simulation access file content display requirements of the simulation server motherboard; According to the stress simulation file standard file and the stress simulation access file content display requirements of the simulation server motherboard, the target content in the target design document is highlighted to obtain the target stress access file of the simulation server motherboard; Wherein, the target content at least includes information of the device to be stressed for simulation.

7. The method according to claim 5, characterized in that The method further comprises: The file name of the target stress access file of the simulation server mainboard is determined according to the device classification information and board information represented by the target design document of the simulation server mainboard.

8. A server motherboard stress simulation device, characterized in that: include: An acquisition module, used to acquire the original design document of the simulation server mainboard and the maximum font size of the original design document on the mainboard; A determination module, used to determine the physical characteristics of each entity device on the simulation server mainboard according to the original design document; A font size adjustment module, used for adjusting the font size of the bit number of each physical device according to the maximum font size in the board of the original design document and the physical characteristics of each physical device, so as to obtain the target bit number of each physical device; A position adjustment module, used for adjusting the target bit number of each of the physical devices to the center position of the physical device in the original design document, so as to obtain a target design document of the simulation server motherboard; The simulation module is used to perform stress simulation of the simulation server mainboard according to the target design document of the simulation server mainboard to obtain the stress simulation result of the simulation server mainboard.

9. An electronic device, characterized in that: include: at least one processor and memory; The memory stores computer-executable instructions; The at least one processor executes the computer-executable instructions stored in the memory, so that the at least one processor performs the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and when a processor executes the computer-executable instructions, the method according to any one of claims 1 to 7 is implemented.

Images