Cleaning container, preparation device and wafer cleaning process

Abstract

The invention discloses a cleaning container, a preparation device and a wafer cleaning process, the cleaning container comprises a cleaning body and a cleaning liquid nozzle used for washing a to-be-cleaned part, the cleaning liquid nozzle is arranged on the inner wall surface of the cleaning body, the cleaning container is further provided with an air exhaust assembly, and the air exhaust assembly is arranged on the inner wall surface of the cleaning body. The air exhaust assembly comprises an air exhaust channel arranged on the inner wall face of the cleaning body and a negative pressure mechanism communicating with the air exhaust channel, and the magnitude of negative pressure provided by the negative pressure mechanism corresponds to the spraying speed of the cleaning liquid nozzle. The negative pressure generated by the negative pressure mechanism can rapidly pump and drain the gaseous cleaning liquid generated when the to-be-cleaned part is washed, and the gaseous cleaning liquid remaining on the to-be-cleaned part can be effectively reduced. The negative pressure can be set according to the spraying speed of the cleaning liquid nozzle so as to ensure that the negative pressure mechanism can extract the gaseous cleaning liquid in the cleaning container, and the situation that the gaseous cleaning liquid volatilizes everywhere after cleaning and pollutes the overall environment of the cleaning container is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer cleaning, and in particular relates to a cleaning container, a preparation device, and a wafer cleaning process. Background Art

[0002] In the prior art, for wafer manufacturing, wafer plating and wafer cleaning processes run through the entire production process, so in these two processes, preventing air from contacting oxygen in the preparation process is an important means to ensure the working effect. In the wafer preparation process, the wafer needs to be cleaned after almost every process.

[0003] During the cleaning process, part of the cleaning waste liquid will be thrown onto the liquid accumulation partition, collected by the liquid accumulation partition and then discharged; while another part of the tiny droplets may not be collected by the liquid accumulation partition, and fall into other areas below, causing environmental pollution.

[0004] Therefore, the problem of small waste liquid splashing during wafer cleaning needs to be solved urgently. Summary of the invention

[0005] The technical problem to be solved by the present invention is to overcome the defect of splashing of fine waste liquid during wafer cleaning in the prior art, and to provide a cleaning container, a preparation device, and a wafer cleaning process.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] A cleaning container, comprising a cleaning body and a cleaning liquid nozzle for flushing a piece to be cleaned, wherein the cleaning liquid nozzle is arranged on the inner wall surface of the cleaning body.

[0008] An exhaust component is also provided on the cleaning container, and the exhaust component includes an exhaust channel arranged on the inner wall surface of the cleaning body and a negative pressure mechanism connected to the exhaust channel. The negative pressure provided by the negative pressure mechanism corresponds to the injection speed setting of the cleaning liquid nozzle.

[0009] In the present technical solution, this structural form is adopted. By setting an exhaust component on the cleaning container, and the exhaust channel connects the cleaning container with the negative pressure mechanism, the negative pressure generated by the negative pressure mechanism can quickly exhaust the gaseous cleaning liquid generated when the parts to be cleaned are rinsed, which can effectively reduce the residual gaseous cleaning liquid on the parts to be cleaned and improve the cleaning effect. In addition, the injection speed of the cleaning liquid nozzle determines the evaporation speed of the cleaning liquid. It can be seen that the negative pressure mechanism provides the exhaust channel with the power to extract the evaporated cleaning liquid, that is, the gaseous cleaning liquid. Therefore, the negative pressure can be set according to the injection speed of the cleaning liquid nozzle to ensure that the negative pressure mechanism can extract the gaseous cleaning liquid in the cleaning container, avoiding the gaseous cleaning liquid after cleaning from volatilizing everywhere and polluting the overall environment of the cleaning container. In addition, the negative pressure provided by the negative pressure mechanism can realize the rapid extraction of gaseous cleaning liquid, thereby improving the cleaning efficiency and speeding up the cleaning speed.

[0010] Preferably, there are a plurality of the exhaust channels, and the plurality of the exhaust channels are arranged at intervals along the circumferential direction of the inner wall surface of the cleaning body.

[0011] In the present technical solution, this structural form is adopted, and the spaced arrangement of multiple exhaust channels can ensure that during the cleaning process, the gaseous cleaning liquid in every corner and part of the cleaning container can be effectively exhausted, avoiding dead corner residue, ensuring the integrity of the extraction of the exhaust component, and avoiding the problem of poor extraction effect in specific areas. In addition, the setting of multiple exhaust channels can increase the overall flow area of ​​the exhaust channel, improve the extraction efficiency of the negative pressure mechanism for the gaseous cleaning liquid, and quickly remove the gaseous cleaning liquid from the cleaning container. At the same time, multiple exhaust channels extract the gaseous cleaning liquid at the same time, which can speed up the extraction speed of the gaseous cleaning liquid, thereby improving the cleaning speed. In addition, the arrangement of multiple exhaust channels can minimize the gaseous cleaning liquid in the cleaning container and pollute the overall environment of the cleaning container.

[0012] Preferably, the air extraction component is opened 100ms-400ms in advance of the spraying of the cleaning liquid nozzle.

[0013] In the present technical solution, this structural form is adopted to form an advance amount of negative pressure in the cleaning container cavity. By starting the vacuum assembly in advance, a negative pressure environment can be quickly established to prevent the negative pressure mechanism from not responding quickly enough when it is started, causing part of the gaseous cleaning liquid to evaporate everywhere and pollute the overall environment of the cleaning container.

[0014] Preferably, the negative pressure of the negative pressure mechanism is in the range of 30Kpa-60Kpa.

[0015] In this technical solution, this structural form is adopted to further limit the negative pressure size of the negative pressure mechanism, which can generate a strong suction capacity, speed up the extraction speed of the gaseous cleaning liquid, quickly extract the gaseous cleaning liquid generated when the parts to be cleaned are rinsed, effectively reduce the residual gaseous cleaning liquid, and improve the extraction effect and cleaning speed. In addition, the negative pressure size is within the range of 30Kpa-60Kpa, which can be set according to the injection speed of the cleaning liquid nozzle, flexibly control the suction effect, and meet the needs of different cleaning scenarios.

[0016] Preferably, a liquid collecting groove for collecting cleaning liquid is further provided on the peripheral side of the inner wall surface of the cleaning body, and the liquid collecting groove is extended in the horizontal direction toward the direction of the central axis of the cleaning container.

[0017] In this technical solution, by adding a liquid collecting tank and adopting the above-mentioned structural form, the cleaning liquid on the to-be-cleaned parts can be collected more effectively. The design of the liquid collecting tank allows the cleaning liquid to quickly flow into and concentrate in the liquid collecting tank, avoiding splashing and scattering of the cleaning liquid during the cleaning process, which is conducive to keeping the inside of the cleaning container clean. In addition, by increasing the receiving area of ​​the liquid collecting tank, the collection of the cleaning liquid is further achieved, ensuring the integrity of the cleaning liquid collection.

[0018] Preferably, the air extraction channel is arranged below the liquid collecting tank along the height direction of the cleaning container.

[0019] In the present technical solution, this structural form is adopted to further define the positional relationship between the liquid collecting tank and the air extraction channel to ensure the integrity and comprehensiveness of the extraction of the air extraction component. In addition, the air extraction channel is located below the liquid, which can more completely extract the gaseous cleaning liquid that is transformed into when the cleaning liquid splashes due to gravity, thereby avoiding contamination of the overall environment of the cleaning container.

[0020] A preparation device, comprising any one of the cleaning containers described above, the preparation device being used to prepare a wafer on a plating head, and the preparation device further comprising an electroplating container;

[0021] When the preparation device is in working state, the cleaning container and the electroplating container are connected. Along the height direction of the preparation device, the cleaning container is arranged above the electroplating container and covers the electroplating container. The interiors of the cleaning container and the electroplating container are communicated.

[0022] This technical solution provides a sealable preparation device for electroplating and cleaning in high-end integrated circuit manufacturing. The wafer is placed in the preparation device so that the cleaning and electroplating of the wafer are carried out in a closed container in sequence, avoiding contact with air during the process from electroplating to cleaning, which may cause oxidation of the wafer. At the same time, this structural form ensures that the wafer is cleaned while also ensuring that the exhaust component can extract the gaseous cleaning liquid in the cleaning container, avoiding the gaseous cleaning liquid after cleaning the wafer from dripping into the electroplating container, overcoming the difficulties of small droplets being difficult to collect and irregular splashing paths, and solving the problem of pollution and waste of electroplating solution in the electroplating container caused by irregular splashing of small droplets in the cleaning container.

[0023] Preferably, the magnitude of the negative pressure provided by the negative pressure mechanism corresponds to the rotation speed setting of the plating head.

[0024] In the present technical solution, this structural form is adopted to adjust the negative pressure provided by the negative pressure mechanism according to the rotation speed of the plating head, thereby ensuring the integrity of the gaseous cleaning liquid extracted by the vacuum component in the cleaning container while ensuring the cleaning of the wafer.

[0025] Preferably, the preparation device further comprises a storage container, and the storage container is connected to the vacuum assembly and / or the electroplating container via a pipeline.

[0026] In the present technical solution, by adding a storage container, on the one hand, the storage container can promptly receive the waste liquid generated during the extraction process, and the vacuum assembly guides the waste liquid to the storage container through a pipeline, ensuring that the waste liquid is effectively stored and avoiding waste liquid overflow or environmental pollution; on the other hand, it ensures the normal operation of the preparation device during electroplating operations and ensures the normal progress of each process.

[0027] A wafer cleaning process, wherein the wafer cleaning process adopts any one of the preparation devices described above, and the wafer cleaning process comprises the following steps:

[0028] S1, the plating head drives the wafer into the cleaning container;

[0029] S2. According to the spray speed of the cleaning liquid nozzle, the vacuum component is turned on and the negative pressure provided by the vacuum component is adjusted;

[0030] S3, opening the cleaning liquid nozzle to rinse the wafer, while the plating head keeps rotating;

[0031] S4. Discharge the collected cleaning liquid out of the cleaning container.

[0032] In the present technical solution, this structural form is adopted, which not only realizes efficient cleaning of the wafer and removal of contaminants, but also ensures that the negative pressure mechanism can extract the gaseous cleaning liquid in the cleaning container, thereby avoiding the gaseous cleaning liquid after cleaning from evaporating everywhere and polluting the overall environment of the cleaning container.

[0033] Preferably, step S4 also includes the following steps:

[0034] The cleaning liquid is discharged out of the cleaning container through the liquid collecting tank and / or the air extraction component.

[0035] In the present technical solution, this structural form is adopted to ensure that gaseous or liquid cleaning fluids can be effectively processed, ensuring the cleanliness of the interior of the cleaning container in preparation for the next wafer cleaning.

[0036] The positive and progressive effects of the present invention are:

[0037] 1. The cleaning container is provided with an exhaust assembly on the cleaning container, and the exhaust channel connects the cleaning container with the negative pressure mechanism. The negative pressure generated by the negative pressure mechanism can quickly exhaust the gaseous cleaning liquid generated when the parts to be cleaned are rinsed, which can effectively reduce the residual gaseous cleaning liquid on the parts to be cleaned and improve the cleaning effect. In addition, the negative pressure can be set according to the injection speed of the cleaning liquid nozzle to ensure that the negative pressure mechanism can extract the gaseous cleaning liquid in the cleaning container, avoiding the volatilization of the gaseous cleaning liquid after cleaning and polluting the overall environment of the cleaning container. In addition, the negative pressure provided by the negative pressure mechanism can quickly exhaust the gaseous cleaning liquid, thereby improving the cleaning efficiency and speeding up the cleaning speed.

[0038] 2. The preparation device provides a sealable preparation device for electroplating and cleaning in high-end integrated circuit manufacturing. The wafer is placed in the preparation device so that the cleaning and electroplating of the wafer are carried out in a closed container in sequence, avoiding contact with air during the process from electroplating to cleaning, which may cause oxidation of the wafer. At the same time, this structural form ensures that the wafer is cleaned while also ensuring that the exhaust component can extract the gaseous cleaning liquid in the cleaning container, avoiding the gaseous cleaning liquid after cleaning the wafer from dripping into the electroplating container, overcoming the difficulties of small droplets being difficult to collect and irregular splashing paths, and solving the problem of pollution and waste of electroplating solution in the electroplating container caused by irregular splashing of small droplets in the cleaning container.

[0039] 3. The wafer cleaning process not only achieves efficient wafer cleaning and removal of contaminants, but also ensures that the negative pressure mechanism can extract the gaseous cleaning liquid in the cleaning container, thereby preventing the gaseous cleaning liquid after cleaning from evaporating everywhere and polluting the overall environment of the cleaning container. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic structural diagram of a cleaning container according to Embodiment 1 of the present invention.

[0041] Figure 2 It is a structural schematic diagram of the preparation device of Example 2 of the present invention (the negative pressure mechanism is hidden).

[0042] Figure 3 Schematic diagram of the working state of the wafer in the preparation device according to the second embodiment of the present invention (the negative pressure mechanism is hidden).

[0043] Figure 4 This is a flowchart of a wafer cleaning process according to the third embodiment of the present invention.

[0044] Description of reference numerals:

[0045] Cleaning container 100

[0046] Cleaning the body 11

[0047] Washing fluid nozzle 12

[0048] Liquid collection tank 13

[0049] Air extraction assembly 200

[0050] Air extraction channel 21

[0051] Negative pressure mechanism 22

[0052] Electroplating container 300

[0053] Preparation device 400

[0054] Plating head 41

[0055] Wafer 42

[0056] Storage container 43

[0057] Waste liquid storage container 431

[0058] Plating solution storage container 432 DETAILED DESCRIPTION

[0059] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0060] [Example 1]

[0061] like Figure 1 As shown, Embodiment 1 discloses a cleaning container 100 .

[0062] The cleaning container 100 includes a cleaning body 11 and a cleaning liquid nozzle 12 for flushing the objects to be cleaned, and the cleaning liquid nozzle 12 is arranged on the inner wall surface of the cleaning body 11 to spray the cleaning liquid to the objects to be cleaned.

[0063] At the same time, an exhaust component 200 is also provided on the cleaning container 100, and the exhaust component 200 includes an exhaust channel 21 arranged on the inner wall surface of the cleaning body 11 and a negative pressure mechanism 22 connected to the exhaust channel 21. The negative pressure provided by the negative pressure mechanism 22 corresponds to the injection speed setting of the cleaning liquid nozzle 12.

[0064] In this embodiment, this structural form is adopted, by arranging a vacuum assembly 200 on the cleaning container 100, and the vacuum channel 21 connects the cleaning container 100 with the negative pressure mechanism 22. The negative pressure generated by the negative pressure mechanism 22 can quickly exhaust the gaseous cleaning liquid generated when the parts to be cleaned are rinsed, which can effectively reduce the gaseous cleaning liquid remaining on the parts to be cleaned and improve the cleaning effect.

[0065] In addition, the injection speed of the cleaning liquid nozzle 12 determines the evaporation speed of the cleaning liquid. It can be seen that the negative pressure mechanism 22 provides the vacuum channel 21 with power to extract the evaporated cleaning liquid, that is, the gaseous cleaning liquid. Therefore, the negative pressure can be set according to the injection speed of the cleaning liquid nozzle 12 to ensure that the negative pressure mechanism 22 can extract the gaseous cleaning liquid in the cleaning container 100, thereby avoiding the gaseous cleaning liquid after cleaning from volatilizing everywhere and polluting the overall environment of the cleaning container 100.

[0066] In addition, the negative pressure provided by the negative pressure mechanism 22 can achieve rapid extraction of the gaseous cleaning liquid, thereby improving the cleaning efficiency and accelerating the cleaning speed.

[0067] The air extraction component 200 is opened 100ms-400ms in advance of the spraying of the cleaning liquid nozzle 12 .

[0068] In the present embodiment, this structural form is adopted in order to form an advance amount of negative pressure in the cavity of the cleaning container 100. By starting the vacuum assembly 200 in advance, a negative pressure environment can be quickly established to prevent the negative pressure mechanism 22 from not responding quickly enough when it is started, causing part of the gaseous cleaning liquid to evaporate and pollute the overall environment of the cleaning container 100.

[0069] Furthermore, in the present embodiment, the spraying speed of the cleaning liquid nozzle 12 is 5 m / s-20 m / s, so the negative pressure of the negative pressure mechanism 22 is in the range of 30 Kpa-60 Kpa.

[0070] In this embodiment, this structural form is adopted to further limit the negative pressure size of the negative pressure mechanism 22, which can generate a strong suction capacity, accelerate the extraction speed of the gaseous cleaning liquid, quickly extract the gaseous cleaning liquid generated when the parts to be cleaned are rinsed, effectively reduce the residual gaseous cleaning liquid, and improve the extraction effect and cleaning speed. In addition, the negative pressure size is within the range of 30Kpa-60Kpa, which can be set according to the injection speed of the cleaning liquid nozzle 12, flexibly control the suction effect, and meet the needs of different cleaning scenes.

[0071] Furthermore, in this embodiment, the cleaning liquid nozzle 12 sprays the workpiece to be cleaned in an oblique manner, and preferably, the angle between the direction of the cleaning liquid nozzle 12 toward the workpiece to be cleaned and the direction of the central axis of the workpiece to be cleaned is in the range of 67°-73°.

[0072] The angle between the direction of the exhaust channel 21 toward the object to be cleaned and the inner wall surface of the cleaning container 100 is not restricted. As long as the gaseous cleaning liquid inside the cleaning container 100 can be exhausted and the residual gaseous cleaning liquid on the object to be cleaned can be reduced, it falls within the protection scope of the present application.

[0073] Preferably, there are multiple exhaust channels 21, and the multiple exhaust channels 21 are arranged at intervals along the inner wall surface of the cleaning body 11 in the circumferential direction. The interval arrangement of the multiple exhaust channels 21 can ensure that during the cleaning process, the gaseous cleaning liquid in each corner and part of the cleaning container 100 can be effectively exhausted, avoiding dead corner residue, ensuring the integrity of the extraction of the exhaust component 200, and avoiding the problem of poor extraction effect in specific areas. In addition, the setting of multiple exhaust channels 21 can increase the overall flow area of ​​the exhaust channel 21, improve the extraction efficiency of the negative pressure mechanism 22 for the gaseous cleaning liquid, and quickly remove the gaseous cleaning liquid from the cleaning container 100. At the same time, the multiple exhaust channels 21 extract the gaseous cleaning liquid at the same time, which can speed up the extraction speed of the gaseous cleaning liquid, thereby improving the cleaning speed. In addition, the arrangement of the multiple exhaust channels 21 can maximize the avoidance of the gaseous cleaning liquid in the cleaning container 100 and pollute the overall environment of the cleaning container 100.

[0074] In this embodiment, the number of the exhaust channels 21 is 8, which are symmetrically distributed on the cleaning body 11. In other embodiments, the number and arrangement of the exhaust channels 21 can be set as needed to extract other cleaning liquids.

[0075] Preferably, a liquid collecting tank 13 for collecting cleaning liquid is provided on the inner wall of the cleaning body 11, that is, the liquid collecting tank 13 is provided in an annular structure and extends along the inner wall of the cleaning container 100. Moreover, the liquid collecting tank 13 extends in the horizontal direction toward the central axis of the cleaning container 100.

[0076] In this embodiment, by adding a liquid collecting tank 13 and adopting the above-mentioned structure, the cleaning liquid on the to-be-cleaned parts can be collected more effectively. The design of the liquid collecting tank 13 allows the cleaning liquid to quickly flow into and be concentrated in the liquid collecting tank 13, avoiding splashing and scattering of the cleaning liquid during the cleaning process, which is conducive to keeping the inside of the cleaning container 100 clean. In addition, by increasing the receiving area of ​​the liquid collecting tank 13, the collection of the cleaning liquid is further achieved, ensuring the integrity of the cleaning liquid collection.

[0077] Furthermore, a drainage hole is provided on the wall surface of the cleaning body 11 near the liquid collecting tank 13 to ensure the normal discharge of the cleaning liquid and prevent the cleaning liquid from accumulating on the liquid collecting tank 13 and overflowing to pollute the internal environment of the cleaning container 100 .

[0078] Preferably, the air extraction channel 21 is disposed below the liquid collecting tank 13 along the height direction of the cleaning container 100 .

[0079] In this embodiment, this structural form is adopted to further define the positional relationship between the liquid collecting tank 13 and the air extraction channel 21 to ensure the integrity and comprehensiveness of the extraction of the air extraction component 200. In addition, the air extraction channel 21 is located below the liquid, which can more completely extract the gaseous cleaning liquid that is transformed into when the cleaning liquid splashes due to gravity, thereby avoiding contamination of the overall environment of the cleaning container 100.

[0080] Furthermore, in the present embodiment, the exhaust channels 21 are arranged on the same horizontal plane along the vertical height of the cleaning container 100 . Specifically, the exhaust channels 21 are at the same distance from the opening of the cleaning container 100 .

[0081] [Example 2]

[0082] like Figure 2-Figure 3 As shown, Example 2 discloses a preparation device 400 including the cleaning container 100 of Example 1 above, and the preparation device 400 is used to prepare the wafer 42 on the plating head 41.

[0083] Furthermore, the preparation device 400 further includes an electroplating container 300 .

[0084] When the preparation device 400 is in working state, the cleaning container 100 and the electroplating container 300 are connected. Along the height direction of the preparation device 400, the cleaning container 100 is arranged above the electroplating container 300 and covers the electroplating container 300. The interiors of the cleaning container 100 and the electroplating container 300 are connected.

[0085] This embodiment provides a sealable preparation device 400 for integrated electroplating and cleaning in high-end integrated circuit manufacturing. The wafer 42 is placed in the preparation device 400, so that the cleaning and electroplating of the wafer 42 are carried out in a closed container, and the wafer 42 is prevented from being oxidized by contact with air during the process from electroplating to cleaning. At the same time, this structural form ensures that the wafer 42 is cleaned while also ensuring that the exhaust component 200 can extract the gaseous cleaning liquid in the cleaning container 100, avoiding the gaseous cleaning liquid after cleaning the wafer 42 from dripping into the electroplating container 300, overcoming the difficulties of small droplets being difficult to collect and irregular splashing paths, and solving the problem of pollution and waste of electroplating solution in the electroplating container 300 caused by irregular splashing of small droplets in the cleaning container 100.

[0086] Preferably, in this embodiment, the rotation speed of the wafer 42 driven by the plating head 41 is 100-200 rpm, so the negative pressure provided by the negative pressure mechanism 22 is set corresponding to the rotation speed of the plating head 41 .

[0087] In this embodiment, this structural form is adopted to adjust the negative pressure provided by the negative pressure mechanism 22 according to the rotation speed of the plating head 41, thereby ensuring the cleaning of the wafer 42 while ensuring the integrity of the gaseous cleaning liquid extracted from the cleaning container 100 by the vacuum component 200.

[0088] Preferably, the preparation device 400 further includes a storage container 43 , and the storage container 43 further includes a plating liquid storage container 432 and a waste liquid storage container 431 .

[0089] The waste liquid storage container 431 is connected to the exhaust assembly 200 through a pipeline. By adding the waste liquid storage container 431, the waste liquid generated during the extraction process can be received in time, and the exhaust assembly 200 guides the waste liquid to the waste liquid storage container 431 through the pipeline for condensation and precipitation treatment, ensuring that the waste liquid is effectively stored and avoiding waste liquid overflow or environmental pollution.

[0090] In addition, the plating solution storage container 432 is connected to the plating container 300 through a pipeline. When the plating work is performed, the plating solution circulates through the pipeline in the plating container 300 and the plating solution storage container 432. By providing the plating solution storage container 432, the normal operation of the preparation device 400 during the plating operation is guaranteed, and the normal progress of each process is guaranteed.

[0091] In other embodiments, the storage container 43 may be provided as needed, and only the plating liquid storage container 432 or only the waste liquid storage container 431 may be provided to meet the normal operation of the preparation device 400 .

[0092] [Example 3]

[0093] like Figure 4 As shown, Embodiment 3 discloses a cleaning process of a wafer 42, and the cleaning process of the wafer 42 adopts the preparation device 400 of Embodiment 2. The cleaning process of the wafer 42 includes the following steps:

[0094] S1, the plating head 41 drives the wafer 42 into the cleaning container 100: through the movement of the plating head 41, the wafer 42 is guided into the cleaning container 100 and is ready for cleaning;

[0095] S2. Adjust the negative pressure provided by the suction component 200: According to the spraying speed of the cleaning liquid nozzle 12, turn on the suction component 200 and adjust the negative pressure. The negative pressure can be adjusted as needed to ensure that the appropriate suction force ensures that the cleaning liquid is extracted and discharged;

[0096] S3, rinsing the wafer 42: Open the cleaning liquid nozzle 12 to rinse the wafer 42. While spraying the cleaning liquid, the plating head 41 drives the wafer 42 to rotate continuously. The cleaning liquid nozzle 12 is reasonably arranged to ensure that all areas on the surface of the wafer 42 are evenly rinsed to remove pollutants and impurities.

[0097] S4, draining the collected cleaning liquid: draining the cleaning liquid in the cleaning container 100 out of the cleaning container 100 through the drainage system. The collected cleaning liquid contains pollutants and impurities, and by draining the cleaning liquid, the cleaning container 100 is kept clean and prepared for the next cleaning.

[0098] In this embodiment, this structural form is adopted, which not only realizes efficient cleaning of the wafer 42 and removal of contaminants, but also ensures that the negative pressure mechanism 22 can extract the gaseous cleaning liquid in the cleaning container 100, thereby preventing the gaseous cleaning liquid after cleaning from evaporating everywhere and polluting the overall environment of the cleaning container 100.

[0099] Preferably, step S4 also includes the following steps:

[0100] The cleaning liquid is discharged out of the cleaning container 100 through the liquid collecting tank 13 and the air extraction assembly 200 .

[0101] In the present embodiment, this structural form is adopted to ensure that the gaseous or liquid cleaning fluid can be effectively processed, ensuring the cleanliness of the interior of the cleaning container 100, in preparation for the next cleaning of the wafer 42.

[0102] In other embodiments, the cleaning liquid may be discharged out of the cleaning container 100 only through the liquid collecting tank 13 or only through the air extraction assembly 200 , which may be specifically configured as required.

[0103] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A cleaning container, comprising a cleaning body and a cleaning liquid nozzle for flushing a piece to be cleaned, wherein the cleaning liquid nozzle is arranged on the inner wall surface of the cleaning body, characterized in that: An exhaust component is also provided on the cleaning container, and the exhaust component includes an exhaust channel arranged on the inner wall surface of the cleaning body and a negative pressure mechanism connected to the exhaust channel. The negative pressure provided by the negative pressure mechanism corresponds to the injection speed setting of the cleaning liquid nozzle.

2. The cleaning container according to claim 1, characterized in that: There are multiple air extraction channels, and the multiple air extraction channels are arranged at intervals along the circumferential direction of the inner wall surface of the cleaning body.

3. The cleaning container according to claim 1, characterized in that: The air extraction component is opened 100ms-400ms in advance of the spraying of the cleaning liquid nozzle.

4. The cleaning container according to claim 1, characterized in that: The negative pressure of the negative pressure mechanism is in the range of 30Kpa-60Kpa.

5. The cleaning container according to claim 1, characterized in that: A liquid collecting groove for collecting cleaning liquid is also provided on the peripheral side of the inner wall surface of the cleaning body, and the liquid collecting groove is extended in the horizontal direction toward the direction of the central axis of the cleaning container.

6. The cleaning container according to claim 5, characterized in that: The air extraction channel is arranged below the liquid collecting tank along the height direction of the cleaning container.

7. A preparation device, characterized in that: The preparation device comprises the cleaning container according to any one of claims 1 to 6, the preparation device is used to prepare the wafer on the plating head, and the preparation device also comprises an electroplating container; When the preparation device is in working state, the cleaning container and the electroplating container are connected. Along the height direction of the preparation device, the cleaning container is arranged above the electroplating container and covers the electroplating container. The interiors of the cleaning container and the electroplating container are communicated.

8. The preparation device according to claim 7, characterized in that: The magnitude of the negative pressure provided by the negative pressure mechanism corresponds to the rotation speed setting of the plating head.

9. The preparation device according to claim 7, characterized in that: The preparation device also includes a storage container, which is connected to the exhaust assembly and / or the electroplating container through a pipeline.

10. A wafer cleaning process, characterized in that: The wafer cleaning process adopts the preparation device according to any one of claims 7 to 9, and the wafer cleaning process comprises the following steps: S1, the plating head drives the wafer into the cleaning container; S2. According to the spray speed of the cleaning liquid nozzle, the vacuum component is turned on and the negative pressure provided by the vacuum component is adjusted; S3, opening the cleaning liquid nozzle to rinse the wafer, while the plating head keeps rotating; S4. Discharge the collected cleaning liquid out of the cleaning container.

11. The wafer cleaning process according to claim 10, characterized in that: Step S4 also includes the following steps: The cleaning liquid is discharged out of the cleaning container through the liquid collecting tank and / or the air extraction component.

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