Wafer processing device

Abstract

The invention belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer processing device which comprises a furnace tube, a loading and unloading area and an isolation door device, the loading and unloading area comprises a boat loading and unloading area and a wafer loading and unloading area which are connected through a communication area, the boat loading and unloading area is communicated with the furnace tube, the boat loading and unloading area comprises a first boat loading and unloading machine, and the isolation door device comprises a second boat loading and unloading machine. The first wafer boat loading and unloading machine is at least used for moving the wafer boat into or out of the furnace tube, the wafer loading and unloading area comprises a wafer loading and unloading machine, and the wafer loading and unloading machine is used for moving the wafer into or out of the wafer boat; and the isolation door device is arranged in the communication area, the isolation door device can isolate the wafer boat loading and unloading area from the wafer loading and unloading area, and the isolation door device can work, so that the wafer boat can flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the communication area. The isolation door device prevents by-products generated by reaction in the furnace tube from passing through the communication area, so that the risk that the by-products pollute the boat and wafers on the boat is reduced, and the yield of products is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor manufacturing equipment, and specifically relates to a wafer processing device. Background Art

[0002] The wafer processing device may include a connected furnace tube and a loading and unloading area. When the wafers on the first wafer boat in the loading and unloading area are moved into the furnace tube by a wafer boat elevator for heat treatment, the second wafer boat in the loading and unloading area can load wafers at a temporary storage position to improve production efficiency.

[0003] When the wafer processing on the first wafer boat is completed, the wafer boat elevator moves the first wafer boat out of the furnace tube, the wafer boat conveyor places the first wafer boat in a temporary storage position, and the wafer boat conveyor then conveys the second wafer boat to the wafer boat elevator, and the wafer boat elevator moves the second wafer boat into the furnace tube for heat treatment.

[0004] When the first wafer boat is moved out of the furnace tube, the reaction byproducts in the furnace tube will be ejected from the furnace tube due to the higher pressure in the furnace tube than in the loading and unloading area, contaminating the wafers on the second wafer boat. In addition, before and during the second wafer boat is moved from the temporary storage position into the furnace tube, the reaction byproducts on the first wafer boat will also spread to the second wafer boat, contaminating the wafers on the second wafer boat. Summary of the invention

[0005] The purpose of the present application is to provide a wafer processing device to reduce the risk of contamination of the wafer and improve the yield of the product.

[0006] In order to achieve the above object, the present application provides a wafer processing device, comprising:

[0007] Furnace pipes;

[0008] The loading and unloading area includes a wafer boat loading and unloading area and a wafer loading and unloading area connected via a connecting area, the wafer boat loading and unloading area is connected to the furnace tube, the wafer boat loading and unloading area includes a first wafer boat loader, the first wafer boat loader is at least used to move the wafer boat into or out of the furnace tube, and the wafer loading and unloading area includes a wafer loader, the wafer loader is at least used to move the wafer into or out of the wafer boat;

[0009] An isolation door device is arranged in the connecting area, and the isolation door device can isolate the crystal boat loading and unloading area and the wafer loading and unloading area, and the isolation door device can work so that the crystal boat can flow between the crystal boat loading and unloading area and the wafer loading and unloading area through the connecting area.

[0010] Optionally, the isolation door device can drive the wafer boat to move, so that the wafer boat can flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the connecting area.

[0011] Optionally, the isolation door device includes a first isolation door assembly, the first isolation door assembly includes a first isolation door and multiple crystal boat transfer mechanisms, each of the crystal boat transfer mechanisms is used to carry and move at least one crystal boat, the multiple crystal boat transfer mechanisms include a first crystal boat transfer mechanism and a second crystal boat transfer mechanism, the first crystal boat transfer mechanism and the second crystal boat transfer mechanism are distributed on a first side and a second side opposite to the first isolation door, at least the multiple crystal boat transfer mechanisms can rotate around a rotation center to form a first state and a second state, in the first state, the first crystal boat transfer mechanism is located in the crystal boat loading and unloading area, and the second crystal boat transfer mechanism is located in the wafer loading and unloading area, in the second state, the second crystal boat transfer mechanism is located in the crystal boat loading and unloading area, and the first crystal boat transfer mechanism is located in the wafer loading and unloading area.

[0012] Optionally, the wafer boat transfer mechanism includes a support seat, which is used to carry the wafer boat and move the carried wafer boat when rotating around the rotation center, the support seat of the first wafer boat transfer mechanism and the support seat of the second wafer boat transfer mechanism are connected by a connecting piece, the connecting piece is connected to the first isolation door, the connecting piece and the support seat are arranged on the same side of the first isolation door, the support seat, the connecting piece and the first isolation door can rotate synchronously around the rotation center, so that the multiple wafer boat transfer mechanisms can switch between the first state and the second state; and / or

[0013] The crystal boat transfer mechanism includes a crystal boat support and a support shaft, the crystal boat support is arranged on the support shaft, the support shaft is connected to the first isolation door, the crystal boat support can rotate around the support shaft to hold the crystal boat to carry the crystal boat, the crystal boat support can rotate around the support shaft to release the held crystal boat, and the crystal boat support, the support shaft and the first isolation door can synchronously rotate around the rotation center to move the held crystal boat and enable the multiple crystal boat transfer mechanisms to switch between the first state and the second state.

[0014] Optionally, the wafer boat support includes a plurality of wafer boat sub-supports, the support shaft includes a plurality of support sub-shafts, the wafer boat sub-support is arranged on the support sub-shafts, the support sub-shafts are connected to the first isolation door, and the wafer boat sub-support can rotate around the support sub-shafts;

[0015] The wafer boat support can rotate around the support rotation axis to hold the wafer boat to carry the wafer boat, including: the plurality of wafer boat sub-supports of the wafer boat support can rotate to gather and clamp the wafer boat to carry the wafer boat;

[0016] The wafer boat support can rotate about the support rotation axis to release the held wafer boat, which includes: the plurality of wafer boat sub-supports of the wafer boat support can rotate to be separated to release the clamped wafer boat.

[0017] Optionally, the wafer boat transfer mechanism includes the wafer boat support and the support shaft, and the wafer boat transfer mechanism is configured as follows:

[0018] Before the boat support, the support shaft and the first isolation door rotate around the rotation center to move the held boat, the boat support can rotate around the support shaft to hold the boat to carry the boat, and the boat support can rise to lift the held boat.

[0019] After the boat support, the support shaft and the first isolation door rotate around the rotation center to move the held boat, the boat support can be lowered to put down the held boat, and the boat support can be rotated around the support shaft to release the held boat.

[0020] Optionally, the first isolation door and the crystal boat transfer mechanism can rotate synchronously, and the first isolation door assembly also includes a seal, and when the first isolation door and the crystal boat transfer mechanism rotate, the seal forms a gap with the first isolation door, and when the first isolation door and the crystal boat transfer mechanism stop rotating, the seal seals the gap between the loading and unloading area and the first isolation door.

[0021] Optionally, the first isolation door is a multi-wing revolving door, the multi-wing revolving door includes at least three door wings, the at least three door wings include two main door wings and at least one auxiliary door wing, the two main door wings are connected to divide the first side and the second side of the first isolation door, and the at least one auxiliary door wing is located on the first side of the first isolation door and / or the second side of the first isolation door;

[0022] The angles between adjacent door wings are equal, and the wafer boat transfer mechanism is arranged one by one between adjacent door wings. The wafer boat transfer mechanism and the multi-wing revolving door can rotate around the rotation center to drive the wafer boat to flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the connecting area.

[0023] Optionally, the crystal boat loading and unloading area includes multiple functional sub-areas and / or the wafer loading and unloading area includes multiple functional sub-areas, isolation partitions are formed between adjacent door wings, and the multi-wing revolving door and the crystal boat transfer mechanism rotate around the rotation center so that each of the isolation partitions is connected to the functional sub-area in turn.

[0024] Optionally, the wafer processing device includes a plurality of the loading and unloading areas and a plurality of the furnace tubes, and the wafer boat loading and unloading areas are connected to the furnace tubes in a one-to-one correspondence.

[0025] Optionally, the isolation door device can be opened when the wafer boat passes through and closed after the wafer boat passes through.

[0026] Optionally, the isolation door device includes a second isolation door assembly;

[0027] The second isolation door assembly includes a second isolation door, and the second isolation door assembly includes a third state and a fourth state. In the third state, the second isolation door closes the communication area, and in the fourth state, the second isolation door opens the communication area; and / or

[0028] The second isolation door assembly includes a second wafer boat loader and unloader, which is arranged in the wafer boat loading and unloading area, and is used to move the wafer boat into the wafer loading and unloading area and close the connecting area, and the second wafer boat loader and unloader is used to move the wafer boat out of the wafer loading and unloading area.

[0029] Optionally, the second isolation door assembly includes the second isolation door, the furnace tube and the wafer loading and unloading area are arranged on the same side of the wafer boat loading and unloading area, and the second isolation door assembly includes a fifth state. In the fifth state, the second isolation door closes the connecting end between the furnace tube and the wafer boat loading and unloading area.

[0030] Optionally, the second isolation door assembly includes the second isolation door and a door driving mechanism, the door driving mechanism includes a door shaft and a crossbeam, the door shaft is rotatably arranged between the furnace tube and the wafer loading and unloading area, and the crossbeam connects the second isolation door and the door shaft.

[0031] Optionally, the furnace tube and the wafer boat loading and unloading area are arranged in a vertical direction, and the furnace tube and the wafer loading and unloading area are arranged on the same side of the wafer boat loading and unloading area. When loading and unloading the wafer boat, the first wafer boat loader and the second wafer boat loader drive the wafer boat to move in a vertical direction.

[0032] Optionally, the wafer processing device further comprises a transfer area and at least one conveying port, wherein the transfer area is arranged at one side of the wafer loading and unloading area, the transfer area is used to place a wafer box, the conveying port is arranged on a partition wall between the wafer loading and unloading area and the transfer area, the partition wall partially surrounds the wafer loader and unloader, the axial direction of the partition wall is parallel to the vertical direction, the conveying port is at least used for the wafers in the wafer box to pass through, the wafer loader and unloader is used to move the wafers in the wafer box into the wafer boat in the wafer loading and unloading area, and the wafer loader and unloader is used to move the wafers on the wafer boat into the wafer box in the transfer area, and a support assembly is arranged on the side of the partition wall away from the wafer loader and unloader, the support assembly comprises at least one wafer box support, and the wafer box support is used to carry the wafer box in the transfer area;

[0033] The support assembly includes n rows of crystal box supports arranged along the circumference of the isolation wall, and the at least one transmission port is arranged in n rows along the circumference of the isolation wall, n≥1, and the row position of each row of crystal box supports corresponds to the row position of each row of transmission ports.

[0034] Optionally, the isolation wall partially surrounds the wafer handler at equal distances, n≥2.

[0035] Optionally, among the n rows of crystal box supports, the mth row of crystal box supports includes a plurality of the crystal box supports and the mth row of crystal box supports is divided into i m Crystal box support unit, 1≤m≤n, i m ≥2, the crystal box support unit includes j m The crystal box support, j m ≥1, i m The crystal box support units are distributed along the vertical direction;

[0036] Among the n columns of transmission ports, the transmission ports in the mth column include j m The transmission ports in the mth column correspond to the column positions of the crystal box supports in the mth column, and the j transmission ports in the mth column correspond to the column positions of the crystal box supports in the mth column. m The transmission port is connected to the j m The positions of the crystal box brackets are distributed in the same manner;

[0037] The crystal box support in the mth column can move in a vertical direction so that any crystal box support unit of the crystal box support in the mth column is aligned with the transmission port in the mth column.

[0038] Optional, j m ≥2, in the m-th row of crystal box supports, the crystal box supports in any two adjacent crystal box support units are alternately arranged in the vertical direction.

[0039] The wafer processing device disclosed in the present application has the following beneficial effects:

[0040] The wafer processing device in the present application includes: a furnace tube, a loading and unloading area and an isolation door device. The loading and unloading area includes a wafer boat loading and unloading area and a wafer loading and unloading area connected via a connecting area. The wafer boat loading and unloading area is connected to the furnace tube. The wafer boat loading and unloading area includes a first wafer boat loader. The first wafer boat loader is at least used to move the wafer boat into or out of the furnace tube. The wafer loading and unloading area includes a wafer loader. The wafer loader is used to move the wafer into or out of the wafer boat. The isolation door device is arranged in the connecting area. The isolation door device can isolate the wafer boat loading and unloading area from the wafer loading and unloading area, and the isolation door device can work so that the wafer boat can flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the connecting area. Since the isolation door device is only opened briefly when the wafer boat passes through, the wafer boat can flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the connecting area. When no wafer boat passes through, the wafer boat loading and unloading area and the wafer loading and unloading area are separated by the isolation door device, blocking the by-products produced by the reaction in the furnace tube from passing through the connecting area, reducing the risk of by-products contaminating the wafer boat and the wafers on the wafer boat, and improving the product yield.

[0041] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0042] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0044] Figure 1 It is a front view schematic diagram of the wafer processing device in the first embodiment of the present application.

[0045] Figure 2 It is a top view schematic diagram of the wafer processing device in the first embodiment of the present application.

[0046] Figure 3 This is a schematic diagram of by-products in the furnace tube being ejected and contaminating the wafer.

[0047] Figure 4 This is a schematic diagram of byproduct diffusion contamination of the wafer.

[0048] Figure 5 is a schematic diagram of a contaminated wafer.

[0049] Figure 6 This is a schematic diagram of the wafer boat support holding the wafer boat in Example 1 of the present application.

[0050] Figure 7 This is a schematic diagram of the wafer boat support releasing the wafer boat in Example 1 of the present application.

[0051] Figure 8 This is a schematic diagram of the support base carrying the wafer boat in the first embodiment of the present application.

[0052] Fig. 9 This is a schematic diagram of the closing of the first isolation door in Example 1 of the present application.

[0053] Fig.10 This is a schematic diagram of the opening of the first isolation door in Example 1 of the present application.

[0054] Fig.11 This is a schematic diagram of the first isolation door assembly forming multiple isolation partitions in Example 1 of the present application.

[0055] Fig.12 It is a schematic diagram of a wafer processing device with multiple furnace tubes in Example 1 of the present application.

[0056] Fig.13 This is a schematic diagram of loading and unloading wafers by the first wafer box support unit in Example 1 of the present application.

[0057] Fig.14 This is a schematic diagram of loading and unloading wafers by the second wafer box support unit in Example 1 of the present application.

[0058] Fig.15 It is a front view schematic diagram of the wafer processing device in the second embodiment of the present application.

[0059] Fig.16 It is a top view schematic diagram of the wafer processing device in the second embodiment of the present application.

[0060] Description of reference numerals:

[0061] 100. Furnace pipe;

[0062] 200, crystal boat loading and unloading area; 201, temporary storage area; 210, first crystal boat loading and unloading machine;

[0063] 300. Wafer loading and unloading area; 310. Wafer loading and unloading machine;

[0064] 400, first isolation door assembly; 410, first isolation door; 411, door wing; 421, crystal boat bracket; 422, bracket shaft; 431, support seat; 432, connector; 440, sealing member;

[0065] 500, transfer area; 510, transmission port; 520, isolation wall;

[0066] 600, support assembly; 610, crystal box support unit; 611, crystal box support;

[0067] 700, second isolation door assembly; 710, second isolation door; 720, door drive mechanism; 721, door shaft; 722, crossbeam; 730, second wafer boat loader and unloader;

[0068] 800, crystal boat transfer device;

[0069] 901, first wafer boat; 902, second wafer boat; 903, wafer box. DETAILED DESCRIPTION

[0070] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0071] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0072] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0073] Embodiment 1

[0074] See also Figure 1 and Figure 2 As shown, the wafer processing device in this embodiment includes: a furnace tube 100, a loading and unloading area and an isolation door device. The loading and unloading area includes a wafer boat loading and unloading area 200 and a wafer loading and unloading area 300 connected via a connecting area, and the wafer boat loading and unloading area 200 is connected to the furnace tube 100. The wafer boat loading and unloading area 200 includes a first wafer boat loader 210, and the first wafer boat loader 210 is at least used to move the wafer boat into or out of the furnace tube 100. The wafer loading and unloading area 300 includes a wafer loader 310, and the wafer loader 310 is at least used to move the wafer into or out of the wafer boat. The wafer loader 310 is used to move the wafer into or out of the wafer box 903.

[0075] The isolation door device is arranged in the connection area, and in a stationary state, the isolation door device can isolate the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300, and the isolation door device can work, so that the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connection area. In other words, the isolation door device is only opened briefly when the wafer boat passes through, so that the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connection area, and when no wafer boat passes through, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are in a state of being separated by the isolation door device.

[0076] In the existing wafer processing device, when the wafers on the first wafer boat in the loading and unloading area are moved into the furnace tube by the wafer boat elevator for heat treatment, the second wafer boat in the loading and unloading area can be loaded with wafers at the temporary storage position to improve production efficiency. When the wafer processing on the first wafer boat is completed, the wafer boat elevator moves the first wafer boat out of the furnace tube, the wafer boat conveying device places the first wafer boat in the temporary storage position, and the wafer boat transfer device then transfers the second wafer boat to the wafer boat elevator, and the wafer boat elevator moves the second wafer boat into the furnace tube for heat treatment.

[0077] See also Figures 3 to 5 As shown, when the first wafer boat 901 is moved out of the furnace tube, since the gas pressure in the furnace tube is higher than that in the loading and unloading area, the reaction byproducts in the furnace tube will be ejected from the furnace tube, contaminating the wafers on the second wafer boat 902. Even if a purge gas is set in the loading and unloading area, since the ejection speed of the byproducts is much greater than the speed of the purge gas, the purge gas cannot prevent the wafers on the second wafer boat 902 from being contaminated. In addition, before the second wafer boat 902 is moved from the temporary storage position to the furnace tube and during the process of being moved into the furnace tube, the reaction byproducts on the first wafer boat 901 will also diffuse to the second wafer boat 902, contaminating the wafers on the second wafer boat 902. Even if a gas purge is set in the loading and unloading area, the purge gas can only purge and remove part of the diffused byproducts, and cannot fundamentally solve the problem of wafer contamination. The problem of wafer contamination on the second wafer boat 902 is more significant on the side close to the furnace tube.

[0078] In this embodiment, the wafer processing device includes: a furnace tube 100, a loading and unloading area and an isolation door device. The loading and unloading area includes a wafer boat loading and unloading area 200 and a wafer loading and unloading area 300 connected via a connecting area. The wafer boat loading and unloading area 200 is connected to the furnace tube 100. The wafer boat loading and unloading area 200 includes a first wafer boat loader 210. The first wafer boat loader 210 is at least used to move the wafer boat into or out of the furnace tube 100. The wafer loading and unloading area 300 includes a wafer loader 310. The wafer loader 310 is used to move the wafer into or out of the wafer boat. The isolation door device is arranged in the connecting area. The isolation door device can isolate the wafer boat loading and unloading area 200 from the wafer loading and unloading area 300, and the isolation door device can work so that the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connecting area. Since the isolation door device is only opened briefly when the wafer boat passes through, the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connecting area. When no wafer boat passes through, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are in a state of being separated by the isolation door device, thereby blocking the by-products produced by the reaction in the furnace tube 100 from passing through the connecting area, reducing the risk of by-products contaminating the wafer boat and the wafers on the wafer boat, and improving the product yield.

[0079] It should be noted that when the wafer boat is moved out of the furnace tube 100, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are in a state of being separated by the isolation door device, and gas purge can be set in the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300. When the reaction by-products on the wafer boat in the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are purged to meet the requirements, the isolation door device works, that is, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are briefly connected, and the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300, thereby further reducing the risk of by-products contaminating the wafer boat and the wafers on the wafer boat and improving the product yield.

[0080] In some embodiments, the isolation door device can drive the wafer boat to move, so that the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connecting area. That is, when the isolation door device is in a stationary state, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are isolated; when the isolation door device is working, the first wafer boat 901 of the wafer boat loading and unloading area 200 is driven to move to the wafer loading and unloading area 300, and the second wafer boat 902 of the wafer loading and unloading area 300 is driven to move to the wafer boat loading and unloading area 200. After the second wafer boat 902 is sent to the furnace tube 100 for processing, and the first wafer boat 901 completes wafer loading and unloading in the wafer loading and unloading area 300 and loads wafers again, the isolation door device can exchange the areas where the two wafer boats are located again, so that the two wafer boats circulate between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300, and continuously send unprocessed wafers from the wafer loading and unloading area 300 into the furnace tube 100 for processing. After the wafer processing is completed, it is sent back to the wafer loading and unloading area 300 and flows to the next process.

[0081] The isolation door device not only isolates the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300, but also exchanges the areas where the two wafer boats are located when the isolation door device is opened, thereby shortening the time for the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 to be connected, which is beneficial to reducing the risk of by-products contaminating the wafer boat and the wafers on the wafer boat.

[0082] For example, the isolation door device includes a first isolation door assembly 400, and the first isolation door assembly 400 includes a first isolation door 410 and a plurality of wafer boat transfer mechanisms. Each wafer boat transfer mechanism is used to carry and move at least one wafer boat, and the plurality of wafer boat transfer mechanisms include a first wafer boat transfer mechanism and a second wafer boat transfer mechanism, and the first wafer boat transfer mechanism and the second wafer boat transfer mechanism are distributed and arranged on a first side and a second side opposite to the first isolation door 410.

[0083] At least a plurality of wafer boat transfer mechanisms can rotate around the rotation center to form a first state and a second state. In the first state, the first wafer boat transfer mechanism is located in the wafer boat loading and unloading area 200, and the second wafer boat transfer mechanism is located in the wafer loading and unloading area 300. In the second state, the second wafer boat transfer mechanism is located in the wafer boat loading and unloading area 200, and the first wafer boat transfer mechanism is located in the wafer loading and unloading area 300. That is, the areas where the first wafer boat 901 and the second wafer boat 902 are located are exchanged by exchanging the areas where the wafer boat transfer mechanisms are located.

[0084] At least the boat transfer mechanism can rotate around the rotation center, that is, the first isolation door 410 can be raised or lowered or slid to connect the boat loading and unloading area 200 and the wafer loading and unloading area 300, and only the boat transfer mechanism rotates to achieve the exchange of the two boat areas. The boat transfer mechanism can also be connected to the first isolation door 410, and the connection can be direct or indirect, and the connection can be a movable connection or a fixed connection, so that the boat transfer mechanism and the first isolation door 410 rotate synchronously to achieve the exchange of the two boat areas. In some embodiments, the two boat transfer mechanisms are arranged symmetrically, and the common center point between the two boat transfer mechanisms, that is, the center of symmetry, can be used as the rotation center of the boat transfer mechanism. In other embodiments, the rotation center is set according to actual conditions.

[0085] The first wafer boat transfer mechanism and the second wafer boat transfer mechanism are disposed on a first side and a second side opposite to the first isolation door 410 . The wafer boat transfer mechanism can be rotated 180° around the rotation center to realize the exchange of the areas where the two wafer boats are located.

[0086] See also Figure 6 and Figure 7As shown, the boat transfer mechanism includes a boat support and a support shaft, and the boat support is rotatably disposed on the first isolation door 410 through the support shaft. The support shaft can be directly or indirectly connected to the first isolation door 410, and the connection can be a movable connection or a fixed connection, as long as the support shaft can serve as the rotation axis of the boat support and can realize the synchronous rotation of the boat transfer mechanism and the first isolation door 410. The boat support can rotate around the support shaft to hold the boat to carry the boat, the boat support can rotate around the support shaft to release the held boat, and the boat support, the support shaft and the first isolation door 410 can rotate synchronously around the rotation center to move the held boat, and multiple boat transfer mechanisms can be switched between the first state and the second state.

[0087] It should be noted that the wafer boat transfer mechanism includes a wafer boat support and a support shaft. The wafer boat support can rotate around the support shaft to hold or release the wafer boat, but is not limited to this. The wafer boat transfer mechanism can also adopt a telescopic structure. The wafer boat transfer mechanism holds or releases the wafer boat through telescopic movement, which can be determined according to the specific situation.

[0088] The wafer boat transferring mechanism includes a wafer boat support and a support shaft. The wafer boat support rotates around the support shaft to hold or release the wafer boat. Compared with a solution in which the wafer boat transferring mechanism holds or releases the wafer boat by telescoping, the structure for holding or releasing the wafer boat is simpler, which can reduce the manufacturing cost of the wafer processing device and improve the robustness of the wafer boat transferring mechanism.

[0089] The wafer boat transfer mechanism comprises a wafer boat support and a support shaft. The wafer boat support rotates around the support shaft to hold or release the wafer boat.

[0090] In some embodiments, the wafer boat support is a single-arm support, that is, the wafer boat transfer mechanism holds or releases the wafer boat by rotating the wafer boat support. Preferably, when the wafer boat support is a single-arm support, there is a matching structure between the wafer boat support and the wafer boat, so that the wafer boat support can hold the wafer boat stably. The matching structure is, for example, a hooking mechanism or a holding mechanism, and the holding or releasing of the wafer boat is achieved by the hooking mechanism or the holding mechanism.

[0091] In some embodiments, the wafer boat holder is a multi-arm clamping holder, that is, the wafer boat holder includes multiple wafer boat sub-holders 421, and the wafer boat carrying mechanism holds or releases the wafer boat by moving the multiple wafer boat sub-holders 421 closer to or farther away from each other, which has a simple structure and is easy to operate.

[0092] Specifically, the wafer boat support includes a plurality of wafer boat sub-supports 421, and the support shaft includes a plurality of support sub-shafts 422. The support sub-shafts 422 are connected to the first isolation door 410. The connection may be direct or indirect, and may be a movable connection or a fixed connection. As long as the support sub-shafts 422 can serve as the rotation axis of the wafer boat sub-support 421 and can realize the synchronous rotation of the wafer boat transfer mechanism and the first isolation door 410, each wafer boat sub-support 421 is rotatably connected to the first isolation door 410 through each support sub-shaft 422, and the wafer boat sub-support 421 can rotate around the support shaft 422. Figure 6 and Figure 7 In the illustrated embodiment, the wafer boat support includes two wafer boat sub-supports 421, the support shaft includes two support sub-shafts 422, and the support sub-shafts 422 are fixedly disposed at least horizontally on the first isolation door 410. The wafer boat support can rotate around the support shaft to hold the wafer boat to carry the wafer boat, including that a plurality of wafer boat sub-supports 421 of a wafer boat support can rotate to gather and clamp the wafer boat to carry the wafer boat; the wafer boat support can rotate around the support shaft to release the held wafer boat, including that a plurality of wafer boat sub-supports 421 of a wafer boat support can rotate to separate to release the clamped wafer boat.

[0093] Preferably, the wafer boat support includes two wafer boat sub-supports 421, and the support shaft includes two support sub-shafts 422. Figure 6 As shown, the structure design is simple, the operation is easy, and the wafer boat can be held more stably. A wafer boat holder can be respectively arranged on both sides of the first isolation door 410 to hold or release the wafer boat. In other embodiments, two or more wafer boat holders can be arranged on the same side of the first isolation door 410, and the multiple wafer boat holders can be arranged at intervals in the vertical direction to clamp the wafer boat at multiple points, thereby improving the stability of holding the wafer boat.

[0094] In some embodiments, the boat transfer mechanism is configured such that at least the boat support can reciprocate in the vertical direction. Before the boat support, the support shaft and the first isolation door 410 rotate around the rotation center to move the held boat, the boat support can rotate around the support shaft to hold the boat to carry the boat, and the boat support can rise to lift the held boat; after the boat support, the support shaft and the first isolation door 410 rotate around the rotation center to move the held boat, the boat support can descend to put down the held boat, and the boat support can rotate around the support shaft to release the held boat. For example, after the first boat loader 210 moves the first boat 901 out of the furnace tube 100, the boat support can rotate around the support shaft to hold the boat to carry the boat, and then the boat support can rise to lift the held boat from the first boat loader 210, so that the boat support can rotate around the rotation center to achieve the switching between the first and second states to exchange the areas where the first boat 901 and the second boat 902 are located. Before the first boat loader 210 moves the second boat 902 into the furnace tube 100 , the boat support can be lowered to place the second boat 902 on the first boat loader 210 , and then the boat support can be rotated about the support rotation axis to release the held boat.

[0095] In some embodiments, the wafer boat support realizes the reciprocating motion in the vertical direction under the drive of the support shaft, and the support shaft can reciprocate in the vertical direction, that is, movably connected to the first isolation door 410. In some embodiments, the support shaft is directly and fixedly connected to the first isolation door 410, and the wafer boat support realizes the reciprocating motion in the vertical direction under the drive of the support shaft and the first isolation door 410.

[0096] The wafer boat support can reciprocate in the vertical direction. When taking the wafer boat, the wafer boat can be lifted from the first wafer boat loader and unloader 210. When releasing the wafer boat, it can be rotated to a certain position and then lowered to release the wafer boat, so as to avoid collision of the wafer boat during circulation and affect the yield of the product. In addition, the wafer boat support can reciprocate in the vertical direction and hold or release the wafer boat, so as to achieve a smooth handover of the wafer boat with the first wafer boat loader and unloader 210. The wafer boat loading and unloading area 200 does not need to be provided with a wafer boat transfer device 800 for transferring the wafer boat from the first wafer boat loader and unloader 210 to the wafer boat transfer mechanism, thereby reducing the manufacturing cost of the wafer processing device.

[0097] See also Figure 8 As shown, in some embodiments, the wafer boat transfer mechanism includes a support seat 431, and two support seats 431 are respectively arranged on the first side and the second side of the first isolation door 410, and the support seat 431 is used to carry the wafer boat and move the carried wafer boat when rotating around the rotation center. Figure 8In the illustrated embodiment, the two support seats 431 are symmetrically arranged, and the rotation center may be the common center point of the two support seats 431. In other embodiments, the rotation center of the support seats 431 may be arranged according to actual needs. When the wafer boat transfer mechanism includes the support seats 431, the wafer boat loading and unloading area 200 may be provided with a wafer boat transfer device 800 for transferring the wafer boat from the first wafer boat loader 210 to the support seats 431 or transferring the wafer boat from the support seats 431 to the first wafer boat loader 210. In addition, structures such as suction cups or card slots may be arranged on the support seats 431 for fixing the wafer boat to prevent the wafer boat from tilting or shifting when the support seats 431 rotate around the rotation center.

[0098] The wafer boat transfer mechanism includes a support base 431 , and the support base 431 is used to carry and move the wafer boat, so that the areas where the two wafer boats are located are more easily interchanged.

[0099] In some embodiments, the support base 431 of the first wafer boat transfer mechanism and the support base 431 of the second wafer boat transfer mechanism are connected by a connector 432, the connector 432 is connected to the first isolation door 410, and the connector 432 and the support base 431 are arranged on the same side of the first isolation door 410. The connector 432 and the support base 431 can be connected as one body, and a rotation drive device such as a motor can be arranged on the side of the connector 432 and the support base 431 away from the first isolation door 410. The support base 431, the connector 432 and the first isolation door 410 can rotate synchronously, so that the areas where the first wafer boat transfer mechanism and the second wafer boat transfer mechanism are located are interchangeable, thereby realizing the interchangeability of the areas where the two wafer boats are located.

[0100] The support base 431 is used as a wafer boat transfer mechanism to drive the wafer boat to rotate, and can also be used as a base to drive the first isolation door 410 to rotate, thereby simplifying the structure of the first isolation door assembly 400 .

[0101] It should be noted that the boat transfer mechanism includes a support seat 431, or the boat transfer mechanism includes a boat support and a support shaft, but is not limited thereto. The boat transfer mechanism may also include a support seat 431, a boat support and a support shaft at the same time, depending on the specific situation. The boat transfer mechanism includes a support seat 431, a boat support and a support shaft at the same time. The boat held by the boat support and the support shaft is placed on the support seat 431. During the rotation of the boat transfer mechanism and the first isolation door 410, the boat is not prone to tilt or shake. At the same time, with the support seat 431 as a support, the number of boat sub-supports 421 of the boat support can be reduced, and can be reduced to two by way of example.

[0102] See also Fig. 9 and Fig.10As shown, the first isolation door 410 and the wafer boat transfer mechanism can rotate synchronously. The first isolation door assembly 400 also includes a seal 440, which can be arranged between the first isolation door 410 and the inner wall of the loading and unloading area. Before the first isolation door 410 and the wafer boat transfer mechanism rotate, the seal 440 moves in a direction away from the first isolation door 410, so that when the first isolation door 410 and the wafer boat transfer mechanism rotate, the seal 440 forms a gap with the first isolation door 410. When the first isolation door 410 and the wafer boat transfer mechanism stop rotating, the seal 440 moves in a direction close to the first isolation door 410 to seal the gap between the loading and unloading area and the first isolation door 410.

[0103] A seal 440 is provided between the first isolation door 410 and the loading and unloading area to enhance the barrier effect of the first isolation door 410 and further reduce the risk of by-products contaminating the wafer boat and the wafers on the wafer boat.

[0104] See also Fig.11 As shown, the first isolation door 410 is a multi-wing revolving door, which includes at least three door wings 411, wherein the at least three door wings 411 include two main door wings and at least one auxiliary door wing, the two main door wings are connected to divide the first side and the second side of the first isolation door 410, and at least one auxiliary door wing is located on the first side of the first isolation door 410 and / or the second side of the first isolation door 410. All door wings 411 are arranged in a circular array and have a common rotation axis, that is, a rotation center. The angles formed between each pair of adjacent door wings 411 are equal, and isolation partitions are formed between adjacent door wings 411, and the angles between the door wings 411 corresponding to each isolation partition are the same.

[0105] The first isolation door assembly 400 includes a plurality of boat transfer mechanisms, including a first boat transfer mechanism, a second boat transfer mechanism, ..., a pth boat transfer mechanism, where p is the number of isolation partitions. The boat transfer mechanisms are arranged one-to-one between adjacent door wings 411, that is, the boat transfer mechanisms are arranged one-to-one in the isolation partitions. The boat transfer mechanism can rotate around the rotation center to drive the boat to flow between the boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connecting area.

[0106] Each wafer boat transfer mechanism is capable of carrying and moving at least one wafer boat. The first isolation door 410 is a multi-wing revolving door. The door wings 411 of the multi-wing revolving door are arranged in a circular array to form multiple isolation partitions. The wafer boat transfer mechanisms are arranged one by one between adjacent door wings 411. The wafer boat transfer mechanism and the first isolation door 410 in the first isolation door assembly 400 can rotate synchronously, so that the first isolation door assembly 400 can carry and move more wafer boats at the same time, thereby improving the working efficiency of the wafer processing device in processing wafers.

[0107] See also Fig.11As shown, the boat loading and unloading area 200 includes at least one functional sub-area, and the wafer loading and unloading area 300 includes at least one functional sub-area. The number of functional sub-areas included in the boat loading and unloading area 200 and the wafer loading and unloading area 300 may be the same or different. For example, part of the functional sub-areas of the boat loading and unloading area 200 is used to connect the furnace tube 100, and part of the functional sub-areas of the boat loading and unloading area 200 is used to pre-treat, cool or temporarily store the boat; part of the functional sub-areas of the wafer loading and unloading area 300 is used to move wafers into or remove the boat, and part of the functional sub-areas of the wafer loading and unloading area 300 is used to pre-treat, cool or temporarily store the boat, depending on the specific situation. The first isolation door 410 and the boat transfer mechanism rotate around the rotation center, so that each isolation partition is connected to the functional sub-area in turn, and then each boat is transferred between different functional sub-areas in turn. It can be understood that when the first isolation door 410 rotates, the functional sub-areas are connected. After the first isolation door 410 rotates completely and each isolation partition is connected to the functional sub-area one-to-one, the first isolation door 410 is closed, so that the functional sub-areas are isolated.

[0108] The number of functional sub-areas included in the boat loading and unloading area 200 and the wafer loading and unloading area 300 in the loading and unloading area can be set according to actual needs. It is understandable that the sum of the number of functional sub-areas included in the boat loading and unloading area 200 and the wafer loading and unloading area 300 is the same as the number of isolation partitions divided by the first isolation door 410, that is, the multi-wing revolving door. In some embodiments, when the number of isolation partitions is an even number, the two main door wings connected in the first isolation door 410 are at an angle of 180 degrees; when the number of isolation partitions is an odd number, the angle between the two main door wings connected in the first isolation door 410 is less than 180 degrees, but not limited to this, when the number of isolation partitions is an even number, the angle between the two main door wings connected in the first isolation door 410 can also be less than 180 degrees.

[0109] The wafer boat loading and unloading area 200 includes multiple functional sub-areas and / or the wafer loading and unloading area 300 includes multiple functional sub-areas, and multiple door wings 411 arranged in a circular array form multiple isolation partitions. The wafer boat transfer mechanisms are arranged one by one in the isolation partitions, so that each isolation partition is connected with the functional sub-area in turn, and then each wafer boat is transferred between different functional sub-areas in turn. More functional sub-areas are set for pre-processing, cooling or temporary storage of wafer boats, etc., which can further improve the working efficiency of the wafer processing device in processing wafers. The first isolation door assembly 400 includes a first isolation door 410, that is, a multi-wing revolving door, to achieve isolation between multiple functional sub-areas, further reducing pollution.

[0110] In some embodiments, see Fig.12 As shown, the wafer processing device includes multiple loading and unloading areas and multiple furnace tubes 100, each loading and unloading area includes a wafer boat loading and unloading area 200 and a wafer loading and unloading area 300 connected via a connecting area, and the first isolation door assemblies 400 are arranged one by one in the connecting area, and the wafer boat loading and unloading areas 200 are connected to the furnace tubes 100 one by one.

[0111] The wafer processing device includes a plurality of furnace tubes 100, and the plurality of furnace tubes 100 can process a plurality of wafer boats at the same time, thereby improving the working efficiency of the wafer processing device in processing wafers. The plurality of wafer loading and unloading areas 300 in the wafer processing device can share a wafer transfer machine, and correspondingly can share a transfer area 500 and a transmission port 510, thereby reducing the cost of the wafer processing device and reducing the space occupied by the wafer processing device.

[0112] See also Figure 2 , Fig.13 and Fig.14 As shown ( Fig.13 and Fig.14 for Figure 2 The wafer processing device further includes a transfer area 500 and a transmission port 510, and there is at least one transmission port 510. The transfer area 500 is arranged on one side of the wafer loading and unloading area 300, and the transfer area 500 is used to place the wafer box 903. The transmission port 510 is arranged on the isolation wall 520 between the wafer loading and unloading area 300 and the transfer area 500, and the isolation wall 520 partially surrounds the wafer handling machine 310, and the axial direction of the isolation wall 520 is parallel to the vertical direction. The transmission port 510 is at least used to allow the wafers in the wafer box 903 to pass through. Preferably, the transmission port 510 is a FIMS (Front Opening Interface Mechanical Standard) device, and the transmission port 510 is also used to open or close the wafer box 903. The wafer handling machine 310 is used to move the wafers in the wafer box 903 into the wafer boat in the wafer loading and unloading area 300, and the wafer handling machine 310 is used to move the wafers on the wafer boat into the wafer box 903 in the transfer area 500.

[0113] A support assembly 600 is provided on the side of the isolation wall 520 away from the wafer handling machine 310, and the support assembly 600 includes at least one crystal box support 611, and the crystal box support 611 is used to carry part of the wafer boxes 903 of the transfer area 500. The support assembly 600 includes n rows of crystal box supports 611 arranged circumferentially along the isolation wall 520, and at least one transmission port 510 is arranged in n rows along the circumferential direction of the isolation wall 520, where n is greater than or equal to 1, and the row position of each row of crystal box supports 611 is arranged corresponding to the row position of each row of transmission ports 510.

[0114] When n is equal to 1, a column of transmission ports 510 may include multiple transmission ports 510; when n is greater than 1, multiple columns of transmission ports 510 are arranged around the wafer loader and unloader 310, so that the wafer loader and unloader 310 can access wafers in different wafer boxes 903 through multiple transmission ports 510 as needed, or when the access of wafers in a wafer box 903 is completed, the wafer loader and unloader 310 can promptly access the wafers in another wafer box 903, thereby improving the internal structure operation flexibility and work efficiency of the wafer processing device.

[0115] The support assembly 600 is disposed on the isolation wall 520 , and the wafer box 903 is placed on the support assembly 600 . The distance between the wafer box 903 and the wafer boat is shortened, which reduces the time consumption of wafer loading and unloading and improves the working efficiency of the wafer processing device.

[0116] In some embodiments, Figure 2 As shown, the isolation wall 520 partially surrounds the wafer handler 310 at equal intervals, and n is greater than or equal to 2. The isolation wall 520 partially surrounds the wafer handler 310 at equal intervals, and at least the multiple rows of transmission ports 510 on the isolation wall 520 surround the wafer handler 310 at equal intervals.

[0117] A plurality of rows of crystal box supports 611 are arranged circumferentially along the isolation wall 520, and a plurality of rows of transmission ports 510 are arranged circumferentially along the isolation wall 520. The position of each row of crystal box supports 611 corresponds to the position of each row of transmission ports 510. The wafer loader and unloader 310 can load and unload wafers from the plurality of rows of crystal box supports 611, and by configuring the isolation wall 520 to partially surround the wafer loader and unloader 310 at equal intervals, the distance from the wafer loader and unloader 310 to each row of crystal box supports 611 can be equal or approximately equal, thereby reducing the operational difficulty of wafer loading and unloading, improving the working efficiency of the wafer processing device, and simplifying the structural design of the wafer loader and unloader 310.

[0118] In some embodiments, among the n rows of cassette supports 611, the mth row of cassette supports 611 includes a plurality of cassette supports 611 and the mth row of cassette supports 611 is divided into i m 610 crystal box support units, 1≤m≤n, i m is greater than or equal to 2. The crystal box support unit 610 includes j m Crystal box support 611,j m Greater than or equal to 1, i m The crystal box support units 610 are distributed in the vertical direction. m The m-th row of transmission ports 510 corresponds to the row position of the m-th row of crystal box holders 611. m The transmission port 510 and any cassette holder unit 611 of the mth row of cassette holders 611 are connected to j m The positions of the cassette supports 611 of the mth row are distributed in the same manner, and the cassette supports 611 of the mth row can move in the vertical direction, so that any cassette support unit 610 of the cassette supports 611 of the mth row is aligned with the transmission port 510 of the mth row. Figure 2 , Fig.13 and Fig.14 In the embodiment shown, n=4, m=1, 2, 3 or 4, i m =2,j m=2. It can be understood that for different rows of crystal box supports 611 in n rows of crystal box supports 611, that is, when the value of m changes, i m and m The value of may vary with m, or for each row of cassette holders 611, i m and m The value of does not change with m and depends on the specific situation.

[0119] The m-th row of cassette holders 611 includes a plurality of cassette holders 611 and the m-th row of cassette holders 611 is divided into i m Other crystal box supports 611 may be arranged above and below the multiple crystal box supports 611 included in the m-th row of crystal box supports 611, but it can be understood that these other crystal box supports 611 do not belong to the multiple crystal box supports 611 included in the m-th row of crystal box supports 611.

[0120] The n-row cassette supports 611 can move synchronously or asynchronously in the vertical direction. The n-row cassette supports 611 can move synchronously in the vertical direction, making the support assembly 600 simple in design; the n-row cassette supports 611 can move asynchronously in the vertical direction, which can improve the working efficiency of wafer access.

[0121] Therefore, by moving the bracket assembly 600 in the vertical direction, it can be achieved that the number of transmission ports 510 in at least one column of transmission ports 510 is less than the number of crystal box brackets 611 in the corresponding column, and multiple crystal box brackets 611 in the corresponding column share the at least one column of transmission ports 510, which not only reduces the number of transmission ports 510 and reduces the manufacturing cost of the wafer processing device, but also reserves sufficient space for arranging the transmission ports 510 and reduces the difficulty of setting the transmission ports 510.

[0122] j m is greater than or equal to 2, and in the mth row of cassette holders 611, the cassette holders 611 in any two adjacent cassette holder units 610 are alternately arranged in the vertical direction. For example, Fig.13 and Fig.14 As shown, each row of cassette supports 611 includes four cassette supports 611, and the four cassette supports 611 are divided into two cassette support units 610. The cassette support unit 610 includes two cassette supports 611, and the cassette supports 611 in two adjacent cassette support units 610 are alternately arranged in the vertical direction. Each row of transmission ports 510 includes two transmission ports 510.

[0123] When two adjacent and alternately arranged crystal box support units 610 in the vertical direction differ by only the position of one crystal box support 611, when the support assembly 600 is moved in the vertical direction, only the height of one crystal box support 611 is moved, so that the crystal box support 611 in another adjacent crystal box support unit 610 can be aligned with the transmission port 510, thereby reducing the vertical movement stroke of the support assembly 600, reducing bumps and contamination during movement, and improving wafer processing efficiency.

[0124] In other embodiments, when the positions of two adjacent and alternately arranged cassette support units 610 differ by x cassette support 611 in the vertical direction, when the support assembly 600 is moved in the vertical direction, only the height of x cassette support 611 is moved, so that the cassette support 611 in another adjacent cassette support unit 610 and the transmission port 510 can be aligned. Obviously, x<j m .

[0125] Preferably, i m =2,j m =2. That is, each row of cassette supports 611 includes two cassette support units 610 , and each cassette support unit 610 includes two cassette supports 611 .

[0126] Each row of crystal box supports 611 includes two crystal box support units 610, and each crystal box support unit 610 includes two crystal box supports 611, so that the wafer loader 310 can quickly access wafers, avoiding the speed of accessing wafers becoming a bottleneck for improving the working efficiency of the wafer processing device, and at the same time avoiding too many crystal box supports 611, which leads to an increase in the production cost of the wafer processing device.

[0127] In some embodiments, the wafer processing device further includes a sealing device, which can be arranged in the wafer boat loading and unloading area 200 and located on one side of the furnace tube 100. The sealing device can be used to seal the connection end between the furnace tube 100 and the wafer boat loading and unloading area 200. When the furnace tube 100 processes the wafer boat, the connection end between the furnace tube 100 and the wafer boat loading and unloading area 200 is sealed by the first wafer boat loader 210. After the first wafer boat loader 210 descends, the connection end between the furnace tube 100 and the wafer boat loading and unloading area 200 is sealed by the sealing device. In this way, it is possible to prevent pollutants in the wafer boat loading and unloading area 200 from diffusing into the furnace tube 100, avoid contaminating wafers subsequently processed by the furnace tube 100, and reduce the number of cleaning and maintenance times of the furnace tube 100.

[0128] The wafer processing device further includes a purge inlet and an exhaust port, the purge inlet is used to introduce inactive gas to purge the wafer boat loading and unloading area 200 and / or the wafer loading and unloading area 300, and the exhaust port is used to discharge the introduced gas. In some embodiments, when the wafer boat loading and unloading area 200 is purged to a pollution level that meets the requirements, the isolation door device works to allow the wafer boat to flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300, thereby further reducing the pollution caused by the reaction by-products in the furnace tube 100. The furnace tube 100 and the wafer boat loading and unloading area 200 are arranged in a vertical direction, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are arranged in a first horizontal direction, and the purge inlet and exhaust port can be arranged in a second horizontal direction. Preferably, the first and second horizontal directions are perpendicular to each other to prevent the purge gas from causing airflow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300, causing wafer contamination.

[0129] Embodiment 2

[0130] The main difference between the second embodiment and the first embodiment is that the isolation door device is different.

[0131] In the first embodiment, the isolation door device can drive the movement of the wafer boat, so that the wafer boat can flow between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 through the connecting area. In the second embodiment, the isolation door device can be opened when the wafer boat passes through and closed after the wafer boat passes through. When the isolation door device is opened, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are connected, and when the isolation door device is closed, the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 are separated by the isolation door device.

[0132] The isolation door device can be opened when the wafer boat passes through and closed after the wafer boat passes through, and the wafer boat can be moved without the help of the isolation door device, thereby simplifying the structure of the isolation door device.

[0133] See also Fig.15 and Fig.16 As shown, the isolation door device in this embodiment includes a second isolation door assembly 700. The second isolation door assembly 700 includes a second isolation door 710. The second isolation door assembly 700 includes a third state and a fourth state. In the third state, the second isolation door 710 closes the communication area, and in the fourth state, the second isolation door 710 opens the communication area. The second isolation door 710 can slide or rotate to open or close the communication area.

[0134] The second isolation door assembly 700 includes a second isolation door 710 , which can slide or rotate to open or close the connecting area, thereby connecting or isolating the boat loading and unloading area 200 and the wafer loading and unloading area 300 , and has a simple structure.

[0135] In some embodiments, the furnace tube 100 and the wafer loading and unloading area 300 are arranged on the same side of the wafer boat loading and unloading area 200. That is, the furnace tube 100 and the wafer boat loading and unloading area 200 are arranged in a vertical direction, the furnace tube 100 and the wafer loading and unloading area 300 are both arranged above the wafer boat loading and unloading area 200, and the furnace tube 100 and the wafer loading and unloading area 300 are arranged in a horizontal direction. The second isolation door assembly 700 includes a fifth state, in which the second isolation door 710 closes the connection end of the furnace tube 100 and the wafer boat loading and unloading area 200.

[0136] The second isolation door 710 can be used to isolate the crystal boat loading and unloading area 200 and the wafer loading and unloading area 300, and can also be used to close the connection end between the furnace tube 100 and the crystal boat loading and unloading area 200, that is, the second isolation door 710 can be reused for the sealing device in the first embodiment to prevent pollutants in the crystal boat loading and unloading area 200 from diffusing into the furnace tube 100, to prevent contamination of wafers subsequently processed by the furnace tube 100, and to reduce the number of cleaning and maintenance times of the furnace tube 100, thereby simplifying the structure of the wafer processing device.

[0137] For example, the second isolation door assembly 700 includes a second isolation door 710 and a door driving mechanism 720, the door driving mechanism 720 includes a door shaft 721 and a crossbeam 722, the door shaft 721 is rotatably disposed between the furnace tube 100 and the wafer loading and unloading area 300, and the crossbeam 722 connects the second isolation door 710 and the door shaft 721. The second isolation door 710 rotates around the door shaft 721 to close the lower end of the furnace tube 100 (i.e., the connection end between the furnace tube 100 and the wafer boat loading and unloading area 200, i.e., the fifth state) or the connecting area (i.e., the third state), or is located between the lower end of the furnace tube 100 and the connecting area (i.e., the fourth state). Fig.16 As shown, the second isolation door 710 can be located at the position shown in the figure, that is, Fig.16 The second isolation door assembly 700 is shown in the fourth state; the second isolation door 710 can also be in Fig.16 At the position indicated by the middle dotted line, when the second isolation door 710 is located at the position indicated by the left dotted line, the second isolation door assembly 700 is in the fifth state; when the second isolation door 710 is located at the position indicated by the right dotted line, the second isolation door assembly 700 is in the third state.

[0138] The second isolation door 710 can be located at one of the three positions: the lower end of the furnace tube 100, the connecting area, or between the lower end of the furnace tube 100 and the connecting area. The second isolation door 710 is driven to rotate by the door driving mechanism 720 to move between the three positions of the lower end of the furnace tube 100, the connecting area, or between the lower end of the furnace tube 100 and the connecting area to achieve position switching. The structure of the second isolation door assembly 700 is simpler.

[0139] In some embodiments, the second isolation door assembly 700 includes a second boat loader 730, which is disposed in the boat loading and unloading area 200. The second boat loader 730 is used to move the boat into the wafer loading and unloading area 300 and close the connecting area, and the second boat loader 730 is used to move the boat out of the wafer loading and unloading area 300.

[0140] The second isolation door assembly 700 includes a second wafer boat loader and unloader 730, which is used to move the wafer boat into or out of the wafer loading and unloading area 300, and to isolate the connecting area between the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300. Reusing the second wafer boat loader and unloader 730 can simplify the structure of the wafer processing device.

[0141] In some embodiments, the furnace tube 100 and the wafer boat loading and unloading area 200 are arranged in a vertical direction, and the furnace tube 100 and the wafer loading and unloading area 300 are arranged on the same side of the wafer boat loading and unloading area 200. When loading and unloading the wafer boat, the first wafer boat loader 210 and the second wafer boat loader 730 drive the wafer boat to move in a vertical direction.

[0142] The furnace tube 100 and the wafer boat loading and unloading area 200 are arranged in a vertical direction, that is, the wafer processing device includes a vertical furnace, and the furnace tube 100 and the wafer loading and unloading area 300 are arranged on the same side of the wafer boat loading and unloading area 200. When loading and unloading the wafer boat, the first wafer boat loader 210 and the second wafer boat loader 730 drive the wafer boat to move in a vertical direction. The first wafer boat loader 210 and the second wafer boat loader 730 have the same structure, which is beneficial to reducing the manufacturing cost of the wafer processing device.

[0143] Preferably, the second isolation door assembly 700 includes a second isolation door 710 and a second wafer boat loader and unloader 730 . When the wafer processing device is working: the first wafer boat 901 is processed in the furnace tube 100. During the processing, the first wafer boat loader and unloader 210 can seal the lower end of the furnace tube 100. The second wafer boat 902 is loaded with wafers in the wafer loading and unloading area 300. At this time, the second wafer boat loader and unloader 730 can separate the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300. When the processing of the first wafer boat 901 is completed, the first wafer boat loader and unloader 210 descends, and the first wafer boat 901 carried by the first wafer boat loader and unloader 210 can be transferred by the wafer boat transfer device 800 to the temporary storage position 201 in the wafer boat loading and unloading area 200. The temporary storage position 201 can be used to temporarily store the wafer boat, so that the wafer boat waits for the next step of processing, pretreatment or cooling at this position. The second isolation door 710 can be rotated to the lower end of the furnace tube 100 to close the furnace tube 100. The wafer loading and unloading area 300 is completed. The second wafer boat 902 loaded with wafers is moved to the wafer boat loading and unloading area 200 by the second wafer boat loader and unloader 730, and the wafer boat transfer device 800 transfers the second wafer boat 902 to the first wafer boat loader and unloader 210, and the first wafer boat loader and unloader 210 moves the second wafer boat 902 into the furnace tube 100 for processing. After the second wafer boat 902 descends, the second isolation door 710 can be rotated to the connecting area to separate the wafer boat loading and unloading area 200 from the wafer loading and unloading area 300; after the first wafer boat 901 is cooled, the wafer boat transfer device 800 transfers the first wafer boat 901 to the second wafer boat loader and unloader 730, and the second isolation door 710 rotates to a position between the lower end of the furnace tube 100 and the connecting area, and the second wafer boat loader and unloader 730 transfers the first wafer boat 901 to the wafer loading and unloading area 300 and separates the wafer boat loading and unloading area 200 from the wafer loading and unloading area 300.

[0144] The second isolation door assembly 700 includes a second isolation door 710 and a second wafer boat loader 730, which can quickly complete the exchange of the positions of the two wafer boats, reduce the time for the wafer boat loading and unloading area 200 and the wafer loading and unloading area 300 to communicate with each other, and help reduce the risk of by-products contaminating the wafer boat and the wafers on the wafer boat.

[0145] It should be noted that the main difference between the second embodiment and the first embodiment is that the isolation door device is different. The structure other than the isolation door device in the first embodiment, including the arrangement of the transmission port 510, the support assembly 600 and the transfer area 500, is also applicable to the second embodiment, so it will not be repeated in the second embodiment.

[0146] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0147] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0148] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0149] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A wafer processing device, characterized in that: include: Furnace pipes; The loading and unloading area includes a wafer boat loading and unloading area and a wafer loading and unloading area connected via a connecting area, the wafer boat loading and unloading area is connected to the furnace tube, the wafer boat loading and unloading area includes a first wafer boat loader, the first wafer boat loader is at least used to move the wafer boat into or out of the furnace tube, and the wafer loading and unloading area includes a wafer loader, the wafer loader is at least used to move the wafer into or out of the wafer boat; An isolation door device is arranged in the connecting area, and the isolation door device can isolate the crystal boat loading and unloading area and the wafer loading and unloading area, and the isolation door device can work so that the crystal boat can flow between the crystal boat loading and unloading area and the wafer loading and unloading area through the connecting area.

2. The wafer processing device according to claim 1, characterized in that: The isolation door device can drive the wafer boat to move, so that the wafer boat can flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the connecting area.

3. The wafer processing device according to claim 2, characterized in that: The isolation door device includes a first isolation door assembly, the first isolation door assembly includes a first isolation door and multiple crystal boat transfer mechanisms, each of the crystal boat transfer mechanisms is used to carry and move at least one crystal boat, the multiple crystal boat transfer mechanisms include a first crystal boat transfer mechanism and a second crystal boat transfer mechanism, the first crystal boat transfer mechanism and the second crystal boat transfer mechanism are distributed on a first side and a second side opposite to the first isolation door, at least the multiple crystal boat transfer mechanisms can rotate around a rotation center to form a first state and a second state, in the first state, the first crystal boat transfer mechanism is located in the crystal boat loading and unloading area, the second crystal boat transfer mechanism is located in the wafer loading and unloading area, in the second state, the second crystal boat transfer mechanism is located in the crystal boat loading and unloading area, and the first crystal boat transfer mechanism is located in the wafer loading and unloading area.

4. The wafer processing device according to claim 3, characterized in that: The wafer boat transfer mechanism includes a support seat, the support seat is used to carry the wafer boat and move the carried wafer boat when rotating around the rotation center, the support seat of the first wafer boat transfer mechanism and the support seat of the second wafer boat transfer mechanism are connected by a connecting piece, the connecting piece is connected to the first isolation door, the connecting piece and the support seat are arranged on the same side of the first isolation door, the support seat, the connecting piece and the first isolation door can rotate synchronously around the rotation center, so that the multiple wafer boat transfer mechanisms can switch between the first state and the second state; and / or The crystal boat transfer mechanism includes a crystal boat support and a support shaft, the crystal boat support is arranged on the support shaft, the support shaft is connected to the first isolation door, the crystal boat support can rotate around the support shaft to hold the crystal boat to carry the crystal boat, the crystal boat support can rotate around the support shaft to release the held crystal boat, and the crystal boat support, the support shaft and the first isolation door can synchronously rotate around the rotation center to move the held crystal boat and enable the multiple crystal boat transfer mechanisms to switch between the first state and the second state.

5. The wafer processing device according to claim 4, characterized in that: The wafer boat support includes a plurality of wafer boat sub-supports, the support shaft includes a plurality of support sub-shafts, the wafer boat sub-supports are arranged on the support sub-shafts, the support sub-shafts are connected to the first isolation door, and the wafer boat sub-supports can rotate around the support shafts; The wafer boat support can rotate around the support rotation axis to hold the wafer boat to carry the wafer boat, including: the plurality of wafer boat sub-supports of the wafer boat support can rotate to gather and clamp the wafer boat to carry the wafer boat; The wafer boat support can rotate about the support rotation axis to release the held wafer boat, which includes: the plurality of wafer boat sub-supports of the wafer boat support can rotate to be separated to release the clamped wafer boat.

6. The wafer processing device according to claim 4 or 5, characterized in that: The wafer boat transfer mechanism includes the wafer boat support and the support shaft, and the wafer boat transfer mechanism is configured as follows: Before the wafer boat support, the support shaft and the first isolation door rotate around the rotation center to move the held wafer boat, the wafer boat support can rotate around the support shaft to hold the wafer boat to carry the wafer boat, and the wafer boat support can rise to lift the held wafer boat; After the boat support, the support shaft and the first isolation door rotate around the rotation center to move the held boat, the boat support can be lowered to put down the held boat, and the boat support can be rotated around the support shaft to release the held boat.

7. The wafer processing device according to any one of claims 3 to 5, characterized in that: The first isolation door and the wafer boat transfer mechanism can rotate synchronously, and the first isolation door assembly also includes a sealing member. When the first isolation door and the wafer boat transfer mechanism rotate, the sealing member forms a gap with the first isolation door. When the first isolation door and the wafer boat transfer mechanism stop rotating, the sealing member seals the gap between the loading and unloading area and the first isolation door.

8. The wafer processing device according to claim 7, characterized in that: The first isolation door is a multi-wing revolving door, the multi-wing revolving door includes at least three door wings, the at least three door wings include two main door wings and at least one auxiliary door wing, the two main door wings are connected to divide the first side and the second side of the first isolation door, and the at least one auxiliary door wing is located on the first side of the first isolation door and / or the second side of the first isolation door; The angles between adjacent door wings are equal, and the wafer boat transfer mechanism is arranged one by one between adjacent door wings. The wafer boat transfer mechanism and the multi-wing revolving door can rotate around the rotation center to drive the wafer boat to flow between the wafer boat loading and unloading area and the wafer loading and unloading area through the connecting area.

9. The wafer processing device according to claim 8, characterized in that: The wafer boat loading and unloading area includes multiple functional sub-areas and / or the wafer loading and unloading area includes multiple functional sub-areas, and isolation partitions are formed between adjacent door wings. The multi-wing revolving door and the wafer boat transfer mechanism rotate around the rotation center so that each isolation partition is connected to the functional sub-area in turn.

10. The wafer processing device according to claim 1 or 2, characterized in that: The wafer processing device comprises a plurality of the loading and unloading areas and a plurality of the furnace tubes, and the wafer boat loading and unloading areas are connected to the furnace tubes in a one-to-one correspondence.

11. The wafer processing device according to claim 1, characterized in that: The isolation door device can be opened when the wafer boat passes through and closed after the wafer boat passes through.

12. The wafer processing device according to claim 11, characterized in that: The isolation door device includes a second isolation door assembly; The second isolation door assembly includes a second isolation door, and the second isolation door assembly includes a third state and a fourth state. In the third state, the second isolation door closes the communication area, and in the fourth state, the second isolation door opens the communication area; and / or The second isolation door assembly includes a second wafer boat loader and unloader, which is arranged in the wafer boat loading and unloading area, and is used to move the wafer boat into the wafer loading and unloading area and close the connecting area, and the second wafer boat loader and unloader is used to move the wafer boat out of the wafer loading and unloading area.

13. The wafer processing device according to claim 12, characterized in that: The second isolation door assembly includes the second isolation door, the furnace tube and the wafer loading and unloading area are arranged on the same side of the wafer boat loading and unloading area, and the second isolation door assembly includes a fifth state. In the fifth state, the second isolation door closes the connection end between the furnace tube and the wafer boat loading and unloading area.

14. The wafer processing device according to claim 12 or 13, characterized in that: The second isolation door assembly includes the second isolation door and a door driving mechanism, the door driving mechanism includes a door shaft and a crossbeam, the door shaft is rotatably arranged between the furnace tube and the wafer loading and unloading area, and the crossbeam connects the second isolation door and the door shaft.

15. The wafer processing device according to claim 12 or 13, characterized in that: The furnace tube and the wafer boat loading and unloading area are arranged in a vertical direction, and the furnace tube and the wafer loading and unloading area are arranged on the same side of the wafer boat loading and unloading area. When loading and unloading the wafer boat, the first wafer boat loader and the second wafer boat loader drive the wafer boat to move in a vertical direction.

16. The wafer processing device according to claim 1, characterized in that: The wafer processing device further comprises a transfer area and at least one transmission port, wherein the transfer area is arranged at one side of the wafer loading and unloading area, the transfer area is used to place a wafer box, the transmission port is arranged on a partition wall between the wafer loading and unloading area and the transfer area, the partition wall partially surrounds the wafer loader and unloader, the axial direction of the partition wall is parallel to the vertical direction, the transmission port is at least used for the wafers in the wafer box to pass through, the wafer loader and unloader is used to move the wafers in the wafer box into the wafer boat in the wafer loading and unloading area, and the wafer loader and unloader is used to move the wafers on the wafer boat into the wafer box in the transfer area, and a support assembly is arranged on the side of the partition wall away from the wafer loader and unloader, the support assembly comprises at least one wafer box support, and the wafer box support is used to carry the wafer box in the transfer area; The support assembly includes n rows of crystal box supports arranged along the circumference of the isolation wall, and the at least one transmission port is arranged in n rows along the circumference of the isolation wall, n≥1, and the row position of each row of crystal box supports corresponds to the row position of each row of transmission ports.

17. The wafer processing device according to claim 16, characterized in that: The isolation wall partially surrounds the wafer handler at equal distances, n≥2.

18. The wafer processing device according to claim 16 or 17, characterized in that: Among the n rows of crystal box supports, the mth row of crystal box supports includes a plurality of the crystal box supports and the mth row of crystal box supports is divided into i m Crystal box support unit, 1≤m≤n, i m ≥2, the crystal box support unit includes j m The crystal box support, j m ≥1, i m The crystal box support units are distributed along the vertical direction; Among the n columns of transmission ports, the transmission ports in the mth column include j m The transmission ports in the mth column correspond to the column positions of the crystal box supports in the mth column, and the j transmission ports in the mth column correspond to the column positions of the crystal box supports in the mth column. m The transmission port is connected to the j m The positions of the crystal box brackets are distributed in the same manner; The crystal box support in the mth column can move in a vertical direction so that any crystal box support unit of the crystal box support in the mth column is aligned with the transmission port in the mth column.

19. The wafer processing device according to claim 18, characterized in that: j m ≥2, in the m-th row of crystal box supports, the crystal box supports in any two adjacent crystal box support units are alternately arranged in the vertical direction.

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