Flow channel structure, cooling device and electronic equipment

Abstract

The invention discloses a flow channel structure, a cooling device and electronic equipment, the flow channel structure comprises a flow channel body, the flow channel body is provided with a first surface and a second surface which are opposite to each other, the flow channel body is provided with a flow channel groove, and an opening of the flow channel groove is located in the first surface. The flow channel groove is provided with a first flow section, a second flow section and a third flow section which are connected in sequence; one end, far away from the third flow section, of the first flow section is an inlet end, and one end, far away from the first flow section, of the third flow section is an outlet end; wherein the second flow section comprises a guide structure capable of guiding the fluid to rotate, and the fluid flowing from the first flow section to the second flow section rotates when flowing through the second flow section and then flows into the third flow section. According to the flow channel structure, due to the fact that the fluid can rotate under the guidance of the guiding structure, the fluid located at different positions in the second flow section is mixed, the temperature of the fluid is more uniform, and the cooling capacity is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment, and in particular to a flow channel structure, a cooling device and an electronic device. Background Art

[0002] With the evolution of semiconductor process nodes, the number of transistors per unit area is increasing, the functions and computing power of chips are becoming stronger, the power density and heat generation are also increasing, and the heat dissipation problem is becoming more prominent.

[0003] Based on the microchannel heat dissipation structure, microchannels with a cross-sectional shape of only tens to hundreds of microns are made on semiconductor materials by photolithography, etching or micromachining. The function of these microchannels is to allow the coolant to pass through these microchannels on the top of the chip to carry away the heat generated by it, so as to utilize the micro-scale heat exchange performance to achieve the purpose of efficient heat dissipation.

[0004] Therefore, how to improve the heat dissipation capability is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0005] In view of this, the present invention provides a flow channel structure to improve cooling capacity. The present invention also provides a cooling device and an electronic device having the flow channel structure.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A flow channel structure comprises a flow channel body, wherein the flow channel body has a first surface and a second surface opposite to each other, the flow channel body has a flow channel groove, the opening of the flow channel groove is located on the first surface, and the flow channel groove has a first flow segment, a second flow segment and a third flow segment connected in sequence;

[0008] The end of the first flow segment away from the third flow segment is an inlet end, and the end of the third flow segment away from the first flow segment is an outlet end;

[0009] in,

[0010] The second flow segment includes a guide structure capable of guiding the fluid to rotate, and the fluid flowing from the first flow segment to the second flow segment rotates when flowing through the second flow segment and then flows into the third flow segment.

[0011] Optionally, in the above-mentioned flow channel structure, during the process of the guide structure guiding the fluid to rotate, the part of the fluid close to the second surface moves to the position where the flow channel groove is away from the second surface, or the part of the fluid away from the second surface moves to the position where the flow channel groove is close to the second surface.

[0012] Optionally, in the above flow channel structure, the second flow section further includes an intermediate flow channel section, the width of the intermediate flow channel section is smaller than the width of the first flow section, and the inlet end of the intermediate flow channel section corresponds to the first area of ​​the outlet end of the first flow section;

[0013] The guiding structure includes a first inclined surface arranged on one side of the middle flow channel section, the first inclined surface is inclined along the flow direction of the fluid in a direction away from the second surface, and the first inclined surface corresponds to a second area of ​​the outlet end of the first flow section at one end of the first flow section.

[0014] Optionally, in the above-mentioned flow channel structure, the first inclined surface is an arc-shaped surface, one end of which is tangent to a side wall of the first flow segment.

[0015] Optionally, in the above-mentioned flow channel structure, the guide structure further comprises a second inclined surface arranged opposite to the first inclined surface, and the second inclined surface is inclined in a direction close to the second surface along the flow direction of the fluid;

[0016] The width of the middle flow channel section is smaller than the width of the third flow section, and the outlet end of the middle flow channel section corresponds to the third area of ​​the inlet end of the third flow section;

[0017] One end of the second inclined surface facing the third flow segment corresponds to a fourth area of ​​the inlet end of the third flow segment.

[0018] Optionally, in the above-mentioned flow channel structure, the second inclined surface is an arc-shaped surface, one end of which is tangent to a side wall of the second flow segment.

[0019] Optionally, in the above-mentioned flow channel structure, the guide structure can guide the fluid to rotate within a set surface, and the set surface forms a certain angle with the arrangement direction of the first flow segment and the third flow segment in the flow channel groove.

[0020] Optionally, in the above-mentioned flow channel structure, the cross-sectional areas of the first flow segment, the second flow segment and the third flow segment are the same.

[0021] Optionally, in the above-mentioned flow channel structure, the flow channel body is made of metal material.

[0022] The present invention also provides a cooling device for dissipating heat from a chip, wherein the cooling device comprises a flow channel structure as described in any one of the above items, and a coolant can pass through the flow channel structure to carry away the heat generated by the chip.

[0023] Optionally, in the above cooling device, the cooling device includes a plurality of the flow channel structures, and the plurality of the flow channel structures are arranged in an array.

[0024] Optionally, in the above cooling device, the cooling device has a first end and a second end opposite to each other, the first end is a liquid inlet end for the coolant to enter, and the second end is a liquid outlet end for the coolant to flow out;

[0025] Alternatively, the cooling device includes two adjacent flow channel structures, which are distributed as a first flow channel structure and a second flow channel structure; the third flow segment of the first flow channel structure is relatively close to and connected to the third flow segment of the second flow channel structure, the relatively distant ends of the first flow segment of the first flow channel structure and the first flow segment of the second flow channel structure are liquid inlet ends for the coolant to enter, and the connecting point between the third flow segment of the first flow channel structure and the third flow segment of the second flow channel structure is a liquid outlet end for the coolant to flow out.

[0026] The present invention further provides an electronic device, comprising a chip and a cooling device for dissipating heat from the chip, wherein the cooling device is any one of the cooling devices described above.

[0027] It can be seen from the above technical solutions that the flow channel structure provided by the present invention, the guiding structure of the second flow segment can guide the fluid to rotate, so that the fluid flowing from the first flow segment to the second flow segment rotates when flowing through the second flow segment, and the rotated fluid flows into the third flow segment. Because the fluid can rotate under the guidance of the guiding structure, the fluids at different positions in the second flow segment (such as the fluids close to the second surface and the fluids far from the second surface, which may have temperature differences due to different positions) are mixed, thereby making the temperature of the fluid more uniform, thereby improving the cooling capacity.

[0028] The embodiment of the present invention also provides a cooling device and an electronic device having the above-mentioned flow channel structure. Since the above-mentioned flow channel structure has the above-mentioned technical effects, the cooling device or electronic device having the above-mentioned flow channel structure should also have the same technical effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the three-dimensional structure of the flow channel structure provided by an embodiment of the present invention;

[0031] Figure 2 A simulation trace diagram of the fluid in the flow channel structure provided by an embodiment of the present invention;

[0032] Figure 3A schematic diagram of the main structure of the flow channel structure provided by an embodiment of the present invention;

[0033] Figure 4 A schematic cross-sectional view of a flow channel structure provided in an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of the structure of a cooling device provided by an embodiment of the present invention;

[0035] Figure 6 A schematic diagram of a first liquid inlet and outlet structure of a cooling device provided in an embodiment of the present invention;

[0036] Figure 7 A schematic diagram of a second liquid inlet and outlet structure of a cooling device provided in an embodiment of the invention;

[0037] in,

[0038] Flow channel groove-100; first flow section-110; second flow section-120; middle flow channel section-121; first inclined surface-122; second inclined surface-123; third flow section-130;

[0039] Flow channel body-200; first surface-210; second surface-220. DETAILED DESCRIPTION

[0040] The invention discloses a flow channel structure to improve cooling capacity. The invention also provides a cooling device and electronic equipment having the flow channel structure.

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] like Figure 1 , Figure 2 and Figure 3As shown, an embodiment of the present invention provides a flow channel structure, including a flow channel body 200, the flow channel body 200 has a first surface 210 and a second surface 220 opposite to each other, the flow channel body 200 has a flow channel groove 100, the opening of the flow channel groove 100 is located on the first surface 210, the flow channel groove 100 has a first flow segment 110, a second flow segment 120 and a third flow segment 130 connected in sequence; the end of the first flow segment 110 away from the third flow segment 130 is an inlet end, and the end of the third flow segment 130 away from the first flow segment 110 is an outlet end; wherein the second flow segment 120 includes a guiding structure capable of guiding the rotation of the fluid, and the fluid flowing from the first flow segment 110 to the second flow segment 120 rotates when flowing through the second flow segment 120 and then flows into the third flow segment 130.

[0043] In the flow channel structure provided in the embodiment of the present invention, the guide structure of the second flow segment 120 can guide the fluid to rotate, so that the fluid flowing from the first flow segment 110 to the second flow segment 120 rotates when flowing through the second flow segment 120, and the rotated fluid flows into the third flow segment 130. Since the fluid can rotate under the guidance of the guide structure, the fluids at different positions in the second flow segment 120 (such as the fluids close to the second surface 220 and the fluids far from the second surface 220, which may have temperature differences due to different positions) are mixed, thereby making the temperature of the fluid more uniform, thereby improving the cooling capacity.

[0044] like Figure 2 As shown, Figure 2 The colored lines in the figure represent fluids, which rotate when passing through the guiding structure of the second flow section 120 .

[0045] It should be noted that the flow channel groove 100 may be a part of the flow channel. The flow channel structure also includes a cover plate or other components (components in contact with the first surface 210 during assembly) that cooperate with the flow channel body 200 and can cooperate with the flow channel body 200 to close the opening of the flow channel groove 100, thereby forming a complete flow channel and preventing the fluid from overflowing to the outside of the flow channel body 200. Of course, the opening of the flow channel groove 100 can also be oriented so that the fluid flows in the flow channel groove 100 under the action of gravity.

[0046] In order to reduce the resistance to the fluid caused by the rotation of the fluid, during the process of the guiding structure guiding the fluid to rotate, the part of the fluid close to the second surface 220 moves to the position of the flow channel 100 away from the second surface 220, or the part of the fluid away from the second surface 220 moves to the position of the flow channel 100 close to the second surface 220. That is, during the process of the fluid flowing along the arrangement direction of the first flow segment 110, the second flow segment 120 and the third flow segment 130, the fluid corresponding to the second flow segment 120 rotates to form a structure arranged along the flow direction of the fluid (such as a spiral-like structure or a spiral structure). The axial direction of the structure is the same or substantially the same as the arrangement direction of the first flow segment 110, the second flow segment 120 and the third flow segment 130.

[0047] Of course, the guiding structure can also guide the fluid to rotate in a direction perpendicular to the arrangement direction of the first flow segment 110, the second flow segment 120 and the third flow segment 130, that is, all or part of the fluid flowing from the first flow segment 110 into the second flow segment 120 will flow back to the first flow segment 110 and mix before flowing to the third flow segment 130.

[0048] like Figure 1 , Figure 2 and Figure 3 As shown, in a specific embodiment, the second flow segment 120 further includes an intermediate flow channel segment 121, the width of the intermediate flow channel segment 121 is smaller than the width of the first flow segment 110, and the inlet end of the intermediate flow channel segment 121 corresponds to the first area of ​​the outlet end of the first flow segment 110. The width of the first flow segment 110 is W, and the width of the intermediate flow channel segment 121 is D. W can be greater than 0.1 mm, and D can be greater than 0.1 mm, 0.1 mm, or less than 0.1 mm.

[0049] The guiding structure includes a first inclined surface 122 disposed on one side of the middle flow channel section 121, the first inclined surface 122 is inclined in the direction away from the second surface 220 along the flow direction of the fluid, and one end of the first inclined surface 122 facing the first flow section 110 corresponds to the second area of ​​the outlet end of the first flow section 110. That is, for the fluid from the first flow section 110 to the second flow section 120, a part of the fluid will enter the inlet end of the middle flow channel section 121 from the first area of ​​the outlet end of the first flow section 110 and flow in the middle flow channel section 121, and another part of the fluid will pass through the first inclined surface 122 from the second area of ​​the outlet end of the first flow section 110 toward one end of the first flow section 110 and flow along the first inclined surface 122 away from the second surface 220, and after reaching the first surface 210 of the flow channel body 200 and being blocked by the baffle or no longer blocking the opening of the flow channel groove 100, the part of the fluid drives the part of the fluid flowing in the middle flow channel section 121 to form a rotating fluid structure.

[0050] like Figure 4 As shown, the inclination angle of the first inclined surface 122 is a, and a is less than 90°.

[0051] In order to further reduce fluid resistance and improve the smoothness of fluid flow, the first inclined surface 122 is an arc-shaped surface, one end of which is tangent to a side wall of the first flow section 110. The first inclined surface 122 can also be set as a plane; it can also be a ripple surface, and the extension direction of the ripple surface is along the inclination direction of the first inclined surface 122, etc. No specific restrictions are made here and they are all within the protection scope.

[0052] In this embodiment, the guiding structure also includes a second inclined surface 123 arranged opposite to the first inclined surface 122, and the second inclined surface 123 is inclined along the flow direction of the fluid toward the direction close to the second surface 220; the width of the middle flow channel section 121 is smaller than the width of the third flow section 130, and the outlet end of the middle flow channel section 121 corresponds to the third area of ​​the inlet end of the third flow section 130; the end of the second inclined surface 123 facing the third flow section 130 corresponds to the fourth area of ​​the inlet end of the third flow section 130.

[0053] Through the above arrangement, the fluid flowing along the first inclined surface 122 in the direction away from the second surface 220 can flow in the direction close to the second surface 220 under the guidance of the second inclined surface 123, thereby forming a closed-loop guiding structure, which is more conducive to the fluid rotating under the guidance of the guiding structure. Preferably, the inclination angle of the second inclined surface 123 is less than 90°.

[0054] In this embodiment, the second inclined surface 123 is arranged opposite to the first inclined surface 122, that is, the projection position of the end of the first inclined surface 122 toward the first flow segment 110 onto the second surface 220 is aligned with the projection position of the end of the second inclined surface 123 close to the first flow segment 110 onto the second surface 220, and the projection position of the end of the first inclined surface 122 close to the third flow segment 130 onto the second surface 220 is aligned with the projection position of the end of the second inclined surface 123 toward the third flow segment 130 onto the second surface 220.

[0055] Of course, the second inclined surface 123 may not be provided, and only the first inclined surface 122 may be provided, which can also achieve the function of the guiding structure guiding the fluid to rotate.

[0056] In order to further reduce fluid resistance and improve the smoothness of fluid flow, the second inclined surface 123 is an arc-shaped surface, one end of which is tangent to a side wall of the second flow section 120. Similarly, the second inclined surface 123 can also be set as a plane; it can also be a ripple surface, and the extension direction of the ripple surface is along the inclination direction of the second inclined surface 123, etc. There is no specific limitation here and it is within the protection scope.

[0057] The flow channel structure provided by the embodiment of the present invention can guide the fluid to rotate in a set plane, and the set plane forms a certain angle with the arrangement direction of the first flow segment 110 and the third flow segment 130 in the flow channel groove 100, that is, a spiral fluid is formed, thereby further improving the mixing uniformity of the fluid.

[0058] In some embodiments, the cross-sectional areas of the first flow segment 110, the second flow segment 120 and the third flow segment 130 are the same. That is, the fluid can flow through the first flow segment 110, the second flow segment 120 and the third flow segment 130 at a stable flow rate, further improving the smoothness of the fluid flow.

[0059] Since the cost of processing microchannels with semiconductor materials is high and the reliability has not been verified. Therefore, the flow channel body 200 of the flow channel structure provided in the embodiment of the present application is made of metal material. That is, the flow channel is processed on the metal block by stamping, casting or engraving, etc., and the flow channel can also be processed on the metal material by photolithography, etching or micromachining. Through the above arrangement, the cost can be effectively reduced and the heat dissipation capacity can be further improved. Among them, the specific type of metal material is not limited, and it is preferred to use a metal with high thermal conductivity to make the flow channel body 200, so as to further improve the heat dissipation capacity.

[0060] Of course, semiconductor materials may also be used to process the flow channel structure, which is not specifically limited here and is within the scope of protection.

[0061] An embodiment of the present invention further provides a cooling device for dissipating heat from a chip. The cooling device includes any of the flow channel structures described above, and the coolant can pass through the flow channel structure to remove the heat generated by the chip.

[0062] Since the above-mentioned flow channel structure has the above-mentioned technical effect, the cooling device having the above-mentioned flow channel structure also has the same technical effect.

[0063] It is understood that the cooling device may include a coolant and a power component, and the power component provides power for the coolant to flow in the flow channel as a fluid. The power component may be provided separately. It is also possible that the cooling device does not include a power component, and the coolant flows in the flow channel as a fluid under gravity or structure.

[0064] In order to improve the cooling effect, the cooling device includes a plurality of flow channel structures, and the plurality of flow channel structures are arranged in an array.

[0065] like Figure 5 As shown, for example, multiple flow channel structures can be arranged in a 6*25 array, and there are six flow channel structures along the fluid flow direction, that is, the flow channel grooves 100 on the flow channel body 200 of the flow channel structure are connected. Of course, the number of flow channel structures can also be other, and the arrangement method can also be adjusted according to actual needs.

[0066] In some embodiments, the cooling device has a first end and a second end opposite to each other, the first end is a liquid inlet end for the cooling liquid to enter, and the second end is a liquid outlet end for the cooling liquid to flow out.

[0067] like Figure 6 As shown, taking a cooling device formed by a plurality of flow channel structures arranged in a 6*25 array as an example, the first end of the cooling device has 25 flow channel structures arranged side by side, and the outer sections thereof are all liquid inlet ends for the coolant to enter, and the second end of the cooling device has 25 flow channel structures arranged side by side, and the outer sections thereof are all liquid outlet ends for the coolant to enter.

[0068] In other embodiments, the cooling device includes two adjacent flow channel structures, which are distributed as a first flow channel structure and a second flow channel structure; the third flow segment 130 of the first flow channel structure is relatively close to and connected with the third flow segment 130 of the second flow channel structure, and the relatively distant ends of the first flow segment 110 of the first flow channel structure and the first flow segment 110 of the second flow channel structure are liquid inlet ends for the coolant to enter, and the connecting point between the third flow segment 130 of the first flow channel structure and the third flow segment 130 of the second flow channel structure is a liquid outlet end for the coolant to flow out.

[0069] like Figure 7 As shown, taking a cooling device formed by a plurality of flow channel structures arranged in a 6*25 array as an example, the cooling device has 6 rows of flow channel structures, which are divided into three groups of flow channel structure groups, and each group of flow channel structure groups has two adjacent flow channel structures (a first flow channel structure and a second flow channel structure). Through the above arrangement, a four-in-three-out structure of the cooling device is realized.

[0070] An embodiment of the present invention further provides an electronic device, including a chip and a cooling device for dissipating heat from the chip, wherein the cooling device is any one of the cooling devices described above.

[0071] Since the above cooling device has the above technical effects, the electronic device having the above cooling device should also have the same technical effects, which will not be described in detail here.

[0072] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0073] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A flow channel structure, characterized in that: The flow channel body (200) comprises a first surface (210) and a second surface (220) opposite to each other, the flow channel body (200) comprises a flow channel groove (100), the opening of the flow channel groove (100) is located on the first surface (210), and the flow channel groove (100) comprises a first flow section (110), a second flow section (120) and a third flow section (130) connected in sequence; An end of the first flow segment (110) away from the third flow segment (130) is an inlet end, and an end of the third flow segment (130) away from the first flow segment (110) is an outlet end; in, The second flow segment (120) comprises a guide structure capable of guiding the fluid to rotate, and the fluid flowing from the first flow segment (110) to the second flow segment (120) rotates when flowing through the second flow segment (120) and then flows into the third flow segment (130).

2. The flow channel structure according to claim 1, characterized in that: During the process of the guide structure guiding the fluid to rotate, a portion of the fluid close to the second surface (220) moves to a position of the flow channel (100) away from the second surface (220), or a portion of the fluid away from the second surface (220) moves to a position of the flow channel (100) close to the second surface (220).

3. The flow channel structure according to claim 2, characterized in that: The second flow section (120) further comprises an intermediate flow channel section (121), the width of the intermediate flow channel section (121) being smaller than the width of the first flow section (110), and the inlet end of the intermediate flow channel section (121) corresponds to a first area of ​​the outlet end of the first flow section (110); The guide structure comprises a first inclined surface (122) arranged on one side of the middle flow channel section (121), the first inclined surface (122) being inclined in a direction away from the second surface (220) along the flow direction of the fluid, and one end of the first inclined surface (122) facing the first flow section (110) corresponds to a second area of ​​an outlet end of the first flow section (110).

4. The flow channel structure according to claim 3, characterized in that: The first inclined surface (122) is an arc-shaped surface, one end of which is tangent to a side wall of the first flow section (110).

5. The flow channel structure according to claim 3, characterized in that: The guide structure further comprises a second inclined surface (123) arranged opposite to the first inclined surface (122), the second inclined surface (123) being inclined in a direction close to the second surface (220) along the flow direction of the fluid; The width of the middle flow channel section (121) is smaller than the width of the third flow section (130), and the outlet end of the middle flow channel section (121) corresponds to a third area of ​​the inlet end of the third flow section (130); One end of the second inclined surface (123) facing the third flow segment (130) corresponds to a fourth area of ​​the inlet end of the third flow segment (130).

6. The flow channel structure according to claim 5, characterized in that: The second inclined surface (123) is an arc-shaped surface, one end of which is tangent to a side wall of the second flow section (120).

7. The flow channel structure according to claim 1, characterized in that: The guide structure can guide the fluid to rotate within a set surface, and the set surface forms a certain angle with the arrangement direction of the first flow segment (110) and the third flow segment (130) in the flow channel groove (100).

8. The flow channel structure according to claim 1, characterized in that: The first flow section (110), the second flow section (120) and the third flow section (130) have the same cross-sectional area.

9. The flow channel structure according to claim 1, characterized in that: The flow channel body (200) is made of metal material.

10. A cooling device for dissipating heat from a chip, characterized in that: The cooling device comprises the flow channel structure as described in any one of claims 1 to 9, and the cooling liquid can pass through the flow channel structure to remove the heat generated by the chip.

11. The cooling device according to claim 10, characterized in that The cooling device includes a plurality of the flow channel structures, and the plurality of the flow channel structures are arranged in an array.

12. The cooling device according to claim 11, characterized in that The cooling device has a first end and a second end opposite to each other, the first end is a liquid inlet end for the coolant to enter, and the second end is a liquid outlet end for the coolant to flow out; Alternatively, the cooling device includes two adjacent flow channel structures, which are distributed as a first flow channel structure and a second flow channel structure; the third flow segment (130) of the first flow channel structure is relatively close to and connected to the third flow segment (130) of the second flow channel structure, the relatively distant ends of the first flow segment (110) of the first flow channel structure and the first flow segment (110) of the second flow channel structure are liquid inlet ends for the coolant to enter, and the connecting point between the third flow segment (130) of the first flow channel structure and the third flow segment (130) of the second flow channel structure is a liquid outlet end for the coolant to flow out.

13. An electronic device, comprising a chip and a cooling device for dissipating heat from the chip, characterized in that: The cooling device is a cooling device as described in any one of claims 10-12.

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