Power supply device, preparation method, system and related electronic equipment

Abstract

The embodiment of the invention provides a power supply device, a preparation method, a system and related electronic equipment, and the power supply device comprises an inductor, a power regulation module and a substrate. The inductor comprises a first surface and a second surface which are opposite to each other; wherein the inductor is embedded in the substrate; the inductor comprises M pins, and M is an integer greater than or equal to 2; the first pin of the M pins is located on the first surface of the inductor, and the second pin of the M pins is located on the second surface of the inductor; the power regulation module is located at the top of the substrate, and a power pin of the power regulation module is electrically connected with a first pin in the M pins; and a second pin in the M pins serves as an output pin of the power supply device to be connected with a load and supplies power to the load. By implementing the embodiment of the invention, the power path can be shortened and the loss can be reduced without influencing the height of the module.

Description

Technical Field

[0001] The present application relates to semiconductor devices, and in particular to a power supply device, a preparation method, a system and related electronic equipment. Background Art

[0002] As the current chips are developing towards higher capacity and higher speed, the integrated circuit (IC) devices are required to continuously evolve towards stronger functions and higher integration. At present, with the demand of IC devices for low voltage and high current, the corresponding voltage regulator module (VRM) (that is, power supply module) is gradually developing towards high frequency, high heat dissipation and high efficiency. At present, in order to reduce the power path, the semiconductor structure encapsulated with the power supply module is often a vertical power supply structure. There are usually two solutions for this vertical power supply structure. Solution 1: The VRM can be placed directly on the top of the load (such as: IC device), and the VRM directly dissipates heat upwards; Solution 2: The VRM and the inductor can be placed flat on the back of the load, where the inductor can appropriately shorten the power path.

[0003] However, in Solution 1, since the VRM is placed on the top of the load, the height of the entire module is high and is not well suited for height-restricted or small-volume scenarios. Moreover, placing it directly on the top will result in a long power path between the VRM and the load, and this method will result in large power routing losses on the system board output. Solution 2 places the VRM on the back of the load, which can reduce the height of the entire module and is more suitable for height-restricted scenarios. However, since the VRM and the inductor are laid flat on the back of the load, the power path in the horizontal direction of the entire module will increase, resulting in a longer overall power path.

[0004] Therefore, how to shorten the power path and reduce losses without affecting the module height is an urgent problem to be solved. Summary of the invention

[0005] The embodiments of the present application provide a power supply device, a preparation method, a system and related electronic equipment to further shorten the power path between the power supply device and the load and reduce losses without affecting the module height.

[0006] In a first aspect, an embodiment of the present application provides a power supply device, comprising an inductor, a power regulation module and a substrate; the inductor comprises a first surface and a second surface opposite to each other; wherein the inductor is embedded inside the substrate; the inductor comprises M pins, M being an integer greater than or equal to 2; a first pin among the M pins is located on the first surface of the inductor, and a second pin among the M pins is located on the second surface of the inductor; the power regulation module is located on the top of the substrate, and a power pin of the power regulation module is electrically connected to the first pin among the M pins; the second pin among the M pins is connected to a load as an output pin of the power supply device, and supplies power to the load.

[0007] In an embodiment of the present application, the power supply device includes an inductor, a power regulating module and a substrate. The substrate can be used to support the inductor and the power regulating module, and utilize the current characteristics of the inductor to conduct the current output by the power regulating module and shorten the power path. The inductor includes a first surface and a second surface that are opposite to each other. For example, the first surface and the second surface can be arranged in parallel and opposite to each other, the first surface includes a first pin, and the second surface includes a second pin, and correspondingly, the first pin and the second pin are also opposite to each other. When the first pin is connected to the power pin and the second pin is connected to the load, it is equivalent to setting the power regulating module and the load back-to-back, that is, the power meter regulating module is connected to the first pin close to the first surface of the inductor, and the load is connected to the second pin close to the second surface of the inductor. The power module and the load are respectively located on both sides of the inductor (that is, the substrate), which can reduce the loss while allowing the module to dissipate heat on both sides. Moreover, this oppositely arranged pin can reduce the horizontal routing between the power regulating module and the load, and shorten the power path, compared with the situation where the pins located on the same surface are respectively connected to the power regulating module and the load (at this time, the power regulating module and the load are arranged flat). In addition, the embodiment of the present application embeds the inductor inside the substrate, which greatly reduces the overall height of the power supply device compared to the situation where the power regulation module and the inductor are directly located on the top of the load, and is more suitable for height-restricted scenes and small-volume scenes, with more application scenarios. Compared to the situation where the power regulation module and the inductor are laid flat on one side of the load, the power path length between the power regulation module, the inductor and the load is further reduced, the reliability and power density of the power supply device are improved, and the output power routing loss on the system board is reduced.

[0008] In a possible implementation, the substrate includes a conductive interconnection layer, and the conductive interconnection layer is used to connect the power pin and the first pin; or the conductive interconnection layer is used to connect the second pin and the load.

[0009] More and more loads will be integrated into the related devices in the prior art, and each load may have different power supply requirements or different power supply locations. In the embodiment of the present application, in order to facilitate the connection between the power regulation module and the load, a conductive interconnection layer can be prepared on the substrate, so that the conductive interconnection layer can be equivalent to a power layer for connecting the power pin and the first pin; or, connecting the second pin and the load. In addition, fewer power layers can be arranged on the load side to reduce system losses.

[0010] In one possible implementation, the substrate includes one or more power vias, each of which vertically penetrates the substrate, and at least one of the one or more power vias is located within the orthographic projection area of ​​the power regulation module on the substrate.

[0011] In an embodiment of the present application, the substrate also includes one or more power vias that penetrate the substrate, and some or all of the one or more power vias are located within the positive projection area of ​​the power regulating module on the substrate. Therefore, some or all of the power vias can be connected to one or more pins in the power regulating module, and it is very convenient to directly supply power to the load. In addition, the material forming the power via is a metal material with good conductivity, such as copper, etc., so that the one or more power vias can disperse heat well and avoid device loss caused by excessive temperature of the power regulating module and the device. Moreover, compared with the heat dissipation solution that mainly dissipates heat through the top of the module, the heat dissipation solution of the present application is simpler, has higher heat dissipation efficiency for the power regulating module, and is more suitable for height-restricted scenarios or small-volume scenarios.

[0012] In one possible implementation, the orthographic projection of the power regulation module on the substrate overlaps with the position of the first pin in the substrate.

[0013] In the embodiment of the present application, the orthographic projection of the power regulating module on the substrate may cover the position of the first pin in the substrate. For example, in a direction parallel to the substrate, the orthographic projection of the power pin of the power regulating module on the substrate may overlap with the position of the first pin in the substrate, so that the power pin may be directly electrically connected to the first pin perpendicular to the substrate, so that the power transmission path between the power regulating module and the inductor is the shortest.

[0014] In one possible implementation, the device further includes a heat sink, which is located above the power regulation module and is used to dissipate heat for the power supply device.

[0015] In an embodiment of the present application, the power supply device also includes a heat sink, which can be located above the power regulation module to dissipate heat for the power regulation module or the entire power supply device. Compared with the unilateral heat dissipation of the module in the prior art, the present application can achieve double-sided heat dissipation, that is, one side can dissipate heat through the heat sink above the power regulation module, and the other side can also dissipate heat through the heat sink above the load attached to the back of the power regulation module. This double-sided heat dissipation method can improve the reliability of the entire system.

[0016] In one possible implementation, the device also includes a circuit board; one side of the circuit board is connected to the bottom of the substrate, and the other side of the circuit board is connected to the load, wherein, in a direction parallel to the one side of the circuit board, the orthographic projection of the second pin in the substrate on the one side of the circuit board overlaps with the orthographic projection of the load on the other side of the circuit board.

[0017] In the embodiment of the present application, the load is back-attached to the power regulating module, and a substrate and a circuit board for support and electrical connection are also included in the middle. Among them, since the orthographic projection of the second pin on one side of the circuit board overlaps with the orthographic projection of the load on the other side of the circuit board, for example: the second pin can pass through the circuit board and directly connect to the load, shortening the power transmission path between the power regulating module and the load, and this method can supply power through the wiring inside the board, reducing the output power loss of the wiring between the boards.

[0018] In one possible implementation, the circuit board includes a conductive path perpendicular to one side of the circuit board, and the conductive path is the shortest path that runs through the circuit board. The conductive path is used to electrically connect the second pin and the load, so that the power regulation module supplies power to the load.

[0019] In an embodiment of the present application, since the orthographic projection of the second pin on one side of the circuit board overlaps with the orthographic projection of the load on the other side of the circuit board, for example: the second pin can be vertically and pass through the circuit board to be directly connected to the load, so that the power transmission path between the power regulation module and the load is the shortest. This method shortens the transmission path between the power pin and the load, can greatly compress the height of the module, and greatly reduce the output power routing loss of the system board.

[0020] In a second aspect, an embodiment of the present application provides a method for preparing a power supply device, the method comprising: preparing a substrate with an inductor embedded therein, wherein the inductor comprises a first surface and a second surface opposite to each other, the inductor comprises M pins, and M is an integer greater than or equal to 2; a first pin among the M pins is located on the first surface of the inductor, and a second pin among the M pins is located on the second surface of the inductor; the second pin among the M pins serves as an output pin of the power supply device to connect to a load; and assembling a power regulation module on top of the substrate so that a power pin of the power regulation module is electrically connected to a first pin among the M pins.

[0021] In one possible implementation, the preparation of the substrate with an inductor embedded therein includes: preparing the inductor; forming a resin layer using a resin material, wherein the thickness of the resin layer corresponds to the thickness of the inductor, and the thickness of the inductor is the distance between the first surface and the second surface; preparing a cavity on the surface of the resin layer based on the shape of the inductor, wherein the cavity penetrates the resin layer; mounting the inductor in the cavity, wherein the first surface and the second surface of the inductor, which are opposite to each other, are exposed to the upper and lower sides of the resin layer respectively; and pressing the resin material on the upper and lower sides of the resin layer to form the substrate with the inductor embedded therein.

[0022] In one possible implementation, the method further includes: drilling holes and filling conductive material at one or more target positions on the surface of the resin layer laminated with the resin material to form a conductive interconnect layer, so that the power pin and the first pin are electrically connected through the conductive interconnect layer; or, the second pin and the load are electrically connected through the conductive interconnect layer.

[0023] In a third aspect, an embodiment of the present application provides a chip module, comprising: a chip and the chip being fixed as a load on a power supply device as described in any one of the items involved in the first aspect above.

[0024] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising a chip and a power supply device as described in any one of the first aspects, wherein the electronic device supplies power to the chip through the power supply device as described in any one of the first aspects.

[0025] In a fifth aspect, an embodiment of the present application provides a power supply system, comprising a load and a power supply device as described in any one of the above first aspect, wherein the power supply device as described in any one of the above first aspect is used to supply power to the load.

[0026] It should be understood that the preparation method of the power supply device provided in the second aspect of the present application, the chip module provided in the third aspect, and the electronic device provided in the fourth aspect are consistent with the technical solution of the first aspect of the present application. Their specific contents and beneficial effects can be referred to the power supply device provided in the above-mentioned first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0028] Figure 1 This is a schematic diagram of a discrete power supply structure with a power supply module provided in an embodiment of the present application.

[0029] Figure 2 This is a schematic diagram of a horizontal power supply structure with a power supply module provided in an embodiment of the present application.

[0030] Figure 3 This is a schematic diagram of a vertical power supply structure with a power supply module provided in an embodiment of the present application.

[0031] Figure 4 This is a schematic diagram of another vertical power supply structure with a power supply module provided in an embodiment of the present application.

[0032] Figure 5 It is a structural schematic diagram of a power supply device provided in an embodiment of the present application.

[0033] Figure 6 It is a schematic diagram of the structure of an inductor provided in an embodiment of the present application.

[0034] Figure 7 It is a schematic diagram of the shapes of several inductors provided in the embodiments of the present application.

[0035] Figure 8 It is a structural schematic diagram of another power supply device provided in an embodiment of the present application.

[0036] Fig. 9 It is a structural schematic diagram of another power supply device provided in an embodiment of the present application.

[0037] Fig.10 It is a flow chart of a method for manufacturing a power supply device provided in an embodiment of the present application.

[0038] Fig.11 It is a schematic diagram of the manufacturing process of a substrate with an inductor embedded therein provided in an embodiment of the present application.

[0039] Fig.12 It is a schematic diagram of the manufacturing process of another substrate with an inductor embedded therein provided in an embodiment of the present application.

[0040] Fig.13 It is a structural schematic diagram of a power supply system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0042] The terms "first" and "second" and the like in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0043] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0044] For ease of description, the embodiments of the present application may use spatial relationship words such as "under", "below", "below", "below", "above", "on", etc. to describe the relationship between an element or feature shown in the drawings and other elements or features. It will be understood that these spatial relationship words are intended to include other directions of the device in use or operation, in addition to the directions depicted in the drawings. For example, if the device in the drawings is turned over, the direction of the element described as being "under" or "under" or "below" other elements or features will be changed to "above" the other elements or features. Thus, the exemplary words "under" and "below" can include both the upper and lower directions. The device may also have other orientations (rotated 90 degrees or in other directions), so the spatial relationship descriptors used here should be interpreted accordingly. In addition, it will be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there may be one or more layers in between.

[0045] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0046] First of all, in order to facilitate understanding of the embodiments of the present application, the technical problems and application scenarios that need to be solved by the embodiments of the present application are analyzed in detail below.

[0047] As current chips are developing towards higher capacity and higher speed, integrated circuit (IC) devices are required to continue to evolve towards more powerful functions and higher integration. At present, with the demand of IC devices for low voltage and high current, the corresponding voltage regulator module (VRM) (that is, power supply module) is gradually developing towards high frequency, high heat dissipation and high efficiency.

[0048] For example: Please refer to the attached Figure 1 and attached Figure 2 , Figure 1 is a schematic diagram of a discrete power supply structure with a power supply module provided in an embodiment of the present application, Figure 2 This is a schematic diagram of a horizontal power supply structure with a power supply module provided in an embodiment of the present application.

[0049] like Figure 1 As shown, the integrated circuit of the traditional discrete power supply structure may include VRM, load and passive components related to the load input terminal (such as inductor L, capacitor C, resistor R, etc.), and the power chip and passive components are separately laid on the circuit board to supply power to the load, and the heat sink dissipates heat for it. Among them, there are height differences between the power chip and other passive components or loads, so during packaging, only the highest component can be used as the basis for packaging, resulting in redundant space for shorter components compared to taller components, which is not conducive to integrated packaging settings.

[0050] like Figure 2 As shown, the integrated circuit of the traditional horizontal power supply structure can also include a horizontally arranged VRM, a load, and passive devices related to the input end of the load (such as capacitor C, etc.). The power chip and the load need to share a heat sink, and the heat dissipation method is mainly through the top of the module. The heat dissipation solution is complicated. In addition, the horizontal power supply structure will cause the power path between the output end of the power chip to the input end of the load to be longer and have a large impedance. Moreover, as the chip load current increases, the board-level wiring loss will increase sharply.

[0051] Therefore, in order to solve the above problems, integrated circuits currently often adopt a vertical power supply structure, and the vertical power supply structure usually has two solutions.

[0052] in,

[0053] For solution 1: Please refer to the attached Figure 3 , Figure 3 This is a schematic diagram of a vertical power supply structure with a power supply module provided in an embodiment of the present application.

[0054] like Figure 3 As shown, the integrated circuit of the vertical power supply structure may include VRM, load, and passive devices related to the input end of the load (such as capacitors, resistors, etc.). The power chip VRM and some passive devices (such as inductors) are placed on the top of the load, so that the output of the VRM can be directly routed downward to the load. However, the VRM chip is placed on the top of the module, which will cause the VRM chip bare die to dissipate heat upward, and the overall height of the module. In addition, the VRM is directly routed downward to the load, which belongs to the system board routing, and its routing loss is large. The rest will cause the height of the entire module to be higher and is not well suited for height-restricted scenarios or small-volume scenarios.

[0055] For Option 2: Please refer to the attached Figure 4 , Figure 4 This is a schematic diagram of another vertical power supply structure with a power supply module provided in an embodiment of the present application.

[0056] like Figure 4 As shown in (1), the integrated circuit of the vertical power supply structure may include a VRM, a load, and passive devices (such as capacitors, resistors, etc.) related to the load input terminal. Figure 4 As shown in (2), the VRM and some passive components (such as inductors) are laid flat and attached to the back of the load, so that the VRM is directly connected to the load through the conductive layer or wire inside the circuit board. However, since the VRM and the inductor are laid flat on the back of the load, there will be a horizontal trace between the VRM and the inductor (such as Figure 4 Moreover, since the VRM and the inductor are attached to the back of the load, the VRM and the inductor need to have an independent support substrate to support the VRM and the inductor, so there will be a vertical trace from the VRM to the load (such as Figure 4 As shown in (2), since the vertical trace is located inside the substrate, although the second solution can reduce the height of the entire module and is more suitable for height-restricted scenarios, the second solution lays the VRM and some passive components (such as inductors) flat, which will increase the power path in the horizontal direction of the entire module, thereby making the overall power path longer.

[0057] In this regard, an embodiment of the present application provides a power supply device, which can further shorten the power path between the power supply device and the load and reduce the loss without affecting the height of the module. For example: An embodiment of the present application provides a power supply device, the device includes an inductor, a power regulation module and a substrate; the inductor includes a first surface and a second surface opposite to each other; wherein the inductor is embedded in the substrate; the inductor includes M pins, M is an integer greater than or equal to 2; the first pin of the M pins is located on the first surface of the inductor, and the second pin of the M pins is located on the second surface of the inductor; the power regulation module is located on the top of the substrate, and the power pin of the power regulation module is electrically connected to the first pin of the M pins; the second pin of the M pins is connected to the load as the output pin of the power supply device, and supplies power to the load. Among them, the specific implementation method can be referred to the description of the following related embodiments, and the embodiments of the present application will not be repeated here.

[0058] Secondly, in order to facilitate the understanding of the embodiments of the present application, several power supply devices on which the embodiments of the present application are based are described below.

[0059] An embodiment of the present application provides a power supply device, which includes an inductor, a power regulation module and a substrate; the inductor includes a first surface and a second surface opposite to each other; wherein the inductor is embedded in the substrate; the inductor includes M pins, M is an integer greater than or equal to 2; a first pin among the M pins is located on the first surface of the inductor, and a second pin among the M pins is located on the second surface of the inductor; the power regulation module is located on the top of the substrate, and a power pin of the power regulation module is electrically connected to the first pin among the M pins; the second pin among the M pins is connected to a load as an output pin of the power supply device and supplies power to the load.

[0060] Please refer to the attached Figure 5 , Figure 5 It is a structural schematic diagram of a power supply device provided in an embodiment of the present application.

[0061] like Figure 5As shown, the power supply device 10 includes an inductor 101, a power regulating module 102 and a substrate 103; the inductor 101 includes a first surface 01 and a second surface 02 opposite to each other; wherein the inductor 101 is embedded in the substrate 103; the inductor includes M pins, M is an integer greater than or equal to 2; the first pin 1011 of the M pins is located on the first surface 01 of the inductor 101, and the second pin 1012 of the M pins is located on the second surface 02 of the inductor 101; the power regulating module 102 is located on the top of the substrate 103, and the power pin of the power regulating module 102 is electrically connected to the first pin 1011 of the M pins; the second pin 1012 of the M pins is connected to the load as the output pin of the power supply device and supplies power to the load. M is an integer greater than or equal to 2. The substrate 103 can be used to support the inductor 101 and the power regulating module 102, and utilize the current conduction characteristics of the inductor 101 to conduct the current output by the power regulating module and shorten the power path.

[0062] In addition, it can be understood that the inductor is embedded in the substrate, which is different from the power regulation module and the inductor being directly located on the top of the load (as described above). Figure 3 The overall height of the power supply device is greatly reduced, which is more suitable for scenes with limited height and small volume, and has more application scenarios. Compared with the power regulation module and the inductor laid flat on the load side (as shown above), the Figure 4 As shown in the figure, the power path length between the power regulation module, the inductor and the load is further reduced, the reliability and power density of the power supply device are improved, and the output power routing loss on the system board is reduced.

[0063] The inductor 101 includes a first surface 01 and a second surface 02 that are opposite to each other. The first surface 01 and the second surface 02 can be arranged in parallel and opposite to each other. For example: Please refer to the attached Figure 6 , Figure 6 is a schematic diagram of the structure of an inductor provided in an embodiment of the present application. Figure 6 As shown in (1), the inductor 101 includes a first surface 01 and a second surface 02 opposite to each other. The first surface 01 and the second surface 02 may be arranged in parallel and opposite to each other, or may be arranged in non-parallel and opposite to each other. The first surface 01 and the second surface 02 may also be understood as two different opposite surfaces of the inductor 101. The first surface 01 of the inductor includes a first pin 1011 among a plurality of pins, and the second surface 02 of the inductor 101 includes a second pin 1012 among a plurality of pins.

[0064] like Figure 6As shown in (2), since the first surface 01 and the second surface 02 can be arranged opposite to each other, the first surface 01 includes a first pin 1011, and the second surface 02 includes a second pin 1012. Accordingly, the first pin 1011 and the second pin 1012 are also opposite to each other. The first pin 1011 can be used to connect to the power pin of the power regulation module 102 and receive the output of the power regulation module. The second pin 1012 is connected to the load as the output pin of the power supply device 10 and supplies power to the load. Compared with the situation where the pins located on the same surface are respectively connected to the power regulation module and the load (in this case, the power regulation module and the load are arranged flat), this kind of oppositely arranged pins can reduce the horizontal wiring between the power regulation module and the load and shorten the power path. That is, the wiring between the board levels (as mentioned above) Figure 4 The wiring 01 and the wiring 02 shown in (2) can be omitted by connecting the two opposite pins of the embedded inductor to the power regulation module and the load. Figure 6 The inductor structure shown in the above Figure 5 In the power supply device shown, the horizontal wiring between the power regulation module and the load can be reduced, shortening the power path.

[0065] In some embodiments, please refer to the attached Figure 7 , Figure 7 Schematic diagrams of the shapes of several inductors provided in the embodiments of the present application. Figure 7 As shown in (1), the shape of the inductor 101 may be an "H-shape"; Figure 7 As shown in (2), the shape of the inductor 101 can be a "Y-shape"; Figure 7 As shown in (3), the shape of the inductor 101 can be an "I-shape" or the like, and the embodiment of the present application does not specifically limit the specific shape of the inductor.

[0066] In some other embodiments, the distance between the first pin and the second pin may be the longer distance between the first surface and the second surface. For example, the longest distance. Figure 7 In the inductor shown in (2), there are two different areas on the first side of the inductor where the first pin can be set. Compared with the area closer to the first pin, the first pin is located in an area farther away from the second pin, so that the first pin is connected to the power regulation module and the second pin is connected to the load. This arrangement can facilitate packaging and connection between devices.

[0067] Among them, when the inductor is connected to the power pin at the first pin and the load at the second pin, it is equivalent to setting the power regulation module on the back of the load through the substrate, that is, the power meter regulation module is connected to the first pin close to the first side of the inductor, and the load is connected to the second pin close to the second side of the inductor, which is equivalent to the power module and the load being respectively located on both sides of the inductor (that is, the substrate).

[0068] In some further embodiments, an orthographic projection of the power regulation module on the substrate overlaps with a position of the first pin in the substrate.

[0069] As mentioned above Figure 5 As shown, the orthographic projection of the power regulating module 102 on the substrate 103 can cover the position of the first pin 1011 in the substrate 103. For example, in a direction parallel to the substrate, the orthographic projection of the power pin of the power regulating module on the substrate can overlap with the position of the first pin in the substrate, so that the power pin can be directly electrically connected to the first pin perpendicular to the substrate, reducing the power transmission path between the power regulating module and the inductor, so as to minimize the power loss.

[0070] In some embodiments, the substrate includes a conductive interconnect layer, and the conductive interconnect layer is used to connect the power pin and the first pin; or, the conductive interconnect layer is used to connect the second pin and the load.

[0071] In current power supply devices, power supply needs to be provided to more and more loads, and each load may have different power supply requirements or each load may have a different power supply position in the integrated circuit. Therefore, in order to facilitate the connection between the power regulation module and the load, a conductive interconnection layer can be prepared on the substrate, so that the conductive interconnection layer can be equivalent to a power layer for connecting the power pin and the first pin; or, connecting the second pin and the load. In addition, fewer power layers can be arranged on the load side to reduce system losses.

[0072] Please refer to the attached Figure 8 , Figure 8 is a schematic diagram of the structure of another power supply device provided in an embodiment of the present application. Figure 8 As shown, the substrate of the power supply device 10 may also include a conductive interconnection layer, which may be a pre-prepared circuit structure, or a conductive medium layer. The conductive interconnection layer includes one or more conductive layers, each of which may correspond to the power pin of the power regulation module and / or the first pin of the inductor. Among them, the embodiment of the present application does not specifically limit the number of power pins of the power regulation module 102. The conductive interconnection layer may be located inside the substrate close to the first and / or second surfaces of the inductor, and may also be embedded in the surface of the substrate between the power regulation module and the inductor, or between the load and the inductor. The embodiment of the present application does not specifically limit this.

[0073] In addition, the embodiments of the present application do not specifically limit the conductive material filled in the conductive interconnect layer.

[0074] In some embodiments, the substrate includes one or more power vias, each of the power vias vertically penetrates the substrate, and at least one of the one or more power vias is located within the orthographic projection area of ​​the power regulation module on the substrate.

[0075] As mentioned above Figure 5 and the above Figure 8 As shown, the substrate also includes one or more power vias penetrating the substrate, and part or all of the one or more power vias are located within the positive projection area of ​​the power regulation module on the substrate, that is, one or more power vias located under the power regulation module can correspond to one or more pins in the power regulation module, and can be used to directly supply power to the load through the connected pins, or be electrically connected to other passive devices. The power pins of the power regulation module are part or all of all the pins of the power regulation module.

[0076] In addition, the material forming the power via can be a metal material with good conductivity, such as copper, etc., and the embodiment of the present application does not make specific limitations on this. Moreover, the metal filled in the one or more power vias has good thermal conductivity. Therefore, the one or more power vias can disperse the heat well and be used to dissipate the heat for the power regulation module and the power supply device, etc., to avoid the device loss caused by the excessive temperature of the module. Compared with the heat dissipation solution that only shares one heat sink for the power regulation module and the load (such as the main chip), the heat dissipation solution of the embodiment of the present application has a higher heat dissipation efficiency for the power regulation module, and is more suitable for height-restricted scenarios or small-volume scenarios.

[0077] In some embodiments, the device further includes a heat sink, which is located above the power regulation module and is used to dissipate heat for the power supply device.

[0078] As mentioned above Figure 8 As shown, the power supply device may further include a heat sink, which may be located above the power regulating module to dissipate heat for the power regulating module or the entire power supply device. Compared with the single-sided heat dissipation of the module in the prior art, the present application may achieve double-sided heat dissipation, that is, one side may dissipate heat through the heat sink on the power regulating module, and the other side may also dissipate heat through the heat sink on the load attached to the back of the power regulating module. This double-sided heat dissipation method may improve the reliability of the entire system.

[0079] In some embodiments, the device also includes a circuit board; one side of the circuit board is connected to the bottom of the substrate, and the other side of the circuit board is connected to the load, wherein in a direction parallel to the one side of the circuit board, the orthographic projection of the second pin in the substrate on one side of the circuit board overlaps with the orthographic projection of the load on the other side of the circuit board.

[0080] Please refer to the attached Fig. 9 , Fig. 9 is a schematic diagram of the structure of another power supply device provided in an embodiment of the present application. Fig. 9 As shown, the load and power regulation module can be based on the back of the circuit board, wherein, since the positive projection of the second pin on one side of the circuit board overlaps with the positive projection of the load on the other side of the circuit board, for example: the second pin can pass through the circuit board and directly connect to the load, such as Fig. 9 The routing shown greatly shortens the power transmission path between the power regulation module and the load. For another example, the second pin can be connected to the load through the conductive interconnect layer, and then connected to the load through the circuit board. This method can supply power through the routing within the board and reduce the output power loss of the routing between the boards.

[0081] In some embodiments, the circuit board includes a conductive path perpendicular to one side of the circuit board, and the conductive path is the shortest path that runs through the circuit board. The conductive path is used to electrically connect the second pin and the load, so that the power regulation module supplies power to the load.

[0082] Since the orthographic projection of the second pin on one side of the circuit board overlaps with the orthographic projection of the load on the other side of the circuit board, the second pin and the load can be connected through the shortest vertical routing, so that the power transmission path from the power regulation module to the load is the shortest. This method shortens the transmission path from the power pin to the load, can greatly compress the height of the module, and greatly reduce the output power routing loss of the system board.

[0083] It should be noted that the above Fig. 9 The structure shown is only an exemplary implementation provided by the embodiments of the present application, and the embodiments of the present application do not limit this.

[0084] In addition, based on the above Figure 8 The power supply device structure shown, the embodiment of the present application also exemplarily provides a method for manufacturing a power supply device.

[0085] Please refer to the attached Fig.10 , Fig.10 1 is a flow chart of a method for manufacturing a power supply device provided in an embodiment of the present application. Fig.10 As shown, the method includes:

[0086] Step S101: preparing a substrate with an inductor embedded therein.

[0087] Specifically, a substrate with an inductor embedded therein is prepared, wherein the inductor comprises a first surface and a second surface opposite to each other, the inductor comprises M pins, M is an integer greater than or equal to 2; a first pin among the M pins is located on the first surface of the inductor, and a second pin among the M pins is located on the second surface of the inductor; and the second pin among the M pins serves as an output pin of the power supply device to connect to a load.

[0088] In some embodiments, the preparation of the substrate with an inductor embedded therein includes: preparing the inductor; forming a resin layer using a resin material, wherein the thickness of the resin layer corresponds to the thickness of the inductor, and the thickness of the inductor is the distance between the first surface and the second surface; preparing a cavity on the surface of the resin layer based on the shape of the inductor, wherein the cavity penetrates the resin layer; mounting the inductor in the cavity, wherein the first surface and the second surface of the inductor, which are opposite to each other, are exposed to the upper and lower sides of the resin layer respectively; and pressing the resin material on the upper and lower sides of the resin layer to form a substrate with an inductor embedded therein.

[0089] Please refer to the attached Fig.11 and Fig.12 , Fig.11 1 is a schematic diagram of a manufacturing process of a substrate with an inductor embedded therein provided in an embodiment of the present application. Fig.12 It is a schematic diagram of the manufacturing process of another substrate with an inductor embedded therein provided in an embodiment of the present application.

[0090] First, prepare the inductor, and pin the upper and lower surfaces (such as the first surface and the second surface) of the two-phase inductor winding to reduce the module power path impedance. Fig.11 As shown in (1), the inductor is "Z-shaped", such as Fig.12 As shown in (1), the inductor is an "H-shaped" inductor. Then, as Fig.11 Zhong (2) and Fig.12 As shown in (2), a resin layer is formed by a resin material, and the thickness of the resin layer corresponds to the thickness of the inductor. Since the inductor is a rectangular parallelepiped, the thickness of the inductor can be understood as the distance between the first surface and the second surface. Fig.11 Neutralize (3) Fig.12 As shown in (3), based on the shape of the inductor, a cavity is prepared on the surface of the resin layer, the cavity penetrates the resin layer, and the inductor is mounted in the cavity, wherein the first surface and the second surface of the inductor, which are opposite to each other, are exposed to the upper and lower sides of the resin layer respectively. In addition, the position of the cavity is not specifically limited in this embodiment of the application. Fig.11 Zhong (4) and Fig.12As shown in (4), the resin material is pressed on the upper and lower sides of the resin layer to form a substrate with an inductor embedded therein. In addition, a circuit pattern can be electroplated after the resin material is pressed to form a complete circuit loop.

[0091] In other embodiments, Fig.11 Zhong (5) and Fig.12 As shown in (5), after the resin material is pressed, one or more power vias can be prepared to supply power to the load and / or dissipate heat for the power regulation module.

[0092] Step S102: drilling holes at one or more target positions on the surface of the resin layer laminated with the resin material and filling the holes with conductive material to form a conductive interconnection layer.

[0093] Specifically, Fig.11 Zhong (5) and Fig.12 As shown in (5), holes can be drilled and filled with conductive material at one or more target positions on the surface of the resin layer laminated with the resin material to form a conductive interconnection layer. The power pin and the first pin are electrically connected through the conductive interconnection layer; or the second pin and the load are electrically connected through the conductive interconnection layer. In addition, the direction of the drilling can be parallel to the substrate or perpendicular to the substrate, which is not specifically limited in the embodiment of the present application.

[0094] Step S103: Assembling a power regulation module on top of the substrate.

[0095] Specifically, Fig.11 Zhong (6) and Fig.12 As shown in (6), a power regulating module is assembled on the top of the substrate so that the power pin of the power regulating module is electrically connected to the first pin of the M pins. In addition, other related passive components, such as capacitors and resistors, can also be assembled on the top of the substrate.

[0096] In other embodiments, the present application also provides a power supply system, including a load and a power supply device as described in any one of the above embodiments, wherein the power supply device as described in any one of the above embodiments is back-mounted with the load and is used to supply power to the load. Fig.13 , Fig.13 Schematic diagram of a power supply system provided in an embodiment of the present application. Fig.13 As shown in (1), the power supply system includes two power supply devices, such as power supply device 1 and power supply device 2, which can supply power to the load respectively. Moreover, since the two power supply devices and the load are in a vertical back-mounted structure, the power supply system can achieve double-sided heat dissipation, that is, it includes two heat dissipation plates. Fig.13As shown in (2), the power supply device 1 and the power supply device 2 can be the power supply device as described in any one of the above embodiments. The inductor is embedded inside the substrate, which can reduce the horizontal wiring between the power regulation module and the load and shorten the power path. In addition, the embodiment of the present application embeds the inductor inside the substrate. Compared with the situation where the power regulation module and the inductor are directly located on the top of the load, the overall height of the power supply device is greatly reduced, which is more suitable for height-restricted scenes and small-volume scenes, and has more application scenarios. Compared with the situation where the power regulation module and the inductor are laid flat on one side of the load, the power path length between the power regulation module, the inductor and the load is further reduced, thereby improving the reliability and power density of the power supply device and reducing the output power wiring loss on the system board.

[0097] In some other embodiments, the embodiments of the present application further provide a chip, which includes a circuit and a power supply device as described in any one of the above embodiments and applied to the circuit.

[0098] In some other embodiments, the embodiments of the present application further provide a chip module, including: a chip and the chip as a load fixed on a power supply device as described in any one of the above embodiments.

[0099] In some other embodiments, the embodiments of the present application further provide an electronic device, comprising a chip and a power supply device as described in any one of the above embodiments, wherein the electronic device supplies power to the chip through the power supply device as described in any one of the above embodiments.

[0100] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0101] The above is a preferred implementation of the embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present application. These improvements and modifications are also regarded as the protection scope of the embodiment of the present application.

[0102] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the above-mentioned units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0103] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0104] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0105] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A power supply device, characterized in that: The device comprises an inductor, a power regulating module and a substrate; the inductor comprises a first surface and a second surface opposite to each other; wherein, The inductor is embedded in the substrate; the inductor includes M pins, where M is an integer greater than or equal to 2; a first pin among the M pins is located on a first surface of the inductor, and a second pin among the M pins is located on a second surface of the inductor; The power regulating module is located on the top of the substrate, and a power pin of the power regulating module is electrically connected to a first pin among the M pins; The second pin among the M pins is connected to a load as an output pin of the power supply device, and supplies power to the load.

2. The power supply device according to claim 1, characterized in that: The substrate includes a conductive interconnection layer, and the conductive interconnection layer is used to connect the power pin and the first pin; or the conductive interconnection layer is used to connect the second pin and the load.

3. The power supply device according to claim 1, characterized in that: The substrate includes one or more power vias, each of which vertically penetrates the substrate, and at least one of the one or more power vias is located within the orthographic projection area of ​​the power regulation module on the substrate.

4. The power supply device according to claim 1, characterized in that: The orthographic projection of the power regulating module on the substrate overlaps with the position of the first pin in the substrate.

5. The power supply device according to claim 1, characterized in that: The device also includes a heat sink, which is located above the power regulation module and is used to dissipate heat for the power supply device.

6. The power supply device according to claim 1, characterized in that: The device also includes a circuit board; One side of the circuit board is connected to the bottom of the substrate, and the other side of the circuit board is connected to the load, wherein in a direction parallel to the one side of the circuit board, the orthographic projection of the second pin in the substrate on the one side of the circuit board overlaps with the orthographic projection of the load on the other side of the circuit board.

7. The power supply device according to claim 1, characterized in that: The circuit board includes a conductive path perpendicular to one side of the circuit board. The conductive path is the shortest path that runs through the circuit board. The conductive path is used to electrically connect the second pin and the load so that the power regulation module supplies power to the load.

8. A method for preparing a power supply device, characterized in that: The method comprises: A substrate with an inductor embedded therein is prepared, wherein the inductor comprises a first surface and a second surface opposite to each other, the inductor comprises M pins, M is an integer greater than or equal to 2; a first pin among the M pins is located on the first surface of the inductor, and a second pin among the M pins is located on the second surface of the inductor; and the second pin among the M pins is connected to a load as an output pin of the power supply device; A power regulating module is assembled on the top of the substrate so that a power pin of the power regulating module is electrically connected to a first pin among the M pins.

9. The method according to claim 8, characterized in that The preparation of the substrate having an inductor embedded therein comprises: preparing the inductor; forming a resin layer by a resin material, wherein the thickness of the resin layer corresponds to the thickness of the inductor, and the thickness of the inductor is the distance between the first surface and the second surface; Based on the shape of the inductor, a cavity is prepared on the surface of the resin layer, and the cavity penetrates the resin layer; Mounting the inductor in the chamber, wherein the first surface and the second surface of the inductor opposite to each other are exposed to the upper and lower sides of the resin layer respectively; The resin material is pressed on the upper and lower sides of the resin layer to form a substrate with an inductor embedded therein.

10. The method according to claim 9, characterized in that The method further comprises: Drill holes and fill with conductive material at one or more target positions on the surface of the resin layer laminated with the resin material to form a conductive interconnect layer, so that the power pin and the first pin are electrically connected through the conductive interconnect layer; or, the second pin and the load are electrically connected through the conductive interconnect layer.

11. A chip module, characterized in that: include: A chip and a power supply device as described in any one of claims 1 to 7, wherein the chip is fixed on the power supply device as described in any one of claims 1 to 7.

12. An electronic device, characterized in that: The electronic device comprises a chip and a power supply device as described in any one of claims 1 to 7, wherein the electronic device supplies power to the chip through the power supply device as described in any one of claims 1 to 7.

13. A power supply system, characterized in that: It comprises a load and a power supply device as described in any one of claims 1 to 7, wherein the power supply device as described in any one of claims 1 to 7 is used to supply power to the load.

Images