Heat dissipation assembly, method for preparing heat dissipation assembly and electronic equipment

Abstract

The invention discloses a heat dissipation assembly, a method for preparing the heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a liquid cooling plate, the interior of the liquid cooling plate is provided with a cooling liquid flow channel, and the liquid cooling plate is provided with a cooling liquid inlet and a cooling liquid outlet which are communicated with the cooling liquid flow channel; the piezoelectric ceramic pump is arranged on one side of the liquid cooling plate, and the piezoelectric ceramic pump is provided with a pumping-in port and a pumping-out port; the connecting piece is located between the liquid cooling plate and the piezoelectric ceramic pump and used for connecting the liquid cooling plate and the piezoelectric ceramic pump, at least part of the liquid cooling plate is made of a metal material, the material forming the connecting piece is a high polymer material, and the part, making contact with the connecting piece, of the piezoelectric ceramic pump is the same as the material of the connecting piece. Therefore, the heat dissipation assembly with excellent heat uniformizing capability can be obtained.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular, to a heat dissipation component, a method for preparing a heat dissipation component, and an electronic device. Background Art

[0002] With the evolution of terminal electronic products over the years, their functions have become richer, but this is accompanied by a significant increase in power consumption. On the other hand, in order to obtain a better interpersonal interaction experience, the size (size and thickness) of smart terminals has always been strictly limited. Therefore, based on the joint considerations of heat dissipation and size, thermal regulation of terminal products has become a key research direction for electronic equipment manufacturers. At present, conventional passive heat dissipation technologies in related technologies such as graphite sheets, thermal pads, VC (Vacuum Chamber) heat spreaders and other heat dissipation components have entered their technical bottleneck period, and there is little room for improvement in their heat dissipation capabilities. Therefore, it is urgent to develop more efficient active heat dissipation technologies to make up for the defects in related technologies.

[0003] Therefore, the current heat dissipation components, methods for preparing heat dissipation components, and electronic devices still need to be improved. Summary of the invention

[0004] In one aspect of the present application, the present application proposes a heat dissipation component, including: a liquid cooling plate, the interior of the liquid cooling plate has a cooling liquid flow channel, the interior of the cooling liquid flow channel is sealed with cooling liquid, the liquid cooling plate has a cooling liquid inlet and a cooling liquid outlet connected to the cooling liquid flow channel; a piezoelectric ceramic pump, the piezoelectric ceramic pump is arranged on one side of the liquid cooling plate, the piezoelectric ceramic pump has a pump inlet port and a pump outlet port; a connector, the connector is located between the liquid cooling plate and the piezoelectric ceramic pump, and is used to connect the liquid cooling plate and the piezoelectric ceramic pump, wherein the liquid cooling plate is at least partially formed of a metal material, the material forming the connector is a polymer material, and the portion where the piezoelectric ceramic pump and the connector are in contact is the same material as the connector. Thus, a heat dissipation component with better heat uniformity can be obtained.

[0005] In another aspect of the present application, the present application proposes a method for preparing a heat dissipation component, comprising: fixing a piezoelectric ceramic pump and a liquid cooling plate through a connector to obtain the heat dissipation component, wherein the liquid cooling plate is at least partially formed of a metal material, the material forming the connector is a polymer material, and the portion where the piezoelectric ceramic pump and the connector are connected is the same material as the connector. Thus, a heat dissipation component with excellent heat uniformity can be obtained by a relatively simple method.

[0006] In another aspect of the present application, the present application proposes an electronic device, comprising: a display screen; a middle frame assembly, the middle frame assembly comprising the aforementioned heat dissipation assembly, or the middle frame assembly comprising the heat dissipation assembly prepared by the aforementioned method; and a mainboard, the middle frame assembly being located between the display screen and the mainboard. Therefore, the electronic device has all the features and advantages of the aforementioned heat dissipation assembly, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0008] Figure 1 A partial structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application is shown;

[0009] Figure 2 A schematic diagram showing a process of a method for preparing a heat dissipation component according to an embodiment of the present application is shown;

[0010] Figure 3 A schematic diagram of the structure of a heat dissipation assembly according to an embodiment of the present application is shown;

[0011] Figure 4 A schematic structural diagram of a heat dissipation assembly according to another embodiment of the present application is shown;

[0012] Figure 5 A schematic structural diagram of a heat dissipation assembly according to another embodiment of the present application is shown;

[0013] Figure 6 A schematic structural diagram of a heat dissipation assembly according to another embodiment of the present application is shown;

[0014] Figure 7 A schematic diagram showing a process of a method for preparing a heat dissipation component according to an embodiment of the present application is shown;

[0015] Figure 8 A schematic flow chart of a method for preparing a heat dissipation component according to another embodiment of the present application is shown;

[0016] Fig. 9 A schematic flow chart of a method for preparing a heat dissipation component according to yet another embodiment of the present application is shown.

[0017] Description of reference numerals:

[0018] 100: liquid cooling plate; 110: first cover body; 120: second cover body; 130: coolant flow channel; 140: second coolant flow channel; 131: coolant inlet; 132: coolant outlet; 200; connector; 210: first through hole; 220: second through hole; 300: piezoelectric ceramic pump; 400: injection molding polymer; 500: middle frame. DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0020] This application is based on the inventor's discovery and understanding of the following facts and problems:

[0021] The active heat dissipation component in the related art usually has an internal flow channel composed of a three-layer polymer film structure, and the layers are connected by welding, so that a high-reliability connection can be formed by a simple welding method. The inventor found that although the sandwich structure formed by the three-layer polymer film can better achieve high-reliability welding between the drive pump and the flow channel film, the polymer material will cause the heat dissipation module's uniform heat ability to be weakened. Specifically, the heat transfer path in the heat dissipation component is as follows: first, the heat from the heat source passes through the polymer film in the thickness direction of the polymer film to transfer the heat to the cooling liquid inside the flow channel; then, the cooling liquid carries the heat to other cold areas in the flow channel under the drive of the drive pump; finally, the heat in the cold area passes through the polymer film again along the thickness direction and is transferred to other areas. During the entire heat transfer process, when the heat passes through the polymer film along the thickness direction, due to the poor thermal conductivity of the polymer material, there is a large thermal resistance, which greatly affects the uniform heat effect of the heat dissipation component.

[0022] Furthermore, the inventors have also found that the heat dissipation components made of high molecular polymer materials are usually connected to the electronic device, such as the middle plate / middle frame of a mobile phone, by bonding or injection molding. In the scenario where the electronic device is drastically reduced in weight or thinning, it is often necessary to hollow out part or all of the middle plate area for placing the heat dissipation component. If the heat dissipation component is connected to the middle plate / middle frame by bonding, due to the poor rigidity of the polymer film, the flatness of the heat dissipation module itself is poor under the above conditions, which can easily affect the bonding flatness, resulting in a significant decrease in yield. If the heat dissipation component is connected to the middle plate / middle frame by injection molding, since the polymer film is very sensitive to high temperature, if the high temperature insulation control is not good, the high heat of the injection molding process can easily cause the polymer film to deform and warp, making it impossible for the module to arrange and stack subsequent components.

[0023] The present application aims to alleviate or solve at least one of the above-mentioned problems to at least some extent.

[0024] In one aspect of the present application, the present application proposes a heat dissipation component, referring to Figure 1 and Figure 3 , including: a liquid cooling plate, the liquid cooling plate has a cooling liquid channel 130 inside, the cooling liquid channel 130 is sealed with cooling liquid inside, and the liquid cooling plate has a cooling liquid inlet 131 and a cooling liquid outlet 132 connected to the cooling liquid channel 130; a piezoelectric ceramic pump 300, the piezoelectric ceramic pump 300 is arranged on one side of the liquid cooling plate, and the piezoelectric ceramic pump 300 has a pump inlet port and a pump outlet port (not shown in the figure); a connector 200, the connector 200 is located between the liquid cooling plate and the piezoelectric ceramic pump 300, and is used to connect the liquid cooling plate and the piezoelectric ceramic pump 300, wherein the liquid cooling plate is at least partially formed of a metal material, the material forming the connector 200 is a polymer material, and the part of the piezoelectric ceramic pump 300 that contacts the connector 200 is the same as the material of the connector 200. The connector 200 formed by the injection molding process of the piezoelectric ceramic pump 300 serves as a transition structure, so as to be fixedly connected to the liquid cooling plate. By first injecting the connector and then welding the piezoelectric ceramic pump, the problem of the difficulty of directly welding and fixing the piezoelectric ceramic pump and the metal liquid cooling plate is solved. The liquid cooling plate effectively reduces the thermal resistance of heat entering the heat dissipation component in the thickness direction, greatly improving the uniform heat dissipation effect of the heat dissipation component; by using a metal liquid cooling plate with high rigidity and good heat resistance, the problem of assembly difficulty caused by poor flatness and high temperature resistance of polymer film polymer is effectively avoided.

[0025] According to some embodiments of the present application, the specific manner in which the connector connects the liquid cooling plate and the piezoelectric ceramic pump is not particularly limited. For example, Figure 1 and Figure 3 The connecting member 200 may have a first through hole 210 and a second through hole 220, one end of the first through hole 210 is connected to the coolant inlet 131, the other end of the first through hole 210 is connected to the pump outlet port, one end of the second through hole 220 is connected to the coolant outlet 132, and the other end of the second through hole 220 is connected to the pump inlet port, thereby realizing the connection between the liquid cooling plate and the piezoelectric ceramic pump 300.

[0026] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0027] According to some embodiments of the present application, the depth of the coolant flow channel is not particularly limited. For example, in the thickness direction of the liquid cooling plate, the depth of the coolant flow channel is not less than 0.05 mm. As a result, the volume of the fluid in the coolant flow channel can be relatively moderate, which can not only achieve rapid flow under the drive of the piezoelectric ceramic pump, but also better absorb the heat transferred from the hot zone to the liquid cooling plate, thereby achieving a good uniform heating effect.

[0028] According to some embodiments of the present application, the structure of the liquid cooling plate is not particularly limited. Figure 1 and Figure 3 The liquid cooling plate may include a first cover 110 and a second cover 120 that are arranged opposite to each other, and the cooling liquid flow channel 130 is sealed between the first cover 110 and the second cover 120. According to other embodiments of the present application, the thickness of the first cover and the thickness of the second cover are not particularly limited. For example, the thickness of the first cover and the thickness of the second cover may be 0.2-0.8 mm, respectively. When the thickness of the first cover and the thickness of the second cover are within the above range, the liquid cooling plate can have good rigidity and thermal conductivity, and will not be too heavy due to the excessive size of the heat dissipation component, which reduces the user experience of the electronic device.

[0029] In this application, all the numbers disclosed herein are approximate values, regardless of whether the words "about" or "approximately" are used. The value of each number may differ by less than 10% or by a reasonable difference considered by those skilled in the art, such as 1%, 2%, 3%, 4% or 5%.

[0030] In the description of the present application, it should be understood that the terms "depth", "thickness", "up", "down", etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] According to some embodiments of the present application, the structure of the liquid cooling plate is not particularly limited. Figure 4 The liquid cooling plate 100 may be an integrated structure, and the liquid cooling plate 100 may be formed entirely of metal materials. By integrating the liquid cooling plate formed by the first cover and the second cover on the same metal plate, the heat dissipation capability and mechanical reliability of the heat dissipation assembly can be effectively improved, the process steps can be greatly saved, the process efficiency can be improved, and there will be no failure problem caused by poor welding between the first cover and the second cover.

[0032] According to some embodiments of the present application, the type of metal material forming the liquid cooling plate is not particularly limited. For example, the metal material forming the liquid cooling plate may include at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel.

[0033] According to some embodiments of the present application, the portion forming the contact between the piezoelectric ceramic pump 300 and the connector 200 is consistent with the material of the connector 200. Specifically, the portion forming the contact between the piezoelectric ceramic pump and the connector and the material of the connector may respectively include at least one of polyethylene terephthalate, polybutylene terephthalate, polycarbonate and polymethyl methacrylate.

[0034] According to some embodiments of the present application, the structure of the heat dissipation assembly is not particularly limited. For example, Figure 3-Figure 6 The heat dissipation assembly may further include a middle frame 500, and the middle frame 500 is disposed at least partially around the liquid cooling plate 100 of the heat dissipation assembly, wherein the material forming the middle frame 500 is a metal material.

[0035] According to some embodiments of the present application, the connection method between the middle frame and the liquid cooling plate is not particularly limited. For example, Figure 3 and Figure 4 The middle frame 500 and the liquid cooling plate 100 can be connected by injection molding polymer 400. The heat dissipation component can be firmly connected to the metal middle frame (no material in the middle plate area) through a relatively simple nano injection molding process.

[0036] According to some embodiments of the present application, the structure of the middle frame is not particularly limited. For example, the surface of the middle frame 500 close to the liquid cooling plate 100 may have a groove, and the groove may be filled with the injection molding polymer 400, thereby improving the bonding strength between the injection molding polymer and the middle frame, as well as the bonding strength between the liquid cooling plate and the middle frame.

[0037] According to some embodiments of the present application, the connection method between the middle frame and the liquid cooling plate is not particularly limited. For example, Figure 5 and Figure 6 , the middle frame 500 and the liquid cooling plate 100 can be an integrated structure. By using 3D printing technology to integrate the first cover and the second cover of the liquid cooling plate into an integrated structure, and using 3D printing technology to integrate the metal liquid cooling plate 100 and the metal middle frame 500 into an integrated structure, the heat dissipation capacity and mechanical reliability of the heat dissipation component can be effectively improved, the process steps can be greatly saved, the process efficiency can be improved, and there will be no reliability risk caused by poor local injection molding connection.

[0038] According to some embodiments of the present application, the type of metal material forming the middle frame is not particularly limited. For example, the metal material forming the middle frame may include at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel.

[0039] According to some embodiments of the present application, the structure of the middle frame is not particularly limited. For example, Figure 6 When the middle frame 500 and the liquid cooling plate 100 are an integrated structure, the middle frame 500 may have a second cooling liquid channel 140 inside, and the second cooling liquid channel 140 is connected to the cooling liquid channel 130 inside the liquid cooling plate 100. Therefore, not only the original middle plate area in the middle frame can be used as the cooling liquid channel 130 area, but also part of the middle frame 500 can be used as the second cooling liquid channel 140 area, so that the cooling liquid can be driven by the piezoelectric ceramic pump 400 to flow at high speed in the channel of the entire liquid cooling plate 100 and the middle frame 500 to transfer heat, effectively improving the overall uniform heat dissipation effect of the heat dissipation component.

[0040] In another aspect of the present application, the present application proposes a method for preparing a heat dissipation component, comprising: fixing a piezoelectric ceramic pump and a liquid cooling plate through a connector to obtain a heat dissipation component, wherein the liquid cooling plate is at least partially formed of a metal material, the material forming the connector is a polymer material, and the portion where the piezoelectric ceramic pump and the connector are connected is the same material as the connector. Specifically, the method for preparing the heat dissipation component comprises the following steps:

[0041] According to some embodiments of the present application, for example, referring to Figure 2 , a method for preparing a heat dissipation component may include:

[0042] S10: Liquid cooling plate provided

[0043] According to some embodiments of the present application, in this step, a liquid cooling plate is provided. Specifically, providing the liquid cooling plate may include: referring to Figure 3, providing a first cover body 110 and a second cover body 120; forming a coolant channel 130 on the first cover body 110 and / or the second cover body 120 through a molding process; sealing the coolant channel 130 between the first cover body 110 and the second cover body 120 through a second welding process, wherein the molding process may include at least one of a die-casting process and a machining process, and the second welding process may include at least one of brazing, diffusion welding and stir friction welding. Specifically, providing a liquid cooling plate may include: first, selecting two metal covers, whose material may be selected from at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel as required; then, machining a cooling liquid channel with a depth of not less than 0.05 mm on one side of a metal cover by a machining process, or die-casting a cooling liquid channel structure between the first cover and the second cover by a die-casting method; then, machining a cooling liquid channel inlet and a cooling liquid channel outlet at a preset position of a piezoelectric ceramic pump on a surface plate of the metal cover away from the cooling liquid channel by a machining process; then, connecting and sealing the above two metal covers by welding; making a connector at the inlet and outlet positions of the cooling liquid channel by a nano injection molding method, wherein the connector has a first through hole and a second through hole, and the first through hole and the second through hole respectively coincide with the opening positions of the cooling liquid channel inlet and the cooling liquid channel outlet; finally, installing the piezoelectric ceramic pump on the connector by a welding process, and the first through hole and the second through hole respectively coincide with the opening positions of the pump outlet port and the pump inlet port.

[0044] It can be understood that when the surface plate on the side of the metal cover body facing away from the cooling liquid flow channel is machined into the cooling liquid flow channel inlet and the cooling liquid flow channel outlet at the preset position of the piezoelectric ceramic pump through a machining process, a liquid injection port can also be formed on the liquid cooling plate through a machining process. After the piezoelectric ceramic pump is installed, the cooling liquid flow channel inside the liquid cooling plate can be injected with cooling liquid through the liquid injection port, and the liquid injection port can be sealed after injection to form the final metal heat dissipation component.

[0045] According to some embodiments of the present application, the type of metal material of the liquid cooling plate formed by welding the first cover body and the second cover body is not particularly limited. For example, the metal material forming the liquid cooling plate may include at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel.

[0046] In the description of the present application, "A and / or B" may include the case of A alone, the case of B alone, or any of the cases of A and B, where A and B are only used for examples and may be any technical feature connected by "and / or" in the present application.

[0047] According to some embodiments of the present application, in this step, a liquid cooling plate is provided. Specifically, providing the liquid cooling plate may include: referring to Figure 4, providing a liquid cooling plate includes: forming a liquid cooling plate 100 with an integrated structure by a 3D printing process. By integrating the liquid cooling plate formed by the first cover and the second cover on the same metal plate by 3D printing, the heat uniformity and mechanical reliability of the heat dissipation component can be effectively improved, the process steps can be greatly saved, the process efficiency can be improved, and there will be no failure problem caused by poor welding between the first cover and the second cover.

[0048] According to some embodiments of the present application, the type of metal material forming the liquid cooling plate by 3D printing is not particularly limited. For example, the metal material forming the liquid cooling plate may include at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel; preferably, the metal material forming the liquid cooling plate may include at least one of aluminum alloy, titanium alloy and stainless steel.

[0049] S20: Forming connectors through nano-injection molding

[0050] According to some embodiments of the present application, in this step, a connector is formed at the coolant inlet and the coolant outlet of the liquid cooling plate by a nano injection molding process, and the material of the connector can be consistent with the aforementioned material, which will not be described in detail here. Since the liquid cooling plate made of metal material has greater rigidity and higher temperature resistance, the high temperature has less effect on the flatness of the liquid cooling plate during the nano injection molding process of the connector, and it can still maintain a high degree of flatness.

[0051] S30: Fixing the piezoelectric ceramic pump by welding

[0052] According to some embodiments of the present application, in this step, the piezoelectric ceramic pump is fixed to the connecting member by welding to obtain a heat dissipation assembly.

[0053] According to some embodiments of the present application, the welding process for mounting the piezoelectric ceramic pump on the connector is not particularly limited. For example, the welding process for mounting the piezoelectric ceramic pump on the connector may include at least one of hot pressing welding, laser welding, and ultrasonic welding. Since the portion where the piezoelectric ceramic pump 300 contacts the connector 200 is consistent with the material of the connector 200, the welding layer between the piezoelectric ceramic pump and the connector can have high reliability and high sealing.

[0054] According to other embodiments of the present application, for example, referring to Figure 7 , the method for preparing the heat dissipation component may further include:

[0055] S100: Liquid cooling plate provided

[0056] According to some embodiments of the present application, a liquid cooling plate is provided in this step.

[0057] It should be noted that the method for providing the liquid cooling plate may refer to part or all of the steps in the aforementioned preparation method, and the relevant parameters of the liquid cooling plate may refer to part or all of the technical features in the aforementioned embodiments, which will not be repeated here.

[0058] S200: Liquid cooling plate is fixed to the middle frame

[0059] According to some embodiments of the present application, the method of connecting and fixing the liquid cooling plate to the middle frame is not particularly limited. For example, Figure 8 The liquid cooling plate can be connected and fixed to the middle frame through the injection molding process.

[0060] According to some embodiments of the present application, when the liquid cooling plate is fixed to the middle frame by an injection molding process, the material forming the middle frame is not particularly limited. For example, the metal material forming the middle frame may include at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel.

[0061] According to some embodiments of the present application, the method of connecting and fixing the liquid cooling plate to the middle frame is not particularly limited. For example, Fig. 9 , connecting and fixing the liquid cooling plate to the middle frame may include: forming a liquid cooling plate and a middle frame with an integrated structure through a 3D printing process. By using a 3D printing process to form an integrated structure with the middle frame and the liquid cooling plate, it is no longer necessary to connect the two through the aforementioned nano injection molding process, which can effectively improve the heat dissipation capacity and mechanical reliability of the heat dissipation component, greatly save process steps, improve process efficiency, and there will be no failure problems caused by poor welding between the first cover body and the second cover body, and there will be no reliability risks caused by poor local injection molding connection.

[0062] According to some embodiments of the present application, when a liquid cooling plate and a middle frame of an integrated structure are formed by a 3D printing process to fix the liquid cooling plate to the middle frame, the material forming the middle frame is not particularly limited. For example, the metal material forming the middle frame may include at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel; preferably, the metal material forming the middle frame may include at least one of aluminum alloy, titanium alloy and stainless steel.

[0063] S300: A connector and a piezoelectric ceramic pump are sequentially arranged on one side of the liquid cooling plate.

[0064] According to some embodiments of the present application, in this step, a connector and a piezoelectric ceramic pump are sequentially arranged on one side of the liquid cooling plate.

[0065] It should be noted that the above-mentioned method of setting the connecting parts and piezoelectric ceramic pump can refer to part or all of the steps in the above-mentioned preparation method, and the relevant parameters of the above-mentioned connecting parts and piezoelectric ceramic pump can refer to part or all of the technical features in the above-mentioned embodiments, which will not be repeated here.

[0066] In another aspect of the present application, the present application proposes an electronic device, comprising: a display screen; a middle frame assembly, the middle frame assembly comprising the aforementioned heat dissipation assembly, or the middle frame assembly comprising the heat dissipation assembly prepared by the aforementioned method; and a mainboard, the middle frame assembly being located between the display screen and the mainboard. Thus, the electronic device has all the features and advantages of the aforementioned heat dissipation assembly, which will not be described in detail here.

[0067] According to some embodiments of the present application, the setting position of the piezoelectric ceramic pump is not particularly restricted. For example, the piezoelectric ceramic pump of the liquid cooling plate in the middle frame assembly can be located on the side of the middle frame assembly away from the display screen, that is, the side facing the main board, thereby taking advantage of the larger space on the main board side to meet the requirements for the setting space of the protrusion of the piezoelectric ceramic pump on the liquid cooling plate, and avoiding the protrusion of the piezoelectric ceramic pump being set toward the display screen side to make the surface of the display screen side uneven.

[0068] Unless otherwise specified, all scientific and technological terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. All patents and publications related to this application are incorporated herein by reference in their entirety. The term "comprising" or "including" is an open expression, i.e., including the content specified in this application, but does not exclude the content of other aspects.

[0069] In the description of this specification, the description with reference to the terms "one embodiment", "another embodiment", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory. In addition, it should be noted that in this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0070] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A heat dissipation component, characterized in that: include: A liquid cooling plate, wherein the liquid cooling plate has a cooling liquid flow channel inside, the cooling liquid flow channel is sealed with cooling liquid inside, and the liquid cooling plate has a cooling liquid inlet and a cooling liquid outlet connected to the cooling liquid flow channel; A piezoelectric ceramic pump, the piezoelectric ceramic pump is arranged on one side of the liquid cooling plate, and the piezoelectric ceramic pump has a pump inlet port and a pump outlet port; A connecting piece, the connecting piece is located between the liquid cooling plate and the piezoelectric ceramic pump, and is used to connect the liquid cooling plate and the piezoelectric ceramic pump, wherein the liquid cooling plate is at least partially formed of a metal material, the material forming the connecting piece is a polymer material, and the portion where the piezoelectric ceramic pump and the connecting piece are connected is the same material as the connecting piece.

2. The heat dissipation assembly according to claim 1, characterized in that: The connecting member has a first through hole and a second through hole, one end of the first through hole is connected to the coolant inlet, the other end of the first through hole is connected to the pump outlet port, one end of the second through hole is connected to the coolant outlet, and the other end of the second through hole is connected to the pump inlet port.

3. The heat dissipation assembly according to claim 1, characterized in that: In the thickness direction of the liquid cooling plate, the depth of the cooling liquid flow channel is not less than 0.05 mm; And / or, the liquid cooling plate comprises a first cover body and a second cover body which are arranged opposite to each other, the cooling liquid flow channel is sealed between the first cover body and the second cover body, and the thickness of the first cover body and the thickness of the second cover body are 0.2-0.8 mm respectively.

4. The heat dissipation assembly according to claim 1, characterized in that: The liquid cooling plate is an integrated structure, and the liquid cooling plate is formed by the metal material.

5. The heat dissipation assembly according to claim 1, characterized in that: The metal material includes at least one of aluminum alloy, copper alloy, magnesium alloy, titanium alloy and stainless steel; And / or, the polymer material includes at least one of polyethylene terephthalate, polybutylene terephthalate, polycarbonate and polymethyl methacrylate.

6. The heat dissipation assembly according to claim 1, characterized in that: Further including: A middle frame, wherein the middle frame is at least partially arranged around the liquid cooling plate of the heat dissipation assembly, wherein the material forming the middle frame is a metal material.

7. The heat dissipation assembly according to claim 6, characterized in that: The middle frame and the liquid cooling plate are connected by injection-molded polymer.

8. The heat dissipation assembly according to claim 7, characterized in that: The middle frame and the liquid cooling plate are an integrated structure.

9. The heat dissipation assembly according to claim 8, characterized in that: A second coolant flow channel is provided inside the middle frame, and the second coolant flow channel is connected to the coolant flow channel inside the liquid cooling plate.

10. The heat dissipation assembly according to claim 1, characterized in that: The piezoelectric ceramic pump is welded and fixed on the connecting piece.

11. The heat dissipation assembly according to claim 1, characterized in that: The connecting piece is formed at the coolant inlet and the coolant outlet of the liquid cooling plate by the polymer material through a nano injection molding process.

12. A method for preparing a heat dissipation component, characterized in that: include: Provide liquid cooling plate; The piezoelectric ceramic pump is fixedly connected to the liquid cooling plate through a connecting piece to obtain the heat dissipation assembly, wherein the liquid cooling plate is at least partially formed of a metal material, the material forming the connecting piece is a polymer material, and the portion where the piezoelectric ceramic pump and the connecting piece are connected is the same material as the connecting piece.

13. The method according to claim 12, characterized in that The method further comprises: Connectors are formed at the coolant inlet and the coolant outlet of the liquid cooling plate by a nano injection molding process.

14. The method according to claim 12 or 13, characterized in that The provision of the liquid cooling plate comprises: providing a first cover body and a second cover body; forming a coolant flow channel on the first cover body and / or the second cover body through a molding process; and sealing the coolant flow channel between the first cover body and the second cover body through a second welding process, wherein the molding process comprises at least one of a die-casting process and a machining process, and the second welding process comprises at least one of brazing, diffusion welding and stir friction welding.

15. The method according to claim 12 or 13, characterized in that Providing the liquid cooling plate includes: forming the liquid cooling plate with an integrated structure through a 3D printing process.

16. The method according to claim 12, characterized in that The method further comprises: Connecting and fixing the liquid cooling plate to the middle frame; A connector and a piezoelectric ceramic pump are sequentially arranged on one side of the liquid cooling plate.

17. The method according to claim 16, characterized in that The connecting and fixing the liquid cooling plate to the middle frame includes: forming the liquid cooling plate and the middle frame having an integrated structure through a 3D printing process.

18. The method according to claim 12, characterized in that The liquid cooling plate is provided with a liquid injection port by machining. After the liquid cooling plate is connected and fixed to the middle frame, the method further comprises the steps of: Filling the cooling liquid flow channel inside the liquid cooling plate with cooling liquid through the liquid filling port; After the injection, the injection port is sealed.

19. An electronic device, characterized in that: include: A display screen; a middle frame assembly, wherein the middle frame assembly includes the heat dissipation assembly described in any one of claims 1 to 11, or the middle frame assembly includes the heat dissipation assembly prepared by the method described in any one of claims 12 to 18; and a main board, wherein the middle frame assembly is located between the display screen and the main board.

20. The electronic device according to claim 19, characterized in that The piezoelectric ceramic pump of the liquid cooling plate in the middle frame assembly is located at a side of the middle frame assembly away from the display screen.

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