Novel vacuum radiator for flexible circuit board
By designing a driving component in the vacuum radiator to deflect the fixed tube and the extension tube back and forth, the problem of local high-temperature heat accumulation in the flexible circuit board that is difficult to dissipate is solved, achieving rapid cooling and improving heat dissipation efficiency.
Patent Information
- Application Number
- CN202411693427.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2044-11-25
AI Technical Summary
The airflow between the existing vacuum radiators is relatively stable between the flexible circuit board and the radiator, making it difficult to quickly dissipate heat at local high temperatures.
A new type of vacuum radiator is designed, including a mounting bracket and a main body of the vacuum radiator. The fixed tube and the extension tube are deflected back and forth through the driving assembly, changing the distance between the flexible circuit board and the extension tube, and promoting the air flow along the direction of the extension tube. Quickly disperse local high temperatures.
The rapid cooling of the flexible circuit board is achieved, and the instantaneous and efficiency of heat dissipation is improved. Through the design of the capillary and opening the hole, the flowing medium flows and the dispersing effects of the heat.
Smart Images

Figure CN119342772A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of vacuum radiators, and in particular to a novel vacuum radiator for a flexible circuit board. Background Art
[0002] Flexible circuit boards refer to printed circuit boards made of substrates such as polyimide. In order to ensure the effectiveness of flexible circuit boards for long-term use, heat sinks are often used around the flexible circuit boards.
[0003] However, conventional means for the heat dissipation structure of flexible circuit boards generally only set heat sinks on the outer part of the circuit board to assist in heat dissipation, and the heat dissipation efficiency is low; vacuum radiators mainly use superconducting liquid, a highly efficient thermal conductive medium, instead of traditional water, and use superconducting liquid to circulate heat in a vacuum-sealed pipeline to dissipate heat and cool the outside of the circuit board. However, the airflow between the circuit board and the radiator is often relatively stable, and when the circuit board is locally hot, it is easy to cause heat to accumulate and be difficult to dissipate quickly. Therefore, a new type of heat dissipation device is designed to improve the immediacy and heat dissipation effect of heat dissipation. Summary of the invention
[0004] Based on the technical problems of the background technology, the present invention proposes a novel vacuum heat sink for a flexible circuit board.
[0005] The present invention proposes a novel vacuum heat sink for a flexible circuit board, comprising a mounting frame and a vacuum heat sink body, wherein the flexible circuit board body is arranged on the mounting frame; a mounting cavity with two ends opened is arranged in the middle position of the mounting frame, and the vacuum heat sink body is provided with two fixed tubes, which are respectively located at the two ends of the mounting cavity; a plurality of extension tubes are connected to the outer wall of the fixed tube toward the middle of the mounting frame, and the extension tubes on the two fixed tubes are arranged alternately at intervals; two groups of drive components are arranged in the mounting frame, and the two groups of drive components respectively drive the two fixed tubes to rotate around their own axes; a through groove is opened at the top of the mounting frame at a position corresponding to the fixed tube and the extension tube.
[0006] Preferably, the two groups of driving components are respectively arranged on both sides of the installation cavity, and the driving components are provided with an electric guide rail fixed to the inner wall of the bottom of the installation cavity, the electric guide rail is arranged parallel to the extension tube, and the electric guide rail is connected to a connecting frame, and a vertically extending driving block is installed on the connecting frame.
[0007] Preferably, an end of the extension tube away from the fixed tube is provided with an end cap, the outer diameter of the end cap gradually decreases in the direction away from the fixed tube, the top of the driving block is in sliding contact with the bottom outer wall of the extension tube and the bottom outer wall of the end cap, and when the extension tube is placed horizontally, the position of the bottom of the end cap away from the fixed tube is just in contact with the top of the driving block.
[0008] Preferably, a plurality of pads are fixed to both side edge positions of the top outer wall of the mounting frame, and the bottom of the flexible circuit board body is in contact with the top of the pads.
[0009] Preferably, the outer wall of the extension tube is provided with a plurality of capillaries extending inwardly, the capillaries are distributed at the top, bottom and both sides of the extension tube, and two adjacent capillaries are vertically arranged.
[0010] Preferably, an opening is provided outside the extension tube at a position corresponding to the capillary tube, the opening is opened outward, and the inner diameter of the opening gradually decreases toward the inside of the extension tube.
[0011] Preferably, positioning tubes are installed at positions on both sides of the mounting frame corresponding to the ends of the fixed tubes, and the ends of the fixed tubes are rotatably connected to the positioning tubes.
[0012] Preferably, the positioning tube is arranged in a U-shaped structure, and one end of the positioning tube away from the fixing tube extends from under the fixing tube into the installation cavity. Connecting tubes are arranged on both sides of the installation cavity, and both ends of the connecting tubes are connected to the bottom ends of the two positioning tubes on the same side of the mounting frame.
[0013] Preferably, the connecting tube is inclined in both the horizontal and vertical directions, one end of the connecting tube close to the driving block at the same side position is set as the lower part, and the other end of the connecting tube is set as the higher part, the lower part is located below the higher part in the vertical direction, and the bottom is located on one side of the higher part close to the center of the mounting frame in the horizontal direction.
[0014] The beneficial effects of the present invention are:
[0015] 1. In the present invention, the two fixed tubes are reciprocatedly deflected around their own axes by driving components, so that the distances between various positions on the top of a single extension tube and the flexible circuit board body vary differently, and the airflow between the flexible circuit board body and the extension tube flows along the direction of the extension tube, so that the local high-temperature airflow of the flexible circuit board body is quickly dispersed during the swinging process of the two fixed tubes and the corresponding extension tube, so as to achieve rapid cooling.
[0016] 2. In the present invention, the capillaries arranged vertically adjacent to each other in the extension tube cooperate with the swing of the extension tube to improve the flow impact effect of the cooling medium in the extension tube, and the corresponding openings of the capillaries opening outwards can increase the dispersion effect of the airflow on the outer wall of the extension tube, thereby improving the heat exchange and cooling effect between the cooling medium in the extension tube and the external hot air.
[0017] 3. In the present invention, the flow dispersion effect of the cooling medium is improved by the tilted arrangement of the connecting pipes at both sides and the circulation of the cooling medium caused by the swing of the extension pipe. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1This is a schematic diagram of the overall structure of a novel vacuum heat sink for a flexible circuit board proposed by the present invention;
[0019] Figure 2 This is a schematic diagram of the overall structure of a mounting frame for a new type of vacuum heat sink for a flexible circuit board proposed by the present invention;
[0020] Figure 3 A schematic diagram of the main structure of a vacuum heat sink for a novel flexible circuit board proposed by the present invention;
[0021] Figure 4 This is a schematic diagram of the structure of a fixed tube and an extension tube of a novel vacuum heat sink for a flexible circuit board proposed by the present invention;
[0022] Figure 5 A novel vacuum heat sink for a flexible circuit board proposed by the present invention Figure 4 Schematic diagram of the structure of part A;
[0023] Figure 6 A schematic diagram of a capillary structure of a novel vacuum heat sink for a flexible circuit board proposed by the present invention;
[0024] Figure 7 A schematic diagram of the structure of a mounting frame for a new type of vacuum heat sink for a flexible circuit board proposed by the present invention;
[0025] Figure 8 A schematic diagram of the structure of a driving component of a novel vacuum heat sink for a flexible circuit board proposed by the present invention;
[0026] Fig. 9 This is a schematic diagram of the connecting pipe structure of a new type of vacuum radiator for flexible circuit boards proposed by the present invention.
[0027] In the figure: 1 mounting frame, 101 through slot, 2 flexible circuit board body, 3 vacuum radiator body, 4 cushion block, 5 fixing tube, 6 extension tube, 601 end, 7 capillary tube, 8 driving assembly, 9 electric guide rail, 10 connecting frame, 11 driving block, 12 positioning tube, 13 connecting tube, 14 supporting frame. DETAILED DESCRIPTION
[0028] Example 1: Reference Figure 1-Figure 8A novel vacuum heat sink for a flexible circuit board comprises a mounting frame 1 and a vacuum heat sink body 3. A flexible circuit board body 2 is arranged on the mounting frame 1; a mounting cavity with two ends opened is arranged in the middle of the mounting frame 1, and the vacuum heat sink body 3 is provided with two fixed tubes 5, which are respectively located at the two ends of the mounting cavity. The fixed tube 5 is horizontally extended between the two sides of the mounting frame 1, and a plurality of extension tubes 6 are connected to the outer wall of the fixed tube 5 toward the middle of the mounting frame 1. The extension tube 6 is vertically arranged between the fixed tube 5, and one end of the extension tube 6 away from the fixed tube 5 is sealed. The two fixed tubes 5 are arranged to be fixed to the fixed tube 5. The extension tubes 6 on the tube 5 are arranged alternately, and a gap is left between the bottom of the fixed tube 5 and the bottom inner wall of the installation cavity; two sets of driving components 8 are arranged in the mounting frame 1, and the two sets of driving components 8 respectively drive the two fixed tubes 5 to rotate around their own axes, and one set of driving components 8 corresponds to one fixed tube 5; a through groove 101 is opened at the top of the mounting frame 1 corresponding to the fixed tube 5 and the extension tube 6, and the flexible circuit board body 2 is installed at the top position of the mounting frame 1, and the extension tubes 6 outside the two fixed tubes 5 are arranged alternately and kept horizontally in a normal state; when in use, the fixed tube 5 and the corresponding The plurality of extension tubes 6 are filled with cooling medium to perform heat exchange and cooling treatment on the outside of the flexible circuit board body 2; and during operation, the two fixed tubes 5 are reciprocatedly deflected around their own axes respectively through the driving assembly 8, and the extension tube 6 can be rotated upward from the through slot 101 position out of the top of the mounting frame 1, so that the distance between each position of the top of the single extension tube 6 and the flexible circuit board body 2 is changed differently, and the airflow between the flexible circuit board body 2 and the extension tube 6 flows along the extension tube 6 direction, and through the reverse effect of the rotation of the adjacent extension tube 6, the bottom airflow of the flexible circuit board body 2 flows in the extension direction of the fixed tube 5, so that the local high-temperature airflow of the flexible circuit board body 2 is quickly dispersed during the swinging process of the two fixed tubes 5 and the corresponding extension tube 6, so as to achieve rapid cooling, and the softness of the substrate of the flexible circuit board body 2 is used to make the substrate shake with the movement of the airflow, so as to further improve the movement dispersion effect of the airflow around the flexible circuit board body 2, thereby improving the immediacy of heat dissipation and enhancing the heat dissipation effect; at the same time, the reciprocating swing of the extension tube 6 around the axis of the fixed tube 5 improves the flow effect of the internal cooling medium, thereby further improving the heat exchange and cooling efficiency.
[0029] In the present invention, two groups of driving components 8 are respectively arranged at two sides of the installation cavity, and the driving component 8 is provided with an electric guide rail 9 fixed to the inner wall of the bottom of the installation cavity, and the electric guide rail 9 is arranged in parallel with the extension tube 6, and a connecting frame 10 is connected to the electric guide rail 9, and a vertically extending driving block 11 is installed on the connecting frame 10, and an end 601 is provided at the end of the extension tube 6 away from the fixed tube 5, and the outer diameter of the end 601 gradually decreases in the direction away from the fixed tube 5, and the top of the driving block 11 is in sliding contact with the outer wall of the bottom of the extension tube 6 and the outer wall of the bottom of the end 601. When the extension tube 6 is placed horizontally, the position of the bottom of the end 601 away from the fixed tube 5 just contacts with the top of the driving block 11, and the two electric guide rails 9 carry the two connecting frames 10 to move in opposite directions alternately, and the two connecting frames 10 extend in different directions at both ends of the mounting frame 1, respectively, so that the driving blocks 11 in the two driving components 8 are respectively in contact with the ends of the extension tube 6 outside two different fixed tubes 5. Driven by the electric guide rail 9, when the driving block 11 moves toward the middle position of the mounting frame 1 along the connecting frame 10, the driving block 11 approaches the extension tube 6 along the inclined surface of the outer wall of the end 601, so that the extension tube 6 is tilted and rotates with the fixed tube 5. Then, when the driving block 11 moves toward the fixed tube 5 at the bottom of the extension tube 6, the support of the driving block 11 at the bottom is used to gradually increase the inclination angle of the extension tube 6 until the end 601 position begins to deflect upward out of the mounting frame 1. When the electric guide rail 9 moves with the driving block 11 in the direction away from the fixed tube 5, the extension tube 6 will be gradually flattened, thereby realizing the reciprocating deflection of the fixed tube 5 and the extension tube 6, and the driving block 11 is used to improve the horizontal state of the extension tube 6 and the stability during the rotation process; at the same time, the reciprocating movement of the driving block 11 in the mounting cavity and at the bottom of the extension tube 6 is used to increase the airflow movement at the bottom of the mounting cavity, thereby further enhancing the overall heat dissipation and cooling efficiency of the vacuum radiator body 3.
[0030] In the present invention, a plurality of pads 4 are fixed to the edge positions of both sides of the top outer wall of the mounting frame 1, and the bottom of the flexible circuit board body 2 is in contact with the top of the pads 4, so that the area corresponding to the bottom of the flexible circuit board body 2 and the extension tube 6 is suspended to avoid direct contact with the outer wall shell at the top of the mounting frame 1, thereby increasing the flow space of the airflow to improve the heat dispersion effect, and increasing the rotation space of the extension tube 6 to further improve the heat dissipation efficiency and the cooling effect.
[0031] In the present invention, the outer wall of the extension tube 6 is provided with a plurality of inwardly extending capillaries 7, and the capillaries 7 are distributed at the top, bottom and both sides of the extension tube 6, and are vertically arranged between two adjacent capillaries 7. The distributed extension tubes 6 and the capillaries 7 distributed in the extension tube 6 are arranged to increase the outer wall contact area to improve the heat exchange and cooling effect, and the adjacent vertically arranged capillaries 7 in the extension tube 6 cooperate with the swing of the extension tube 6 to improve the flow impact effect of the cooling medium in the extension tube 6, thereby improving the heat exchange and cooling effect between the cooling medium inside the extension tube 6 and the external hot air.
[0032] In the present invention, an opening is provided at a position outside the extension tube 6 corresponding to the capillary tube 7, and the opening is opened outwardly. The inner diameter of the opening gradually decreases toward the inside of the extension tube 6, so that during the reciprocating swing of the extension tube 6, the opening corresponding to the capillary tube 7 opening outward will increase the dispersion effect of the airflow on the outer wall of the extension tube 6, so as to further disperse the airflow during the swing of the extension tube 6 and evenly and quickly exchange heat and cool down.
[0033] Embodiment 2: Embodiment 2 includes all structures and methods of Embodiment 1, with reference to Figure 1-Figure 9 A novel vacuum heat sink for a flexible circuit board. On the basis of Example 1, positioning tubes 12 are installed at positions corresponding to the ends of the fixed tubes 5 on both sides of the mounting frame 1. The ends of the fixed tubes 5 are rotatably connected to the positioning tubes 12. The positioning tubes 12 are arranged in a U-shaped structure. One end of the positioning tube 12 away from the fixed tube 5 extends from the bottom of the fixed tube 5 into the mounting cavity. Connecting tubes 13 are arranged on both sides of the mounting cavity. A supporting frame 14 is fixed between the connecting tube 13 and the inner wall of the bottom of the mounting cavity. Both ends of the connecting tube 13 are connected to the bottom ends of the two positioning tubes 12 on the same side of the mounting frame 1. The connecting tube 13 is inclined in both the horizontal and vertical directions. One end of the connecting tube 13 close to the driving block 11 on the same side is arranged as a low part, and the other end of the connecting tube 13 is arranged as a high part. The low part in the vertical direction is located below the high part, and the bottom part in the horizontal direction is located below the high part. It is located at a side position at a high part close to the center of the mounting frame 1, so that the two fixed tubes 5 and the multiple extension tubes 6 are connected to each other through the positioning tube 12 and the connecting tube 13, and the flow and cooling of the cooling medium can be actively realized through the external pipeline and pump of the positioning tube 12 at the fixed position; during use, the cooling medium circulation caused by the tilting setting of the connecting tubes 13 at the two sides and the swinging of the extension tubes 6 are coordinated to improve the flow dispersion effect of the cooling medium; and because the driving blocks 11 on the driving components 8 at the two sides are respectively located at the two end positions of the mounting cavity, the connecting tubes 13 on both sides are tilted in opposite directions, and the connecting tubes 13 span the adjacent extension tubes 6 and the adjacent extension tubes 6 are deflected in the opposite direction, thereby further improving the airflow movement around the connecting tubes 13, so as to improve the heat exchange and cooling efficiency of the overall vacuum radiator body 3.
[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A novel vacuum heat sink for a flexible circuit board, comprising a mounting frame (1) and a vacuum heat sink body (3), characterized in that: A flexible circuit board body (2) is arranged on the mounting frame (1); A mounting cavity with openings at both ends is provided in the middle of the mounting frame (1); the vacuum heat sink body (3) is provided with two fixed tubes (5), the two fixed tubes (5) are respectively located at the two end positions of the mounting cavity; the outer wall of the fixed tube (5) is connected to a plurality of extension tubes (6) in a direction toward the middle of the mounting frame (1); the extension tubes (6) on the two fixed tubes (5) are arranged alternately at intervals; Two sets of driving components (8) are arranged in the mounting frame (1), and the two sets of driving components (8) respectively drive the two fixed pipes (5) to rotate around their own axes; A through groove (101) is provided at a position on the top of the mounting frame (1) corresponding to the fixed tube (5) and the extension tube (6).
2. A novel vacuum heat sink for a flexible circuit board according to claim 1, characterized in that: The two groups of driving components (8) are respectively arranged at two sides of the installation cavity. The driving components (8) are provided with an electric guide rail (9) fixed to the inner wall of the bottom of the installation cavity. The electric guide rail (9) is arranged parallel to the extension tube (6). The electric guide rail (9) is connected to a connecting frame (10), and a vertically extending driving block (11) is installed on the connecting frame (10).
3. A novel vacuum heat sink for a flexible circuit board according to claim 2, characterized in that: An end of the extension tube (6) away from the fixed tube (5) is provided with an end cap (601), the outer diameter of the end cap (601) gradually decreases in the direction away from the fixed tube (5), the top end of the driving block (11) is in sliding contact with the bottom outer wall of the extension tube (6) and the bottom outer wall of the end cap (601), and when the extension tube (6) is placed horizontally, the position of the bottom of the end cap (601) away from the fixed tube (5) just contacts with the top end of the driving block (11).
4. The novel vacuum heat sink for flexible circuit board according to claim 1 is characterized in that: A plurality of pads (4) are fixed to the edge positions of both sides of the top outer wall of the mounting frame (1), and the bottom of the flexible circuit board body (2) is in contact with the top of the pads (4).
5. The novel vacuum heat sink for flexible circuit board according to claim 1 is characterized in that: The outer wall of the extension tube (6) is provided with a plurality of inwardly extending capillaries (7), the capillaries (7) are distributed at the top, bottom and both sides of the extension tube (6), and are vertically arranged between two adjacent capillaries (7).
6. The novel vacuum heat sink for flexible circuit board according to claim 5, characterized in that: An opening is arranged outside the extension tube (6) at a position corresponding to the capillary tube (7), the opening is opened outward, and the inner diameter of the opening gradually decreases towards the inside of the extension tube (6).
7. A novel vacuum heat sink for a flexible circuit board according to any one of claims 1 to 6, characterized in that: Positioning tubes (12) are installed at positions on both sides of the mounting frame (1) corresponding to the ends of the fixing tubes (5), and the ends of the fixing tubes (5) are rotatably connected to the positioning tubes (12).
8. The novel vacuum heat sink for flexible circuit board according to claim 7, characterized in that: The positioning tube (12) is arranged in a U-shaped structure, and one end of the positioning tube (12) away from the fixing tube (5) extends from below the fixing tube (5) into the installation cavity, and connecting tubes (13) are arranged on both sides of the installation cavity, and both ends of the connecting tube (13) are connected to the bottom ends of the two positioning tubes (12) on the same side of the installation frame (1).
9. The novel vacuum heat sink for flexible circuit board according to claim 8, characterized in that: The connecting pipe (13) is arranged obliquely in both the horizontal and vertical directions, one end of the connecting pipe (13) close to the driving block (11) at the same side is arranged as a low part, and the other end of the connecting pipe (13) is arranged as a high part, the low part is located below the high part in the vertical direction, and the bottom is located at a side position of the high part close to the center of the mounting frame (1) in the horizontal direction.
Citation Information
Patent Citations
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