LED support anti-vulcanization packaging structure and method

Abstract

The invention discloses an LED support anti-vulcanization packaging structure and method. Comprising an LED support and an LED chip, a stacking groove is formed in the LED support, a silver layer is arranged at the bottom of the stacking groove, the LED chip is welded to the silver layer, a protective film is arranged on the upper surface of the silver layer, and the protective film is formed by depositing and stacking any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer and a titanium dioxide layer in sequence from bottom to top in a specific environment. According to the LED support, the protection film is packaged on the outer surface of the silver layer on the LED support, so that erosion of sulfur elements, halogen elements or smelly elements and the like in the external environment to the silver layer is effectively prevented, stable performance of the silver layer is ensured, the stability and reliability of an LED product are further improved, the maintenance cost is reduced, and the service life of the product is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and in particular to an anti-sulfurization packaging structure and method for an LED bracket. Background Art

[0002] With the continuous advancement of LED technology, the structure of LED products on the market is becoming increasingly diversified to meet the application needs of different fields and scenarios. In the manufacturing process of LED products, in order to improve their reflectivity, most LED products use an electroplating silver process on the bottom surface of the bracket. The electroplated silver layer can effectively reflect light and improve the luminous efficiency of the LED. However, as an active metal, silver is prone to chemical reactions with sulfur, halogen or odor elements in the external environment to generate corresponding compounds, causing the silver layer on the surface of the bracket to change color, thereby affecting its reflectivity, and ultimately affecting the luminous efficiency of the LED product, causing product attenuation or dead light.

[0003] In order to solve the anti-sulfurization problem of LED products, a variety of processes and materials have appeared on the market. Among them, a common method is to coat the surface of the LED product or the bottom of the bracket with polymer materials. Polymer materials are widely used in the protection of LED products due to their good chemical stability and physical properties. By coating polymer materials, the direct contact between the external environment and the silver layer at the bottom of the LED bracket can be isolated to a certain extent, thereby slowing down the sulfurization process of the silver layer. In addition, there is also a method of using the characteristics of polymer materials to react chemically under specific conditions, and generating specific organic substances through the reaction to protect LED products.

[0004] However, although these methods can play a certain protective role under certain conditions, there are still great bottlenecks in their stability and the degree of protection of the LED. First, the polymer material itself is prone to chemical reactions under high temperature or acid-base conditions, thus losing its due protective effect. This limits the application of LED products in some extreme environments. Secondly, the bonding force between the coated polymer film and the bracket or the product itself is not strong enough, and it is easy to fall off or wear during long-term use, resulting in a significant reduction in the protective effect. Finally, the density of the formed polymer film is not high enough, and elements such as sulfur, halogen, and odor may still penetrate into it and react with the silver layer at the bottom of the bracket, thereby causing the performance of the LED product to deteriorate.

[0005] Therefore, there is an urgent need to provide an LED bracket anti-sulfurization packaging structure and method to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to overcome the shortcomings and defects of the prior art and provide an anti-sulfurization packaging structure and method for an LED bracket, which effectively prevents the silver layer on the LED bracket from being sulfurized, significantly improves the performance of the LED product and prolongs its service life.

[0007] The objective of the present invention is achieved through the following technical solutions:

[0008] An anti-sulfurization packaging structure for an LED bracket comprises an LED bracket and an LED chip. A stacking groove is provided on the LED bracket, a silver layer is provided at the bottom of the stacking groove, the LED chip is welded on the silver layer, a protective film is provided on the upper surface of the silver layer, and the protective film is formed by depositing and stacking in sequence from bottom to top any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer, and a titanium dioxide layer in a specific environment.

[0009] As a preferred technical solution of the present invention, the protective film is formed by sequentially depositing and stacking a metal chromium layer, an aluminum oxide layer, and a titanium dioxide layer from bottom to top in a specific environment.

[0010] As a preferred technical solution of the present invention, the protective film is deposited on the silver layer by PVD.

[0011] As a preferred technical solution of the present invention, the metal chromium layer, the aluminum oxide layer, the silicon dioxide layer and the titanium dioxide layer are all nanoparticle layers.

[0012] As a preferred technical solution of the present invention, the LED bracket is made of any one of PPA, PCT, and EMC.

[0013] A method for anti-sulfurization packaging of an LED bracket, comprising:

[0014] A stacking groove is opened on the LED bracket, and the LED chip is welded on the silver layer at the bottom of the stacking groove. Then any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer, and a titanium dioxide layer are deposited on the outer surface of the silver layer from bottom to top in a specific environment to form a protective film.

[0015] As a preferred technical solution of the present invention, the specific environment is a vacuum environment or an environment filled with inert gas.

[0016] As a preferred technical solution of the present invention, a metal chromium layer, a silicon dioxide layer, and a titanium dioxide layer are sequentially deposited from bottom to top on the outer surface of the silver layer in a vacuum or an environment filled with an inert gas.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention sequentially deposits any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer, and a titanium dioxide layer on the outer surface of the silver layer on the LED bracket to construct a protective film, which effectively prevents the sulfur element, halogen element, or odor element in the external environment from corroding the silver layer, thereby ensuring the stable performance of the silver layer. The protective film formed by PVD deposition has a strong bond with the LED bracket and is not easy to fall off. The protective film has a high density and can effectively prevent the sulfur element, halogen element, or odor element in the external environment from penetrating into and reacting with the silver layer, and has a strong protective property for the silver layer. The LED bracket packaging structure and method of the present invention effectively improve the stability and reliability of LED products, reduce maintenance costs, and extend product service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of one embodiment of the present invention.

[0020] Figure 2 It is a structural schematic diagram of the LED chip of the present invention installed on the LED bracket.

[0021] Figure 3 It is a structural schematic diagram of the second embodiment of the present invention.

[0022] Figure 4 Schematic diagram of the structure of the third embodiment of the present invention.

[0023] Figure 5 Schematic diagram of the structure of four embodiments of the present invention.

[0024] Figure 6 Schematic diagram of the structure of the fifth embodiment of the present invention.

[0025] The above drawings include the following reference numerals:

[0026] 1. LED bracket, 2. LED chip, 3. wire, 4. stacking groove, 5. silver layer, 6. metal chromium layer, 7. aluminum oxide layer, 8. titanium dioxide layer, 9. silicon dioxide layer. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0028] The specific implementation process of the present invention is as follows:

[0029] like Figures 1 to 6As shown, an anti-sulfurization packaging structure of an LED bracket includes an LED bracket 1 and an LED chip 2. A stacking groove 4 is provided on the LED bracket 1, and a silver layer 5 is provided at the bottom of the stacking groove 4. The LED chip 2 is welded on the silver layer 5. There can be multiple LED chips 2, and multiple LED chips 2 are connected by wires 3. The silver layer 5 is used to reflect light and improve the luminous efficiency of the LED. A protective film is encapsulated on the upper surface of the silver layer 5 to isolate the silver layer 5 from the external environment. The protective film is formed by depositing and stacking any one or more of a metal chromium layer 6, an aluminum oxide layer 7, a silicon dioxide layer, and a titanium dioxide layer 8 in a specific environment from bottom to top. Each layer is closely attached to the upper layer through PVD deposition. Because it has high chemical stability, temperature resistance, and corrosion resistance, it oxidizes very slowly even in a high temperature environment, is insoluble in water, and is plated on the surface of the silver layer to play a protective role, effectively preventing sulfur elements, halogen elements, or odor elements in the external environment from corroding the silver layer, ensuring the stability of the performance of the silver layer. Preferably, PVD is used to deposit the protective film on the silver layer in a vacuum or inert gas environment by evaporation or sputtering. The PVD coating technology has excellent adhesion and wear resistance. Since the PVD coating is formed by physical evaporation and deposition, the combination between it and the LED bracket 1 is very strong, so that the PVD coating can maintain its integrity for a long time even in harsh environments, providing excellent wear resistance and corrosion resistance. Secondly, the PVD coating technology is mature, simple to operate, has good uniformity, high consistency, can ensure the uniformity and consistency of the coating thickness, and it is highly feasible to deposit the protective film on the LED bracket 1. In addition to the above-mentioned PVD deposition, CVD, thermal oxidation, electrodeposition and other methods can also be used to achieve the deposition of any one or more of metal chromium, aluminum oxide, silicon dioxide, and titanium dioxide on the silver layer 5. Metal chromium, aluminum oxide, silicon dioxide, and titanium dioxide are relatively common in the market, the price is relatively cheap, and the operation steps are simple and easy.

[0030] Preferably, the metal chromium layer 6, the aluminum oxide layer 7, the silicon dioxide layer, and the titanium dioxide layer 8 are all nanoparticle layers composed of nano-sized particles. Through PVD deposition on the LED bracket 1, a uniform and continuous nanostructure is formed, in which the nanoparticles are closely arranged, and the protective film formed has high density. It can effectively prevent the corrosion of sulfur, halogen or odor elements in the external environment to the silver layer 5, protect the LED bracket 1, significantly improve the sulfurization resistance and corrosion resistance of the LED bracket 1, and extend the service life of the LED product.

[0031] Preferably, the LED bracket 1 is made of any one of PPA, PCT, and EMC. Specifically, the LED bracket 1 is made of thermoplastic material, which can be PPA, PCT, or EMC. These materials have high temperature resistance, chemical corrosion resistance, and high stability. The manufactured LED bracket 1 can still maintain good mechanical properties and thermal stability at high temperatures, and has good resistance to a variety of chemical substances, thereby ensuring the long-term reliability and stability of the LED bracket 1 in a complex working environment.

[0032] Preferably, refer to Figure 1 In one embodiment, the protective film is formed by depositing and stacking a metal chromium layer 6, an aluminum oxide layer 7, and a titanium dioxide layer 8 in sequence from bottom to top in a specific environment, wherein the metal chromium layer 6 is located at the bottom layer and is tightly attached to the silver layer 5. The metal chromium layer 6 has good adhesion and corrosion resistance, and can effectively prevent the corrosion of the silver layer 5 by harmful substances such as sulfides in the external environment. The aluminum oxide layer 7 is located on the metal chromium layer 6, and the aluminum oxide layer 7 has extremely high hardness and wear resistance, which can further enhance the durability and corrosion resistance of the protective film. At the same time, the aluminum oxide layer 7 also has good insulation properties, which helps to prevent the occurrence of electrical breakdown and leakage. The titanium dioxide layer 8 is located in the outermost layer, and the titanium dioxide layer 8 has excellent photocatalytic properties and UV resistance. Under light conditions, the titanium dioxide layer 8 can decompose harmful substances in the air and further purify the environment around the LED bracket 1. In addition, the titanium dioxide layer 8 also has good hydrophilicity and self-cleaning properties, which helps to keep the surface of the LED bracket 1 clean and dry. The metal chromium layer 6, the aluminum oxide layer 7, and the titanium dioxide layer 8 are sequentially deposited on the upper surface of the silver layer 5 to form a protective film, which effectively prevents the silver layer on the LED bracket from being sulfurized, significantly improving the performance of the LED product and extending its service life.

[0033] Specifically, PVD is used to deposit the metal chromium layer 6, the aluminum oxide layer 7, and the titanium dioxide layer 8 on the silver layer 5 in sequence by evaporation or sputtering in a vacuum or inert gas environment, wherein the metal chromium layer 6 directly contacts and covers the upper surface of the silver layer 5, the aluminum oxide layer 7 is deposited on the metal chromium layer 6, and the titanium dioxide layer 8 is deposited on the aluminum oxide surface. In the PVD coating process, the metal chromium, aluminum oxide, and titanium dioxide are deposited on the surface of the LED bracket 1 with atomic-level precision, thereby ensuring the uniformity of the coating thickness.

[0034] The present invention also includes a method for anti-sulfurization packaging of an LED bracket, and the specific steps are as follows:

[0035] A stacking groove 4 is opened on the LED bracket 1, and the LED chip 2 is welded on the silver layer 5 at the bottom of the stacking groove 4, and then any one or more of a metal chromium layer 6, an aluminum oxide layer 7, a silicon dioxide layer, and a titanium dioxide layer 8 are deposited on the outer surface of the silver layer from bottom to top in a specific environment to form a protective film.

[0036] Preferably, the specific environment is a vacuum environment or an environment filled with an inert gas.

[0037] The present invention will be further described below in conjunction with specific embodiments and experimental data.

[0038] The organic polymer material is coated on the upper surface of the silver layer on the LED bracket, and the experimental data are as follows:

[0039] Experimental group Before vulcanization Attenuation ratio after 12 hours of vulcanization 24-hour vulcanization attenuation ratio Company A's products 100％ 13％ 29％ Company B's products 100％ 16％ 36％

[0040] A protective film is deposited on the upper surface of the silver layer on the LED bracket by PVD deposition or sputtering. The protective film is composed of any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer, and a titanium dioxide layer deposited in sequence from bottom to top. In order to illustrate the implementation effect of the protective film constituent material, different constituent materials were selected to conduct multiple experiments. The embodiments of the protective film constituent material and the experimental data thereof are as follows:

[0041]

[0042]

[0043] Through the above comparative data, whether the present application uses any one or more PVD depositions of metal chromium layer, aluminum oxide layer, silicon dioxide layer, and titanium dioxide layer on the upper surface of the silver layer of the LED bracket, the silver layer is vulcanized more slowly than coating with organic polymer materials, the bracket has better anti-vulcanization performance, the bonding force between the protective film and the LED bracket is stronger, the density is higher, and it can effectively prevent sulfur elements, halogen elements or odor elements in the external environment from penetrating into and reacting with the silver layer, and the silver layer on the LED bracket is more protective.

[0044] The above-mentioned embodiments only express the implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. An anti-sulfurization packaging structure for an LED bracket, characterized in that: It includes an LED bracket and an LED chip. The LED bracket is provided with a stacking groove. A silver layer is provided at the bottom of the stacking groove. The LED chip is welded on the silver layer. A protective film is provided on the upper surface of the silver layer. The protective film is formed by depositing and stacking any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer, and a titanium dioxide layer in sequence from bottom to top in a specific environment.

2. The anti-sulfurization packaging structure of an LED bracket according to claim 1, characterized in that: The protective film is formed by depositing and stacking a metal chromium layer, an aluminum oxide layer, and a titanium dioxide layer in sequence from bottom to top in a specific environment.

3. The LED bracket anti-sulfurization packaging structure according to claim 1, characterized in that: The protective film is deposited on the silver layer by PVD.

4. The LED bracket anti-sulfurization packaging structure according to claim 1, characterized in that: The metal chromium layer, aluminum oxide layer, silicon dioxide layer and titanium dioxide layer are all nanoparticle layers.

5. The LED bracket anti-sulfurization packaging structure according to claim 1, characterized in that: The LED bracket is made of any one of PPA, PCT and EMC materials.

6. A method for packaging an LED bracket against sulfurization, characterized in that: include: A stacking groove is opened on the LED bracket, and the LED chip is welded on the silver layer at the bottom of the stacking groove. Then any one or more of a metal chromium layer, an aluminum oxide layer, a silicon dioxide layer, and a titanium dioxide layer are deposited on the outer surface of the silver layer from bottom to top in a specific environment to form a protective film.

7. The method for anti-sulfurization packaging of an LED bracket according to claim 6, characterized in that: The specific environment is a vacuum environment or an environment filled with inert gas.

8. The method for anti-sulfurization packaging of an LED bracket according to claim 7, characterized in that: A metal chromium layer, a silicon dioxide layer and a titanium dioxide layer are sequentially deposited from bottom to top on the outer surface of the silver layer in a vacuum or inert gas environment.

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