Cutting device and method for manufacturing cutted article

Abstract

The cutting device cuts the object to be cut. The cutting device includes a table, a cutting mechanism, and an imaging device. The table holds an object to be cut. The cutting mechanism cuts the object to be cut held on the table. The image capturing device captures an image of an object to be cut held on the table. The object to be cut includes a plurality of marks formed in an imaging region imaged by the imaging device. The cutting device further includes a storage unit and a display unit. The storage unit stores an image and coordinates of each of a plurality of marks as a reference. The display unit displays, for each of the plurality of marks captured by the imaging device, an amount of deviation of coordinates compared with a corresponding mark among the plurality of marks as a reference stored in the storage unit.

Description

Technical Field

[0001] The present invention relates to a cutting device and a method for manufacturing a cut product. Background Art

[0002] Japanese Patent Publication No. 2018-142572 (Patent Document 1) discloses a cutting device that cuts the package substrate along a predetermined dividing line to divide the package substrate into individual packaged devices. In the cutting device, multiple alignment marks provided on the package substrate are detected. Then, the distance (maximum warping amount) between the straight line connecting the alignment mark that becomes the starting point of the predetermined dividing line and the alignment mark that becomes the end point of the predetermined dividing line as a reference line and the alignment mark farthest from the reference line among the multiple alignment marks corresponding to the predetermined dividing line is calculated. Based on whether the calculated maximum warping amount is below the allowable value, the package substrate is cut (refer to Patent Document 1).

[0003] Patent Document 1: Japanese Patent Publication No. 2018-142572

[0004] In the cutting device disclosed in the above-mentioned Patent Document 1, a cutting method of a package substrate is determined based on consideration of the maximum warpage amount of the package substrate, so that even if a substrate has warpage, a predetermined dividing line can be cut with high precision. However, in the above-mentioned Patent Document 1, there is no disclosure of a technique for further improving the quality of a package device (an example of a cut product) manufactured by the cutting device (an example of a cutting device). Summary of the invention

[0005] The present invention has been made to solve such a problem, and an object of the present invention is to provide a cutting device capable of providing an operator with information useful for improving the quality of a manufactured cut product and a cut product manufacturing method capable of improving the quality of the manufactured cut product.

[0006] A cutting device according to one aspect of the present invention cuts a cutting object. The cutting device includes a workbench, a cutting mechanism, and a camera device. The workbench holds the cutting object. The cutting mechanism cuts the cutting object held on the workbench. The camera device takes a picture of the cutting object held on the workbench. The cutting object includes a plurality of marks formed in a shooting area photographed by the camera device. The cutting device also includes a storage unit and a display unit. The storage unit stores an image and coordinates of each mark among a plurality of marks serving as a reference. The display unit displays, for each mark among a plurality of marks photographed by the camera device, the deviation of the coordinates compared with the corresponding mark among a plurality of marks serving as a reference stored in the storage unit.

[0007] In addition, a method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above-mentioned cutting device. The above-mentioned cutting mechanism cuts the cut object according to a preset cutting rule. The method for manufacturing a cut product includes: a step of displaying the deviation of the coordinates related to each of the multiple marks photographed by the camera device; a step of changing the setting of the cutting rule based on the displayed deviation of the coordinates; and a step of manufacturing the cut product by cutting the cut object according to the changed cutting rule.

[0008] Effects of the Invention

[0009] According to the present invention, it is possible to provide a cutting device capable of providing an operator with information that is useful for improving the quality of a manufactured cut product and a cut product manufacturing method capable of improving the quality of a manufactured cut product. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a top view schematically showing the cutting device.

[0011] Figure 2 It is a top view schematically showing a holding member.

[0012] Figure 3 It is schematically indicated Figure 2 Figure 3 is a diagram of the III-III section.

[0013] Figure 4 FIG. 1 is a diagram schematically showing an example of an alignment mark shown on the ball / lead surface of a package substrate.

[0014] Figure 5 This is a diagram schematically showing the hardware configuration of a computer.

[0015] Figure 6 This is a diagram schematically showing an example of an alignment mark used for alignment when a package substrate is cut along the longitudinal direction.

[0016] Figure 7 FIG. 2 is a diagram schematically showing a data table for managing data used for the first alignment.

[0017] Figure 8 This is a diagram schematically showing an example of an alignment mark used for alignment when a package substrate is cut along a short-side direction.

[0018] Fig. 9 FIG. 2 is a diagram schematically showing a data table for managing data used for the second alignment.

[0019] Fig.10 FIG. 1 is a diagram schematically showing an example of an image showing the amount of deviation calculated by the first alignment.

[0020] Fig.11 is a flow chart showing the preparation procedure for alignment.

[0021] Fig.12 is a flow chart showing the procedure of alignment and cutting.

[0022] Fig.13 This is a flowchart showing a procedure for displaying the deviation amount of the alignment mark.

[0023] Fig.14 It means in Fig.13 FIG. 3 is a diagram showing an example of an image displayed on a monitor in step S320 of FIG.

[0024] Fig.15 This is a flowchart showing a procedure for reviewing manufacturing conditions of electronic components.

[0025] Fig.16 This is a diagram for explaining a first example of other information to be additionally displayed.

[0026] Fig.17 It is a diagram for explaining a second example of other information to be additionally displayed.

[0027] Fig.18 FIG. 1 is a diagram schematically showing examples of other images displayed on a monitor.

[0028] Fig.19 It is a diagram schematically showing a first alternative example of a symbol of coordinates pre-stored in a storage unit.

[0029] Fig. 20 It is a diagram schematically showing a second alternative example of a symbol of coordinates pre-stored in a storage unit.

[0030] Description of Reference Numerals

[0031] 1 cutting device, 3 substrate supply unit, 4 positioning unit, 4a rail unit, 5 cutting table, 5a holding member, 5b rotating mechanism, 5c moving mechanism, 5d first position confirmation camera, 5e first cleaner, 6 spindle unit, 6a blade, 6b second position confirmation camera, 6c rotating shaft, 7 conveying unit, 7a second cleaner, 11 inspection table, 12 first optical inspection camera, 13 second optical inspection camera, 14 arrangement unit, 15 extraction unit, 15a tray for good products, 15b tray for defective products, 20 monitor, 21, 22, 23, 24, 25, 26, 27, 28, 29 display area, 31 holding member body, 32 clamp, 33 plate-shaped unit, 34 rubber unit, 50 computer, 70 control Department, 72CPU, 74RAM, 76ROM, 80 storage unit, 81 control program, 90 input and output I / F, 95 input unit, A1 cutting module, AL1 alignment mark, B1 inspection and storage module, BL1 blade position information, CG1 cutting groove, CL1, CL11, CL12, CL13 cutting line, CL21, CL22, CL23 candidate cutting line, CS1 cursor, G1 groove, H1 hole, IM1 image, IN1 internal mark, M1 material box, MA1, MA2, MA3 deviation information, MK1 mark, MP1 deviation, P1 packaging substrate, PR1 protrusion, RA1 rubber position information, S1 electronic component, SL1 baseline, SP1 space, TB1, TB2 data table. DETAILED DESCRIPTION

[0032] Hereinafter, an embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding parts in the figures are marked with the same reference numerals and their descriptions are not repeated. In addition, for ease of understanding, each of the drawings appropriately omits or exaggerates the schematic depiction of an object.

[0033] [1. Composition]

[0034] <1-1. Structure of cutting device>

[0035] Figure 1 1 is a top view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to separate a package substrate (an example of a cutting object) into a plurality of electronic components (an example of a cut product) by cutting the package substrate. In the package substrate, a substrate or a lead frame to which a semiconductor chip is fixed is sealed with resin. In addition, the cutting object does not necessarily have to be a package substrate, and may be, for example, a substrate (including a wafer) that is not sealed with resin.

[0036] As an example of a packaging substrate, there can be listed a BGA (Ball Grid Array) packaging substrate, an LGA (Land Grid Array) packaging substrate, a CSP (Chip Size Package) packaging substrate, an LED (Light Emitting Diode) packaging substrate and a QFN (Quad Flat No-leaded) packaging substrate.

[0037] In addition, the cutting device 1 is configured to inspect the plurality of singulated electronic components separately. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated by the inspection, and each electronic component is classified as "good" or "defective".

[0038] In this example, a package substrate P1 is used as a cutting object, and the package substrate P1 is singulated into a plurality of electronic components S1 by a cutting device 1. Hereinafter, the surface of the package substrate P1 sealed with resin is referred to as a molding surface, and the surface opposite to the molding surface is referred to as a ball / pin surface. In addition, in the case where the cutting object is a substrate that is not sealed with resin, the surface facing upward during cutting (cut surface) is equivalent to the ball / pin surface in this embodiment, and the surface opposite to the cut surface is equivalent to the molding surface in this embodiment.

[0039] like Figure 1 As shown, the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1. The inspection and storage module B1 is configured to inspect the manufactured plurality of electronic components S1 respectively and then store the electronic components S1 in a tray. In the cutting device 1, each component can be disassembled and replaced relative to other components.

[0040] The cutting module A1 mainly includes a substrate supply part 3 , a positioning part 4 , a cutting table 5 , a spindle part 6 and a conveying part 7 .

[0041] The substrate supply unit 3 pushes out the package substrates P1 one by one from the magazine M1 storing a plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrates P1 are arranged in a state where the balls and pins face upward.

[0042] The positioning section 4 positions the package substrate P1 pushed out from the substrate supply section 3 on the rail section 4 a , and then conveys the positioned package substrate P1 to the cutting stage 5 .

[0043] The cutting table 5 holds the package substrate P to be cut. Here, a cutting device 1 having a double cutting table structure with two cutting tables 5 is exemplified. The cutting table 5 includes a holding component 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding component 5a holds the package substrate P1 by adsorbing the package substrate P1 conveyed by the positioning portion 4 from below. The rotating mechanism 5b can rotate the holding component 5a in a horizontal plane around the θ1 direction in the figure. The moving mechanism 5c can move the holding component 5a along the Y axis in the figure.

[0044] Figure 2 It is a plan view schematically showing the holding member 5a. Figure 3 It is schematically indicated Figure 2 Figure 3 is a diagram of the III-III section of FIG. Figure 2 and Figure 3 The holding component 5a includes a holding component body 31 and a clamp 32. The holding component body 31 is a metal component that is rectangular in plan view. The clamp 32 is installed above the holding component body 31. The package substrate P1 is arranged on the clamp 32. In the Z-axis direction, a space SP1 is formed between the holding component body 31 and the clamp 32. A suction mechanism (not shown) is connected to the space SP1.

[0045] The clamp 32 includes a plate-like portion 33 made of metal or resin and a rubber portion 34. The clamp 32 mounted on the holding member body 31 is replaceable. The rubber portion 34 is composed of an elastic member such as rubber. The plate-like portion 33 and the rubber portion 34 each have a rectangular shape when viewed from above. On the upper surface of the rubber portion 34, a plurality of protrusions PR1 are formed in a matrix. In this example, 18 protrusions PR1 are formed in a manner of arranging 3 rows × 6 columns.

[0046] A hole H1 is formed in each protrusion PR1. Each hole H1 passes through the rubber portion 34 and the plate-like portion 33. The external space of the holding member 5a and the space SP1 are connected via each hole H1. By using a suction mechanism (not shown) connected to the space SP1 to suck, the package substrate P1 is adsorbed through each hole H1. As a result, the package substrate P1 arranged on the rubber portion 34 is adsorbed and held.

[0047] A groove G1 is formed between two adjacent protrusions PR1. Although described in detail later, the package substrate P1 held by adsorption on the rubber portion 34 is cut by a blade 6a (described later). When the package substrate P1 is cut, the blade 6a is located in the groove G1 and does not contact the rubber portion 34.

[0048] Refer again Figure 1The mandrel portion 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. Here, a cutting device 1 having a dual-mandrel structure with two mandrel portions 6 is exemplified. The mandrel portion 6 can move along the X-axis and the Z-axis in the figure. In addition, the cutting device 1 can also be a single-mandrel structure with one mandrel portion 6.

[0049] The mandrel portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, thereby singulating the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state of being clamped by a first flange and a second flange not shown. The first flange and the second flange are fixed to the rotating shaft 6c by a fastening member not shown such as a nut.

[0050] The mandrel portion 6 is provided with a cutting water nozzle, a cooling water nozzle, and an end material splashing water nozzle. The cutting water nozzle sprays cutting water toward the blade 6a rotating at a high speed. The cooling water nozzle sprays cooling water toward the vicinity of the cut portion of the package substrate P1. The end material splashing water nozzle sprays end material splashing water to splash the chips and the like.

[0051] After the cutting workbench 5 adsorbs the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d, thereby confirming the position of the package substrate P1. The confirmation performed by the first position confirmation camera 5d is, for example, confirmation of the position of the alignment mark AL1 set on the package substrate P1. The position information of the alignment mark AL1 is used, for example, to determine the cutting line of the package substrate P1.

[0052] Figure 4 FIG. 2 is a diagram schematically showing an example of an alignment mark AL1 shown on the ball / pin surface of the package substrate P1. Figure 4 As shown, in this example, a plurality of alignment marks AL1 are printed on the ball / pin surface of the package substrate P1. In this example, each of the plurality of alignment marks AL1 has a cross shape. In addition, the alignment mark AL1 does not necessarily need to be a cross shape, and can be any shape as long as it is a characteristic shape (unique shape). In addition, the plurality of alignment marks AL1 do not necessarily need to be the same shape.

[0053] Refer again Figure 1 When the position of the alignment mark AL1 is confirmed, the cutting line of the package substrate P1 is determined based on the position information of the alignment mark AL1. Based on the determined cutting line, the rotation angle of the rotating mechanism 5b is adjusted. This series of actions for adjusting the cutting position of the package substrate P1 is also called "alignment". Alignment will be described in detail later.

[0054] Then, the cutting table 5 moves along the Y-axis in the figure toward the mandrel portion 6. After the cutting table 5 moves to the bottom of the mandrel portion 6, the package substrate P1 is cut by moving the cutting table 5 and the mandrel portion 6 relative to each other. Then, the package substrate P1 is photographed using the second position confirmation camera 6b of the mandrel portion 6 as needed to confirm the position of the package substrate P1, etc. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

[0055] After the cutting of the package substrate P1 is completed, the cutting workbench 5 moves along the Y-axis in the figure in a state where the multiple electronic components S1 after singulation are adsorbed, in a direction away from the core shaft portion 6. During this movement, the upper surface (ball / pin surface) of the electronic component S1 is cleaned and dried by the first cleaner 5e. The cleaning can be performed, for example, by directly spraying cleaning water on the upper surface of the electronic component S1, or by supplying cleaning water to the upper surface of the electronic component S1 via a brush or the like. In addition, in the cutting device 1, two first cleaners 5e are arranged along the X-axis direction of the figure, but the number of the first cleaners 5e is not limited to this.

[0056] The conveying unit 7 sucks the electronic component S1 held on the cutting workbench 5 from above and conveys the electronic component S1 to the inspection table 11 of the inspection storage module B1. During the conveying process, the lower surface (molding surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a. The cleaning can be performed by, for example, directly spraying cleaning water on the lower surface of the electronic component S1, or by supplying cleaning water to the lower surface of the electronic component S1 via a brush or the like.

[0057] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement unit 14, and an extraction unit 15. In addition, the first optical inspection camera 12 may also be provided in the cutting module A1.

[0058] The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 can move along the X axis in the figure. In addition, the inspection table 11 can be turned upside down. A holding member that holds the electronic component S1 by adsorbing the electronic component S1 is provided on the inspection table 11.

[0059] The first optical inspection camera 12 and the second optical inspection camera 13 photograph both surfaces (ball / pin surface and mold surface) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the photographed images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each arranged near the inspection table 11 in a manner of photographing upward.

[0060] The first optical inspection camera 12 photographs the molded surface of the electronic component S1 conveyed by the conveyor 7 to the inspection table 11. Then, the conveyor 7 places the electronic component S1 on the holding member of the inspection table 11. After the holding member absorbs the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball / pin surface of the electronic component S1 is photographed by the second optical inspection camera 13.

[0061] The inspected electronic component S1 is arranged in the arrangement unit 14 . The arrangement unit 14 is movable along the Y axis in the figure. The inspection table 11 arranges the inspected electronic component S1 in the arrangement unit 14 .

[0062] The extraction unit 15 transfers the electronic components S1 arranged in the arrangement unit 14 to the tray. Based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13, the electronic components S1 are classified as "good products" or "defective products". Based on the classification results, the extraction unit 15 transfers each electronic device S1 to the good product tray 15a or the defective product tray 15b. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. When the good product tray 15a and the defective product tray 15b are each filled with electronic components S1, they are replaced with new trays.

[0063] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is configured by a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

[0064] The computer 50 controls the operation of the components of the cutting module A1 and the inspection and storage module B1. For example, the computer 50 controls the operation of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the conveying unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the arrangement unit 14, the extraction unit 15, and the monitor 20.

[0065] <1-2. Computer Hardware Structure>

[0066] Figure 5 Schematically shows the hardware structure of the computer 50. Figure 5 As shown, the computer 50 includes a calculation unit 70, an input / output I / F (interface) 90, and a storage unit 80, and each component is electrically connected via a bus.

[0067] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in response to information processing.

[0068] The input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input / output I / F 90 is used to send data from the computer 50 to each component in the cutting device 1, and receive data sent from each component in the cutting device 1 to the computer 50. The input unit 95 is configured to receive instructions from the user (operator). The input unit 95 is composed of, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.

[0069] The storage unit 80 is constituted by, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store, for example, a control program 81. The control unit 70 executes the control program 81 to realize various operations in the cutting device 1. When the control unit 70 executes the control program 81, the control program 81 is expanded into the RAM 74. Thus, the control unit 70 controls each component by interpreting and executing the control program 81 expanded into the RAM 74 by the CPU 72.

[0070] [2. Overview of alignment]

[0071] As described above, in the cutting device 1, alignment is performed before the package substrate P1 is cut by the mandrel portion 6. Generally, the shapes of the plurality of package substrates P1 prepared for manufacturing the electronic component S1 are not exactly the same. For example, the warping condition of the substrate is slightly different for each package substrate P1. From the viewpoint of suppressing the quality reduction of the manufactured electronic component S1, the cutting line of the package substrate P1 should be adjusted according to the warping condition of the package substrate P1. Therefore, in the cutting device 1, alignment is performed before the package substrate P1 is cut by the mandrel portion 6. The following is an overview of the alignment.

[0072] In the cutting device 1, the shape and coordinates of the alignment mark AL1 used for alignment are pre-registered. The coordinates of the pre-registered alignment mark AL1 are used as a reference in alignment. The registration of the shape and coordinates of the alignment mark AL1 is performed, for example, by an operator of the cutting device 1 (hereinafter also referred to as "operator"). Information indicating the shape and coordinates of the alignment mark AL1 is pre-stored in the storage unit 80 of the computer 50.

[0073] Figure 61 is a diagram schematically showing an example of an alignment mark AL1 used for alignment (hereinafter also referred to as “first alignment”) when the package substrate P1 is cut along the longitudinal direction. Figure 6 In this example, a plurality of alignment marks AL1 corresponding to three cutting lines CL1 extending in the longitudinal direction are used as a reference in the first alignment.

[0074] Figure 7 Schematically shows a data table TB1 for managing data used for the first alignment. Figure 7 The data table TB1 manages the shape information and coordinate information of each alignment mark AL1 used as a reference in the first alignment. The shape information and coordinate information of each alignment mark AL1 are generated based on the shape and coordinate of the alignment mark AL1 registered by the operator. In the data table TB1, each alignment mark AL1 is assigned a unique number (No.), and the shape, X-coordinate value, and Y-coordinate value of the alignment mark AL1 are associated with each number. The data table TB1 is stored in the storage unit 80 of the computer 50.

[0075] Figure 8 1 is a diagram schematically showing an example of an alignment mark AL1 used for alignment (hereinafter also referred to as “second alignment”) when the package substrate P1 is cut along the short side direction. Figure 8 In this example, a plurality of alignment marks AL1 corresponding to three cutting lines CL1 extending in the short-side direction are used as a reference in the second alignment.

[0076] Fig. 9 Schematically shows a data table TB2 for managing data used for the second alignment. Fig. 9 The data table TB2 manages the shape information and coordinate information of each alignment mark AL1 used as a reference in the second alignment. The shape information and coordinate information of each alignment mark AL1 are generated based on the shape and coordinate of the alignment mark AL1 registered by the operator. In the data table TB2, each alignment mark AL1 is assigned a unique number (No.), and the shape, X coordinate value, and Y coordinate value of the alignment mark AL1 are associated with each number. The data table TB2 is stored in the storage unit 80 of the computer 50.

[0077] In the cutting device 1, based on the coordinate information managed in the data table TB1, a range for searching the alignment mark AL1 in the first alignment (hereinafter also referred to as "first search range") is predetermined. The first search range is composed of, for example, a plurality of search ranges. The first search range is composed of, for example, a plurality of search ranges centered on the coordinates of each alignment mark AL1 managed in the data table TB1.

[0078] In addition, in the cutting device 1, based on the coordinate information managed in the data table TB2, a range for searching the alignment mark AL1 during the second alignment (hereinafter also referred to as "second search range") is predetermined. The second search range is composed of, for example, a plurality of search ranges. The second search range is composed of, for example, a plurality of search ranges centered on the coordinates of each alignment mark AL1 managed in the data table TB2.

[0079] When the length direction of the package substrate P1 is along the Y-axis, the first position confirmation camera 5d photographs the package substrate P1, thereby performing the first alignment. Specifically, the image photographed by the first position confirmation camera 5d is searched in the first search range, and the coordinates of each alignment mark AL1 are detected and stored. Based on the coordinates of each alignment mark AL1, the deviation is calculated as described later to determine the cutting line of the package substrate P1. Then, the angle of the rotating mechanism 5b and the position of the blade 6a are adjusted to cut along the determined cutting line. The first alignment is performed according to this procedure.

[0080] In addition, the first position confirmation camera 5d photographs the package substrate P1 while the short side direction of the package substrate P1 is along the Y axis, thereby performing the second alignment. Specifically, the image photographed by the first position confirmation camera 5d is searched in the second search range, and the coordinates of each alignment mark AL1 are detected and stored. Based on the coordinates of each alignment mark AL1, the deviation is calculated as described later to determine the cutting line of the package substrate P1. Then, the angle of the rotating mechanism 5b and the position of the blade 6a are adjusted to cut along the determined cutting line. The second alignment is performed according to this procedure.

[0081] In this way, in the cutting device 1, alignment is performed before the package substrate P1 is cut by the mandrel portion 6. Therefore, according to the cutting device 1, the package substrate P1 can be appropriately cut in accordance with the warping state of each package substrate P1 and the like.

[0082] [3. Function to display the deviation of the alignment mark]

[0083] For example, sometimes the quality (e.g., cutting quality) of the electronic component S1 manufactured through the above alignment is not good enough. In addition, sometimes it is desired to further improve the quality of the manufactured electronic component S1. In this case, it is convenient if the cutting device 1 provides the operator with information that helps improve the quality of the manufactured electronic component S1.

[0084] In the cutting device 1, for each alignment mark AL1 detected by the first position confirmation camera 5d during the first alignment, the amount of deviation of the coordinates compared with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 as references managed in the data table TB1 is calculated, and the calculation result is stored in the storage unit 80. In addition, for each alignment mark AL1 detected by the first position confirmation camera 5d during the second alignment, the amount of deviation of the coordinates compared with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 as references managed in the data table TB2 is calculated, and the calculation result is stored in the storage unit 80.

[0085] For example, the deviation amount calculated by each alignment is correlated with the warping condition of the package substrate P1. For example, when the quality of the manufactured electronic component S1 is not good enough, by confirming the deviation amount related to the package substrate P1 used to manufacture the electronic component S1, it may be determined that the reason why the quality of the electronic component S1 is not good enough is the warping condition of the package substrate P1. If the cause is determined, the quality of the electronic component S1 can be improved by eliminating the cause. That is, the deviation amount calculated by each alignment can be said to be information that helps improve the quality of the electronic component S1.

[0086] The cutting device 1 is provided with a function of displaying the deviation of the alignment mark. The deviation display function is a function of displaying the deviation calculated by each alignment on the monitor 20. For example, the deviation related to the package substrate P1 selected by the operator among the plurality of package substrates P1 cut in the cutting device 1 is displayed on the monitor 20.

[0087] Fig.10 is a schematic diagram showing the deviation in the X-axis direction calculated by the first alignment (described later). Fig.14 An example of an image IM1 represented as "X-axis offset" in FIG. Fig.10 The image IM1 includes the deviation amount information MA1, MA2, and MA3. For example, the image IM1 is displayed on the monitor 20.

[0088] The deviation amount information MA1 indicates the deviation from the left cutting line CL1 ( Figure 6 ) The deviation amount information MA1 is formed by connecting a plurality of deviation amounts MP1 and grouping them. The length between each deviation amount MP1 included in the deviation amount information MA1 and the reference line SL1 on the left side of the figure represents the deviation amount of each alignment mark AL1 in the X-axis direction.

[0089] The deviation amount information MA2 indicates the deviation from the central cutting line CL1 ( Figure 6) The deviation amount information MA2 is formed by connecting a plurality of deviation amounts MP1 and grouping them. The length between each deviation amount MP1 included in the deviation amount information MA2 and the reference line SL1 in the center of the figure represents the deviation amount of each alignment mark AL1 in the X-axis direction.

[0090] The deviation amount information MA3 indicates the deviation from the right cutting line CL1 ( Figure 6 ) The deviation amount information MA3 is formed by connecting a plurality of deviation amounts MP1 and grouping them. The length between each deviation amount MP1 included in the deviation amount information MA3 and the reference line SL1 on the right side of the figure represents the deviation amount of each alignment mark AL1 in the X-axis direction. In addition, each reference line SL1 may be displayed on the monitor 20 or not.

[0091] In this way, in the cutting device 1, for each alignment mark AL1 among the plurality of alignment marks AL1 photographed by the first position confirmation camera 5d, the deviation of the coordinates compared with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 stored in the storage unit 80 as a reference (specifically, the deviation in the X-axis direction) is displayed. By confirming the deviation of each displayed coordinate, the operator can recognize, for example, the warping condition of the package substrate P1. The warping condition of the package substrate P1 is related to the quality of the electronic component S1, so the deviation of each coordinate can be said to be information that helps improve the quality of the electronic component S1. Therefore, according to the cutting device 1, by causing the monitor 20 to display the deviation of each alignment mark AL1, the operator can be provided with information that helps improve the quality of the manufactured electronic component S1.

[0092] In addition, in the cutting device 1, the deviation amount of the alignment mark AL1 photographed by the first position confirmation camera 5d is displayed in groups (specifically, in groups of alignment marks AL1 for each cutting line). The operator can more easily recognize the warping condition of the electronic component S1, for example, by confirming the deviation amount displayed in groups. Therefore, according to the cutting device 1, by causing the monitor 20 to display each deviation amount in groups, the operator can be provided with information that helps improve the quality of the manufactured electronic component S1.

[0093] [4. Operation]

[0094] <4-1. Preparation for alignment>

[0095] Fig.11: is a flowchart showing the preparation procedure for alignment. The processing shown in the flowchart is executed, for example, by the control unit 70 of the computer 50. Here, the case where all the alignment marks AL1 of a package substrate P1 are of the same shape is described. In the case where part or all of the alignment marks AL1 in a package substrate P1 are different, the preparation operation for alignment can be performed on each alignment mark AL1. Since the preparation procedures for the first alignment and the second alignment are substantially the same, the preparation procedure for the first alignment is described here.

[0096] Reference Fig.11 , the control unit 70 performs a registration process for each alignment mark AL1 used for the first alignment (step S100). For this registration process, for example, the package substrate P1 selected by the operator is arranged on the holding component 5a in such a way that the length direction is along the Y-axis direction. The package substrate P1 arranged on the holding component 5a is photographed by the first position confirmation camera 5d. For example, based on the image photographed by the first position confirmation camera 5d, a plurality of alignment marks AL1 are detected, and the operator selects an alignment mark AL1 as a reference from the detected plurality of alignment marks AL1. This selection is performed, for example, via the input unit 95 of the computer 50. The images and coordinates of each of the alignment marks AL1 selected as a reference are stored in the storage unit 80. Thus, the registration process ends.

[0097] After the registration process is completed, the control unit 70 sets the area (shooting area) photographed by the first position confirmation camera 5d in the first alignment (step S110). In step S110, for example, a plurality of shooting areas are set. The plurality of shooting areas set in step S110 correspond to the plurality of search ranges included in the first search range. Information related to the set shooting areas is stored in the storage unit 80. Thus, the preparation for the first alignment is completed.

[0098] <4-2. Alignment and cutting operations>

[0099] Fig.12 1 is a flowchart showing the alignment and cutting procedures. The processing shown in the flowchart is performed by the control unit 70 of the computer 50, for example, when the package substrate P1 held by the holding member 5a is located below the first position confirmation camera 5d. In addition, since the procedures of the first alignment and the second alignment are substantially the same, the procedures of the first alignment and the cutting are described here.

[0100] Reference Fig.12 The control unit 70 controls the first position confirmation camera 5d to Fig.11The control unit 70 captures the uncaptured capture area among the plurality of capture areas set in step S110 (step S200). The control unit 70 detects the alignment mark AL1 included in the image captured by the first position confirmation camera 5d, and obtains the coordinate information of the detected alignment mark AL1 (step S210). The control unit 70 calculates the deviation amount (sometimes also referred to as "deviation amount") of the detected alignment mark AL1 in the X-axis direction, and stores the calculated deviation amount in the storage unit 80 (step S220).

[0101] The control unit 70 determines whether Fig.11 The control unit 70 determines whether all the plurality of imaging areas set in step S110 have been imaged (step S230). If it is determined that the imaging is not completed ("No" in step S230), the control unit 70 executes the process of step S200 again.

[0102] On the other hand, if it is determined in step S230 that imaging is completed (YES in step S230 ), the control unit 70 calculates a plurality of (three in this example) cutting lines based on the coordinate information of each of the plurality of detected alignment marks AL1 (step S240 ).

[0103] The control unit 70 determines whether the relative positional relationship between the cutting table 5 and the blade 6a can be corrected so as to cut along the calculated cutting line (step S250). If it is determined that the positional relationship cannot be corrected ("No" in step S250), the package substrate P1 is not cut, and the processing shown in the flowchart ends. For example, no matter how the rotation angle of the rotating mechanism 5b and the position of the blade 6a are adjusted, the blade 6a will contact the protrusion PR1 ( Figure 3 ) is in contact, it is determined that the positional relationship cannot be corrected.

[0104] On the other hand, if it is determined that the positional relationship can be corrected ("Yes" in step S250), the control unit 70 corrects the relative positional relationship between the cutting table 5 and the mandrel unit 6 so as to cut along the cutting line calculated in step S240 (step S260). Thereafter, the control unit 70 controls the cutting table 5 and the mandrel unit 6 to cut the package substrate P1 (step S270).

[0105] <4-3. Display Operation of the Deviation Amount of Alignment Mark>

[0106] Fig.13 2 is a flowchart showing a procedure for displaying the amount of deviation of the alignment mark AL1. The process shown in the flowchart is executed by the control unit 70 of the computer 50 when, for example, an operator performs a start operation of the deviation amount display function.

[0107] Reference Fig.13The control unit 70 determines whether the package substrate P1 as the display object of the deviation amount of the alignment mark AL1 is selected by the operator (step S300). If it is determined that the package substrate P1 is not selected ("No" in step S300), the control unit 70 waits until the package substrate P1 is selected.

[0108] On the other hand, if it is determined that the package substrate P1 has been selected ("Yes" in step S300), the control unit 70 reads the deviation of each alignment mark AL1 of the selected package substrate P1 from the storage unit 80 (step S310). The control unit 70 controls the monitor 20 to display each deviation read (step S320).

[0109] Fig.14 It means in Fig.13 FIG. 1 is a diagram showing an example of an image displayed on the monitor 20 in step S320. Fig.14 As shown, the image includes display areas 21, 22, 23, 24, 25, and 26. Information specifying the package substrate P1 selected by the operator is displayed in the display area 21. An image showing the coordinates of each alignment mark AL1 used as a reference in the first alignment is displayed in the display area 22. An image showing the coordinates of each alignment mark AL1 used as a reference in the second alignment is displayed in the display area 23.

[0110] The display area 24 displays the deviation information generated based on the deviation calculated in the first alignment. The display area 25 displays the deviation information generated based on the deviation calculated in the second alignment. In the graphs displayed in the display areas 24 and 25, the scales are adjusted so that each deviation is visually easy to recognize. In each of the display areas 24 and 25, each reference line SL1 ( Fig.10 ). The coordinate information of each alignment mark AL1 displayed in the display area (display area 22 or display area 23) selected by the cursor CS1 is displayed in the display area 26. The coordinate information of each alignment mark AL1 in the display area 26 can be easily understood if it is expressed as a separate table in groups (specifically, in groups of alignment marks AL1 for each cutting line).

[0111] In this way, in the cutting device 1, for each of the plurality of alignment marks AL1 photographed by the first position confirmation camera 5d, the amount of deviation of the coordinates compared with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 as references stored in the storage unit 80 (specifically, the amount of deviation in the X-axis direction) is displayed. According to the cutting device 1, by displaying the amount of deviation of each alignment mark AL1 on the monitor 20, it is possible to provide the operator with information that helps improve the quality of the manufactured electronic component S1.

[0112] <4-4. Review of manufacturing conditions>

[0113] Fig.15 1 is a flowchart showing a procedure for reviewing the manufacturing conditions of the electronic component S1. The steps shown in this flowchart are performed by an operator.

[0114] Reference Fig.15 , the operator confirms each deviation amount information displayed on the monitor 20 (step S400). The operator changes the setting of the cutting rule of the package substrate P1 based on the deviation amount information displayed on the monitor 20 (step S410). As an example of the cutting rule, the number of alignment marks AL1 used in alignment and the calculation algorithm of the cutting line can be cited. The operator uses the cutting device 1 with the changed setting of the cutting rule to manufacture the electronic component S1 again (step S420).

[0115] Thus, in the manufacturing method of the electronic component S1, the setting of the cutting rule is changed based on the deviation amount of the alignment mark AL1 displayed on the monitor 20. Therefore, according to the manufacturing method of the electronic component S1, the quality of the manufactured electronic component S1 can be improved by reviewing the cutting rule.

[0116] [5. Features]

[0117] As described above, in the cutting device 1 according to the present embodiment, for each alignment mark AL1 among the plurality of alignment marks AL1 photographed by the first position confirmation camera 5d, the deviation of the coordinates compared with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 stored in the storage unit 80 as a reference is displayed. The operator can recognize, for example, the warping condition of the package substrate P1 by confirming the deviation of each displayed coordinate. The warping condition of the package substrate P1 is related to the quality of the electronic component S1, and thus the deviation of each coordinate can be said to be information that helps improve the quality of the electronic component S1. Therefore, according to the cutting device 1, by displaying the deviation of each alignment mark AL1 on the monitor 20, the operator can be provided with information that helps improve the quality of the manufactured electronic component S1.

[0118] In addition, the cutting device 1 is an example of the "cutting device" in the present invention. The cutting workbench 5 is an example of the "workbench" in the present invention. The mandrel part 6 is an example of the "cutting mechanism" in the present invention. The first position confirmation camera 5d is an example of the "camera device" in the present invention. The storage unit 80 is an example of the "storage unit" in the present invention. The monitor 20 is an example of the "display unit" in the present invention. The input unit 95 is an example of the "input unit" in the present invention. The clamp 32 is an example of the "holder" in the present invention.

[0119] [6. Other embodiments]

[0120] The concept of the above-described embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the concept of the above-described embodiment can be applied will be described.

[0121] <6-1>

[0122] In the above embodiment, the deviations of the plurality of alignment marks AL1 associated with the package substrate P1 selected by the operator are displayed on the monitor 20 as deviation information (deviation information MA1, MA2, MA3) in units of groups corresponding to the respective cutting lines CL1. However, the plurality of deviations may not necessarily be displayed in units of groups. For example, in each of the deviation information MA1, MA2, MA3, the plurality of deviations MP1 may be displayed on the monitor 20 without connecting the deviations MP1 with lines.

[0123] <6-2>

[0124] For example, in Fig.14 In each of the display regions 24 and 25, only the deviation amount information of the alignment mark AL1 is displayed. However, for example, other information may be additionally displayed in each of the display regions 24 and 25.

[0125] Fig.16 2 is a diagram for explaining a first example of additional information displayed. Fig.16 For example, in addition to the deviation information MA1, MA2, MA3, the cutting lines CL11, CL12, CL13 and the reference line SL1 may be displayed on the monitor 20. The cutting lines CL11, CL12, CL13 respectively represent the cutting lines actually used to cut the package substrate P1. By referring to the cutting lines CL11, CL12, CL13, the operator can study the relationship between each cutting line and the quality of the electronic component S1.

[0126] Fig.17 2 is a diagram for explaining a second example of additional information displayed. Fig.17 , for example, in addition to Fig.16 In addition to the example shown, candidate cutting lines CL21, CL22, and CL23 may be displayed on the monitor 20. Candidate cutting lines CL21, CL22, and CL23 are calculated using, for example, an algorithm different from the algorithm used to calculate each cutting line CL11, CL12, and CL13. As an example of an algorithm, an algorithm using the average value of the deviation amount and an algorithm using the least square method can be cited. By referring to the candidate cutting lines CL21, CL22, and CL23, the operator can study the use of other candidate cutting lines. In addition, a plurality of candidate cutting lines may be displayed for each cutting line.

[0127] <6-3>

[0128] Fig.18 2 is a diagram schematically showing an example of another image displayed on the monitor 20. Fig.18 , the image includes display areas 27, 28, and 29. For example, in display area 27, Fig.14 The image of the display area 25. For example, in Fig.14 When the display area 25 is selected in a state where an image of the image is displayed on the monitor 20, the monitor 20 displays Fig.18 For example, if Fig.14 When the image is displayed on the monitor 20, the display area 24 is selected, and the display area 27 can be displayed. Fig.14 An image of display area 24 is displayed.

[0129] A plurality of selection items are displayed in the display area 28, each of which corresponds to any one of the plurality of deviation amount information displayed in the display area 27. In this example, the selection item displayed as "COL1" corresponds to the deviation amount information on the left. The selection item displayed as "COL2" corresponds to the deviation amount information in the center. The selection item displayed as "COL3" corresponds to the deviation amount information on the right. In this example, "COL1" is selected.

[0130] The deviation information corresponding to the item selected in the display area 28 is displayed in the display area 29. In addition to the deviation information MA1, the cutting line CL1, the blade position information BL1 (specifically, the width of the blade is represented by two straight lines) and the rubber position information RA1 are also displayed in the display area 29. The blade position information BL1 is information indicating the position of the blade 6a when cutting along the cutting line CL1. In this example, the blade 6a is located in the groove G1. The rubber position information RA1 is information indicating the position of the protrusion PR1 when cutting along the cutting line CL1. In addition, the positional relationship between the blade 6a and the protrusion PR1 in the state where the inclination of the cutting line CL1 is corrected is displayed in the display area 29. In addition, the inclination of the deviation information MA1 is also corrected in coordination with the correction of the inclination of the cutting line CL1.

[0131] Thus, in the cutting device 1, in addition to the cutting line, the blade position information BL1 and the rubber position information RA1 are also displayed on the monitor 20. Therefore, according to the cutting device 1, it is possible to provide the operator with information indicating the positional relationship between the cutting line, the protrusion PR1 of the rubber portion 34, and the blade 6a. For example, when the manufacture of the electronic component S1 is stopped and the blade position information BL1 and the rubber position information RA1 overlap, the operator can recognize that if the manufacture of the electronic component S1 is continued, the manufacture of the electronic component S1 is stopped because the blade 6a contacts the protrusion PR1.

[0132] <6-4>

[0133] In the above embodiment, the coordinates of the alignment mark AL1 used as a reference are stored in the storage unit 80 in advance, and the deviation between the coordinates of the alignment mark AL1 photographed by the first position confirmation camera 5d and the coordinates of the alignment mark AL1 used as a reference is calculated. By displaying the calculated deviation on the monitor 20, the degree of deviation between the package substrate P1 photographed by the first position confirmation camera 5d and the package substrate P1 used as a reference is determined. However, the reference for confirming the deviation between the package substrates P1 is not limited to the alignment mark AL1. The information used as the reference is described in sequence below.

[0134] (6-4-1)

[0135] Fig.19 2 is a diagram schematically showing a first alternative example of coordinate markers pre-stored in the storage unit 80. Fig.19 , the mark MK1 represents the part where the two vertical and horizontal grooves CG1 in the package substrate P1 after cutting intersect (an example of the characteristic part of the package substrate P1 after cutting in appearance). For example, the storage unit 80 can pre-store the coordinates of the mark MK1 used as a reference, for example, the monitor 20 displays the deviation between the coordinates of the mark MK1 detected in the image taken by the second position confirmation camera 6b and the coordinates of the mark MK1 used as a reference. Thereby, the operator can recognize the deviation caused by the cutting of the package substrate P1. In addition, for example, by confirming how the deviation changes in each cutting rule, a cutting rule for minimizing the deviation can be found.

[0136] (6-4-2)

[0137] Fig. 20 2 is a diagram schematically showing a second alternative example of a marker for storing coordinates in advance in the storage unit 80. Fig. 20 The internal mark IN1 is printed on the mold surface of the electronic component S1, for example. For example, the storage unit 80 may store the coordinates of the internal mark IN1 as a reference in advance, and the deviation between the coordinates of the internal mark IN1 detected in the image captured by the second position confirmation camera 6b and the coordinates of the internal mark IN1 as a reference may be displayed on the monitor 20. In this way, the operator can recognize the deviation of the internal mark IN1 in each electronic component S1.

[0138] The above is an exemplary description of the embodiments of the present invention. That is, the detailed description and the drawings are disclosed for the purpose of exemplary description. Therefore, the components described in the detailed description and the drawings may include components that are not necessary for solving the problem. Therefore, these non-essential components should not be directly regarded as necessary just because they are described in the detailed description and the drawings.

[0139] In addition, the above-mentioned embodiments are merely examples of the present invention in all aspects. The above-mentioned embodiments can be variously improved and changed within the scope of the present invention. For example, at least a part of the structure of any embodiment can be combined with at least a part of the structure of any other embodiment. That is, when implementing the present invention, a specific structure can be appropriately adopted in accordance with the embodiment.

[0140] [6. Notes]

[0141] In this specification, various technical concepts including at least the following technologies are disclosed.

[0142] <Technology 1>

[0143] (constitute)

[0144] A cutting device for cutting an object to be cut, comprising:

[0145] A workbench for holding the cutting object;

[0146] a cutting mechanism for cutting the cutting object held on the workbench; and

[0147] a camera device for photographing the object to be cut held on the workbench,

[0148] The object to be cut includes a plurality of marks formed in a photographing area photographed by the imaging device,

[0149] The cutting device further comprises:

[0150] a storage unit that stores an image and coordinates of each of the plurality of markers serving as a reference; and

[0151] The display unit displays, for each of the plurality of marks captured by the imaging device, an amount of deviation of coordinates compared with a corresponding mark among the plurality of marks serving as a reference and stored in the storage unit.

[0152] (Effects, etc.)

[0153] In the cutting device, for each of the multiple marks photographed by the camera, the deviation of the coordinates compared with the corresponding mark among the multiple marks stored in the storage unit as a reference is displayed. The operator of the cutting device can recognize, for example, the warping condition of the cut object by confirming the deviation of each displayed coordinate. Since the warping condition of the cut object is related to the quality of the cut product, the deviation of each coordinate can be said to be information that helps improve the quality of the cut product. Therefore, according to the cutting device, by causing the display unit to display the deviation of each coordinate, it is possible to provide the operator with information that helps improve the quality of the cut product being manufactured.

[0154] <Technology 2>

[0155] (constitute)

[0156] According to the cutting device described in technology 1,

[0157] The plurality of tags are composed of a plurality of groups,

[0158] Each of the plurality of groups corresponds to a cutting line along which the cutting mechanism cuts the object to be cut.

[0159] The display unit displays the amount of deviation of the coordinates in units of each of the plurality of groups.

[0160] (Effects, etc.)

[0161] In the cutting device, the deviation of the coordinates of each mark photographed by the camera is displayed in groups. The operator can more easily recognize the warping of the cut object, for example, by confirming the deviation of the coordinates displayed in groups. Therefore, according to the cutting device, by making the display unit display the deviation of each coordinate in groups, the operator can be provided with information that helps improve the quality of the cut product to be manufactured.

[0162] <Technology 3>

[0163] (constitute)

[0164] According to the cutting device described in technology 1,

[0165] The cutting device further includes a control unit that determines the cutting line associated with each of the plurality of groups based on the coordinates of each of the plurality of marks captured by the imaging device.

[0166] The display unit further displays the cutting line determined by the control unit.

[0167] (Effects, etc.)

[0168] In the cutting device, the cutting line determined by the control unit is also displayed. The operator can confirm the cutting line of the cutting object by visually viewing the display unit. The cutting line of the cutting object can be said to be information that helps improve the quality of the cut product. Therefore, according to the cutting device, by making the display unit further display the cutting line, it is possible to provide the operator with information that helps improve the quality of the manufactured cut product.

[0169] <Technique 4>

[0170] (constitute)

[0171] According to the cutting device described in technology 3,

[0172] The control unit determines one or more candidate cutting lines corresponding to the cutting line based on the coordinates of each of the plurality of marks captured by the imaging device,

[0173] The display unit further displays the one or more candidate cutting lines determined by the control unit.

[0174] (Effects, etc.)

[0175] In the cutting device, one or more candidate cutting lines determined by the control unit are also displayed. The operator can confirm the one or more candidate cutting lines by visually viewing the display unit. The candidate cutting lines can be said to be information that helps improve the quality of the cut product. Therefore, according to the cutting device, by causing the display unit to further display the candidate cutting lines, the operator can be provided with information that helps improve the quality of the manufactured cut product.

[0176] <Technique 5>

[0177] (constitute)

[0178] A cutting device according to any one of Techniques 1 to 4, wherein:

[0179] The storage unit stores the deviation amount of the coordinates associated with each of the plurality of marks for each of the plurality of cutting objects.

[0180] The cutting device further includes an input unit configured to receive an input for selecting any one of the plurality of cutting objects.

[0181] The display unit displays the amount of deviation of the coordinates related to the cutting target object selected via the input unit.

[0182] (Effects, etc.)

[0183] In the cutting device, the deviation of the coordinates of each mark related to the cutting object selected by the operator is displayed. Therefore, according to the cutting device, information indicating the deviation of the coordinates of each mark related to the cutting object selected by the operator can be provided to the operator.

[0184] <Technique 6>

[0185] (constitute)

[0186] A cutting device according to any one of Techniques 1 to 5, wherein:

[0187] The object to be cut is a package substrate,

[0188] Each of the plurality of marks is an alignment mark provided on the packaging substrate, a characteristic portion of the packaging substrate after being cut in appearance, or an internal mark provided on an electronic component singulated by cutting the packaging substrate.

[0189] <Technique 7>

[0190] (constitute)

[0191] A cutting device according to any one of Techniques 3 to 6, wherein:

[0192] The workbench includes a holder for holding the object to be cut,

[0193] The cutting mechanism cuts the object to be cut by a blade.

[0194] The display portion further displays the holder and the blade.

[0195] (Effects, etc.)

[0196] In this cutting device, in addition to the cutting line, the holder and the blade are also displayed. Therefore, according to this cutting device, it is possible to provide the operator with information indicating the positional relationship between the cutting line, the holder and the blade.

[0197] <Technology 8>

[0198] (constitute)

[0199] A method for manufacturing a cut product, using a cutting device according to any one of Techniques 1 to 7,

[0200] The cutting mechanism cuts the cutting object according to a preset cutting rule.

[0201] The method for manufacturing the cut product comprises:

[0202] a step of displaying a deviation amount of the coordinates associated with each of the plurality of marks photographed by the imaging device;

[0203] A step of changing the setting of the cutting rule based on the displayed deviation of the coordinates; and

[0204] A step of manufacturing the cut product by cutting the cutting object according to the changed cutting rule.

[0205] (Effects, etc.)

[0206] In the manufacturing method of the cut product, the setting of the cutting rule is changed based on the deviation of the displayed coordinates. Therefore, according to the manufacturing method of the cut product, the quality of the manufactured cut product can be improved by re-examining the cutting rule.

Claims

1. A cutting device for cutting an object to be cut, comprising: A workbench for holding the object to be cut; a cutting mechanism for cutting the cutting object held on the workbench; and a camera device for photographing the object to be cut held on the workbench, The object to be cut includes a plurality of marks formed in a photographing area photographed by the imaging device, The cutting device further comprises: a storage unit that stores coordinates of each of the plurality of markers serving as a reference; and The display unit displays, for each of the plurality of marks captured by the imaging device, an amount of deviation of coordinates compared with a corresponding mark among the plurality of marks serving as a reference and stored in the storage unit.

2. The cutting device according to claim 1, wherein: The plurality of tags are composed of a plurality of groups, Each of the plurality of groups corresponds to a cutting line along which the cutting mechanism cuts the object to be cut. The display unit displays the amount of deviation of the coordinates in units of each of the plurality of groups.

3. The cutting device according to claim 2, wherein: The cutting device further includes a control unit that determines the cutting line based on the coordinates of each of the plurality of marks captured by the imaging device. The display unit further displays the cutting line determined by the control unit.

4. The cutting device according to claim 3, wherein: The control unit determines one or more candidate cutting lines corresponding to the cutting line based on the coordinates of each of the plurality of marks captured by the imaging device, The display unit further displays the one or more candidate cutting lines determined by the control unit.

5. The cutting device according to any one of claims 1 to 4, wherein: The storage unit stores the deviation amount of the coordinates associated with each of the plurality of marks for each of the plurality of cutting objects. The cutting device further includes an input unit configured to receive an input for selecting any one of the plurality of cutting objects. The display unit displays the amount of deviation of the coordinates related to the cutting target object selected via the input unit.

6. The cutting device according to any one of claims 1 to 5, wherein: The object to be cut is a package substrate, Each of the plurality of marks is an alignment mark provided on the packaging substrate, a characteristic portion of the packaging substrate after being cut in appearance, or an internal mark provided on an electronic component singulated by cutting the packaging substrate.

7. The cutting device according to any one of claims 3 to 6, wherein: The workbench includes a holder for holding the object to be cut, The cutting mechanism cuts the object to be cut by a blade. The display portion further displays the holder and the blade.

8. A method for manufacturing a cut product, using the cutting device according to any one of claims 1 to 7, The cutting mechanism cuts the cutting object according to a preset cutting rule. The method for manufacturing the cut product comprises: a step of displaying a deviation amount of the coordinates associated with each of the plurality of marks photographed by the imaging device; A step of changing the setting of the cutting rule based on the displayed deviation of the coordinates; and A step of manufacturing the cut product by cutting the cutting object according to the changed cutting rule.

Images