Substrate cleaning apparatus, substrate processing apparatus, substrate cleaning method, and substrate processing method

Abstract

The lower surface of the substrate can be cleaned. A substrate cleaning apparatus includes a first scrubbing member configured to scrub a lower surface of a substrate to be cleaned, a first single-tube nozzle configured to supply a cleaning liquid to a vicinity of a center of the lower surface of the substrate, and a first spray nozzle configured to supply the cleaning liquid to the lower surface of the substrate.

Description

Technical Field The invention relates to a substrate cleaning device, a substrate processing device, a substrate cleaning method, and a substrate processing method. Background Art Patent Documents 1 to 5 disclose substrate cleaning devices for cleaning the upper surface of a substrate. Patent Document 1: Japanese Patent No. 6600470 Patent Document 2: Japanese Patent No. 6710129 Patent Document 3: Japanese Patent No. 6877221 Patent Document 4: Japanese Patent No. 6964745 Patent Document 5: International Publication No. 2021 / 230344 Summary of the invention An object of the present invention is to enable cleaning of the lower surface of a substrate. According to one embodiment of the present invention,

[0001] A substrate cleaning device is provided, comprising: a first scrubbing member for scrubbing the lower surface of the substrate to be cleaned; A first single-tube nozzle that supplies a cleaning liquid near the center of the lower surface of the substrate; and The first spray nozzle supplies the cleaning liquid to the lower surface of the substrate.

[0002] Based on the substrate cleaning device described in [1] above, It is preferable that a liquid landing area of ​​the cleaning liquid supplied from the first spray nozzle covers a vicinity of an edge of the substrate from a vicinity of a center of the substrate.

[0003] In the substrate cleaning device described in [1] or [2] above, it is preferred that the device further comprises at least one of a second single-tube nozzle and a second spray nozzle: The second single-tube nozzle is arranged at a position that is point-symmetrical with the first single-tube nozzle relative to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to a region near the center of the lower surface of the substrate and to a region different from the region where the cleaning liquid is supplied from the first single-tube nozzle. The second spray nozzle is disposed at a position that is point-symmetrical to the first spray nozzle with respect to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to the lower surface of the substrate. According to one embodiment of the present invention,

[0004] A substrate cleaning device is provided, comprising: a first scrubbing member for scrubbing the lower surface of the substrate to be cleaned; A first single-tube nozzle that supplies a cleaning liquid near the center of the lower surface of the substrate; and The second single-tube nozzle supplies the cleaning liquid to a region different from the vicinity of the center of the lower surface of the substrate.

[0005] In the substrate cleaning device described in [4] above, it is preferred that at least one of the third single-tube nozzle and the fourth single-tube nozzle is provided: The third single-tube nozzle is arranged at a position that is point-symmetrical with the first single-tube nozzle relative to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to a region near the center of the lower surface of the substrate and to a region different from the region where the cleaning liquid is supplied from the first single-tube nozzle. The fourth single tube is arranged at a position point-symmetrical to the second single tube nozzle with respect to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to a region of the lower surface of the substrate different from the vicinity of the center.

[0006] In the substrate cleaning device described in any one of the above [1] to [5], it is preferred that the device comprises: a second scrubbing member for scrubbing the upper surface of the substrate; a third single-tube nozzle that supplies a cleaning liquid near the center of the upper surface of the substrate; and The fourth single-tube nozzle supplies the cleaning liquid to a region different from the vicinity of the center of the upper surface of the substrate. According to one embodiment of the present invention,

[0007] A substrate cleaning device is provided, comprising: a first nozzle as a single-tube nozzle that supplies pure water toward the vicinity of the center of the lower surface of the substrate to be cleaned; and The second nozzle as the spray nozzle supplies pure water to the lower surface of the substrate.

[0008] In the substrate cleaning device described in [7] above, it is preferred that at least one of the third nozzle and the fourth nozzle is provided: The third nozzle is a single-tube nozzle, and is arranged at a position that is point-symmetrical with the first nozzle relative to the center of the substrate when viewed from vertically above, and supplies pure water to a region near the center of the lower surface of the substrate and to a region different from the pure water supply region from the first nozzle. The fourth nozzle is a spray nozzle, is disposed at a position that is point-symmetrical with the second nozzle with respect to the center of the substrate when viewed from vertically above, and supplies pure water to the lower surface of the substrate. According to one embodiment of the present invention,

[0009] A substrate cleaning device is provided, comprising: a first nozzle as a single-tube nozzle that supplies pure water toward the vicinity of the center of the lower surface of the substrate to be cleaned; and The second nozzle, which is a single-tube nozzle, supplies pure water to a region different from the vicinity of the center of the lower surface of the substrate.

[0010] In the substrate cleaning device described in [9] above, it is preferred that at least one of the third nozzle and the fourth nozzle is provided: The third nozzle is a single-tube nozzle, and is arranged at a position that is point-symmetrical with the first nozzle relative to the center of the substrate when viewed from vertically above, and supplies pure water to a region near the center of the lower surface of the substrate and to a region different from the pure water supply region from the first nozzle. The fourth nozzle is a single-tube nozzle, is arranged at a point-symmetrical position with the second nozzle relative to the center of the substrate when viewed from vertically above, and supplies pure water to a region of the lower surface of the substrate different from the vicinity of the center.

[0011] In the substrate cleaning device described in any one of the above-mentioned [7] to

[10] , it may be that: A substrate rotating mechanism configured to rotate the substrate is provided, A supply direction of the pure water supplied from the first nozzle and a tangential direction of the rotation direction of the substrate in a landing area of ​​the pure water supplied from the second nozzle are opposite to each other.

[0012] In the substrate cleaning device described in any one of the above-mentioned [7] to

[10] , it may be that: A substrate rotating mechanism configured to rotate the substrate is provided, A supply direction of the pure water supplied from the first nozzle and a tangential direction of the rotation direction of the substrate in a landing area of ​​the pure water supplied from the second nozzle are in the same direction.

[0013] Based on the substrate cleaning device described in

[12] above, It is preferable that an angle formed by the substrate and a supply direction of the pure water supplied from the first nozzle is 10 to 60 degrees. According to one embodiment of the present invention,

[0014] A substrate processing device is provided, comprising: A substrate polishing device that polishes a substrate using a polishing liquid; A first substrate cleaning device as described in any one of [1] to [6], which uses a cleaning liquid to scrub the substrate polished by the substrate polishing device; and The second substrate cleaning device of the substrate cleaning device described in any one of [7] to

[13] above cleans the substrate cleaned by the first substrate cleaning device using pure water. According to one embodiment of the present invention,

[0015] A substrate cleaning method is provided, wherein: The method includes a cleaning step in which the lower surface of a substrate to be cleaned is scrubbed, a cleaning liquid is supplied from a single nozzle to the vicinity of the center of the lower surface of the substrate, and a cleaning liquid is supplied from a spray nozzle to the lower surface of the substrate. According to one embodiment of the present invention,

[0016] A substrate cleaning method is provided, wherein: The method includes a cleaning step in which the lower surface of a substrate to be cleaned is scrubbed, and cleaning liquid is supplied from a first single-tube nozzle to near the center of the lower surface of the substrate, and cleaning liquid is supplied from a second single-tube nozzle to an area of ​​the lower surface of the substrate different from the area near the center.

[0017] Based on the substrate cleaning method described in

[15] or

[16] , The cleaning step is preferably performed after the substrate is polished using the polishing liquid to remove the polishing liquid from the lower surface of the substrate. According to one embodiment of the present invention,

[0018] A substrate cleaning method is provided, wherein: The method includes a cleaning step in which pure water is supplied from a single-tube nozzle to the vicinity of the center of the lower surface of a substrate to be cleaned, and pure water is supplied from a spray nozzle to the lower surface of the substrate. According to one embodiment of the present invention,

[0019] A substrate cleaning method is provided, wherein: The method includes a cleaning step in which pure water is supplied from a first single-tube nozzle to a region near the center of a lower surface of a substrate to be cleaned, and pure water is supplied from a second single-tube nozzle to a region of the lower surface of the substrate different from the region near the center.

[0020] Based on the substrate cleaning method described in

[18] or

[19] , The cleaning step is preferably performed after the substrate is cleaned with a cleaning liquid, and the cleaning liquid is removed from the lower surface of the substrate. According to one embodiment of the present invention,

[0021] A substrate processing method is provided, comprising: a substrate grinding process, in which the substrate is ground using a grinding liquid; a first substrate cleaning step, in which, after the substrate polishing step, the polished substrate is cleaned using a cleaning liquid by the substrate cleaning method described in any one of

[15] to

[17] , thereby removing the polishing liquid from the lower surface of the substrate; and A second substrate cleaning step, in which, after the first substrate cleaning step, the cleaned substrate is cleaned by the substrate cleaning method described in any one of claims

[18] to

[20] , thereby removing the cleaning liquid from the lower surface of the substrate. The lower surface of the substrate can be cleaned. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 1 is a block diagram showing a schematic structure of the substrate processing apparatus 100 . Figure 2 It is a schematic perspective view of the substrate cleaning apparatus 2 according to the first embodiment. Figure 3 This is a diagram for explaining the cleaning liquid supply area from the cleaning liquid supply nozzles 51 and 52. Figure 4A The figure schematically shows the state of cleaning when the rotation direction of the substrate W in the liquid landing area coincides with the supply direction of the cleaning liquid. Figure 4B The figure schematically shows the state of cleaning when the rotation direction of the substrate W in the liquid landing area does not coincide with the supply direction of the cleaning liquid. Figure 5 The diagram shows experimental results comparing the cleaning performance of the lower surface of the substrate W between the substrate cleaning apparatus 2 according to the first embodiment and a substrate cleaning apparatus as a comparative example. Fig. 6A As Figure 2 A schematic three-dimensional view of a substrate cleaning device 2 which is a modified example of the substrate cleaning device 2 . Figure 6B This is a diagram for explaining the cleaning liquid supply area from the cleaning liquid supply nozzles 51, 52, 51', and 52'. Figure 7 This is a diagram for explaining the cleaning liquid supply area from the single-tube nozzles 51 and 53. Figure 8 1 and 2 are diagrams showing experimental results of comparing the cleaning performance of the lower surface of the substrate W between the substrate cleaning apparatus 2 ′ according to the second embodiment and a substrate cleaning apparatus as a comparative example. Fig. 9 This is a diagram for explaining the cleaning liquid supply area from the single-tube nozzles 51 , 53 , 51 ′, and 53 ′. Fig.10 It is a schematic perspective view of a substrate cleaning device 3 according to a third embodiment. Fig.11A The figure schematically shows the state of cleaning when the rotation direction of the substrate W in the liquid landing area does not coincide with the supply direction of the cleaning liquid. Fig. 11B The figure schematically shows the state of cleaning when the rotation direction of the substrate W in the liquid landing area coincides with the supply direction of the cleaning liquid. Fig.12 This is a diagram for explaining a preferred pure water supply area from the single tube nozzle 81. Fig.13 This is a diagram showing experimentally the relationship between the pure water landing area and the cleaning power. Fig.14 This is a graph experimentally showing the relationship between the vertical angle and the cleaning power. Fig.15 This is a diagram for explaining a preferred pure water supply area from the spray nozzle 82 . Fig.16 This is a diagram for explaining a preferred arrangement of the pure water supply nozzles 81 and 82 when viewed from vertically above. Fig.17 The graph shows experimental results of comparing the cleaning performance of the lower surface of the substrate W between the substrate cleaning apparatus 3 according to the third embodiment and a substrate cleaning apparatus as a comparative example. Fig.18 As Fig.10 A schematic three-dimensional view of a substrate cleaning device 3 which is a modified example of the substrate cleaning device 3 . Fig.19 The graph shows experimental results of comparing the cleaning performance of the lower surface of the substrate W between the substrate cleaning apparatus 3 according to the fourth embodiment and a substrate cleaning apparatus as a comparative example. DETAILED DESCRIPTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Figure 1 1 is a block diagram showing a schematic structure of a substrate processing apparatus 100. The substrate processing apparatus 100 includes a substrate polishing apparatus 1, and substrate cleaning apparatuses 2 and 3. The type, shape, and size of the substrate to be processed are not particularly limited, and may be, for example, a circular semiconductor wafer with a diameter of 300 mm. The substrate polishing device 1 polishes the surface and / or the inclined surface of the substrate using a polishing liquid. Debris (defects) such as polishing liquid and polishing scraps will adhere to the upper surface (front surface) and the lower surface (back surface) of the polished substrate. The substrate polishing device 1 can be a known device, so its description is omitted. The substrate cleaning device 2 scrubs the upper and lower surfaces of the substrate polished by the substrate polishing device 1, and uses a cleaning liquid to clean and remove dirt. The cleaning liquid can be a chemical liquid or pure water (Deionized Water: DIW). The cleaning liquid will remain on the upper and lower surfaces of the substrate after cleaning. The structure of the substrate cleaning device 2 is described in the first and second embodiments. The substrate cleaning device 3 cleans the upper and lower surfaces of the substrate cleaned by the substrate cleaning device 2 with pure water, and replaces the remaining cleaning liquid with pure water. The structure of the substrate cleaning device 3 is described in the third and fourth embodiments. Although not shown, the substrate processing apparatus 100 includes a conveying device for conveying a substrate to be processed from a loading port (not shown) to the substrate polishing apparatus 1, a conveying device for conveying a substrate polished by the substrate polishing apparatus 1 to the substrate cleaning apparatus 2, and a conveying device for conveying a substrate cleaned by the substrate cleaning apparatus 2 to the substrate cleaning apparatus 3. In addition, the substrate processing apparatus 100 may also include a substrate drying device for drying the cleaned substrate. (First Embodiment) In the first embodiment, the substrate cleaning device 2 is described in detail. Figure 2 1 is a schematic perspective view of a substrate cleaning device 2 according to the first embodiment. The substrate cleaning device 2 includes substrate rotating mechanisms 11 to 14, scrubbing members 21 and 22, rotating mechanisms 31 and 32, guide rails 33, a lifting drive mechanism 34, cleaning liquid supply nozzles 41 and 42 for the upper surface, and cleaning liquid supply nozzles 51 and 52 for the lower surface. The substrate rotating mechanisms 11 to 14 hold and rotate the substrate W. In the present embodiment, the substrate rotating mechanisms 11 to 14 hold the substrate W in a horizontal direction and rotate the substrate W in a horizontal plane. The rotation speed is, for example, 50 to 500 rpm. Specifically, the substrate rotating mechanism 11 is a roller composed of a holding portion 11a and a shoulder (supporting portion) 11b. The diameter of the shoulder 11b is larger than the diameter of the holding portion 11a, and the holding portion 11a is provided on the shoulder 11b. The substrate rotating mechanisms 12 to 14 also have the same structure as the substrate rotating mechanism 11. The substrate rotating mechanisms 11 to 14 can move in directions approaching and separating from each other through a driving mechanism (such as a cylinder) not shown in the figure. The substrate rotating mechanisms 11 to 14 are close to each other, so that the holding portions 11a to 14a can hold the substrate W roughly horizontally. In addition, it is configured so that at least one of the substrate rotating mechanisms 11 to 14 is driven to rotate by a rotating mechanism not shown in the figure, thereby enabling the substrate W to rotate in a horizontal plane. When held by the substrate rotating mechanisms 11 to 14 , the vertically upward substrate surface is referred to as the upper surface of the substrate W, and the vertically downward substrate surface is referred to as the lower surface of the substrate W. Generally, devices are formed on the upper surface of the substrate W. The scrubbing member 21 contacts the upper surface of the substrate W to scrub the upper surface of the substrate W. In the present embodiment, the scrubbing member 21 is a roller formed of a sponge or the like, and is arranged to extend horizontally from the edge of the substrate W through the center to the opposite edge. The scrubbing member 21 is rotated by the rotating mechanism 31 about the longitudinal direction of the scrubbing member 21. The rotating mechanism 31 is attached to a guide rail 33 for guiding its vertical movement and supported by a lifting drive mechanism 34. The rotating mechanism 31 and the scrubbing member 21 are moved vertically along the guide rail 33 by the lifting drive mechanism 34. The scrubbing member 22 is disposed below the scrubbing member 21 and contacts the lower surface of the substrate W to scrub the lower surface of the substrate W. In this embodiment, the scrubbing member 22 is a roller formed of a sponge or the like and is disposed to extend horizontally from the edge of the substrate W through the center to the opposite edge. The scrubbing member 22 is rotated by the rotating mechanism 32 about the longitudinal direction of the scrubbing member 22. Although the lifting drive mechanism and the like are not shown, the rotating mechanism 32 and the scrubbing member 22 also move in the vertical direction similarly to the scrubbing member 21. The cleaning liquid supply nozzles 41 and 42 are arranged above the substrate W to supply cleaning liquid to the upper surface of the substrate W. As an example, the cleaning liquid supply nozzle 41 is a single-tube nozzle, and supplies cleaning liquid to the vicinity of the center of the upper surface of the substrate W. The cleaning liquid supply nozzle 42 is also a single-tube nozzle, and supplies cleaning liquid to a position of the upper surface of the substrate W that is different from the vicinity of the center (for example, between the center and the edge). As a specific example, the front end diameter of the cleaning liquid supply nozzles 41 and 42 can be made to be 1.0 mm in diameter. However, there is no limitation on the type and number of the cleaning liquid supply nozzles 41 and 42, and they can also be omitted according to circumstances. The cleaning liquid supply nozzles 51 and 52 are arranged below the substrate W to supply the cleaning liquid to the lower surface of the substrate W. As a feature of the present embodiment, the cleaning liquid supply nozzle 51 is a single-tube nozzle (hereinafter sometimes referred to as "single-tube nozzle 51"). The radius of the single-tube nozzle 51 is, for example, 0.5 to 3 mm. On the other hand, the cleaning liquid supply nozzle 52 is a spray nozzle (hereinafter sometimes referred to as "spray nozzle 52"). Its expansion angle is, for example, 50 to 150 degrees. Comparing the two nozzles, the single-tube nozzle 51 is strong because it continuously supplies large droplets to a narrow area on the lower surface of the substrate W. On the other hand, the spray nozzle 52 is weak because it discontinuously supplies small droplets to a wide area on the lower surface of the substrate W while dispersing them. In addition, the cleaning liquid used in the substrate cleaning device 2 may be a liquid medicine or pure water. The liquid medicine may be, for example, an organic solvent or a heated liquid, and the pure water may be ultrasonic water or may contain microbubbles. The cleaning liquid from a certain nozzle may be a liquid medicine, and the cleaning liquid from another nozzle may be pure water. Alternatively, the cleaning liquid from all nozzles may be a liquid medicine, and the cleaning liquid from all nozzles may be pure water. In addition, it is preferred that the supply of the cleaning liquid from the cleaning liquid supply nozzles 51 and 52 is started at the same time and stopped at the same time. The flow rate balance of the cleaning liquid supplied from the cleaning liquid supply nozzles 51 and 52 is arbitrary, but for example, both are 500 ml / min. Moreover, the total flow rate of the cleaning liquid supplied from the cleaning liquid supply nozzles 51 and 52 is, for example, 500 to 4000 ml / min. In addition, the cleaning liquid supply nozzles 51 and 52 may be arranged so as to be offset in the horizontal direction, or may be arranged so as to be offset in the vertical direction. For convenience of explanation, the center of the held substrate W is taken as the origin, the direction in which the scrubbing members 21 and 22 extend is taken as the y direction (the side where the rotating mechanism 31 is provided is taken as the negative direction), the direction perpendicular to the y direction in the horizontal plane is taken as the x direction (the side where the cleaning liquid supply nozzles 51 and 52 are provided is taken as the positive direction), and the vertical direction is taken as the z direction (the upward direction is taken as the positive direction). Figure 2 In FIG. 5 , the cleaning liquid supply nozzles 51 and 52 are arranged in a region where x>0 and z<0. Figure 3 1 is a diagram for explaining the cleaning liquid supply area from the cleaning liquid supply nozzles 51 and 52. Figure 3 (a) corresponds to a view of the substrate W viewed from the bottom +z direction, Figure 3 (b) corresponds to a view of the substrate W viewed from the side direction +y direction (wherein the scrubbing member 22 is omitted). As shown in the figure, the cleaning liquid from the single-tube nozzle 51 is supplied to a narrow liquid landing area A1 including the vicinity of the center (the so-called "near the center" preferably includes the center, but may not include the center) of the substrate W. The liquid landing area A1 of the cleaning liquid from the single-tube nozzle 51 can also be said to be near the origin. On the other hand, the cleaning liquid from the spray nozzle 52 is supplied to a wide liquid landing area A2 covering the edge from the vicinity of the center of the substrate W while spreading in a fan shape or a cone shape. The liquid landing area A2 of the cleaning liquid from the spray nozzle 52 is an area where x≈0 and y<0. In addition, the direction from the spray nozzle 52 toward the center of the liquid landing area A2 in the longitudinal direction is referred to as the cleaning liquid supply direction of the spray nozzle 52. The cleaning liquid supply direction is approximately the -x direction. Figure 4A2 is a diagram schematically showing the cleaning process when the rotation direction of the substrate W in the liquid landing area is consistent with the supply direction of the cleaning liquid. Figure 4A (a) corresponds to a view of the substrate W viewed from the bottom +z direction, Figure 4A (b) corresponds to a view of the substrate W viewed from the side direction +y direction. like Figure 4A As shown in (a), the substrate W rotates in a clockwise direction when viewed from below. The tangent direction of the rotation direction of the substrate W in the liquid landing area (the area where x≈0 and y<0) of the cleaning liquid from the spray nozzle 52 is the -x direction. In addition, the cleaning liquid supply direction from the cleaning liquid supply nozzles 51 and 52 is also the -x direction. In this way, the tangent direction of the rotation direction of the substrate W in the liquid landing area is consistent with the supply direction of the cleaning liquid (both are the -x direction). In addition, if Figure 4A (b) shows an example in which the rotation direction of the scrubbing part 21 is counterclockwise when viewed from the side direction +y direction, and the rotation direction of the scrubbing part 22 is clockwise (that is, in the area where the cleaning liquid is supplied from the spray nozzle 52, at the position where the scrubbing parts 21, 22 contact the substrate W, the tangential direction of the rotation direction of the scrubbing parts 21, 22 is opposite to the tangential direction of the rotation direction of the substrate W), but it can also be opposite rotation. As shown in the figure, cleaning liquid layers 91 and 92 are formed on the upper surface and the lower surface of the substrate W, respectively, and flow in the same direction as the tangent direction of the rotation direction of the substrate W (that is, the -x direction). Moreover, the cleaning liquid in the cleaning liquid layers 91 and 92 that is closer to the substrate W flows more slowly. For example, when the substrate W is rotated at 100 rpm and the cleaning liquid is supplied at 1 L / min, the flow of the cleaning liquid in the portion that is about 10 μm or less from the substrate W is particularly slow, about 20 mm / s (estimated value), which is called a low-viscosity layer. In addition, dust such as polishing liquid and polishing scraps adhere to the upper and lower surfaces of the substrate W. The dust is scraped off from the upper and lower surfaces of the substrate W by the scrubbing members 21 and 22 . On the lower surface of the substrate W, part of the scraped dust 93 flows in the −x direction along with the flow of the cleaning liquid layer 92 , and is guided to the edge of the substrate W and efficiently discharged in the horizontal direction due to the strong force of the cleaning liquid from the single-tube nozzle 51 . In addition, part of the scraped dirt 94 flows in the +x direction due to the rotation of the scrubbing member 22. At this time, the droplets of the cleaning liquid from the spray nozzle 52 collide discontinuously, and because the amount of motion (mass) of the droplets is small, they can be easily bounced off by the flow of the cleaning liquid layer 92 and do not enter the adhesion lower layer. As a result, the flow of the cleaning liquid layer 92 becomes larger, and the attached matter can be removed efficiently. In this way, when the supply direction of the cleaning liquid in the liquid landing area is consistent with the tangent direction of the rotation direction of the substrate W, the cleaning liquid supply from the single-tube nozzle 51 and the spray nozzle 52 works effectively on the lower surface of the substrate W, and the garbage 94 can be removed efficiently. Figure 4B 2 is a diagram schematically showing the cleaning process when the rotation direction of the substrate W in the liquid landing area is inconsistent with the supply direction of the cleaning liquid. Figure 4B (a) corresponds to a view of the substrate W viewed from the bottom +z direction, Figure 4B (b) corresponds to a view of the substrate W viewed from the side direction +y direction. like Figure 4B As shown in (a), the substrate W rotates counterclockwise when viewed from below. The tangent direction of the rotation direction of the substrate W in the liquid landing area (the area where x≈0 and y<0) of the cleaning liquid from the spray nozzle 52 is the + direction. In contrast, the cleaning liquid supply direction from the cleaning liquid supply nozzles 51 and 52 is the -x direction. In this way, the tangent direction of the rotation direction of the substrate W in the liquid landing area is inconsistent with the supply direction of the cleaning liquid. In addition, if Figure 4B (b) shows an example in which the rotation direction of the scrubbing part 21 is counterclockwise when viewed from the side direction +y direction, and the rotation direction of the scrubbing part 22 is clockwise (that is, in the area where the cleaning liquid is supplied from the spray nozzle 52, at the position where the scrubbing parts 21, 22 contact the substrate W, the tangential direction of the rotation direction of the scrubbing parts 21, 22 is the same direction as the tangential direction of the rotation direction of the substrate W), but it may also be opposite rotation. On the lower surface of the substrate W, the flow of the cleaning liquid layer 92 is in the +x direction, and the rotation direction of the scrubbing member 22 is also in the clockwise direction, so most of the scraped dust 95 flows in the +x direction. On the other hand, the cleaning liquid supply direction from the spray nozzle 52 is the -x direction, which is opposite to the flow (+x direction) of the cleaning liquid layer 92. Moreover, since the cleaning liquid from the spray nozzle 52 is weak and the droplets are fine, they are bounced off by the cleaning liquid layer 92 and fall downward. At this time, since the cleaning liquid falls together with the garbage 95, the garbage 95 can be efficiently discharged downward. In this way, when the supply direction of the cleaning liquid in the liquid landing area is inconsistent with the rotation direction of the substrate W, the supply of the cleaning liquid from the spray nozzle 52 also works particularly effectively on the lower surface of the substrate W, and dust can be removed efficiently. Figure 5 The diagram shows experimental results comparing the cleaning performance of the lower surface of the substrate W between the substrate cleaning apparatus 2 according to the first embodiment and a substrate cleaning apparatus as a comparative example. The substrate cleaning device as a comparative example replaces the cleaning liquid supply nozzles 51 and 52 of the substrate cleaning device 2 according to the first embodiment with comb-shaped nozzles. The comb-shaped nozzle is a nozzle having about 10 to 15 holes in a rod-shaped tube extending parallel to the scrubbing member 22, and the cleaning liquid is supplied to the entire lower surface of the substrate W from each hole. Furthermore, the substrate cleaning apparatus 2 according to the first embodiment and the substrate cleaning apparatus as the comparative example have the same conditions such as the supply amount of the cleaning liquid per unit time, the number of rotations and the rotation direction of the substrate W. Figure 5 The vertical axis of the figure normalizes the amount of garbage (defect) after constant cleaning time as a comparative example. As shown in the figure, in the substrate cleaning device 2 according to the present embodiment using the single-tube nozzle 51 and the spray nozzle 52 instead of the comb-shaped nozzle, the amount of garbage remaining on the back of the substrate W can be reduced to about 40% regardless of whether the cleaning liquid is an alkaline liquid or pure water. As described above, in the first embodiment, scrubbing is performed while supplying the cleaning liquid from the single nozzle 51 and the spray nozzle 52 to the lower surface of the substrate W. Thus, the polishing liquid and other debris attached to the lower surface of the substrate W during polishing can be efficiently removed. Fig. 6A As Figure 2 A simplified perspective view of a substrate cleaning device 2 of a modified example of the substrate cleaning device 2 is provided with an additional single-tube nozzle 51' and a spray nozzle 52' (one of the single-tube nozzle 51' and the spray nozzle 52' may be omitted). Figure 6B This is a diagram for explaining the cleaning liquid supply region from the cleaning liquid supply nozzles 51 , 52 , 51 ′, and 52 ′ in this case, and corresponds to a diagram of the substrate W viewed from the bottom in the +z direction (however, the scrubbing member 22 is omitted). The single nozzle 51' is disposed below the substrate W and is disposed at a position that is point-symmetrical to the single nozzle 51 with respect to the center of the substrate W when viewed from vertically above. The single nozzle 51 and the single nozzle 51' are preferably located on the same plane. The spray nozzle 52' is disposed below the substrate W and is disposed at a position that is point-symmetrical with respect to the center of the substrate W when viewed from vertically above. The spray nozzle 52 and the spray nozzle 52' are preferably located on the same plane. like Figure 6B As shown, the cleaning liquid from the single-tube nozzle 51 is supplied to the liquid landing area A1 near the center of the substrate W. The cleaning liquid from the single-tube nozzle 51' is supplied to the liquid landing area A1' near the center of the substrate W. The liquid landing area A1 and the liquid landing area A1' are preferably at different positions. Among them, it is preferred that one of them includes the vicinity of the center of the substrate W. The cleaning liquid from the spray nozzle 52 is supplied to the liquid landing area A2 covering the edge from the center of the substrate W. The liquid landing area A2 is an area where x≈0 and y<0. The cleaning liquid from the spray nozzle 52' is supplied to the liquid landing area A2' covering the edge from the center of the substrate W. The liquid landing area A2' is preferably an area where x≈0 and y>0. (Second Embodiment) The second embodiment is a modified example of the substrate cleaning apparatus 2 described in the first embodiment. Hereinafter, the differences from the first embodiment will be mainly described. The substrate cleaning apparatus 2 ′ according to the second embodiment is obtained by replacing the spray nozzle 52 in the substrate cleaning apparatus 2 according to the first embodiment with a single-tube nozzle 53 . Figure 7 This is a diagram for explaining the cleaning liquid supply area from the single-tube nozzles 51 and 53. Figure 7 (a) corresponds to a view of the substrate W viewed from the bottom +z direction, Figure 7 (b) corresponds to a view of the substrate W viewed from the side direction +y direction. As shown in the figure, the cleaning liquid from the single-tube nozzle 51 is supplied to a narrow liquid landing area A1 including the center (or the vicinity of the center) of the substrate W. The cleaning liquid from the single-tube nozzle 53 is supplied to the scrubbing member 22 (at Figure 7 The cleaning liquid landing area A3 is a narrow area near the substrate W (omitted in FIG. 1 ) and between the center and the edge of the substrate W. The cleaning liquid landing area A3 from the single-tube nozzle 53 can be said to be an area where x=0 and y<0. The cleaning liquid supply direction from the single-tube nozzle 53 can also be a direction orthogonal to the scrubbing member 22. Figure 8 1 is a diagram showing experimental results of comparing the cleaning performance of the lower surface of the substrate W between the substrate cleaning apparatus 2 ′ according to the second embodiment and a substrate cleaning apparatus as a comparative example. Figure 7 As shown in the figure, in the substrate cleaning device 2' of this embodiment using single-tube nozzles 51 and 53 instead of comb-shaped nozzles, the amount of garbage remaining on the back of the substrate W can be reduced to about 50% regardless of whether the cleaning liquid is a chemical liquid or pure water. The reason why the single-tube nozzles 51 and 53 can remove dust more efficiently than the comb-shaped nozzles is as follows. Since the comb nozzle supplies cleaning liquid from 10 to 15 holes, when the cleaning liquid supply per unit time is equal, the cleaning liquid of the single-tube nozzle 51 and 53 has a strong force, and the force of the cleaning liquid layer (horizontal propulsion force) is high. Therefore, the force to discharge garbage in the horizontal direction becomes larger. Furthermore, since the comb-shaped nozzle supplies cleaning liquid to a wide area, the single nozzle 51 can more intensively supply cleaning liquid to the center of the substrate W. Thus, when the single nozzle 51 is used, it is possible to suppress a decrease in cleaning force near the center of the substrate W where the effect of rotation is reduced. In this embodiment, when compared with the first embodiment using the spray nozzle 52, although the effect of causing the dust to fall downward is relatively small, the cleaning effect is higher than that of the comparative example using the comb-shaped nozzle. In addition, Fig. 6A Similarly, additional single-tube nozzles 51 ′ and 53 ′ may be provided (however, one of the single-tube nozzles 51 ′ and 53 ′ may be omitted). Fig. 9 This is a diagram for explaining the cleaning liquid supply region from the single-tube nozzles 51 , 53 , 51 ′, and 53 ′ in this case, and corresponds to a diagram of the substrate W viewed from the bottom in the +z direction (however, the scrubbing member 22 is omitted). The single nozzle 51' is disposed below the substrate W and is disposed at a position that is point-symmetrical to the single nozzle 51 with respect to the center of the substrate W when viewed from vertically above. The single nozzle 51 and the single nozzle 51' may be on the same plane. The single nozzle 53' is disposed below the substrate W and is disposed at a position that is point-symmetrical with respect to the center of the substrate W when viewed from vertically above. The single nozzle 53 and the single nozzle 53' may be on the same plane. The cleaning liquid from the single-tube nozzle 51 is supplied to the liquid landing area A1 near the center of the substrate W. The cleaning liquid from the single-tube nozzle 51' is supplied to the liquid landing area A1' near the center of the substrate W. Preferably, the liquid landing area A1' and the liquid landing area A1' are different areas. Preferably, one of them includes the center of the substrate W. The cleaning liquid from the single-tube nozzle 53 is supplied to the liquid landing area A3 between the center and the edge of the substrate W. The liquid landing area A3 of the cleaning liquid from the single-tube nozzle 53 is an area where x=0 and y<0. The cleaning liquid from the single-tube nozzle 53' is supplied to the liquid landing area A3' between the center and the edge of the substrate W. The liquid landing area A3' of the cleaning liquid from the single-tube nozzle 53' is an area where x=0 and y>0. (Third Embodiment) In a third embodiment, Figure 1 The substrate cleaning device 3 is described in detail. The substrate cleaning device 3 is a device that replaces the cleaning liquid used in the cleaning of the substrate cleaning device 2 and remaining on the surface of the substrate W with pure water. Fig.103 is a schematic perspective view of a substrate cleaning device 3 according to the third embodiment. The substrate cleaning device 4 includes substrate rotating mechanisms 61 to 64, pure water supply nozzles 71 and 72 for the upper surface, and pure water supply nozzles 81 and 82 for the lower surface. Figure 2 Compared with the substrate cleaning device 2 shown in FIG. 1 , the scrubbing components 21 and 22 and the associated rotating mechanisms 31 and 32, the guide rails 33, and the lifting drive mechanism 34 may also be omitted. Figure 2 The substrate cleaning device 2 shown is the same. In addition, as a feature of this embodiment, the pure water supply nozzle 81 for the lower surface is set as a single-tube nozzle (hereinafter, sometimes referred to as "single-tube nozzle 81"), and the pure water supply nozzle 82 is set as a spray nozzle (hereinafter, sometimes referred to as "spray nozzle 82"). The pure water supplied from these nozzles has a liquid landing area and a liquid landing area. Figure 3 Same as shown. Fig.11A 2 is a diagram schematically showing the cleaning process when the rotation direction of the substrate W in the liquid landing area is inconsistent with the supply direction of the cleaning liquid. Fig.11A (a) corresponds to a view of the substrate W viewed from the bottom +z direction, Fig.11A (b) corresponds to a view of the substrate W viewed from the side direction +y direction. like Fig.11A As shown in (a), the substrate W rotates counterclockwise when viewed from below. The tangent direction of the rotation direction of the substrate W in the liquid landing area (the area where x≈0 and y<0) of the cleaning liquid from the spray nozzle 82 is the + direction. In contrast, the pure water supply direction from the pure water supply nozzles 81 and 82 is the -x direction. In this way, the tangent direction of the rotation direction of the substrate W in the liquid landing area is inconsistent with the pure water supply direction. Furthermore, layers 96 and 97 of the cleaning liquid used in the substrate cleaning apparatus 2 remain on the upper surface and the lower surface of the substrate W, respectively. On the lower surface of the substrate W, the flow of the cleaning liquid layer 97 is in the +x direction. On the other hand, the pure water supply direction from the spray nozzle 82 is in the -x direction, and is in the opposite direction to the flow (+x direction) of the cleaning liquid layer 97. The pure water from the spray nozzle 82 discontinuously disperses small droplets while colliding in a wide range, and the motion amount (mass) of the droplets is small. Therefore, the flow velocity in the horizontal direction after the droplets collide with the cleaning liquid layer 97 is small, and they are bounced off by the cleaning liquid layer 97 and fall downward. At this time, since the pure water falls together with the cleaning liquid layer 97, the cleaning liquid layer 97 can be efficiently discharged downward. In addition, even if the spray nozzle 82 is a single-tube nozzle, a constant effect is achieved, but the spray nozzle 82 is more preferable. If pure water is supplied from a single-tube nozzle, the pure water that lands on the substrate W will fall due to gravity before it is fully diffused. Therefore, the cleaning liquid layer 97 cannot be efficiently removed in an area of ​​the substrate W that is far from the liquid landing area. In contrast, since the spray nozzle 82 can supply pure water to a wide area and can expand the liquid landing area itself, the pure water will not fall due to gravity before it is fully diffused, and the cleaning liquid layer 97 can be efficiently removed in a wide area. In addition, if pure water is supplied from a single-tube nozzle, the pure water has a strong force, so on the lower surface of the substrate W, the pure water easily flows back along the substrate W, causing liquid stagnation, making it difficult to replace the cleaning liquid layer 97 with pure water. In contrast, since the spray nozzle 82 supplies pure water with a weak force, it does not flow back along the substrate W and is easily bounced off and falls downward. As a result, the cleaning liquid layer 97 can be efficiently removed downward. The reason why the single-tube nozzle 81 is provided in addition to the spray nozzle 82 is as follows. Since the cleaning liquid from the spray nozzle 82 lands on a wide area, the cleaning liquid supplied to the center of the substrate W becomes less. Since the rotation speed of the center of the substrate W is relatively low, the liquid flow is poor, and there is a case where the cleaning force is insufficient if the cleaning liquid is small. Therefore, in order to supply sufficient cleaning liquid to the center of the substrate W, the cleaning liquid is supplied toward the center of the substrate W from the single-tube nozzle 81. Fig. 11B 2 is a diagram schematically showing the cleaning process when the rotation direction of the substrate W in the liquid landing area is consistent with the supply direction of the cleaning liquid. Fig. 11B (a) corresponds to a view of the substrate W viewed from the bottom +z direction, Fig. 11B (b) corresponds to a view of the substrate W viewed from the side direction +y direction. like Fig. 11B As shown in (a), the substrate W rotates in a clockwise direction when viewed from below. The tangent direction of the rotation direction of the substrate W in the liquid landing area (the area where x≈0 and y<0) of the cleaning liquid from the spray nozzle 82 is the -x direction. In addition, the pure water supply direction from the pure water supply nozzles 81 and 82 is also the -x direction. In this way, the tangent direction of the rotation direction of the substrate W in the liquid landing area is consistent with the supply direction of the cleaning liquid. In this case, the cleaning liquid layer 97 is removed in the horizontal direction by the rotation of the substrate W, and the cleaning liquid layer 97 is removed downward by the pure water from the pure water supply nozzles 81 and 82. In particular, when the following specified conditions are met, the cleaning liquid layer 97 can be replaced with pure water more efficiently. Fig.12 This is a diagram for explaining a preferred pure water supply area from the single-tube nozzle 81. Fig.12 (a) corresponds to a view of the substrate W viewed from below, Fig.12 (b) corresponds to a view of the substrate W viewed from the side. like Fig.12 As shown in (a), the single-tube nozzle 81 preferably supplies pure water in a manner such that the liquid landing area is converged in the area B1 of 0<x<D closer to the front (single-tube nozzle 81 side) than the center of the substrate W. This is because if the liquid landing area is in the area of ​​x<0, the cleaning force at the center of the substrate W with a low rotation speed is insufficient. In addition, when the liquid landing area is too close to the edge of the substrate W (area where x is too large) and the single-tube nozzle 81 needs to be pointed upward, the ability to discharge the cleaning liquid layer 97 formed on the lower surface of the substrate W is reduced. Fig.13 This is a diagram showing experimentally the relationship between the pure water landing area and the cleaning power. The position shown in "Nozzle Position" is the configuration position of the single-tube nozzle 81, and the six small circles represent the landing area. The pH after pure water is supplied to each landing area under constant conditions relative to the lower surface of the substrate W on which the alkaline cleaning liquid layer is formed is represented by a numerical value. When the liquid-attaching area exists in the region of x<0, the pH after pure water supply is 7.4, and the alkaline cleaning liquid cannot be fully removed. In addition, when the liquid-attaching area exists in the region of 53mm<x, the pH after pure water supply is 7.8 or 8.0, and the alkaline cleaning liquid cannot be fully removed. In contrast, when the liquid-attaching area is narrowed to the region of 0<x<D=53mm, the pH after pure water supply is 7.0, and the alkaline cleaning liquid can be fully removed. As described above, when the diameter of the substrate W is 300 mm, D is preferably 50 mm or less, and more preferably 30 mm or less. In general, D is preferably 16% or less of the diameter of the substrate W. Back to Fig.12 The angle (hereinafter referred to as "vertical angle") α formed by the substrate W and the supply direction of pure water is preferably 10 to 60 degrees, more preferably 20 to 40 degrees, and further preferably 30 to 35 degrees. This is because when the vertical angle α is too large (close to 90 degrees), the ability to discharge the cleaning liquid layer 97 in the horizontal direction is reduced. In addition, when the vertical angle α is too small (less than 10 degrees), the ability to discharge the cleaning liquid layer 97 downward is reduced. Fig.14 This is a graph showing the relationship between the vertical angle and the cleaning force experimentally. It shows the time variation of the residual rate of the cleaning liquid layer remaining on the lower surface of the substrate W when the vertical angle is 20 degrees, 30 degrees, 40 degrees, and 60 degrees. It can be seen that it is particularly significant in 1 to 1.25 seconds, but the vertical angle is preferably 20 degrees to 40 degrees, and more preferably 30 degrees. Fig.15 This is a diagram for explaining a preferred pure water supply region from the spray nozzle 82 , and corresponds to a diagram of the substrate W viewed from below. As shown in the figure, it is preferred that pure water is supplied from the spray nozzle 82 to the spray nozzle 82 side relative to the line connecting the single-tube nozzle 81 and the center of the substrate W. In detail, the liquid landing area A3 of the pure water supplied from the spray nozzle 82 overlaps at least a part of the liquid landing area A4 of the pure water supplied from the single-tube nozzle 81. In addition, the liquid landing area A3 reaches the edge of the substrate W. This is because, when the pure water does not reach the edge, the efficiency of replacing the cleaning liquid layer 97 at the edge with pure water is reduced. Also, the angle (perpendicular angle) formed between the substrate W and the pure water supply direction from the spray nozzle 82 is preferably 15 to 60 degrees, more preferably 20 to 40 degrees, and even more preferably 30 to 35 degrees, similarly to the single-tube nozzle 81 . Fig.16 This is a diagram illustrating the preferred configuration of the pure water supply nozzles 81 and 82 when viewed from vertically above. The distance between the line L connecting the single-tube nozzle 81 and the spray nozzle 82 and the center of the substrate W is preferably 300 mm or less. In addition, when the line connecting the center of the substrate W and the center Lc of the line L is used as the reference line M, the angle β formed by the reference line M and the line connecting the single-tube nozzle 81 and the center of the substrate W is preferably 0 degrees to 75 degrees, and more preferably 15 degrees to 45 degrees. In addition, the angle formed by the reference line M and the line connecting the spray nozzle 82 and the center of the substrate W is preferably 0 degrees to -75 degrees, and more preferably -15 degrees to -45 degrees. This is because the pure water from the single-tube nozzle 81 and the pure water from the spray nozzle 82 are mixed, and the cleaning liquid layer 97 near the center of the substrate W can be efficiently discharged in the horizontal direction. In particular, in order for the single-tube nozzle 81 to efficiently discharge the cleaning liquid layer 97 in the horizontal direction, the above-mentioned angle β may also have a constant degree. As described above, in the third embodiment, pure water is supplied from the single tube nozzle 81 and the spray nozzle 82 to clean the lower surface of the substrate W. Thus, the cleaning liquid remaining during substrate cleaning by the substrate cleaning apparatus 2 can be efficiently removed from the lower surface of the substrate W. Fig.17 1 is a graph showing experimental results of comparing the cleaning performance of the lower surface of the substrate W in the substrate cleaning device 3 according to the third embodiment and the substrate cleaning device as a comparative example. The vertical axis normalizes the time required to remove the layer of cleaning liquid remaining on the lower surface of the substrate W by the comparative example. Figure 7 Similarly, a comb nozzle was used as a comparative example. As shown in the figure, in the substrate cleaning apparatus 3 of this embodiment using the single tube nozzle 81 and the spray nozzle 82 instead of the comb nozzle, the time required to remove the cleaning liquid can be reduced to less than 20%. In addition, Fig. 6A Similarly, the substrate cleaning device 3 may also include an additional single-tube nozzle 81' and a spray nozzle 82' (see Fig.18. Among them, one of the single-tube nozzle 81' and the spray nozzle 82' may be omitted). (Fourth Embodiment) The fourth embodiment is a modified example of the substrate cleaning apparatus 3 described in the third embodiment. Hereinafter, the differences from the third embodiment will be mainly described. The substrate cleaning device 3' according to the fourth embodiment is a device in which the spray nozzle 82 in the substrate cleaning device 3 according to the third embodiment is replaced with a single nozzle. Figure 7 Same as shown. The results of the cleaning test in this case are as follows Fig.19 The vertical axis normalizes the time required to remove the layer of cleaning liquid remaining on the lower surface of the substrate W in the comparative example. Fig.17 As shown in the figure, even when the spray nozzle is changed to a single-tube nozzle, the time required to remove the cleaning liquid can be reduced to about 70% compared with the comb nozzle. In addition, Fig. 9 Similarly, an additional single-tube nozzle may be provided (wherein, the nozzle equivalent to Fig. 9 One side of the nozzle of the single-tube nozzle 51', 53'). In the above-described embodiment, the substrate cleaning device 2 and the substrate cleaning device 3 are used as separate devices. However, when the cleaning liquid used in the substrate cleaning device 2 is pure water, the substrate cleaning devices 2 and 3 may be integrated. In this case, while the polished substrate is scrubbed with the scrubbing members 21 and 22, pure water is supplied to the upper and lower surfaces of the substrate to remove the garbage generated during the polishing. Next, while the scrubbing member 21 is moved upward and the scrubbing member 22 is moved downward, pure water is supplied to the upper and lower surfaces of the substrate to remove the pure water remaining on the upper and lower surfaces of the substrate. Based on the above description, those skilled in the art can think of additional effects and various modifications of the present invention, but the present invention is not limited to the above-mentioned embodiments. Various additions, changes and partial deletions can be made within the scope of the conceptual ideas and the main purpose of the present invention as defined in the claims and derived from their equivalents. For example, a function described as one device (or component, the same below) in this specification (including a function depicted as one device in the drawings) may be implemented by multiple devices. Conversely, a function described as multiple devices in this specification (including a function depicted as multiple devices in the drawings) may be implemented by one device. Alternatively, a part or all of a unit or function included in a certain device may also be included in another device. In addition, not all of the matters described in this specification are essential. In particular, matters described in this specification but not described in the claims can be regarded as arbitrary additional matters. In addition, please note that the applicant is only aware of the known inventions in the literature of the background technology recorded in this specification, and the present invention is not intended to solve the problems in the known inventions in the literature. The problems to be solved by the present invention should be determined by considering the entire specification. For example, in this specification, when there is a record of a content that a specified effect is achieved through a specific structure, it can also be considered that the problem that is the opposite of the specified effect can be solved. However, it is not the purpose of taking its specific structure as a necessary requirement. Description of Reference Numerals 100…substrate processing device; 1…substrate polishing device; 2, 3…substrate cleaning device; 11-14, 61-64…substrate rotating mechanism; 21, 22…scrubbing parts; 31, 32…rotating mechanism; 33…guide rail; 34…lifting drive mechanism; 41, 42, 71, 72…cleaning liquid supply nozzle; 51, 51', 53, 53', 81, 81'…single-tube nozzle; 52, 52', 82…spray nozzle; 91, 92, 96, 97…cleaning liquid layer; 93-95…garbage.

Claims

1. A substrate cleaning device, characterized in that: have: a first scrubbing member for scrubbing a lower surface of a substrate to be cleaned; a first single-tube nozzle that supplies a cleaning liquid near a center of a lower surface of the substrate; as well as A first spray nozzle supplies a cleaning liquid to a lower surface of the substrate.

2. The substrate cleaning device according to claim 1, characterized in that: The liquid landing area of ​​the cleaning liquid supplied from the first spray nozzle covers the vicinity of the edge of the substrate from the vicinity of the center of the substrate.

3. The substrate cleaning device according to claim 1 or 2, characterized in that: At least one of a second single-tube nozzle and a second spray nozzle is provided: The second single-tube nozzle is arranged at a position that is point-symmetrical with the first single-tube nozzle relative to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to a region near the center of the lower surface of the substrate and to a region different from the region where the cleaning liquid is supplied from the first single-tube nozzle. The second spray nozzle is disposed at a position that is point-symmetrical with the first spray nozzle with respect to the center of the substrate when viewed from vertically above, and supplies a cleaning liquid to the lower surface of the substrate.

4. A substrate cleaning device, characterized in that: have: a first scrubbing member for scrubbing a lower surface of a substrate to be cleaned; a first single-tube nozzle that supplies a cleaning liquid near a center of a lower surface of the substrate; as well as The second single-tube nozzle supplies the cleaning liquid to a region of the lower surface of the substrate different from the region near the center.

5. The substrate cleaning device according to claim 4, characterized in that: At least one of a third single-tube nozzle and a fourth single-tube nozzle is provided: The third single-tube nozzle is arranged at a position that is point-symmetrical with the first single-tube nozzle relative to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to a region near the center of the lower surface of the substrate and to a region different from the region where the cleaning liquid is supplied from the first single-tube nozzle. The fourth single tube is disposed at a position that is point-symmetrical to the second single tube nozzle with respect to the center of the substrate when viewed from vertically above, and supplies the cleaning liquid to a region of the lower surface of the substrate that is different from the vicinity of the center.

6. The substrate cleaning device according to claim 1 or 4, characterized in that: have: a second scrubbing member, the second scrubbing member scrubbing the upper surface of the substrate; a fifth single-tube nozzle, the fifth single-tube nozzle supplying a cleaning liquid near the center of the upper surface of the substrate; as well as A sixth single-tube nozzle supplies the cleaning liquid to a region of the upper surface of the substrate different from a region near the center.

7. A substrate cleaning device, characterized in that: have: a first nozzle as a single-tube nozzle that supplies pure water to the vicinity of the center of the lower surface of the substrate to be cleaned; and The second nozzle is a spray nozzle, and supplies pure water to the lower surface of the substrate.

8. The substrate cleaning device according to claim 7, characterized in that: At least one of the third nozzle and the fourth nozzle is provided: The third nozzle is a single-tube nozzle, and is arranged at a position that is point-symmetrical with the first nozzle relative to the center of the substrate when viewed from vertically above, and supplies pure water to a region near the center of the lower surface of the substrate and to a region different from the pure water supply region from the first nozzle. The fourth nozzle is a spray nozzle, is disposed at a position that is point-symmetrical with the second nozzle with respect to the center of the substrate when viewed from vertically above, and supplies pure water to the lower surface of the substrate.

9. A substrate cleaning device, characterized in that: have: a first nozzle as a single-tube nozzle that supplies pure water to the vicinity of the center of the lower surface of the substrate to be cleaned; and The second nozzle is a single-tube nozzle, and supplies pure water to a region of the lower surface of the substrate different from the vicinity of the center.

10. The substrate cleaning device according to claim 9, characterized in that: At least one of the third nozzle and the fourth nozzle is provided: The third nozzle is a single-tube nozzle, and is arranged at a position that is point-symmetrical with the first nozzle relative to the center of the substrate when viewed from vertically above, and supplies pure water to a region near the center of the lower surface of the substrate and to a region different from the pure water supply region from the first nozzle. The fourth nozzle is a single-tube nozzle disposed at a point-symmetrical position with the second nozzle relative to the center of the substrate when viewed from vertically above, and supplies pure water to a region of the lower surface of the substrate different from the vicinity of the center.

11. The substrate cleaning device according to claim 7 or 9, characterized in that: A substrate rotating mechanism configured to rotate the substrate is provided, The supply direction of the pure water supplied from the first nozzle and the tangential direction of the rotation direction of the substrate in the landing area of ​​the pure water supplied from the second nozzle are opposite to each other.

12. The substrate cleaning device according to claim 7 or 9, characterized in that: A substrate rotating mechanism configured to rotate the substrate is provided, A supply direction of the pure water supplied from the first nozzle and a tangential direction of the rotation direction of the substrate in a landing area of ​​the pure water supplied from the second nozzle are in the same direction.

13. The substrate cleaning device according to claim 12, characterized in that: The angle formed by the substrate and the supply direction of the pure water supplied from the first nozzle is 10 to 60 degrees.

14. A substrate processing device, characterized in that: have: A substrate polishing device, wherein the substrate polishing device polishes the substrate using a polishing liquid; a first substrate cleaning device, wherein the first substrate cleaning device is the substrate cleaning device according to claim 1 or 4, and uses a cleaning liquid to scrub the substrate after being polished by the substrate polishing device; as well as A second substrate cleaning device, wherein the second substrate cleaning device is the substrate cleaning device according to claim 7 or 9, and uses pure water to clean the substrate cleaned by the first substrate cleaning device.

15. A substrate cleaning method, characterized in that: The method includes a cleaning step in which the lower surface of a substrate to be cleaned is scrubbed, a cleaning liquid is supplied from a single nozzle to the vicinity of the center of the lower surface of the substrate, and a cleaning liquid is supplied from a spray nozzle to the lower surface of the substrate.

16. A substrate cleaning method, characterized in that: The method includes a cleaning step in which the lower surface of a substrate to be cleaned is scrubbed, and cleaning liquid is supplied from a first single-tube nozzle to a region near the center of the lower surface of the substrate, and cleaning liquid is supplied from a second single-tube nozzle to a region of the lower surface of the substrate different from the region near the center.

17. The substrate cleaning method according to claim 15 or 16, characterized in that: The cleaning step is performed after the substrate is polished using the polishing liquid to remove the polishing liquid from the lower surface of the substrate.

18. A substrate cleaning method, characterized in that: The method includes a cleaning step in which pure water is supplied from a single-tube nozzle to the vicinity of the center of the lower surface of a substrate to be cleaned, and pure water is supplied from a spray nozzle to the lower surface of the substrate.

19. A substrate cleaning method, characterized in that: The method includes a cleaning step in which pure water is supplied from a first single-tube nozzle to a portion near the center of a lower surface of a substrate to be cleaned, and pure water is supplied from a second single-tube nozzle to a region of the lower surface of the substrate different from the portion near the center.

20. The substrate cleaning method according to claim 18 or 19, characterized in that: The cleaning step is performed after the substrate is cleaned with a cleaning liquid, and the cleaning liquid is removed from the lower surface of the substrate.

21. A substrate processing method, characterized in that: Include: a substrate grinding process, in which the substrate is ground using a grinding liquid; a first substrate cleaning step, in which, after the substrate polishing step, the polished substrate is cleaned using a cleaning liquid by the substrate cleaning method according to claim 15 or 16, thereby removing the polishing liquid from the lower surface of the substrate; as well as A second substrate cleaning step, in which, after the first substrate cleaning step, the cleaned substrate is cleaned by the substrate cleaning method according to claim 18 or 19, thereby removing the cleaning liquid from the lower surface of the substrate.

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