Clamp for conveying vertical semiconductor wafer and method for cleaning semiconductor wafer

Abstract

A jig for transporting an upright semiconductor wafer, the jig comprising: a flat body having a head portion and a foot portion, the head portion and the foot portion forming a planar front side; arms extending from the head portion to spaced apart ends in the foot portion; a support surface at an end portion of the arm, arranged such that it is provided so as to move rearward from a plane on the front side; and a retaining pin arranged on the end portion and intended for establishing a clamping connection between the semiconductor wafer and the body, characterized in that a channel extending along an inner side of the arm is formed in the arm and terminates at an edge, where the edge is separated from the end portion of the arm.

Description

Technical Field

[0001] The present invention relates to a fixture for conveying an upright semiconductor wafer, the fixture comprising: a flat body having a head segment and a foot segment, the head segment and the foot segment forming a planar front side (front side);

[0002] an arm portion extending from the head segment to spaced apart ends in the foot segment;

[0003] a support surface at an end section (portion) of the arm, which is arranged such that it is set back from the plane of the front side; and

[0004] Holding pins are arranged on the end section and are intended to produce a clamping connection between the semiconductor wafer and the body. Background Art

[0005] This type of fixture is used in particular for cleaning (washing) lines, in which semiconductor wafers after chemical mechanical polishing (CMP) are individually transported to a cleaning module and cleaned. For example, this type of cleaning line (traveling beam device) is described in US2020 0 203 152A1. This fixture is also called a blade.

[0006] CN213 845 245U discloses such a fixture. The disadvantage is that such a fixture is not sufficient to protect the cleaned semiconductor wafer to prevent the following situations from occurring: liquid cleaning agent flows from the fixture onto the semiconductor wafer, particles contained in the cleaning agent may thus contaminate the cleaned (cleaned) semiconductor wafer again, and / or the cleaning agent subsequently flowing onto the semiconductor wafer changes the roughness of the surface of the semiconductor wafer. Summary of the invention

[0007] The purpose of the present invention is to reduce the risk of re-contamination of cleaned semiconductor wafers.

[0008] The object of the present invention is achieved by a clamp for conveying an upright semiconductor wafer, the clamp comprising: a flat body having a head segment and a foot segment, the head segment and the foot segment forming a planar front side;

[0009] an arm portion extending from the head segment to spaced apart ends in the foot segment;

[0010] a support surface at an end section of the arm, arranged such that it is set back from the plane of the front side; and

[0011] Holding pins are arranged on the end section and are intended to produce a clamping connection between the semiconductor wafer and the body.

[0012] Characterized in that a channel extending along the inner side of the arm is formed in the arm and terminates at an edge, wherein the edge is separated from the end of the arm.

[0013] The proposed channel guides the liquid that passes mainly through the semiconductor wafer to the (end) edge of the channel, from where the liquid can drip without previously flowing onto the surface of the semiconductor wafer. The channel preferably extends in the forward direction, that is, it projects to a certain extent out of the plane of the front side. Preferably, the inner sides of the arms are bent towards each other in a semicircular manner. It is also possible for the arms to be shaped in other ways, for example, the arms are spaced apart from each other at a constant distance in the foot section.

[0014] It is also preferred that at the end, the arms each taper to a tip which does not contact the semiconductor wafer being transported by the gripper. The tip is preferably rounded. This configuration is also the case in that liquid can drip at the tip.

[0015] The body of the clamp is thicker than the semiconductor wafer to be transported and it is preferably composed of a polymer.

[0016] The head section preferably presents an aperture therein and this reduces the weight of the clamp and its flow resistance.

[0017] The semiconductor wafer is preferably composed of single crystal silicon, and preferably has a diameter of 300 mm or more.

[0018] Preferably, the semiconductor wafer transported by the fixture is at a distance from the support surface. This distance is ensured by the configuration of the holding pins. This distance is preferably at least equal to the thickness of the semiconductor wafer. The holding pins preferably each have a contact surface for the semiconductor wafer, which is surrounded on both sides by a border portion. The border portion is in the form of a truncated cone, which is positioned opposite to each other, and the base surface of the truncated cone is located on the outside.

[0019] The invention also relates to a method for cleaning semiconductor wafers in a cleaning line, wherein the semiconductor wafer is transported from a cleaning module of the cleaning line in an upright state, characterized in that during this period, the semiconductor wafer is transported by a clamp according to the invention. The method is preferably used after CMP.

[0020] The present invention will be described in more detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 An embodiment of a clamp according to the present invention and the front side of a semiconductor wafer transported by the clamp are shown;

[0022] Figure 2 Shows Figure 1 The enlarged details;

[0023] Figure 3 Shows Figure 1 Views of some portions of the apparatus, which are rotated by almost 90° in a counterclockwise direction about a vertical axis;

[0024] Figure 4 Other possible configurations of the ends of the arms are shown;

[0025] Figure 5 Possible configurations of retaining pins are shown.

[0026] List of reference numerals

[0027] 1. Clamp

[0028] 2 body

[0029] 3 Head segment

[0030] 4-port

[0031] 5 Foot Segments

[0032] 6 Arm

[0033] 7 ends

[0034] 8Inside

[0035] 9 Support surface

[0036] 10 Semiconductor Wafer

[0037] 11 Retaining pin

[0038] 12 channels

[0039] 13 End edge

[0040] 14 Tip (tip)

[0041] 15 Truncated cone DETAILED DESCRIPTION

[0042] Figure 1 The clamp 1 shown comprises a flat body 2 having a head section 3 with an orifice 4 and a foot section 5 formed by arms 6 extending from the head section 3 to the end 7 of the foot section 5. The arms 6 in this embodiment are bent along an inner side 8 and meet in the head section 3. The head section 3 and the foot section 5 form a planar front side of the body.

[0043] A support surface 9 is present at the end section of the arm 6, which is arranged so that it is set back from the plane of the front side (set away from the plane of the front side). Retaining pins 11 are also arranged on the end section, by means of which a clamping connection is established between the semiconductor wafer 10 and the body 2.

[0044] The clamp 1 also has a channel 12 which follows the curvature of the arm 6 and ends at an end edge 13. The channel 12 is formed in the body 2 and follows the curvature of the inner side 8 of the arm at a distance therefrom.

[0045] Figure 2 It is clearly shown that the end 7 and the end edge 13 of the arm 6 are separated from each other. The ends of the channel 12 are oriented further away from each other in the outward direction, while the ends 7 of the arm 6 are closer to each other in the inward direction.

[0046] Figure 3 A perspective view is shown in which the channel 12 can be seen to good effect. The channel 12 extends substantially following the curvature of the inner side 8 of the arm 6 up to the edge 13. According to the embodiment shown, the channel 12 projects somewhat out of the plane of the front side.

[0047] Once the fixture 1 is transported out of the cleaning module, the path of the liquid leads from the head section 3 of the body 2 mainly along the channel 12 to the end edge 13. From here the liquid drips back, for example into the cleaning module. The residue of liquid on the semiconductor wafer 10 is greatly reduced.

[0048] In accordance with Figure 4 In the schematic diagram of , the arms 6 each taper at the end 7 to a tip 14 which does not come into contact with the semiconductor wafer 10 transported by the gripper. In the example shown, the tip 14 is rounded. The tip 14 may also be chamfered, ie have a decreasing thickness which decreases with increasing distance from the holding pin 11. Preferably, Figure 4 The upper surface of the tip 14 shown in FIG. 1 is beveled.

[0049] Figure 5 The preferred configuration of holding pins 11 is shown, which hold the transported semiconductor wafer 10 at a distance from the support surface 9. Each holding pin 11 has a contact surface for the semiconductor wafer 10, which is surrounded on both sides by a border portion. The border portion is in the form of a truncated cone 15, which is located opposite to each other, and the base surface of the truncated cone 15 is located on the outside.

Claims

1. A fixture for conveying an upright semiconductor wafer, the fixture comprising: a flat body having a head segment and a foot segment, the head segment and the foot segment forming a planar front side; an arm portion extending from the head segment to spaced ends in the foot segment; a support surface at an end section of the arm, arranged such that it is set back from the plane of the front side; as well as holding pins which are arranged on the end segments and are intended to produce a clamping connection between the semiconductor wafer and the body, Characterized in that a channel extending along the inner side of the arm is formed in the arm and terminates at an end edge, wherein the edge is separated from the end of the arm.

2. The clamp according to claim 1, characterized in that: The head segment has an aperture therein.

3. The clamp according to claim 1 or 2, characterized in that: The channel extends out of the plane of the front side.

4. The clamp according to any one of claims 1 to 3, characterized in that: The inner side of the arm is curved.

5. The clamp according to any one of claims 1 to 4, characterized in that: The arm portions each taper at the end portions to a tip that does not contact a semiconductor wafer conveyed by the gripper.

6. The clamp according to any one of claims 1 to 5, characterized in that: The holding pins hold the semiconductor wafer at a distance from the support surface.

7. A method for cleaning semiconductor wafers in a cleaning line, wherein the semiconductor wafers are The cleaning module of the cleaning line is transported out of the cleaning module in a separate state, characterized in that: During this period, The semiconductor wafer is transported by a gripper according to one of the preceding claims.

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