Heat sink for 3D electronic modules

Abstract

The invention relates to a heat sink component (40) made of a thermally conductive material and intended to thermally connect an optoelectronic sensor (10) to a rigid bracket (30) cooled by an external cooling device; the optoelectronic sensor (10) is mounted on a printed circuit (20); the bracket has at least one fixing boss (32) and an opening (31) intended to receive the optoelectronic sensor (10); the heat sink part (40) comprises: a base (41) intended to be placed in thermal contact with at least one fixing boss (32) of the bracket; -a projection (42) intended to be placed in thermal contact with the lower surface of the optoelectronic sensor (10) through a hole through the printed circuit (20).

Description

Technical Field

[0001] The present invention relates to the field of 3-D optoelectronic modules for imaging, in particular space imaging. More specifically, the present invention relates to the thermal management of image sensors used in the context of space applications, whether these are scientific or industrial. Background Art

[0002] Problems solved

[0003] In the space industry, it is desirable to miniaturize optoelectronic imaging modules while using higher performance optoelectronic sensors with higher resolution.

[0004] In the context of space imaging, image sensors need to be kept stable and at low temperatures in order to ensure that they operate correctly. When the temperature rises, the performance of optoelectronic sensors decreases drastically. The dark current increases and therefore blacks become grey when detected. This causes problems in space applications where black dominates in most images. These problems are amplified by using sensors with higher and higher resolutions. For the same sensor technology, increasing the resolution leads to an increase in electrical consumption and therefore the sensor dissipates more heat during its operation.

[0005] Thus, for operation under low brightness conditions, reducing thermal noise in imagers is of fundamental importance. "Thermal noise" means noise generated by thermal agitation of charge carriers.

[0006] One problem that needs to be overcome in this context is to keep optoelectronic sensors in 3D electronic modules for space applications at low temperatures. A general goal is to ensure a low operating temperature of the optoelectronic sensors in order to reduce thermal noise and thereby reduce dark current. This makes it possible to improve the quality of the image.

[0007] Prior Art / Limitations of Prior Art

[0008] The current solution for cooling the sensor is to add a Peltier type heat exchanger and a heat sink for dissipating the heat. However, this type of solution is costly. In addition, the realization and implementation of this solution remain complex. This is because the surface dedicated to the heat exchange in the sensor is not easily accessible for installing such a device in a 3D electronic module. Thus, the implementation of the heat exchanger is at the expense of the compactness of the 3D module.

[0009] European patent EP3340303B1 shows a 3D electronic module comprising an optoelectronic sensor and a heat-conducting rigid bracket in the form of a frame defining an opening for accommodating the sensor. The bracket is passively cooled and acts as a thermal mass. However, the contact area between the bracket and the sensor is limited to the periphery of the sensor. This increases the thermal resistance between the sensor and the bracket and limits the heat exchange area. Summary of the invention

[0010] Response to issues and provision of solutions

[0011] In order to alleviate the limitations of existing solutions, the present invention proposes a heat sink component that is inexpensive, simple to implement and compatible with the three-dimensional structure of the electronic module, in terms of improving the heat dissipation of optoelectronic sensors incorporated into 3D electronic modules. Compared with the solution of European patent EP3340303B1 (3°C / W instead of 7°C / W), this heat sink component can reduce the thermal resistance by 4°C / W. The heat sink component according to the present invention makes it possible to maximize the heat exchange area between the sensor and the bracket, regardless of the way the sensor is held in the bracket. In addition, the present invention proposes a 3D electronic module in which the heat sink component according to the present invention is implemented in a way that produces a thermal loop that connects the sensor to an interface cooled by an external device. In addition, the present invention provides a method for manufacturing a 3D electronic module according to the present invention.

[0012] The solution according to the invention makes it possible to improve the image quality in low light environments by reducing the thermal noise in the sensor. The reduction of thermal noise is achieved by reducing the thermal resistance between the sensor and the thermal mass of the module. The thermal resistance between the sensor and the thermal mass of the module is reduced by increasing the heat exchange area between the sensor and the thermal mass of the module.

[0013] This solution allows a more effective control of the temperature of the sensor, making it possible to keep said sensor at a low temperature without losing the compactness of the 3D module.

[0014] Furthermore, the heat sink component according to the invention makes it possible to reduce manufacturing and assembly costs compared to prior art solutions.

[0015] Furthermore, the solution according to the invention is compatible with any optical sensor having a free surface in its connection array of the LGA (Land Grid Array), BGA (Ball Grid Array), CGA (Column Grid Array) or PGA (Pin Grid Array) type.

[0016] Overview / Claims

[0017] A subject of the invention is a heat sink component made of thermally conductive material and intended to thermally connect an optoelectronic sensor to a rigid bracket cooled by an external cooling device. The optoelectronic sensor is mounted on a printed circuit; the bracket has at least one fixing boss and an opening intended to accommodate the optoelectronic sensor.

[0018] The heat sink component comprises:

[0019] - a base intended to be placed in thermal contact with at least one fixing boss of the bracket;

[0020] - a projection intended to be placed in thermal contact with the lower surface of the optoelectronic sensor by passing through a hole through the printed circuit and through a hole in the printed circuit.

[0021] According to a particular aspect of the invention, the base is constituted by one or more connected arms.

[0022] According to a particular aspect of the invention, the arms are coplanar in a first plane.

[0023] According to a particular aspect of the invention, the arms are connected via a common central intersection surface.

[0024] According to a particular aspect of the invention, the projection extends from the central intersection surface.

[0025] According to a particular aspect of the invention, the arms are connected via a mechanical fastener in the form of a frame or a ring connecting the arms to each other.

[0026] According to a particular aspect of the invention, the protrusion extends from the mechanical fixing.

[0027] According to a specific aspect of the present invention, the protrusion has a planar first upper surface.

[0028] According to a particular aspect of the invention, each arm comprises at least one end having a second upper surface intended to be joined to the base of the associated fixing boss.

[0029] According to a particular aspect of the invention, each arm comprises at least one end of a shape complementary to that of the associated lateral surface of the fixing boss.

[0030] Another subject of the present invention is a 3D electronic module comprising:

[0031] - optoelectronic sensors mounted on printed circuits,

[0032] - a rigid bracket cooled by external cooling means; the bracket having a central opening intended to accommodate the optoelectronic sensor and having at least one fixing boss,

[0033] - A heat sink component according to the invention.

[0034] According to a particular aspect of the invention, the optoelectronic sensor comprises a housing in which a photosensitive chip having a planar active face is housed, with electrical connection pins on the opposite face of the housing connected to a printed circuit through openings in a carrier.

[0035] According to a particular aspect of the invention, the height of the protrusion is chosen so as to obtain an empty space volume between the base and the printed circuit.

[0036] According to a particular aspect of the invention, the sensor is cast in epoxy resin.

[0037] Another subject of the invention is a manufacturing method for manufacturing a 3D electronic module according to the invention, comprising the following steps:

[0038] i- fixing the optoelectronic sensor to the bracket by bonding it to the edge of the central opening using a thermally conductive adhesive,

[0039] ii-piercing the printed circuit so as to create a plurality of holes aligned with the fixing bosses of the bracket and the protrusions of the heat sink component,

[0040] iii- assembling the assembly formed by the optoelectronic sensor and the bracket with the printed circuit after inserting the fixing bosses into the dedicated holes,

[0041] iv- Assembling the assembly formed by the optoelectronic sensor, the bracket and the printed circuit with the heat sink component by inserting the protrusions into the dedicated holes and by adhesively bonding the ends of the base to the supporting bosses using a thermally conductive adhesive.

[0042] According to a particular aspect of the invention, the method further comprises the step of casting the optoelectronic sensor in epoxy resin after the fixing step i). BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Other features and advantages of the present invention will become more apparent by reading the following description with reference to the following drawings.

[0044] [ Figure 1a ] Figure 1a A first perspective view shows an electronic module according to a first embodiment of the present invention.

[0045] [ Figure 1b ] Figure 1b A second perspective view shows an electronic module according to the first embodiment of the present invention.

[0046] [ Figure 1c ] Figure 1c A cross-sectional view showing an electronic module according to a first embodiment of the present invention.

[0047] [ Figure 1d ] Figure 1d A perspective view showing a heat sink component according to a first embodiment of the present invention.

[0048] [ Figure 2a ] Figure 2a A perspective view showing an electronic module according to a second embodiment of the present invention.

[0049] [ Figure 2b ] Figure 2b A cross-sectional view showing an electronic module according to a second embodiment of the present invention.

[0050] [ Figure 2c ] Figure 2c A perspective view showing a heat sink component according to a second embodiment of the present invention.

[0051] [ Figure 3a ] Figure 3a A perspective view showing a heat sink component according to a third embodiment of the present invention.

[0052] [ Figure 3b ] Figure 3b A perspective view showing a heat sink component according to a fourth embodiment of the present invention.

[0053] [ Figure 4 ] Figure 4 Flow chart showing the steps of a manufacturing method for manufacturing a 3D electronic module according to the present invention. DETAILED DESCRIPTION

[0054] In the remainder of the specification, the expressions “front,” “rear,” “upper,” and “lower” are used with reference to the orientation of the figures being described. Given that elements may be positioned at other orientations, the directional terms are indicated only by way of illustration and are not limiting.

[0055] Figure 1a A first perspective view of an electronic module 1 according to a first embodiment of the invention is shown. The electronic module 1 comprises an optoelectronic sensor 10 mounted on a printed circuit 20, a rigid bracket 30 and a heat sink component 40. Figure 1a The electronic module 1 is shown from the side of the active area of ​​the optoelectronic sensor 10 . Figure 1b A second perspective view shows an electronic module according to the first embodiment of the present invention. Figure 1b The electronic module 1 is shown from one side of the heat sink component 40 .

[0056] The optoelectronic sensor 10 comprises a housing 101 in which a photosensitive chip 102 is housed. The photosensitive chip 102 has a planar active first face (orthogonal to the axis Z) capable of converting photons into electric charges. The sensor further comprises electrical connection pins 103 on the opposite face of the housing 101 orthogonal to the axis Z (the lower face in this example). The pins 103 are intended to connect the photosensitive chip to conductive tracks of the printed circuit 20. Figure 1b 1 , the printed circuit 20 is shown transparently in the figure, so that the distribution of the pins and the lower surface of the optoelectronic sensor 10 can be seen. The pins 103 partially occupy the lower surface of the housing 101 so as to leave a local surface without pins. In the example shown, this is the central surface of the lower surface of the sensor 10. The pins 103 can be of LGA (land grid array), BGA (ball grid array), CGA (column grid array) or PGA (pin grid array) type.

[0057] The printed circuit 20 may be implemented by a PCB (printed circuit board) type circuit comprising conductive traces. The conductive traces are connected to the pins in order to carry the signals from the optoelectronic sensor 10. Alternatively, it is possible to stack a plurality of printed circuits one on top of another underneath the sensor 10. The printed circuits may be interconnected by metal vias or lateral conductive traces.

[0058] The bracket 30 is manufactured in the form of a rigid frame in which the sensor 10 is positioned and bonded via the rear surface of the rigid frame including the pins 103. The bracket 30 serves to mechanically stabilize the sensor 10. The bracket includes an opening 31 in which the sensor 10 is accommodated. The periphery of the lower surface of the sensor 10 rests on a portion of the peripheral surface of the opening 31. The opening 31 allows the pins 103 to pass to the printed circuit 20. The opening 31 is generally rectangular, but it does not necessarily need to be so. The sensor 10 is fixed to the bracket 30 by means of a thermally conductive adhesive at the peripheral contact surface of the opening 31. Advantageously, the sensor 10 is molded in an epoxy resin, preferably an epoxy resin filled with silica beads. This enables the sensor to be mechanically stabilized in the frame of the bracket 30.

[0059] By way of non-limiting example, bracket 30 is made of steel or aluminum.

[0060] In addition, the bracket 30 has a plurality of fixing bosses 32 for mechanically stabilizing the bracket 30 and thus stabilizing the 3D module 10. The printed circuit 20 has holes aligned with the positioning of the fixing bosses 32. When the printed circuit 20 is assembled with the bracket 30 by soldering, the fixing bosses 32 are inserted into the associated holes. The fixing bosses 32 are inserted into the holes in the printed circuit 20 so as to obtain electrical contact between the pins 103 of the sensor and the metal traces of the printed circuit 20 through the openings 31.

[0061] In addition, the bracket 30 acts as a thermal mass for the overall 3D electrical module assembly 1. More specifically, it acts as a thermal interface for the sensors of the 3D electronic module. The bracket 30 is cooled by an external cooling device, which is not described for simplicity. The cooling device can be implemented using various active devices (e.g., heat pipes) or passive devices (e.g., Peltier type devices) connected via mechanical interfaces available on the 3D electronic module. Thereby, the temperature of the bracket is maintained at a target value, which is generally low in the context of the present invention.

[0062] The heat sink component 40 includes a base 41 and a protrusion 42 extending from the base toward the lower surface of the sensor 10. The base 41 is fixed to at least one fixing boss 32 by adhesive bonding using a thermally conductive adhesive. This makes it possible to create at least one thermal contact point between the base 41 and the bracket acting as a thermal mass.

[0063] In addition, the protrusion 42 extends from the base until it reaches the lower surface of the sensor 10 through a hole aligned with the positioning of the protrusion 42. The protrusion is inserted into the associated hole in the printed circuit 20 and its height is selected so that it abuts against the lower surface of the sensor 10. This makes it possible to create at least one surface for thermal contact between the heat sink 40 and the sensor 10 to be cooled. The surface for contact between the protrusion 42 and the lower surface of the sensor 10 is located in the area of ​​the surface without pins 103.

[0064] Advantageously, the projection 42 has a planar upper surface. It is possible to fix the upper surface of the projection 42 to the lower surface of the sensor 10 using a thermally conductive adhesive. This makes it possible to improve the mechanical robustness of the structure of the 3D electronic module.

[0065] This results in the creation of a heat removal circuit that removes heat from the sensor 10 to the bracket 30 acting as a thermal mass. The introduction of the heat sink component 40 makes it possible to increase the heat exchange area between the bracket 30 and the sensor 10. Thus, the present invention makes it possible to reduce the thermal resistance between the bracket and the sensor without increasing the bulk of the 3D electronic module, compared to a structure without such a heat discharge component.

[0066] Advantageously, the base 41 is composed of a plurality of connected arms, more particularly of two coplanar arms 412 and 411, which cross each other in the middle thereof. The first arm 411 connects the first fixed boss to the fixed boss diagonally opposite thereto. The second arm 412 connects the second fixed boss to the fixed boss diagonally opposite thereto. The second fixed boss is adjacent to the first fixed boss. Each arm has a planar surface at one end, which is supported against the lower surface of the associated fixed boss. The end of each arm is fixed to the associated fixed boss by a thermally conductive adhesive. The use of arms makes it possible to reduce the weight of the heat sink component 40 without weakening the mechanical strength of the component 40. The length of each of the arms 411 and 412 is greater than or equal to the diagonal length of the frame of the rigid bracket 30.

[0067] The two arms 412 and 411 are connected via a central intersection surface SO common to the two arms. A projection 42 extends from said intersection surface SO towards the sensor 10 mounted in the bracket.

[0068] Figure 1c A cross-sectional view of an electronic module according to a first embodiment is shown in order to provide an understanding of the heat removal path. The interface between the protrusion 42 and the lower surface of the sensor 10 acts as a heat exchange surface to receive some of the heat generated by the sensor when it is in operation. The heat recovered at the interface I0 is transferred by thermal conduction via the protrusion 42 and the arms 411 and 412 of the base 41. The heat path generated by the heat sink component 40 directs heat to the interfaces I1 and I2 between each arm of the base 41 and the associated fixed boss 31 of the bracket 30. Remember that the bracket is cooled by an external cooling device. This then makes it possible to avoid overheating of the sensor 10 by removing the heat generated by the Joule heating effect when the sensor 10 is in operation. Thereby, this allows the sensor 10 to be maintained at a target temperature and makes it possible to minimize thermal noise in the sensor.

[0069] In the first embodiment, the base 41 of the heat sink component 40 comes to bear on the lower surface of the boss 32 , which makes it possible to improve the mechanical robustness of the 3D electronic module while minimizing the mechanical stress applied to the sensor 10 by the protrusion 42 .

[0070] The length of the protrusion 42 is chosen so that it abuts against the lower surface of the sensor 10 through the printed circuit 20 and the opening 31. Advantageously, it is possible to design the length of the protrusion 42 in such a way that an empty space volume V0 is obtained between the base 41 and the printed circuit 20. The empty space V0 can be used to accommodate additional electronic components in order to obtain a more compact 3D electronic module.

[0071] Figure 1dA perspective view of only the heat sink component 40 according to the first embodiment of the present invention is shown. By way of non-limiting example, the protrusion 42 is in the shape of a parallelepiped with a planar upper surface. The planar upper surface serves as a surface for heat exchange with the sensor. Each of the arms 411 and 412 is in a planar shape so as to improve the stability of the 3D electrical module after assembly. The planar shape at the end of the arm enables formal assembly, in which the arms 411 and 412 rest on the fixed boss 32 while maximizing the area available for heat exchange between the bracket 30 and the heat sink component 40.

[0072] The heat sink component 40 is made of a thermally conductive material, such as metal (aluminum, steel, etc.), a light metal alloy, or a thermally conductive polymer or graphene.

[0073] Figure 2a A perspective view of an electronic module 1 according to a second embodiment of the invention is shown. Figure 2b A cross-sectional view showing an electronic module according to a second embodiment of the present invention. Figure 2c A perspective view showing a heat sink component according to a second embodiment of the present invention.

[0074] The second embodiment of the present invention reuses the same features as the first embodiment, except for the shape of the ends of the arms 411 and 412 of the base 41. The end of each of the arms 411, 412 forming the base 41 of the heat sink component 40 has a shape complementary to the shape of the associated lateral surface of the fixing boss. By way of non-limiting example, if the shape of the fixing boss is cylindrical, the shape of the end of each of the arms is an arc shape, such as Figure 2c The heat sink component is assembled with the bracket as follows: the arcuate end of the arm abuts against the lateral surface of the associated cylindrical fixing boss, such as Figure 2a This in turn creates a sliding connection guided by the fixing boss 32. The heat sink component is inserted into the structure of the bracket until the top of the protrusion 42 and the lower surface of the sensor 10 abut each other. A thermally conductive adhesive is applied to the upper surface of the protrusion 42 in order to mechanically fix the heat sink component 40 to the connected assembly formed by the sensor 10, the printed circuit 20 and the bracket 30.

[0075] The length of the arms 411 and 412 is equal to the diagonal length of the frame of the bracket, so that the base 41 can be inserted as a slide guided by the fixing boss 32 .

[0076] An advantage of the second embodiment over the first embodiment is that it allows for easier assembly as the heat sink component is centered relative to the frame of the bracket by construction.

[0077] Figure 3aA perspective view of a heat sink component 40 according to a third embodiment of the invention is shown. According to this embodiment, the arms 411 and 412 are also connected via a mechanical fixture 43 in the form of a frame or ring connecting the arms 411, 412 to each other. This makes it possible to improve the mechanical robustness of the heat sink component. It is possible that a local area of ​​the lower surface of the sensor 10 (which is aligned with the mechanical fixture 43) is free of connecting pins. In this case, it is conceivable to produce one or more protrusions extending from the mechanical fixture 43 towards the local area. Thereby, the surface area for heat exchange is increased compared to the previous embodiment.

[0078] Figure 3b A perspective view of a heat sink component according to a fourth embodiment of the invention is shown. In the fourth embodiment, the base is a plane including holes 420, 421, 422, 423 in order to reduce the weight of the component. In addition, this embodiment allows access to components mounted in the empty space volume V0 between the base 41 and the printed circuit 20. In addition, these holes allow the volume V0 to incorporate components whose height is greater than the height of the protrusion so as to extend beyond the base 41.

[0079] Thus, the third and fourth embodiments have advantages over the previous embodiments in that mechanical robustness is increased and thermal resistance is reduced.

[0080] More generally, the shape of the base 41 is not limited to a plurality of arm structures. It is contemplated that the shape of the base varies depending on the shape of the frame of the bracket (rectangular, circular, etc.). By way of example, it is contemplated that the base 41 is in the form of a ring (or frame) that creates a solid plane parallel to the lower surface of the sensor or a platform connecting the bracket boss support surface.

[0081] Figure 4 A flow chart showing the steps of a production method P1 for producing an electronic module 1 according to the invention.

[0082] The first step i) is a step of fixing the photoelectric sensor 10 to the bracket 30 by bonding the photoelectric sensor 10 to the edge of the central opening 31 using a thermally conductive adhesive. The sensor 10 is placed in the opening 31 of the frame of the bracket 30. The periphery of the lower surface of the sensor 10 rests on a portion of the peripheral surface of the opening 31. The sensor 10 is centered relative to the opening 31. The sensor 10 and the bracket 30 are thus mechanically assembled.

[0083] The second step ii) is a step of piercing the printed circuit 20 so as to create holes aligned with the fixing bosses 32 of the bracket and the at least one protrusion 42 of the heat sink component 40 .

[0084] Alternatively, it is conceivable to use a printed circuit 20 in which holes have already been punched by the manufacturer.

[0085] The third step iii) is a step of assembling the assembly formed by the sensor 10 and the bracket 30 with the printed circuit 20 by inserting the fixing bosses 32 into the dedicated holes. The bracket 30 is inserted into the printed circuit 20 through the holes associated with the box until the pins 103 of the sensor come into contact with the metal tracks of the printed circuit 20.

[0086] The printed circuit 20 is then assembled with the sensor 10 by soldering the pins to the metal traces of the printed circuit.

[0087] The fourth step iv) is a step of assembling the assembly formed by the optoelectronic sensor 10, the bracket 30 and the printed circuit 20 with the heat sink component 40. This step is performed by inserting the protrusion 42 into a dedicated hole through the printed circuit 20 until the top of the protrusion 42 abuts against the lower surface of the sensor 10. The end of the base 41 is assembled with the fixing boss 32 using a thermally conductive adhesive. It is conceivable that the thermally conductive adhesive is applied to the upper surface of the protrusion 42 in contact with the lower surface of the sensor 10.

[0088] Optionally, method P1 comprises, after first step i), a step of casting optoelectronic sensor 10 in epoxy resin in order to enhance the mechanical bond between sensor and carrier.

[0089] Optionally, method P1 comprises the step of casting the assembly formed by the sensor, the bracket, the printed circuit and the heat sink component in a resin. This in turn provides protection for the overall assembled structure.

Claims

1. A heat sink component (40) made of a thermally conductive material and intended to thermally connect the optoelectronic sensor (10) to a rigid bracket (30) cooled by an external cooling device; The optoelectronic sensor (10) is mounted on a printed circuit (20); the bracket has at least one fixing boss (32) and an opening (31) intended to accommodate the optoelectronic sensor (10); The heat sink component (40) comprises: - a base (41) intended to be placed in thermal contact with at least one fixing boss (32) of said bracket; - a projection (42) intended to be placed in thermal contact with the lower surface of the optoelectronic sensor (10) through a hole passing through the printed circuit (20).

2. The heat sink component (40) according to claim 1, wherein the base (41) is constituted by one or more connected arms (411, 412).

3. The heat sink component (40) of claim 2, wherein the arms (411, 412) are coplanar in a first plane (P1).

4. The heat sink component (40) according to claim 3, wherein the arms (411, 412) are connected via a common central intersection surface (S0).

5. The heat sink component (40) of claim 4, wherein the protrusion (42) extends from the central intersection surface.

6. A heat sink component (40) according to any one of claims 2 to 5, wherein the arms (411, 412) are connected via a mechanical fixing (43) in the form of a frame or a ring connecting the arms (411, 412) to each other.

7. The heat sink component (40) of claim 6, wherein the protrusion (42) extends from the mechanical fixture (43).

8. The heat sink component (40) according to any one of claims 1 to 7, wherein the protrusion (42) has a planar first upper surface.

9. A heat sink component (40) according to any one of claims 2 to 8, wherein each arm (411, 412) comprises at least one end having a second upper surface intended to be joined to a base of an associated fixing boss.

10. The heat sink component (40) according to any one of claims 2 to 8, wherein each arm (411, 412) comprises at least one end portion of a shape complementary to a shape of an associated lateral surface of the fixing boss.

11. 3D electronic module (1), comprising: - an optoelectronic sensor (10) mounted on a printed circuit (20), - a rigid bracket (30) cooled by external cooling means; said bracket having a central opening (31) intended to accommodate said optoelectronic sensor and having at least one fixing boss (32), - Heat sink component (40) according to any one of the preceding claims.

12. A 3D electronic module (1) according to claim 11, wherein the optoelectronic sensor (10) comprises a housing (101), in which a photosensitive chip (102) having a planar active surface is accommodated, and on the opposite side of the housing (101) there are electrical connection pins (103) connected to the printed circuit (20) through the opening (31).

13. The 3D electronic module (1) according to any one of claims 11 to 12, wherein the height of the protrusion is selected so as to obtain an empty space volume (V0) between the base (41) and the printed circuit (20).

14. The 3D electronic module (1) according to any one of claims 11 or 13, wherein the sensor (10) is cast in epoxy resin.

15. A manufacturing method (P1) for manufacturing a 3D electronic module (1) according to any one of claims 11 to 14, comprising the following steps: i- fixing the optoelectronic sensor (10) to the bracket (30) by bonding the optoelectronic sensor (10) to the edge of the central opening (31) using a thermally conductive adhesive, ii-piercing the printed circuit (20) so as to create a plurality of holes aligned with the fixing bosses (32) of the bracket and the protrusions of the heat sink component, iii- after inserting the fixing protrusion (32) into the dedicated hole, assembling the assembly formed by the optoelectronic sensor (10) and the bracket (30) with the printed circuit (20), iv- Assembling the assembly formed by the optoelectronic sensor (10), the bracket (30) and the printed circuit (20) with the heat sink component by inserting the protrusion (32) into the dedicated hole and by adhesively bonding the end of the base (41) to the supporting boss (32) using a thermally conductive adhesive.

16. Manufacturing method (P1) according to the preceding claim, for producing a 3D electronic module according to claim 14, and further comprising a step of casting the optoelectronic sensor (10) in epoxy resin after said fixing step i).

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