Dispensing device for semiconductor diode production

Abstract

The invention discloses a dispensing device for semiconductor diode production, which comprises a base, a workbench arranged on the base, an adjusting device arranged on the base, a power assembly arranged on the inner side of the base, a glue gun arranged on one side of the power assembly, and a clamping device connected to the bottom end of the glue gun. The clamping device comprises a connecting sleeve, a dispensing head, an unlocking block, an unlocking groove, an unlocking plate, a clamping rod, a clamping groove, a pulling plate, a fixing plate and second springs, the clamping rod is clamped in the clamping groove, the unlocking block is installed on the outer side of the connecting sleeve, the unlocking plate is installed in the unlocking groove, the pulling plate is connected with the unlocking block, the fixing plate is installed on the outer side of the connecting sleeve, and the second springs are arranged on the two sides of the fixing plate. A sealing mechanism is arranged above the connecting sleeve and comprises a movable plate, a sealing plate, a one-way pipe, a top plate and an ejector rod, the one-way pipe is arranged in the glue gun, the sealing plate is installed in the one-way pipe, the movable plate is connected with the top end of the sealing plate, the ejector rod is installed on one side of the movable plate, and the top plate is installed at the top end in the dispensing head.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor diode production and processing, and more specifically, to a glue dispensing device for semiconductor diode production. Background Art

[0002] In the modern semiconductor industry, diodes are an important electronic component and are widely used in various circuits and equipment. In the production process of diodes, the dispensing process is a key link, which directly affects the performance and reliability of the diodes. First of all, the connection operation between the dispensing head and the output end of the glue gun in the existing dispensing device is relatively cumbersome, which brings inconvenience to production. In the production process of diodes, the dispensing head is the core component of the dispensing device, which is responsible for accurately applying glue to the specified position of the diode. The dispensing head is connected to the output end of the glue gun to receive the glue supply from the glue gun. However, the connection between the dispensing head and the output end of the glue gun in the existing device is usually made by threading, snapping, etc., and the operator needs to manually complete the installation and disassembly. This connection method is not only time-consuming and labor-intensive, but also greatly reduces production efficiency when replacing the dispensing head. At the same time, due to the complexity of the connection operation, the risk of human error is increased, which may cause the dispensing head to be improperly installed or loosely connected, affecting the dispensing quality.

[0003] Secondly, the glue gun is another important component of the dispensing device, which is used to store and transport glue. During the dispensing process, the glue gun is under a certain pressure inside, and the glue is supplied to the dispensing head through the output end of the glue gun. However, the internal structure of the existing glue gun is relatively simple, usually with only one cavity and piston, and one-way sealing cannot be achieved. This means that when the dispensing head is removed, the pressure inside the glue gun will be suddenly released, causing some glue to overflow or drip from the output end of the glue gun, which not only wastes glue, but may also pollute the working environment and other components, affecting production quality and efficiency.

[0004] In addition, the workbench in the existing dispensing device usually adopts a fixed structure, which lacks flexibility and brings inconvenience to production. The workbench is a platform for placing and fixing the semiconductor diode to be dispensed. During the dispensing process, the diode needs to be placed on the workbench so that the dispensing head can perform dispensing operations on it. However, the workbench in the existing device is mostly a fixed structure, and the position and angle of the diode cannot be flexibly adjusted. This means that when it is necessary to dispense diodes in different positions or different models, it is necessary to frequently adjust the placement of the diode and the placement table, which is not only time-consuming and labor-intensive, but also increases the risk of human error, affecting production efficiency and quality. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the problems existing in the prior art, the present invention provides a dispensing device for semiconductor diode production to solve the technical problems mentioned in the background technology.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a dispensing device for semiconductor diode production, comprising a base, a workbench is provided on the base, an adjusting device is provided on the base, a power assembly is provided on the inner side of the base, a glue gun is provided on one side of the power assembly, a clamping device is connected to the bottom end of the glue gun, the clamping device comprises a connecting sleeve, a dispensing head, an unlocking block, an unlocking groove, an unlocking plate, a clamping rod, a clamping groove, a pulling plate, a fixing plate and a second spring, the connecting sleeve is fixedly connected to the bottom of the glue gun, the dispensing head is detachably installed under the connecting sleeve, the clamping groove is provided on the side wall of the dispensing head, the clamping rod is clamped in the clamping groove, the unlocking plate is connected to the clamping rod, the unlocking block is movably installed on the outside of the connecting sleeve, The unlocking groove is provided on the inner side of the unlocking block, and the unlocking plate is slidably installed in the unlocking groove. The two ends of the pulling plate are connected to two adjacent unlocking blocks, and the two adjacent unlocking blocks are symmetrically arranged. The fixed plate is fixedly installed on the outside of the connecting sleeve. The second spring is symmetrically arranged on both sides of the fixed plate, and the other end of the second spring is respectively connected to the corresponding unlocking blocks. A sealing mechanism is arranged above the connecting sleeve, and the sealing mechanism includes a movable plate, a sealing plate, a one-way tube, a top plate, and a push rod. The one-way tube is arranged in the glue gun, and the sealing plate can be movably installed in the one-way tube. The movable plate is connected to the top end of the sealing plate, and the movable plate can be movably installed in the one-way tube. The push rod is installed on one side of the movable plate, and the top plate is installed on the top end inside the dispensing head.

[0009] The present invention is further configured such that a limiting groove is provided in the one-way tube, a limiting plate is provided on the outer side of the movable plate, and the limiting plate is slidably installed in the limiting groove. The setting of the limiting groove and the limiting block limits the movable plate to prevent the movable plate from deflecting during the movement process.

[0010] The present invention is further configured such that a first spring is provided in the limiting groove, one end of the first spring is connected to the top end of the limiting plate, and the provision of the first spring facilitates the resetting of the movable plate and the sealing plate.

[0011] The present invention is further configured such that a conveying assembly is provided at the top of the base, an output end of the conveying assembly is connected to an input end of the glue gun, and the conveying assembly is mainly responsible for conveying glue into the glue gun.

[0012] The present invention is further configured as follows: the adjusting device includes a first cylinder, a first piston rod, a sliding groove and a sliding frame, the first cylinder is detachably mounted on the base, one end of the first piston rod is connected to the output end of the first cylinder, the other end of the first piston rod is connected to the sliding frame, the sliding groove is opened on the base, the sliding frame is installed under the workbench, and one end of the sliding frame is slidably connected to the sliding groove. The configuration of the adjusting device facilitates the adjustment of the longitudinal position of the workbench.

[0013] The present invention is further configured such that a lead screw is provided on the base, and the power assembly is movably mounted on the lead screw via a thread, and the provision of the lead screw facilitates lateral position adjustment of the power assembly.

[0014] The present invention is further configured such that a motor is provided on one side of the base, an output end of the motor is connected to one end of a lead screw, and the configuration of the motor provides power support for the lateral movement of the power assembly.

[0015] The present invention is further configured such that a second cylinder is provided above the workbench, a second piston rod is provided at the output end of the second cylinder, and a clamping plate is provided at the other end of the second piston rod. The configuration of the above components can stably clamp the placement rack on which the semiconductor diodes are placed.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the present invention provides a dispensing device for semiconductor diode production, which has the following beneficial effects:

[0018] 1. The engaging device includes a connecting sleeve, a dispensing head, an unlocking block, an unlocking groove, an unlocking plate, an engaging rod, an engaging groove, a pulling plate, a fixing plate and other components. The sliding cooperation between the unlocking block and the unlocking groove, and the engaging connection between the engaging rod and the engaging groove, realize the rapid installation and disassembly between the dispensing head and the glue gun. When the dispensing head needs to be replaced, it is only necessary to pull the pulling plate, and with the help of the movement of the unlocking block and the unlocking plate, the engaging rod is disengaged from the engaging groove, and the dispensing head can be conveniently taken out of the connecting sleeve. This design does not require the use of tools, is simple and quick to operate, greatly improves the replacement efficiency of the dispensing head, and reduces the risk of human error. At the same time, the setting of the second spring ensures the reliable engagement of the engaging rod and the engaging groove, and improves the stability and reliability of the connection.

[0019] 2. The sealing mechanism includes components such as a movable plate, a sealing plate, a one-way tube, a top plate and a push rod. The one-way sealing inside the glue gun is achieved through the sliding cooperation of the movable plate and the sealing plate in the one-way tube, and the cooperation between the push rod and the top plate. When the dispensing head is pulled out of the connecting sleeve, the top plate will drive the push rod to move downward, so that the movable plate and the sealing plate are reset under the action of the first spring. Finally, there is no gap between the sealing plates, which effectively prevents the leakage of glue. The design of this sealing mechanism cleverly utilizes the action when the dispensing head is disassembled, and realizes reliable one-way sealing through the automatic cooperation of the mechanical structure, avoiding pollution and waste caused by glue overflow or dripping, and maintaining the cleanliness of the production environment and product quality.

[0020] 3. The adjusting device includes components such as a first cylinder, a first piston rod, a sliding groove, a sliding frame, a lead screw, a motor and a clamping plate. Through the telescopic movement of the cylinder and the piston rod, and the rotation of the lead screw and the motor, multi-directional adjustment of the workbench and the power assembly is realized. The first cylinder and the first piston rod can drive the sliding frame to slide in the sliding groove, thereby adjusting the position of the workbench; the motor can drive the power assembly to slide left and right along the lead screw through the lead screw to adjust the position of the dispensing head; the clamping plate can stably clamp the placement frame with the diodes. This multi-degree-of-freedom adjustment device design greatly improves the flexibility and adaptability of the dispensing device, and can conveniently perform dispensing operations on diodes in different positions and of different models without frequent manual adjustments, thereby improving production efficiency and dispensing accuracy and reducing the risk of human errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of a dispensing device for producing semiconductor diodes in the present invention;

[0022] Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention;

[0023] Figure 3 It is a schematic cross-sectional structure diagram of the engaging device and the sealing mechanism in the present invention;

[0024] Figure 4 for Figure 3 A schematic diagram of the local enlarged structure at point A in the middle;

[0025] Figure 5 It is a schematic cross-sectional structure diagram of the engaging device part in the present invention.

[0026] In the figure: 1. base; 2. workbench; 3. power assembly; 4. glue gun; 5. connecting sleeve; 6. glue dispensing head; 7. unlocking block; 8. unlocking groove; 9. unlocking plate; 10. clamping rod; 11. clamping groove; 12. pulling plate; 13. fixing plate; 14. second spring; 15. movable plate; 16. sealing plate; 17. one-way tube; 18. top plate; 19. top rod; 20. limiting groove; 21. limiting plate; 22. first spring; 23. conveying assembly; 24. first cylinder; 25. first piston rod; 26. sliding groove; 27. sliding frame; 28. lead screw; 29. ​​motor; 30. second cylinder; 31. second piston rod; 32. clamping plate. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0029] In the present invention, unless otherwise specified, the directions used, such as "up" and "down", usually refer to the directions shown in the drawings, or to the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directions are not used to limit the present invention.

[0030] See also Figure 1-5A dispensing device for semiconductor diode production comprises a base 1, a workbench 2 is arranged on the base 1, an adjusting device is arranged on the base 1, a power assembly 3 is arranged on the inner side of the base 1, a glue gun 4 is arranged on one side of the power assembly 3, and a clamping device is connected to the bottom end of the glue gun 4, the clamping device comprises a connecting sleeve 5, a dispensing head 6, an unlocking block 7, an unlocking groove 8, an unlocking plate 9, a clamping rod 10, a clamping groove 11, a pulling plate 12, a fixing plate 13 and a second spring 14, the connecting sleeve 5 is fixedly connected to the bottom of the glue gun 4, the dispensing head 6 is detachably installed under the connecting sleeve 5, the clamping groove 11 is arranged on the side wall of the dispensing head 6, the clamping rod 10 is clamped in the clamping groove 11, the unlocking plate 9 is connected to the clamping rod 10, the unlocking block 7 is movably installed on the outside of the connecting sleeve 5, and the unlocking groove 8 is arranged on the inside of the unlocking block 7, The unlocking plate 9 is slidably installed in the unlocking groove 8, the two ends of the pulling plate 12 are connected to the two adjacent unlocking blocks 7, and the two adjacent unlocking blocks 7 are symmetrically arranged, the fixing plate 13 is fixedly installed on the outside of the connecting sleeve 5, the second spring 14 is symmetrically arranged on both sides of the fixing plate 13, and the other ends of the second spring 14 are respectively connected to the corresponding unlocking blocks 7, and a sealing mechanism is arranged above the connecting sleeve 5, the sealing mechanism includes a movable plate 15, a sealing plate 16, a one-way tube 17, a top plate 18, and a push rod 19. The one-way tube 17 is arranged in the glue gun 4, the sealing plate 16 can be movably installed in the one-way tube 17, the movable plate 15 and the top of the sealing plate 16 are connected, and the movable plate 15 can be movably installed in the one-way tube 17, the push rod 19 is installed on one side of the movable plate 15, and the top plate 18 is installed on the top of the dispensing head 6.

[0031] A limiting groove 20 is provided in the one-way tube 17 , a limiting plate 21 is provided on the outer side of the movable plate 15 , and the limiting plate 21 is slidably installed in the limiting groove 20 .

[0032] A first spring 22 is disposed in the limiting groove 20 , and one end of the first spring 22 is connected to the top end of the limiting plate 21 .

[0033] A conveying assembly 23 is provided at the top of the base 1 , and an output end of the conveying assembly 23 is connected to an input end of the glue gun 4 .

[0034] In this embodiment, when the dispensing head 6 needs to be replaced, the pull plate 12 is pulled to both sides, and the pull plate 12 will drive the unlocking block 7 to slide, and the unlocking block 7 will cooperate with the fixed plate 13 to compress the second spring 14 set in the middle. Since the two adjacent unlocking blocks 7 are symmetrically arranged, and due to the special structural design of the unlocking plate 9 and the unlocking groove 8, when the unlocking block 7 drives the unlocking groove 8 to move, the unlocking plate 9 will move relatively outward, thereby driving the locking rod 10 to disengage from the locking groove 11. When the pull plate 12 cannot be pulled further, the unlocking block 7 cannot be moved further, and the locking rod 10 has been completely disengaged from the locking groove 11, and then the dispensing head 6 is pulled downward, and the dispensing head 6 will drive the top plate in the process of disengaging from the connecting sleeve 5 18 moves downward, and the push rod 19 will lose the limit of the top plate 18. Due to the characteristics of the first spring 22, the first spring 22 will automatically reset, driving the limit plate 21 set on the outside of the movable plate 15 to slide in the limit groove 20, and making the bottom end of the push rod 19 always fit with the top of the top plate 18. At the same time, the movable plate 15 will drive the sealing plate 16 to reset. When the dispensing head 6 is completely separated from the connecting sleeve 5, the first spring 22 is completely reset, the limit plate 21 moves to the bottom end of the limit groove 20, and there is no gap between the sealing plates 16, so that the inside of the one-way tube 17 set inside the glue gun 4 is sealed, thereby preventing leakage of glue. After the replacement or maintenance of the dispensing head 6 is completed, the dispensing head 6 can be reinstalled back to its original position with reference to the above process.

[0035] See also Figure 1-2 , as an implementation method of the adjusting device: the adjusting device includes a first cylinder 24, a first piston rod 25, a sliding groove 26 and a sliding frame 27, the first cylinder 24 is detachably mounted on the base 1, one end of the first piston rod 25 is connected to the output end of the first cylinder 24, the other end of the first piston rod 25 is connected to the sliding frame 27, the sliding groove 26 is opened on the base 1, the sliding frame 27 is installed under the workbench 2, and one end of the sliding frame 27 is slidably connected to the sliding groove 26.

[0036] A lead screw 28 is provided on the base 1 , and the power assembly 3 is movably mounted on the lead screw 28 via threads.

[0037] A motor 29 is provided on one side of the base 1 , and an output end of the motor 29 is connected to one end of the lead screw 28 .

[0038] A second cylinder 30 is disposed above the workbench 2 , a second piston rod 31 is disposed at an output end of the second cylinder 30 , and a clamping plate 32 is disposed at the other end of the second piston rod 31 .

[0039] More specifically, when glue dispensing is required, first place the placement rack with the semiconductor diode on it on the workbench 2, then turn on the two second cylinders 30 installed above the workbench 2, and the two second cylinders 30 drive the clamping plate 32 to move through the second piston rods 31 connected to the output ends of the two second cylinders 30, so as to clamp the placement rack with the semiconductor diode, and then turn on the conveying assembly 23, the conveying assembly 23 will convey the hot-melt glue to the glue gun 4, and then turn on the power assembly 3, the power assembly 3 drives the glue gun 4 to move, and then the glue dispensing process of the semiconductor diode is completed through the glue dispensing head 6, and when it is completed After the glue dispensing process at one place, turn on the motor 29, and the motor 29 drives the screw 28 to rotate, thereby driving the power assembly 3 to slide left and right, so that the glue dispensing head 6 performs glue dispensing process on another place, and then the first cylinder 24 installed on the base 1 can be turned on. The first cylinder 24 drives the sliding frame 27 to move in the sliding groove 26 through the first piston rod 25 connected to the output end, thereby driving the workbench 2 to move, and then adjusting the placement frame where the semiconductor diodes are placed, so that the equipment can complete multi-directional glue dispensing processing, without the need for manual position adjustment, and is easier to use.

[0040] In summary, when the overall device is in use or running: when the dispensing head 6 needs to be replaced, the pull plate 12 is pulled to both sides, the pull plate 12 will drive the unlocking block 7 to slide, and the unlocking block 7 will cooperate with the fixed plate 13 to compress the second spring 14 arranged in the middle. Since the two adjacent unlocking blocks 7 are symmetrically arranged, and due to the special structural design of the unlocking plate 9 and the unlocking groove 8, when the unlocking block 7 drives the unlocking groove 8 to move, the unlocking plate 9 will move relatively outward, thereby driving the locking rod 10 to disengage from the locking groove 11. When the pull plate 12 can no longer be pulled, the unlocking block 7 can no longer move, and the locking rod 10 has completely disengaged from the locking groove 11, and then the dispensing head 6 is pulled downward, and the dispensing head 6 is in the process of disengaging from the connecting sleeve 5. It will drive the top plate 18 to move downward, and the top rod 19 will lose the limit of the top plate 18. Due to the characteristics of the first spring 22, the first spring 22 will automatically reset, driving the limit plate 21 set on the outside of the movable plate 15 to slide in the limit groove 20, and making the bottom end of the top rod 19 always fit with the top of the top plate 18. At the same time, the movable plate 15 will drive the sealing plate 16 to reset. When the dispensing head 6 is completely separated from the connecting sleeve 5, the first spring 22 is completely reset, the limit plate 21 moves to the bottom end of the limit groove 20, and there is no gap between the sealing plates 16, so that the inside of the one-way tube 17 set inside the glue gun 4 is sealed, thereby preventing leakage of glue. After the replacement or maintenance of the dispensing head 6 is completed, the dispensing head 6 can be reinstalled back to its original position with reference to the above process.

[0041] When dispensing glue is required, first place the placement rack with the semiconductor diode on the workbench 2, then turn on the two second cylinders 30 installed above the workbench 2, and the two second cylinders 30 drive the clamping plate 32 to move through the second piston rods 31 connected to the output ends of the two second cylinders 30, so as to clamp the placement rack with the semiconductor diode, and then turn on the conveying assembly 23, the conveying assembly 23 will convey the hot melt glue to the glue gun 4, and then turn on the power assembly 3, the power assembly 3 drives the glue gun 4 to move, and then the dispensing glue processing of the semiconductor diode is completed through the dispensing head 6, and when one is completed After the glue dispensing process, turn on the motor 29, the motor 29 drives the lead screw 28 to rotate, thereby driving the power assembly 3 to slide left and right, so that the glue dispensing head 6 performs glue dispensing process on another place, and then the first cylinder 24 installed on the base 1 can be turned on, and the first cylinder 24 drives the sliding frame 27 to move in the sliding groove 26 through the first piston rod 25 connected to the output end, thereby driving the workbench 2 to move, and then adjusting the placement frame where the semiconductor diode is placed, so that the equipment can complete multi-directional glue dispensing processing, without manual position adjustment, and is easier to use.

[0042] In all the schemes mentioned above, the connection between two parts can be selected according to actual conditions by welding, bolt and nut matching connection, bolt or screw connection or other well-known connection methods, which will not be described one by one here. In the above, all fixed connections are preferably welded. Although the embodiments of the present invention have been shown and described, it can be understood by ordinary technicians in this field that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A glue dispensing device for semiconductor diode production, comprising a base (1), wherein a workbench (2) is provided on the base (1), wherein: The base (1) is provided with an adjustment device, a power assembly (3) is provided on the inner side of the base (1), a glue gun (4) is provided on one side of the power assembly (3), a clamping device is connected to the bottom end of the glue gun (4), and the clamping device comprises a connecting sleeve (5), a glue dispensing head (6), an unlocking block (7), an unlocking groove (8), an unlocking plate (9), a clamping rod (10), a clamping groove (11), a pulling plate (12), a fixing plate (13) and a second spring (14), the clamping rod (10) is clamped in the clamping groove (11), the unlocking block (7) is installed on the outer side of the connecting sleeve (5), and the unlocking plate (9) is installed on the unlocking groove (11). In the groove (8), the pull plate (12) is connected to the unlocking block (7), the second spring (14) is arranged on both sides of the fixed plate (13), and a sealing mechanism is arranged above the connecting sleeve (5), and the sealing mechanism includes a movable plate (15), a sealing plate (16), a one-way tube (17), a top plate (18), and a top rod (19). The one-way tube (17) is arranged in the glue gun (4), the sealing plate (16) is installed in the one-way tube (17), the top ends of the movable plate (15) and the sealing plate (16) are connected, the top rod (19) is installed on one side of the movable plate (15), and the top plate (18) is installed at the top end inside the glue dispensing head (6).

2. The glue dispensing device for semiconductor diode production according to claim 1 is characterized in that: A limiting groove (20) is provided in the one-way tube (17), a limiting plate (21) is provided on the outer side of the movable plate (15), and the limiting plate (21) is slidably installed in the limiting groove (20).

3. The glue dispensing device for semiconductor diode production according to claim 2 is characterized in that: A first spring (22) is provided in the limiting groove (20), and one end of the first spring (22) is connected to the top end of the limiting plate (21).

4. The glue dispensing device for semiconductor diode production according to claim 1 is characterized in that: A conveying assembly (23) is provided at the top of the base (1), and an output end of the conveying assembly (23) is connected to an input end of a glue gun (4).

5. A dispensing device for semiconductor diode production according to any one of claims 1 to 4, characterized in that: The regulating device comprises a first cylinder (24), a first piston rod (25), a sliding groove (26) and a sliding frame (27); the first cylinder (24) is detachably mounted on the base (1); one end of the first piston rod (25) is connected to the output end of the first cylinder (24); the other end of the first piston rod (25) is connected to the sliding frame (27); the sliding groove (26) is provided on the base (1); the sliding frame (27) is mounted below the workbench (2); and one end of the sliding frame (27) is slidably connected to the sliding groove (26).

6. The glue dispensing device for semiconductor diode production according to claim 5, characterized in that: A lead screw (28) is provided on the base (1), and the power assembly (3) is movably mounted on the lead screw (28) via threads.

7. The glue dispensing device for semiconductor diode production according to claim 6, characterized in that: A motor (29) is provided on one side of the base (1), and an output end of the motor (29) is connected to one end of a lead screw (28).

8. The glue dispensing device for semiconductor diode production according to claim 7, characterized in that: A second cylinder (30) is provided above the workbench (2); a second piston rod (31) is provided at the output end of the second cylinder (30); and a clamping plate (32) is provided at the other end of the second piston rod (31).

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