Circuit board jet printing production line and working method

Abstract

The invention discloses a circuit board jet printing production line and a working method, and relates to the technical field of PCB processing, and the production line comprises a first circuit board jet printing device, a first mechanical arm, a clamping mechanism, a second mechanical arm and a second circuit board jet printing device, the first circuit board jet printing equipment and the second circuit board jet printing equipment are used for carrying out jet printing on a circuit board, and the first mechanical arm is used for grabbing one side, subjected to jet printing, of the circuit board from the first circuit board jet printing equipment and placing the circuit board on the clamping mechanism; and the clamping mechanism is used for clamping the circuit board, so that the non-jet-printed side of the circuit board faces the second mechanical arm, and the second mechanical arm is used for grabbing the non-jet-printed side of the circuit board from the clamping mechanism and placing the circuit board on the second circuit jet printing equipment. The line jet printing production line can automatically complete jet printing operation on the two surfaces of the circuit board, and is simple to operate and high in efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB manufacturing process, and in particular to a circuit board printing production line and a working method. Background Art

[0002] Circuit boards are essential components in electronic devices. During the preparation of circuit boards, circuit board printing equipment can be used to prepare the circuit boards by printing. In many scenarios, both surfaces of the circuit board need to be printed.

[0003] In the prior art, after one side of a circuit board is printed, it is usually manually turned over and then placed on the circuit board printing device again for printing on the other side.

[0004] However, the above method is relatively complicated to operate and has low efficiency. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a circuit board printing production line, which can automatically complete the printing operation on the two surfaces of the circuit board, is simple to operate and has high efficiency.

[0006] The present invention provides a circuit board printing production line, comprising a first circuit board printing device, a first robotic arm, a clamping mechanism, a second robotic arm and a second circuit board printing device arranged in sequence, wherein the first circuit board printing device and the second circuit board printing device are used to print circuit boards, the first robotic arm is used to grab the printed side of the circuit board from the first circuit board printing device, and place the circuit board on the clamping mechanism so that the unprinted side of the circuit board faces the second robotic arm, and the second robotic arm is used to grab the unprinted side of the circuit board from the clamping mechanism, and place the circuit board on the second circuit printing device.

[0007] Furthermore, the first robotic arm and the second robotic arm both include a robotic arm body and an adsorption mechanism for adsorbing the circuit board, the adsorption mechanism is arranged on the robotic arm body, the adsorption mechanism includes a connecting arm, a mounting plate and a suction cup, the connecting arm is connected to the robotic arm body, the mounting plate is installed on the connecting arm, and the suction cup is arranged on the mounting plate.

[0008] Furthermore, there are at least two mounting plates, and at least one of the mounting plates is slidably disposed on the connecting arm.

[0009] Furthermore, the clamping mechanism includes a plurality of clamping heads arranged in a vertical direction, and the clamping heads have an open state and a closed state. In the closed state, the clamping heads clamp the circuit board.

[0010] Furthermore, the clamping heads are arranged in two rows, each row is provided with a plurality of the clamping heads, the plurality of the clamping heads in each row are arranged along a vertical direction, and the clamping heads in the two rows are arranged opposite to each other.

[0011] Furthermore, the first circuit board printing device and the second circuit board printing device both include a printing module and a feeding module. The printing module includes an ink cartridge, an ink switching device and a nozzle. There are multiple ink cartridges for storing different inks. The ink cartridge is connected to the nozzle through the ink switching device. The ink switching device selects different ink cartridges to be connected to the nozzle and controls the outflow of ink in the ink cartridge. The feeding module is used to deliver the circuit board to a position corresponding to the nozzle.

[0012] Furthermore, the ink switching device includes a control valve, a liquid inlet, a mixing chamber and a liquid outlet. There are multiple liquid inlets and multiple liquid outlets. One end of each of the liquid inlets is connected to an ink cartridge, and the other end is connected to the mixing chamber. One end of each of the liquid outlets is connected to a nozzle, and the other end is connected to the mixing chamber. The control valve controls the opening and closing and the opening degree of each of the liquid inlets respectively.

[0013] Furthermore, an ink discharge port for recovering ink is also provided on the ink switching device, and the ink discharge port is communicated with the mixing chamber.

[0014] Furthermore, the ink switching device is also provided with an air inlet for injecting air flow into the mixing chamber, and a cleaning liquid inlet for injecting cleaning liquid into the mixing chamber.

[0015] Furthermore, the feeding module includes a substrate, a clamp and an adsorption device, the clamp and the adsorption device are arranged on the substrate, the clamp is used to clamp the circuit board between the clamp and the support plate, and the adsorption device is used to adsorb the circuit board.

[0016] The present invention also provides a working method based on a circuit board printing production line, the method comprising the following steps:

[0017] Printing one side of the circuit board by a first circuit board printing device, and transporting the circuit board to a position corresponding to the first robotic arm;

[0018] The first mechanical arm grabs the circuit board from the printed side of the circuit board and places the circuit board on a clamping mechanism;

[0019] The clamping mechanism fixes the circuit board and makes the unprinted side of the circuit board face the second mechanical arm;

[0020] The second robot arm grabs the circuit board from the side of the circuit board that is not printed, and places the circuit board on the second circuit board printing device;

[0021] The second circuit board printing device prints the other side of the circuit board.

[0022] Further, when the circuit board is printed by the first circuit board printing device and / or the second circuit board printing device, the method includes:

[0023] Select the process required for printing the circuit board;

[0024] The ink cartridge corresponding to the selected process is connected to the printhead through the ink switching device;

[0025] The circuit board is subjected to a spray printing operation.

[0026] In summary, the circuit board printing production line can automatically complete the printing operation on both surfaces of the circuit board, with simple operation and high efficiency. Furthermore, the circuit board printing equipment provided by the present invention can switch the ink required for different processes through the ink switching device, and control the amount of ink, quickly switch the ink formula required in the circuit board preparation process, reduce non-production downtime, and improve production efficiency.

[0027] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Shown is a schematic diagram of the axial structure of a circuit board printing production line provided by an embodiment of the present invention.

[0029] Figure 2 Shown Figure 1 Side view structural diagram of the circuit board printing production line.

[0030] Figure 3 Shown is a schematic diagram of the axial structure of the first robotic arm, the second robotic arm and the clamping mechanism.

[0031] Figure 4 Shown is a schematic diagram of the axial structure of the adsorption mechanism.

[0032] Figure 5 Shown is a schematic diagram of the axial structure of the adsorption mechanism from another perspective.

[0033] Figure 6Shown is a schematic diagram of the structure of the clamping mechanism when clamping a circuit board.

[0034] Figure 7 The figure shows the schematic diagram of the structure of the clamping mechanism when releasing the circuit board.

[0035] Figure 8 Shown is a schematic diagram of the axial structure of the circuit board printing equipment.

[0036] Fig. 9 Shown Figure 8 Schematic diagram of the top view of the circuit board printing equipment.

[0037] Fig.10 Shown Figure 8 A side view of the structure of the circuit board printing equipment.

[0038] Fig.11 Shown Figure 8 Schematic diagram of the axial structure of the ink switching device.

[0039] Fig.12 Shown Figure 8 Schematic diagram of the front view of the ink switching device.

[0040] Fig.13 Shown Fig.12 Schematic diagram of the cross-sectional structure along the XIII-XIII direction. DETAILED DESCRIPTION

[0041] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is a detailed description in conjunction with the accompanying drawings and preferred embodiments.

[0042] The invention provides a circuit board printing production line and a working method. The circuit board printing production line can automatically complete the printing operation on two surfaces of the circuit board, has simple operation and high efficiency.

[0043] It should be noted that in order to facilitate the understanding of the overall structure of various equipment on the production line and reduce the complexity of the drawings, the pipelines connecting the various components for the flow of gas or liquid are omitted in the drawings of the specification.

[0044] like Figures 1 to 3As shown, the circuit board printing production line provided by the embodiment of the present invention includes a first circuit board printing device 10, a first mechanical arm 20, a clamping mechanism 30, a second mechanical arm 40 and a second circuit board printing device 50. The first circuit board printing device 10, the first mechanical arm 20, the clamping mechanism 30, the second mechanical arm 40 and the second circuit board printing device 50 are arranged in sequence. The first circuit board printing device 10 and the second circuit board printing device 50 are used to print on the circuit board 60, and the first mechanical arm 20 is used to grab the printed side of the circuit board 60 from the first circuit board printing device 10, and place the circuit board 60 on the clamping mechanism 30 so that the unprinted side of the circuit board 60 faces the second mechanical arm 40. The second mechanical arm 40 is used to grab the unprinted side of the circuit board 60 from the clamping mechanism 30, and place the circuit board 60 on the second circuit board printing device 50.

[0045] When the circuit board printing production line provided in this embodiment is used to print the circuit board 60, the circuit board 60 can be first placed on the first circuit board printing device 10 to print the first board surface of the circuit board 60. In this step, based on the working principles of the first circuit board printing device 10 and the second circuit board printing device 20, the first circuit board printing device 10 will print the upward side of the circuit board 60; after the printing process of the first board surface of the circuit board 60 is completed, the first robot arm 20 will The circuit board 60 is facing upward, that is, the printed side is grabbed, and the circuit board 60 is placed on the clamping mechanism 30, so that the unprinted side of the circuit board 60 faces the second robotic arm 40; the second robotic arm 40 grabs the unprinted side of the circuit board 60 from the clamping mechanism 30, and places the circuit board 60 on the second circuit board printing device 50; finally, the second circuit board printing device 50 prints on the other side of the circuit board 60 to complete the printing operation on both sides of the circuit board 60.

[0046] In this embodiment, the first circuit board printing device 10 and the second circuit board printing device 50 are arranged in sequence, so that the two circuit board printing devices respectively print on the two surfaces of the circuit board 60; the first mechanical arm 20, the clamping mechanism 30 and the second mechanical arm 40 are arranged and the three cooperate with each other to automatically complete the flipping and loading and unloading of the circuit board 60. That is, the circuit board printing production line can automatically complete the printing operation on the two surfaces of the circuit board 60, with simple operation and high efficiency.

[0047] Please continue to refer to Figures 1 to 3The structures of the first robot arm 20 and the second robot arm 40 are basically the same. In the figure, only the first robot arm 20 is taken as an example. Both the first robot arm 20 and the second robot arm 40 include a robot body 21 and an adsorption mechanism 22 for adsorbing the circuit board 60. The adsorption mechanism 22 is arranged on the robot body 21. The adsorption mechanism 22 includes a connecting arm 221, a mounting plate 222 and a suction cup 223. The connecting arm 221 is connected to the robot body 21, and the mounting plate 222 is mounted on the connecting arm 221. The suction cup 223 is arranged on the mounting plate 222.

[0048] When the circuit board 60 is grasped by the first robot arm 20 and the second robot arm 40 , the adsorption mechanism 22 can be moved to the circuit board 60 , and then the suction cup 223 is started, and the circuit board 60 is adsorbed on the suction cup 223 to complete the grasping.

[0049] Furthermore, in this embodiment, there are at least two mounting plates 222, at least one of which is slidably disposed on the connecting arm 221. Through the above arrangement, the distance between the two mounting plates 222 can be easily adjusted, and while ensuring stable grasping, it can also adapt to various types of circuit boards 60. A first power source 224 for controlling the position of the mounting plate 222 can be disposed on the connecting arm 221 to automatically change the distance between the two mounting plates 222 as needed.

[0050] There can be multiple suction cups 223 , and the multiple suction cups 223 are arranged on the mounting plate 222 along the length direction of the mounting plate 222 to make the adsorption of the circuit board 60 more stable.

[0051] It can be understood that a plurality of shaft joints are provided on the robot body 21 so that the robot body 21 can at least complete the rotation of the circuit board 60 by 90°, that is, the rotation from a horizontal state to a vertical state.

[0052] Please continue to refer to Figure 2 , Figure 3 , Figure 6 and Figure 7 In this embodiment, the clamping mechanism 30 includes a plurality of clamping heads 31 arranged in a vertical direction, and the clamping heads 31 have an open state and a closed state. In the closed state, the circuit board 60 can be clamped, and in the open state, the clamping heads 31 release the fixation of the circuit board 60. That is, when the first mechanical arm 20 places the circuit board 60 on the clamping mechanism 30, the circuit board 60 is in a vertical state, and the unprinted side of the circuit board 60 faces the second mechanical arm 40. It should be noted that, for the convenience of display, the supporting structure of the clamping mechanism 30 is omitted in the figure, and only the clamping mechanism 30 itself is shown.

[0053] Furthermore, the clamping heads 31 can be arranged in two rows, each row having multiple clamping heads 31 , and the multiple clamping heads 31 in each row are arranged in a vertical direction. The two rows of clamping heads 31 are arranged opposite to each other to clamp the circuit board 60 at two sides of the circuit board 60 .

[0054] like Figures 8 to 10 As shown, the structures of the first circuit board printing device 10 and the second circuit board printing device 50 provided in the embodiment of the present invention can be the same, and the figure only takes the first circuit board printing device 10 as an example. The first circuit board printing device 10 and the second circuit board printing device 50 both include a printing module 11 and a feeding module 12. The printing module 11 includes an ink cartridge 111, an ink switching device 112 and a nozzle 113. There are multiple ink cartridges 111, and they are used to store different inks. The ink cartridge 111 is connected to the nozzle 113 through the ink switching device 112. The ink switching device 112 selects different ink cartridges 111 to be connected to the nozzle 113, and controls the outflow of ink in the ink cartridge 111. The feeding module 12 is used to transport the circuit board 60 to be printed to a position corresponding to the nozzle 113.

[0055] When preparing the circuit board 60, it involves various production processes such as circuit etching, solder resist, and selective gold plating (the present invention only takes selective gold plating as an example, and it is obvious to those with technical background in the same industry that selective plating may include but is not limited to selective copper plating, gold plating, silver plating, and tin plating). In order to carry out the above-mentioned different production processes, it is necessary to form film layers such as circuit etching resist ink layer, solder resist ink layer, and anti-electroplating layer on the circuit board 60 accordingly.

[0056] However, in the prior art, due to the different characteristics and formulas of inks, different ink formulas need to be replaced when performing different processes. However, since the current equipment of this type has a single function, when performing production of different types of processes, the time required to switch ink formulas and the non-production downtime are both long, and the production efficiency is still low.

[0057] When using the circuit board printing equipment provided by the present invention, the circuit board 60 to be printed can be first placed on the feeding module 12, and the circuit board 60 to be printed can be sent to the position corresponding to the nozzle 113, such as below the nozzle 113, through the feeding module 12; then, according to the needs of the process, the ink switching device 112 switches different ink cartridges 111 to be connected to the nozzle 113, and controls the amount of ink flowing out of the ink cartridge 111 according to the requirements of the process, so that the nozzle 113 can spray out different types and amounts of ink as needed, and print the circuit board 60; after the printing is completed, the feeding module 12 drives the printed circuit board 60 to enter the next process to complete the process on the circuit board printing equipment.

[0058] Correspondingly, the first robot arm 20 can remove the circuit board 60 from the feeding module 12 of the first circuit board printing device 10, and the second robot arm 40 can place the circuit board 60 on the feeding module 12 of the second circuit board printing device.

[0059] For example, if the circuit board 60 needs to be sprayed with an anti-etching ink process, the ink switching device 112 can be controlled to connect the ink cartridge 111 storing the anti-etching ink to the nozzle 113, and the spraying amount of the anti-etching ink can be controlled according to the process requirements; if the circuit board 60 needs to be sprayed with a solder resist process, the ink switching device 112 can be controlled to connect the ink cartridge 111 storing the solder resist ink to the nozzle 113, and the spraying amount of the solder resist ink can be controlled according to the process requirements; if the circuit board 60 needs to be sprayed with a selective ink process, the ink switching device 112 can be controlled to connect the ink cartridge 111 storing the selective ink to the nozzle 113, and the spraying amount of the selective ink can be controlled according to the process; if the circuit board 60 needs to be sprayed with a character ink process, the ink switching device 112 can be controlled to connect the ink cartridge 111 storing the character ink to the nozzle 113, and the spraying amount of the character ink can be controlled according to the process.

[0060] Therefore, in this embodiment, by setting the printing module 11 and the feeding module 12, the ink formula required in the process of preparing the circuit board 60 can be quickly switched, thereby reducing non-production downtime and improving production efficiency.

[0061] Furthermore, in this embodiment, the circuit board printing device further includes a bracket 13, and the feeding module 12 is arranged along a first direction, such as Fig.10 The printing module 11 can be moved along the second direction, such as Fig.10 The left and right directions of the paper shown, as well as the third direction, such as Fig.10 The bracket 1330 is reciprocally movable in the up and down directions of the paper surface as shown.

[0062] Through the arrangement of the above structure, the printing module 11 can better complete the spraying of various positions on the circuit board 60 according to the process requirements.

[0063] Furthermore, in order to detect the position and size of the circuit board, a position detection device (not shown), such as a visual detection module, is also provided on the printing module 11. The regional contours of the circuit, window opening, and drilling on the circuit board 60 are determined based on the detection results, and the printing area on the circuit board 60 is determined based on the regional contours.

[0064] In order to facilitate the curing of the ink on the circuit board, a drying device (not shown), such as an ultraviolet drying device, is also provided on the printing module 11, such as the bottom of the printing module 11.

[0065] Please continue to refer to Figures 11 to 13 The ink switching device 112 includes a control valve 1121, a liquid inlet 1122, a mixing chamber 1123 and a liquid outlet 1124. There are multiple liquid inlets 1122 and multiple liquid outlets 1124. One end of each liquid inlet 1122 is connected to an ink cartridge 111, and the other end is connected to the mixing chamber 1123. That is, the ink in multiple ink cartridges 111 can enter the mixing chamber 1123 through their respective pipelines and liquid inlets 1122 to be mixed. One end of each liquid outlet 1124 is connected to a nozzle 113, and the other end is connected to the mixing chamber 1123. That is, the ink mixed in the mixing chamber 1123 can be sprayed on the circuit board 60 through multiple nozzles 113. The control valve 1121, such as a solenoid valve, controls the opening and closing and the opening degree of each liquid inlet 1122 respectively. It can be understood that there can be multiple control valves 1121, and each solenoid valve corresponds to a liquid inlet 1122.

[0066] It should be noted that, in this embodiment, the opening and closing of the liquid outlet 1124 can also be controlled by the control valve 1121. In other embodiments, the opening and closing of the nozzle 113 can also be controlled to control the ejection of the mixed ink.

[0067] When the ink required for the process is switched by the ink switching device 112, the opening and closing and the opening degree of the liquid inlet 1122 connected to the ink cartridge 111 corresponding to the process can be controlled by the control valve 1121. At this time, the selected ink can enter the mixing chamber 1123 for mixing, and the mixed ink reaches the nozzle 113 through the liquid outlet 1124 to spray the circuit board 60.

[0068] Furthermore, in this embodiment, the ink switching device 112 may also include an ink discharge port 1125, which is connected to the mixing chamber 1123. The ink discharge port 1125 may be connected to an ink recovery box to recover the original ink when switching the process.

[0069] Furthermore, the ink switching device 112 may also include an air inlet 1126 and a cleaning liquid inlet 1127, which are connected to the mixing chamber 1123. Air flow can be injected into the mixing chamber 1123 through the air inlet 1126 to purge the liquid inlet 1122, the liquid outlet 1124, the nozzle 113 and the inner wall of the mixing chamber 1123 to facilitate cleaning of residual ink.

[0070] Cleaning liquid can be injected into the mixing chamber 1123 through the cleaning liquid inlet 1127, so as to perform a deeper cleaning on the ink in the mixing chamber 1123, thereby preventing the ink used in the previous process from contaminating the next process.

[0071] It can be understood that the opening and closing of the ink discharge port 1125 , the air inlet 1126 and the cleaning liquid inlet 1127 are also controlled by the control valve 1121 .

[0072] When switching the process, the ink discharge port 1125 can be opened by the control valve 1121 first, and the ink in the mixing chamber 1123 will flow out from the ink discharge port 1125; secondly, the air inlet 1126 is opened, and the air flow will sweep the liquid inlet 1122, the liquid outlet 1124 and the inner wall of the mixing chamber 1123 to discharge the residual ink from the ink discharge port 1125; at the same time, part of the air flow will enter the nozzle 113 from the liquid outlet 1124 to spray out the residual ink in the nozzle 113; thirdly, the control valve 1121 closes the ink discharge port 1125, opens the cleaning liquid inlet 1127, and the cleaning liquid enters the mixing chamber 1123 to clean the mixing chamber 1123, and then the cleaning liquid can flow out through the liquid outlet 1124 and the nozzle 113 to complete the cleaning of the ink switching device 112.

[0073] See also Figure 1 and 8 In this embodiment, the feeding module 12 includes a base plate 121, a clamp 122, a first driving source (not shown) and a second driving source (not shown). A guide groove 1211 is provided on the base plate 121. The first driving source and the second driving source are provided in the base plate 121, the clamp 122 is provided on the first driving source, and the first driving source drives the clamp 122 to move along the guide groove 1211. The second driving source is connected to the clamp 122, and drives the clamp 122 to clamp the circuit board 60 between the clamp 122 and the support plate 122.

[0074] When positioning, the circuit board 60 is first placed on the substrate 121, and then the first driving source drives the clamping head 122 to move on the guide groove 1211, so as to push the circuit board 60 through the side of the clamping head 122, so that the circuit board 60 reaches the set position; then the second driving source drives the clamping head 122 to move downward, so that the circuit board 60 is clamped between the clamping head 122 and the substrate 121.

[0075] Furthermore, the feeding module 12 also includes an adsorption device 123 for adsorbing the circuit board 60 .

[0076] In this embodiment, two feeding modules 12 can be arranged in parallel on the same circuit board printing device. By controlling the printing module 11 in the second direction, the circuit boards 60 on the two feeding modules 12 can be printed to speed up the production cycle.

[0077] Please continue reading Figure 8The circuit board printing device further includes a cleaning module 14, which includes a waste liquid recovery tank 141, a wiper head 142, a second power source (not shown) and a waste liquid recovery box (not shown). The wiper head 142 is disposed in the waste liquid recovery tank 141, and a recovery hole connected to the waste liquid recovery box is disposed in the waste liquid recovery tank 141.

[0078] When the process is switched, the waste liquid recovery tank 141 can be driven by the second power source to move to the bottom of the nozzle 113; the printing module 11 is moved along the third direction so that the nozzle 113 is against the wiping head 142; the printing module 11 is moved along the second direction so that the nozzle 113 moves back and forth relative to the wiping head 142, so that the wiping head 142 can wipe the nozzle 113; the ink dripping after wiping can drip into the waste liquid recovery tank 141 and enter the waste liquid recovery box through the recovery hole 411.

[0079] It should be noted that when the cleaning liquid is used to switch the ink switching device 112 , the waste liquid recovery tank 141 may also be moved to the bottom of the nozzle 113 to collect the cleaning liquid.

[0080] The present invention also provides a working method of a circuit board printing production line, the method comprising the following steps:

[0081] S1: Printing one side of the circuit board 60 by the first circuit board printing device 10, and transporting the circuit board 60 to a position corresponding to the first robot arm 20;

[0082] When printing the circuit board 60, the method further includes:

[0083] S11: Selecting the process required for printing the circuit board 60;

[0084] S12: connecting the ink cartridge 111 corresponding to the selected process to the nozzle 113 through the ink switching device 112;

[0085] S13: Printing operation is performed on the circuit board 60;

[0086] S14: Drying the printed pattern.

[0087] It is understandable that when the circuit board 60 needs to be printed through multiple processes, after completing the printing of one process, the ink switching device 112 can be used to switch here so that the ink cartridge 111 corresponding to the next process is connected to the nozzle 113.

[0088] Furthermore, before switching, the ink switching device 112 and the nozzle 113 may be cleaned. When cleaning, the following steps may be included:

[0089] Recover the remaining ink into the ink recovery box;

[0090] Purging the ink switching device 112 by air flow;

[0091] The residual ink in the ink switching device 112 is cleaned by injecting a cleaning liquid.

[0092] Furthermore, the method further includes cleaning the residual ink on the nozzle 113 by using the cleaning module 14 .

[0093] When performing the printing operation, the production line can also detect the position and size of the circuit board 60 through a position detection device, determine the area contours of the circuits, windows, and holes on the circuit board 60 based on the detection results, and determine the printing area on the circuit board 60 based on the area contours.

[0094] Furthermore, after determining the contour area, the method further includes expanding the area contour by a preset threshold value to determine the area outlines of the circuit, window opening, and drilling, and determining the printing area of ​​the circuit board 60 according to the area outlines.

[0095] More specifically, when determining the printing area of ​​the line, a first difference area between the area outline of the line and the area contour of the line is determined, and the first difference area is determined as the printing area of ​​the line.

[0096] When determining the printing area of ​​window opening and drilling, the second difference area between the two is determined according to the regional groove edges of the window opening and drilling, and the regional contours of the window opening and drilling, and the second difference area is determined as the printing area of ​​the window opening and drilling.

[0097] S2: The first robot arm 20 grabs the circuit board 60 from the printed side of the circuit board 60 and places the circuit board 60 on the clamping mechanism 30;

[0098] S3: The clamping mechanism 30 fixes the circuit board 60 and makes the unprinted side of the circuit board 60 face the second robotic arm 40;

[0099] S4: The second robot arm 40 grabs the circuit board 60 from the side of the circuit board 60 that is not printed, and places the circuit board 60 on the second circuit board printing device 50;

[0100] S4: The second circuit board printing device 50 prints the other side of the circuit board 60 .

[0101] In this embodiment, the printing process of the second circuit board printing device 50 on the circuit board 60 can refer to the first circuit board printing device 10, which will not be described in detail here.

[0102] In summary, the circuit board printing production line can automatically complete the printing operation on the two surfaces of the circuit board 60, with simple operation and high efficiency. Furthermore, the circuit board printing equipment provided by the present invention can switch the ink required for different processes through the ink switching device 112, and control the amount of ink, quickly switch the ink formula required in the preparation process of the circuit board 60, reduce non-production downtime, and improve production efficiency.

[0103] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A circuit board printing production line, characterized in that: It includes a first circuit board printing device, a first robot arm, a clamping mechanism, a second robot arm and a second circuit board printing device which are arranged in sequence. The first circuit board printing device and the second circuit board printing device are used to print circuit boards. The first robot arm is used to grab the printed side of the circuit board from the first circuit board printing device and place the circuit board on the clamping mechanism so that the unprinted side of the circuit board faces the second robot arm. The second robot arm is used to grab the unprinted side of the circuit board from the clamping mechanism and place the circuit board on the second circuit printing device.

2. The circuit board printing production line according to claim 1, characterized in that: The first robotic arm and the second robotic arm both include a robotic arm body and an adsorption mechanism for adsorbing the circuit board, the adsorption mechanism is arranged on the robotic arm body, the adsorption mechanism includes a connecting arm, a mounting plate and a suction cup, the connecting arm is connected to the robotic arm body, the mounting plate is installed on the connecting arm, and the suction cup is arranged on the mounting plate.

3. The circuit board printing production line according to claim 2, characterized in that: There are at least two mounting plates, and at least one of the mounting plates is slidably disposed on the connecting arm.

4. The circuit board printing production line according to claim 1, characterized in that: The clamping mechanism includes a plurality of clamping heads arranged in a vertical direction. The clamping heads have an open state and a closed state. In the closed state, the clamping heads clamp the circuit board.

5. The circuit board printing production line according to claim 4, characterized in that: The clamping heads are arranged in two rows, each row is provided with a plurality of the clamping heads, the plurality of the clamping heads in each row are arranged along a vertical direction, and the clamping heads in the two rows are arranged opposite to each other.

6. The circuit board printing production line according to claim 1, characterized in that: The first circuit board printing device and the second circuit board printing device both include a printing module and a feeding module. The printing module includes an ink cartridge, an ink switching device and a nozzle. There are multiple ink cartridges for storing different inks. The ink cartridge is connected to the nozzle through the ink switching device. The ink switching device selects different ink cartridges to be connected to the nozzle and controls the outflow of ink in the ink cartridge. The feeding module is used to deliver the circuit board to a position corresponding to the nozzle.

7. The circuit board printing production line according to claim 6, characterized in that: The ink switching device includes a control valve, a liquid inlet, a mixing chamber and a liquid outlet. There are multiple liquid inlets and multiple liquid outlets. One end of each of the liquid inlets is connected to an ink cartridge, and the other end is connected to the mixing chamber. One end of each of the liquid outlets is connected to a nozzle, and the other end is connected to the mixing chamber. The control valve controls the opening and closing and the opening degree of each of the liquid inlets respectively.

8. The circuit board printing production line according to claim 7, characterized in that: The ink switching device is also provided with an ink discharge port for recovering ink, and the ink discharge port is communicated with the mixing chamber.

9. The circuit board printing production line according to claim 7, characterized in that: The ink switching device is also provided with an air inlet for injecting air flow into the mixing chamber, and a cleaning liquid inlet for injecting cleaning liquid into the mixing chamber.

10. The circuit board printing production line according to claim 1, characterized in that: The feeding module includes a substrate, a clamp and an adsorption device. The clamp and the adsorption device are arranged on the substrate. The clamp is used to clamp the circuit board between the clamp and the support plate, and the adsorption device is used to adsorb the circuit board.

11. A working method based on a circuit board printing production line, characterized in that: The method comprises the following steps: Printing one side of the circuit board by a first circuit board printing device, and transporting the circuit board to a position corresponding to the first robotic arm; The first mechanical arm grabs the circuit board from the printed side of the circuit board and places the circuit board on a clamping mechanism; The clamping mechanism fixes the circuit board and makes the unprinted side of the circuit board face the second mechanical arm; The second robot arm grabs the circuit board from the side of the circuit board that is not printed, and places the circuit board on the second circuit board printing device; The second circuit board printing device prints the other side of the circuit board.

12. The working method based on the circuit board printing production line according to claim 11, characterized in that: When the circuit board is printed by the first circuit board printing device and / or the second circuit board printing device, the method includes: Select the process required for printing the circuit board; The ink cartridge corresponding to the selected process is connected to the printhead through the ink switching device; The circuit board is subjected to a spray printing operation.

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