Thermal conductive adhesive pad film cutting machine and processing method thereof

Abstract

The present invention relates to a thermal conductive adhesive pad film cutting machine and a processing method thereof. The thermal conductive adhesive pad film cutting machine includes a workbench, a movable material table, a cutting mechanism, and a film pasting mechanism. A thermal conductive adhesive pad is laid flat on the movable material table. The cutting knife of the cutting mechanism cuts the thermal conductive adhesive pad on the cutting station twice. The thermal conductive adhesive pad is formed into at least two thermal conductive adhesive pad strips by the first cutting operation. A tear strip is formed between two adjacent thermal conductive adhesive pad strips. The tear strip is separated from the thermal conductive adhesive pad strips by external force before the film pasting operation. The thermal conductive adhesive pad is formed into at least two thermal conductive adhesive pad blocks by the second cutting operation. The film pasting mechanism pastes a release film on the thermal conductive adhesive pad strips before the second cutting operation, so that the thermal conductive adhesive pad blocks formed after the second cutting operation carry the release film. The present invention can process a whole thermal conductive adhesive pad into small pieces of thermal conductive adhesive pad blocks carrying release film. At least one side edge of the release film extends beyond the thermal conductive adhesive pad block, which is convenient for users to use.

Description

Technical Field

[0001] The present invention relates to the technical field of cutting machines, and in particular to a thermal conductive adhesive pad film cutting machine and a processing method thereof. Background Art

[0002] Thermal conductive pads are high-performance gap-filling thermal conductive materials. They have good viscosity, flexibility, compressibility, and excellent thermal conductivity. As a medium for heat transfer, thermal conductive pads are placed between electronic devices and heat dissipation structures to increase the heat dissipation effect of electronic devices. Thermal conductive pads have a certain viscosity and are easier to install than ordinary insulating thermal conductive materials.

[0003] In the production process of thermal conductive adhesive pads, the thermal conductive adhesive pads will first be formed into a large wide thermal conductive adhesive pad, and then cut into small thermal conductive adhesive pad blocks. The thermal conductive adhesive pads have a certain degree of stickiness. In order to prevent the cut thermal conductive adhesive pads from sticking together, it is necessary to stick a release film on the thermal conductive adhesive pads to facilitate subsequent packaging. If the release film is affixed before the thermal conductive adhesive pads are cut, the release film and the thermal conductive adhesive pads will be cut together, making the release film and the thermal conductive adhesive pads the same size. When the thermal conductive adhesive pads are used later, it is difficult to separate the release film from the thermal conductive adhesive pads, resulting in inconvenience in using the thermal conductive adhesive pads; if the release film is affixed after the thermal conductive adhesive pads are cut into thermal conductive adhesive pads, each thermal conductive adhesive pad needs to be positioned before affixing the thermal conductive adhesive pads, resulting in a large workload in the release film affixing process, affecting the production efficiency of the thermal conductive adhesive pads.

[0004] Therefore, it is necessary to design a cutting machine for thermal conductive adhesive pads to perform cutting and film lamination operations on the thermal conductive adhesive pads. Summary of the Invention

[0005] In order to solve the deficiencies of the prior art, the present invention provides a thermal conductive adhesive pad film cutting machine and a processing method thereof.

[0006] In a first aspect, the present invention provides a thermal conductive adhesive pad film cutting machine, comprising a workbench, a movable material table, a cutting mechanism, and a film laminating mechanism. The workbench is provided with a loading and unloading station, a cutting station, and a film laminating station in a straight line. The movable material table is flatly laid with a thermal conductive adhesive pad and drives the thermal conductive adhesive pad to move back and forth between the loading and unloading station, the cutting station, and the film laminating station.

[0007] The cutting mechanism is arranged at a cutting station, and the cutting blade of the cutting mechanism cuts the thermal conductive adhesive gasket on the cutting station twice, and the cutting directions of the cutting blades of the two cuttings are perpendicular to each other. The thermal conductive adhesive gasket is formed into at least two thermal conductive adhesive pads by the first cutting operation, and a tear strip is formed between two adjacent thermal conductive adhesive pads. The tear strip is separated from the thermal conductive adhesive pad by external force before the film lamination operation, and the thermal conductive adhesive pad is formed into at least two thermal conductive adhesive pad blocks by the second cutting operation;

[0008] The film-sticking mechanism is arranged at the film-sticking station. The film-sticking mechanism sticks the release film on the thermal conductive adhesive pad before the second cutting operation, so that the thermal conductive adhesive pad formed after the second cutting operation carries the release film. During the film-sticking operation, part of the edge of the release film falls into the avoidance groove formed after the two adjacent thermal conductive adhesive pads are separated by the tear strip.

[0009] In some embodiments, the cutting mechanism includes a first cutting knife, a cutting lifting module and a cutting translation module. The first cutting knife is vertically arranged above the cutting station. The first cutting knife is arranged on the first lifting seat of the cutting lifting module. The cutting lifting module drives the first cutting knife to move in the Z-axis direction. The cutting lifting module is arranged on the first moving seat of the cutting translation module. The cutting translation module drives the cutting lifting module and the first cutting knife to move in the X-axis direction to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

[0010] In some embodiments, the cutting mechanism also includes a rotary knife drive assembly, which is arranged on a first lifting seat. The rotary knife drive assembly includes a knife seat and a rotary knife motor with a transmission connection. The first cutting knife is inserted into the axial hole of the knife seat. The first cutting knife is connected to the axial hole through a key. The rotary knife motor drives the first cutting knife to rotate 90° through the knife seat to perform a second cutting operation on the thermal conductive rubber pad along the Y-axis direction.

[0011] In some embodiments, the film sticking mechanism includes a film sticking device, a film sticking lifting module and a film sticking translation module. The film sticking device is arranged on the second lifting seat of the film sticking lifting module, and the film sticking lifting module drives the film sticking device to move in the Z-axis direction. The film sticking lifting module is arranged on the second moving seat of the film sticking translation module, and the film sticking translation module drives the film sticking lifting module and the film sticking device to move in the X-axis direction to stick the release film on the thermal conductive adhesive pad along the X-axis direction.

[0012] In some embodiments, the cutting mechanism also includes a second cutting knife, which is arranged on a second lifting seat of the film lifting module. The film lifting module and the film translation module drive the second cutting knife to move in the X-axis and Z-axis directions to drive the second cutting knife to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

[0013] In some embodiments, the first cutting knife is a vibrating knife, and the second cutting knife is a circular knife.

[0014] The film pressing roller adheres the release film to the thermal conductive adhesive strip in a rolling manner, and the cutter is driven by the film cutting cylinder, and the film cutting cylinder drives the cutter to cut the release film between the film clamping head and the film pressing roller.

[0015] In some embodiments, the movable material table includes a slide, a splint and a support plate. Two splints are symmetrically arranged on both sides of the slide. Each splint is transmission-connected to an alignment cylinder. The alignment cylinder is installed on the slide. A thermal conductive glue gasket is laid flat on the support plate. The support plate is placed on the slide. The two splints are driven by the alignment cylinder to align the support plate with the slide in the X-axis direction. The slide is transmission-connected to a linear module, which drives the slide and the support plate to move in the Y-axis direction.

[0016] In a second aspect, the present invention further provides a method for processing a thermally conductive adhesive pad film cutting machine, comprising the following steps performed by the thermally conductive adhesive pad film cutting machine described in the first aspect:

[0017] Step 1: Loading: Place a support plate with a thermally conductive adhesive pad on the slide at the loading and unloading station. The support plate and the thermally conductive adhesive pad are centered on the slide in the X-axis direction through a clamping plate;

[0018] Step 2: The first cutting operation, wherein the movable material table drives the thermal conductive adhesive gasket to the cutting station, and the thermal conductive adhesive gasket is cut for the first time by a cutting knife moving along the X-axis direction. The first cutting operation forms at least one tear strip on the thermal conductive adhesive gasket, and each tear strip is formed by the thermal conductive adhesive gasket being cut twice by the cutting knife along two parallel paths;

[0019] Step 3: waste removal: the movable material platform drives the thermal conductive adhesive gasket to the loading and unloading station, and uses external force to tear and separate the tear strip cut in step 2, separating the thermal conductive adhesive gasket into at least two thermal conductive adhesive gasket strips, wherein the thermal conductive adhesive gasket strips are arranged on the support plate along the X-axis direction;

[0020] Step 4: film laminating operation. The movable material table drives the thermal conductive adhesive strips to move to the film laminating station. The film laminating mechanism applies a release film to each thermal conductive adhesive strip, wherein at least one edge of the release film falls into the avoidance groove formed by the tear strip;

[0021] Step 5, a second cutting operation, wherein the movable material table drives the thermal conductive adhesive strip after film application to the cutting station, the first cutting blade rotates 90 degrees, and the movable material table drives the thermal conductive adhesive strip to move along the Y-axis. The first cutting blade moves relative to the thermal conductive adhesive strip in the Y-axis direction to perform a second cutting operation on the thermal conductive adhesive strip and the release film, cutting each thermal conductive adhesive strip into at least two thermal conductive adhesive pads;

[0022] Step six, unloading, the movable material platform drives the thermal conductive adhesive pad to move to the loading and unloading station, removes the support plate and the thermal conductive adhesive pad from the slide, and separates the thermal conductive adhesive pad with the release film from the support plate.

[0023] In some embodiments, the cutting knife in step 2 is the first cutting knife or the second cutting knife.

[0024] Compared with the prior art, the beneficial effect of the present invention is that the thermal conductive adhesive gasket is cut twice and laminated once through the cutting mechanism and the film laminating mechanism. The first cutting operation simultaneously forms the thermal conductive adhesive pad strip and the tear strip. The tear strip is torn off before the film laminating operation to form a avoidance groove between adjacent thermal conductive adhesive pad strips. During the film laminating operation, the edge of the release film can fall into the avoidance groove, so that the width of the release film can be greater than the width of the thermal conductive adhesive pad strip. Before the second cutting operation, the release film is affixed to the thermal conductive adhesive pad, so that the cut and formed thermal conductive adhesive pad block carries the release film. After the second cutting operation, the edge of the release film carried by the thermal conductive adhesive pad block will exceed the thermal conductive adhesive pad block, thereby facilitating the separation of the release film when the thermal conductive adhesive pad block is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is one of the three-dimensional structural schematic diagrams of the thermal conductive adhesive pad film cutting machine according to an embodiment of the present application.

[0026] Figure 2 This is the second three-dimensional structural schematic diagram of the thermal conductive adhesive pad film cutting machine according to an embodiment of the present application.

[0027] Figure 3 It is a schematic planar structural diagram of the thermal conductive adhesive pad film cutting machine according to an embodiment of the present application.

[0028] Figure 4 It is a schematic diagram of the three-dimensional structure of the cutting mechanism of an embodiment of the present application.

[0029] Figure 5 It is a schematic diagram of the exploded structure of the first cutting knife and the first lifting seat in an embodiment of the present application.

[0030] Figure 6 This is one of the three-dimensional structural schematic diagrams of the film-sticking mechanism of the embodiment of the present application.

[0031] Figure 7 This is the second schematic diagram of the three-dimensional structure of the film-sticking mechanism of the embodiment of the present application.

[0032] Figure 8 It is a schematic diagram of the structure of the release film material belt feeding path of the film laminating mechanism in an embodiment of the present application.

[0033] Figure 9 It is a schematic diagram of the three-dimensional structure of the movable material table of an embodiment of the present application.

[0034] Figure 10 This is a schematic diagram of the processing of the thermal conductive pad according to an embodiment of the present application.

[0035] Reference numerals: 101, workbench; 102, frame; 103, beam; 104, loading and unloading station; 105, cutting station; 106, film laminating station;

[0036] 201, thermal conductive adhesive gasket; 202, thermal conductive adhesive pad; 203, thermal conductive adhesive pad; 204, tear strip; 205, avoidance groove; 206, release film; 207, material feeding path;

[0037] 100. Mobile material table;

[0038] 1. Support plate; 11. Slide; 12. Clamp; 13. Alignment cylinder; 14. Linear module; 15. Drive motor; 16. Third screw pair; 17. Slide rail;

[0039] 200, cutting mechanism;

[0040] 2. First cutting knife; 21. Blade;

[0041] 3. Cutting lifting module; 31. First lifting seat; 32. First lifting motor; 33. First screw rod pair;

[0042] 4. Cutting translation module; 41. First moving seat; 42. First linear motor;

[0043] 5. Rotary cutter drive assembly; 51. Rotary cutter motor; 52. Cutting block; 53. Shaft hole; 54. Key;

[0044] 6. Second cutting knife; 61. Knife adjustment assembly;

[0045] 300, film-sticking mechanism;

[0046] 7. Film laminating device; 71. Unwinding shaft; 72. Pulling roller; 73. Film-pressing roller; 731. Film-pressing cylinder; 732. Film-pressing guide rail; 74. Film clamping head; 741. Film-pressing cylinder; 742. Guide plate; 743. Guide block; 744. Adjusting screw; 75. Cutter; 76. Film pressing roller; 77. Film-cutting cylinder;

[0047] 8. Film-mounting lifting module; 81. Second lifting seat; 82. Second lifting motor; 83. Second screw rod pair;

[0048] 9. Film-sticking translation module; 91. Second moving seat; 92. Second linear motor. DETAILED DESCRIPTION

[0049] Specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0050] refer to Figure 1 The figure shows the three-dimensional structure of the thermal conductive adhesive pad film cutting machine. A cutting mechanism 200 and a film pasting mechanism 300 are arranged above the workbench 101. The thermal conductive adhesive pad 201 is spread flat on the movable material table 100. The movable material table 100 moves back and forth along a straight line between the loading and unloading station 104, the cutting mechanism 200 and the film pasting mechanism 300. The cutting mechanism 200 cuts the thermal conductive adhesive pad twice, cutting the thermal conductive adhesive pad 201 into small pieces of thermal conductive adhesive pad blocks 203, and the film pasting mechanism 300 performs film pasting operations on the thermal conductive adhesive pad strips 202.

[0051] refer to Figures 1 to 10 A thermal conductive adhesive pad film cutting machine includes a workbench 101, a movable material table 100, a cutting mechanism 200 and a film pasting mechanism 300. The workbench 101 is provided with a loading and unloading station 104, a cutting station 105 and a film pasting station 106 in a straight line. The movable material table 100 is flatly laid with a thermal conductive adhesive pad 201, and drives the thermal conductive adhesive pad 201 to move back and forth between the loading and unloading station 104, the cutting station 105 and the film pasting station 106.

[0052] Among them, the cutting mechanism 200 is set at the cutting station 105, and the cutting knife 75 of the cutting mechanism 200 cuts the thermal conductive adhesive gasket 201 on the cutting station 105 twice. The cutting directions of the cutting knife 75 of the two cuttings are perpendicular to each other. The thermal conductive adhesive gasket 201 forms at least two thermal conductive adhesive pads 202 through the first cutting operation, and a tear strip 204 is formed between two adjacent thermal conductive adhesive pads 202. The tear strip 204 is separated from the thermal conductive adhesive pad 202 by external force before the film laminating operation, and the thermal conductive adhesive pad 202 forms at least two thermal conductive adhesive pad blocks 203 through the second cutting operation.

[0053] The film laminating mechanism 300 is set at the film laminating station 106. The film laminating mechanism 300 lays the release film 206 on the thermal conductive adhesive pad 202 before the second cutting operation, so that the thermal conductive adhesive pad 203 formed after the second cutting operation carries the release film 206. During the film laminating operation, part of the edge of the release film 206 falls into the avoidance groove 205 formed after the two adjacent thermal conductive adhesive pads 202 are separated from the tear strip 204.

[0054] It should be further explained that, when the thermal conductive adhesive pad 201 is cut into a plurality of parallel thermal conductive adhesive pad strips 202 in the first cutting operation, the method of separating two adjacent thermal conductive adhesive pad strips 202 is that the cutting knife 75 moves twice to cut out a tear strip 204 of smaller width, and the tear strip 204 and the two thermal conductive adhesive pad strips 202 on both sides have cutting seams, which can ensure that the tear strip 204 can be torn and separated from the thermal conductive adhesive pad strip 202. After the tear strip 204 is torn off, the corresponding A certain width of avoidance groove 205 will be left between two adjacent thermal adhesive pads 202. When the release film 206 is attached along the thermal adhesive pad 202, the edge of the release film 206 can fall into the avoidance groove 205, so that the edge of the release film 206 at the avoidance groove 205 is not flush with the thermal adhesive pad 202. After the second cutting operation, the side edge of the release film 206 can be exposed relative to the thermal adhesive pad 203, thereby facilitating the thermal adhesive pad 203 to tear off the release film 206 when in use.

[0055] The thermal conductive adhesive pad film cutting machine of this embodiment performs two cutting operations and one film laminating operation on the thermal conductive adhesive gasket 201 through the cutting mechanism 200 and the film laminating mechanism 300. The first cutting operation simultaneously forms the thermal conductive adhesive pad strip 202 and the tear strip 204. The tear strip 204 is torn off before the film laminating operation, so that a avoidance groove 205 is formed between adjacent thermal conductive adhesive pad strips 202. During the film laminating operation, the edge of the release film 206 can fall into the avoidance groove 205, so that the width of the release film 206 can be greater than the width of the thermal conductive adhesive pad strip 202. Before the second cutting operation, the release film 206 is affixed to the thermal conductive adhesive pad, so that the cut and formed thermal conductive adhesive pad block 203 carries the release film 206. After the second cutting operation, the edge of the release film 206 carried by the thermal conductive adhesive pad block 203 will exceed the thermal conductive adhesive pad block 203, thereby facilitating the separation of the release film 206 when the thermal conductive adhesive pad block 203 is used.

[0056] In order to cut the thermal conductive pad, in this embodiment, refer to Figures 1 to 5The cutting mechanism 200 includes a first cutting knife 2, a cutting lifting module 3 and a cutting translation module 4. The first cutting knife 2 is vertically arranged above the cutting station 105. The first cutting knife 2 is arranged on the first lifting seat 31 of the cutting lifting module 3. The cutting lifting module 3 drives the first cutting knife 2 to move in the Z-axis direction. The cutting lifting module 3 is arranged on the first moving seat 41 of the cutting translation module 4. The cutting translation module 4 drives the cutting lifting module 3 and the first cutting knife 2 to move in the X-axis direction to perform the first cutting operation on the thermal conductive adhesive gasket 201 along the X-axis direction.

[0057] It should be further explained that the cutting lifting module 3 includes a first lifting motor 32 and a first screw pair 33. The first lifting motor 32 and the first screw pair 33 are mounted on the first movable seat 41. The first lifting seat 31 is installed on the first screw pair 33. The first lifting motor 32 drives the first lifting seat 31 and the first cutting knife 2 to move up and down along the Z axis through the first screw pair 33. The first lifting motor 32 adopts a servo motor, which can accurately control the lifting height of the first cutting knife 2, thereby accurately cutting the thermal conductive adhesive pad, and can perform half-cut or full-cut operations on the thermal conductive adhesive pad; the cutting translation module 4 includes a first linear motor 42. The first linear motor 42 drives the first movable seat 41 and the first cutting knife 2 to move along the X axis. The translation movement of the first cutting knife 2 only needs to move along a straight line. The use of the first linear motor 42 can well meet the translation movement of the first cutting knife 2. At the same time, the first linear motor 42 is simpler in structure than the other linear modules 14, reducing the complexity of the entire machine and reducing the complexity of installation and maintenance.

[0058] It can be understood that with such a setting, the cutting lifting module 3 drives the first cutting knife 2 to move in the Z-axis direction, the cutting translation module 4 drives the first cutting knife 2 to move in the X-axis direction, and the thermal conductive adhesive pad moves in the Y-axis direction through the movable material table 100, so that the first cutting knife 2 can cut any position of the thermal conductive adhesive pad.

[0059] In order to change the cutting direction of the first cutting blade 2, in this embodiment, refer to Figure 4 and Figure 5 The cutting mechanism 200 also includes a rotary knife drive assembly 5, which is arranged on the first lifting seat 31. The rotary knife drive assembly 5 includes a knife seat 52 and a rotary knife motor 51 that are transmission-connected. The first cutting knife 2 is inserted into the shaft hole 53 of the knife seat 52. The first cutting knife 2 is connected to the shaft hole 53 through a key 54. The rotary knife motor 51 drives the first cutting knife 2 to rotate 90° through the knife seat 52 to perform a second cutting operation on the thermal conductive adhesive pad 202 along the Y-axis direction.

[0060] It can be understood that, with such a setting, the rotary knife motor 51 and the knife seat 52 are connected by a direction transmission of gears or synchronous belts. The rotary knife motor 51 drives the first cutting knife 2 to rotate by rotating the knife seat 52. The blade 21 of the first cutting knife 2 is set along the X-axis direction during the first cutting operation. The blade 21 of the first cutting knife 2 is rotated to the Y-axis direction by the rotary knife drive assembly 5, and cooperates with the thermal conductive adhesive pad 202 moving along the Y-axis direction driven by the movable material table 100 to cut the thermal conductive adhesive pad 202 into thermal conductive adhesive pad blocks 203.

[0061] In order to perform film lamination on the thermal conductive adhesive strip 202, in this embodiment, reference is made to Figures 6 to 8 The film sticking mechanism 300 includes a film sticking device 7, a film sticking lifting module 8 and a film sticking translation module 9. The film sticking device 7 is arranged on the second lifting seat 81 of the film sticking lifting module 8. The film sticking lifting module 8 drives the film sticking device 7 to move in the Z-axis direction. The film sticking lifting module 8 is arranged on the second moving seat 91 of the film sticking translation module 9. The film sticking translation module 9 drives the film sticking lifting module 8 and the film sticking device 7 to move in the X-axis direction to stick the release film 206 on the thermal conductive adhesive pad 202 along the X-axis direction.

[0062] It should be further explained that the film lifting module 8 includes a second lifting motor 82 and a second screw pair 83. The second lifting motor 82 and the second screw pair 83 are mounted on the second movable seat 91. The second lifting motor 82 drives the second lifting seat 81 to move up and down along the Z-axis through the second screw pair 83. The second lifting motor 82 adopts a servo motor, which can accurately control the lifting height of the film device 7, so as to accurately stick the release film 206 on the thermal conductive adhesive pad 202; the film translation module 9 includes a second linear motor 92. The second linear motor 92 drives the second movable seat 91 and the film device 7 to move along the X-axis. When the film device 7 performs the film sticking operation, it only needs to move along the X-axis. The release film 206 can be attached to the thermal conductive adhesive pad 202. The second linear motor 92 can well meet the translational movement of the film-sticking device 7. At the same time, the second linear motor 92 is simpler in structure than the remaining linear modules 14, reducing the complexity of the entire machine and reducing the complexity of installation and maintenance. At the same time, in order to facilitate control and wiring, the first linear motor 42 and the second linear motor 92 are installed in parallel on both sides of the crossbeam 103 of the frame 102, so that the cutting mechanism 200 and the film-sticking mechanism 300 are respectively installed on both sides of the crossbeam 103, and the respective weights of the two mechanisms are used to form a counterweight to ensure that the cutting mechanism 200 and the film-sticking mechanism 300 can operate stably.

[0063] It can be understood that, in this arrangement, the film laminating device 7 is used to unwind the release film 206, stick the release film 206 on the thermal adhesive pad 202, and cut the release film 206. The film laminating lifting module 8 drives the film laminating device 7 to move in the Z-axis direction, and the film laminating translation module 9 drives the film laminating device 7 to move in the X-axis direction. The thermal adhesive pad 202 moves along the Y-axis direction driven by the movable material table 100, so that the film laminating device 7 can perform film laminating operations on the thermal adhesive pad 202 at any position.

[0064] In order to cut the thermal conductive pads of different thicknesses, in this embodiment, reference is made to Figure 7 The cutting mechanism 200 also includes a second cutting knife 6, which is arranged on the second lifting seat 81 of the film lifting module 8. The film lifting module 8 and the film translation module 9 drive the second cutting knife 6 to move in the X-axis and Z-axis directions to drive the second cutting knife 6 to perform the first cutting operation on the thermal conductive adhesive gasket 201 along the X-axis direction.

[0065] It should be further explained that the second cutting knife 6 is a circular knife, and a knife adjusting assembly 61 is provided between the second cutting knife 6 and the second lifting seat 81. According to the different thicknesses of the thermal conductive glue gasket 201, the knife adjusting assembly 61 is used to adjust the height of the second cutting knife 6 relative to the second lifting seat 81, thereby controlling the depth of the second cutting knife 6 cutting the thermal conductive glue gasket 201. The knife adjusting assembly 61 will also adjust the inclination angle of the second cutting knife 6 so that the blade of the second cutting knife 6 can cut at the optimal angle.

[0066] It can be understood that, with such an arrangement, the second cutting knife 6 is arranged along the X-axis direction, and the second cutting knife 6 is installed on the second lifting seat 81. It moves along the Z-axis and X-axis directions respectively driven by the film lifting module 8 and the film translation module 9. The thermal conductive adhesive gasket 201 moves along the Y-axis direction driven by the movable material table 100, so that the second cutting knife 6 can perform the first cutting operation on any position of the thermal conductive adhesive gasket 201 along the X-axis direction. Separating the second cutting knife 6 from the first cutting knife 2 can reduce the structure on one side of the first cutting knife 2, and at the same time avoid the high-frequency vibration of the first cutting knife 2 affecting the cutting accuracy of the circular knife.

[0067] In order to better cut the thermal conductive pads of different thicknesses, in this embodiment, reference Figure 4 and Figure 7 The first cutting knife 2 is a vibrating knife, and the second cutting knife 6 is a circular knife.

[0068] It can be understood that, in such a setting, the first cutting knife 2 is a vibrating knife, which can cut thermal conductive adhesive pads of different thicknesses, and the second cutting knife 6 adopts a circular knife, which can cut thinner thermal conductive adhesive pads very well. The circular knife is more energy-efficient than the vibrating knife when working, so the second cutting knife 6 can be used for the first cutting operation of the thinner thermal conductive adhesive pad, and the circular knife has a weaker cutting effect on the thermal conductive adhesive pad strip 202 with the release film 206 than the vibrating knife. For the second cutting operation, the first cutting knife 2 should still be used.

[0069] In order to attach the release film 206 to the thermal conductive adhesive strip 202, in this embodiment, refer to Figures 6 to 8 The film laminating device 7 includes a discharge shaft 71, a traction roller 72, a film-stirring roller 73, a film clamping head 74, a cutter 75 and a film-stirring roller 76 which are sequentially arranged on the second lifting seat 81 along the material feeding path 207 of the release film 206. A material roll is sleeved on the discharge shaft 71. Under the action of the film-stirring roller 73, the material roll releases the release film 206 material strip to the traction roller 72. The film-stirring roller 73 is transmission-connected to the film-stirring cylinder 731. The film-stirring cylinder 731 drives the film-stirring roller 73 to move along the film-stirring guide rail 732 relative to the traction roller 72 to pull the release film 206 material strip. ; The film clamping head 74 is transmission-connected to the film clamping cylinder 741, and the second lifting seat 81 is provided with a guide plate 742 opposite to the film clamping head 74 on the other side of the release film 206 material strip. Driven by the film clamping cylinder 741, the film clamping head 74 clamps the release film 206 material strip between the film clamping head 74 and the guide plate 742, and the film pressing roller 76 sticks the release film 206 on the thermal conductive adhesive pad 202 in a rolling manner. The cutter 75 is transmission-connected to the film cutting cylinder 77, and the film cutting cylinder 77 drives the cutter 75 to cut the release film 206 between the film clamping head 74 and the film pressing roller 76.

[0070] It should be further explained that a guide block 743 is provided on one side of the guide plate 742 close to the release film 206 material strip, and an adjusting screw 744 is provided on the other side of the guide plate 742. The adjusting screw 744 is threadedly connected to the guide block 743. The adjusting screw 744 is provided along the Y-axis direction. By rotating the adjusting screw 744, the position of the block in the Y-axis direction can be adjusted, thereby adjusting the position of the edge of the release film 206 material strip in the Y-axis direction, so that the edge of the release film 206 can accurately fall into the avoidance groove 205 between the thermal conductive adhesive pad strips 202, thereby improving the accuracy of the film pasting.

[0071] The film cutting cylinder 77 drives the cutter 75 downward to cut the release film 206. In the process of cutting the release film 206, the film-pushing roller 73 is driven by the film-pushing cylinder 731 to pull the release film 206 strip to a distance, thereby pulling the material roll on the unloading shaft 71 to rotate and unwind. The length of the release film 206 strip pushed by the film-pushing roller 73 each time is the length of the release film 206 strip that the release film 206 needs to be attached to the guide plate 742. The length of the thermal adhesive pad 202 is such that the release film 206 can be stepped on once to complete the film-sticking operation of a thermal adhesive pad 202; during the film-sticking operation, the film-sticking lifting module 8 will drive the film-sticking device 7 to move downward, and the film-sticking translation module 9 will drive the film-sticking device 7 to start from the outside of the thermal adhesive pad 202, and press the release film 206 onto the thermal adhesive pad 202 through the film-sticking pressing roller 76, and roll the release film 206 onto the thermal adhesive pad 202 in turn through the two film-sticking pressing rollers 76, thereby expelling the air between the release film 206 and the thermal adhesive pad 202, so that the release film 206 is better attached to the thermal adhesive pad 202. After sticking, the film clamping head 74 and the guide plate 742 clamp the release film 206 strip, and the cutter 75 cuts the release film 206 strip, and the film-sticking operation of a thermal adhesive pad 202 is completed.

[0072] In order to stably drive the thermal conductive adhesive pad 201 to move, in this embodiment, reference Figure 9 The movable material table 100 includes a slide 11, a splint 12 and a pallet 1. Two splints 12 are symmetrically arranged on both sides of the slide 11. Each splint 12 is transmission-connected to an alignment cylinder 13. The alignment cylinder 13 is installed on the slide 11. A thermal conductive adhesive gasket 201 is laid flat on the pallet 1. The pallet 1 is placed on the slide 11. The two splints 12 are driven by the alignment cylinder 13 to align the pallet 1 with the slide 11 in the X-axis direction. The slide 11 is transmission-connected to a linear module 14, which drives the slide 11 and the pallet 1 to move in the Y-axis direction.

[0073] It should be further explained that the linear module 14 includes a drive motor 15 and a third screw pair 16. The drive motor 15 is connected to the third screw pair 16 in a transmission manner. The third screw pair 16 is connected to the slide 11 in a transmission manner. Slide rails 17 are arranged in parallel on both sides of the third screw pair 16. The drive motor 15 drives the slide 11 to move along the slide rails 17 through the third screw pair 16, and drives the slide 11 to reciprocate between the loading and unloading station 104, the cutting station 105 and the film laminating station 106. The loading and unloading station 104 is a connecting station. The loading of the thermal conductive adhesive gasket 201 and the unloading of the thermal conductive adhesive pad 203 are both carried out at the loading and unloading station 104. At the same time, the operation of removing the tear strip 204 can also be carried out at the loading and unloading station 104. The operation of removing the tear strip 204 can be done by manually clamping the tear strip 204 and tearing it off from the pallet 1, or by a robot hooking or clamping the tear strip 204 and tearing it off from the pallet 1.

[0074] It can be understood that, with such a configuration, the pallet 1 is used for transit transportation, and the thermal conductive adhesive gasket 201 will first be spread flat on the pallet 1. By transporting the thermal conductive adhesive gasket 201 through the pallet 1, the loading and unloading efficiency of the thermal conductive adhesive gasket 201 can be improved. The pallet 1 is aligned and clamped on the slide 11 through two symmetrically arranged clamps 12, so that the thermal conductive adhesive pad and the pallet 1 need to be stably placed on the slide 11, and the slide 11 moves in a straight line driven by the linear module 14.

[0075] The thermal conductive adhesive pad film cutting machine of the embodiment of the present application completes the loading of the thermal conductive adhesive pad 201, removes the tear strip 204 and the unloading of the thermal conductive adhesive pad block 203 at the loading and unloading station 104, completes the first cutting operation for the thermal conductive adhesive pad 201 and the second cutting operation for the thermal conductive adhesive pad strip 202 at the cutting station 105, and completes the film application operation for the thermal conductive adhesive pad strip 202 at the film application station 106. Through the two cutting operations, the entire thermal conductive adhesive pad 201 is converted into multiple thermal conductive adhesive pad strips 202. 02, and then become multiple thermal conductive adhesive pads 203, which can improve the production efficiency of the entire thermal conductive adhesive pad. During the film pasting operation, the edge of the release film 206 can fall into the avoidance groove 205 formed after tearing off the tear strip 204, so that the width of the release film 206 can be greater than the width of the thermal conductive adhesive pad strip 202. After the second cutting operation, the edge of the release film 206 carried by the thermal conductive adhesive pad 203 will exceed the thermal conductive adhesive pad 203, thereby facilitating the separation of the release film 206 when the thermal conductive adhesive pad 203 is used.

[0076] refer to Figures 1 to 10 The present application also provides a method for processing a thermal conductive adhesive pad film cutting machine, comprising the following steps performed on the thermal conductive adhesive pad film cutting machine:

[0077] Step 1: Loading, such as Figure 9 and Figure 10As shown in part a, the support plate 1 with the thermal conductive adhesive pad 201 is placed on the slide 11 at the loading and unloading station 104, and the support plate 1 and the thermal conductive adhesive pad 201 are centered on the slide 11 in the X-axis direction through the clamping plate 12;

[0078] Step 2, the first cutting operation, the moving material table 100 drives the thermal conductive adhesive gasket 201 to move to the cutting station 105, and the thermal conductive adhesive gasket 201 is cut for the first time by the cutting knife 75 moving along the X-axis direction. The first cutting operation processes at least one tear strip 204 on the thermal conductive adhesive gasket 201. Each tear strip 204 is formed by the thermal conductive adhesive gasket 201 being cut twice along two parallel paths by the cutting knife 75. The tear strips 204 and the thermal conductive adhesive gasket strips 202 formed by the first cutting operation are as follows: Figure 10 As shown in part b;

[0079] Step 3, waste removal, the mobile material platform 100 drives the thermal conductive adhesive pad 201 to move to the loading and unloading station 104, and uses external force to tear and separate the tear strip 204 cut in step 2, and separates the thermal conductive adhesive pad 201 into at least two thermal conductive adhesive pad strips 202, wherein the thermal conductive adhesive pad strip 202 is arranged on the support plate 1 along the X-axis direction, and the thermal conductive adhesive pad strip 202 after removing the tear strip 204 is as shown in FIG. Figure 10 As shown in part c;

[0080] Step 4: Film pasting operation. The moving material table 100 drives the thermal conductive adhesive pad 202 to move to the film pasting station 106. The film pasting mechanism 300 pastes a release film 206 on each thermal conductive adhesive pad 202. At least one side edge of the release film 206 falls into the avoidance groove 205 formed by the tear strip 204. The thermal conductive adhesive pad 202 formed after the film pasting operation is as shown in FIG. Figure 10 As shown in part d;

[0081] Step 5, the second cutting operation, the moving material table 100 drives the thermal conductive adhesive strip 202 after film application to the cutting station 105, the first cutting knife 2 rotates 90 degrees, the moving material table 100 drives the thermal conductive adhesive strip to move along the Y axis, the first cutting knife 2 moves in the Y axis direction relative to the thermal conductive adhesive strip 202, to perform a second cutting operation on the thermal conductive adhesive strip 202 and the release film 206, and cut each thermal conductive adhesive strip 202 into at least two thermal conductive adhesive pads 203. After the second cutting operation, the thermal conductive adhesive pads 203 are formed as shown in FIG. Figure 10 As shown in part e;

[0082] Step 6: Unloading. The mobile material platform 100 drives the thermal conductive adhesive pad 203 to move to the unloading and unloading station 104, and the support plate 1 and the thermal conductive adhesive pad 203 are taken off the slide 11, and the thermal conductive adhesive pad 203 with the release film 206 is separated from the support plate 1. Figure 10As shown in part e, the thermal conductive adhesive pads 203 formed after two cutting operations can be separated from each other.

[0083] It can be understood that, with such a configuration, the thermal conductive adhesive gasket 201 is cut into multiple thermal conductive adhesive pads 203 through two cutting operations with cutting directions perpendicular to each other, and waste removal and film pasting operations are performed between the two cutting operations. By cutting out the tear strip 204 structure during the first cutting operation, the adjacent thermal conductive adhesive pads 202 can be well separated by tearing off the tear strip 204. At the same time, the edge of the pasted release film 206 can extend beyond the thermal conductive adhesive pad 202, so that at least one side edge of the release film 206 will not be flush with the thermal conductive adhesive pad 203, which is convenient for separating the release film 206 during use.

[0084] In order to better cut the thermal conductive pads of different thicknesses, in this embodiment, reference Figure 4 and Figure 7 The cutting knife 75 in step 2 is selected from the first cutting knife 2 or the second cutting knife 6.

[0085] It can be understood that, in such a setting, the first cutting knife 2 is a vibrating knife, and the second cutting knife 6 is a circular knife. The vibrating knife can cut thermal conductive adhesive pads of different thicknesses, and the first cutting knife 2 can be used for the first cutting operation and the second cutting operation; the circular knife can cut thinner thermal conductive adhesive pads very well, and the circular knife is more energy-efficient than the vibrating knife when working, so the second cutting knife 6 can be used for the first cutting operation of the thinner thermal conductive adhesive pad, and the circular knife has a weaker cutting effect on the thermal conductive adhesive pad strip 202 with a release film 206 than the vibrating knife. For the second cutting operation, the first cutting knife 2 should still be used.

[0086] The processing method of the thermal conductive adhesive pad film cutting machine of the embodiment of the present application sequentially performs the loading of the thermal conductive adhesive gasket 201, the first cutting operation, waste removal, film pasting operation, the second cutting operation, and the unloading of the thermal conductive adhesive pad block 203, so that the entire thermal conductive adhesive gasket 201 is processed into small pieces of thermal conductive adhesive pads 203 carrying release films 206, thereby improving the production efficiency of the thermal conductive adhesive pad. At the same time, at least one side edge of the release film 206 extends beyond the thermal conductive adhesive pad block 203. When the thermal conductive adhesive pad block 203 is in use, the release film 206 can be easily separated from the thermal conductive adhesive pad block 203, which is convenient for users to use.

[0087] The above does not limit the technical scope of the present invention. Any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A thermal conductive adhesive pad film cutting machine, characterized in that: It includes a workbench, a movable material table, a cutting mechanism and a film laminating mechanism. The workbench is provided with a loading and unloading station, a cutting station and a film laminating station in a straight line. The movable material table is flatly paved with a thermal conductive adhesive pad and drives the thermal conductive adhesive pad to move back and forth between the loading and unloading station, the cutting station and the film laminating station. The cutting mechanism is arranged at a cutting station, and the cutting blade of the cutting mechanism cuts the thermal conductive adhesive gasket on the cutting station twice, and the cutting directions of the cutting blades of the two cuttings are perpendicular to each other. The thermal conductive adhesive gasket is formed into at least two thermal conductive adhesive pads by the first cutting operation, and a tear strip is formed between two adjacent thermal conductive adhesive pads. The tear strip is separated from the thermal conductive adhesive pad by external force before the film lamination operation, and the thermal conductive adhesive pad is formed into at least two thermal conductive adhesive pad blocks by the second cutting operation; The film-sticking mechanism is arranged at the film-sticking station. The film-sticking mechanism sticks the release film on the thermal conductive adhesive pad before the second cutting operation, so that the thermal conductive adhesive pad formed after the second cutting operation carries the release film. During the film-sticking operation, part of the edge of the release film falls into the avoidance groove formed after the two adjacent thermal conductive adhesive pads are separated by the tear strip.

2. The thermal conductive adhesive pad film cutting machine according to claim 1, characterized in that: The cutting mechanism includes a first cutting knife, a cutting lifting module and a cutting translation module. The first cutting knife is vertically arranged above the cutting station. The first cutting knife is arranged on the first lifting seat of the cutting lifting module. The cutting lifting module drives the first cutting knife to move in the Z-axis direction. The cutting lifting module is arranged on the first moving seat of the cutting translation module. The cutting translation module drives the cutting lifting module and the first cutting knife to move in the X-axis direction to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

3. The thermal conductive adhesive pad film cutting machine according to claim 2, characterized in that: The cutting mechanism also includes a rotary knife drive assembly, which is arranged on a first lifting seat. The rotary knife drive assembly includes a knife seat and a rotary knife motor that are transmission-connected. The first cutting knife is inserted into the shaft hole of the knife seat. The first cutting knife is connected to the shaft hole through a key. The rotary knife motor drives the first cutting knife to rotate 90° through the knife seat to perform a second cutting operation on the thermal conductive adhesive pad along the Y-axis direction.

4. The thermal conductive adhesive pad film cutting machine according to claim 2, characterized in that: The film sticking mechanism includes a film sticking device, a film sticking lifting module and a film sticking translation module. The film sticking device is arranged on the second lifting seat of the film sticking lifting module. The film sticking lifting module drives the film sticking device to move in the Z-axis direction. The film sticking lifting module is arranged on the second moving seat of the film sticking translation module. The film sticking translation module drives the film sticking lifting module and the film sticking device to move in the X-axis direction to stick the release film on the thermal conductive adhesive pad along the X-axis direction.

5. The thermal conductive adhesive pad film cutting machine according to claim 4, characterized in that: The cutting mechanism also includes a second cutting knife, which is arranged on the second lifting seat of the film lifting module. The film lifting module and the film translation module drive the second cutting knife to move in the X-axis and Z-axis directions to drive the second cutting knife to perform the first cutting operation on the thermal conductive adhesive gasket along the X-axis direction.

6. The thermal conductive adhesive pad film cutting machine according to claim 5, characterized in that: The first cutting knife is a vibrating knife, and the second cutting knife is a circular knife.

7. The thermal conductive adhesive pad film cutting machine according to claim 4, characterized in that: The film pressing roller is driven by the film cutting cylinder, and the film cutting cylinder drives the cutter to cut the release film between the film clamping head and the film pressing roller.

8. The thermal conductive adhesive pad film cutting machine according to claim 1, characterized in that: The movable material table includes a slide, a splint and a support plate. Two splints are symmetrically arranged on both sides of the slide. Each splint is transmission-connected to an alignment cylinder. The alignment cylinder is installed on the slide. A thermal conductive glue gasket is laid flat on the support plate. The support plate is placed on the slide. The two splints are driven by the alignment cylinder to align the support plate with the center of the slide in the X-axis direction. The slide is transmission-connected to a linear module, which drives the slide and the support plate to move in the Y-axis direction.

9. A processing method of a thermal conductive adhesive pad film cutting machine, characterized in that: The following steps are performed by the thermal conductive adhesive pad film cutting machine according to any one of claims 1 to 8: Step 1: Loading: Place a support plate with a thermally conductive adhesive pad on the slide at the loading and unloading station. The support plate and the thermally conductive adhesive pad are centered on the slide in the X-axis direction through a clamping plate; Step 2: The first cutting operation, wherein the movable material table drives the thermal conductive adhesive gasket to the cutting station, and the thermal conductive adhesive gasket is cut for the first time by a cutting knife moving along the X-axis direction. The first cutting operation forms at least one tear strip on the thermal conductive adhesive gasket, and each tear strip is formed by the thermal conductive adhesive gasket being cut twice by the cutting knife along two parallel paths; Step 3: waste removal: the movable material platform drives the thermal conductive adhesive gasket to the loading and unloading station, and uses external force to tear and separate the tear strip cut in step 2, separating the thermal conductive adhesive gasket into at least two thermal conductive adhesive gasket strips, wherein the thermal conductive adhesive gasket strips are arranged on the support plate along the X-axis direction; Step 4: film laminating operation. The movable material table drives the thermal conductive adhesive strips to move to the film laminating station. The film laminating mechanism applies a release film to each thermal conductive adhesive strip, wherein at least one edge of the release film falls into the avoidance groove formed by the tear strip; Step 5, a second cutting operation, wherein the movable material table drives the thermal conductive adhesive strip after film application to the cutting station, the first cutting blade rotates 90 degrees, and the movable material table drives the thermal conductive adhesive strip to move along the Y-axis. The first cutting blade moves relative to the thermal conductive adhesive strip in the Y-axis direction to perform a second cutting operation on the thermal conductive adhesive strip and the release film, cutting each thermal conductive adhesive strip into at least two thermal conductive adhesive pads; Step six, unloading, the movable material platform drives the thermal conductive adhesive pad to move to the loading and unloading station, removes the support plate and the thermal conductive adhesive pad from the slide, and separates the thermal conductive adhesive pad with the release film from the support plate.

10. The processing method of the thermal conductive adhesive pad film cutting machine according to claim 9, characterized in that: The cutting knife in step 2 is selected from the first cutting knife or the second cutting knife.

Images