Semiconductor softening wastewater treatment process

Abstract

The invention relates to the technical field of semiconductor wastewater softening treatment, in particular to a semiconductor softening wastewater treatment process which comprises a fixing unit and a scale scraping unit. A semi-closed space with an upward opening is formed by a closed frame and the bottom of an electrolytic tank, and a first scale scraping frame is matched with a second scale scraping frame; the scale particles are stirred while the scale is scraped, the suction filtration effect of the suction filtration frame is ensured, the wastewater and the scale particles in the semi-closed space are extracted and filtered through the suction filtration frame, the filtered wastewater is discharged to other parts of the electrolytic tank through the suction filtration frame, and in the whole scale removal process, the electrolytic tank and the polar plate do not need to be disassembled for cleaning, so that the operation is simple and convenient. According to the electrolytic tank, the workload of operators during descaling is reduced, the time for delaying normal use of the electrolytic tank is shortened, scale on the surface of a single negative plate can be cleaned as required, and the situation that part of the negative plates with less scale on the surface are greatly abraded due to synchronous cleaning of the scale on the surfaces of all the negative plates is avoided, so that the service life of the electrolytic tank is prolonged. Therefore, the service life is influenced.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wastewater softening treatment, in particular to a semiconductor softening wastewater treatment process. Background Art

[0002] Semiconductor wastewater refers to wastewater containing various pollutants generated during the semiconductor manufacturing process. It mainly comes from multiple processes such as raw material processing, wafer preparation, cleaning, etching, electroplating, and grinding. Semiconductor wastewater has the following characteristics: complex composition, high pollution concentration, large pH value fluctuations, high toxicity and concentration volatility. Therefore, it needs to be treated before discharge so that the wastewater meets the discharge standards.

[0003] The process flow of semiconductor production wastewater treatment mainly includes the following steps: pretreatment, classification treatment, deep treatment, standard discharge or reuse. Among them, deep treatment includes an electrolytic treatment method. Electrolytic treatment can change the hardness of wastewater, converting sewage from hard water to soft water, avoiding eutrophication of water bodies and soil hardening when discharged into the external environment, affecting water quality and ecosystems, and even affecting human health. However, after a long period of electrolytic treatment, calcium hydroxide and magnesium hydroxide crystals, i.e. scale, are produced on the surface of the cathode plate in the electrolytic cell. If it is not cleaned in time, it will affect the normal use of the subsequent cathode plate. Traditional descaling methods include mechanical descaling and electrochemical descaling. Mechanical descaling uses mechanical force to clean the equipment and remove scale. This method does not require the use of any chemical reagents, so it has less impact on the environment. Electrochemical descaling uses electrochemical principles to decompose scale, which requires a higher level of technology and equipment. In order to reduce the cost of wastewater treatment, only mechanical descaling is used here. Mechanical descaling mainly includes: grinding wheel polishing, wire brush removal, high-pressure water jet cleaning, drill drilling and scraper scraping.

[0004] The traditional mechanical descaling method is to remove the electrolytic cell and the electrode plate after discharging the wastewater, and then descale and clean multiple electrode plates simultaneously. The operator's workload is large when removing the electrode plates. After descaling, the electrode plates need to be installed, which delays the normal use of the electrolytic cell. Mechanical descaling generally cleans the scale on the surface of all cathode plates at one time, causing some cathode plates with less scale on the surface to suffer greater wear in the process, thereby affecting their service life. Summary of the invention

[0005] In view of the above problems, the embodiment of the present application provides a semiconductor softening wastewater treatment process to solve the technical problems in the related art that the workload of operators is large during descaling and the service life of some cathode plates is affected by excessive polishing. In order to achieve the above purpose, the embodiment of the present application provides the following technical solutions.

[0006] A semiconductor softening wastewater treatment process according to an embodiment of the present application includes the following steps: S1. Pretreatment: First, the wastewater generated in the semiconductor manufacturing process is pretreated, and the pretreated wastewater is coagulated, precipitated and preliminarily filtered.

[0007] S2. Sedimentation and filtration: Add an oxidant to the wastewater after preliminary filtration for oxidation treatment and adjust the pH value, add a chemical precipitant to the wastewater to precipitate the heavy metal ions in the wastewater, and filter it again.

[0008] S3. Electrolytic treatment: The re-filtered wastewater is passed into an electrolytic cell for electrolytic treatment. During the electrolytic process, oxidation and reduction reactions occur at the anode and cathode, respectively, and calcium hydroxide and magnesium hydroxide crystals are produced on the surface of the cathode plate to soften the wastewater.

[0009] S4. Discharge waste water: discharge the waste water after electrolysis out of the equipment.

[0010] S5. Scrape off scale: Scrape off the scale produced on the surface of the cathode plate in the electrolytic cell used in S3.

[0011] The S5 step is completed by using an electrode plate scale treatment device, the scale treatment device includes a fixed unit and a scraping unit, the fixed unit is used in conjunction with the electrolytic cell, the scraping unit is arranged on the fixed unit for scraping scale on the surface of the electrode plate; the fixed unit includes a contact block, a clamping frame 1 and a clamping frame 1 are arranged on the contact block, a distance control cylinder is fixedly installed on the upper end of the contact block, and a moving block is fixedly installed on the telescopic end of the distance control cylinder; the scraping unit includes a control frame 1, a control frame 1 and a control frame 2 are arranged on the moving block, a closed frame is commonly arranged between the control frame 1 and the control frame 2, a filtration frame is fixedly installed on the upper end of the moving block, a scraping frame 1 is fixedly installed symmetrically on the moving block, and a scraping frame 2 is fixedly installed symmetrically on the front and back of the moving block.

[0012] According to an embodiment of the present invention, the clamping frame includes a bidirectional screw, a bidirectional screw in the left and right directions is rotatably connected to the contact block, the bidirectional screw is symmetrically connected to the clamping plate in a threaded connection, and a guide rod is symmetrically fixedly installed on the contact block front and back and slides left and right through the clamping plate.

[0013] According to an embodiment of the present invention, the clamping frame 1 includes a bidirectional screw 2, a bidirectional screw 2 in the front-to-back direction is rotatably connected on the contact block and located on the upper side of the bidirectional screw 1, the bidirectional screw 2 is symmetrically connected to the clamping plate 2 by a threaded connection in the front-to-back direction, and a guide rod 2 is fixedly installed on the contact block, and the guide rod 2 slides back and forth and passes through the clamping plate 2.

[0014] According to an embodiment of the present invention, the control frame 1 includes a bidirectional screw 3, a bidirectional screw 3 in left and right directions is rotatably connected to the moving block, the bidirectional screw 3 is symmetrically connected to the compensation plate 1 in a threaded manner, and a guide rod 3 is fixedly installed on the moving block symmetrically front and back, and the guide rod 3 slides left and right and penetrates the compensation plate 1.

[0015] According to an embodiment of the present invention, the control frame 2 includes a bidirectional screw rod 4, a bidirectional screw rod 4 in the front-to-back direction is rotatably connected to the moving block, the bidirectional screw rod 4 is symmetrically connected to the compensation plate 2 in a threaded manner in the front-to-back direction, and a guide rod 4 is fixedly installed symmetrically on the left-right direction of the moving block, and the guide rod 4 slides forward and backward and penetrates the compensation plate 2.

[0016] According to an embodiment of the present invention, the closed frame includes a right-angle plate, a compensation plate 1 is symmetrically connected to the right-angle plate in a front-to-back sliding fit manner, a cylindrical spring 1 is fixedly connected between the right-angle plate and the compensation plate 1, two right-angle plates opposite to each other on the left and right are connected to the corresponding compensation plate 2 in a left-right sliding fit manner, a cylindrical spring 2 is fixedly connected between the right-angle plate and the compensation plate 2, and rubber blocks are fixedly installed on the lower ends of the right-angle plate, the compensation plate 1 and the compensation plate 2.

[0017] According to an embodiment of the present invention, the filtration rack includes a filter tank, the filter tank is fixedly installed on the upper end of the movable block, conveying groups are symmetrically arranged on the left and right ends of the filter tank, the conveying group is composed of front-to-back symmetrical conveying pumps, conveying pipes are fixedly installed on the conveying pumps, drainage pipes are symmetrically fixedly installed on the left and right sides of the middle of the filter tank, a filter plate is fixedly installed on the inner end of the drainage pipe, and the ends of the conveying pipes are fixedly connected to the corresponding right-angle plates.

[0018] According to an embodiment of the present invention, the scraper frame 1 includes an electric push rod 1, on which the moving block is symmetrically fixedly installed with the electric push rod 1, the electric push rod 1 is located directly below the bidirectional screw rod 3, a vertical plate 1 is fixedly installed at the telescopic end of the electric push rod 1, a motor 1 is fixedly installed at the front end of the vertical plate 1 through a motor seat, a sprocket 1 is fixedly installed on the output shaft of the motor 1 through a coupling, two sprockets 2 arranged up and down are rotatably connected to the vertical plate 1, a sprocket 3 is fixedly installed at the front end of the upper sprocket 2, the sprocket 1 and the sprocket 3 are connected for transmission by a toothed chain belt 1, the sprockets 2 are connected for transmission by a toothed chain belt 2, and scrapers are evenly fixedly installed on the toothed chain belt 2. The structure of the scraper frame 2 is the same as that of the scraper frame 1, and only the size is different.

[0019] According to an embodiment of the present invention, anti-blocking grooves are provided on the vertical plate one and above and below the toothed chain belt two. Positioning blocks are symmetrically connected to the anti-blocking grooves through pin shafts. A cleaning column brush is connected to the positioning blocks through a common rotation. A torsion spring is sleeved on the pin shaft. One end of the torsion spring is fixedly connected to the positioning block, and the other end of the torsion spring is fixedly connected to the vertical plate one.

[0020] According to an embodiment of the present invention, a winding column is rotatably connected to one side of the compensation plate one and close to the two adjacent right-angle plates, and a winding column is rotatably connected to one side of the compensation plate two and close to the two adjacent right-angle plates. A plastic film is wound around the winding column, and the end of the plastic film is fixedly connected to the adjacent right-angle plates. A spiral spring is fixedly installed on the compensation plate one and the compensation plate two near the winding column, and the end of the spiral spring is fixedly connected to the winding column.

[0021] It can be seen from the above technical solutions that the present invention has the following advantages:

[0022] 1. The present invention can be used alone or in combination with acid. First, the acid is used to spray the surface of the cathode plate in the electrolytic cell for reaction. After a period of time, the scale is loosened or even separated from the cathode plate. At this time, a semi-enclosed space with an opening upward is formed by the closed frame and the bottom of the electrolytic cell. In the semi-enclosed space, the scraper frame 1 cooperates with the scraper frame 2 to perform descaling on the left and right end surfaces of the cathode plate through the scraper frame. At the same time, the scraper frame 2 stirs the scale particles in the semi-enclosed space, the scraper frame 1 is returned to the initial position, and then the scraper frame 2 performs descaling on the front and rear end surfaces of the cathode plate. At the same time, the scraper frame 1 and the semi-enclosed space are used to remove the scale particles in the semi-enclosed space. The scale particles in the space are stirred to ensure the filtration effect of the filter rack. During the whole descaling process, the water and scale particles in the semi-enclosed space are extracted and filtered by the filter rack, and the filtered wastewater is discharged to the rest of the electrolytic cell through the filter rack. During the whole descaling process, there is no need to disassemble the electrolytic cell and the plate for cleaning, which reduces the workload of the operator during descaling and the time for delaying the normal use of the electrolytic cell. In addition, the scale on the surface of a single cathode plate can be cleaned as needed to avoid simultaneous cleaning of the scale on the surface of all cathode plates, which may cause greater wear on some cathode plates with less scale on the surface, thereby affecting their service life.

[0023] 2. In the present invention, the first scraper frame cooperates with the second scraper frame, when one of them is scraping off the scale, the other one is stirring the scale, so as to prevent the phenomenon of large-scale precipitation of scale particles and ensure the filtration effect of the filtration frame.

[0024] 3. In the present invention, the scale attached to the surface of the scraper is cleaned by the cleaning column brush, and the unstressed cleaning column brush is driven by the torsion spring to return to the initial position, so as to facilitate the cleaning of the scale attached to the surface of the next scraper.

[0025] 4. In the present invention, the plastic film is always kept in a tensioned state by means of a spiral spring, so as to adapt the distance between the right-angle plate and the compensation plate one and between the right-angle plate and the compensation plate two, thereby preventing scale particles in the semi-enclosed space from entering the electrolytic cell through the semi-enclosed space. By extracting and filtering the scale particles in the semi-enclosed space, it is prevented that the suspended scale particles flow into the electrolytic cell again and become clogged on the electrode plates.

[0026] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by a semiconductor softening wastewater treatment process provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0028] Figure 1 A diagram showing the treatment process of semiconductor wastewater in a scale treatment facility.

[0029] Figure 2 A schematic diagram of the main stereoscopic structure of the scale treatment device when in use is shown.

[0030] Figure 3 A left-side stereoscopic structural schematic diagram of the scale treatment device when in use is shown.

[0031] Figure 4 A schematic diagram of the main cross-sectional plan structure of the filter plate and the distance-controlling cylinder is shown.

[0032] Figure 5 Shows Figure 4 A local enlarged view of point M.

[0033] Figure 6 Shows Figure 4 A local enlarged view of point E.

[0034] Figure 7 A left-side perspective structural diagram of a scale treatment equipment removal enclosure is shown.

[0035] Figure 8 Shows Figure 7 A local enlarged view of location N.

[0036] Fig. 9 A schematic diagram of the main stereoscopic structure of a scale treatment equipment removal enclosure is shown.

[0037] Fig.10 A schematic diagram of the top view and cross-section structure of the compensation plate 1, the compensation plate 2 and the right-angle plate is shown.

[0038] The above drawings include the following reference numerals:

[0039] 1. Fixed unit; 11. Contact block; 12. Clamping frame 1; 121. Bidirectional screw 1; 122. Clamping plate 1; 123. Guide rod 1; 13. Clamping frame 1; 131. Bidirectional screw 2; 132. Clamping plate 2; 133. Guide rod 2; 14. Distance control cylinder; 15. Moving block; 2. Scraping unit; 21. Control frame 1; 211. Bidirectional screw 3; 212. Compensation plate 1; 213. Guide rod 3; 22. Control frame 2; 221. Bidirectional screw 4; 222. Compensation plate 2; 223. Guide rod 4; 23. Closing frame; 231. Right angle plate; 2311. Winding column; 2312. Plastic film; 2313, scroll spring; 232, cylindrical spring one; 233, cylindrical spring two; 234, rubber block; 24, filter rack; 241, filter tank; 242, delivery pump; 243, delivery pipe; 244, drain pipe; 245, filter plate; 25, scraper rack one; 251, electric push rod one; 252, vertical plate one; 2521, anti-blocking groove; 2522, positioning block; 2523, cleaning column brush; 2524, torsion spring; 253, motor one; 254, sprocket one; 255, sprocket two; 256, sprocket three; 257, toothed chain belt one; 258, toothed chain belt two; 259, scraper; 26, scraper rack two. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0041] See also Figure 1 , Figure 2 and Figure 4 , a semiconductor softening wastewater treatment process, comprising the following steps: S1, pretreatment: first pre-treat the wastewater generated in the semiconductor manufacturing process, and perform coagulation sedimentation and preliminary filtration on the pre-treated wastewater.

[0042] S2. Sedimentation and filtration: Add an oxidant to the wastewater after preliminary filtration for oxidation treatment and adjust the pH value, add a chemical precipitant to the wastewater to precipitate the heavy metal ions in the wastewater, and filter it again.

[0043] S3. Electrolytic treatment: The re-filtered wastewater is passed into an electrolytic cell for electrolytic treatment. During the electrolytic process, oxidation and reduction reactions occur at the anode and cathode, respectively, and calcium hydroxide and magnesium hydroxide crystals are produced on the surface of the cathode plate to soften the wastewater.

[0044] S4. Discharge waste water: discharge the waste water after electrolysis out of the equipment.

[0045] S5. Scrape off scale: Scrape off the scale produced on the surface of the cathode plate in the electrolytic cell used in S3.

[0046] The step S5 is completed by using an electrode plate scale treatment device, the scale treatment device includes a fixed unit 1 and a scraper unit 2, the fixed unit 1 is used in conjunction with the electrolytic cell, the scraper unit 2 is arranged on the fixed unit 1 for scraping scale on the surface of the electrode plate; the fixed unit 1 includes a contact block 11, the contact block 11 is provided with a clamping frame 12 and a clamping frame 13, the upper end of the contact block 11 is fixedly installed with a distance control cylinder 14, and the telescopic end of the distance control cylinder 14 is fixedly installed with a moving block 15; the scraper unit 2 includes a control frame 1 21, the moving block 15 is provided with a control frame 1 21 and a control frame 2 22, the control frame 1 21 and the control frame 1 22 are connected to each other. A closed frame 23 is provided between the frame 22, a filtration frame 24 is fixedly installed on the upper end of the moving block 15, a scraping frame 25 is fixedly installed symmetrically on the moving block 15, and a scraping frame 26 is fixedly installed symmetrically on the front and back of the moving block 15; when there is a lot of scale on the surface of a cathode plate in the electrolytic cell, firstly, an acid solution is used to spray the surface of the cathode plate in the electrolytic cell for reaction, and after a period of time, the scale and the cathode plate are loosened or even separated, and then the contact block 11 is placed on the cathode plate to be scraped off by using a lifting device, and at this time, the clamping frame 12 and the clamping frame 13 are adjusted by a motor so that the contact block 11 is located in the middle of the upper end of the cathode plate and is in contact with the cathode plate. At this time, according to the size of the cathode plate, the control frame 1 21 and the control frame 2 22 are adjusted, thereby adjusting the size of the closed frame 23, so that the internal space size of the closed frame 23 is larger than the size of the cathode plate. At this time, the moving block 15 is driven downward by the distance control cylinder 14, thereby driving the scraper frame 1 25 and the scraper frame 2 26 and the closed frame 23 to move downward together, until the closed frame 23 and the bottom of the electrolytic cell form a semi-enclosed space with an opening upward, and water is introduced into the semi-enclosed space. At this time, the scraper frame 1 25 is used to descale the left and right end surfaces of the cathode plate, and the scraper frame 1 25 is restored to its initial position, and then the front of the cathode plate is descaled by the scraper frame 26. The two end surfaces are descaled, and the scraper frame 25 continues to move to stir the water and scale particles in the semi-enclosed space to prevent the scale particles from settling in large quantities. During the entire descaling process, the water and scale particles in the semi-enclosed space are extracted and filtered by the filter frame 24, and the filtered water is discharged into the electrolytic cell through the filter frame 24. The residual acid in the water is used to pickle the surfaces of other cathode plates to loosen or even separate the cathode plates with less scale on the surface from the scale on their surfaces. Then, the scale on the surface of the cathode plates is washed through the process of drainage and water circulation, so that the surfaces of the remaining cathode plates with less scale on the surface do not need to be scraped, thereby reducing surface wear.

[0047] See also Figure 7 and Fig. 9 The clamping frame 12 includes a bidirectional screw 121, and the contact block 11 is rotatably connected with a bidirectional screw 121 in the left and right directions. The bidirectional screw 121 is symmetrically connected to a clamping plate 122 in a threaded connection manner. A guide rod 123 is fixedly installed on the contact block 11 symmetrically in front and back, and the guide rod 123 slides left and right and penetrates the clamping plate 122; the bidirectional screw 121 is rotated to drive the clamping plate 122 to squeeze and fix the left and right ends of the cathode plate.

[0048] See also Figure 7 The clamping frame 13 includes a bidirectional screw 131, and a bidirectional screw 131 is rotatably connected to the contact block 11 and located on the upper side of the bidirectional screw 121 in the front-to-back direction. The bidirectional screw 131 is symmetrically connected to the clamping plate 132 by threaded connection, and a guide rod 133 is fixedly installed on the contact block 11 and slides forward and backward and penetrates the clamping plate 132; the bidirectional screw 131 is rotated to drive the clamping plate 132 to squeeze and fix the front and rear ends of the cathode plate.

[0049] See also Figure 3 , Figure 6 and Fig.10 The control frame 21 includes a bidirectional screw rod 3 211, and the moving block 15 is rotatably connected with the bidirectional screw rod 3 211 in the left and right directions. The bidirectional screw rod 3 211 is symmetrically connected to the compensation plate 1 212 in a threaded connection manner. The moving block 15 is symmetrically fixed with a guide rod 3 213 front and back. The guide rod 3 213 slides left and right and penetrates the compensation plate 1 212; according to the length of the cathode plate, the compensation plate 1 212 is driven to move by rotating the bidirectional screw rod 3 211 to adjust the distance between the compensation plates 1 212.

[0050] See also Figure 3 and Fig.10 The control frame 22 includes a bidirectional screw rod 4 221, and the moving block 15 is rotatably connected with the bidirectional screw rod 4 221 in the front-to-back direction. The bidirectional screw rod 4 221 is symmetrically connected to the compensation plate 222 in a threaded connection manner. The moving block 15 is symmetrically fixed with a guide rod 4 223, and the guide rod 4 223 slides forward and backward to penetrate the compensation plate 222; according to the width of the cathode plate, the compensation plate 222 is driven to move by rotating the bidirectional screw rod 4 221 to adjust the distance between the compensation plates 222.

[0051] See also Fig.10The closed frame 23 includes a right-angle plate 231, each compensation plate 1 212 is connected to the right-angle plate 231 in a front-to-back sliding manner, and a cylindrical spring 1 232 is fixedly connected between the right-angle plate 231 and the compensation plate 1 212. The two right-angle plates 231 opposite to each other on the left and right are connected to the corresponding compensation plate 222 in a left-right sliding manner, and a cylindrical spring 233 is fixedly connected between the right-angle plate 231 and the compensation plate 222. The lower ends of the plate 1 212 and the compensation plate 222 are fixedly mounted with rubber blocks 234; the rubber blocks 234 make the right-angle plate 231, the compensation plate 1 212 and the compensation plate 222 all closely adhere to the bottom of the electrolytic cell to prevent the scraped scale from entering the rest of the electrolytic cell from the closing frame 23; the cylindrical spring 1 232 cooperates with the cylindrical spring 233 to balance the forces between the right-angle plate 231 and the compensation plate 1 212 and between the right-angle plate 231 and the compensation plate 222.

[0052] See also Figure 3 and Figure 4 The filtration frame 24 includes a filter tank 241, the filter tank 241 is fixedly installed on the upper end of the moving block 15, and conveying groups are symmetrically arranged on the left and right ends of the filter tank 241. The conveying group is composed of a conveying pump 242 that is symmetrical in front and back. A conveying pipe 243 is fixedly installed on the conveying pump 242. A drain pipe 244 is symmetrically fixedly installed on the left and right sides of the middle of the filter tank 241. A filter plate 245 is fixedly installed on the inner end of the drain pipe 244. The ends of the conveying pipe 243 are fixedly connected to the corresponding right-angle plate 231; scale particles and wastewater are sucked into the filter tank 241 together through the conveying pump 242, and the filtered wastewater is sent to the electrolytic cell through the filter plate 245 and the drain pipe 244, and the scale remains in the filter tank 241.

[0053] See also Figure 5 , Figure 7 and Fig. 9 The scraper frame 25 includes an electric push rod 251, and the moving block 15 is symmetrically fixed with the electric push rod 251. The electric push rod 251 is located directly below the bidirectional screw rod 3 211. A vertical plate 252 is fixedly installed at the telescopic end of the electric push rod 251. A motor 253 is fixedly installed at the front end of the vertical plate 252 through a motor seat. A sprocket 254 is fixedly installed on the output shaft of the motor 253 through a coupling. Two sprockets 255 arranged up and down are rotatably connected to the vertical plate 252. A sprocket 3 256 is fixedly installed at the front end of the sprocket 255 on the upper side. The sprocket 1 254 and the sprocket 3 256 are connected by a toothed chain belt 257 for transmission, and the sprockets 255 are connected by a toothed chain belt 258 for transmission. Scrapers 259 are evenly fixedly installed on the toothed chain belt 258. The structure of the scraper frame 26 is the same as that of the scraper frame 25, and only the size is different.

[0054] The motor 1 253 drives the sprocket 1 254 to rotate, and with the cooperation of the toothed chain belt 1 257, the sprocket 255 rotates, and with the cooperation of the toothed chain belt 258, the sprockets 255 on the upper and lower sides rotate synchronously, thereby driving the scraper 259 on the toothed chain belt 258 to move, and the electric push rod 1 251 drives the vertical plate 1 252 to move toward the cathode plate, thereby driving the scraper 259 to move toward the scale on the left and right sides of the cathode plate and contact it, thereby scraping off the scale, and at the same time the scraper frame 26 starts The scale particles in the semi-enclosed space with an opening upward formed by the closed frame 23 and the bottom of the electrolytic cell are stirred. When the scraper frame 26 is needed to scrape the scale on the surfaces of the front and rear sides of the cathode plate, the vertical plate 252 is driven by the electric push rod 1 251 to move toward the side away from the cathode plate, and the toothed chain belt 258 continues to move, thereby stirring the scale particles in the semi-enclosed space with an opening upward formed by the closed frame 23 and the bottom of the electrolytic cell, so as to prevent them from settling in large quantities and affecting the filtration effect of the filtration frame 24.

[0055] See also Figure 5 and Figure 8 , the vertical plate 1 252 and above and below the toothed chain belt 258 are provided with anti-blocking grooves 2521, and positioning blocks 2522 are symmetrically connected to the anti-blocking grooves 2521 through a pin shaft, and a cleaning column brush 2523 is connected to the positioning blocks 2522 for common rotation, and a torsion spring 2524 is sleeved on the pin shaft, one end of the torsion spring 2524 is fixedly connected to the positioning block 2522, and the other end of the torsion spring 2524 is fixedly connected to the vertical plate 1 252; when the scraper When the scraper 259 moves into the anti-blocking groove 2521, the scraper 259 first contacts the cleaning column brush 2523, and the cleaning column brush 2523 cleans the scale attached to the surface of the scraper 259. When the scraper 259 continues to move, the cleaning column brush 2523 encounters resistance, driving the positioning block 2522 to rotate. After the scraper 259 smoothly moves out of the anti-blocking groove 2521, the cleaning column brush 2523 returns to its initial position driven by the torsion spring 2524.

[0056] See also Figure 6 and Fig.10 A winding column 2311 is rotatably connected on the compensation plate 1 212 and on one side close to the two adjacent right-angle plates 231, and on the compensation plate 222 and on one side close to the two adjacent right-angle plates 231, a plastic film 2312 is wound and rolled up on the winding column 2311, and the end of the plastic film 2312 is fixedly connected to the adjacent right-angle plates 231, and a spiral spring 2313 is fixedly installed on the compensation plate 1 212 and the compensation plate 222 near the winding column 2311, and the end of the spiral spring 2313 is fixedly connected to the winding column 2311; the plastic film 2312 is always in a tensioned state through the spiral spring 2313, so as to adapt the distance between the right-angle plate 231 and the compensation plate 1 212 and between the right-angle plate 231 and the compensation plate 222.

[0057] In the description of the present invention, it is necessary to understand that the terms "center", "middle", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "end", "axial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0058] In addition, the terms "first", "second", "number one", "number two", "one", "two" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. In the description of the present invention, "multiple" means at least two, such as two, three, etc., unless otherwise clearly and specifically limited.

[0059] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, a sliding connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor softening wastewater treatment process, characterized in that , including the following steps: S1. Pretreatment: First, the wastewater generated in the semiconductor manufacturing process is pretreated, and the pretreated wastewater is coagulated, precipitated and initially filtered; S2, precipitation filtration: adding an oxidant to the wastewater after preliminary filtration for oxidation treatment and adjusting the pH value, adding a chemical precipitant to the wastewater to precipitate the heavy metal ions in the wastewater, and filtering again; S3, electrolytic treatment: the re-filtered wastewater is passed into an electrolytic cell for electrolytic treatment. During the electrolytic process, oxidation and reduction reactions occur at the anode and cathode, respectively, and calcium hydroxide and magnesium hydroxide crystals are generated on the surface of the cathode plate to soften the wastewater; S4. Discharge wastewater: discharge the wastewater after electrolysis from the equipment; S5. Scraping off scale: Scraping off scale generated on the surface of the cathode plate in the electrolytic cell used in S3; The step S5 is completed by using an electrode plate scale treatment device, the scale treatment device comprising a fixing unit (1) and a scraping unit (2), the fixing unit (1) is used in conjunction with the electrolytic cell, and the scraping unit (2) is arranged on the fixing unit (1) and is used to scrape off scale on the surface of the electrode plate; The fixing unit (1) comprises a contact block (11), a clamping frame (12) and a clamping frame (13) are arranged on the contact block (11), a distance control cylinder (14) is fixedly mounted on the upper end of the contact block (11), and a moving block (15) is fixedly mounted on the telescopic end of the distance control cylinder (14); The scraping unit (2) comprises a control frame 1 (21), a control frame 1 (21) and a control frame 2 (22) are arranged on the moving block (15), a closed frame (23) is arranged between the control frame 1 (21) and the control frame 2 (22), a suction filter frame (24) is fixedly mounted on the upper end of the moving block (15), a scraping frame 1 (25) is fixedly mounted on the moving block (15) in a symmetrical manner on the left and right, and a scraping frame 2 (26) is fixedly mounted on the moving block (15) in a symmetrical manner on the front and back; The scraper frame (25) comprises an electric push rod (251), the moving block (15) is symmetrically fixedly installed with the electric push rod (251), the telescopic end of the electric push rod (251) is fixedly installed with a vertical plate (252), the front end of the vertical plate (252) is fixedly installed with a motor (253) through a motor seat, the output shaft of the motor (253) is fixedly installed with a sprocket (254) through a coupling, and the vertical plate (252) is rotatably connected with two upper and lower The sprocket wheel 2 (255) is arranged, and the front end of the upper sprocket wheel 2 (255) is fixedly installed with a sprocket wheel 3 (256). The sprocket wheel 1 (254) and the sprocket wheel 3 (256) are connected to each other through a toothed chain belt 1 (257). The sprocket wheels 2 (255) are connected to each other through a toothed chain belt 2 (258). A scraper (259) is evenly fixedly installed on the toothed chain belt 2 (258). The structure of the scraper frame 2 (26) is the same as that of the scraper frame 1 (25), and only the size is different.

2. A semiconductor softening wastewater treatment process according to claim 1, characterized in that: The clamping frame (12) comprises a bidirectional screw (121), the contact block (11) is rotatably connected to the bidirectional screw (121) in the left and right directions, the bidirectional screw (121) is symmetrically connected to the clamping plate (122) in a threaded manner, and the contact block (11) is symmetrically fixed with a guide rod (123) in the front and rear directions, and the guide rod (123) slides left and right and penetrates the clamping plate (122).

3. A semiconductor softening wastewater treatment process according to claim 1, characterized in that: The clamping frame (13) comprises a bidirectional screw (131) which is rotatably connected to the contact block (11) and located on the upper side of the bidirectional screw (121) in the front-to-back direction. The bidirectional screw (131) is symmetrically connected to the clamping plate (132) by means of a threaded connection. A guide rod (133) which is fixedly mounted on the contact block (11) and slides through the clamping plate (132) in the front-to-back direction is fixedly mounted on the contact block (11).

4. A semiconductor softening wastewater treatment process according to claim 1, characterized in that: The control frame (21) comprises a bidirectional screw rod (211), an electric push rod (251) is located directly below the bidirectional screw rod (211), the moving block (15) is rotatably connected to the bidirectional screw rod (211) in the left and right directions, the bidirectional screw rod (211) is symmetrically connected to the compensation plate (212) in a threaded connection, and the moving block (15) is symmetrically fixedly installed with a guide rod (213) in a front-to-back direction, and the guide rod (213) slides left and right and penetrates the compensation plate (212).

5. A semiconductor softening wastewater treatment process according to claim 4, characterized in that: The control frame 2 (22) comprises a bidirectional screw rod 4 (221), the moving block (15) is rotatably connected with the bidirectional screw rod 4 (221) in the front-to-back direction, the bidirectional screw rod 4 (221) is symmetrically connected to the compensation plate 2 (222) in a threaded connection manner, and the moving block (15) is symmetrically fixedly mounted with a guide rod 4 (223), and the guide rod 4 (223) slides forward and backward and penetrates the compensation plate 2 (222).

6. A semiconductor softening wastewater treatment process according to claim 4, characterized in that: The closed frame (23) comprises a right-angle plate (231), the compensation plate 1 (212) is connected to the right-angle plate (231) in a front-to-rear symmetrical manner in a front-to-rear sliding fit, a cylindrical spring 1 (232) is fixedly connected between the right-angle plate (231) and the compensation plate 1 (212), two right-angle plates (231) opposite to each other on the left and right are connected to the corresponding compensation plate 2 (222) in a left-right sliding fit, a cylindrical spring 2 (233) is fixedly connected between the right-angle plate (231) and the compensation plate 2 (222), and a rubber block (234) is fixedly installed at the lower ends of the right-angle plate (231), the compensation plate 1 (212) and the compensation plate 2 (222).

7. A semiconductor softening wastewater treatment process according to claim 6, characterized in that: The filtration frame (24) comprises a filter tank (241), the filter tank (241) is fixedly mounted on the upper end of the moving block (15), conveying groups are symmetrically arranged at the left and right ends of the filter tank (241), the conveying groups are composed of front and rear symmetrical conveying pumps (242), conveying pipes (243) are fixedly mounted on the conveying pumps (242), drainage pipes (244) are symmetrically fixedly mounted on the left and right sides of the middle of the filter tank (241), a filter plate (245) is fixedly mounted on the inner end of the drainage pipe (244), and the ends of the conveying pipes (243) are fixedly connected to the corresponding right-angle plates (231).

8. The semiconductor softening wastewater treatment process according to claim 1, characterized in that: Anti-blocking grooves (2521) are provided on the vertical plate 1 (252) and above and below the toothed chain belt 2 (258); positioning blocks (2522) are symmetrically connected to the anti-blocking grooves (2521) through a pin shaft, and a cleaning column brush (2523) is connected to the positioning blocks (2522) for rotation; a torsion spring (2524) is sleeved on the pin shaft, one end of the torsion spring (2524) is fixedly connected to the positioning block (2522), and the other end of the torsion spring (2524) is fixedly connected to the vertical plate 1 (252).

9. A semiconductor softening wastewater treatment process according to claim 6, characterized in that: A winding column (2311) is rotatably connected on one side of the compensation plate 1 (212) and close to the two adjacent right-angle plates (231) and on one side of the compensation plate 2 (222) and close to the two adjacent right-angle plates (231), a plastic film (2312) is wound and rolled on the winding column (2311), the end of the plastic film (2312) is fixedly connected to the adjacent right-angle plates (231), and a spiral spring (2313) is fixedly installed on the compensation plate 1 (212) and the compensation plate 2 (222) near the winding column (2311), and the end of the spiral spring (2313) is fixedly connected to the winding column (2311).

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