Shielding device, electroplating equipment and control method of electroplating equipment

Abstract

The invention discloses a shielding device, electroplating equipment and a control method of the electroplating equipment, the shielding device is arranged in an electroplating cavity and located below a wafer, and the shielding device comprises a bearing part; the shielding plate is arranged on the bearing part and is used for shielding the flat edge structure of the wafer; the number of the sensors is two, the two sensors are electrically connected with each other, are arranged on the bearing part and are used for identifying the flat edge structure in the wafer, and the connecting surface of the two sensors is parallel to the flat edge of the flat edge structure. The flat edge structure of the wafer and the shielding plate can be accurately aligned, and the shielding effect of the shielding plate is realized to the maximum extent, so that the electroplating effect and the product quality of the wafer are improved. Meanwhile, the shielding device is simple in structure, convenient to operate, high in reliability and suitable for protecting flat edge structures in the electroplating industry.

Description

Technical Field

[0001] The present invention relates to the field of wafer preparation, and in particular to a shielding device, electroplating equipment and a control method thereof. Background Art

[0002] When it comes to electroplating in the field of wafer preparation, the plating head will drive the wafer into the electroplating chamber for electroplating. Since there is a flat-edge structure on the wafer, the wafer will be affected by many factors during electroplating due to electric field differentiation and other reasons. Therefore, the prior art generally sets a shielding plate in the plating solution of the electroplating chamber, that is, the shielding plate is set under the wafer to ensure the quality and accuracy of the flat-edge wafer during electroplating. However, during the electroplating process of the wafer, the shielding plate cannot shield the wafer, that is, the electroplating quality of the wafer cannot be guaranteed.

[0003] Therefore, the above problems need to be solved urgently. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the defect in the prior art that the shielding plate cannot shield the wafer, and to provide a shielding device, an electroplating device and a control method thereof.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] A shielding device is provided in an electroplating chamber and below a wafer, and comprises:

[0007] bearing member;

[0008] A shielding plate, arranged on the carrier and used for shielding the flat edge structure of the wafer;

[0009] The sensor is two in number, the two sensors are electrically connected to each other and are both arranged on the carrier, and are used to identify the flat edge structure in the wafer, wherein the connection surfaces of the two sensors are parallel to the flat edges of the flat edge structure.

[0010] In this technical solution, two sensors are arranged on a carrier that can move up and down in the electroplating chamber, so that the carrier can drive the two sensors to follow the position of the wafer, and then the two sensors can accurately identify the flat edge structure of the wafer to ensure that the flat edge structure of the wafer and the shielding plate can be accurately aligned, maximizing the shielding effect of the shielding plate, thereby improving the electroplating effect of the wafer and the product quality. At the same time, the shielding device has a simple structure, easy operation, high reliability, and is suitable for flat edge structure protection in the electroplating industry.

[0011] Preferably, the shielding device also includes a power sensor arranged on the carrier and a driving member connected to the power sensor, and the driving member drives the power sensor to drive the carrier to move along the central axis direction of the shielding device toward a side close to the wafer.

[0012] In this technical solution, this structural form is adopted, and the driving member can realize the movement of the bearing member in the vertical direction according to the power sensor on the control bearing member, and through the control of the driving member, the bearing member can accurately and smoothly move along the central axis direction of the shielding device, so as to realize the alignment of the flat edge structure of the wafer and the shielding plate more quickly, and improve the positioning efficiency of the shielding device. In addition, the range, position and movement speed of the bearing member can be controlled by the driving member, and the bearing member can be flexibly adjusted, which enhances the flexibility of the use of the shielding device.

[0013] Preferably, the shielding plate includes a shielding flat edge parallel to the flat edge of the flat edge structure, and the two sensors are arranged on both ends of the shielding flat edge.

[0014] In the present technical solution, this structural form is adopted. This design enables the two sensors to accurately sense and identify the position of the shielding flat edge, and one of the sensors can receive the signal sent by the other sensor to ensure that the flat edge in the wafer flat edge structure and the shielding flat edge on the shielding plate can be accurately aligned, thereby improving the quality and consistency of wafer electroplating.

[0015] Preferably, along the central axis direction of the shielding device, the horizontal plane where the two sensors are located is higher than the horizontal plane where the shielding plate is located.

[0016] In the present technical solution, by adopting this structural form, when positioning the flat edge structure of the wafer, it is possible to more accurately and quickly identify whether the two are aligned.

[0017] Preferably, the shielding device further comprises a support member arranged below the bearing member along the central axis direction of the shielding device and parallel to the bearing member, a power sensor and a driving member connected to the power sensor, wherein the driving member is arranged on the support member.

[0018] In the present technical solution, this structural form is adopted. On the one hand, the supporting member can be used to effectively support, carry and balance the carrier. On the other hand, the driving member can better drive the carrier to move in the vertical direction, thereby improving the efficiency of the driving member driving the carrier, thereby increasing the speed of aligning the flat edge structure of the wafer and the shielding plate, and improving the positioning efficiency of the shielding device.

[0019] Preferably, along the central axis direction of the shielding device, the cross-sectional dimension of the support member is not less than the cross-sectional dimension of the bearing member.

[0020] In the present technical solution, this structural form is adopted to increase the contact area of ​​the supporting member supporting the bearing member, which can achieve more effective support for the bearing member, thereby making the overall structure of the shielding device more stable and ensuring the normal operation of the shielding device.

[0021] An electroplating device comprises a plating head and the shielding device as described above, and an electroplating chamber which accommodates the shielding device and provides an electroplating environment for the wafer.

[0022] In the present technical solution, by adding the above-mentioned shielding device for shielding the wafer under the plating head, the wafer can be better shielded to avoid problems such as electric field differentiation when the wafer is electroplated in the plating chamber.

[0023] Preferably, a positioning hole is provided on the plating head, and a positioning column adapted to the positioning hole is provided on the surface of the side of the carrier close to the wafer, and both the positioning column and the positioning hole have magnetic attraction properties, so that the positioning column and the positioning hole can attract each other.

[0024] In the present technical solution, this structural form is adopted, so that when the plating head drives the wafer to the range where they can be connected to each other, the positioning column and the positioning hole with magnetic attraction can automatically attract each other, so that the carrier can be connected to the plating head and rotate with the plating head to achieve the shielding effect, and the magnetic attraction positioning can quickly and accurately locate the position between the plating head and the carrier. This efficient positioning method can improve the efficiency of electroplating and reduce the problems such as the pause time caused by assembly and adjustment. In addition, the magnetic attraction of the positioning column and the positioning hole can provide stable fixing performance. This magnetic attraction can maintain a firm connection between the positioning column and the positioning hole, and no relative displacement will occur during the electroplating process, preventing the carrier from detaching from the plating head.

[0025] Preferably, a positioning hole is provided on the plating head, a positioning column matched with the positioning hole is provided on a surface of one side of the carrier close to the wafer, and an electromagnetic adsorption coil is provided inside the positioning hole and the positioning column.

[0026] A positioning laser for detecting the distance between the positioning hole and the positioning post is provided on the wall surface of the electroplating chamber and close to the positioning post. The positioning laser is electrically connected to the positioning post and / or the positioning hole.

[0027] In the present technical solution, this structural form is adopted. By providing a positioning hole on the plating head and a positioning column adapted thereto on the carrier, electromagnetic induction can be generated between the positioning column and the positioning hole by energizing the electromagnetic adsorption coil, so that they can attract and adsorb each other and maintain the connection between the positioning column and the positioning hole, thereby providing a stable connection. At the same time, a positioning laser for detecting the distance and position between the positioning hole and the positioning column is provided at a position close to the positioning column on the wall of the electroplating chamber, so that the precise distance between the positioning hole and the positioning column can be measured. When the distance between the plating head and the carrier is close to the range in which the two can be connected, the positioning laser provides a feedback signal to the positioning column and the positioning hole, and energizes the electromagnetic adsorption coils inside the two, thereby realizing a fixed connection between the carrier and the plating head, so that the carrier rotates with the plating head, thereby realizing the shielding effect of the shielding plate on the carrier. This arrangement not only improves the accuracy and consistency of positioning between the plating head and the carrier, but also reduces the complexity of manual operation through the automated operation of the electroplating equipment, automated position positioning and automatic connection, and improves the efficiency of the connection between the two, thereby improving the overall work efficiency of the electroplating equipment.

[0028] Preferably, first permanent magnets are arranged on the carrier and in sequence along the circumferential direction of the carrier, and a plurality of first electromagnetic coils for controlling the movement of the carrier through the first permanent magnets are provided on the wall surface of the electroplating chamber close to the first permanent magnets, and the currents of adjacent first electromagnetic coils are opposite.

[0029] In the present technical solution, this structural form is adopted, and the currents of the adjacent first electromagnetic coils are opposite to each other and can generate a magnetic field to generate a magnetic force on the first permanent magnet. This force can control the movement of the carrier, so that the carrier can move to the side close to the plating head, even if it is suspended, so that the carrier can rotate with the wafer, so as to realize the function of the flat edge structure of the baffle plate in the carrier to shield the wafer. This configuration can realize precise control of the carrier, so that it moves along a specific path in the electroplating chamber. In addition, by controlling the current size and direction of the first electromagnetic coil, the size and direction of the applied force can be adjusted, thereby further optimizing the movement trajectory of the carrier during the electroplating process.

[0030] Preferably, the electroplating equipment further comprises a flow equalizer plate arranged below the shielding device along the central axis direction of the shielding device.

[0031] In the present technical solution, this structural form is adopted by adding a uniform flow plate to stir the plating liquid during operation to eliminate bubbles generated by fluctuations, so as to eliminate the adverse effects of bubbles, so that the plating liquid flows at an appropriate speed in the plating tank, creating the optimal working reaction environment for wafer electroplating.

[0032] Preferably, second permanent magnets are arranged on the flow plate and in sequence along the circumferential direction of the flow plate, and a plurality of second electromagnetic coils for controlling the movement of the flow plate through the second permanent magnets are provided on the wall surface of the electroplating chamber close to the second permanent magnets, and the currents of adjacent second electromagnetic coils are opposite.

[0033] In the present technical solution, this structural form is adopted, and the currents of the adjacent second electromagnetic coils are opposite to each other and can generate a magnetic field to generate a magnetic force on the second permanent magnet. This force can control the movement of the flow plate, so that the flow plate can be suspended in the plating solution to stir the plating solution, so as to eliminate the adverse effects of bubbles, so that the plating solution flows at a suitable speed in the plating tank, and creates the best working reaction environment for wafer electroplating. This configuration can achieve precise control of the flow plate, so that it moves along a specific path in the plating chamber. In addition, by controlling the current size and direction of the second electromagnetic coil, the size and direction of the applied force can be adjusted, thereby further optimizing the movement trajectory of the flow plate during the electroplating process.

[0034] A control method for electroplating equipment, the control method for electroplating equipment is used to control the electroplating equipment described above, and the control method for electroplating equipment comprises the following steps:

[0035] The plating head drives the wafer to move toward the plating chamber;

[0036] When one of the sensors receives a signal sent by another sensor, the flat edge structure of the wafer is positioned;

[0037] When one of the sensors does not receive the signal sent by the other sensor, the plating head drives the wafer to rotate. When one of the sensors receives the signal sent by the other sensor, the flat edge structure of the wafer is positioned.

[0038] Through the above control method, the wafer and the shielding plate can be accurately positioned during the electroplating process, so that the wafer can be prevented from being affected by the electric field differentiation during the electroplating process, the quality of wafer electroplating can be guaranteed, and the electroplating effect can be improved. At the same time, through the positioning method recognized by the sensor, the position of the wafer can be accurately identified and quickly adjusted, improving the accuracy of the electroplating equipment and the electroplating quality.

[0039] Preferably, before positioning the flat edge structure of the wafer, the following steps are also included:

[0040] The driving member drives the bearing member to move along the central axis of the shielding device toward a side close to the wafer.

[0041] Through the above control method, the driving action of the driving member is adopted to speed up the flat edge positioning of the carrier and the wafer, improve the positioning speed of the flat edge structure of the wafer and the shielding plate, and improve the overall working efficiency of the electroplating equipment.

[0042] Preferably, after the flat edge structure of the wafer is positioned, the following steps are further included:

[0043] The electromagnetic adsorption coil inside the positioning column on the carrier is energized, so that the carrier continues to move toward one side of the wafer along the central axis of the shielding device and connects the positioning column with the positioning hole of the plating head to achieve the rotation of the carrier and the plating head together.

[0044] Through the above-mentioned control method, by energizing the electromagnetic adsorption coil, electromagnetic induction is generated between the positioning column and the positioning hole, and they can attract and adsorb each other and maintain the connection between the positioning column and the positioning hole, providing a stable connection, thereby realizing a fixed connection between the carrier and the plating head, and allowing the carrier to rotate with the plating head, thereby realizing the shielding effect of the baffle plate on the carrier.

[0045] Preferably, after the flat edge structure of the wafer is positioned, the following steps are further included:

[0046] The first electromagnetic coil connected to the first permanent magnet on the carrier is energized, so that the carrier continues to move along the central axis of the shielding device toward the side close to the plating head and rotates synchronously with the wafer.

[0047] Through the above-mentioned control method, the currents of adjacent first electromagnetic coils are opposite and can generate a magnetic field to produce a magnetic force on the permanent magnet. This force can control the movement of the carrier, so that the carrier can move to the side close to the plating head even if it is suspended, so that the carrier can rotate with the wafer, so as to realize the function of the baffle plate in the carrier to shield the flat edge structure of the wafer.

[0048] Preferably, after the carrier and the wafer rotate synchronously, the following steps are further included:

[0049] The second electromagnetic coil connected to the second permanent magnet on the current equalizer plate is energized, so that the current equalizer plate continues to move toward the side close to the plating head along the central axis of the shielding needle seat and performs its own circumferential rotation.

[0050] Through the above control method, a uniform flow plate is added to stir the plating liquid during operation to eliminate bubbles generated by fluctuations, so as to eliminate the adverse effects of bubbles, so that the plating liquid flows at an appropriate speed in the plating tank, creating the best working reaction environment for wafer electroplating.

[0051] The positive and progressive effects of the present invention are:

[0052] 1. The shielding device sets two sensors on a carrier that can move up and down in the electroplating chamber, so that the carrier can drive the two sensors to follow the position of the wafer, and then accurately identify the flat edge structure of the wafer through the two sensors to ensure that the flat edge structure of the wafer and the shielding plate can be accurately aligned, maximize the shielding effect of the shielding plate, and thus improve the electroplating effect of the wafer and product quality. At the same time, the shielding device has a simple structure, easy operation, high reliability, and is suitable for flat edge structure protection in the electroplating industry.

[0053] 2. The electroplating equipment can better shield the wafer by adding the above-mentioned shielding device for shielding the wafer under the plating head, thereby avoiding problems such as electric field differentiation when the wafer is electroplated in the electroplating chamber.

[0054] 3. The control method of the electroplating equipment can ensure the accurate positioning of the wafer and the shielding plate during the electroplating process, so as to avoid the wafer being affected by the electric field differentiation during the electroplating process, ensure the quality of wafer electroplating, and improve the electroplating effect. At the same time, through the positioning method recognized by the sensor, the position of the wafer can be accurately identified and quickly adjusted, improving the accuracy of the electroplating equipment and the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a schematic structural diagram of a shielding device according to Embodiment 1 of the present invention.

[0056] Figure 2 This is a top view of the wafer and the shielding plate adapted to each other according to the first embodiment of the present invention.

[0057] Figure 3 It is a schematic diagram of the structure of the electroplating equipment according to the second embodiment of the present invention.

[0058] Figure 4 for Figure 3 Enlarged view of part A in .

[0059] Figure 5 This is a flowchart of a control method for electroplating equipment according to the third embodiment of the present invention.

[0060] Description of reference numerals:

[0061] Shielding device 100

[0062] Carrier 11

[0063] Positioning column 111

[0064] Shielding plate 112

[0065] Power Sensor 113

[0066] Sensor 12

[0067] Support 13

[0068] Driving member 131

[0069] Electroplating equipment 200

[0070] Plating head 21

[0071] Wafer 211

[0072] Positioning hole 212

[0073] Flow plate 22

[0074] Along the central axis direction X of the shielding device DETAILED DESCRIPTION

[0075] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0076] [Example 1]

[0077] like Figure 1-Figure 2 As shown, Embodiment 1 discloses a shielding device 100 , which is disposed in an electroplating chamber and below a wafer 211 , and is used to shield the flat edge structure of the wafer 211 when the wafer 211 is electroplated.

[0078] The shielding device 100 includes a carrier 11 , a shielding plate 112 and a sensor 12 , which are located on an equally divided annular step on the side wall of the electroplating chamber.

[0079] The shielding plate 112 is arranged on the carrier 11 to shield the flat edge structure of the wafer 211. There are two sensors 12, which are electrically connected to each other and are arranged on the carrier 11 to identify the flat edge structure in the wafer 211, and the connection surfaces of the two sensors 12 are parallel to the flat edges of the flat edge structure of the wafer 211.

[0080] In this embodiment, two sensors 12 are arranged on a carrier 11 that can move up and down in the electroplating chamber, so that the carrier 11 can drive the two sensors 12 to follow the position of the wafer 211, and then the two sensors 12 can accurately identify the flat edge structure of the wafer 211, so as to ensure that the flat edge structure of the wafer 211 and the shielding plate 112 can be accurately aligned, and the shielding effect of the shielding plate 112 can be maximized, thereby improving the electroplating effect and product quality of the wafer 211. At the same time, the shielding device 100 has a simple structure, convenient operation, high reliability, and is suitable for flat edge structure protection in the electroplating industry.

[0081] Specifically, Figure 2As shown, the shielding plate 112 includes a shielding flat edge parallel to the flat edge in the flat edge structure of the wafer 211 , and two sensors 12 are arranged at both ends of the shielding flat edge.

[0082] In the present embodiment, this structural form is adopted. This design enables the two sensors 12 to accurately sense and identify the position of the obstructed flat edge, and one of the sensors 12 can receive the signal sent by the other sensor 12 to ensure that the flat edge in the flat edge structure of the wafer 211 and the obstructed flat edge on the baffle plate 112 can be accurately aligned, thereby improving the quality and consistency of the electroplating of the wafer 211.

[0083] Preferably, if Figure 1 As shown, the shielding device 100 further includes a driving member 131 connected to the sensor 12 to drive the supporting member 11 to move along the central axis direction X of the shielding device toward a side close to the wafer 211 .

[0084] In this embodiment, the driving member 131 is an energized coil. After the energized coil is energized, the electromagnetic induction generated drives the power sensor 12113, thereby driving the carrier 11 to move along the central axis direction X of the shielding device to the side close to the wafer 211. In other embodiments, the driving member 131 can adopt other structural forms of existing technologies, which can be specifically configured as needed.

[0085] The driving member 131 controls the power sensor 12113 on the carrier 11 to realize the movement of the carrier 11 in the vertical direction, and through the control of the driving member 131, the carrier 11 can accurately and smoothly move along the central axis direction X of the shielding device, so as to more quickly align the flat edge structure of the wafer 211 with the shielding plate 112, thereby improving the positioning efficiency of the shielding device 100. In addition, the range, position and movement speed of the carrier 11 can be controlled by the driving member 131, and the carrier 11 can be flexibly adjusted, thereby enhancing the flexibility of use of the shielding device 100.

[0086] Furthermore, along the central axis direction X of the shielding device, the horizontal plane where the two sensors 12 are located is higher than the horizontal plane where the shielding plate 112 is located, so when positioning the flat edge structure of the wafer 211, it is possible to more accurately and quickly identify whether the two are aligned.

[0087] Preferably, the shielding device 100 also includes a support member 13 arranged below the carrier 11 along the central axis direction X of the shielding device and parallel to the carrier 11, a power sensor 12113 and a driving member 131 connected to the power sensor 12113, and the driving member 131 is arranged on the support member 13.

[0088] In the present embodiment, this structural form is adopted. On the one hand, the supporting member 13 can effectively support, carry and balance the supporting member 11. On the other hand, the driving member 131 can better drive the supporting member 11 to move in the vertical direction, thereby improving the efficiency of the driving member 131 in driving the supporting member 11, thereby increasing the speed of aligning the flat edge structure of the wafer 211 and the shielding plate 112, and improving the positioning efficiency of the shielding device 100.

[0089] At the same time, along the central axis direction X of the shielding device, the cross-sectional dimension of the support member 13 is not less than the cross-sectional dimension of the carrier 11. With this structural form, the contact area of ​​the support member 13 supporting the carrier 11 is increased, and the carrier 11 can be supported more effectively, thereby making the overall structure of the shielding device 100 more stable, ensuring the normal operation of the shielding device 100.

[0090] In this embodiment, the support member 13 is a ring-shaped structure to support the bearing member 11 and the driving member 131 .

[0091] [Example 2]

[0092] like Figure 3-Figure 4 As shown, Embodiment 2 discloses an electroplating device 200 , which includes the shielding device 100 of Embodiment 1 and an electroplating chamber that accommodates the shielding device 100 and provides an electroplating environment for the wafer 211 .

[0093] By adding the above-mentioned shielding device 100 for shielding the wafer 211 under the plating head 21, the wafer 211 can be better shielded to avoid problems such as electric field differentiation when the wafer 211 is electroplated in the electroplating chamber.

[0094] Preferably, in order to realize that the shielding plate 112 in the carrier 11 can shield the flat edge structure of the wafer 211, that is, to locate the positional relationship between the shielding plate 112 and the flat edge structure of the wafer 211 in the vertical direction, at least the following three implementation modes are included:

[0095] The first embodiment: a positioning hole 212 is provided on one side of the plating head 21 close to the wafer 211, and a positioning column 111 adapted to the positioning hole 212 is provided on the surface of one side of the carrier 11 close to the wafer 211, wherein both the positioning column 111 and the positioning hole 212 have magnetic attraction properties, so that the positioning column 111 and the positioning hole 212 can attract each other.

[0096] In this embodiment, this structural form is adopted, so that when the plating head 21 drives the wafer 211 to a range where they can be connected to each other, the positioning column 111 and the positioning hole 212 with magnetic attraction properties can automatically attract each other, so that the carrier 11 can be connected to the plating head 21 and rotate with the plating head 21 to achieve the shielding effect, and the magnetic attraction positioning can quickly and accurately locate the position between the plating head 21 and the carrier 11. This efficient positioning method can improve the electroplating efficiency and reduce the problems such as the pause time caused by assembly and adjustment. In addition, the magnetic attraction of the positioning column 111 and the positioning hole 212 can provide stable fixing performance. This magnetic attraction can maintain a firm connection between the positioning column 111 and the positioning hole 212, and no relative displacement will occur during the electroplating process, thereby preventing the carrier 11 from detaching from the plating head 21.

[0097] The second embodiment: a positioning hole 212 is provided on one side of the plating head 21 close to the wafer 211, and a positioning column 111 matched with the positioning hole 212 is provided on the surface of one side of the carrier 11 close to the wafer 211, an electromagnetic adsorption coil is provided inside the positioning hole 212 and the positioning column 111, and a positioning laser for detecting the distance between the positioning hole 212 and the positioning column 111 is provided on the wall of the electroplating chamber close to the positioning column 111, and the positioning laser is electrically connected to the positioning column 111 and the positioning hole 212.

[0098] Specifically, in this embodiment, the positioning hole 212 adopts a pin structure with a permanent magnet disposed inside, and an electromagnetic adsorption coil is disposed inside the positioning hole 212 .

[0099] In this embodiment, this structural form is adopted. By providing a positioning hole 212 on the plating head 21 and a positioning column 111 adapted thereto on the carrier 11, electromagnetic induction can be generated between the positioning column 111 and the positioning hole 212 by energizing the electromagnetic adsorption coil, so that the positioning column 111 and the positioning hole 212 can attract and adsorb each other and maintain the connection between the positioning column 111 and the positioning hole 212, thereby providing a stable connection. At the same time, a positioning laser for detecting the distance and position between the positioning hole 212 and the positioning column 111 is arranged on the wall of the electroplating chamber near the positioning column 111, so that the precise distance between the positioning hole 212 and the positioning column 111 can be measured. When the distance between the plating head 21 and the carrier 11 is close to the range in which the two can be connected, the positioning laser provides feedback signals to the positioning column 111 and the positioning hole 212, and energizes the electromagnetic adsorption coils inside the two, so as to realize the fixed connection between the carrier 11 and the plating head 21, so that the carrier 11 rotates with the plating head 21, so as to realize the shielding effect of the shielding plate 112 on the carrier 11. This arrangement not only improves the accuracy and consistency of the positioning between the plating head 21 and the carrier 11, but also reduces the complexity of manual operation through the automated operation, automated position positioning and automated connection of the electroplating equipment 200, improves the efficiency of the connection between the two, and thus improves the overall work efficiency of the electroplating equipment 200.

[0100] In other embodiments, the positioning laser may be electrically connected only to the positioning post 111 , or the positioning laser may be electrically connected only to the positioning hole 212 , as long as the positioning laser can detect the distance between the two.

[0101] In other embodiments, the shielding plate 112 may be fixed to the plating head 21 by a fixing method, such as a mechanical lock in the prior art, etc., which may be specifically set as needed.

[0102] Furthermore, during electroplating, a millimeter-level gap is maintained between the shielding plate 112 and the wafer 211 , which allows the electroplating solution to flow through, thereby eliminating the negative impact caused by the electric field difference at the flat edge of the wafer 211 .

[0103] In addition, after the electroplating process is completed, the electromagnetic adsorption coils in the positioning column 111 and the positioning hole 212 are powered off or briefly reversed to eliminate the residual electromagnetic adsorption force, so that the shielding plate 112 falls on the support in the electroplating chamber by gravity.

[0104] A third embodiment: first permanent magnets with alternating north and south poles are arranged on the support member 11 and arranged in sequence and at intervals along the circumferential direction of the support member 11 .

[0105] A plurality of first electromagnetic coils are arranged on the wall of the electroplating chamber near the first permanent magnet to control the movement of the carrier 11 through the first permanent magnet, and the currents of adjacent first electromagnetic coils are opposite, thus forming alternating electromagnetic north and south poles in a ring configuration.

[0106] In this embodiment, this structural form is adopted, and the currents of the adjacent first electromagnetic coils are opposite to each other and can generate a magnetic field to generate a magnetic force on the first permanent magnet. This force can control the movement of the carrier 11, so that the carrier 11 can move to the side close to the plating head 21, even if it is suspended, so that the carrier 11 can rotate with the wafer 211, so as to realize the function of the shielding plate 112 in the carrier 11 to shield the flat edge structure of the wafer 211. This configuration can realize precise control of the carrier 11, so that it moves along a specific path in the electroplating chamber. In addition, by controlling the magnitude and direction of the current of the first electromagnetic coil, the magnitude and direction of the applied force can be adjusted, thereby further optimizing the movement trajectory of the carrier 11 during the electroplating process.

[0107] Specifically, the first permanent magnet is arranged on the outer edge of the carrier 11, and the magnetic pole axis is perpendicular to or deviates from the normal line of the lower plane of the shielding plate at a small angle, corresponding to the magnetic pole axis of the lower part or the lower side of the shielding plate. The first electromagnetic coil is arranged on a plane at the same horizontal height as the plane where the first permanent magnet is located, so as to control the carrier 11 to rotate circumferentially along the central axis direction of the carrier 11, so as to form the alternating electromagnetic north and south poles arranged in an annular manner and the first permanent magnets with equidistant magnetic north and south poles installed at the lower part or the lower side of the shielding plate to generate the lifting force of the same repulsion to balance the gravity of the shielding plate.

[0108] Specifically, the first permanent magnet is arranged on a side surface of the carrier 11 away from the wafer 211, and the magnetic pole axis is perpendicular to or deviates from the normal of the lower plane of the shielding plate at a small angle, corresponding to the magnetic pole axis of the lower part or the lower side of the shielding plate. The plane where the first electromagnetic coil is located is located below the carrier 11 along the central axis direction of the carrier 11 to control the carrier 11 to move along the central axis direction of the carrier 11, that is, to suspend, so that the alternating electromagnetic north and south poles in an annular configuration and the second permanent magnets with equidistant north and south poles installed at the lower part or the lower side of the shielding plate generate the same-sex repulsive lifting force to balance the gravity of the shielding plate.

[0109] After the electroplating is completed, the second electromagnetic coil is powered off or reversely powered on for a short time to eliminate the residual electromagnetic force, so that the shielding plate falls on the annular step by gravity.

[0110] Preferably, the electroplating equipment 200 further includes a flow equalizer 22 disposed below the shielding device 100 along the central axis direction X of the shielding device. By adding the flow equalizer 22, the electroplating solution is stirred during operation to eliminate bubbles generated by fluctuations, thereby eliminating the adverse effects of bubbles, so that the electroplating solution flows at a suitable speed in the electroplating tank, creating an optimal working reaction environment for electroplating the wafer 211.

[0111] Furthermore, second permanent magnets with alternating north and south poles are arranged in sequence and spaced apart on the flow equalizer plate 22 and along the circumferential direction of the flow equalizer plate 22 , and the magnetic pole axis is perpendicular to or deviates from the normal line of the lower plane of the flow equalizer plate at a small angle.

[0112] When the flow plate is not in operation, it sits on another annular step on the side wall of the electroplating chamber, and a plurality of second electromagnetic coils are provided on the wall of the electroplating chamber close to the second permanent magnet to control the movement of the flow plate 22 through the second permanent magnet. The magnetic pole axis generated by the second electromagnetic coil is perpendicular to or deviates from the normal of the lower plane of the flow plate at a small angle, corresponding to the magnetic pole axis of the lower part or the lower side of the flow plate, and the currents of adjacent second electromagnetic coils are opposite, thus forming an annular configuration of alternating electromagnetic north and south poles and an equidistant second permanent magnet installed at the lower part or the lower side of the flow plate to generate like-sex repulsive lifting forces to balance the gravity of the baffle.

[0113] In this embodiment, this structural form is adopted, and the currents of the adjacent second electromagnetic coils are opposite to each other and can generate a magnetic field to generate a magnetic force on the second permanent magnet. This force can control the movement of the flow plate 22, so that the flow plate 22 can be suspended in the plating liquid to stir the plating liquid, so as to eliminate the adverse effects of bubbles, so that the plating liquid flows at a suitable speed in the plating tank, and creates an optimal working reaction environment for the electroplating of the wafer 211. This configuration can achieve precise control of the flow plate 22, so that it moves along a specific path in the plating chamber. In addition, by controlling the current size and direction of the second electromagnetic coil, the size and direction of the applied force can be adjusted, thereby further optimizing the movement trajectory of the flow plate 22 during the electroplating process.

[0114] Specifically, the second permanent magnet is arranged on the outer edge of the flow plate 22, and the second electromagnetic coil is arranged on a plane parallel to the plane where the second permanent magnet is located, so as to control the flow plate 22 to rotate circumferentially along the central axis direction of the flow plate 22 in a magnetic suspension manner.

[0115] Specifically, the second permanent magnet is arranged on a side surface of the flow plate 22 away from the wafer 211, and the plane where the second electromagnetic coil is located is located below the flow plate 22 along the central axis direction of the carrier 11, and the flow plate 22 is controlled to move along the central axis direction of the flow plate 22 in a magnetic suspension manner.

[0116] [Example 3]

[0117] like Figure 5 As shown, Example 3 discloses a control method for an electroplating device 200 , and the control method for the electroplating device 200 is used to control the electroplating device 200 of Example 2.

[0118] The control method of the electroplating equipment 200 specifically includes the following steps:

[0119] By controlling the movement of the plating head 21, the wafer 211 is moved along a specified path to the position of the electroplating chamber;

[0120] A sensor 12 is installed on the carrier 11 to determine the position and positioning of the wafer 211 by sending and receiving signals: when one of the sensors 12 receives a signal sent by another sensor 12, it indicates that the wafer 211 has reached the predetermined position, that is, the flat edge structure of the wafer 211 and the baffle 112 are positioned; if one of the sensors 12 does not receive a signal from another sensor 12, it indicates that the wafer 211 has not reached the predetermined position, and it is necessary to continue to drive the wafer 211 to rotate through the plating head 21 to adjust the position of the wafer 211 until one of the sensors 12 can receive the signal sent by another sensor 12.

[0121] Once one of the sensors 12 is able to receive the signal sent by another sensor 12, it indicates that the flat edge structure of the wafer 211 and the shielding plate 112 are positioned completely, and the next electroplating operation can be performed.

[0122] Through the above control method, the wafer 211 can be accurately positioned with the shielding plate 112 during the electroplating process, so that the wafer 211 can be prevented from being affected by the electric field differentiation during the electroplating process, the quality of the electroplating of the wafer 211 can be ensured, and the electroplating effect can be improved. At the same time, through the positioning method recognized by the sensor 12, the position of the wafer 211 can be accurately identified and quickly adjusted, thereby improving the accuracy and electroplating quality of the electroplating equipment 200.

[0123] Preferably, before positioning the flat edge structure of the wafer 211, the following steps are also included:

[0124] The driving member 131 drives the supporting member 11 to move along the central axis of the shielding device 100 toward a side close to the wafer 211 .

[0125] Through the above control method, the driving action of the driving member 131 can be used to accelerate the flat edge positioning of the carrier 11 and the wafer 211, improve the positioning speed of the flat edge structure of the wafer 211 and the baffle 112, and improve the overall working efficiency of the electroplating equipment 200.

[0126] Preferably, after the flat edge structure of the wafer 211 is positioned, the following steps are further included:

[0127] The electromagnetic adsorption coil inside the positioning column 111 on the carrier 11 is energized, so that the carrier 11 continues to move toward one side of the wafer 211 along the central axis of the shielding device 100 and connects the positioning column 111 and the positioning hole 212 of the plating head 21 to achieve the rotation of the carrier 11 and the plating head 21 together.

[0128] Through the above-mentioned control method, by energizing the electromagnetic adsorption coil, electromagnetic induction is generated between the positioning column 111 and the positioning hole 212, and they can attract and adsorb each other and maintain the connection between the positioning column 111 and the positioning hole 212, providing a stable connection, thereby realizing a fixed connection between the carrier 11 and the plating head 21, so that the carrier 11 rotates with the plating head 21, thereby realizing the shielding effect of the baffle plate 112 on the carrier 11.

[0129] Preferably, after the flat edge structure of the wafer 211 is positioned, the following steps are further included:

[0130] The first electromagnetic coil connected to the first permanent magnet on the carrier 11 is energized, so that the carrier 11 continues to move along the central axis of the shielding device 100 toward the side close to the plating head 21 and rotates synchronously with the wafer 211 .

[0131] Through the above-mentioned control method, the currents of adjacent first electromagnetic coils are opposite and can generate a magnetic field to produce a magnetic force on the permanent magnet. This force can control the movement of the carrier 11, so that the carrier 11 can move to the side close to the plating head 21, even if it is suspended, so that the carrier 11 can rotate with the wafer 211, so as to realize the function of the baffle plate 112 in the carrier 11 to shield the flat edge structure of the wafer 211.

[0132] Preferably, after the carrier 11 and the wafer 211 rotate synchronously, the following steps are further included:

[0133] The second electromagnetic coil connected to the second permanent magnet on the current equalizer plate 22 is energized, so that the current equalizer plate 22 continues to move along the central axis of the shielding needle seat toward the side close to the plating head 21 and performs its own circumferential rotation.

[0134] Through the above control method, a uniform flow plate 22 is added to stir the plating solution during operation to eliminate bubbles generated by fluctuations, so as to eliminate the adverse effects of bubbles, so that the plating solution flows at an appropriate speed in the plating tank, creating an optimal working reaction environment for electroplating of the wafer 211.

[0135] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A shielding device, characterized in that: The shielding device is arranged in the electroplating chamber and below the wafer, and the shielding device comprises: bearing member; A shielding plate, arranged on the carrier and used for shielding the flat edge structure of the wafer; The sensor is two in number, the two sensors are electrically connected to each other and are both arranged on the carrier, and are used to identify the flat edge structure in the wafer, wherein the connection surfaces of the two sensors are parallel to the flat edges of the flat edge structure.

2. The shielding device according to claim 1, characterized in that: The shielding device also includes a power sensor arranged on the supporting member and a driving member connected to the power sensor, and the driving member drives the power sensor to drive the supporting member to move along the central axis direction of the shielding device toward a side close to the wafer.

3. The shielding device according to claim 1, characterized in that: The shielding plate includes a shielding flat edge parallel to the flat edge of the flat edge structure, and the two sensors are arranged on both ends of the shielding flat edge.

4. The shielding device according to claim 1, characterized in that: Along the central axis direction of the shielding device, the horizontal plane where the two sensors are located is higher than the horizontal plane where the shielding plate is located.

5. The shielding device according to claim 1, characterized in that: The shielding device further includes a support member arranged below the bearing member along the central axis direction of the shielding device and arranged parallel to the bearing member, a power sensor, and a driving member connected to the power sensor, wherein the driving member is arranged on the support member.

6. The shielding device according to claim 5, characterized in that: Along the central axis direction of the shielding device, the cross-sectional dimension of the support member is not less than the cross-sectional dimension of the bearing member.

7. An electroplating device, characterized in that: The electroplating equipment comprises a plating head and a shielding device as described in any one of claims 1 to 6, and a plating chamber that accommodates the shielding device and provides an electroplating environment for the wafer.

8. The electroplating equipment according to claim 7, characterized in that: A positioning hole is provided on the plating head, and a positioning column matched with the positioning hole is provided on the surface of the side of the carrier close to the wafer. Both the positioning column and the positioning hole have magnetic attraction properties, so that the positioning column and the positioning hole can attract each other.

9. The electroplating equipment according to claim 7, characterized in that: A positioning hole is provided on the plating head, a positioning column matched with the positioning hole is provided on a surface of the carrier close to the wafer, and an electromagnetic adsorption coil is provided inside the positioning hole and the positioning column. A positioning laser for detecting the distance between the positioning hole and the positioning post is provided on the wall surface of the electroplating chamber and close to the positioning post. The positioning laser is electrically connected to the positioning post and / or the positioning hole.

10. The electroplating equipment according to claim 7, characterized in that: First permanent magnets are arranged on the carrier and in sequence along the circumferential direction of the carrier, and a plurality of first electromagnetic coils for controlling the movement of the carrier through the first permanent magnets are arranged on the wall surface of the electroplating chamber close to the first permanent magnets, and the currents of adjacent first electromagnetic coils are opposite.

11. The electroplating equipment according to claim 7, characterized in that: The electroplating equipment also includes a flow equalizer plate arranged below the shielding device along the central axis direction of the shielding device.

12. The electroplating equipment according to claim 11, characterized in that Second permanent magnets are arranged on the flow plate and in sequence along the circumferential direction of the flow plate, and a plurality of second electromagnetic coils for controlling the movement of the flow plate through the second permanent magnets are arranged on the wall surface of the electroplating chamber close to the second permanent magnets, and the currents of adjacent second electromagnetic coils are opposite.

13. A control method for electroplating equipment, characterized in that: The control method of the electroplating equipment is used to control the electroplating equipment according to any one of claims 7 to 12, and the control method of the electroplating equipment comprises the following steps: The plating head drives the wafer to move toward the plating chamber; When one of the sensors receives a signal sent by another sensor, the flat edge structure of the wafer is positioned; When one of the sensors does not receive the signal sent by the other sensor, the plating head drives the wafer to rotate. When one of the sensors receives the signal sent by the other sensor, the flat edge structure of the wafer is positioned.

14. The control method of electroplating equipment according to claim 13, characterized in that: Before positioning the flat edge structure of the wafer, the following steps are also included: The driving member drives the bearing member to move along the central axis of the shielding device toward a side close to the wafer.

15. The control method of electroplating equipment according to claim 13, characterized in that: After the flat edge structure of the wafer is positioned, The following steps are involved: The electromagnetic adsorption coil inside the positioning column on the carrier is energized, so that the carrier continues to move toward one side of the wafer along the central axis of the shielding device and connects the positioning column with the positioning hole of the plating head to achieve the rotation of the carrier and the plating head together.

16. The control method of electroplating equipment according to claim 13, characterized in that: After the flat edge structure of the wafer is positioned, the following steps are also included: The first electromagnetic coil connected to the first permanent magnet on the carrier is energized, so that the carrier continues to move along the central axis of the shielding device toward the side close to the plating head and rotates synchronously with the wafer.

17. The control method of the electroplating equipment according to any one of claims 13 to 16, characterized in that: After the carrier and the wafer rotate synchronously, the following steps are also included: The second electromagnetic coil connected to the second permanent magnet on the current equalizer plate is energized, so that the current equalizer plate continues to move toward the side close to the plating head along the central axis of the shielding needle seat and performs its own circumferential rotation.

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