Optical fiber connection structure

Abstract

The invention relates to the technical field of communication equipment, and discloses an optical fiber connection structure, which comprises a silicon optical chip and an optical fiber, the optical fiber comprises a receiving part and a transmitting part, the receiving part is arranged corresponding to the silicon optical chip to receive light emitted by the silicon optical chip, the receiving part is provided with a receiving surface, and the transmitting part is arranged on the receiving surface. The receiving surface is configured to be a quadric surface protruding towards the silicon optical chip; and the transmission part is connected to one end, far away from the silicon optical chip, of the receiving part, and the transmission part is configured to transmit the light received by the receiving part. By adopting the scheme provided by the invention, the coupling efficiency between the optical fiber and the silicon optical chip can be improved, the precision of coupling equipment is reduced, and the cost can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to an optical fiber connection structure. Background Art

[0002] With the development of new industries such as 5G communications and artificial intelligence, the requirements for electronic chips are becoming higher and higher. High-speed silicon photonic communication modules, as a highly integrated, low-power and high-speed transmission method, have also attracted market attention.

[0003] High-speed silicon photonic communication modules usually contain silicon photonic chips, optical fibers, etc. Silicon photonic chips are core components that integrate components such as light sources, modulators, optical waveguides, detectors, and circuit chips, and can realize functions such as the generation, transmission, modulation, and detection of optical signals. The coupling of optical fibers and silicon photonic chips is one of the key technologies for achieving optical interconnection. By coupling optical fibers and silicon photonic chips, high-speed optical signal transmission between chips and chips, and between chips and external devices can be achieved.

[0004] In related technologies, the coupling method between optical fiber and silicon photonic chip is usually adopted by setting a lens array between the optical fiber array and the silicon photonic chip. The light output by the silicon photonic chip is converged onto the optical fiber array through the lens array. However, this coupling method has high requirements on the processing accuracy of the optical fiber array and the lens array, and the coupling process is relatively complicated, resulting in low overall coupling efficiency. Summary of the invention

[0005] The present application discloses an optical fiber connection structure, which can increase the coupling efficiency between the optical fiber and the silicon photonic chip, and can also reduce the accuracy requirements of the coupling device.

[0006] In order to achieve the above object, the embodiment of the present application discloses an optical fiber connection structure, including: Silicon photonic chips; An optical fiber, comprising: a receiving part, the receiving part being arranged corresponding to the silicon photonic chip to receive light emitted by the silicon photonic chip, the receiving part having a receiving surface, and the receiving surface being configured as a quadratic surface protruding toward the silicon photonic chip; and A transmitting part, wherein the transmitting part is connected to an end of the receiving part away from the silicon photonic chip, and the transmitting part is configured to transmit the light received by the receiving part.

[0007] In this way, the light emitted by the silicon photonic chip is refracted to the transmission part after passing through the quadratic surface, thereby increasing the incident angle received by the optical fiber, thereby expanding the coupling tolerance of the optical fiber, increasing the coupling efficiency of the optical fiber and the silicon photonic chip, and eliminating the lens array and optical path matching glue, saving the required material costs.

[0008] As an optional implementation, the receiving surface is an ellipsoidal surface.

[0009] In this way, since the ellipsoidal surface can converge the light to a focal point, the light energy density in the area is increased, thereby improving the coupling efficiency. The reflection characteristics of the ellipsoidal surface make the reflection angle of the light more concentrated during the reflection process, reducing the scattering and absorption of the light during the reflection process, thereby improving the coupling efficiency.

[0010] As an optional implementation, the radius of curvature of the ellipsoidal surface along the optical axis of the optical fiber is 3.5 μm-9 μm.

[0011] In this way, collision and wear between the optical fiber and the silicon photonic chip are avoided, the impact on the coupling efficiency is reduced, the service life is guaranteed, and the coupling efficiency is guaranteed. It is also avoided that the optical fiber is far away from the silicon photonic chip, the light emitted by the silicon photonic chip has a poor convergence effect, and the optical fiber cannot fully receive the light emitted by the silicon photonic chip.

[0012] As an optional implementation, the angle between the normal section of the receiving surface and the optical axis of the optical fiber is related to the maximum incident half-angle that the optical fiber can receive.

[0013] As an optional implementation, the angle between the normal line of the receiving surface and the optical axis of the optical fiber is The maximum incident half angle that the optical fiber can receive satisfy: ; The enlarged value of the incident angle of the receiving part to the air side satisfy: ; in, is the maximum total reflection angle transmitted by the optical fiber, which is determined by the refractive index of the core and cladding of the optical fiber; The incident angle on the air side when the maximum total reflection is formed from the air to the receiving part; is the refractive index of the core layer of the optical fiber; is the refractive index of air.

[0014] As an optional implementation, the receiving unit and the silicon photonic chip are spaced apart.

[0015] In this way, the interval between the optical fiber and the silicon photonic chip can avoid wear caused by the relative movement between the receiving part and the silicon photonic chip, ensure the coupling efficiency of the receiving part and the silicon photonic chip, and ensure the service life of the optical fiber connection structure.

[0016] As an optional implementation manner, the interval L1 between the receiving part and the silicon photonic chip satisfies: 0 μm<L1≤6 μm.

[0017] In this way, when the interval L1 between the optical fiber and the silicon photonic chip is less than 6 μm, the attenuation of the optical signal due to the long transmission distance can be avoided, the quality of the optical signal is guaranteed, and the coupling efficiency between the optical fiber and the silicon photonic chip is guaranteed.

[0018] As an optional implementation manner, the interval L1 between the receiving part and the silicon photonic chip satisfies: 0.5 μm≤L1≤6 μm.

[0019] In this way, when the interval L1 between the optical fiber and the silicon photonic chip is greater than 0.5μm, direct contact between the optical fiber and the silicon photonic chip is avoided, thereby reducing physical damage caused by collision or friction. Moreover, when the interval L1 is greater than 0.5μm, it can effectively reduce the accuracy requirements for the installation distance, reduce the difficulty of operation during the installation process, improve the success rate and efficiency of the installation, reduce the defective rate caused by installation accuracy problems, and thus reduce production costs.

[0020] As an optional implementation, the receiving portion and the transmitting portion are integrally formed.

[0021] In this way, when the receiving part and the transmitting part are integrally formed, the optical signal transmission path is shorter, reducing the loss of the optical signal during the transmission process, thereby improving the coupling efficiency of the optical fiber connection structure. Secondly, the integrally formed design can simplify the manufacturing process, eliminate the step of aligning the receiving part with the transmitting part, and avoid wear or misalignment between the receiving part and the transmitting part due to physical contact or slight displacement, thereby ensuring the optical signal transmission effect.

[0022] As an optional embodiment, the receiving surface is formed by grinding.

[0023] In this way, the use of grinding technology can achieve higher precision, and high-precision grinding can ensure the flatness and smoothness of the receiving surface of the optical fiber, thereby reducing the reflection and loss of the optical signal and improving the transmission efficiency of the optical fiber. The grinding process can make the end face of the optical fiber more uniform, and uniform grinding can avoid uneven distribution of the optical signal in the optical fiber, thereby improving the coupling connection efficiency of the optical fiber connection structure.

[0024] Compared with the prior art, the beneficial effects of this application are: The optical fiber connection structure disclosed in the embodiment of the present application includes a silicon photonic chip and an optical fiber. By setting the end of the receiving portion of the optical fiber close to the silicon photonic chip as a receiving surface, the receiving surface is a quadratic surface protruding toward the silicon photonic chip. The receiving surface is a quadratic surface that can expand the incident angle received by the optical fiber, thereby expanding the coupling tolerance of the optical fiber array, thereby increasing the coupling efficiency. In addition, when coupling the optical fiber and the silicon photonic chip, there is no need to add a lens array between the optical fiber and the silicon photonic chip, which reduces the use of components and reduces the alignment accuracy requirements, effectively improving the coupling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of a coupling method between an optical fiber and a silicon photonic chip in the related art; Figure 2 It is a structural schematic diagram of another coupling method between an optical fiber and a silicon photonic chip in the related art; Figure 3 A schematic diagram of a structure of an optical fiber connection structure disclosed in an embodiment of the present application; Figure 4 for Figure 3 A magnified view of the optical fiber connection structure in FIG. Figure 5 A structural schematic diagram of the optical fiber connection structure when the curvature radius of the ellipsoidal surface in the optical fiber connection structure disclosed in the embodiment of the present application is less than 3.5 μm; Figure 6 A structural schematic diagram of the optical fiber connection structure when the curvature radius of the ellipsoidal surface in the optical fiber connection structure disclosed in the embodiment of the present application is greater than 9 μm.

[0027] Description of reference numerals: 100-optical fiber connection structure; 1-optical fiber; 11-receiving part; 12-transmitting part; 111-receiving surface; 2-silicon photonic chip; L1-interval between the receiving part and the silicon photonic chip; L2-curvature radius of the ellipsoidal surface; X-optical axis. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] In the present application, the terms "upper", "lower", "top", "bottom", "inner", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0030] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0031] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0033] The continuous development of new industries such as 5G communications and artificial intelligence has led to increasing requirements for electronic chips. High-speed silicon photonic communication modules have attracted market attention due to their high integration, low power consumption, and support for high-speed transmission.

[0034] High-speed silicon photonic communication modules are generally composed of silicon photonic chips, optical fibers and other related optoelectronic components, among which silicon photonic chips are the core part. Silicon photonic chips integrate light sources, modulators, optical waveguides, detectors and circuit chips, and have the functions of generating, transmitting, modulating and detecting optical signals. The coupling of optical fibers and silicon photonic chips is a key technology for realizing optical interconnection. With this coupling, high-speed optical signal transmission between chips and chips, and between chips and external devices can be achieved.

[0035] See also Figure 1 In the related art, one way to achieve the coupling between optical fiber and silicon photonic chip is to set a lens array b between optical fiber array a and silicon photonic chip c, and the light output by silicon photonic chip c is refracted by lens array b and converged on optical fiber array a. However, this coupling method has some problems. For example, it has very high requirements on the processing accuracy of optical fiber array a and lens array b, and the coupling process is relatively complicated, which makes the overall coupling efficiency low.

[0036] Based on this, the inventors also tried another way to couple the optical fiber and silicon photonic chip, see Figure 2, grind the light-emitting end face of silicon photonic chip c and the end face of optical fiber array a into an 8° plane, and then dock the silicon photonic chip c and optical fiber array a. In order to improve the anti-reflection performance during docking, it is necessary to add optical path matching glue on the contact surface of the docking. However, the processing technology of the light-emitting end face of silicon photonic chip c and the end face of optical fiber array a has high precision requirements, low coupling efficiency, and the price of optical path matching glue is relatively expensive, resulting in high cost.

[0037] Based on this, an embodiment of the present application discloses an optical fiber connection structure, which can increase the coupling efficiency between the optical fiber and the silicon photonic chip, reduce the accuracy of the coupling equipment, and reduce costs.

[0038] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0039] See also Figure 3 and Figure 4 , Figure 3 1 is a schematic structural diagram of an optical fiber connection structure 100 disclosed in an embodiment of the present application. Figure 4 for Figure 3 An enlarged view of point A of the optical fiber connection structure 100.

[0040] The embodiment of the present application discloses an optical fiber connection structure 100 , including an optical fiber 1 and a silicon photonic chip 2 .

[0041] Wherein, optical fiber 1 comprises: A receiving part 11, the receiving part 11 is arranged corresponding to the silicon photonic chip 2 to receive light emitted by the silicon photonic chip 2, the receiving part 11 has a receiving surface 111, and the receiving surface is configured as a quadratic surface protruding toward the silicon photonic chip 2; The transmitting part 12 is connected to an end of the receiving part 11 away from the silicon photonic chip 2 , and is configured to transmit the light received by the receiving part 11 .

[0042] In the optical fiber connection structure 100 provided in the embodiment of the present application, by setting the receiving surface 111 of the receiving part 11 of the optical fiber 1 as a quadratic surface, the light emitted by the silicon photonic chip 2 is refracted to the transmission part 12 after passing through the quadratic surface, thereby increasing the incident angle received by the optical fiber 1, thereby expanding the coupling tolerance of the optical fiber 1 and increasing the coupling efficiency of the optical fiber 1 and the silicon photonic chip 2. In addition, compared with the related art, the optical fiber connection structure 100 provided in the embodiment of the present application omits the lens array, and does not need to grind an 8° plane on both the light emitting end face of the silicon photonic chip 2 and the end face of the optical fiber 1, and does not need to add optical path matching glue on the butt surface of the optical fiber 1 and the silicon photonic chip 2, which reduces the requirements for processing accuracy and saves the required material costs.

[0043] It can be understood that the silicon photonic chip 2 is an optoelectronic integrated chip manufactured using a silicon-based complementary metal oxide semiconductor process platform. The silicon photonic chip 2 integrates optical elements and semiconductor devices on a single silicon wafer, realizing the generation, transmission, modulation and detection of optical signals. The core components of the silicon photonic chip 2 include light sources, modulators, optical waveguides, detectors and circuit chips, which can realize the generation, transmission, modulation and detection of optical signals.

[0044] Optical fiber 1 is a fiber made of glass or plastic that can be used as a light transmission tool. Optical fiber 1 is generally composed of a core, a cladding, a coating, and a protective layer. The core is the central part of the optical fiber 1 and is the main channel for light propagation. It has a high refractive index and is usually made of highly transparent materials, such as quartz glass (silicon dioxide) doped with other elements to adjust the refractive index. Light propagates in a straight line inside the core based on the principle of total reflection. The cladding surrounds the core and is also made of transparent materials with a lower refractive index than the core. This refractive index difference causes total reflection of the optical signal when it enters and leaves the core, thereby effectively limiting the propagation of light in the core and reducing signal loss. The thickness of the cladding is also at the μm level, which is designed just right to maintain good light waves. The coating is wrapped around the outside of the cladding and is usually made of polymer materials such as plastic or resin. Its main purpose is to provide mechanical protection to prevent the optical fiber from being affected by external stress, chemical corrosion and humidity. It also increases the flexibility and wear resistance of the optical fiber, which helps with the bending and installation of the optical fiber during laying and use. In order to further enhance the mechanical strength and environmental resistance of the optical fiber, a thicker protective layer is added on the basis of the outer coating, such as an armor layer or a secondary coating layer (sometimes also called a plastic sheath), especially when used in outdoor wiring or special environments.

[0045] It should be noted that the optical fiber 1 in the embodiment of the present application refers to the core part of the optical fiber, and the embodiment of the present application does not limit the part other than the core.

[0046] The receiving part 11 is a portion of the optical fiber 1 for receiving light emitted by the silicon photonic chip 2 .

[0047] The transmission part 12 is connected to the end of the receiving part 11 away from the silicon photonic chip 2. The main function of the transmission part 12 is to transmit the light received by the receiving part 11. In the optical fiber 1, the light propagates in the transmission part 12 by the principle of total reflection.

[0048] In some optional embodiments, the receiving surface 111 of the receiving unit 11 can be arranged in contact with the silicon photonic chip 2. For example, the receiving surface can abut against the light output end of the silicon photonic chip, so that the transmission path of the optical signal is shorter, reducing the loss of light during transmission, thereby improving the coupling efficiency.

[0049] For other optional implementations, please refer to Figure 3 , the receiving part 11 and the silicon photonic chip 2 can be spaced apart. Spaced apart from each other, the receiving part 11 and the silicon photonic chip 2 can avoid wear caused by relative movement between the receiving part 11 and the silicon photonic chip 2, ensure the coupling efficiency between the receiving part 11 and the silicon photonic chip 2, and ensure the service life of the optical fiber connection structure 100.

[0050] Optionally, the interval L1 between the receiving unit 11 and the silicon photonic chip 2 satisfies: 0μm<L1≤6μm. When the interval L1 between the optical fiber and the silicon photonic chip is less than 6μm, the attenuation of the optical signal due to the long transmission distance can be avoided, the quality of the optical signal is guaranteed, and the coupling efficiency between the optical fiber and the silicon photonic chip is guaranteed.

[0051] If the interval L1 between the receiving part 11 and the silicon photonic chip 2 is greater than 6 μm, the optical signal will experience attenuation due to the long distance during transmission, reducing the quality of the optical signal and further reducing the coupling efficiency between the receiving part 11 and the silicon photonic chip 2 .

[0052] Preferably, the interval L1 between the receiving part 11 and the silicon photonic chip 2 satisfies: 0.5μm≤L1≤6μm. When the interval L1 between the receiving part 11 and the silicon photonic chip 2 is greater than 0.5μm, a certain interval is maintained between the receiving part 11 and the silicon photonic chip 2 to avoid direct contact between the receiving part 11 and the silicon photonic chip 2, thereby reducing physical damage caused by collision or friction. And the interval L1 greater than 0.5μm can effectively reduce the accuracy requirements for the installation distance, reduce the difficulty of operation during the installation process, improve the success rate and efficiency of the installation, and reduce the defective rate caused by installation accuracy problems, thereby reducing production costs.

[0053] When the interval L1 between the receiving part 11 and the silicon photonic chip 2 is less than 0.5 μm, the distance between the receiving part 11 and the silicon photonic chip 2 is too close, which may cause physical contact and increase the risk of damage. If the interval L1 between the receiving part 11 and the silicon photonic chip 2 is less than 0.5 μm, when installing the optical fiber 1 and the silicon photonic chip 2, the installation is difficult and physical contact is easily caused.

[0054] Optionally, the receiving portion 11 and the transmitting portion 12 of the optical fiber 1 may be integrally formed, or may be separately provided.

[0055] In one example, the receiving part 11 and the transmitting part 12 of the optical fiber 1 can be a split structure. On the one hand, the split structure can improve the system performance by optimizing the design of the receiving part 11 and the transmitting part 12. For example, the receiving part 11 can use an optical fiber material with higher receiving efficiency, and the transmitting part 12 can use a low-loss optical fiber material to reduce signal attenuation and improve transmission efficiency. On the other hand, when one of the receiving part 11 or the transmitting part 12 is damaged, it can be replaced accordingly without replacing the entire optical fiber 1, which not only reduces maintenance costs but also extends the service life of the system.

[0056] For another example, see Figure 3 , the receiving part 11 and the transmitting part 12 of the optical fiber 1 can be integrally formed. When the receiving part 11 and the transmitting part 12 are integrally formed, the optical signal transmission path is shorter, which reduces the loss of the optical signal during the transmission process, thereby improving the coupling efficiency of the optical fiber connection structure 100. Secondly, the one-piece design can simplify the manufacturing process, thereby omitting the step of aligning the receiving part 11 and the transmitting part 12. In addition, the one-piece design can reduce the wear or misalignment between the receiving part 11 and the transmitting part 12 caused by physical contact or slight displacement, thereby ensuring the optical signal transmission effect and increasing the service life of the optical fiber 1. And since there are no additional connecting parts between the receiving part 11 and the transmitting part 12, the attenuation of the signal during the transmission process can be reduced, further ensuring the transmission effect of the optical signal, and since there are no connecting parts, the optical signal transmission will not be affected by the failure of the connecting parts, thereby improving the reliability and maintainability of the optical fiber 1.

[0057] Optionally, the receiving surface 111 can be formed by grinding one end of the receiving part 11 close to the silicon photonic chip 2. The use of a grinding process can achieve higher precision, thereby ensuring the flatness and smoothness of the receiving surface 111 of the optical fiber 1, reducing the reflection and loss of the optical signal, and thus helping to improve the transmission efficiency of the optical fiber 1. In addition, the grinding process can make the end face of the optical fiber 1 more evenly ground, and even grinding can avoid uneven distribution of the optical signal in the optical fiber 1, thereby improving the coupling connection efficiency of the optical fiber connection structure 100.

[0058] In addition, the grinding process can adjust the grinding parameters and processes according to different needs and application scenarios to achieve different ellipsoidal shapes and sizes. This flexibility enables the grinding process to adapt to the requirements of various curvature radii of the receiving surface 111 and the size of the interval L1 between the receiving part 11 and the silicon photonic chip 2.

[0059] Of course, it is understandable that, as another example, the receiving surface 111 can also be made by the fiber forming technology in the fiber drawing at the end of the receiving part 11 close to the silicon photonic chip 2, and the receiving surface 111 with an ellipsoidal shape is directly formed during the fiber drawing process, without the need for additional complex post-processing processes to shape the receiving surface 111. Compared with the method of first drawing a conventional optical fiber and then manufacturing the ellipsoidal receiving surface 111 through other processes, this integrated process avoids the intermediate links and reduces the errors and losses that may occur during the process conversion process. Moreover, fiber drawing is a relatively stable and precisely controllable continuous process. Once the parameters for manufacturing the ellipsoidal receiving surface 111 are determined during the drawing process, it is only necessary to keep the drawing conditions stable to continuously and stably produce optical fibers 1 with qualified ellipsoidal receiving surfaces 111, thereby improving the consistency of the quality of the optical fiber 1 and reducing the fluctuations and defects of the optical fiber 1.

[0060] Optionally, the receiving portion 11 has a receiving surface 111 , and the receiving surface 111 is configured as a quadratic surface protruding toward the silicon photonic chip 2 .

[0061] A quadratic surface is a surface in three-dimensional space that is represented by a three-dimensional quadratic equation. The equation of a quadratic surface can be written in the following form: Ax^2+By^2+Cz^2+2Dxy+2Exz+2Fyz+2Gx+2Hy+2Iz+J=0; Among them, A, B, C, D, E, F, G, H, I, and J are constants, and A, B, and C are not all zero.

[0062] Quadratic surfaces include ellipsoids, single-leaf hyperboloids, double-leaf hyperboloids, elliptical paraboloids, etc.

[0063] The quadratic surface has special optical properties such as focusing or collimation, which helps to more efficiently receive the light emitted by the silicon photonic chip.

[0064] Exemplarily, if the receiving surface 111 is a parabola, the parabola has the characteristic of converging light parallel to the axis of symmetry to a focus. In the receiving part 11 of the optical fiber 1, if the light emitted by the silicon photonic chip 2 is close to parallel light, the receiving surface 111 can converge these light rays to a point or a small area, thereby improving the efficiency of light reception. According to the law of reflection, the angle of reflection of light on the reflecting surface is equal to the angle of incidence. For a parabola, the direction of the tangent at any point on its surface determines the direction of the normal at that point, thereby determining the reflection direction of the light at that point. When light parallel to the axis of symmetry is irradiated onto the parabola, by calculating the slope of the tangent and the direction of the normal at a certain point on the parabola, combined with the law of reflection, it can be proved that the reflected light will pass through the focus.

[0065] In another exemplary embodiment, if the receiving surface 111 is a single-leaf hyperboloid, the single-leaf hyperboloid has the characteristic that the light emitted from one focus will pass through another focus after reflection. If the silicon photonic chip 2 is placed near a focus of the single-leaf hyperboloid receiving surface 111, then after the light emitted by the silicon photonic chip 2 is reflected by the hyperboloid receiving surface 111, the reflected light is similar to that emitted from another focus, and the light can be redirected and converged, thereby facilitating the reception of light.

[0066] For another example, see Figure 3 and Figure 4 , the above-mentioned receiving surface 111 may be an ellipsoidal surface. The ellipsoidal surface has the characteristic of converging the light emitted by a light source located at one focus to another focus. In the receiving part 11 of the optical fiber 1, if the light-emitting point of the silicon photonic chip 2 is appropriately related to a focus position of the receiving surface 111 of the ellipsoidal surface, then the light emitted by the silicon photonic chip 2 can be effectively converged to the vicinity of another focus after being reflected by the ellipsoidal surface, which is beneficial to the reception of light. Since the ellipsoidal surface can converge the light to the vicinity of a focus, the light energy density in the area is increased, thereby improving the coupling efficiency. The reflective characteristics of the ellipsoidal surface make the reflection angle of the light more concentrated during the reflection process, reduce the scattering and absorption of the light during the reflection process, thereby improving the coupling efficiency. The focusing characteristics of the ellipsoidal surface make the alignment error within a certain range have less influence on the coupling efficiency, improve the alignment tolerance of the system, and make the optical fiber connection structure 100 more stable and reliable in practical applications.

[0067] It should be noted that the curvature radius of the ellipsoidal surface along the optical axis X of the optical fiber 1 is 3.5 μm-9 μm.

[0068] Among them, see Figure 5 , Figure 5 1 is a structural schematic diagram of the optical fiber connection structure 100 when the curvature radius L2 of the ellipsoidal surface in the optical fiber connection structure 100 disclosed in the embodiment of the present application is less than 3.5 μm. Figure 5 The dotted circle in the figure represents a circle with a radius of 3.5 μm, the dotted line represents the light emitted by the silicon photonic chip 2, and the angle between the two dotted lines is the divergence angle of the light emitted by the silicon photonic chip 2. Taking the divergence angle of the light emitted by the silicon photonic chip 2 as 30° as an example, if the radius of curvature of the ellipsoidal surface along the optical axis X of the optical fiber 1 is less than 3.5 μm, the receiving surface 111 of the receiving part 11 is relatively convex, and the receiving part 11 needs to be close to the silicon photonic chip 2. The distance between the receiving surface 111 of the receiving part 11 and the silicon photonic chip 2 is small, which makes it easy for the receiving part 11 to collide with the silicon photonic chip 2, thereby damaging the optical fiber 1 and the silicon photonic chip 2, thereby affecting the normal use and service life of the optical fiber connection structure 100.

[0069] See also Figure 6 , Figure 61 is a structural schematic diagram of the optical fiber connection structure 100 when the curvature radius L2 of the ellipsoidal surface in the optical fiber connection structure 100 disclosed in the embodiment of the present application is greater than 9 μm. Figure 6 The dotted circle in the figure represents a circle with a radius of 9 μm, the dotted line represents the light emitted by the silicon photonic chip 2, and the angle between the two dotted lines is the divergence angle of the light emitted by the silicon photonic chip 2. Taking the divergence angle of the light emitted by the silicon photonic chip 2 as 30° as an example, if the radius of curvature of the ellipsoid along the optical axis X of the optical fiber 1 is greater than 9 μm, the receiving surface 111 of the receiving part 11 is relatively flat, and the receiving part 11 needs to be away from the silicon photonic chip 2. The need for the receiving part 11 to be away from the silicon photonic chip 2 will cause the light to converge farther, and the light convergence effect will be poor. The receiving part 11 cannot completely receive the light emitted by the silicon photonic chip 2, resulting in a decrease in the coupling efficiency between the optical fiber 1 and the silicon photonic chip 2.

[0070] The radius of curvature of the ellipsoidal surface along the optical axis X of the optical fiber 1 is between 3.5μm and 9μm, and the receiving surface 111 of the receiving part 11 does not need to be too close to the silicon photonic chip 2 because the receiving surface 111 is too convex, thereby avoiding the problem of easy collision between the receiving part 11 and the silicon photonic chip 2, protecting the optical fiber 1 and the silicon photonic chip 2 from physical damage caused by the collision, ensuring the integrity of the optical fiber connection structure 100, and helping to maintain the normal use of the optical fiber connection structure 100, reducing the frequency of maintenance and replacement of parts, thereby extending the overall service life; and within the range of 3.5μm-9μm, the receiving surface 111 of the receiving part 11 will not be too flat. This means that the receiving part 11 does not need to be too far away from the silicon photonic chip 2, and can ensure that the light converges within a suitable distance, thereby obtaining a better light convergence effect. Because the receiving part 11 does not need to be too far away from the silicon photonic chip 2 and can receive the light emitted by the silicon photonic chip 2 at a suitable distance, it can avoid the situation where the receiving part 11 cannot completely receive the light emitted by the silicon photonic chip 2, thereby ensuring the coupling efficiency between the optical fiber 1 and the silicon photonic chip 2, so that the optical signal can be effectively transmitted between the optical fiber 1 and the silicon photonic chip 2.

[0071] The selection of the curvature radius of the above-mentioned ellipsoidal surface along the optical axis X of the optical fiber 1 is related to the interval L1 between the receiving part 11 and the silicon photonic chip 2. The curvature radius of the ellipsoidal surface along the optical axis X of the optical fiber 1 and the interval between the receiving part 11 and the silicon photonic chip 2 can be adjusted according to actual conditions and simulation results, so as to achieve the maximum coupling efficiency between the optical fiber 1 and the silicon photonic chip 2.

[0072] In some embodiments, the angle c between the normal section of the ellipsoidal surface and the axis of the optical fiber 1 is related to the maximum incident half-angle α that the optical fiber 1 can receive.

[0073] The angle c between the normal section of the ellipsoid and the axis of the optical fiber 1 and the maximum incident half-angle a that the optical fiber 1 can receive satisfy: ; The enlarged value of the incident angle of the receiving unit 11 to the air side satisfy: ; in, is the maximum total reflection angle transmitted by optical fiber 1, optionally, , determined by the refractive index of the core and cladding of optical fiber 1; The incident angle on the air side when the maximum total reflection is formed from the air to the receiving part, optionally, ; is the refractive index of the core layer of optical fiber 1, ; is the refractive index of air, .

[0074] Taking c=1 as an example, when c=1,

[0075] Take c=5 as an example. When c=5,

[0076] The angle between the normal section of the ellipsoid and the axis of the optical fiber 1 is applied successively The simulation test results are shown in Table 1, where α, The unit is °.

[0077] Table 1

[0078] It can be seen from Table 1 that the enlargement value of the incident angle of the receiving part 11 on the air side increases with the increase of the emission angle of the light emitted by the silicon photonic chip 2. The larger the enlargement value, the more light the transmission part 12 of the optical fiber 1 can receive, and thus the higher the coupling efficiency between the optical fiber 1 and the silicon photonic chip 2.

[0079] It should be noted that the embodiment of the present application does not limit other data of the above-mentioned ellipsoid.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical fiber connection structure, characterized in that: include: Silicon photonic chips; An optical fiber, comprising: A receiving part, the receiving part is arranged corresponding to the silicon photonic chip to receive light emitted by the silicon photonic chip, the receiving part has a receiving surface, and the receiving surface is configured as a quadratic surface protruding toward the silicon photonic chip; as well as A transmitting part, wherein the transmitting part is connected to an end of the receiving part away from the silicon photonic chip, and the transmitting part is configured to transmit the light received by the receiving part.

2. The optical fiber connection structure according to claim 1, characterized in that: The receiving surface is an ellipsoidal surface.

3. The optical fiber connection structure according to claim 2, characterized in that: The curvature radius of the ellipsoidal surface along the optical axis of the optical fiber is 3.5 μm-9 μm.

4. The optical fiber connection structure according to claim 1, characterized in that: The angle between the normal section of the receiving surface and the optical axis of the optical fiber is related to the maximum incident half-angle that the optical fiber can receive.

5. The optical fiber connection structure according to claim 4, characterized in that: Angle between the normal section of the receiving surface and the optical axis of the optical fiber The maximum incident half angle that the optical fiber can receive satisfy: ； The enlarged value of the incident angle of the receiving part to the air side satisfy: ； in, is the maximum total reflection angle transmitted by the optical fiber, which is determined by the refractive index of the core and cladding of the optical fiber; The incident angle on the air side when the maximum total reflection is formed from the air to the receiving part; is the refractive index of the core layer of the optical fiber; is the refractive index of air.

6. The optical fiber connection structure according to claim 1, characterized in that: The receiving surface is spaced apart from the silicon photonic chip.

7. The optical fiber connection structure according to claim 6, characterized in that: The interval L1 between the receiving surface and the silicon photonic chip satisfies: 0 μm<L1≤6 μm.

8. The optical fiber connection structure according to claim 7, characterized in that: The interval L1 between the receiving surface and the silicon photonic chip satisfies: 0.5 μm≤L1≤6 μm.

9. The optical fiber connection structure according to claim 1, characterized in that: The receiving portion and the transmitting portion are integrally formed.

10. The optical fiber connection structure according to claim 9, characterized in that: The receiving surface is formed by grinding.

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