A simultaneous multi-wafer pre-bonding device

Abstract

The present invention belongs to the field of semiconductor technology, and is particularly a device for pre-bonding multiple wafers at the same time, comprising a frame, a film material feeding assembly is installed on the upper surface of the frame, a film material separation assembly is installed on the upper surface of the frame, a film material recovery assembly is installed on the upper surface of the frame, a vacuum pressing chamber assembly is installed on the upper surface of the frame, and a lifting mechanism is installed on the upper surface of the frame. The second Z-axis drive unit is conducive to driving the upper chamber to move downward and merge with the lower chamber to form a closed chamber, which is conducive to the molecular pump to evacuate the closed chamber to vacuum, thereby ensuring that the wafer pre-packaging bonding process will not produce tiny bubbles with the bonding process of the lower substrate, thereby improving the yield rate. The setting of the five-axis pressure mechanism can facilitate the downward movement of the airbag pressing mechanism and the upper fixture heating and cooling unit. In addition, the airbag in the airbag pressing mechanism can be filled with CDA gas through a proportional valve, so that the upper pressure plate presses the wafer.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a device for pre-bonding multiple wafers at the same time. Background Art

[0002] Wafer bonding is a key process in semiconductor manufacturing, which is used to bond two or more wafers together to achieve the connection of different materials or structures. Wafer bonding technology can be divided into two types: permanent bonding and temporary bonding. Permanent bonding is to permanently bond wafers together through chemical or physical reactions, while temporary bonding is to temporarily bond wafers together through dielectric materials for subsequent processing. Since the platform is in a heated state during the entire wafer bonding process, the embedded and fixed glue is in a softened active state. Since it is always in a normal pressure environment, the implanted wafers and the softened active glue may have the risk of bubbles, affecting the yield. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a device for pre-bonding multiple wafers at the same time, which solves the problems raised in the above background technology.

[0004] To achieve the above-mentioned object, the present invention provides the following technical solutions: a simultaneous multi-wafer pre-bonding device, comprising a frame, a film material feeding assembly is installed on the upper surface of the frame, a film material separation assembly is installed on the upper surface of the frame, a film material recovery assembly is installed on the upper surface of the frame, a vacuum pressing chamber assembly is installed on the upper surface of the frame, a lifting mechanism is installed on the upper surface of the frame, and a thickened square tube is installed on the upper surface of the frame;

[0005] The film material feeding assembly comprises a film feeding motor, a film feeding rubber roller, a film pressing assembly, a torque motor and an air expansion shaft;

[0006] The membrane material separation assembly includes a membrane material separation rubber roller, an X-axis drive unit and a Z-axis drive unit;

[0007] The film material recovery assembly includes a film collecting motor, an automatic deviation correction mechanism, a second film pressing assembly, a second air expansion shaft, a second torque motor and a film collecting rubber roller;

[0008] The vacuum pressing chamber assembly includes an upper chamber, a lower chamber, a Roots pump, a five-axis pressing mechanism, a fixture heating and cooling unit, an airbag pressing mechanism and a molecular pump;

[0009] The fixture heating and cooling unit includes a heat insulation plate, a cooling plate, a heating plate, an upper pressing plate and a lower pressing plate;

[0010] The lifting mechanism comprises a lifting Z-axis power mechanism, a sealing bellows and a suction nozzle.

[0011] Preferably, the molecular pump is located on the side of the lower cavity, and a pipeline is installed between the Roots pump and the lower cavity.

[0012] Preferably, the airbag pressing mechanism includes an upper base plate, a lower floating plate, an airbag and a guide mechanism, and the airbag pressing mechanism is located above the fixture heating and cooling unit.

[0013] Preferably, the positions of the upper cavity and the lower cavity overlap each other.

[0014] Preferably, the adsorption nozzle vertically penetrates the fixture heating and cooling unit.

[0015] Preferably, the vacuum pressing cavity assembly further includes a second Z-axis driving unit, and the second Z-axis driving unit is installed on the inner side of the thickened square tube and connected to the upper cavity.

[0016] Preferably, the airbag pressing mechanism further includes a proportional valve, and the proportional valve is connected to the airbag.

[0017] Preferably, an angle valve is installed at the end of the pipeline, and the pipeline is Y-shaped.

[0018] Preferably, the five-axis pressure mechanism further includes a second upper base plate, and a stress release groove is provided between the second upper base plate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The simultaneous multi-wafer pre-bonding equipment, the film material feeding component can drive the PI film material through the film feeding motor and the film pressing component 1 to complete the feeding, the film pressing component 1 can stabilize the PI film material, the film material recovery component can timely rewind the waste film through the film winding motor and the torque motor 2 to drive the air expansion shaft 2, the torque motor 1 and the torque motor 2 can respectively drive the air expansion shaft 1 and the air expansion shaft 2 to roll, which is conducive to keeping the PI film material in a tensioned state, and the automatic correction mechanism is conducive to automatically correcting the PI film material to avoid affecting the winding.

[0021] 2. The simultaneous multi-wafer pre-bonding equipment is provided with a lifting mechanism, and its lifting Z-axis power mechanism can drive the adsorption nozzle to adjust the height. The top of the adsorption nozzle can carry the substrate with the wafer. After the lifting Z-axis power mechanism drives the adsorption nozzle to move downward, the substrate with the wafer will be placed on the lower pressure plate. Through the upper cavity cooperating with the lower cavity, the Z-axis drive unit 2 is conducive to driving the upper cavity to move downward and merge with the lower cavity to form a closed cavity, which is conducive to the molecular pump to evacuate the closed cavity, thereby ensuring that the wafer pre-packaging bonding process will not produce tiny bubbles with the gluing process of the lower substrate, thereby improving the quality. rate, the setting of the five-axis pressure mechanism can facilitate the downward movement of the airbag pressing mechanism and the upper fixture heating and cooling unit. In addition, the airbag in the airbag pressing mechanism can be filled with CDA gas through a proportional valve, so that the upper pressure plate can press the wafer. The airbag cooperates with the guide mechanism and the lower floating plate to ensure that the wafer pre-packaging pressing process can provide uniform pressure when embedded in different states of the glass substrate, and in this process, the heating plate in the fixture heating and cooling unit can ensure that the upper and lower pressure plates are evenly heated, thereby ensuring that the temperature of each crystal surface during the pre-packaging pressing process is consistent.

[0022] 3. The simultaneous multi-wafer pre-bonding equipment, through the setting of the angle valve, can facilitate the external CDA gas source to enter the closed cavity formed by the upper cavity and the lower cavity through the pipeline after opening, so as to break the vacuum, so as to facilitate the separation of the upper cavity and the lower cavity. By controlling the proportional valve to move the valve core, the CDA gas in the airbag can be discharged, thereby achieving the purpose of pressure relief in the airbag. Through the setting of the film separation component, the PI film passes through the film separation rubber roller, so that the X-axis drive unit cooperates with the Z-axis drive unit to separate the PI film adhered to the substrate from the substrate by driving the film separation rubber roller to move horizontally and vertically. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 It is a complete structural schematic diagram of the present invention;

[0025] Figure 2 It is a front view of the membrane material supply assembly of the present invention;

[0026] Figure 3 It is a side view of the membrane material supply assembly of the present invention;

[0027] Figure 4 It is a side view of the membrane separation assembly of the present invention;

[0028] Figure 5It is a front view of the film material recovery assembly of the present invention;

[0029] Figure 6 It is a side view of the film material recovery assembly of the present invention;

[0030] Figure 7 It is a structural diagram of the jacking mechanism of the present invention;

[0031] Figure 8 It is a structural diagram of the heating and cooling unit and the airbag pressing mechanism of the jig of the present invention;

[0032] Fig. 9 It is a side view of the heating and cooling unit and the airbag pressing mechanism of the jig of the present invention;

[0033] Fig.10 is a cross-sectional view of the airbag pressing mechanism of the present invention;

[0034] Fig.11 It is a cross-sectional view of the heating and cooling unit of the jig of the present invention;

[0035] Fig.12 It is a structural diagram of the lower cavity of the present invention;

[0036] Fig.13 For the present invention Fig.12 Enlarged view of point A in the middle;

[0037] Fig.14 It is a structural diagram of the five-axis pressure mechanism of the present invention.

[0038] Among them: 1 frame, 2 film material feeding assembly, 2-1 film supply motor, 2-2 film supply rubber roller, 2-3 film pressing assembly 1, 2-4 torque motor 1, 2-5 air expansion shaft 1, 3 film material separation assembly, 3-1 film material separation rubber roller, 3-2 X-axis drive unit, 3-3 Z-axis drive unit 1, 4 film recovery assembly, 4-1 film collection motor, 4-2 automatic deviation correction mechanism, 4-3 film pressing assembly 2, 4-4 air expansion shaft 2, 4-5 torque motor 2, 4-6 film collection rubber roller, 5 vacuum pressing chamber assembly, 5-1 upper chamber, 5-2 lower chamber, 5-3 roots pump, 5-4 five-axis pressure mechanism, 5-4-1 upper bottom plate 2, 5-4-2 stress release groove, 5-5 fixture heating and cooling unit, 5-5-1 insulation board, 5-5-2 cooling plate, 5-5-3 heating plate, 5-5-4 upper pressure plate, 5-5-5 lower pressure plate, 5-6 airbag pressing mechanism, 5-6-1 upper bottom plate 1, 5-6-2 lower floating plate, 5-6-3 airbag, 5-6-4 guide mechanism, 5-6-5 proportional valve, 5-7 molecular pump, 5-8 Z-axis drive unit 2, 6 lifting mechanism, 6-1 lifting Z-axis power mechanism, 6-2 sealing bellows, 6-3 adsorption nozzle, 7 thickened square tube, 8 pipeline, 9 angle valve. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See also Figure 1-14 The present invention provides the following technical solutions: a simultaneous multi-wafer pre-bonding device, comprising a frame 1, a film material feeding assembly 2 is installed on the upper surface of the frame 1, a film material separation assembly 3 is installed on the upper surface of the frame 1, a film material recovery assembly 4 is installed on the upper surface of the frame 1, a vacuum pressing chamber assembly 5 is installed on the upper surface of the frame 1, a lifting mechanism 6 is installed on the upper surface of the frame 1, and a thickened square tube 7 is installed on the upper surface of the frame 1;

[0041] The film material feeding assembly 2 includes a film feeding motor 2-1, a film feeding rubber roller 2-2, a film pressing assembly 2-3, a torque motor 2-4 and an air expansion shaft 2-5;

[0042] The membrane material separation assembly 3 includes a membrane material separation rubber roller 3-1, an X-axis driving unit 3-2 and a Z-axis driving unit 3-3;

[0043] The film material recovery component 4 includes a film collecting motor 4-1, an automatic deviation correction mechanism 4-2, a second film pressing component 4-3, a second air expansion shaft 4-4, a second torque motor 4-5 and a film collecting rubber roller 4-6;

[0044] The vacuum pressing chamber assembly 5 includes an upper chamber 5-1, a lower chamber 5-2, a Roots pump 5-3, a five-axis pressing mechanism 5-4, a fixture heating and cooling unit 5-5, an airbag pressing mechanism 5-6 and a molecular pump 5-7;

[0045] The fixture heating and cooling unit 5-5 includes a heat insulation plate 5-5-1, a cooling plate 5-5-2, a heating plate 5-5-3, an upper pressing plate 5-5-4 and a lower pressing plate 5-5-5;

[0046] The lifting mechanism 6 includes a lifting Z-axis power mechanism 6-1, a sealing bellows 6-2 and a suction nozzle 6-3.

[0047] In this embodiment, the film material feeding component 2 can drive the PI film material through the film feeding motor 2-1 and the film pressing component 2-3 to complete the feeding, and the film pressing component 2-3 can stabilize the PI film material. The film material recovery component 4 can timely rewind the waste film through the film winding motor 4-1 and the torque motor 2 4-5 to drive the air expansion shaft 2 4-4. The torque motor 1 2-4 and the torque motor 2 4-5 can respectively drive the air expansion shaft 1 2-5 and the air expansion shaft 2 4-4 to roll, which is conducive to keeping the PI film material in a tensioned state. The automatic deviation correction mechanism 4-2 is conducive to automatically correcting the PI film material to avoid affecting the rewinding. By providing a jacking mechanism 6, its jacking Z-axis power mechanism 6-1 can drive the adsorption nozzle 6-3 to adjust the height, and the adsorption The top of the suction nozzle 6-3 can carry the substrate with the wafer. After the lifting Z-axis power mechanism 6-1 drives the suction nozzle 6-3 to move downward, the substrate with the wafer will be placed on the lower pressure plate 5-5-5. Through the upper cavity 5-1 cooperating with the lower cavity 5-2, the Z-axis drive unit 2 5-8 is conducive to driving the upper cavity 5-1 to move downward and merge with the lower cavity 5-2 to form a closed cavity, which is conducive to the molecular pump 5-7 to evacuate the closed cavity to vacuum, thereby ensuring that the wafer pre-packaging bonding process will not produce tiny bubbles with the gluing process of the lower substrate, thereby improving the yield. The setting of the five-axis pressure mechanism 5-4 can facilitate the promotion of the airbag pressing mechanism 5-6 and the upper fixture heating and cooling unit 5-5 In addition, CDA gas can be filled into the airbag 5-6-3 in the airbag pressing mechanism 5-6 through the proportional valve 5-6-5, so that the upper pressure plate 5-5-4 presses the wafer, and the airbag 5-6-3 cooperates with the guide mechanism 5-6-4 and the lower floating plate 5-6-2 to ensure that the wafer pre-packaging pressing process can provide uniform pressure when the wafer is embedded in different states of the glass substrate, and in this process, the heating plate 5-5-3 in the fixture heating and cooling unit 5-5 can ensure that the upper pressure plate 5-5-4 and the lower pressure plate 5-5-5 are evenly heated, so as to ensure that the temperature of each crystal surface during the pre-packaging pressing process is consistent, and through the setting of the angle valve 9, it is opened after The external CDA gas source can enter the closed cavity formed by the upper cavity 5-1 and the lower cavity 5-2 through the pipeline 8, so as to break the vacuum, so as to separate the upper cavity 5-1 from the lower cavity 5-2. By controlling the proportional valve 5-6-5 to move its valve core, the CDA gas in the airbag 5-6-3 can be discharged, thereby achieving the purpose of pressure relief in the airbag 5-6-3. Through the setting of the film separation component 3, the PI film passes through the film separation rubber roller 3-1, so that the X-axis drive unit 3-2 cooperates with the Z-axis drive unit 3-3 to separate the PI film adhered to the substrate from the substrate by driving the film separation rubber roller 3-1 to move horizontally and vertically.

[0048] Specifically, the molecular pump 5-7 is located on the side of the lower cavity 5-2 so as to directly evacuate the closed cavity formed by the lower cavity 5-2 and the upper cavity 5-1. A pipeline 8 is installed between the Roots pump 5-3 and the lower cavity 5-2. Through the setting of the Roots pump 5-3, it can work before the molecular pump 5-7 works, so that the closed cavity can be evacuated to an internal pressure value of less than 500Pa through the pipeline 8, and the molecular pump 5-7 works again, and finally reaches 0.5Pa, so that a high vacuum environment is achieved in the closed cavity.

[0049] Specifically, the airbag pressing mechanism 5-6 includes an upper base plate 5-6-1, a lower floating plate 5-6-2, an airbag 5-6-3 and a guide mechanism 5-6-4. The airbag 5-6-3 is filled with CDA gas and expands so as to push the lower floating plate 5-6-2 downward through the guide mechanism 5-6-4. The airbag pressing mechanism 5-6 is located above the jig heating and cooling unit 5-5, which is conducive to forming a uniform pressure on the jig heating and cooling unit 5-5.

[0050] Specifically, the positions of the upper cavity 5-1 and the lower cavity 5-2 overlap each other, so that the upper cavity 5-1 can be moved downward through the Z-axis driving unit 5-8 to merge with the lower cavity 5-2 aligned below.

[0051] Specifically, the adsorption nozzle 6-3 vertically penetrates the jig heating and cooling unit 5-5, so that after the adsorption nozzle 6-3 is driven downward by the lifting Z-axis power mechanism 6-1, the substrate with the chip carried on its top can be placed on the lower pressure plate 5-5-5 of the jig heating and cooling unit 5-5 below. When the adsorption nozzle 6-3 cooperates with the robot arm outside the device, it can complete the loading and unloading of the substrate with the chip.

[0052] Specifically, the vacuum pressing cavity assembly 5 also includes a Z-axis driving unit 5-8, and the Z-axis driving unit 5-8 is installed on the inner side of the thickened square tube 7 and connected to the upper cavity 5-1. The setting of the Z-axis driving unit 5-8 is conducive to driving the upper cavity 5-1 to move vertically.

[0053] Specifically, the airbag pressing mechanism 5-6 also includes a proportional valve 5-6-5, and the proportional valve 5-6-5 is connected to the airbag 5-6-3. The proportional valve 5-6-5 can be connected to an external CDA gas source through a connecting pipe, so that controlling the proportional valve 5-6-5 to change its valve core can control the CDA gas to enter the airbag 5-6-3 or be discharged from the airbag 5-6-3.

[0054] Specifically, an angle valve 9 is installed at the end of the pipeline 8, and the pipeline 8 is Y-shaped. One end of the pipeline 8 can also be connected to an external CDA gas source. By controlling the angle valve 9 to open, the CDA gas can enter the closed cavity to break the vacuum of the closed cavity.

[0055] Specifically, the five-axis pressing mechanism 5-4 also includes an upper base plate 5-4-1, and a stress release groove 5-4-2 is opened between the upper base plates 5-4-1. Through the setting of the stress release groove 5-4-2, the pressing mechanism can easily fine-tune the flatness of the upper pressure plate 5-5-4, thereby ensuring the consistency of the upper force applied during the pressing process of each chip package, and ensuring that all parts of the entire panel of the upper pressure plate 5-5-4 have force applied.

[0056] The working principle and use process of the present invention are as follows: the wafers need to be neatly arranged on the surface of the substrate before lamination. The surface of the substrate has weak viscosity, so as to ensure that the wafers will not be displaced above the substrate. The PI film material needs to pass between the lamination component 2-3 and the film supply rubber roller 2-2, between the upper pressing plate 5-5-4 and the lower pressing plate 5-5-5, between the automatic deviation correction mechanism 4-2, and between the lamination component 2 4-3. The lamination component 2-3 can be driven by the film supply motor 2-1 to drive the PI film material to complete the feeding. The lamination component 2-3 can stabilize the PI film material, and then the substrate with the wafer passes through the tooth fork of the robot arm. The wafer is transferred to the top of the suction nozzle 6-3, and the suction nozzle 6-3 is driven downward by the lifting Z-axis power mechanism 6-1. The substrate with the wafer will be placed on the lower pressure plate 5-5-5. The Z-axis drive unit 5-8 is conducive to driving the upper cavity 5-1 downward to merge with the lower cavity 5-2 to form a closed cavity. The sealing bellows 6-2 can prevent leakage in the closed cavity and improve the airtightness. Then the Roots pump 5-3 is started to pump the closed cavity through the pipeline 8 to an internal pressure value of less than 500Pa. Then the molecular pump 5-7 is started again to work, and finally the closed cavity is pumped to a pressure value of 0.5Pa, so that a high vacuum environment is reached in the closed cavity, and the five-axis pressure mechanism 5-4 is started to push the airbag pressing mechanism 5-6 and the upper fixture heating and cooling unit 5-5 to move downward, and the airbag 5-6-3 in the airbag pressing mechanism 5-6 can be filled with CDA gas through the proportional valve 5-6-5, so that the upper pressure plate 5-5-4 presses the wafer to ensure that during the wafer pre-packaging pressing process, the wafer pre-packaging pressing process can provide uniform pressure when embedded in different states of the glass substrate, and in this process, the heating plate 5-5-3 in the fixture heating and cooling unit 5-5 can evenly heat the upper pressure plate 5-5-4 and the lower pressure plate 5-5-5, so as to ensure that the temperature of each crystal surface during the pre-packaging pressing process is consistent, and then the angle valve 9 can be opened to allow CDA gas to enter the closed cavity, so as to break the vacuum of the closed cavity, thereby facilitating the separation of the upper cavity 5-1 and the lower cavity 5-2, and the proportional valve 5-6-5 is controlled to move its valve core, so as to facilitate the airbag 5-6-3 The CDA gas is discharged, thereby achieving the purpose of pressure relief in the airbag 5-6-3, and then the X-axis drive unit 3-2 and the Z-axis drive unit 3-3 of the film separation component 3 are operated. Since the PI film passes through the film separation rubber roller 3-1, the X-axis drive unit 3-2 cooperates with the Z-axis drive unit 3-3 to drive the film separation rubber roller 3-1 to move horizontally and vertically to separate the PI film adhered to the substrate from the substrate. Then the film recovery component 4 starts to drive the film pressing component 2 4-3 through the film collection motor 4-1 and cooperates with the torque motor 2 4-5 to drive the air expansion shaft 2 4-4 to rewind the waste film in time. The automatic deviation correction mechanism 4-2 is conducive to automatic deviation correction of the PI film to avoid affecting the rewinding. After that, the lifting Z-axis power mechanism 6-1 is started again to drive the suction nozzle 6-3 to move upward, so that the upper substrate is separated from the lower pressure plate 5-5-5, and then the tooth fork of the robot arm transfers the pressed substrate to the downstream. Among them, the input ends of the electrical equipment in this equipment are all electrically connected to the external power supply. .

[0057] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device for pre-bonding multiple wafers simultaneously, comprising a frame (1), characterized in that: The upper surface of the frame (1) is provided with a film material supply assembly (2), the upper surface of the frame (1) is provided with a film material separation assembly (3), the upper surface of the frame (1) is provided with a film material recovery assembly (4), the upper surface of the frame (1) is provided with a vacuum pressing chamber assembly (5), the upper surface of the frame (1) is provided with a lifting mechanism (6), and the upper surface of the frame (1) is provided with a thickened square tube (7); The film material supply assembly (2) comprises a film supply motor (2-1), a film supply rubber roller (2-2), a film pressing assembly (2-3), a torque motor (2-4) and an air expansion shaft (2-5); The membrane material separation component (3) comprises a membrane material separation rubber roller (3-1), an X-axis drive unit (3-2) and a Z-axis drive unit (3-3); The film material recovery component (4) comprises a film collecting motor (4-1), an automatic deviation correction mechanism (4-2), a second film pressing component (4-3), a second air expansion shaft (4-4), a second torque motor (4-5) and a film collecting rubber roller (4-6); The vacuum pressing cavity assembly (5) comprises an upper cavity (5-1), a lower cavity (5-2), a Roots pump (5-3), a five-axis pressing mechanism (5-4), a fixture heating and cooling unit (5-5), an airbag pressing mechanism (5-6) and a molecular pump (5-7); the fixture heating and cooling unit (5-5) is located inside the upper cavity (5-1) and the lower cavity (5-2), respectively, and the airbag pressing mechanism (5-6) is located inside the upper cavity (5-1) and above the fixture heating and cooling unit (5-5); The fixture heating and cooling unit (5-5) comprises a heat insulation plate (5-5-1), a cooling plate (5-5-2), a heating plate (5-5-3), an upper pressing plate (5-5-4) and a lower pressing plate (5-5-5); The lifting mechanism (6) comprises a lifting Z-axis power mechanism (6-1), a sealing bellows (6-2) and a suction nozzle (6-3).

2. The device for pre-bonding multiple wafers simultaneously according to claim 1, characterized in that: The molecular pump (5-7) is located on the side of the lower cavity (5-2), and a pipeline (8) is installed between the Roots pump (5-3) and the lower cavity (5-2).

3. The simultaneous multi-wafer pre-bonding device according to claim 1, characterized in that: The airbag pressing mechanism (5-6) comprises an upper base plate (5-6-1), a lower floating plate (5-6-2), an airbag (5-6-3) and a guide mechanism (5-6-4), and the airbag pressing mechanism (5-6) is located above the fixture heating and cooling unit (5-5).

4. The simultaneous multi-wafer pre-bonding device according to claim 1, characterized in that: The upper cavity (5-1) and the lower cavity (5-2) overlap in position.

5. The simultaneous multi-wafer pre-bonding device according to claim 1, characterized in that: The adsorption nozzle (6-3) vertically penetrates the fixture heating and cooling unit (5-5).

6. The simultaneous multi-wafer pre-bonding device according to claim 1, characterized in that: The vacuum pressing cavity assembly (5) further comprises a second Z-axis driving unit (5-8), and the second Z-axis driving unit (5-8) is installed on the inner side of the thickened square tube (7) and connected to the upper cavity (5-1).

7. The simultaneous multi-wafer pre-bonding device according to claim 1, characterized in that: The airbag pressing mechanism (5-6) further comprises a proportional valve (5-6-5), and the proportional valve (5-6-5) is connected to the airbag (5-6-3).

8. The simultaneous multi-wafer pre-bonding device according to claim 2, characterized in that: An angle valve (9) is installed at the end of the pipeline (8), and the pipeline (8) is Y-shaped.

9. The simultaneous multi-wafer pre-bonding device according to claim 1, characterized in that: The five-axis pressure mechanism (5-4) further comprises a second upper base plate (5-4-1), and a stress release groove (5-4-2) is provided between the second upper base plates (5-4-1).

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