Etching device for semiconductor chip production

Abstract

The invention discloses an etching device for semiconductor chip production, comprising: an etching unit comprising an etching bin; the placing unit is movably arranged in the etching bin; and the processing unit is arranged at the top of the etching bin. The arc-shaped plate can be pulled back and forth through the pushing piece, the cylinder reciprocates on the surface of the round rod rail, or the motor rotates forwards and backwards to drive the wire roller to contract or release the anti-corrosion rope, so that the anti-corrosion rope drives the placing plate to move up and down in the etching bin; therefore, a first moving part continuously reciprocates among a second shrinking plate, a second connecting plate and a second expanding plate, a first transverse connecting plate and a second transverse connecting plate intermittently clamp a chip, and a second moving part continuously reciprocates among the second shrinking plate, the second connecting plate and the second expanding plate. And the outer clamping plate, the inner clamping plate, the first transverse connecting plate and the first display plate alternately clamp the chips at intervals, so that the etching effect of the chips is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip production, and in particular to an etching device used for semiconductor chip production. Background Art

[0002] The etching process in semiconductor chip production is a micromachining technology that mainly uses chemical methods to selectively remove materials from the chip surface.

[0003] Chinese patent CN116031183A discloses an etching device for semiconductor chip production, including a containing box, an etching box, a support column, a top mounting plate, an extrusion anti-rust height adjustment component and a retractable magnetic drive component. The above scheme belongs to the field of semiconductor chip production technology. The winding anti-corrosion rope can take out the semiconductor chip from the etching liquid. At the same time, when the winding anti-corrosion rope passes through the absorbent cotton, the etching liquid adhered to the winding anti-corrosion rope can be absorbed by the absorbent cotton to prevent the etching liquid from adhering to the winding anti-corrosion rope for a long time. At the same time, the etching liquid in the absorbent cotton can use the seepage effect of the liquid to flow into the collection box through the seepage capillaries, which greatly increases the water absorption of the absorbent cotton.

[0004] The above patents and prior art have the following problems: When the existing absorbent cotton absorbs the anti-corrosion rope, it will contaminate the absorbent cotton, making it impossible to reuse the absorbent cotton. In addition, the absorbent cotton will rub the anti-corrosion rope, which will cause residues on the anti-corrosion rope. When the above-mentioned patented chip is placed on the leak plate, the up and down movement of the leak plate will cause the chip to slide on the surface of the leak plate, which will easily cause the chip to wear. In addition, the contact surface between the chip and the leak plate will be blocked, resulting in incomplete etching of the chip, affecting the processing quality of the chip. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: An etching device for semiconductor chip production, comprising: An etching unit, the etching unit comprising an etching chamber, the etching chamber being a concave-convex space formed by a first side plate, a second side plate and a bottom plate; A placement unit, wherein the placement unit is movably disposed inside the etching chamber; The placement unit comprises a placement plate, which is movably arranged inside the etching chamber, and a plurality of placement grooves are arranged inside the placement plate, and a first cross-connecting plate and a second cross-connecting plate for clamping the upper and lower sides of the chip, and an outer clamping plate and an inner clamping plate for clamping the side of the chip are arranged inside the placement groove, and the first cross-connecting plate and the second cross-connecting plate and the outer clamping plate and the inner clamping plate reciprocate and contact with the chip under the guidance of the concave and convex space of the etching chamber; A processing unit, wherein the processing unit is arranged on the top of the etching chamber; The processing unit includes a card bin symmetrically and movably arranged on the top of the etching bin for closing the sealing placement plate, a mounting frame is arranged on the side of the card bin, and a water control part and an air control part for cleaning the placement unit, as well as a pushing part for controlling the closing of the card bin are arranged on the surface of the mounting frame.

[0007] As a preferred embodiment of the etching device for semiconductor chip production of the present invention, the first side plates are symmetrically arranged on the left and right sides of the etching chamber, and the second side plates are symmetrically arranged on the front and rear sides of the etching chamber; The first side plate is composed of a first contraction plate, a first expansion plate, and a first connecting plate obliquely connected between the first contraction plate and the first expansion plate; The second side plate is composed of a mounting section plate, a second contraction plate, a second expansion plate and a second connecting plate. The second contraction plate and the second expansion plate are obliquely connected by a second connecting plate. The mounting section plate is inclined outwardly and arranged on the top of the second contraction plate.

[0008] As a preferred solution of the etching device for semiconductor chip production of the present invention, wherein: the distance between the first shrinking plate and the center of the etching chamber is smaller than the distance between the first expanding plate and the center of the etching chamber; The distances between the second expansion plate, the installation section plate and the second contraction plate and the center of the etching chamber decrease successively, and the height of the second connecting plate between the second contraction plate and the second expansion plate is lower than the height of the first connecting plate between the first contraction plate and the first expansion plate.

[0009] As a preferred solution of the etching device for semiconductor chip production of the present invention, wherein: a vertical plate is installed on the top of the first expansion plate, circular sleeves are symmetrically installed on the front and rear sides of the vertical plate, a scraper contacting with the anti-corrosion rope is installed on the side of the circular sleeve close to the etching chamber, and a circular ring rod is installed on the bottom of the scraper corresponding to the surface of the vertical plate; A round bar rail is extended outwardly from one side of the vertical plate opposite to the etching chamber.

[0010] As a preferred solution of the etching device for semiconductor chip production of the present invention, wherein: the vertical plate is fixedly connected to the mounting frame through a round bar rail, and side rails are symmetrically installed on the left and right sides of the vertical plate; The surface of the round rod rail is movably sleeved with a cylinder, a retaining ring is arranged on the side of the cylinder close to the vertical plate, a retaining plate is fixedly connected to the side of the cylinder opposite to the vertical plate, and the cylinder is fixedly connected to the radian plate through the retaining plate.

[0011] As a preferred solution of the etching device for semiconductor chip production described in the present invention, the output shaft of the pushing member movably passes through the mounting frame and is fixedly connected with the radian plate, and a sliding block is movably sleeved on the surface of the cylinder; the sliding block is arranged between the baffle ring and the baffle plate.

[0012] As a preferred solution of the etching device for semiconductor chip production of the present invention, wherein: the left and right sides of the sliding block are movably connected with connecting rods, the sliding block is movably connected to the column through the connecting rod, and the bottom of the column is fixedly arranged inside the card bin; A card slot corresponding to the vertical plate is provided at the bottom of the card bin, a card bin is slidably provided on the surface of the side rail, slots and plugs are symmetrically installed on opposite sides of the card bin, and an air outlet is provided on the top of the card bin.

[0013] As a preferred solution of the etching device for semiconductor chip production of the present invention, wherein: a plurality of first movable rods are arranged on the opposite surface of the placement plate and the second side plate, a first movable member is installed on the opposite surface of the first movable rod and the second side plate, a first elastic member is sleeved on the surface of the first movable rod, and a first elastic member is arranged between the first movable member and the placement plate; A plurality of second movable rods are arranged on the opposite surface of the placement plate and the first side plate, a second movable member is installed on the opposite surface of the second movable rod and the first side plate, and a second elastic member is sleeved on the surface of the second movable rod.

[0014] As a preferred solution of the etching device for semiconductor chip production of the present invention, a moving beam plate is movably installed on the side of the placement groove close to the first moving member, a fixed beam plate is fixedly connected to the side of the placement groove opposite to the first moving member, a second cross-connecting plate is arranged on the upper and lower sides of the fixed beam plate, a second drainage groove is opened on the surface of the second cross-connecting plate, and second extension plates extend outward from the four corners of the fixed beam plate; The dynamic beam plate is symmetrically installed with a first cross-connecting plate above and below, a first drainage groove is opened on the surface of the first cross-connecting plate, and a first expansion plate is extended outward at four corners of the dynamic beam plate. Cross-expansion rods are symmetrically arranged on the left and right sides of the dynamic beam plate, and the top of the placement plate is fixedly connected with the cross-expansion rod. A second elastic member is arranged between the second movable member and the cross-expansion rod, and the second movable rod is movably installed inside the cross-expansion rod. An outer clamping plate and an inner clamping plate are respectively arranged on the inner sides of the cross-expansion rods on the left and right sides of the dynamic beam plate, and second movable rods are installed on the outer sides of the outer clamping plate and the inner clamping plate.

[0015] As a preferred solution of the etching device for semiconductor chip production of the present invention, wherein: the four corners of the placement plate are provided with downward extension rods, the placement plate is fixedly connected to the filter plate through the downward extension rods, and the filter plate is surrounded by connecting spring plates; The top surfaces of the four corners of the placement plate are fixedly connected with anti-corrosion ropes, and the placement plate is fixedly connected with the side of the radian plate after the anti-corrosion ropes pass through the circular ring rod and the circular sleeve.

[0016] Beneficial effects of the present invention: When the first movable member moves to the top of the second shrinking plate, the chip is clamped by the first cross-connection plate and the second cross-connection plate. After clamping, the placement plate drives the chip clamped at its top to continue to move along the second shrinking plate, thereby maintaining the clamping state. At this time, the second movable member moves to the surface of the first expansion plate, and the first expansion plate does not squeeze the second movable member, thereby reducing the chip wear caused by accidental sliding of the etched chip during the etching process.

[0017] When the placement plate moves to the inside of the etching chamber corresponding to the second contraction plate, the etching liquid inside the etching chamber will contact the chip to cause the chip to be etched, and the filter plate at the bottom of the placement plate will first contact the etching liquid when the placement plate moves downward, so that the dirt filtered last time inside the etching liquid is partially isolated, and the connecting spring plate arranged on the outside of the filter plate is to fit the concave and convex space inside the etching chamber to increase the filtering effect of the filter plate. The area of ​​the connecting spring plate plus the filter plate is larger than the cross-sectional area of ​​any point inside the etching chamber. At the same time, when the placement plate stops etching, the filter plate will also be lifted inside the etching liquid along with the placement plate, thereby filtering the dirt left by this etching to ensure the cleanliness of the etching liquid.

[0018] During the etching process of the chip, the pushing member continues to push the arc plate to move toward the inside of the etching chamber, so that the anti-corrosion rope continues to be released, and then the placement plate at the bottom of the anti-corrosion rope continues to move toward the bottom of the etching chamber. When the placement plate moves to the position of the first connecting plate, the gradually shrinking distance between the first connecting plate and the center of the etching chamber will squeeze the second moving member to drive the second movable rod to approach the placement plate, and the second moving members on both sides of the placement plate are in contact with the corresponding first connecting plates on both sides, so that the outer clamping plates and inner clamping plates on both sides of the movable beam plate are driven by the second moving member to drive the second movable rod and the transmission of the outer connecting plate and the inner connecting plate, so that the side of the chip is clamped.

[0019] The arc plate is moved toward the etching chamber to make the placement plate continue to move downward, and the first movable member on the side of the placement plate is guided by the second connecting plate to enter the interior of the second expansion plate, so that the extrusion of the first movable member and the first movable rod is released, and then the extruded first elastic member pushes the first movable member and the first movable rod to reset, so that the first movable rod drives the first cross-connecting plate to reset, so that the component mounting surface of the chip is exposed, thereby driving the alternating clamping of each surface of the chip through the movement of the placement plate, so that the area of ​​the chip that can be etched is increased, the clamping obstruction is reduced, and the chip etching effect is increased under the condition of stable clamping.

[0020] The pushing member can be used to reciprocate the arc plate through the cylinder to make reciprocating motion on the surface of the round rod rail, or the motor can be rotated forward and reversely to drive the line roller to contract or release the anti-corrosion rope, so that the anti-corrosion rope drives the placement plate to move up and down inside the etching chamber, so that the first moving member continuously reciprocates between the second contraction plate, the second connecting plate and the second expansion plate, so that the first cross-connecting plate and the second cross-connecting plate intermittently clamp the chip, and the second moving member continuously reciprocates between the second contraction plate, the second connecting plate and the second expansion plate, so that the outer clamping plate and the inner clamping plate intermittently clamp the chip with the first cross-connecting plate and the first expansion plate, thereby improving the etching effect of the chip.

[0021] During the descending movement of the placement plate, the liquid at the bottom of the placement plate will pass through the filter plate and the placement groove, and then pass through the first expansion plate and the second expansion plate at the bottom of the first cross-connecting plate and the second cross-connecting plate, so that the liquid passes through the space of the first drainage groove and the second drainage groove, and enters the space of the dynamic beam plate and the fixed beam plate relative to the chip, so that the chip surface is combined with the up and down swinging of the placement plate and the focusing effect of the first expansion plate and the second expansion plate, so that the chip is more comprehensively and fully etched. Similarly, when the placement plate is lifted, the water flow on the top of the placement plate will be guided by the first expansion plate and the second expansion plate at the top of the first cross-connecting plate and the second cross-connecting plate, and then flushed to the chip surface through the first drainage groove and the second drainage groove, thereby improving the etching effect of the chip.

[0022] When the first transverse connecting plate approaches the second transverse connecting plate, it will drive the sealing plate to be pulled out of the inside of the placement plate, so that the sealing plate can seal the space after the first transverse connecting plate moves, so that the water flow at the bottom of the placement plate can only pass through the space of the placement groove after the shrinkage, and then be guided by the first display plate and the second display plate, thereby improving the flow gathering effect of the first display plate and the second display plate.

[0023] When the chip is completely etched within the preset time, the moving groove pulls the arc plate and the cylinder to reset along the round rod rail, so that the placement plate rises away from the etching chamber. When the top of the placement plate contacts the circular ring rod, the retaining ring and the sliding block contact. In this process, the circular ring and the scraper at the front end of the circular ring rod scrape the anti-corrosion rope, thereby reducing the etching liquid remaining on the surface of the anti-corrosion rope.

[0024] When the retaining ring contacts the sliding block, the pushing member pulls the cylinder to continue moving, closing the card bin and engaging the card slot and the vertical plate, so that the card bin is finally sealed and closed, and the placement unit and the mounting frame are closed and sealed as a whole to the interior of the card bin, and the mounting frame seals the front and back of the closed card bin. At this time, the anti-corrosion rope is straightened and arranged inside the card bin, and the water control member is started so that the water control members before and after the card bin are used as a water supply pump and a water suction pump respectively, so that the water control member of the water supply pump inputs the deionized water connected to the external pipeline into the interior of the card bin, so that the deionized water flows to clean the card bin and the placement unit, and the deionized water flows to clean the placement unit completely and slowly, thereby reducing the etching liquid attached to the surface of the chip and the anti-corrosion rope, and after the water control member delivers water for cleaning, the air control member is started so that the air control member can air-dry the placement unit inside the card bin, thereby increasing the overall service life of the placement unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the following is a brief introduction to the drawings required for describing the embodiment, wherein: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structural connection between the etching unit and the placement unit of the present invention; Figure 3 for Figure 2 A schematic diagram of the enlarged structure of part A; Figure 4 This is a schematic diagram of the internal structure connection of the circular sleeve of the present invention; Figure 5 This is a schematic diagram of the connection of the placement unit structure of the present invention; Figure 6 for Figure 5 A schematic diagram of the enlarged structure of part B; Figure 7 This is a schematic diagram of the internal structure connection between the placement plate and the filter plate of the present invention; Figure 8 It is a schematic diagram of the structural connection between the dynamic beam plate and the fixed beam plate and the outer clamping plate and the inner clamping plate of the present invention; Fig. 9 A schematic diagram comparing the internal structures of the first side panel and the second side panel of the present invention; Fig.10 It is a schematic diagram of the top view of the overall structure of the present invention; Fig.11 for Fig.10 A schematic diagram of the enlarged structure of the middle C part; Fig.12 It is a schematic diagram of the overall structure of the present invention from a side perspective; Fig.13 This is a schematic diagram of the connection of the card bin structure of the present invention; Fig.14 It is a schematic diagram of the connection of the first movable rod structures arranged opposite to each other in the present invention.

[0026] In the figure: 1. Etching unit; 101. Etching chamber; 1011. First side plate; 10111. First contraction plate; 10112. First connecting plate; 10113. First expansion plate; 1012. Second side plate; 10121. Mounting section plate; 10122. Second contraction plate; 10123. Second expansion plate; 10124. Second connecting plate; 1013. External connection port; 102. Vertical plate; 1021. Round rod rail; 1022. Round sleeve; 10221. Scraping port; 1023. Ring rod; 2. Placement unit; 201. Placement plate; 2011. Anticorrosion rope; 2012. Lower extension rod; 2013. Moving groove; 2014. Horizontal extension rod; 202. Filter hole plate; 2021. Connecting spring plate; 203. First movable rod; 2031. First moving member; 2032. First elastic member; 2033. Inner moving cavity; 2034. Insertion rod; 20341. Connecting horizontal plate; 204. Second movable rod; 2041. Second moving member; 204 2. second elastic member; 2043. outer clamping plate; 20431. outer connecting plate; 20432. inner groove; 2044. inner clamping plate; 20441. inner connecting plate; 205. dynamic beam plate; 2051. first transverse connecting plate; 20511. first drainage groove; 2052. first extension plate; 2053. sealing plate; 206. fixed beam plate; 2061. second transverse connecting plate; 20611. second drainage groove; 20612. second extension plate; 207. placement groove; 3. Processing unit; 301. Mounting frame; 3011. Water control part; 3012. Wind control part; 3013. Push part; 302. Side rail; 303. Card bin; 3031. Card slot; 3032. Slot; 3033. Plug; 3034. Air outlet; 304. Curved plate; 3041. Baffle; 305. Cylinder; 3051. Baffle ring; 306. Sliding block; 3061. Connecting rod; 30611. Column. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0028] like Figure 1-14 As shown, an etching device for semiconductor chip production includes: The etching unit 1 includes an etching chamber 101, and the etching chamber 101 is a concave-convex space formed by a first side plate 1011, a second side plate 1012 and a bottom plate; A placement unit 2, wherein the placement unit 2 is movably disposed inside the etching chamber 101; The placement unit 2 comprises a placement plate 201, which is movably arranged inside the etching chamber 101, and a plurality of placement grooves 207 are arranged inside the placement plate 201, and a first cross-connecting plate 2051 and a second cross-connecting plate 2061 for clamping the upper and lower sides of the chip, and an outer clamping plate 2043 and an inner clamping plate 2044 for clamping the side of the chip are arranged inside the placement groove 207, and the first cross-connecting plate 2051 and the second cross-connecting plate 2061 and the outer clamping plate 2043 and the inner clamping plate 2044 reciprocate and contact with the chip under the guidance of the concave and convex space of the etching chamber 101; A processing unit 3, wherein the processing unit 3 is arranged on the top of the etching chamber 101; The processing unit 3 includes a card bin 303 symmetrically and movably arranged on the top of the etching bin 101 for closing the sealed placement plate 201, a mounting frame 301 is arranged on the side of the card bin 303, a water control part 3011 and a wind control part 3012 for cleaning the placement unit 2, and a pushing part 3013 for controlling the closing of the card bin 303 are arranged on the surface of the mounting frame 301, and a rubber layer is surrounded on all sides of the mounting frame 301, the water control part 3011 is preferably a water pump, the wind control part 3012 is preferably a hot air blower, and the pushing part 3013 is preferably a cylinder or an electric telescopic cylinder, and the above components are controlled by PLC and powered by external energy.

[0029] like Figure 2 and Fig. 9 As shown, the first side plates 1011 are symmetrically arranged on the left and right sides of the etching chamber 101, and the second side plates 1012 are symmetrically arranged on the front and back sides of the etching chamber 101; The first side plate 1011 is composed of a first contraction plate 10111, a first expansion plate 10113, and a first connecting plate 10112 obliquely connected between the first contraction plate 10111 and the first expansion plate 10113; The second side panel 1012 is composed of a mounting section plate 10121, a second contraction plate 10122, a second expansion plate 10123 and a second connecting plate 10124. The second contraction plate 10122 and the second expansion plate 10123 are obliquely connected via the second connecting plate 10124. The mounting section plate 10121 is tilted outwardly at the top of the second contraction plate 10122.

[0030] Preferably, the distance between the first shrinking plate 10111 and the center of the etching chamber 101 is smaller than the distance between the first expanding plate 10113 and the center of the etching chamber 101; The distances between the second expansion plate 10123, the installation section plate 10121 and the second contraction plate 10122 and the center of the etching chamber 101 decrease successively. The height of the second connecting plate 10124 between the second contraction plate 10122 and the second expansion plate 10123 is lower than the height of the first connecting plate 10112 between the first contraction plate 10111 and the first expansion plate 10113. Two external connection ports 1013 are provided on the bottom surface of the etching chamber 101. Ball valves are installed on the bottom pipeline surface of the external connection ports 1013. The two external connection ports 1013 are used to transport and discharge the etching liquid inside the etching chamber 101.

[0031] like Figure 1-4 and Fig.10 As shown, a vertical plate 102 is installed on the top of the first expansion plate 10113, and a circular sleeve 1022 is symmetrically installed on the front and rear sides of the vertical plate 102. A scraper 10221 in contact with the anti-corrosion rope 2011 is installed on the side of the circular sleeve 1022 close to the etching bin 101, and a circular ring rod 1023 is installed on the surface of the vertical plate 102 corresponding to the bottom of the scraper 10221; A round bar rail 1021 extends outward from a side of the vertical plate 102 opposite to the etching chamber 101 .

[0032] like Figure 1 and 10 As shown in FIG. 13 , the vertical plate 102 is fixedly connected to the mounting frame 301 through a round bar rail 1021 , and side rails 302 are symmetrically installed on the left and right sides of the vertical plate 102 ; A cylinder 305 is movably sleeved on the surface of the round rod rail 1021 , a retaining ring 3051 is provided on the side of the cylinder 305 close to the vertical plate 102 , a retaining plate 3041 is fixedly connected to the side of the cylinder 305 opposite to the vertical plate 102 , and the cylinder 305 is fixedly connected to the radian plate 304 via the retaining plate 3041 .

[0033] Preferably, the output shaft of the pushing member 3013 movably passes through the mounting frame 301 and is fixedly connected to the radian plate 304 , and a sliding block 306 is movably sleeved on the surface of the cylinder 305 ; the sliding block 306 is arranged between the retaining ring 3051 and the baffle 3041 .

[0034] Preferably, the left and right sides of the sliding block 306 are movably connected with connecting rods 3061, and the sliding block 306 is movably connected to the column 30611 through the connecting rod 3061, and the bottom of the column 30611 is fixedly arranged inside the card bin 303; A card slot 3031 corresponding to the vertical plate 102 is provided at the bottom of the card slot 303, and a rubber layer is provided on the contact surface between the card slot 3031 and the vertical plate 102. The card slot 303 is slidably provided on the surface of the side rail 302, and a slot 3032 and a plug 3033 are symmetrically installed on opposite surfaces of the card slot 303. An air outlet 3034 is provided on the top of the card slot 303, and a rubber layer is provided inside the slot 3032 to seal with the plug 3033. The area of ​​the air outlet 3034 is equivalent to the area of ​​the placement plate 201.

[0035] like Figure 2-8 As shown, a plurality of first movable rods 203 are arranged on the opposite surface of the placement plate 201 and the second side plate 1012, a first movable member 2031 is installed on the opposite surface of the first movable rod 203 and the second side plate 1012, a first elastic member 2032 is sleeved on the surface of the first movable rod 203, and a first elastic member 2032 is arranged between the first movable member 2031 and the placement plate 201; A plurality of second movable rods 204 are disposed on the opposite surface of the placement plate 201 and the first side plate 1011 , a second movable member 2041 is installed on the opposite surface of the second movable rod 204 and the first side plate 1011 , and a second elastic member 2042 is sleeved on the surface of the second movable rod 204 .

[0036] like Figure 5-7 As shown, the four corners of the placement plate 201 are extended downward with lower extension rods 2012, the placement plate 201 is fixedly connected to the filter plate 202 through the lower extension rods 2012, and the filter plate 202 is surrounded by a connecting spring plate 2021, and the connecting spring plate 2021 is made of corrosion-resistant material; The top surfaces of the four corners of the placement plate 201 are fixedly connected with anti-corrosion ropes 2011 , and the placement plate 201 is fixedly connected to the side of the radian plate 304 after the anti-corrosion ropes 2011 pass through the circular ring rod 1023 and the circular sleeve 1022 .

[0037] Operation process: Preparation before etching: The etching liquid is poured into the interior of the etching chamber 101 through the external connection port 1013, so that the highest water level is flush with the connection between the installation section plate 10121 and the second shrinkage plate 10122. At this time, the pushing member 3013 pulls the anti-corrosion rope 2011 to straighten, so that the top of the placement plate 201 contacts the bottom of the circular ring rod 1023, so that the placement plate 201 and the bottom filter hole plate 202 are suspended in the interior of the card chamber 303. At this time, the second moving member 2041 contacts the surface of the vertical plate 102, and the first moving member 2031 does not contact the installation section plate 10121. The inclined top of the installation section plate 10121 is greater than the distance of the first moving member 2031 protruding from the surface of the placement plate 201 under the premise that there is no external force on the first elastic member 2032. At this time, the symmetrical card chambers 303 are closed oppositely, and the retaining ring 3051 on the surface of the cylinder 305 fits with the sliding block 306; Detailed working process: By starting the pushing member 3013, the pushing member 3013 pushes the radian plate 304 at its front end toward the etching chamber 101. The movement of the radian plate 304 drives the cylinder 305 to move toward the etching chamber 101 along the round rod rail 1021 through the baffle plate 3041, so that the baffle ring 3051 is away from the sliding block 306. The movement of the radian plate 304 releases the straightened state of the fixed-length anti-corrosion rope 2011, reduces the distance of the radian plate 304 relative to the etching chamber 101, and makes the anti-corrosion rope 2011 not stretched and in a loose state. At this time, the placement plate 201 contacts the inner bottom surface of the card chamber 303 through the filter hole plate 202 at the bottom thereof. Then, the chip to be etched is manually placed into the space between the first cross-connecting plate 2051 and the second cross-connecting plate 2061 through the air outlet 3034, so that the bottom side of the chip is placed on the surface of the placement plate 201 corresponding to the movable groove 2013, and the placement element of the chip faces the first cross-connecting plate 2051. When the baffle plate 3041 on the surface of the cylinder 305 contacts the sliding block 306, the sliding block 306 is pushed to move, so that the sliding block 306 is driven by the connecting rod 3061 to make the card bin 303 expand outward along the side rail 302, and finally the arc plate 304 is reduced The distance with the etching bin 101, the length of the anti-corrosion rope 2011 in the loose state is also increased, and at the same time, the baffle plate 3041 pushes the sliding block 306 and the connecting rod 3061 to drive the card bin 303 to expand, so that the state of the placement plate 201 being blocked by the card bin 303 is released, and the placement plate 201 passes through the space after the card bin 303 is expanded and falls into the etching bin 101; When the placement plate 201 falls, the first moving member 2031 on one side of the placement plate 201 contacts the top of the installation section plate 10121 to cushion the fall. Subsequently, when the placement plate 201 moves downward by its own weight, the inner wall of the installation section plate 10121 continuously squeezes the first moving member 2031, causing the first moving member 2031 to move toward the inside of the placement plate 201, thereby causing the first moving member 2031 to drive the first movable rod 203 and the first cross-connecting plate 2051 on the surface of the moving beam plate 205 connected to it by the insertion rod 2034 to move toward the fixed beam plate 206, so that the moving beam plate 205 and The distance between the fixed beam plates 206 is reduced, and finally when the first movable member 2031 moves to the top of the second contraction plate 10122, the chip is clamped by the first cross-connecting plate 2051 and the second cross-connecting plate 2061. After clamping, the placement plate 201 drives the chip clamped on its top to continue to move along the second contraction plate 10122, thereby maintaining the clamping state. At this time, the second movable member 2041 moves to the surface of the first expansion plate 10113, and the first expansion plate 10113 does not squeeze the second movable member 2041, thereby reducing the accidental sliding of the etched chip during the etching process, resulting in chip wear.

[0038] It should be noted that, in order to achieve better results, a wire roller controlled by a waterproof motor can be installed on the surface of the radian plate 304 to reel in the anti-corrosion rope 2011. The anti-corrosion rope 2011 is continuously retracted and released before the radian plate 304 pushes the baffle plate 3041 and the sliding block 306 to contact, so that the anti-corrosion rope 2011 between the radian plate 304 and the placement plate 201 is always kept taut. The reeling process continues until the card bin 303 opens, causing the placement plate 201 to fall, and when the placement plate 201 falls into the installation section plate 10121, the wire roller releases the rope at a uniform speed, so that the first cross-connecting plate 2051 is pushed by the passive contact and extrusion of the first moving member 2031 and the first active rod 203 with the installation section plate 10121. Approaching the second cross-connecting plate 2061, when the space between the first cross-connecting plate 2051 and the second cross-connecting plate 2061 reaches the preset distance of the constraint, the line roller stops, and then the chip is inserted between the first cross-connecting plate 2051 and the second cross-connecting plate 2061. At this time, the bottom side of the chip does not contact the surface of the placement plate 201. At this time, the chip is slightly squeezed by the rubber layer on the surface of the first cross-connecting plate 2051 and the second cross-connecting plate 2061, thereby increasing the stability of the chip during the clamping process of the first cross-connecting plate 2051 and the second cross-connecting plate 2061. The subsequent line roller is started again to move the placement plate 201 downward, and when the first cross-connecting plate 2051 and the second cross-connecting plate 2061 reach the top of the second shrinking plate 10122, the chip is finally clamped.

[0039] When the placement plate 201 moves to the inside of the etching chamber 101 corresponding to the second contraction plate 10122, the etching liquid inside the etching chamber 101 will contact the chip to cause the chip to be etched, and the filter plate 202 at the bottom of the placement plate 201 will first contact the etching liquid when the placement plate 201 moves downward, so that the dirt filtered last time inside the etching liquid is partially isolated, and the connecting spring plate 2021 arranged on the outside of the filter plate 202 is to fit the concave and convex space inside the etching chamber 101 to increase the filtering effect of the filter plate 202. The area of ​​the connecting spring plate 2021 plus the filter plate 202 is larger than the cross-sectional area of ​​any point inside the etching chamber 101. At the same time, when the placement plate 201 stops etching, the filter plate 202 will also be lifted inside the etching liquid along with the placement plate 201, thereby filtering the dirt left by this etching to ensure the cleanliness of the etching liquid; During the etching process of the chip, the pushing member 3013 continues to push the arc plate 304 to move toward the inside of the etching chamber 101, so that the anti-corrosion rope 2011 continues to be released, and then the placement plate 201 at the bottom of the anti-corrosion rope 2011 continues to move toward the bottom of the etching chamber 101. When the placement plate 201 moves to the position of the first connecting plate 10112, the gradually reduced distance between the first connecting plate 10112 and the center of the etching chamber 101 will squeeze the second moving member 2041 to drive the second movable rod 204 approaches the placement plate 201, and the second moving members 2041 on both sides of the placement plate 201 are in contact with the corresponding first connecting plates 10112 on both sides, so that the outer clamping plates 2043 and the inner clamping plates 2044 on both sides of the movable beam plate 205 drive the second movable rod 204 and the outer connecting plates 20431 and the inner connecting plates 20441 through the second moving member 2041, and push the outer clamping plates 2043 and the inner clamping plates 2044 to clamp the side of the chip, so that the side of the chip is clamped; The radian plate 304 is continuously moved toward the etching chamber 101 to make the placement plate 201 continue to move downward, and the first movable member 2031 on the side of the placement plate 201 is guided by the second connecting plate 10124 to enter the interior of the second expansion plate 10123, so that the extrusion of the first movable member 2031 and the first movable rod 203 is released, and then the extruded first elastic member 2032 pushes the first movable member 2031 and the first movable rod 203 to reset, so that the first movable rod 203 drives the first cross-connecting plate 2051 to reset, so that the component mounting surface of the chip is exposed, so that the movement of the placement plate 201 drives the alternate clamping of each surface of the chip, so that the area of ​​the chip that can be etched is increased and the clamping shielding is reduced, and when the clamping is stable In order to increase the chip etching effect, the placement plate 201 moves to the position of the first shrinking plate 10111, and the second moving part 2041 will move along the first shrinking plate 10111, so that the outer clamping plate 2043 and the inner clamping plate 2044 maintain the clamping of the chip side. If the placement plate 201 needs to be lifted, when the first moving part 2031 moves to the first connecting plate 10112 and finally reaches the connection between the first connecting plate 10112 and the second shrinking plate 10122, the upper and lower surfaces of the chip are clamped by the first cross-connecting plate 2051 and the second cross-connecting plate 2061, and then the second moving part 2041 will pass through the first connecting plate 10112 and reach the inside of the first expansion plate 10113, and the clamping of the chip side by the outer clamping plate 2043 and the inner clamping plate 2044 is released. Example

[0040] Reference Figure 1-14 As shown, this embodiment is different from the first embodiment in that: A moving beam plate 205 is movably installed on the side close to the placement groove 207 and the first movable member 2031, a moving groove 2013 is arranged at the bottom of the moving beam plate 205, the moving beam plate 205 is movably passed through the moving groove 2013 and fixedly connected with the first movable rod 203 by an insertion rod 2034, a fixed beam plate 206 is fixedly connected to the side opposite to the placement groove 207 and the first movable member 2031, a second cross-connecting plate 2061 is arranged on the upper and lower sides of the fixed beam plate 206, a second drainage groove 20611 is opened on the surface of the second cross-connecting plate 2061, and second display plates 20612 are extended outward from the four corners of the fixed beam plate 206; The dynamic beam plate 205 is symmetrically installed with a first transverse connecting plate 2051 on the upper and lower sides, and a first drainage groove 20511 is opened on the surface of the first transverse connecting plate 2051. The four corners of the dynamic beam plate 205 are obliquely extended with a first exhibition plate 2052. The first exhibition plate 2052 is fixedly connected with a sealing plate 2053 on the opposite surface of the first moving member 2031. The sealing plate 2053 is slidably arranged inside the placement plate 201. The dynamic beam plate 205 is symmetrically provided with transverse expansion rods 2014 on the left and right sides. The top of the placement plate 201 is fixedly connected with the transverse expansion rod 2014, and the transverse expansion rod 2014 corresponds to the outer side of the closed chip clamping position of the first transverse connecting plate 2051 and the second transverse connecting plate 2061. A second elastic member 2042 is arranged between the second moving member 2041 and the transverse expansion rod 2014. The second movable rod 204 is movably installed inside the transverse extension rod 2014, and the inner sides of the transverse extension rod 2014 on the left and right sides of the movable beam plate 205 are respectively provided with an outer clamping plate 2043 and an inner clamping plate 2044, and the outer sides of the outer clamping plate 2043 and the inner clamping plate 2044 are both installed with the second movable rod 204, and the opposite surfaces of the first transverse connecting plate 2051 and the second transverse connecting plate 2061 are covered with a corrosion-resistant rubber layer, and the first movable member 2031 and the second movable member 2041 are preferably universal ball heads, and the first elastic member 2032 and the second elastic member 2042 are preferably springs. It should be noted that the outer side of the second movable rod 204 on the opposite side of the transverse extension rod 2014 and the first side plate 1011 is not provided with the second movable member 2041, and only a ring for pulling and squeezing the second elastic member 2042 is provided; The placement plate 201 is provided with an inner moving cavity 2033 inside, the first movable rod 203 is movably arranged inside the inner moving cavity 2033, and insertion rods 2034 are sequentially arranged at intervals on the surface thereof, and the insertion rods 2034 are fixedly connected to the bottoms of the corresponding multiple movable beam plates 205, so that the movement of the first movable rod 203 drives the multiple movable beam plates 205 to move, and the first movable rods 203 are symmetrically arranged on the side of the placement plate 201, and intervals are arranged between the first movable rods 203 on both sides, so that the first movable rods 203 on both sides can move inward without interference, or the first movable rods 203 on both sides are provided with a sleeve structure, so that the first movable rod 203 on one side can be inserted into the hollow space inside the other first movable rod 203; And as Figure 7 and 8As shown, the moving beam plate 205 and the fixed beam plate 206 are a group, two groups are arranged horizontally on the surface of the placement plate 201, and a plurality of the above two groups of structures are arranged vertically on the surface of the placement plate 201. The outer clamping plate 2043 at the left end of the moving beam plate 205 on the left and the inner clamping plate 2044 at the left end of the moving beam plate 205 on the right are connected by an inner connecting plate 20441, and the inner clamping plate 2044 at the right end of the moving beam plate 205 on the left and the outer clamping plate 2043 at the right end of the moving beam plate 205 on the right are connected by an outer connecting plate 20431, and the middle part of the outer connecting plate 20431 is provided with an inner groove 20432 for accommodating the movement of the inner clamping plate 2044 connected to the inner connecting plate 20441; Of course, the structure of the outer connecting plate 20431 and the inner connecting plate 20441 can also be applied between the fixed beam plate 206 and the movable beam plate 205, so that the bottoms of multiple fixed beam plates 206 on the surface of the placement plate 201 are connected to the surface of the first movable rod 203 on one side through the insertion rod 2034, and the bottoms of multiple movable beam plates 205 are connected to the surface of the first movable rod 203 on the other side through the insertion rod 2034. The two first movable rods 203 are symmetrically arranged on the surface of the placement plate 201, so that the insertion rods 2034 on the surface of the first movable rod 203 on one side are staggered between adjacent insertion rods 2034 on the surface of the first movable rod 203 on the other side, and refer to the outer connecting plate 20431 and the inner connecting plate 20441 staggered up and down and movably accommodated through the inner groove 20432, so that the first movable rod 203 on one side is movably arranged inside the first movable rod 203 on the other side, and the insertion rods 2034 of the first movable rod 203 on the other side are connected to each other through the connecting cross plate 20341 as shown in FIG. Fig.14 When the first movable rods 203 on both sides are squeezed, the fixed beam plate 206 and the movable beam plate 205 can be closed oppositely. At this time, the fixed beam plate 206 and the placement groove 207 are movably connected, thereby increasing the chip clamping effect and increasing the area that can contact with the etching solution after the opposite clamping contact.

[0041] The rest of the structure is the same as that of the first embodiment.

[0042] Operation process: In order to ensure that the etching liquid can fully and effectively contact all surfaces of the chip, the pusher 3013 can be used to reciprocate the arc plate 304 through the cylinder 305 on the surface of the round rod rail 1021, or the motor can be reversed to drive the line roller to shrink or release the anti-corrosion rope 2011, so that the anti-corrosion rope 2011 drives the placement plate 201 to move up and down inside the etching chamber 101, so that the first moving member 2031 continuously moves along the second shrinking plate 10122, the second connecting plate 10123, and the second connecting plate 10124. The plate 10124 and the second expansion plate 10123 reciprocate between each other, so that the first cross-connecting plate 2051 and the second cross-connecting plate 2061 intermittently clamp the chip, and the second movable member 2041 will continuously reciprocate between the second contraction plate 10122, the second connecting plate 10124 and the second expansion plate 10123, so that the outer clamping plate 2043 and the inner clamping plate 2044 intermittently and alternately clamp the chip with the first cross-connecting plate 2051 and the first expansion plate 2052, thereby improving the etching effect of the chip.

[0043] During the downward movement of the placement plate 201, the liquid at the bottom of the placement plate 201 passes through the filter plate 202 and the placement groove 207, and then passes through the first extension plate 2052 and the second extension plate 20612 at the bottom of the first cross-connecting plate 2051 and the second cross-connecting plate 2061, so that the liquid passes through the space of the first drainage groove 20511 and the second drainage groove 20611, and enters the space between the dynamic beam plate 205 and the fixed beam plate 206 relative to the chip, so that the chip surface is combined with the placement plate 201. The up and down swing and the focusing effect of the first display plate 2052 and the second display plate 20612 make the chip be etched more comprehensively and fully. Similarly, when the placement plate 201 is lifted, the water flow on the top of the placement plate 201 will be guided by the first display plate 2052 and the second display plate 20612 on the top of the first cross-connecting plate 2051 and the second cross-connecting plate 2061, and will be concentrated and flushed to the chip surface through the first drainage groove 20511 and the second drainage groove 20611, thereby improving the etching effect of the chip. When the first cross-connecting plate 2051 approaches the second cross-connecting plate 2061, the sealing plate 2053 will be pulled out of the inside of the placement plate 201, so that the sealing plate 2053 can seal the space after the first cross-connecting plate 2051 moves, so that the water flow at the bottom of the placement plate 201 can only pass through the space of the placement groove 207 after the shrinkage, and then be guided by the first exhibition plate 2052 and the second exhibition plate 20612, thereby improving the focusing effect of the first exhibition plate 2052 and the second exhibition plate 20612. This improvement process only occurs when the first cross-connecting plate 2051 approaches the second cross-connecting plate 2061 to clamp the chip.

[0044] When the chip is etched within a preset time, the movable groove 2013 pulls the arc plate 304 and the cylinder 305 to reset along the round rod rail 1021, so that the placement plate 201 rises away from the etching chamber 101. When the top of the placement plate 201 contacts the circular ring rod 1023, the retaining ring 3051 contacts the sliding block 306. In this process, the circular ring at the front end of the circular ring rod 1023 and the scraping mouth 10221 scrape the anti-corrosion rope 2011, thereby reducing the etching liquid remaining on the surface of the anti-corrosion rope 2011. When the retaining ring 3051 contacts the sliding block 306, the pushing member 3013 pulls the cylinder 305 to continue moving, so that the card bin 303 is closed, and the card slot 3031 and the vertical plate 102 are engaged, so that the card bin 303 is finally sealed and closed, so that the placement unit 2 and the mounting frame 301 are completely closed and sealed to the inside of the card bin 303, and the mounting frame 301 seals the front and back of the closed card bin 303. At this time, the anti-corrosion rope 2011 is straightened and set inside the card bin 303, and the water control member 3011 is started to make the water control members 3011 at the front and back of the card bin 303 act as a A water delivery pump is used as a water extraction pump, so that the water control part 3011 of the water delivery pump inputs the deionized water connected to the external pipeline into the interior of the card bin 303, so that the deionized water flows to clean the card bin 303 and the placement unit 2, and the deionized water flows to clean the placement unit 2 completely and slowly, thereby reducing the etching liquid attached to the surface of the chip and the anti-corrosion rope 2011, and after the water control part 3011 delivers water for cleaning, the wind control part 3012 is started to make the wind control part 3012 air-dry the placement unit 2 inside the card bin 303, thereby improving the overall service life of the placement unit 2.

[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0046] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An etching device for semiconductor chip production, characterized in that: include: An etching unit (1), the etching unit (1) comprising an etching chamber (101), the etching chamber (101) being a concave-convex space formed by a first side plate (1011), a second side plate (1012) and a bottom plate; A placement unit (2), wherein the placement unit (2) is movably arranged inside the etching chamber (101); The placement unit (2) comprises a placement plate (201), the placement plate (201) being movably arranged inside the etching chamber (101), a plurality of placement grooves (207) being arranged through the placement plate (201), a first cross-connecting plate (2051) and a second cross-connecting plate (2061) for clamping the upper and lower sides of the chip, and an outer clamping plate (2043) and an inner clamping plate (2044) for clamping the side surfaces of the chip being arranged inside the placement grooves (207), the first cross-connecting plate (2051) and the second cross-connecting plate (2061) being in reciprocating clamping contact with the chip together with the outer clamping plate (2043) and the inner clamping plate (2044) under the guidance of the concave and convex space of the etching chamber (101); A processing unit (3), wherein the processing unit (3) is arranged on the top of the etching chamber (101); The processing unit (3) comprises a card bin (303) symmetrically and movably arranged on the top of the etching bin (101) for closing the sealing placement plate (201); a mounting frame (301) is arranged on the side of the card bin (303); a water control member (3011) and an air control member (3012) for cleaning the placement unit (2) are arranged on the surface of the mounting frame (301); and a pushing member (3013) for controlling the closing of the card bin (303) is arranged.

2. The etching device for semiconductor chip production according to claim 1, characterized in that: The first side plate (1011) is symmetrically arranged on the left and right sides of the etching chamber (101), and the second side plate (1012) is symmetrically arranged on the front and rear sides of the etching chamber (101); The first side plate (1011) is composed of a first contraction plate (10111), a first expansion plate (10113), and a first connecting plate (10112) obliquely connected between the first contraction plate (10111) and the first expansion plate (10113); The second side plate (1012) is composed of a mounting section plate (10121), a second contraction plate (10122), a second expansion plate (10123) and a second connecting plate (10124); the second contraction plate (10122) and the second expansion plate (10123) are obliquely connected via the second connecting plate (10124); and the mounting section plate (10121) is arranged outwardly obliquely on top of the second contraction plate (10122).

3. The etching device for semiconductor chip production according to claim 2, characterized in that: The distance between the first contraction plate (10111) and the center of the etching chamber (101) is smaller than the distance between the first expansion plate (10113) and the center of the etching chamber (101); The distances between the second expansion plate (10123), the installation section plate (10121) and the second contraction plate (10122) and the center of the etching chamber (101) decrease successively, and the height of the second connecting plate (10124) between the second contraction plate (10122) and the second expansion plate (10123) is lower than the height of the first connecting plate (10112) between the first contraction plate (10111) and the first expansion plate (10113).

4. The etching device for semiconductor chip production according to any one of claims 2-3, characterized in that: A vertical plate (102) is installed on the top of the first expansion plate (10113), and circular sleeves (1022) are symmetrically installed on the front and rear sides of the vertical plate (102), and a scraper (10221) in contact with the anti-corrosion rope (2011) is installed on the side of the circular sleeve (1022) close to the immersion chamber (101), and a circular ring rod (1023) is installed on the surface of the vertical plate (102) at the bottom of the scraper (10221); A round bar rail (1021) extends outwardly from a side of the vertical plate (102) opposite to the etching chamber (101).

5. The etching device for semiconductor chip production according to claim 4, characterized in that: The vertical plate (102) is fixedly connected to the mounting frame (301) via a round bar rail (1021), and side rails (302) are symmetrically mounted on the left and right sides of the vertical plate (102); A cylinder (305) is movably sleeved on the surface of the round rod rail (1021); a retaining ring (3051) is provided on the side of the cylinder (305) close to the vertical plate (102); a retaining plate (3041) is fixedly connected to the side of the cylinder (305) opposite to the vertical plate (102); and the cylinder (305) is fixedly connected to the radian plate (304) via the retaining plate (3041).

6. The etching device for semiconductor chip production according to claim 5, characterized in that: The output shaft of the pushing member (3013) movably passes through the mounting frame (301) and is fixedly connected to the radian plate (304); a sliding block (306) is movably sleeved on the surface of the cylinder (305); and the sliding block (306) is arranged between the retaining ring (3051) and the retaining plate (3041).

7. The etching device for semiconductor chip production according to claim 6, characterized in that: The left and right sides of the sliding block (306) are movably connected with connecting rods (3061), the sliding block (306) is movably connected to a column (30611) via the connecting rod (3061), and the bottom of the column (30611) is fixedly arranged inside the card bin (303); The bottom of the card compartment (303) is provided with a card slot (3031) corresponding to the vertical plate (102), the surface of the side rail (302) is slidably provided with the card compartment (303), the opposite surfaces of the symmetrical card compartment (303) are respectively provided with a slot (3032) and a plug (3033), and the top of the card compartment (303) is provided with an air outlet (3034).

8. The etching device for semiconductor chip production according to claim 7, characterized in that: A plurality of first movable rods (203) are arranged on the surfaces opposite to the placement plate (201) and the second side plate (1012); a first movable member (2031) is installed on the surfaces opposite to the first movable rods (203) and the second side plate (1012); a first elastic member (2032) is sleeved on the surface of the first movable rods (203); and a first elastic member (2032) is arranged between the first movable member (2031) and the placement plate (201); A plurality of second movable rods (204) are arranged on the opposite surface of the placement plate (201) and the first side plate (1011), a second movable member (2041) is installed on the opposite surface of the second movable rod (204) and the first side plate (1011), and a second elastic member (2042) is sleeved on the surface of the second movable rod (204).

9. The etching device for semiconductor chip production according to claim 8, characterized in that: A moving beam plate (205) is movably mounted on the side of the placement groove (207) close to the first movable member (2031); a fixed beam plate (206) is fixedly connected to the side of the placement groove (207) opposite to the first movable member (2031); a second cross-connecting plate (2061) is arranged on the upper and lower surfaces of the fixed beam plate (206); a second drainage groove (20611) is provided on the surface of the second cross-connecting plate (2061); and second extension plates (20612) extend outwardly from the four corners of the fixed beam plate (206); The moving beam plate (205) is symmetrically mounted with a first transverse connecting plate (2051) above and below, a first drainage groove (20511) is provided on the surface of the first transverse connecting plate (2051), four corners of the moving beam plate (205) are obliquely extended with a first expansion plate (2052) outward, the moving beam plate (205) is symmetrically arranged with transverse expansion rods (2014) on the left and right sides, the top of the placement plate (201) is fixedly connected with the transverse expansion rod (2014), and the second moving beam plate (205) is provided with a first expansion plate (2052) extending outwardly. A second elastic member (2042) is provided between the movable member (2041) and the transverse extension rod (2014); the second movable rod (204) is movably mounted inside the transverse extension rod (2014); outer clamping plates (2043) and inner clamping plates (2044) are respectively provided on the inner sides of the transverse extension rod (2014) on the left and right sides of the movable beam plate (205); and second movable rods (204) are both mounted on the outer sides of the outer clamping plates (2043) and the inner clamping plates (2044).

10. The etching device for semiconductor chip production according to claim 9, characterized in that: The four corners of the placement plate (201) are provided with downwardly extending rods (212); the placement plate (201) is fixedly connected to the filter plate (202) via the downwardly extending rods (212); and the filter plate (202) is provided with connecting spring plates (221) around its periphery. The top surfaces of the four corners of the placement plate (201) are fixedly connected with anti-corrosion ropes (2011), and the placement plate (201) is fixedly connected to the side of the radian plate (304) after the anti-corrosion ropes (2011) pass through the circular ring rod (1023) and the circular sleeve (1022).

Images