Wafer box backflow equipment

Abstract

The invention discloses a piece box backflow device, and relates to the technical field of wafer cleaning, the piece box backflow device comprises a feeding and discharging mechanism used for separating or assembling a piece box and a wafer in the piece box, a wafer transfer mechanism, a piece box transfer mechanism and a wafer cleaning mechanism, the wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transfer mechanism, and the wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transfer mechanism. The wafer transfer mechanism drives a wafer to enter the wafer cleaning mechanism for cleaning, the two ends of the transfer path of the wafer transfer mechanism and the two ends of the transfer path of the wafer box transfer mechanism coincide, and a feeding and discharging mechanism is arranged at the end; transfer and cleaning are integrated, the wafer box and the wafer can be separated through the feeding and discharging mechanism, the separated wafer is transferred into the wafer cleaning mechanism through the wafer transfer mechanism to complete the cleaning process, and the separated wafer box is transferred to the feeding and discharging mechanism at the tail end through the wafer box transfer mechanism to wait for containing the cleaned wafer. And the cleaning efficiency is effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning, and in particular to a wafer box reflow device. Background Art

[0002] As the size of semiconductor devices continues to shrink and the precision requirements continue to increase, the technical requirements of the wafer cleaning process are becoming increasingly stringent. Any tiny particles, organic matter, metal ions or oxide residues on the wafer surface may have a significant impact on the device performance, thereby affecting the yield and reliability of semiconductor devices. Wafer cleaning is one of the most important steps in the semiconductor manufacturing process. Its purpose is to remove various contaminants on the wafer surface and ensure that subsequent process steps can be carried out on a clean surface. The main cleaning steps include pre-cleaning process, chemical cleaning process, final cleaning process and drying process. By cleaning the wafer, the wafer cassette reflow requirements are met.

[0003] Currently, most of the wafer cassette reflow equipment known to the applicant is a decentralized equipment, that is, the wafer cassette carrying the wafer is transferred between each cleaning process through a rotating mechanism, and the wafer needs to be taken out of the wafer cassette in each cleaning process, resulting in low cleaning efficiency.

[0004] Therefore people are in urgent need of a film box reflow device with high cleaning efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer box reflow equipment to solve the problems existing in the above-mentioned prior art, integrating transportation and cleaning. After the wafer is separated from the wafer box, the wafer can be directly transported to the wafer cleaning mechanism to complete the cleaning process. After cleaning is completed, the wafer is placed in the wafer box, and the cleaning efficiency is effectively improved.

[0006] To achieve the above-mentioned purpose, the present invention provides the following scheme: The present invention provides a wafer box reflow device, comprising a loading and unloading mechanism for separating or assembling a wafer box and its internal wafers, a wafer transfer mechanism for transferring wafers, a wafer box transfer mechanism for transferring wafer boxes separated from wafers, and a wafer cleaning mechanism for cleaning wafers, the wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transfer mechanism, the wafer transfer mechanism drives the wafers into the wafer cleaning mechanism for cleaning, the wafer transfer mechanism and the wafer box transfer mechanism have the same transportation path at both ends and the loading and unloading mechanism is arranged at the end; the loading and unloading mechanism comprises a wafer box positioning member and a wafer support plate with a lifting and lowering movement function, the wafer box positioning member is provided with a through opening for lifting and lowering the wafer support plate corresponding to the bottom opening of the wafer box, the wafer support plate is lifted and lowered in the through opening of the wafer box positioning member and the bottom opening of the wafer box to lift or put down the wafer and separate or assemble it from the wafer box.

[0007] Preferably, the loading and unloading mechanism also includes a lifting part with the function of lifting and lowering movement and movement toward or away from the film box positioning member, the lifting part is U-shaped, and the two arms of the lifting part are respectively arranged corresponding to the two ends of the bottom of the film box, and the U-shaped opening of the lifting part is arranged toward the film box positioning member. The lifting part moves up and down on the outer peripheral side of the film box positioning member to place the film box on the film box positioning member.

[0008] Preferably, the wafer transfer mechanism includes a wafer clamp with lifting and lowering movements and movement functions between the loading and unloading mechanisms on both sides, the wafer clamp includes two rotating motors, two rotating shafts and two wafer clamping arms, the rotating motor is transmission-connected to the rotating shaft, the rotating shaft is transmission-connected to the wafer clamping arms, the two rotating shafts are arranged in parallel, and the two wafer clamping arms are swinging towards or away from each other.

[0009] Preferably, the wafer box reflow device is further provided with a detector for detecting whether a wafer is clamped between the two wafer clamping jaws.

[0010] Preferably, the film box transport mechanism includes a film box clamp with translation and lifting functions, a lifting lifter with lifting function, and a transporter that moves toward or away from the lifting lifter and has lifting function, the transporter drives the film box positioning piece to move, the lifting lifter is U-shaped, the opening of the lifting lifter is arranged toward the film box positioning piece, the part of the film box positioning piece used to lift the film box is a U-shaped piece with two openings arranged back to back, the upper surfaces of the two U-shaped pieces are the lifting parts for lifting the film box, and the two ends of the U-shaped opening of the lifting lifter are inwardly provided with support blocks matching the inner cavity of the U-shaped piece, the transporter carries the film box positioning piece, slides into the U-shaped inner cavity of the lifting lifter and moves downward to transport the film box to the lifting lifter, the film box clamp is arranged above the lifting lifter, and the lifting lifter is arranged on the loading and unloading mechanism.

[0011] Preferably, the film box clamp includes a telescope, two sliders and two film box clamp arms, the two film box clamp arms are slidably arranged on the clamp arm slide rail through the slider, the telescopic direction of the telescope is perpendicular to the sliding direction of the film box clamp arm, and L-shaped connecting rods are hinged on both sides of the telescopic end of the telescope, and the end of the L-shaped connecting rod away from the telescope is hinged to the slider.

[0012] Preferably, a supporting plate for supporting the film box is provided on one side of the movement path of the film box clamping claw.

[0013] Preferably, the wafer cleaning mechanism includes a first process tank, a second process tank, a third process tank and a fourth process tank arranged along the wafer transfer mechanism.

[0014] Preferably, the loading and unloading mechanism, the wafer transfer mechanism, the cassette transfer mechanism and the wafer cleaning mechanism are all arranged in a cabinet, and the cabinet is provided with an observation window for observing the interior and an inspection door for inspection and maintenance.

[0015] Preferably, the wafer box reflow equipment also includes an overall transfer mechanism with translation and lifting movement functions, the movement path of the overall transfer mechanism is located on one side of the wafer transfer mechanism, and loading and unloading platforms are provided at the front and rear ends of the movement path of the overall transfer mechanism.

[0016] Compared with the prior art, the present invention mainly achieves the following technical effects: This device integrates transfer and cleaning. The loading and unloading mechanism can separate the cassette from the wafer. The separated wafer is transferred by the wafer transfer mechanism to the wafer cleaning mechanism to complete the cleaning process. The separated cassette is transferred by the cassette transfer mechanism to the loading and unloading mechanism at the end to wait for the wafer after cleaning. The cleaning efficiency is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 It is a front view of the film box reflow device in the embodiment of the present invention; Figure 2 It is a front cross-sectional view of a film box reflow device in an embodiment of the present invention; Figure 3 It is an isometric view of a film box reflow device in an embodiment of the present invention; Figure 4 It is a left side view of the film box reflow device in the embodiment of the present invention; Figure 5 It is a structural schematic diagram of a wafer transfer mechanism in an embodiment of the present invention; Figure 6 It is a structural schematic diagram of the loading and unloading mechanism in an embodiment of the present invention; Figure 7 It is a structural schematic diagram of a lifting and supporting device in an embodiment of the present invention; Figure 8 Schematic diagram of the structure of the film box clamp in the embodiment of the present invention; Fig. 9 This is a schematic diagram of the internal structure of the film box reflow device after removing the cabinet in the embodiment of the present invention; Fig.10It is a schematic diagram of the connection between the transporter and the film box positioning member in an embodiment of the present invention; Fig.11 It is a structural schematic diagram of a film box positioning member in an embodiment of the present invention; Fig.12 It is a structural schematic diagram of the U-shaped opening side of the lifting and supporting device in an embodiment of the present invention; Among them, 1. loading and unloading mechanism; 2. wafer transfer mechanism; 3. film box transfer mechanism; 4. wafer cleaning mechanism; 5. film box positioning piece; 6. wafer support plate; 7. limit plate; 8. lifting part; 9. wafer clamp; 10. rotating shaft; 11. wafer clamp arm; 12. connecting rod; 13. detector; 14. film box clamp; 15. lifting and lowering lifter; 16. transporter; 17. U-shaped part; 18. card block; 19. telescope; 20. slider; 21. clamp arm slide rail; 22. film box clamp arm; 23. L-shaped connecting rod; 24. supporting plate; 25. first process slot; 26. second process slot; 27. third process slot; 28. fourth process slot; 29. ​​cabinet; 30. observation window; 31. inspection door; 32. inlet and outlet; 33. overall transfer mechanism; 34. support block. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] The purpose of the present invention is to provide a wafer box reflow device to solve the problems existing in the prior art and integrate transportation and cleaning. After the wafer is separated from the wafer box, the wafer can be directly transported to the wafer cleaning mechanism to complete the cleaning process. After cleaning, the wafer is placed in the wafer box, and the cleaning efficiency is effectively improved.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Please refer to Figures 1 to 12As shown, a wafer box reflow device is provided, including a loading and unloading mechanism 1 for separating or assembling a wafer box and wafers therein, a wafer transport mechanism 2 for transporting wafers, a wafer box transport mechanism 3 for transporting a wafer box separated from a wafer, and a wafer cleaning mechanism 4 for cleaning the wafers, the wafer cleaning mechanism 4 is arranged corresponding to the movement path of the wafer transport mechanism 2, the wafer transport mechanism 2 drives the wafer to enter the wafer cleaning mechanism 4 for cleaning, the two ends of the transport path of the wafer transport mechanism 2 and the wafer box transport mechanism 3 overlap, and the loading and unloading mechanism 1 is arranged at the end; the loading and unloading mechanism 1 includes a wafer box positioning member 5 and a lifting mechanism The wafer support plate 6 has a moving function, and the bottom opening of the wafer box corresponding to the wafer box is provided with a through hole for the wafer support plate 6 to be raised and lowered. The wafer support plate 6 is raised and lowered in the through hole of the wafer box positioning member 5 and the bottom opening of the wafer box to lift or put down the wafer and separate or assemble it from the wafer box. The device integrates transportation and cleaning. The loading and unloading mechanism 1 can be used to separate the wafer box from the wafer. The separated wafer is transported by the wafer transport mechanism 2 to the wafer cleaning mechanism 4 to complete the cleaning process. The separated wafer box is transported by the wafer box transport mechanism 3 to the loading and unloading mechanism 1 at the end to wait for the wafer after cleaning to be loaded, thereby effectively improving the cleaning efficiency.

[0023] In order to ensure the stability of the film box, two limit plates 7 are provided on the top of the film box positioning member 5. The distance between the two limit plates 7 is the same as the distance between the outer walls at both ends of the bottom opening of the film box, so as to fix the bottom of the film box; in order to ensure the stability of the wafer lifting, the top of the wafer support plate 6 is a V-shaped or arc-shaped structure.

[0024] The loading and unloading mechanism 1 also includes a lifting portion 8 with the function of lifting and lowering movement and movement toward or away from the film box positioning member 5. The lifting portion 8 is U-shaped, and the two arms of the lifting portion 8 are respectively arranged corresponding to the two ends of the bottom of the film box. The U-shaped opening of the lifting portion 8 is arranged toward the film box positioning member 5. The U-shaped inner cavity area of ​​the lifting portion 8 is larger than the area of ​​the film box positioning member 5. The two arms of the lifting portion 8 are used to lift the two ends of the bottom of the film box, and the film box positioning member 5 is used to lift the middle part of the bottom of the film box. The lifting portion 8 moves up and down on the outer peripheral side of the film box positioning member 5 to place the film box on the film box positioning member 5.

[0025] In order to ensure that the lifting part 8 stably lifts the film box, protrusions can be provided on both arms of the lifting part 8 to lock the two ends of the bottom opening of the film box from the inside or outside. The principle of the protrusion locking the film box is the same as the locking principle of the limit plate 7.

[0026] The wafer transfer mechanism 2 includes a wafer clamp 9 with lifting and lowering movements and movement functions between the loading and unloading mechanisms 1 on both sides. In this embodiment, the wafer clamp 9 includes two rotating motors, two rotating shafts 10 and two wafer clamp arms 11. The rotating motor is transmission-connected to the rotating shaft 10, and the rotating shaft 10 is transmission-connected to the wafer clamp arms 11. The two rotating shafts 10 are arranged in parallel, and the two wafer clamp arms 11 are swung toward or away from each other to complete the clamping of the wafer. In order to reduce the weight of the wafer clamp arm 11, the middle part of the wafer clamp arm 11 can be hollowed out; in other embodiments, other clamps that can clamp the wafer can be selected.

[0027] In other embodiments, the wafer transfer mechanism 2 can be provided with a plurality of wafer clamps 9, so as to clamp a plurality of wafers in sequence, and enable the plurality of wafers to complete the cleaning process in sequence, thereby improving efficiency. When a plurality of wafer clamps 9 are provided, the plurality of wafer clamps 9 have a cleaning path and a return path, and the two ends of the cleaning path coincide with the two ends of the transfer path of the wafer box transfer mechanism 3, and the two ends of the return path coincide with the two ends of the cleaning path and form a circular ring, and the plurality of wafer clamps 9 move in a circular motion.

[0028] A flexible pad may be provided on the clamping side of the wafer clamping arm 11 to prevent damage to the wafer during clamping.

[0029] The ends of the two wafer clamping arms 11 close to the rotating shaft 10 are connected by a connecting rod 12, and both ends of the connecting rod 12 are rotatably connected to the two wafer clamping arms 11 respectively. The setting of the connecting rod 12 can improve the structural strength and stability.

[0030] The wafer box reflow device is also provided with a detector 13, which is used to detect whether the wafer is clamped between the two wafer clamps 9. The detector 13 can be an infrared sensor or other detectors 13 that can detect whether the wafer is clamped between the two wafer clamps 9.

[0031] The detector 13 can be directly arranged on the driving structure for driving the wafer clamping jaws 9 to move, and move along with the wafer clamping jaws 9 to monitor in real time whether the wafer is clamped between the two wafer clamping jaws 9 .

[0032] The film box transport mechanism 3 includes a film box clamp 14 with translation and lifting functions, a lifting lifter 15 with lifting function, and a transporter 16 that moves toward or away from the lifting lifter 15 and has lifting function. The transporter 16 drives the film box positioning member 5 to move. The lifting lifter 15 is U-shaped, and the opening of the lifting lifter 15 is arranged toward the film box positioning member 5. The part of the film box positioning member 5 for lifting the film box is two U-shaped parts 17 with openings facing back to back. The upper surfaces of the two U-shaped parts 17 are the lifting parts for lifting the film box. The upper surface of the U-shaped part 17 can be set The surface is bent upward to form a limit plate 7, and the two ends of the U-shaped opening of the lifting and lifting device 15 are inwardly provided with support blocks 34 matching the inner cavity of the U-shaped part 17. The support blocks 34 can be integrated with the lifting and lifting device 15 to improve the structural strength. The U-shaped inner cavity area of ​​the lifting and lifting device 15 is larger than the occupied area of ​​the two U-shaped parts 17. The transporter 16 carries the film box positioning part 5 to slide into the U-shaped inner cavity of the lifting and lifting device 15 and moves downward to transport the film box to the lifting and lifting device 15. The film box clamp 14 is arranged above the lifting and lifting device 15, and the lifting and lifting device 15 is arranged on the loading and unloading mechanism 1.

[0033] A clamping block 18 is provided on the upper surface of the lifting support 15 for clamping the film box to improve the stability when driving the film box to move. The principle of clamping the film box by the clamping block 18 is the same as the clamping principle of the limit plate 7. When setting the clamping block 18, it is necessary to ensure that the inner cavity of the U-shaped part 17 can pass through the support block 34 and the clamping block 18.

[0034] In this embodiment, the film box clamping claw 14 includes a telescope 19, two sliders 20 and two film box clamping arms 22. The two film box clamping arms 22 are slidably arranged on the clamping arm slide rail 21 through the slider 20. The telescopic direction of the telescope 19 is perpendicular to the sliding direction of the film box clamping arms 22. L-shaped connecting rods 23 are hinged on both sides of the telescopic end of the telescope 19. The end of the L-shaped connecting rod 23 away from the telescope 19 is hinged to the slider 20. When the telescope 19 is telescoped, the L-shaped connecting rods 23 on both sides are driven to swing. When the L-shaped connecting rod 23 swings, the end away from the telescope 19 will produce lateral movement, thereby driving the slider 20 to slide on the clamping arm slide rail 21, thereby adjusting the distance between the two film box clamping arms 22. In this embodiment, the two film box clamping arms 22 drive the film box to move through the flange protruding outward from the top of the film box; in other embodiments, other clamping claws that can clamp the film box can be selected.

[0035] Since the cleaning process takes longer time than the transport of the cassette, a support plate 24 for supporting the cassette may be provided on one side of the movement path of the cassette clamp 14 . When the wafer is cleaned, the cassette may be placed on the support plate 24 to wait.

[0036] The wafer cleaning mechanism 4 includes a first process tank 25, a second process tank 26, a third process tank 27 and a fourth process tank 28 arranged along the wafer transfer mechanism 2. The four process tanks correspond to the pre-cleaning process, chemical cleaning process, final cleaning process and drying process of the wafer respectively.

[0037] The loading and unloading mechanism 1 , the wafer transfer mechanism 2 , the cassette transfer mechanism 3 and the wafer cleaning mechanism 4 are all arranged in a cabinet 29 , and the cabinet 29 is provided with an observation window 30 for observing the interior and an inspection door 31 for detection and maintenance.

[0038] The cabinet 29 is provided with inlet and outlet ports 32 corresponding to the loading and unloading mechanisms 1 at both ends.

[0039] Since the actual factory may involve the transportation of wafer boxes that do not require cleaning, an overall transfer mechanism 33 with translation and lifting functions is also provided, which is used to transfer the wafer boxes carrying the wafers as a whole. The movement path of the overall transfer mechanism 33 is located on one side of the wafer transfer mechanism 2, and loading and unloading platforms are provided at the front and rear ends of the movement path of the overall transfer mechanism 33. The loading and unloading platforms can be integrated on the loading and unloading mechanism 1, and the structure of the loading and unloading platforms can be the same as the lifting part 8, that is, lifting parts 8 are provided on both sides of the loading and unloading mechanism 1, and the lifting parts 8 on both sides of the loading and unloading mechanisms 1 at both ends correspond one to one, and the corresponding lifting parts 8 on one side correspond to the movement path of the wafer transfer mechanism 2, and the corresponding lifting parts 8 on the other side correspond to the movement path of the overall transfer mechanism 33.

[0040] In this embodiment, the overall transfer mechanism 33 has the same structure as the wafer transfer mechanism 2 .

[0041] In this embodiment, the shorter distances of the movement of the wafer support plate 6, the lifting part 8, the wafer clamp 9, the wafer box clamp 14, the lifting lift 15, and the transporter 16 can be controlled by the electric / pneumatic / hydraulic telescopic rod, and the longer distances can be controlled by the reduction motor. The principle of the reduction motor control is: a track is set on the movement path, a rack is set on the track, the reduction motor is connected to the device that needs to move, and the reduction motor drives the gear to move, and the gear is engaged with the rack on the track. In this way, when the reduction motor drives the gear to move, the gear can be moved on the rack.

[0042] During actual use, a film box with wafers is placed at the inlet and outlet 32 ​​on the feed side of the cabinet 29, the lifting part 8 lifts the film box to the film box positioning member 5, and the film box is transferred to the film box positioning member 5, the wafer support plate 6 moves upward to push the wafer out of the film box, and after the wafer clamp 9 clamps the wafer, the wafer support plate 6 drops back to its original position; the wafer clamp 9 drives the wafer to pass through the first process slot 25, the second process slot 26, the third process slot 27 and the fourth process slot 28 in sequence, and then enters the loading and unloading mechanism 1 on the discharge side to wait for the wafer to be placed on the wafer support plate 6; the transporter 16 moves the film box after the wafer is clamped to one side, and by adjusting the height of the film box, the U-shaped member 17 passes through the support block 34 and enters the inside of the lifting lifter 15, and then the height of the film box positioning member 5 is lowered by the transporter 16 to transfer the film box to the lifting lifter 15. After the transfer, the transporter 16 drives the film box positioning member 5 back to its original position Waiting to receive the next cassette; the lifting and lifting device 15 drives the cassette to move upward, and after moving to a certain height, the cassette clamping claws 14 are used to clamp the cassette and move it to the supporting plate 24. When the wafer cleaning is about to be completed, the cassette clamping claws 14 clamp the cassette on the supporting plate 24 and place it on the lifting and lifting device 15 on the discharge side. The lifting and lifting device 15 on the discharge side drives the cassette to move downward, and then the transporter 16 of the loading and unloading mechanism 1 on the discharge side drives the cassette positioning member 5 to rise from the lifting and lifting device 15 to lift the cassette, and drives the cassette positioning member 5 to slide out of the U-shaped opening of the lifting and lifting device 15. The transporter 16 drives the cassette positioning member 5 to move to the position corresponding to the lifting part 8, and the wafer support plate 6 extends out. After the wafer clamping claws 9 place the cleaned wafer on the wafer support plate 6, the wafer support plate 6 descends to realize the wafer assembly into the cassette, and the cassette of the assembled wafer is driven by the lifting part 8 to the inlet and outlet 32 ​​on the discharge side of the cabinet 29.

[0043] Adaptive changes made according to actual needs are all within the protection scope of the present invention.

[0044] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numerals in the claims should not be regarded as limiting the claims involved.

[0045] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A film box reflow device, characterized in that: It includes a loading and unloading mechanism for separating or assembling a wafer box and the wafers therein, a wafer transport mechanism for transporting wafers, a wafer box transport mechanism for transporting a wafer box separated from a wafer, and a wafer cleaning mechanism for cleaning the wafers. The wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transport mechanism. The wafer transport mechanism drives the wafers to enter the wafer cleaning mechanism for cleaning. The two ends of the transport path of the wafer transport mechanism and the wafer box transport mechanism overlap and the loading and unloading mechanism is arranged at the end. The loading and unloading mechanism includes a wafer box positioning member and a wafer support plate with a lifting and lowering function. The wafer box positioning member is provided with a through opening for lifting and lowering the wafer support plate corresponding to the bottom opening of the wafer box. The wafer support plate is lifted and lowered in the through opening of the wafer box positioning member and the bottom opening of the wafer box to lift or put down the wafer and separate or assemble it from the wafer box.

2. The film box reflow device according to claim 1, characterized in that: The loading and unloading mechanism also includes a lifting part with the function of lifting and lowering movement and movement toward or away from the film box positioning member. The lifting part is U-shaped, and the two arms of the lifting part are respectively arranged corresponding to the two ends of the bottom of the film box. The U-shaped opening of the lifting part is arranged toward the film box positioning member. The lifting part lifts and lowers on the outer peripheral side of the film box positioning member to place the film box on the film box positioning member.

3. The film box reflow device according to claim 1, characterized in that: The wafer transfer mechanism includes a wafer clamp with lifting and lowering movements and movement functions between the loading and unloading mechanisms on both sides. The wafer clamp includes two rotating motors, two rotating shafts and two wafer clamping arms. The rotating motor is transmission-connected to the rotating shaft, and the rotating shaft is transmission-connected to the wafer clamping arms. The two rotating shafts are arranged in parallel, and the two wafer clamping arms are swinging toward or away from each other.

4. The film box reflow device according to claim 3, characterized in that: The wafer box reflow device is also provided with a detector for detecting whether a wafer is clamped between the two wafer clamping claws.

5. The film box reflow device according to claim 1, characterized in that: The film box transport mechanism includes a film box clamp with translation and lifting functions, a lifting lifter with lifting function, and a transporter that moves toward or away from the lifting lifter and has lifting function, the transporter drives the film box positioning piece to move, the lifting lifter is U-shaped, the opening of the lifting lifter is arranged toward the film box positioning piece, the part of the film box positioning piece used to lift the film box is a U-shaped piece with two openings arranged back to back, the upper surfaces of the two U-shaped pieces are the lifting parts for lifting the film box, and the two ends of the U-shaped opening of the lifting lifter are inwardly provided with support blocks matching the inner cavity of the U-shaped piece, the transporter carries the film box positioning piece to slide into the U-shaped inner cavity of the lifting lifter and moves downward to transport the film box to the lifting lifter, the film box clamp is arranged above the lifting lifter, and the lifting lifter is arranged on the loading and unloading mechanism.

6. The film box reflow device according to claim 5, characterized in that: The film box clamp includes a telescope, two sliders and two film box clamp arms. The two film box clamp arms are slidably arranged on the clamp arm slide rails through the sliders. The telescopic direction of the telescope is perpendicular to the sliding direction of the film box clamp arms. L-shaped connecting rods are hinged on both sides of the telescopic end of the telescope, and the end of the L-shaped connecting rod away from the telescope is hinged to the slider.

7. The film box reflow device according to claim 5, characterized in that: A supporting plate for supporting the film box is arranged on one side of the moving path of the film box clamping claw.

8. The film box reflow device according to claim 1, characterized in that: The wafer cleaning mechanism includes a first process tank, a second process tank, a third process tank and a fourth process tank arranged along the wafer transport mechanism.

9. The film box reflow device according to claim 1, characterized in that: The loading and unloading mechanism, the wafer transfer mechanism, the film box transfer mechanism and the wafer cleaning mechanism are all arranged in a cabinet, and the cabinet is provided with an observation window for observing the interior and an inspection door for detection and maintenance.

10. The film box reflow device according to claim 1, characterized in that: The wafer box reflow device also includes an overall transfer mechanism with translation and lifting functions. The movement path of the overall transfer mechanism is located on one side of the wafer transfer mechanism. The front and rear ends of the movement path of the overall transfer mechanism are provided with loading and unloading platforms.

Images