Wafer holding device, processing system, transmission method, processor and storage medium

Abstract

The embodiment of the invention provides a wafer holding device, a processing system, a transmission method, a processor and a storage medium. The wafer holding device comprises a sucker used for placing and adsorbing a wafer; the liquid suction mechanism is arranged on the suction cup and used for sucking liquid on the surface of the wafer; the liquid discharging mechanism is arranged on the suction cup and used for receiving the liquid sucked by the liquid sucking mechanism and discharging the received liquid out of the suction cup; the suction cup is arranged on the liquid discharging disc, and the liquid discharging disc is used for receiving the liquid discharged by the liquid discharging mechanism and discharging the received liquid. According to the invention, the liquid on the surface of the wafer is absorbed through the liquid absorption mechanism, and the liquid is guided to the liquid discharge disc through the liquid discharge mechanism, so that the adhesion problem between the wafer and the sucker is effectively solved. Besides, the liquid drainage disc can drain the liquid adsorbed by the adsorption mechanism to the outside, so that the water accumulation problem of the liquid drainage disc is avoided, the liquid on the surface of the wafer absorbed by the liquid absorption mechanism is ensured to be drained in time, and the wafer holding device in the embodiment can continuously and stably work.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor processing technology, and in particular, to a wafer holding device, a processing system, a transmission method, a processor, and a storage medium. Background Art

[0002] In semiconductor processing technology, the wafer holding device is the core component of the wafer transfer mechanism. During the wafer processing process, the wafer is first thinned by a grinding device, and then simply cleaned after reaching a predetermined thickness. Subsequently, the wafer is transferred to a CMP (Chemical Mechanical Polishing) machine for polishing. Therefore, when the wafer is placed on the holding device for transferring the wafer, there may be water droplets or water films on the surface of the wafer. These water films will cause adhesion between the wafer and the suction cup due to surface tension when the wafer is removed from the holding device. In addition, there will also be water accumulation in the lower support plate of the wafer holding device. Summary of the invention

[0003] In view of this, embodiments of the present application provide a wafer holding device, a processing system, a transmission method, a processor and a storage medium to at least partially solve the above-mentioned problems.

[0004] According to a first aspect of an embodiment of the present application, a wafer holding device is provided, which includes: a suction cup for placing and adsorbing a wafer; a liquid suction mechanism, which is arranged on the suction cup and is used to adsorb liquid on the surface of the wafer; a liquid discharge mechanism, which is arranged on the suction cup and is used to receive the liquid adsorbed by the liquid suction mechanism and discharge the received liquid out of the suction cup; and a liquid discharge plate, on which the suction cup is arranged, and the liquid discharge plate is used to receive the liquid discharged by the liquid discharge mechanism and discharge the received liquid.

[0005] Furthermore, in the above-mentioned wafer holding device, the drainage mechanism includes a drainage channel, which is opened on the top surface of the suction cup for placing the wafer; a drainage hole is opened at the bottom of the drainage channel, and the drainage channel is connected with the drainage plate through the drainage hole; the liquid suction mechanism is arranged in the drainage channel, and the drainage channel is used to receive the liquid adsorbed by the adsorption mechanism.

[0006] Furthermore, in the above-mentioned wafer holding device, the liquid absorption mechanism is a liquid absorption elastomer, and the liquid absorption elastomer is partially embedded in the drainage channel for being pressed into contact with the wafer. When the suction cup absorbs the wafer, the liquid absorption elastomer can be compressed back into the drainage channel, thereby squeezing the absorbed liquid into the drainage channel.

[0007] Furthermore, in the above-mentioned wafer holding device, the liquid absorbing elastic body is detachably embedded in the liquid discharge channel.

[0008] Furthermore, in the above-mentioned wafer holding device, the liquid-absorbing elastomer is at least one of sponge, latex, and water-absorbing fiber.

[0009] Furthermore, in the above-mentioned wafer holding device, a vacuum channel is also provided on the top surface of the suction cup; the suction cup is provided with a first suction hole passing through the suction cup, one end of the first suction hole is connected to the vacuum channel, and the other end is used to be connected to a vacuum extraction device to evacuate the vacuum channel and thereby adsorb the wafer to the suction cup.

[0010] Furthermore, the above-mentioned wafer holding device also includes: a first vacuum connector, which is penetrated through the drainage tray and communicated with the first suction hole, and the first suction hole is connected to the vacuum pumping device through the first vacuum connector.

[0011] Furthermore, in the above-mentioned wafer holding device, the drainage flow channels and the vacuum flow channels are alternately arranged, and the vacuum flow channels are interconnected.

[0012] Furthermore, in the above-mentioned wafer holding device, the vacuum flow channel includes an annular flow channel centered on the first suction hole, and a radial flow channel opened along the radial direction of the suction cup for connecting each of the annular flow channels; a fan-shaped drainage flow channel arranged on the same circle centered on the first suction hole is provided between two adjacent annular flow channels.

[0013] Furthermore, in the above-mentioned wafer holding device, the drain plate is provided with a second suction hole that passes through the drain plate; the drain plate forms a drainage channel toward the top surface of the suction cup, and the bottom surface of the drainage channel forms a gradually decreasing slope along the direction from the outer edge to the second suction hole, so that the liquid in the drainage channel converges to the second suction hole for discharge.

[0014] Furthermore, in the above-mentioned wafer holding device, the top surface of the drain plate is provided with an annular drain channel concentric with the drain plate, and the drain channel is used to receive the liquid discharged by the drain mechanism; the second adsorption hole is connected to the drain channel.

[0015] Furthermore, in the above-mentioned wafer holding device, there is one annular drainage channel; or, there are multiple annular drainage channels corresponding to the positions of the liquid suction mechanism, and each of the drainage channels is provided with a first drainage port along the radial direction so that the drainage channels are interconnected.

[0016] Furthermore, in the above wafer holding device, each of the drainage channels is provided with one of the first drainage ports.

[0017] Furthermore, in the above wafer holding device, each of the drainage channels is provided with at least two first drainage ports which are evenly distributed along the circumference of the drainage channel.

[0018] Furthermore, in the above-mentioned wafer holding device, the outer edge of the drainage plate is formed with a blocking body along the axial direction, and an annular channel is formed between the blocking body and the outer wall of the outermost drainage channel, and the annular channel is used to receive liquid dripping from the outer edge of the wafer.

[0019] Furthermore, in the above wafer holding device, the outermost drainage channel is provided with a second drainage port, and the annular channel is connected to the outermost drainage channel through the second drainage port.

[0020] Furthermore, in the above-mentioned wafer holding device, the number of the second liquid drainage port is one; or, the number of the second liquid drainage port is at least two and is evenly distributed along the circumference of the outermost liquid drainage channel.

[0021] Furthermore, in the above-mentioned wafer holding device, the cross-sectional area of ​​the second liquid discharge port is smaller than a preset cross-sectional value.

[0022] Furthermore, the above-mentioned wafer holding device also includes: a liquid absorption annular body, which is arranged in the annular channel and is used to absorb liquid dripping from the outer edge of the wafer.

[0023] Furthermore, the above-mentioned wafer holding device also includes: a second vacuum connection head, one end of the second vacuum connection head is connected to the second suction hole, and the other end is used to be connected to the vacuum extraction device.

[0024] According to the second aspect of an embodiment of the present application, a wafer processing system is provided, which includes: a robot and any one of the above-mentioned wafer holding devices; wherein the robot is used to place a cleaned wafer onto the wafer holding device, and to remove the wafer from the wafer holding device.

[0025] According to the third aspect of the embodiment of the present application, a method for wafer transfer is provided, which includes the following steps: controlling a robot to move a cleaned wafer to the top of any one of the above-mentioned wafer holding devices; controlling the robot to move the wafer downward toward the wafer holding device until the wafer contacts the suction cup; wherein, during the downward movement of the wafer, the wafer is pressed against the liquid suction mechanism provided on the suction cup, and the liquid suction mechanism absorbs the liquid on the surface of the wafer and discharges it to the liquid discharge mechanism; controlling the suction cup to be evacuated to adsorb the wafer to the suction cup; controlling the drain plate to be evacuated to discharge the liquid received by the drain plate, and closing the vacuum of the drain plate after a preset time; controlling the robot to release the wafer.

[0026] Furthermore, in the above-mentioned wafer transfer method, after controlling the robot to release the wafer, it also includes: controlling the robot to move to above any one of the above-mentioned wafer holding devices on which the wafer is placed; controlling the robot to move downward in the direction of the wafer holding device until it contacts the wafer, and clamps or sucks the wafer; controlling the suction cup to turn off the vacuum so that the suction cup releases the wafer; controlling the robot to move up with the wafer and take away the wafer.

[0027] According to a fourth aspect of an embodiment of the present application, a processor is provided, which is used to execute relevant steps of any of the above-mentioned wafer transfer methods.

[0028] According to a fifth aspect of an embodiment of the present application, a computer storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, any of the above-mentioned wafer transfer methods is implemented.

[0029] In the embodiment of the present application, the liquid suction mechanism can fully absorb the liquid on the surface of the wafer to prevent it from being retained on the surface of the wafer, thereby solving the adhesion problem between the wafer and the suction cup caused by residual liquid. At the same time, the embodiment of the present application is also provided with a liquid discharge mechanism to promptly guide the liquid absorbed by the liquid suction mechanism to the liquid discharge plate to ensure that the liquid does not flow back to the surface of the wafer. In addition, the embodiment of the present application also discharges the liquid absorbed by the adsorption mechanism from the surface of the wafer to the outside through the liquid discharge plate. By discharging the liquid in time, the continuity of the suction cup when adsorbing the liquid on the surface of the wafer is ensured, and the decrease in adsorption function due to liquid accumulation is avoided, which ensures that the wafer holding device in the present embodiment can still maintain its stability during long-term operation, and the adsorption capacity of the adsorption mechanism will not be affected by liquid residue.

[0030] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0032] Figure 1 A schematic structural diagram of a wafer processing system for application of a wafer holding device provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of the three-dimensional structure of a wafer holding device is provided for an embodiment of the present application;

[0034] Figure 3A schematic diagram of the planar structure of a suction cup in a wafer holding device provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of the three-dimensional structure of a liquid drain tray in a wafer holding device provided in an embodiment of the present application;

[0036] Figure 5 Another schematic diagram of the three-dimensional structure of the drain tray in the wafer holding device provided in the embodiment of the present application;

[0037] Figure 6 A schematic diagram of the planar structure of a drain pan in a wafer holding device provided in an embodiment of the present application;

[0038] Figure 7 A schematic diagram of a process flow of a wafer transmission method provided in an embodiment of the present application;

[0039] Figure 8 Another schematic diagram of a process of a wafer transfer method provided in an embodiment of the present application;

[0040] In the above picture:

[0041] Wafer holding device 100; suction cup 110; top surface 111; vacuum flow channel 112; annular flow channel 112A; radial flow channel 112B; first suction hole 113; first vacuum joint 114; suction mechanism 120; discharge mechanism 130; discharge flow channel 131; discharge hole 131A; discharge plate 140; second suction hole 141; discharge channel 142; first discharge port 142A; second discharge port 142B; enclosure 143; annular channel 144; second vacuum joint 145;

[0042] Wafer processing system 200; grinding module 210; wafer carrier 211; grinding device 212; first Z feed axis 212A; first grinding spindle 212B; second Z feed axis 212C; second grinding spindle 212D; measurement module 213; grinding cleaning module 214; first manipulator 215; CMP and cleaning module 220; polishing module 221; polishing cleaning module 222; second manipulator 223; scrubbing module 224; EFEM module 230; third manipulator 231;

[0043] Wafer 300. DETAILED DESCRIPTION

[0044] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0045] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0046] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] In the related art, when the cleaned wafer is placed on the wafer holding device, there may be water droplets or water film on the surface of the wafer, which may cause adhesion between the wafer and the suction cup due to surface tension when the wafer is removed from the holding device. In addition, there may also be water accumulation in the lower support plate of the wafer holding device.

[0050] In response to the above problems, an embodiment of the present application provides a wafer holding device, which solves the problem of wafer adhesion to the suction cup due to the tension of water.

[0051] The specific implementation of the embodiment of the present application is further explained below in conjunction with the accompanying drawings of the embodiment of the present application.

[0052] Figure 1 FIG. 2 shows a wafer processing system 200 applicable to the wafer holding device 100 provided in an embodiment of the present application. Figure 1 As shown, the system 200 may include a grinding module 210 , a CMP and cleaning module 220 , and an EFEM module (Equipment Front End Module) 230 .

[0053] As shown in the figure, the grinding module 210 is used to grind and thin the wafer, and may include a wafer carrier 211, a grinding device 212, a measuring module 213, a grinding cleaning module 214, and a first robot 215. The CMP and cleaning module 220 may include a polishing module 221, a polishing cleaning module 222, a second robot 223, a scrubbing module 224, and a wafer holding device 100. The EFEM module 230 may include a third robot 231, etc.

[0054] Figure 1 The wafer carrier 211 is provided with two grinding devices 212, the first grinding device 212 includes a first Z feed axis 212A and a first grinding spindle 212B, the second grinding device 212 includes a second Z feed axis 212C and a second grinding spindle 212D, the first grinding device 212 is used for rough grinding of the wafer, and the second grinding device 212 is used for fine grinding of the wafer. The first grinding spindle 212B is connected to the grinding wheel for rough grinding, and the first Z feed axis 212A is responsible for controlling the movement of the grinding wheel in the Z-axis direction, and this action is used to adjust the distance between the grinding wheel and the wafer to control the grinding depth. The rotation speed of the first grinding spindle 212B determines the grinding speed, and the rotation speed is the key to removing the surface material of the wafer during the grinding process. In general, the first Z feed axis 212A controls the approach or distance of the grinding wheel to the wafer, thereby controlling the feeding of the grinding wheel, while the first grinding spindle 212B controls the rotation speed of the grinding wheel, and the two work together to complete the grinding and thinning of the wafer. Similarly, the second grinding spindle 212C of the second grinding device 212 is connected to the grinding wheel for fine grinding, and the second Z feed axis 212D is responsible for controlling the movement of the fine grinding wheel in the Z-axis direction, thereby controlling the feeding of the grinding wheel, and the second grinding spindle 212C controls the rotation speed of the fine grinding wheel.

[0055] After grinding and thinning, the measurement module 213 is used to detect whether the parameters such as the flatness and size of the wafer surface meet the requirements. The first robot 215 sends the wafer that meets the requirements to the grinding and cleaning module 214, and the grinding and cleaning module 214 cleans the wafer surface to remove the residue on the wafer surface. The first robot 215 then sends the cleaned wafer to the wafer holding device 100.

[0056] The second robot 223 delivers the wafer on the wafer holding device 100 to the polishing module 221 for polishing, and transfers the polished wafer to the polishing cleaning module 222 and the brush cleaning module 224 to clean the wafer surface. The second robot 223 delivers the cleaned wafer to the wafer holding device 100 so that the wafer enters the next processing step.

[0057] The main function of the EFEM module 230 is to load, unload, sort and transfer wafers at the front end of the wafer processing equipment. For example, the third robot 231 in the EFEM module 230 can automatically take out the wafers from the wafer box and load them into the wafer processing equipment (for example Figure 1 The grinding module 210, CMP and cleaning module 220 are shown in the figure, and after the wafer processing is completed, the wafer is automatically unloaded from the equipment and placed back into the wafer box or other designated container.

[0058] It should be noted that Figure 1 The wafer holding device 100 is shown to be used for placing wafers that have been cleaned after grinding, thinning and polishing. In specific implementation, the wafer holding device 100 can be used after the wafer has undergone any cleaning process, and this embodiment does not make any limitation here.

[0059] See also Figures 2 to 5 According to an embodiment of the present application, a wafer holding device 100 includes: a suction cup 110, a liquid suction mechanism 120, a liquid discharge mechanism 130, and a liquid discharge plate 140. The suction cup 110 is used to place and absorb the wafer 300. Specifically, the suction cup 110 may be formed with a top surface 111 for placing the wafer 300. When the wafer 300 is placed on the top surface 111, the suction cup 110 absorbs the wafer 300 to fix the wafer 300.

[0060] The liquid suction mechanism 120 and the liquid discharge mechanism 130 are both disposed on the suction cup 110 . The liquid suction mechanism 120 is used to suction the liquid on the surface of the wafer 300 and discharge the suctioned liquid. The liquid discharge mechanism 130 is used to receive the liquid discharged by the liquid suction mechanism 120 and discharge the received liquid from the suction cup 110 .

[0061] The suction cup 110 is disposed on the drain plate 140 (relative to Figure 2The drain pan 140 is used to receive the liquid discharged by the drain mechanism 130 and to discharge the received liquid to the outside.

[0062] Compared with the related art, in the embodiment of the present application, the liquid suction mechanism 120 can fully absorb the liquid on the surface of the wafer 300 to prevent it from being retained on the surface of the wafer 300, thereby solving the adhesion problem between the wafer 300 and the suction cup 110 caused by liquid residue. At the same time, the embodiment of the present application also provides a liquid discharge mechanism 130 to promptly guide the liquid absorbed by the liquid suction mechanism 120 to the liquid discharge plate 140 to ensure that the liquid does not flow back to the surface of the wafer 300. In addition, the embodiment of the present application also discharges the liquid absorbed by the adsorption mechanism 120 from the surface of the wafer 300 to the outside through the liquid discharge plate 140. By promptly discharging the liquid, the continuity of the suction cup 110 in adsorbing the liquid on the surface of the wafer is ensured, and the decrease in adsorption function due to liquid accumulation is avoided, so that the wafer holding device in the present embodiment can still maintain its stability during long-term operation, and the adsorption capacity of the adsorption mechanism 120 will not be affected by liquid residue.

[0063] In some embodiments, the suction cup 110 and the drain pan 140 may be integrally formed. In other embodiments, the suction cup 110 and the drain pan 140 may be detachably connected, such as by snapping or screwing.

[0064] In some embodiments, the drainage mechanism 130 may include a drainage channel 131, and the drainage channel 131 is opened on the top surface 111 of the suction cup 110, that is, the drainage channel 131 is a groove opened on the top surface of the suction cup 110. The bottom of the drainage channel 131 (relative to Figure 2 In the state shown in the figure, a drainage hole 131A is opened, and the drainage hole 131A passes through the suction cup 110. The drainage channel 131 is connected to the drainage plate 140 through the drainage hole 131A.

[0065] The liquid suction mechanism 120 is arranged in the drainage channel 131A. When the wafer 300 is placed on the suction cup 110, it contacts the adsorption mechanism 20. The adsorption mechanism 120 adsorbs the liquid on the surface of the wafer 300 and discharges the adsorbed liquid into the drainage channel 131. The drainage channel 131 then discharges the liquid into the drainage tray 140 through the drainage hole 131A.

[0066] In a specific implementation, one or more drainage holes 131A may be provided. When a plurality of drainage holes 131A are provided, they may be evenly distributed along the drainage channel 131 .

[0067] In the embodiment of the present application, the liquid adsorbed by the liquid suction mechanism 120 is introduced into the liquid drainage plate 140 through the liquid drainage channel 131 and the liquid drainage hole 131A, and the overall structure is relatively compact.

[0068] In some embodiments, the liquid absorption mechanism 120 is a liquid absorption elastomer, which is partially embedded in the drainage channel 131 and is used to be pressed against the wafer 300. When the suction cup 110 absorbs the wafer 300, the liquid absorption elastomer can be compressed back into the drainage channel 131 by the wafer 300, thereby squeezing the absorbed liquid into the drainage channel 131.

[0069] In this embodiment, a portion of the liquid-absorbing elastic body is embedded in the liquid discharge channel 131, and a portion is placed outside the liquid discharge channel 131. In other words, the upper surface (relative to the upper surface) of the liquid-absorbing elastic body is Figure 2 In the state shown in FIG. 1 , the wafer 300 is higher than the top surface 111 of the suction cup 110, so that the wafer 300 first contacts the liquid absorbing elastic body during the lowering process, and the liquid absorbing elastic body absorbs the liquid on the surface of the wafer 300. At the same time, the liquid absorbing elastic body is compressed during the lowering process of the wafer 300, and the liquid absorbed by the liquid absorbing elastic body is squeezed into the drainage channel 131. When the wafer 300 is lowered and contacts the top surface 111 of the suction cup 110, the liquid absorbing elastic body is completely compressed back into the drainage channel 131.

[0070] In a specific implementation, the liquid-absorbing elastomer can be a sponge, which has good liquid absorption and air permeability; it can also be latex, which is soft and durable and can effectively absorb liquid; it can also be a water-absorbing fiber, which has the ability to quickly absorb liquid. Of course, the liquid-absorbing elastomer can also be any combination of these materials, such as a combination of sponge and latex, or a mixture of sponge and water-absorbing fiber, or a combination of latex, sponge and water-absorbing fiber.

[0071] It should be noted that, in specific implementation, the liquid-absorbing elastic body only needs to be able to absorb liquid and have elasticity, and this embodiment will not be listed one by one here.

[0072] In a specific implementation, there is one or more drainage channels 131 , and accordingly, the number of the liquid-absorbing elastomers is adapted to the drainage channel 131 .

[0073] In one example, when there is more than one drainage channel 131, each drainage channel 131 can be an annular channel concentric with the suction cup 110, or each drainage channel 131 can be a straight channel distributed in parallel along the radial direction of the suction cup 110. Of course, they can also be arranged in a criss-cross pattern. This embodiment does not impose any limitation on the specific arrangement of the drainage channels 131.

[0074] In this embodiment, the liquid-absorbing elastomer has good liquid-absorbing performance, and can quickly absorb the liquid on the surface of the wafer 300, accelerating the drying process of the surface of the wafer 300; at the same time, because the soft liquid-absorbing material of the liquid-absorbing elastomer can gently contact the surface of the wafer 300, it avoids causing damage or scratches to the wafer 300. In addition, the liquid-absorbing elastomer can be integrated into the suction cup 110, does not require additional space, and is conducive to miniaturization of the device.

[0075] Furthermore, in some embodiments, the liquid-absorbing elastomer is detachably embedded in the liquid discharge channel 131, and can be quickly replaced after the liquid-absorbing elastomer is worn or saturated, thereby reducing maintenance difficulty and maintenance cost.

[0076] Continue to see Figure 2 In some embodiments, the top surface 111 of the suction cup 110 is further provided with a vacuum channel 112. The suction cup 110 is provided with a first suction hole 113 penetrating the suction cup 110, one end of the first suction hole 113 is connected to the vacuum channel 112, and the other end is used to be connected to a vacuum pumping device to evacuate the vacuum channel and then adsorb the wafer 300 to the suction cup 110.

[0077] In this embodiment, the vacuum channel 112 is also a groove opened on the top surface 111 of the suction cup 110. When the wafer 300 is placed on the top surface 111, the wafer 300 covers the open end of the vacuum channel 112, so that the vacuum channel 112 forms a closed space. At this time, the vacuum channel 112 is evacuated by a vacuum pumping device, so that the wafer 300 can be adsorbed on the top surface 111 of the suction cup 110.

[0078] This embodiment fixes the wafer 300 by vacuum adsorption. Since vacuum adsorption is a non-contact adsorption method, it will not damage the surface of the wafer 300 and is suitable for wafer processing with extremely high surface quality requirements. When the wafer 300 needs to be released, the wafer 300 can be easily separated from the suction cup 110 by simply stopping the vacuum pumping. The operation is simple and quick.

[0079] Furthermore, in some embodiments, it may also include: a first vacuum connector 114 , which is penetrated through the drain pan 140 and communicated with the first suction hole 113 , so that the first suction hole 113 is connected to the vacuum device through the first vacuum connector 114 .

[0080] See also Figure 3 In some embodiments, the drainage channels 131 and the vacuum channels 112 are alternately arranged, and the vacuum channels 112 are interconnected.

[0081] In a specific implementation, the vacuum flow channel 112 includes an annular flow channel 112A centered on the first suction hole 113 , and a radial flow channel 112B opened along the radial direction of the suction cup 110 for connecting the annular flow channels 112A.

[0082] A fan-shaped drainage channel 131 arranged on the same circumference with the first adsorption hole 113 as the center is provided between two adjacent annular channels 112A.

[0083] It can be seen that in this embodiment, the drainage channel 131 is divided into multiple fan-shaped shapes by the annular channel 112A and the radial channel 112B. In specific implementation, the number and size of the liquid-absorbing elastomers can be adjusted by changing the number of the annular channel 112A and the radial channel 112B. The specific implementation can be determined based on actual conditions, and this application does not make any limitations here.

[0084] In this embodiment, the drainage channel 131 and the vacuum channel 112 are arranged alternately. This layout not only ensures the uniform distribution of the vacuum adsorption force, thereby stably fixing the wafer 300, but also enables the liquid absorbing elastomer to contact the surface of the wafer 300 more evenly, thereby more effectively adsorbing the liquid on the surface of the wafer 300.

[0085] Furthermore, the vacuum channel 112 is evenly distributed along the radial and circumferential directions of the suction cup 110 , and the drainage channel 131 is also evenly distributed along the radial and circumferential directions of the suction cup 110 , so that the adsorption force of the wafer 300 is more uniform, and the liquid on the surface of the wafer 300 can also be more fully adsorbed.

[0086] See also Figure 2 , Figures 4 to 6 In some embodiments, the drain pan 140 is provided with a second suction hole 141, and a drainage channel 142 is formed on the top surface of the drain pan 140 toward the suction cup 110. The drainage channel 142 has a gradually decreasing slope along the direction from the outer edge to the second suction hole 141, so that the liquid in the drainage channel 142 converges to the second suction hole 141 for discharge.

[0087] The gradually decreasing slope in this embodiment helps to prevent the liquid from being retained in the drain pan 140 , thereby ensuring that the liquid can be quickly drained and avoiding the accumulation of liquid in the drain pan 140 .

[0088] In some embodiments, the top surface of the drain pan 140 is provided with an annular drain channel 142 concentric with the drain pan 140 . The drain channel 142 is used to receive the liquid discharged by the drain mechanism 130 . The second adsorption hole 141 is connected to the drain channel 142 .

[0089] In a specific implementation, there may be one or more annular drainage channels 142. When there are more than one, each drainage channel 142 is provided with a first drainage port 142A in the radial direction so that each drainage channel 142 is interconnected. Each drainage channel 142 corresponds to the position of the suction mechanism 120. Specifically, the drainage channel 131 on the suction cup 110 corresponds to the position of the drainage channel 142 on the drainage disc 140 so that the liquid in the drainage channel 131 is discharged into the drainage channel 142 through the drainage hole 131A.

[0090] In some embodiments, each drainage channel 142 may have a first drainage port 142A. In other embodiments, each drainage channel 142 may have more than one first drainage port 142, and each first drainage port 142A is evenly distributed along the circumference of the drainage channel 142, ensuring that the liquid can be discharged from multiple points in the drainage channel 142 at the same time, thereby reducing the accumulation of liquid in the drainage channel 142 and making the liquid flow smoother.

[0091] See also Figure 2 , Figures 4 to 6 In some embodiments, an annular enclosure 143 is formed on the outer edge of the drain tray 140 along the axial direction of the drain tray 140 (i.e., perpendicular to the direction of the suction cup 110), and an annular channel 144 is formed between the annular enclosure 143 and the outer wall of the annular drainage channel 142 located on the outermost side (the side away from the center of the drain tray 140). The wafer 300 and the suction cup 110 are both placed in the enclosure 143, and the annular channel 144 is used to receive liquid dripping from the upper surface of the wafer 300 and the lower surface exposed outside the suction cup 110.

[0092] Further, in some embodiments, see Figure 4 and Figure 5 The outermost drainage channel 142 is provided with a second drainage port 142B, and the annular channel 144 is connected to the outermost drainage channel 142 through the second drainage port 142B to discharge the liquid dripping from the outer edge of the wafer 300 into the drainage channel 140. In specific implementation, one second adsorption hole 142B can be provided, or two or more second adsorption holes 142B can be provided, and the specific number can be determined according to actual conditions and is not limited here.

[0093] In one example, there may be one first suction hole 113 disposed at the center of the suction cup 110 , and two second suction holes 141 may be disposed near the center of the drain tray 140 and symmetrically relative to the center of the drain tray 140 .

[0094] In some embodiments, there is one second liquid discharge port 142B. In other embodiments, there are more than one second liquid discharge port 142B and they are evenly distributed along the circumference of the outermost liquid discharge channel 142, ensuring that the liquid can be discharged from multiple points in the annular channel 144 at the same time, thereby reducing the accumulation of liquid in the annular channel 144 and making the liquid flow smoother.

[0095] Furthermore, in some other embodiments, it further comprises: a liquid absorbing annular body (not shown in the figure), which is arranged in the annular channel 144 and is used to absorb the liquid dripping from the outer edge of the wafer 300, and the saturated liquid absorbing annular body can be replaced regularly. In specific implementation, the liquid absorbing annular body can be a water absorbing sponge, latex, water absorbing fiber, etc.

[0096] In some embodiments, the second vacuum connector 145 is further included, one end of which is connected to the second suction hole 141 and the other end is used to connect to the vacuum device. In this embodiment, the accumulated water in the drain pan 140 is sucked away by vacuuming, thereby enhancing the discharge effect of the liquid in the drain channel 142.

[0097] Furthermore, the cross-sectional area of ​​the second drain port 142B is smaller than the preset cross-sectional value. In this embodiment, since the water in the drain pan 140 will be vacuumed away through the drain channel 142, an overly large setting of the second drain port 142B will affect the vacuuming effect, so the second drain port 142B is set as small as possible. It should be noted that, in specific implementation, the preset cross-sectional value can be determined according to actual conditions, and this embodiment does not impose any limitation on this.

[0098] In the embodiment of the present application, the interactive process of taking and placing the wafer 300 is as follows:

[0099] When placing the wafer 300, the robot moves the wafer 300 with the water film or water droplets to the top of the wafer holding device 100 in this embodiment, and then the robot lowers the wafer 300. Since the initial upper surface height of the liquid-absorbing elastic body is higher than the upper surface of the suction cup 220, the robot will move the wafer 300 downward, that is, move in the direction close to the suction cup 110. The wafer 300 first contacts the liquid-absorbing elastic body. During the lowering process of the wafer 300, the liquid-absorbing elastic body is continuously pressed downward until it is aligned with the top surface 111 of the suction cup 220. At this time, the liquid-absorbing elastic body is completely compressed into the drainage channel 131, and then the vacuum channel 112 is vacuumed to absorb the wafer 300. In this process, the liquid on the lower surface of the wafer 300 is absorbed by the liquid-absorbing elastic body, and the liquid in the liquid-absorbing elastic body is squeezed into the drainage channel 131 by the extrusion force, and then discharged into the drainage tray 140 from the drainage hole 131A inside the drainage channel 131. The drainage channel 142 of the drainage tray 140 is then vacuumed to absorb the liquid in the tray (the vacuuming of the drainage channel 142 can be performed simultaneously with the vacuuming of the vacuum channel 112 of the suction cup 110, or it can be performed slightly delayed), and then the drainage tray 140 is closed to vacuum (for example, after a few seconds), and the robot releases the wafer 300 and returns to its original position.

[0100] When taking the wafer 300, the robot moves to the top of the wafer 300, the robot descends and contacts the wafer 300, then the robot sucks or clamps the wafer 300, the vacuum channel 112 of the suction cup 110 releases the vacuum, and the robot rises with the wafer 300. During the rising process of the wafer 300, the upper surface of the liquid-absorbing elastic body will rise and rebound due to its elasticity, lifting the wafer 300, and then the wafer 300 will be separated from the upper surface of the liquid-absorbing elastic body.

[0101] An embodiment of the present application also proposes a wafer processing system, which includes: a robot and any one of the above-mentioned wafer holding devices; wherein the robot is used to place the cleaned wafer into the wafer holding device and remove the wafer on the wafer holding device.

[0102] Since the wafer holding device has the above-mentioned effects, the wafer polishing system having the wafer holding device also has corresponding technical effects.

[0103] The present application also provides a wafer transfer method, which places the cleaned wafer 300 on any of the above-mentioned wafer holding devices 100, see Figure 7 , the method comprises the following steps:

[0104] Step S710 , controlling the robot arm to move the cleaned wafer 300 to directly above any one of the above-mentioned wafer holding devices 100 .

[0105] Step S720, control the robot to move the wafer downward toward the wafer holding device 100 until the wafer contacts the suction cup. During the downward movement of the wafer, the wafer is pressed against the liquid suction mechanism provided on the suction cup, and the liquid suction mechanism absorbs the liquid on the surface of the wafer and discharges it to the liquid discharge mechanism.

[0106] Specifically, when the robot moves the wafer downward toward the wafer holding device, the wafer first contacts the liquid absorbing mechanism (such as a sponge), and the liquid absorbing mechanism begins to absorb the liquid on the surface of the wafer. Then the robot continues to move downward until it contacts the suction cup, and the wafer squeezes the liquid absorbing mechanism into the liquid discharging mechanism. During the downward movement of the wafer, the liquid absorbing mechanism absorbs the water on the lower surface of the wafer into the sponge, and squeezes the water in the liquid absorbing mechanism into the liquid discharging mechanism through the squeezing force.

[0107] Step S730, controlling the suction cup to evacuate the wafer to the suction cup.

[0108] Specifically, when the wafer contacts the suction cup, the suction cup is evacuated by an external vacuum pumping device.

[0109] Step S740, controlling the drain pan to be evacuated to drain the liquid received by the drain pan, and closing the vacuum of the drain pan after a preset time.

[0110] In specific implementation, the preset time can be determined according to actual conditions, such as 3 seconds, 4 seconds, etc. This embodiment does not impose any limitation on the specific value.

[0111] It should be noted that the vacuuming of the drain pan in step S730 can be performed simultaneously with the vacuuming of the suction cup in step S740, or the vacuuming of the drain pan in step S740 can be performed slightly later, for example, after a delay of 2 seconds or 3 seconds.

[0112] Step S750, control the robot arm to release the wafer, and then the robot arm returns to its original position.

[0113] In the process of placing the wafer on the wafer holding device in the embodiment of the present application, the liquid suction mechanism can fully absorb the liquid on the surface of the wafer to prevent it from being retained on the surface of the wafer, thereby solving the adhesion problem between the wafer and the suction cup caused by liquid residue. At the same time, the embodiment of the present application also provides a liquid drainage mechanism to promptly guide the liquid absorbed by the liquid suction mechanism to the liquid drainage tray to ensure that the liquid does not flow back to the surface of the wafer.

[0114] Figure 7 The process of placing a wafer on a wafer holding device is shown. Furthermore, the wafer transfer method may also include a process of removing a wafer from the wafer holding device. This process may remove a wafer from any of the wafer holding devices in the above embodiments. Figure 8 , after the above step S750, the following may also be included:

[0115] Step S810, controlling the robot arm to move to directly above any of the above-mentioned wafer holding devices on which the wafer is placed.

[0116] Step S820, controlling the robot arm to move downward toward the wafer holding device until it contacts the wafer, and clamps or sucks the wafer.

[0117] Step S830, controlling the suction cup to turn off the vacuum so that the suction cup releases the wafer.

[0118] Step S840, controlling the robot arm to move up with the wafer, taking away the wafer, and transferring the wafer to the next workstation.

[0119] In the embodiment of the present application, since the wafer holding device absorbs the liquid on the lower surface of the wafer, there will be no adhesion problem between the wafer and the suction cup during the process of removing the wafer.

[0120] The embodiment of the present application also proposes a processor for executing a program, which can specifically execute the relevant steps of any of the above-mentioned wafer transfer methods.

[0121] Specifically, the program may include program codes including computer operation instructions.

[0122] The processor may be a central processing unit CPU, or an application specific integrated circuit ASIC (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0123] An embodiment of the present application further provides a computer storage medium on which a computer program is stored, and when the program is executed by a processor, any of the above-mentioned wafer transmission methods is implemented.

[0124] The above-mentioned method according to the embodiment of the present application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as a CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as a computer code originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a dedicated processor or programmable or dedicated hardware (such as an AS IC or FPGA). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the wafer transmission method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the verification code generation method shown here, the execution of the code converts the general-purpose computer into a dedicated computer for executing the wafer transmission method shown here.

[0125] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A wafer holding device, characterized in that: include: Suction cup, used to place and absorb the wafer; A liquid suction mechanism, disposed on the suction cup, for absorbing liquid on the surface of the wafer; A liquid discharge mechanism, disposed on the suction cup, for receiving the liquid adsorbed by the liquid suction mechanism and discharging the received liquid from the suction cup; A drain pan, the suction cup is arranged on the drain pan, and the drain pan is used to receive the liquid discharged by the drain mechanism and to discharge the received liquid.

2. The wafer holding device according to claim 2, characterized in that: The drainage mechanism comprises a drainage channel, and the drainage channel is opened on the top surface of the suction cup for placing the wafer; A drainage hole is provided at the bottom of the drainage channel, and the drainage channel is connected to the drainage plate through the drainage hole; The liquid suction mechanism is arranged in the liquid discharge channel, and the liquid discharge channel is used to receive the liquid adsorbed by the adsorption mechanism.

3. The wafer holding device according to claim 2, characterized in that: The liquid absorption mechanism is a liquid absorption elastomer, which is partially embedded in the drainage channel for being pressed against the wafer. When the suction cup absorbs the wafer, the liquid absorption elastomer can be compressed back into the drainage channel, thereby squeezing the absorbed liquid into the drainage channel.

4. The wafer holding device according to claim 3, characterized in that ； The liquid-absorbing elastic body is detachably embedded in the liquid-discharging channel.

5. The wafer holding device according to claim 3, characterized in that: The liquid-absorbing elastic body is at least one of sponge, latex and water-absorbing fiber.

6. The wafer holding device according to claim 3, characterized in that: The top surface of the suction cup is also provided with a vacuum flow channel; The suction cup is provided with a first suction hole penetrating the suction cup, one end of the first suction hole is connected to the vacuum channel, and the other end is used to be connected to a vacuum pumping device to evacuate the vacuum channel and then adsorb the wafer to the suction cup.

7. The wafer holding device according to claim 6, characterized in that: Also includes: A first vacuum joint is provided through the drain pan and is communicated with the first suction hole. The first suction hole is communicated with the vacuum pumping device through the first vacuum joint.

8. The wafer holding device according to claim 2, characterized in that: The drainage channels and the vacuum channels are arranged alternately, and the vacuum channels are interconnected.

9. The wafer holding device according to claim 8, characterized in that: The vacuum flow channel includes an annular flow channel centered at the first suction hole, and a radial flow channel opened along the radial direction of the suction cup for connecting the annular flow channels; A fan-shaped liquid discharge channel arranged on the same circumference with the first adsorption hole as the center is provided between two adjacent annular flow channels.

10. The wafer holding device according to any one of claims 1 to 9, characterized in that: The drain plate is provided with a second adsorption hole penetrating through the drain plate; The drainage plate is formed with a drainage channel on the top surface toward the suction cup, and the bottom surface of the drainage channel is formed with a gradually decreasing slope along the direction from the outer edge to the second suction hole, so that the liquid in the drainage channel is gathered to the second suction hole for discharge.

11. The wafer holding device according to claim 10, characterized in that: The top surface of the drain plate is provided with an annular drain channel which is concentric with the drain plate, and the drain channel is used to receive the liquid discharged by the drain mechanism; The second adsorption hole is communicated with the liquid discharge channel.

12. The wafer holding device according to claim 11, characterized in that: There is one annular liquid discharge channel; or There are a plurality of annular drainage channels corresponding to the positions of the liquid suction mechanisms, and each of the drainage channels is provided with a first drainage port along the radial direction so that the drainage channels are interconnected.

13. The wafer holding device according to claim 12, characterized in that: Each of the liquid discharge channels is provided with a first liquid discharge port.

14. The wafer holding device according to claim 12, characterized in that: Each of the drainage channels is provided with at least two first drainage ports which are evenly distributed along the circumference of the drainage channel.

15. The wafer holding device according to claim 11, characterized in that: The outer edge of the drain pan is formed with a baffle along the center line of the drain pan, and an annular channel is formed between the baffle and the outer wall of the outermost drainage channel, and the annular channel is used to receive liquid dripping from the outer edge of the wafer.

16. The wafer holding device according to claim 15, characterized in that: The outermost liquid discharge channel is provided with a second liquid discharge port, and the annular channel is connected with the outermost liquid discharge channel through the second liquid discharge port.

17. The wafer holding device according to claim 16, characterized in that: The second liquid discharge port is one; or, There are at least two second drainage ports, which are evenly distributed along the circumference of the outermost drainage channel.

18. The wafer holding device according to claim 16, characterized in that: The cross-sectional area of ​​the second liquid discharge port is smaller than a preset cross-sectional value.

19. The wafer holding device according to claim 15, characterized in that: Also includes: The liquid absorbing annular body is arranged in the annular channel and is used for absorbing the liquid dripping from the outer edge of the wafer.

20. The wafer holding device according to claim 10, characterized in that: Also includes: A second vacuum connector, one end of which is connected to the second suction hole, and the other end of which is used to be connected to a vacuum pumping device.

21. A wafer processing system, characterized in that: include: A robot and a wafer holding device as claimed in any one of claims 1 to 20; wherein: The robot is used to place the cleaned wafer on the wafer holding device and to take the wafer off the wafer holding device.

22. A wafer transmission method, characterized in that: The method comprises the following steps: Controlling the robot to move the cleaned wafer to above the wafer holding device according to any one of claims 1 to 20; Control the robot to move the wafer downward toward the wafer holding device until the wafer contacts the suction cup; wherein, during the downward movement of the wafer, the wafer is pressed against the liquid suction mechanism provided on the suction cup, and the liquid suction mechanism absorbs the liquid on the surface of the wafer and discharges it to the liquid discharge mechanism; Controlling the suction cup to evacuate the wafer so as to adsorb the wafer to the suction cup; Controlling the drain pan to evacuate the liquid to discharge the liquid received by the drain pan, and closing the vacuum of the drain pan after a preset time; The robot arm is controlled to release the wafer.

23. The wafer transfer method according to claim 22, characterized in that: After controlling the robot to release the wafer, the method further includes: Controlling the robot to move above the wafer holding device according to any one of claims 1 to 20 on which the wafer is placed; Controlling the robot to move downward toward the wafer holding device until it contacts the wafer, and clamps or sucks the wafer; Controlling the suction cup to close the vacuum so that the suction cup releases the wafer; The robot is controlled to move the wafer upward and take away the wafer.

24. A processor, characterized in that: Used to execute relevant steps of the wafer transfer method described in claim 22 or 23.

25. A computer storage medium having a computer program stored thereon, wherein when the program is executed by a processor, the wafer transfer method according to claim 22 or 23 is implemented.

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