Sapphire wafer taking device and sapphire wafer taking method

Abstract

The invention discloses a sapphire wafer taking device and a sapphire wafer taking method, belongs to the technical field of sapphire wafer transfer, and aims to solve the problems that when an air bag is used for taking out ground sapphire wafers one by one in the prior art, the appearances of the wafers are easily abraded, the appearances of products are easily poor, and the taking-out efficiency is poor. The chip taking device comprises a chip taking plate, a mechanical valve, a plurality of air passing pipes and a plurality of adsorption unit sets, the mechanical valve is arranged at the top of the chip taking plate, a plurality of annular air channels are machined in the chip taking plate and sequentially arranged in a sleeving mode from the center of the chip taking plate to the edge of the chip taking plate, and the ventilation end of the mechanical valve communicates with the annular air channels through the air passing pipes; the multiple adsorption unit sets are all installed at the bottom of the sheet taking plate, each adsorption unit set corresponds to one or two annular air channels, and the ventilation end of each adsorption unit set communicates with the corresponding annular air channel. The sapphire wafer taking and transferring device is mainly used for taking and transferring sapphire wafers.

Description

Technical Field

[0001] The invention belongs to the technical field of sapphire wafer transportation, and in particular relates to a sapphire wafer taking device and a sapphire wafer taking method. Background Art

[0002] As an important basic material for modern industry, sapphire single crystal material has superior properties in chemistry, electricity, mechanics, optics, thermodynamics and durability. Sapphire has mature production technology and good device quality; good chemical stability, can be used in high-temperature growth processes; and high mechanical strength, easy to handle and clean. At the same time, it has good transmittance in ultraviolet, infrared, visible light and microwave bands, so sapphire crystal materials are widely used in LED substrate materials, various consumer electronic products, high-intensity lasers, smart wearable devices, aerospace and large-scale integrated circuits.

[0003] In recent years, due to the emergence of display technologies such as OLED, QLED, Mini LED and Micro LED, integrated circuit chip packaging technology has developed in the direction of smaller size, higher density, higher performance and more functions, and the corresponding blue wafer quality requirements have also increased. Therefore, the development of high-quality processing technology for sapphire wafers has become a necessary task for current development. Sapphire substrates need to go through a relatively important grinding process during the processing, especially the finished substrates whose final form is a single-polished wafer. The roughness measurement results and appearance performance are needed to judge the processing quality. During the grinding process of the substrate, when the semi-finished wafers in the grinding equipment are taken out after the operation is completed, the existing method is to use air bags to place the grinding wafers into the card box one by one through adsorption. There is a risk of poor product appearance in the process, and only one semi-finished wafer can be taken out in one operation, and the removal efficiency is very low. Therefore, in order to overcome the above-mentioned disadvantages, it is very practical to develop a sapphire wafer taking device and method. Summary of the invention

[0004] The present invention aims to solve the problems that the appearance of the wafers is easily worn when the sapphire wafers are taken out one by one after grinding by using air bags, which easily leads to the problem of poor product appearance and poor taking out efficiency, and thus provides a sapphire wafer grinding device and a grinding method;

[0005] A sapphire wafer fetching device, comprising a fetching plate, a mechanical valve, a plurality of air pipes and a plurality of adsorption unit groups, wherein the mechanical valve is arranged on the top of the fetching plate, and the housing of the mechanical valve is fixedly connected to the fetching plate, a plurality of annular air passages are processed inside the fetching plate, and the plurality of annular air passages are sequentially arranged from the center to the edge of the fetching plate, a venting end of the mechanical valve is connected to the plurality of annular air passages through the plurality of air pipes, and each air pipe is corresponding to an annular air passage, a plurality of adsorption unit groups are installed at the bottom of the fetching plate, each adsorption unit group is corresponding to one or two annular air passages, and the venting end of each adsorption unit group is connected to the corresponding annular air passage;

[0006] Furthermore, the adsorption unit group includes a plurality of adsorption units, and the plurality of adsorption units are arranged in sequence and equidistantly along the contour of the corresponding annular airway, and the ventilation end of each adsorption unit is connected to the corresponding annular airway;

[0007] Furthermore, a plurality of blind holes are processed at the bottom of the sheet fetching plate, each adsorption unit is correspondingly arranged in one blind hole, and the venting end of each adsorption unit passes through the bottom of the blind hole and is connected to the corresponding annular airway;

[0008] Furthermore, the size of the blind hole is set to match the size of the sapphire wafer to be taken;

[0009] Further, each adsorption unit in the adsorption unit group corresponding to an annular air channel includes two suction cups, and the adsorption end of each suction cup is arranged toward the opening end of the receiving blind hole, and the ventilation end of each suction cup passes through the bottom of the receiving blind hole and is connected to the corresponding annular air channel;

[0010] Further, each adsorption unit in the adsorption unit group corresponding to the two annular air passages includes three suction cups, the adsorption end of each suction cup is arranged toward the opening end of the receiving blind hole, and the ventilation end of each suction cup passes through the bottom of the receiving blind hole and is connected to the corresponding annular air passage;

[0011] Furthermore, a grabbing through hole is processed at the center of the top of the sheet taking plate, and a handle is provided in the grabbing through hole, and both ends of the handle are fixedly connected to the hole wall of the grabbing through hole;

[0012] Furthermore, the film taking plate is a circular acrylic plate, the end diameter of the film taking plate is 420-450mm, and the thickness is 10mm;

[0013] A sapphire wafer taking method is implemented by the following steps:

[0014] Step 1: After a single batch of sapphire wafers is finished in the double-sided grinding machine, the grinding upper plate in the double-sided grinding machine is lifted, and the grinding liquid on the sapphire wafers is washed off with a water gun, and the surface of the sapphire wafers to be grabbed is cleaned;

[0015] Step 2: When the mechanical valve in the film taking device is closed, the film taking device is arranged above a planetary wheel in the double-sided grinding machine, and each receiving blind hole is arranged corresponding to a planetary wheel hole in the planetary wheel;

[0016] Step 3: After the position of the wafer picking device is adjusted accurately, place the wafer picking device on the corresponding planetary wheel in the double-sided grinding machine, and ensure that the sapphire wafer in each planetary wheel hole is in contact with the suction cup in the corresponding blind hole;

[0017] Step 4: Control the mechanical valve in the wafer picking device to open, and use air pressure to make all the sapphire wafers adsorbed on the corresponding suction cups. On the premise that the adsorption of the sapphire wafer to be picked up is stable, the wafer picking device is transported to the next target location;

[0018] Step 5: After the wafer picking device is transported to the next target location, the sapphire wafer adsorbed in the wafer picking device is brought into contact with the target bearing surface, and the mechanical valve in the wafer picking device is closed. At this time, the ventilation in the suction cup loses its adsorption effect, and the sapphire wafer is stably placed at the target location;

[0019] Step 6: Repeat steps 2 to 6 until all the ground sapphire wafers in the double-sided grinding machine are transferred to the target location, completing the sapphire wafer retrieval work.

[0020] The beneficial effects of this application compared to the prior art are as follows:

[0021] 1. The present application provides a sapphire wafer picking device and a sapphire wafer picking method, which utilizes the air pressure principle to adsorb and grab the target sapphire wafer, thereby helping to reduce factors causing poor wafer appearance. At the same time, the device has a strong adsorption capacity, and avoids problems such as chip breakage caused by chip falling off during the transfer process.

[0022] 2. The present application provides a sapphire wafer retrieval device and a sapphire wafer retrieval method, which can simultaneously complete the transfer of 12 wafers in a planetary wheel in a double-sided grinding machine, avoid bumps and collisions caused by inserting the wafers into the box in the original way, reduce the risk of edge collapse, and improve product processing yield.

[0023] 3. The sapphire wafer retrieval device and method provided in the present application are more convenient to operate than the traditional retrieval method, and can greatly improve the wafer operation efficiency (the existing airbag can only take out one wafer at a time, while the present application can take out 12 wafers at the same time, which improves the efficiency by nearly 12 times), greatly saves the machine idle period time, and improves the operation rate of the grinding machine. The retrieval device provided in the present application is very simple to operate and has relatively low risk, which is conducive to reducing the training cost of new employees and shortening the training time for new employees from the initial employment to the ability to operate independently. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a top view schematic diagram of the sapphire wafer fetching device described in this application;

[0025] Figure 2 It is a bottom view schematic diagram of the sapphire wafer fetching device described in the present application;

[0026] In the figure, 1 is a sheet taking plate, 11 is an annular air channel, 12 is a blind hole for accommodating, 13 is a grasping through hole, 2 is a mechanical valve, 3 is an air pipe, 4 is a suction cup and 5 is a handle. DETAILED DESCRIPTION

[0027] Specific implementation method 1: Combination Figure 1 to Figure 2 The present embodiment is described. In the present embodiment, a sapphire wafer picking device is provided, and the picking device includes a picking plate 1, a mechanical valve 2, a plurality of air pipes 3 and a plurality of adsorption unit groups. The mechanical valve 2 is arranged on the top of the picking plate 1, and the shell of the mechanical valve 2 is fixedly connected to the picking plate 1. A plurality of annular air channels 11 are processed inside the picking plate 1, and the plurality of annular air channels 11 are sequentially arranged from the center to the edge of the picking plate 1. The ventilation end of the mechanical valve 2 is connected to the plurality of annular air channels through the plurality of air pipes 3, and each air pipe 3 is corresponding to an annular air channel 11. The plurality of adsorption unit groups are installed at the bottom of the picking plate 1, and each adsorption unit group is corresponding to one or two annular air channels, and the ventilation end of each adsorption unit group is connected to the corresponding annular air channel.

[0028] A sapphire wafer picking device provided in this embodiment can control the working status of multiple adsorption unit groups through a mechanical valve 2, and use the air pressure principle to adsorb and grab the target sapphire wafer, which is beneficial to reducing factors causing poor appearance of the wafer; at the same time, the device has a strong adsorption capacity and avoids problems such as chip breakage caused by chip falling off during the transfer process.

[0029] Specific implementation method 2: Combination Figure 1 to Figure 2This embodiment is described. The difference between this embodiment and the first embodiment is that the adsorption unit group includes a plurality of adsorption units, and the plurality of adsorption units are arranged equidistantly along the contour of the corresponding annular airway, and the ventilation end of each adsorption unit is connected to the corresponding annular airway. The other components and connection methods are the same as those of the first embodiment.

[0030] In this embodiment, the adsorption unit is generally arranged corresponding to the wheel hole on each planetary wheel in the double-sided grinder, usually there are 12 adsorption units, and the 12 adsorption units are divided into two groups. The first adsorption unit group includes 9 adsorption units, and the 9 adsorption units are arranged equidistantly along the edge contour of the film-taking plate 1. The second adsorption unit group includes 3 adsorption units, and the 3 adsorption units are arranged equidistantly around the center of the film-taking plate 1. The first adsorption unit group is arranged corresponding to two annular air passages, and the second adsorption unit group is arranged corresponding to one annular air passage.

[0031] Specific implementation method three: Combination Figure 1 to Figure 2 This embodiment is described. The difference between this embodiment and the second embodiment is that a plurality of blind holes 12 are processed at the bottom of the sheet taking plate 1, each adsorption unit is correspondingly arranged in one blind hole 12, and the venting end of each adsorption unit passes through the bottom of the blind hole 12 and is connected to the corresponding annular airway. The other components and connection methods are the same as those of the second embodiment.

[0032] In this embodiment, the design of accommodating the blind hole 12 allows the sapphire wafer to be embedded in the retrieval plate 1 after the wafer picking device adsorbs the sapphire wafer, and the sapphire wafer is wrapped and protected by the retrieval plate 1 to prevent the edge and outer surface of the sapphire wafer from being worn during transportation.

[0033] Specific implementation method four: Combination Figure 1 to Figure 2 This embodiment is described. The difference between this embodiment and the third embodiment is that the size of the blind hole 12 is matched with the size of the sapphire wafer to be taken. The other components and connection methods are the same as those of the third embodiment.

[0034] Specific implementation method five: Combination Figure 1 to Figure 2 This embodiment is described. The difference between this embodiment and the fourth embodiment is that each adsorption unit in the adsorption unit group corresponding to an annular airway includes two suction cups 4, and the adsorption end of each suction cup 4 is arranged toward the opening end of the receiving blind hole 12, and the ventilation end of each suction cup 4 passes through the bottom of the receiving blind hole 12 and is connected to the corresponding annular airway. Other components and connection methods are the same as those of the fourth embodiment.

[0035] Specific implementation method six: Combination Figure 1 to Figure 2This embodiment is described. The difference between this embodiment and the fifth embodiment is that each adsorption unit in the adsorption unit group corresponding to the two annular air passages includes three suction cups 4, the adsorption end of each suction cup 4 is arranged toward the opening end of the receiving blind hole 12, and the ventilation end of each suction cup 4 passes through the bottom of the receiving blind hole 12 and is connected to the corresponding annular air passage. The other components and connection methods are the same as those of the fifth embodiment.

[0036] In combination with the description of specific embodiments five and six, considering that there are more adsorption units in the first adsorption unit group and the corresponding airway stroke of the annular airway 11 is longer, in order to improve the reliability of adsorption, the number of suction cups 4 is increased, and a design of three suction cups adsorbing at the same time is selected, while there are fewer adsorption units in the second adsorption unit group and the corresponding airway stroke of the annular airway 11 is shorter, a design of two suction cups adsorbing at the same time can achieve the adsorption reliability requirements. Therefore, from the perspective of the manufacturing cost of the removal device, different numbers of suction cup structures are used for adsorption units at different positions in order to improve the economic efficiency of the device.

[0037] Specific implementation method seven: Combination Figure 1 to Figure 2 This embodiment is described. The difference between this embodiment and the sixth embodiment is that a grabbing through hole 13 is processed at the top center of the film taking plate 1, and a handle 5 is provided in the grabbing through hole 13. Both ends of the handle 5 are fixedly connected to the hole wall of the grabbing through hole 13. Other components and connection methods are the same as those of the sixth embodiment.

[0038] In this embodiment, the handle 5 is designed to facilitate the taking and transportation of the sheet plate 1 .

[0039] Specific implementation method eight: Combination Figure 1 to Figure 2 This embodiment is different from the seventh embodiment in that the film-taking plate 1 is a circular acrylic plate, the end diameter of the film-taking plate 1 is 420-450mm, and the thickness is 10mm. The other components and connection methods are the same as those of the seventh embodiment.

[0040] Specific implementation method nine: Combination Figure 1 to Figure 2 This embodiment describes a sapphire wafer extraction method, which is implemented by the following steps:

[0041] Step 1: After a single batch of sapphire wafers is finished in the double-sided grinding machine, the grinding upper plate in the double-sided grinding machine is lifted, and the grinding liquid on the sapphire wafers is washed off with a water gun, and the surface of the sapphire wafers to be grabbed is cleaned;

[0042] Step 2: When the mechanical valve 2 in the film taking device is closed, the film taking device is arranged above a planetary wheel in the double-sided grinding machine, and each receiving blind hole 12 is arranged corresponding to a planetary wheel hole in the planetary wheel;

[0043] Step 3: After the position of the wafer taking device is accurately adjusted, the wafer taking device is placed on the corresponding planetary wheel in the double-sided grinding machine, and the sapphire wafer in each planetary wheel hole is ensured to contact with the suction cup 4 in the corresponding blind hole 12;

[0044] Step 4: Control the mechanical valve 2 in the wafer picking device to open, and through the action of air pressure, make all the sapphire wafers adsorbed on the corresponding suction cups 4. On the premise of ensuring that the adsorption of the sapphire wafer to be picked up is stable, transport the wafer picking device to the next target location;

[0045] Step 5: After the wafer picking device is transported to the next target location, the sapphire wafer adsorbed in the wafer picking device is brought into contact with the target bearing surface, and the mechanical valve 2 in the wafer picking device is closed. At this time, the suction cup 4 loses its adsorption effect and the sapphire wafer is stably placed at the target location;

[0046] Step 6: Repeat steps 2 to 6 until all the ground sapphire wafers in the double-sided grinding machine are transferred to the target location, completing the sapphire wafer retrieval work.

[0047] The present invention has been disclosed as above with preferred implementation cases, but it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent implementation cases with equivalent changes by using the above-disclosed structures and technical contents without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above implementation cases based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A sapphire wafer fetching device, characterized in that: The film taking device comprises a film taking plate (1), a mechanical valve (2), a plurality of air pipes (3) and a plurality of adsorption unit groups. The mechanical valve (2) is arranged on the top of the film taking plate (1), and the shell of the mechanical valve (2) is fixedly connected to the film taking plate (1). A plurality of annular air passages (11) are processed inside the film taking plate (1). The plurality of annular air passages (11) are sequentially arranged from the center to the edge of the film taking plate (1). The ventilation end of the mechanical valve (2) is connected to the plurality of annular air passages through the plurality of air pipes (3), and each air pipe (3) is arranged corresponding to one annular air passage (11). The plurality of adsorption unit groups are all installed at the bottom of the film taking plate (1), and each adsorption unit group is arranged corresponding to one or two annular air passages. The ventilation end of each adsorption unit group is connected to the corresponding annular air passage.

2. A sapphire wafer fetching device according to claim 1, characterized in that: The adsorption unit group includes a plurality of adsorption units, which are arranged in sequence and at equal intervals along the contour of the corresponding annular airway, and the ventilation end of each adsorption unit is connected to the corresponding annular airway.

3. A sapphire wafer fetching device according to claim 2, characterized in that: The bottom of the sheet taking plate (1) is processed with a plurality of accommodating blind holes (12), each adsorption unit is correspondingly arranged in a accommodating blind hole (12), and the venting end of each adsorption unit passes through the bottom of the accommodating blind hole (12) and is connected to the corresponding annular airway.

4. The sapphire wafer fetching device according to claim 3, characterized in that: The size of the accommodating blind hole (12) is set in accordance with the size of the sapphire wafer to be taken.

5. A sapphire wafer fetching device according to claim 4, characterized in that: Each adsorption unit in the adsorption unit group arranged corresponding to an annular air channel comprises two suction cups (4), and the adsorption end of each suction cup (4) is arranged toward the opening end of the receiving blind hole (12), and the ventilation end of each suction cup (4) passes through the bottom of the receiving blind hole (12) and is connected to the corresponding annular air channel.

6. A sapphire wafer fetching device according to claim 5, characterized in that: Each adsorption unit in the adsorption unit group arranged corresponding to the two annular air passages comprises three suction cups (4), the adsorption end of each suction cup (4) is arranged toward the opening end of the receiving blind hole (12), and the ventilation end of each suction cup (4) passes through the bottom of the receiving blind hole (12) and is connected to the corresponding annular air passage.

7. A sapphire wafer fetching device according to claim 5 or 6, characterized in that: A grabbing through hole (13) is processed at the center of the top of the film taking plate (1), and a handle (5) is arranged in the grabbing through hole (13), and both ends of the handle (5) are fixedly connected to the hole wall of the grabbing through hole (13).

8. The sapphire wafer fetching device according to claim 7, characterized in that: The film taking plate (1) is a circular acrylic plate, the end diameter of the film taking plate (1) is 420-450 mm, and the thickness is 10 mm.

9. A sapphire wafer taking method implemented based on any one of the sapphire wafer taking devices of claim 1 to claim 8, characterized in that: The film taking method is achieved by the following steps: Step 1: After a single batch of sapphire wafers is finished in the double-sided grinding machine, the grinding upper plate in the double-sided grinding machine is lifted, and the grinding liquid on the sapphire wafers is washed off with a water gun, and the surface of the sapphire wafers to be grabbed is cleaned; Step 2: When the mechanical valve (2) in the film taking device is closed, the film taking device is arranged above a planetary wheel in the double-sided grinding machine, and each receiving blind hole (12) is arranged corresponding to a planetary wheel hole in the planetary wheel; Step 3: After the position of the wafer taking device is accurately adjusted, the wafer taking device is placed on the corresponding planetary wheel in the double-sided grinding machine, and the sapphire wafer in each planetary wheel hole is ensured to be in contact with the suction cup (4) in the corresponding blind hole (12); Step 4: Control the mechanical valve (2) in the wafer picking device to open, and through the action of air pressure, make all the sapphire wafers adsorbed on the corresponding suction cups (4). On the premise that the adsorption of the sapphire wafer to be picked up is stable, the wafer picking device is transported to the next target location; Step 5: After the wafer picking device is transported to the next target location, the sapphire wafer adsorbed in the wafer picking device is brought into contact with the target bearing surface, and the mechanical valve (2) in the wafer picking device is closed. At this time, the ventilation in the suction cup (4) loses its adsorption effect, and the sapphire wafer is stably placed at the target location; Step 6: Repeat steps 2 to 6 until all the ground sapphire wafers in the double-sided grinding machine are transferred to the target location, completing the sapphire wafer retrieval work.

Images