High parallel optical transmission link communication system and method for digital image

Abstract

The invention provides a high parallel optical transmission system and method for digital images. An image acquisition parallel conversion module is used for acquiring an original image signal through an image sensor, and converting the original image signal into a multi-channel electric signal; the electro-optical array conversion module is used for modulating a multi-type LED array through a multi-channel electric signal and converting the multi-channel electric signal into an array optical signal through electro-optical conversion; the optical signal passive transmission module transmits the array optical signal to the photoelectric detection diode array through optical signal passive transmission; and the photoelectric detection signal processing module is used for converting and restoring the array optical signal into a restored electric signal through a photoelectric detection diode array, and carrying out signal processing on the restored electric signal through a signal processing system.

Description

Technical Field

[0001] The present invention relates to the field of photoelectric conversion precision detection image transmission communication technology, and more specifically, to a high-parallel optical transmission system and method for digital images. Background Art

[0002] In the common short-distance image transmission, especially the short-distance electronic image transmission within 10 meters, the image collected by the image sensor is transmitted to the image processing unit for processing via SerDes (SERializer / DESerializer), MIPI, LVDS, DVP and other high-speed transmissions, that is, the collected image signal is converted into a serial signal at the sending end by multiple parallel signals, and transmitted through active media such as metal cables. The electrical signal decays according to Ohm's law, and only when there is enough voltage signal at both ends of the cable can it be effectively transmitted. At the receiving end, the serial signal is converted back into a parallel signal and then handed over to the image processing unit for processing. This process requires the signal to be converted into a serial signal for transmission, which reduces the speed and throughput of the transmitted data. At the same time, the transmission process is active transmission, which increases the power consumption and volume of the entire system, and is prone to delay and rate bottlenecks. Electrical signals are easily interfered during transmission, especially in complex electromagnetic environments, where the signal transmission effect is poor and noise is easily generated. Light wave transmission is passive transmission, which is basically lossless in short-distance transmission and is not affected by electromagnetic and temperature interference.

[0003] In the published patent CN114503001A (Avicena Co.), it is mentioned that multimode optical fiber is used for communication to increase the signal transmission amount per unit time, wherein the collected electrical signal drives multiple types of LEDs to convert the electrical signal into an optical signal, which is transmitted in the above optical fiber; in the published patent WO2023034298A1 (Ciena Co.) and the published patent WO2023069944A1 (Avicena Co.) mentioned that multiple types of LEDs are used as light sources for communication in short-distance (10 meters) communications; however, in the above-mentioned patents (CN114503001A, WO2023034298A1, WO2023069944A1), a duplex link (i.e., a transmitter and a receiver exist on one side at the same time) is used for communication, and the devices used at both ends of the transmission and reception are the same, and the number of devices at both ends of the transmission and reception is the same; none of the above-mentioned patents mention that the transmitted signal is the original signal of the collected electronic image, and the functions of image collection, conversion and optical signal sending cannot be realized at the transmitting end, and the image signal cannot be processed at the receiving end, nor can many-to-one (i.e., multiple transmitting ends correspond to one receiving end) transmission be realized. The above-mentioned technical problems remain to be solved; therefore, it is necessary to propose a high-parallel optical transmission link communication system and method for digital images to at least partially solve the problems existing in the prior art. Summary of the invention

[0004] A series of simplified concepts are introduced in the content of the invention, which will be further described in detail in the specific implementation method section; the content of the invention of the present invention does not mean to attempt to limit the key features and essential technical features of the technical solution claimed for protection, nor does it mean to attempt to determine the scope of protection of the technical solution claimed for protection.

[0005] To at least partially solve the above problems, the present invention provides a high-parallel optical transmission link communication system for digital images, comprising:

[0006] An image acquisition parallel conversion module acquires original image signals through an image sensor and converts the original image signals into multi-channel electrical signals;

[0007] An electro-optical array conversion module modulates a multi-type LED array through a multi-channel electrical signal and converts the multi-channel electrical signal into an array optical signal through electro-optical conversion;

[0008] An optical signal passive transmission module transmits the array optical signal to the photodetection diode array through the optical signal passive transmission;

[0009] The photoelectric detection signal processing module converts the array optical signal into a restored electrical signal through a photoelectric detection diode array, and performs signal processing on the restored electrical signal through a signal processing chip.

[0010] Preferably, the image acquisition parallel conversion module includes:

[0011] The electronic image acquisition sensor unit acquires the original image signal through the electronic image acquisition sensor group;

[0012] A multi-channel signal conversion unit, using a multi-channel signal conversion group, converts the original image signal into a multi-channel electrical signal;

[0013] The electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: an LVDS signal, a MIPI signal, a USB signal, an EtherMAC signal, an SPI signal and a SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN signal, a USB signal and an EtherMAC signal; the CMOS image sensor includes: an on-chip microlens, a color filter, a photosensitive diode and a silicon-based logic control circuit; the silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED array drive control circuit; the multi-type LED modulation and drive control circuit setting includes: the multi-type LED modulation and drive control circuit is set on the intermediate layer, and the multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

[0014] Preferably, the electro-optical array conversion module comprises:

[0015] The electric signal array drive conversion unit converts the multi-channel electric signal into a multi-type LED array modulation signal through a signal drive conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; the wavelength range of the emission light of the multi-type LED array is 390nm-2000nm;

[0016] LED light source modulation unit, controlling multi-type LED light source modulation signals according to multi-type LED array modulation signals;

[0017] The multi-type LED light source array unit controls the multi-type LED light source array to emit light according to the multi-type LED light source modulation signal, and converts the multi-channel electrical signal into an array light signal.

[0018] Preferably, the optical signal passive transmission module comprises:

[0019] The optical waveguide transmission unit performs waveguide passive transmission of optical signals through multiple combined optical waveguides;

[0020] A free-space optical transmission unit performs free-space passive transmission of optical signals through obstacle-monitoring spatial pathways;

[0021] The multiple combinations of optical waveguides include: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides.

[0022] Preferably, the photoelectric detection signal processing module includes:

[0023] Reduction and combination of photoelectric detection units, constructing a photoelectric detection diode array through reduction and combination; converting the array optical signal into a reduction electrical signal through the photoelectric detection diode array;

[0024] A chip processing unit performs signal processing on the restored electrical signal through a signal processing chip;

[0025] The photodetection diode array detects wavelengths in the range of 390nm-2000nm;

[0026] The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photodetection diode array is a silicon-based photodetection diode array.

[0027] The present invention provides a high-parallel optical transmission link communication method for digital images, comprising:

[0028] S100, collecting original image signals through an image sensor and converting the original image signals into multi-channel electrical signals;

[0029] S200, modulating a multi-type LED array by a multi-channel electrical signal, and converting the multi-channel electrical signal into an array optical signal by electro-optical conversion;

[0030] S300, transmitting the array optical signal to the photodetection diode array by passive transmission of the optical signal;

[0031] S400, converting the array optical signal into a restored electrical signal through a photodetection diode array, and performing signal processing on the restored electrical signal through a signal processing chip.

[0032] Preferably, S100 includes:

[0033] S101, collecting original image signals through an electronic image collection sensor group;

[0034] S102, using a multi-channel signal conversion group to convert the original image signal into a multi-channel electrical signal;

[0035] The electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: an LVDS signal, a MIPI signal, a USB signal, an EtherMAC signal, an SPI signal and a SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN signal, a USB signal and an EtherMAC signal; the CMOS image sensor includes: an on-chip microlens, a color filter, a photosensitive diode and a silicon-based logic control circuit; the silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED array drive control circuit; the multi-type LED modulation and drive control circuit setting includes: the multi-type LED modulation and drive control circuit is set on the intermediate layer, and the multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

[0036] Preferably, S200 includes:

[0037] S201, converting the multi-channel electrical signal into a multi-type LED array modulation signal through a signal driving conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; the wavelength range of the emission light of the multi-type LED array is 390nm-2000nm;

[0038] S202, controlling modulation signals of multiple types of LED light sources according to modulation signals of multiple types of LED arrays;

[0039] S203, controlling the multi-type LED light source array to emit light according to the multi-type LED light source modulation signal, and converting the multi-channel electrical signal into an array light signal;

[0040] Preferably, S300 includes:

[0041] S301, performing waveguide passive transmission of optical signals through multiple combined optical waveguides;

[0042] S302, performing free space passive transmission of optical signals through an obstacle monitoring space path;

[0043] The multiple combinations of optical waveguides include: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides.

[0044] Preferably, S400 includes:

[0045] S401, constructing a photodetection diode array through reduction combination; converting the array optical signal into a reduction electrical signal through the photodetection diode array;

[0046] S402, performing signal processing on the restored electrical signal by using a signal processing chip;

[0047] The photodetection diode array detects wavelengths in the range of 390nm-2000nm;

[0048] The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photodetection diode array is a silicon-based photodetection diode array.

[0049] The beneficial effects of the above technical solution include:

[0050] The present invention provides a high-parallel optical transmission system and method for digital images, which uses an image acquisition parallel conversion module to acquire original image signals through an image sensor and convert the original image signals into multi-channel electrical signals; an electro-optical array conversion module modulates a multi-type LED array through a multi-channel electrical signal and converts the multi-channel electrical signals into array optical signals through electro-optical conversion; an optical signal passive transmission module transmits the array optical signals to a photoelectric detection diode array through passive optical signal transmission; a photoelectric detection signal processing module converts the array optical signals into electrical signals through a photoelectric detection diode array, and performs signal processing on the restored electrical signals through a signal processing system; the present invention mainly realizes the acquisition of electronic images and simultaneously completes the short-distance high-speed parallel transmission of image digital signals; single-link communication is performed through an optical waveguide or free space, and optical transmission can reduce the loss in signal transmission, and the signal is not interfered in a complex electromagnetic environment; serial electrical signals do not need to be converted into parallel signals, which reduces the power consumption, area and delay of the chip. This embodiment is applicable to a vehicle image acquisition and optical transmission system; it includes: an image acquisition module composed of various vehicle-mounted cameras, which is used to acquire various image signals and convert the image signals acquired by each camera into a set of digital signals; an electro-optical conversion module, which uses the image signal to drive a multi-type LED array to convert the parallel image signals into parallel optical signals; a transmission module, which uses plastic imaging optical fibers, and each multi-type LED in the multi-type LED array corresponds to an optical fiber, and each optical fiber transmits one channel of image data; a detection module, which is composed of a photodetection diode array, which is used to convert the optical signal into an electrical signal; all image signals are finally transmitted to the chip of the vehicle including the vehicle So C chip, and subsequent work such as image processing is performed; specifically, the automobile image acquisition and optical transmission system in the embodiment refers to an information transmission method that uses a CMOS image sensor for image acquisition and uses visible light emitted by multiple types of LEDs as a communication method; wherein, the CMOS image sensor includes but is not limited to the front view, rear view, surround view, side view and interior image sensors commonly used in automobiles; the multiple types of LED arrays use gallium nitride, indium gallium nitride, aluminum gallium nitride, and gallium phosphide as visible light sources, and the parallel image signals collected by each camera regulate the multiple types of LED light source arrays; the image signal uses optical fiber communication with high speed, and multiple images are transmitted to the bus in parallel, with low latency and significant effect.

[0051] The present invention provides a high-parallel optical transmission link communication system and method for digital images. Other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by technicians in this field through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0053] Figure 1 This is a diagram showing an embodiment of a high-parallel optical transmission link communication system and method for digital images of the present invention.

[0054] Figure 2 This is a diagram of an embodiment of a multi-type LED light-emitting array and a control circuit of a high-parallel optical transmission link communication system for digital images of the present invention.

[0055] Figure 3 This is a diagram of a many-to-one transmission implementation example of a high-parallel optical transmission link communication system and method for digital images of the present invention.

[0056] Figure 4 This is a transmission process implementation diagram of a high-parallel optical transmission link communication system and method for digital images of the present invention.

[0057] Figure 5 This is a diagram of an embodiment of a high-parallel optical transmission link communication system and method for digital images of the present invention for vehicle-mounted application.

[0058] Figure 6 This is another embodiment diagram of a high-parallel optical transmission link communication system and method for digital images of the present invention. DETAILED DESCRIPTION

[0059] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the instructions. As shown in the drawings, the present invention provides a high-parallel optical transmission link communication system for digital images, including:

[0060] An image acquisition parallel conversion module acquires original image signals through an image sensor and converts the original image signals into multi-channel electrical signals;

[0061] An electro-optical array conversion module modulates a multi-type LED array through a multi-channel electrical signal and converts the multi-channel electrical signal into an array optical signal through electro-optical conversion;

[0062] An optical signal passive transmission module transmits the array optical signal to the photodetection diode array through the optical signal passive transmission;

[0063] The photoelectric detection signal processing module converts the array optical signal into a restored electrical signal through the photoelectric detection diode array, and performs signal processing on the restored electrical signal through the signal processing chip;

[0064] The present embodiment is applicable to a vehicle image acquisition and optical transmission system; it includes: an image acquisition module composed of various vehicle-mounted cameras, which is used to acquire various image signals and convert the image signals acquired by each camera into a group of digital signals; an electro-optical conversion module, which uses image signals to drive a multi-type LED array to convert parallel image signals into parallel optical signals; a transmission module, which uses plastic imaging optical fibers, and each multi-type LED in the multi-type LED array corresponds to an optical fiber, and each optical fiber transmits one channel of image data; a detection module, which is composed of a photodetection diode array, which is used to convert optical signals into electrical signals; all image signals are finally transmitted to the main control processing system of the vehicle for subsequent work such as image processing; specifically, the vehicle image acquisition and optical transmission system in the embodiment refers to an information transmission method that uses CMOS image sensors for image acquisition and uses visible light emitted by multi-type LEDs as a communication method; wherein the CMOS image sensors include but are not limited to the image sensors commonly used in vehicles for front view, rear view, surround view, side view and vehicle interior; the multi-type LED array uses gallium nitride, indium gallium nitride, aluminum gallium nitride, and gallium phosphide as visible light sources, and the parallel image signals acquired by each camera regulate the multi-type LED light source array.

[0065] The principle and effect of the above technical solution are as follows: the present invention provides a high-parallel optical transmission link communication system for digital images, including: an image acquisition parallel conversion module, which acquires original image signals through image sensors and converts the original image signals into multi-channel electrical signals; an electro-optical array conversion module, which modulates multi-type LED arrays through multi-channel electrical signals and converts the multi-channel electrical signals into array optical signals through electro-optical conversion; an optical signal passive transmission module, which transmits the array optical signals to the photodetection diode array through passive optical signal transmission; a photodetection signal processing module, which converts the array optical signals into restored electrical signals through the photodetection diode array, and performs signal processing on the restored electrical signals through the signal processing chip; the present invention mainly realizes the acquisition of electronic images and completes the short-distance high-speed parallel transmission of the original image signals at the same time; single-link communication is performed through optical waveguides or free space, and optical transmission can reduce the loss in signal transmission, and the signal is not interfered in complex electromagnetic environments; this embodiment is suitable for vehicle image acquisition and optical transmission systems; it includes: an image acquisition module composed of various vehicle-mounted cameras, which is used to acquire various image signals and converts the image signals acquired by each camera into a group of digital signal; an electro-optical conversion module, which uses an image signal to drive a multi-type LED array to convert parallel image signals into parallel optical signals; a transmission module, which uses a plastic imaging optical fiber, and each multi-type LED in the multi-type LED array corresponds to an optical fiber, and each optical fiber transmits one channel of image data; a detection module, which is composed of a photodetection diode array and is used to convert optical signals into electrical signals; all image signals are ultimately transmitted to the car's chip, including the car SoC chip, for subsequent work such as image processing; specifically, the car image acquisition and optical transmission system in the embodiment refers to an information transmission method that uses a CMOS image sensor for image acquisition and uses visible light emitted by multi-type LEDs as a communication method; wherein the CMOS image sensor includes but is not limited to the image sensors commonly used in cars for front view, rear view, surround view, side view and interior of the car; the multi-type LED array uses gallium nitride, indium gallium nitride, aluminum gallium nitride, and gallium phosphide as visible light sources, and the parallel image signals collected by each camera regulate the multi-type LED light source array; the image signal uses optical fiber communication at a fast speed, and multiple images are transmitted to the bus in parallel with low latency; such as Figure 1 As shown, (a) is a silicon-based logic control circuit and a multi-type LED structure diagram; (b) is a silicon-based logic control circuit and a multi-type LED control circuit structure diagram; Figure 2 This is a diagram of an embodiment of a multi-type LED light emitting array and a control circuit of a high parallel optical transmission link communication system for digital images of the present invention; Figure 2 As shown, the present invention is a control array in a high-parallel optical transmission link communication system for digital images; Figure 3As shown, the present invention is a digital image high parallel optical transmission link communication system optical waveguide many-to-one combined transmission embodiment; as Figure 4 As shown, a high-parallel optical transmission link communication system and method transmission process embodiment of a digital image of the present invention; as Figure 5 As shown, in a vehicle-mounted application embodiment of a high-parallel optical transmission link communication system and method for digital images of the present invention, images of multiple groups of cameras are formed into multiple groups of optical signals through Micro-LEDs, which are transmitted to photodiodes for reception through image data transmission optical waveguides, and image processing is performed through a car SoC chip; Figure 6 As shown, another embodiment of a high-parallel optical transmission link communication system for digital images of the present invention includes a Color filter array and a silicon-based logic control circuit integrated Micro-LED embodiment.

[0066] In one embodiment, the image acquisition parallel conversion module includes:

[0067] The electronic image acquisition sensor unit acquires the original image signal through the electronic image acquisition sensor group;

[0068] A multi-channel signal conversion unit, using a multi-channel signal conversion group, converts the original image signal into a multi-channel electrical signal;

[0069] The electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: an LVDS signal, a MIPI signal, a USB signal, an EtherMAC signal, an SPI signal and a SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN signal, a USB signal and an EtherMAC signal; the CMOS image sensor includes: an on-chip microlens, a color filter, a photosensitive diode and a silicon-based logic control circuit; the silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED array drive control circuit; the multi-type LED modulation and drive control circuit setting includes: the multi-type LED modulation and drive control circuit is set on the intermediate layer, and the multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

[0070] The principle and effect of the above technical solution are as follows: the image acquisition parallel conversion module includes: an electronic image acquisition sensor unit, which acquires the original image signal through the electronic image acquisition sensor group; a multi-channel signal conversion unit, which uses a multi-channel signal conversion group to convert the original image signal into a multi-channel electrical signal; the electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: an LVDS signal, a MIPI signal, a USB signal, an EtherMAC signal, an SPI signal and a SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN signal, a USB signal and an EtherMAC signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal signal, data enable signal and data flag signal; serial digital image signals include: LVDS signal, MIPI signal, USB signal, EtherMAC signal, SPI signal and SerDes signal; interface signals include: serial bus I2C signal, UART signal, SIO signal, SSP / SPI signal, CAN signal, USB signal and EtherMAC signal; CMOS image sensor includes: on-chip microlens, color filter, photosensitive diode and silicon-based logic control circuit; silicon-based logic control circuit includes: image sensor control circuit and multi-type LED array drive control circuit; multi-type LED modulation and drive control circuit setting includes: multi-type LED modulation and drive control circuit is set on the intermediate layer, and multi-type LED modulation and drive control circuit is integrated in silicon-based logic control circuit; silicon-based logic control circuit includes: image sensor control circuit and multi-type LED array drive control circuit; multi-type LED modulation and drive control circuit setting includes: multi-type LED modulation and drive control circuit is set on the intermediate layer, and multi-type LED modulation and drive control circuit is integrated in silicon-based logic control circuit.

[0071] In one embodiment, the electro-optical array conversion module comprises:

[0072] The electric signal array drive conversion unit converts the multi-channel electric signal into a multi-type LED array modulation signal through a signal drive conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; the wavelength range of the emission light of the multi-type LED array is 390nm-2000nm;

[0073] LED light source modulation unit, controlling multi-type LED light source modulation signals according to multi-type LED array modulation signals;

[0074] The multi-type LED light source array unit controls the multi-type LED light source array to emit light according to the multi-type LED light source modulation signal, and converts the multi-channel electrical signal into an array light signal.

[0075] The principle and effect of the above technical solution are as follows: the electro-optical array conversion module includes: an electrical signal array drive conversion unit, which converts the multi-channel electrical signal into a multi-type LED array modulation signal through a signal drive conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; the wavelength range of the light emitted by the multi-type LED array is 390nm-2000nm; the LED light source modulation unit controls the multi-type LED light source modulation signal according to the multi-type LED array modulation signal; the multi-type LED light source array unit controls the multi-type LED light source array to emit light according to the multi-type LED light source modulation signal, and converts the multi-channel electrical signal into The invention relates to an array optical signal; the sizes of multiple types of LEDs include: 1μm×1μm to 1000μm×1000μm; the number of multiple types of LEDs in the micro light emitting diode array light source includes: 1-100000; the signal drive conversion circuit includes: an active matrix drive circuit; the drive voltage of the signal drive conversion circuit includes: 0.5V-12V; the image acquisition parallel conversion module and the electro-optical array conversion module are integrated on the same intermediate layer, and the image acquisition parallel conversion module and the electro-optical array conversion module are respectively located on both sides of the intermediate layer; the multiple types of LEDs and the signal drive conversion circuit on both sides are connected through metal paths in the intermediate layer; the signal drive conversion circuit and the control circuit also include an integrated silicon-based logic circuit.

[0076] In one embodiment, the optical signal passive transmission module includes:

[0077] The optical waveguide transmission unit performs waveguide passive transmission of optical signals through multiple combined optical waveguides;

[0078] A free-space optical transmission unit performs free-space passive transmission of optical signals through obstacle-monitoring spatial pathways;

[0079] The multiple combinations of optical waveguides include: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides.

[0080] The principle and effect of the above technical solution are: the optical signal passive transmission module includes: an optical waveguide transmission unit, which performs optical signal waveguide passive transmission through a multi-combination optical waveguide; or adopts a free space optical transmission unit, which performs optical signal free space passive transmission through an obstacle monitoring space path; the array optical signal is transmitted to the photoelectric detection diode array; the multi-combination optical waveguide includes: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides; the obstacle monitoring space path includes: a free space obstacle detection group, a light focusing group, an obstacle bypass group and a focusing bypass control group; the free space obstacle detection group detects whether there is an optical path obstacle in the free space and obtains free space obstacle detection information; according to the free space obstacle detection information, the focusing bypass control group controls the light focusing group to convert the focus point to the obstacle bypass group; the obstacle bypass group bypasses the optical path obstacle by refracting and reflecting the light signal, and transmits the array optical signal to the photoelectric detection diode array.

[0081] In one embodiment, the photoelectric detection signal processing module includes:

[0082] Reduction and combination of photoelectric detection units, constructing a photoelectric detection diode array through reduction and combination; converting the array optical signal into a reduction electrical signal through the photoelectric detection diode array;

[0083] A chip processing unit performs signal processing on the restored electrical signal through a signal processing chip;

[0084] The photodetection diode array detects wavelengths in the range of 390nm-2000nm;

[0085] The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photodetection diode array is a silicon-based photodetection diode array.

[0086] The principle and effect of the above technical solution are: a photoelectric detection signal processing module, including: a reduction combination photoelectric detection unit, which constructs a photoelectric detection diode array through reduction combination; converts the array optical signal into a reduced electrical signal through the photoelectric detection diode array; a chip processing unit, which performs signal processing on the reduced electrical signal through a signal processing chip; the detection wavelength range of the photoelectric detection diode array is 390nm-2000nm; the reduction combination construction of the photoelectric detection diode array includes: when the multi-combination optical waveguide is a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguide is a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photoelectric detection diode array is a silicon-based photoelectric detection diode array; it can reduce the loss in signal transmission, and the signal is not interfered with in a complex electromagnetic environment.

[0087] The present invention provides a high-parallel optical transmission link communication method for digital images, comprising:

[0088] S100, collecting original image signals through an image sensor and converting the original image signals into multi-channel electrical signals;

[0089] S200, modulating a multi-type LED array by a multi-channel electrical signal, and converting the multi-channel electrical signal into an array optical signal by electro-optical conversion;

[0090] S300, transmitting the array optical signal to the photodetection diode array by passive transmission of the optical signal;

[0091] S400, converting the array optical signal into a restored electrical signal through a photodetection diode array, and performing signal processing on the restored electrical signal through a signal processing chip;

[0092] The present embodiment is applicable to a method for image acquisition and optical transmission for vehicles; the vehicle image acquisition and optical transmission system in the embodiment refers to an information transmission method that uses a CMOS image sensor for image acquisition and uses visible light emitted by multiple types of LEDs as a communication method; it includes: an image acquisition module composed of various vehicle-mounted cameras, which is used to acquire various image signals and convert the image signals acquired by each camera into a group of digital signals; an electro-optical conversion module, which uses image signals to drive a multiple type LED array to convert parallel image signals into parallel optical signals; a transmission module, which uses plastic imaging optical fibers, and each multiple type LED in the multiple type LED array corresponds to an optical fiber, and each optical fiber transmits one channel of image data; a detection module, which is composed of a photodetection diode array, which is used to convert optical signals into electrical signals; the signals of all images are finally transmitted to the chip of the vehicle, including the vehicle SoC chip, for subsequent work such as image processing; wherein the CMOS image sensor includes but is not limited to the image sensors commonly used in vehicles for front view, rear view, surround view, side view and vehicle interior; the multiple type LED array uses gallium nitride, indium gallium nitride, aluminum gallium nitride, and gallium phosphide as visible light sources, and the parallel image signals acquired by each camera regulate the multiple type LED light source array.

[0093] The principle and effect of the above technical solution are as follows: the present invention provides a high-parallel optical transmission link communication method for digital images, comprising: collecting original image signals through an image sensor, converting the original image signals into multi-channel electrical signals; modulating a multi-type LED array through the multi-channel electrical signals, converting the multi-channel electrical signals into array optical signals through electro-optical conversion; transmitting the array optical signals to a photodetection diode array through passive transmission of optical signals; converting the array optical signals into restored electrical signals through the photodetection diode array, and performing signal processing on the restored electrical signals through a signal processing chip;

[0094] This embodiment is applicable to a vehicle image acquisition and light transmission method; the vehicle image acquisition and light transmission system in the embodiment refers to an information transmission method that uses a CMOS image sensor for image acquisition and uses visible light emitted by multiple types of LEDs as a communication method; it includes: an image acquisition module composed of various vehicle-mounted cameras, which is used to acquire various image signals and convert the image signal acquired by each camera into a set of digital signals; an electro-optical conversion module, which uses the image signal to drive the multiple types of LED arrays to convert the parallel image signals into parallel light signals; a transmission module, which uses plastic imaging optical fibers, and each of the multiple types of LEDs in the multiple types of LED arrays corresponds to one optical fiber. , each optical fiber transmits one channel of image data; the detection module, which is composed of a photodetection diode array, is used to convert optical signals into electrical signals; all image signals are ultimately transmitted to the car's chips, including the car's SoC chip, for subsequent work such as image processing; among them, CMOS image sensors include but are not limited to the front-view, rear-view, surround-view, side-view and interior image sensors commonly used in cars; multiple types of LED arrays use gallium nitride, indium gallium nitride, aluminum gallium nitride, and gallium phosphide as visible light sources, and the parallel image signals collected by each camera regulate the multiple types of LED light source arrays; the image signal uses optical fiber communication at a fast speed, and multiple images are transmitted to the bus in parallel with low latency.

[0095] In one embodiment, S100 includes:

[0096] S101, collecting original image signals through an electronic image collection sensor group;

[0097] S102, using a multi-channel signal conversion group to convert the original image signal into a multi-channel electrical signal;

[0098] The electronic image acquisition sensor group includes: CMOS image sensor or CCD image sensor or organic image sensor or quantum dot image sensor or infrared image sensor; the multi-channel electrical signal includes: parallel digital image signal, serial digital image signal and interface signal; the parallel digital image signal includes: frame synchronization signal, line synchronization signal, clock signal, image data signal, data enable signal and data flag signal; the serial digital image signal includes: LVDS signal, MIPI signal, USB signal, EtherMAC signal, SPI signal and SerDes signal; the interface signal includes: serial bus I2C signal, UART signal, SIO signal, SSP / SPI signal, CAN signal, USB signal and EtherMAC signal; the CMOS image sensor includes: on-chip microlens, color filter, photosensitive diode and silicon-based logic control circuit; such as Figure 1As shown, a multi-type LED control circuit; the silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED array drive control circuit; the multi-type LED modulation and drive control circuit setting includes: the multi-type LED modulation and drive control circuit is set on the intermediate layer, and the multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

[0099] The principle and effect of the above technical solution are: the original image signal is collected by the electronic image acquisition sensor group; the original image signal is converted into a multi-channel electrical signal by a multi-channel signal conversion group; the electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: LVDS signal, MIPI signal, USB signal, EtherMAC signal, SPI signal and SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN ... / SPI signal, a CAN / SPI signal SB signal and EtherMAC signal; parallel digital image signals include: frame synchronization signal, line synchronization signal, clock signal, image data signal, data enable signal and data flag signal; serial digital image signals include: LVDS signal, MIPI signal and SerDes signal; interface signals include: serial bus I2C signal, UART signal, SIO signal, SSP / SPI signal, CAN signal, USB signal and EtherMAC signal; CMOS image sensor includes: on-chip microlens, color filter, photosensitive diode and silicon-based logic control circuit; silicon-based logic control circuit includes: image sensor control circuit and multi-type LED array drive control circuit; multi-type LED modulation and drive control circuit setting includes: multi-type LED modulation and drive control circuit is set on the intermediate layer, and multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

[0100] In one embodiment, S200 includes:

[0101] S201, converting the multi-channel electrical signal into a multi-type LED array modulation signal through a signal driving conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; the wavelength range of the emission light of the multi-type LED array is 390nm-2000nm;

[0102] S202, controlling modulation signals of multiple types of LED light sources according to modulation signals of multiple types of LED arrays;

[0103] S203, controlling the multi-type LED light source array to emit light according to the multi-type LED light source modulation signal, and converting the multi-channel electrical signal into an array light signal.

[0104] The principle and effect of the above technical solution are: through the signal driving conversion circuit, the multi-channel electrical signal is converted into a multi-type LED array modulation signal; the multi-type LED array includes: Micro-LED array, mini-LED array or general LED array; the wavelength range of the light emitted by the multi-type LED array is 390nm-2000nm; according to the multi-type LED array modulation signal, the multi-type LED light source modulation signal is controlled; according to the multi-type LED light source modulation signal, the multi-type LED light source array is controlled to emit light and the multi-channel electrical signal is converted into an array light signal; the multi-type LED size includes: 1μm×1μ m to 1000μm×1000μm; the number of multiple types of LEDs in the micro light emitting diode array light source includes: 1-100000; the signal drive conversion circuit includes: an active matrix drive circuit; the driving voltage of the signal drive conversion circuit includes: 0.5V-12V; the image acquisition parallel conversion module and the electro-optical array conversion module are integrated on the same intermediate layer, and the image acquisition parallel conversion module and the electro-optical array conversion module are respectively located on both sides of the intermediate layer; the multiple types of LEDs and the signal drive conversion circuit on both sides are connected through metal paths in the intermediate layer; the signal drive conversion circuit and the control circuit also include an integrated silicon-based logic circuit.

[0105] In one embodiment, S300 includes:

[0106] S301, performing waveguide passive transmission of optical signals through multiple combined optical waveguides;

[0107] S302, performing free space passive transmission of optical signals through an obstacle monitoring space path;

[0108] The multiple combinations of optical waveguides include: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides.

[0109] The principle and effect of the above technical solution are: through a multi-combination optical waveguide, passive transmission of optical signals is performed in waveguide; or through an obstacle monitoring space path, passive transmission of optical signals in free space is performed; the array optical signal is transmitted to the photoelectric detection diode array; the multi-combination optical waveguide includes: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides; the obstacle monitoring space path includes: a free space obstacle detection group, a light focusing group, an obstacle bypass group and a focusing bypass control group; the free space obstacle detection group detects whether there is an obstacle in the optical path in the free space, and obtains free space obstacle detection information; according to the free space obstacle detection information, the focusing bypass control group controls the light focusing group to convert the focus point to the obstacle bypass group; the obstacle bypass group bypasses the optical path obstacle by refracting and reflecting the light signal, and transmits the array optical signal to the photoelectric detection diode array.

[0110] In one embodiment, S400 includes:

[0111] S401, constructing a photodetection diode array through reduction combination; converting the array optical signal into a reduction electrical signal through the photodetection diode array;

[0112] S402, performing signal processing on the restored electrical signal by using a signal processing chip;

[0113] The photodetection diode array detects wavelengths in the range of 390nm-2000nm;

[0114] The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photodetection diode array is a silicon-based photodetection diode array.

[0115] The principle and effect of the above technical solution are: constructing a photodetection diode array through reduction combination; converting the array optical signal into a reduced electrical signal through the photodetection diode array; performing signal processing on the reduced electrical signal through the signal processing chip; the detection wavelength range of the photodetection diode array is 390nm-2000nm;

[0116] The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photodetection diode array is a silicon-based photodetection diode array; the loss in signal transmission can be reduced, and the signal is not interfered with in a complex electromagnetic environment.

[0117] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A high-parallel optical transmission link communication system for digital images, characterized in that: include: An image acquisition parallel conversion module acquires original image signals through an image sensor and converts the original image signals into multi-channel electrical signals; An electro-optical array conversion module modulates a multi-type LED array through a multi-channel electrical signal and converts the multi-channel electrical signal into an array multi-channel optical signal through electro-optical conversion; An optical signal passive transmission module transmits the array optical signal to the photodetection diode array through the optical signal passive transmission; The photoelectric detection signal processing module converts the array optical signal into an electrical signal through a photoelectric detection diode array, and performs signal processing on the restored electrical signal through a signal processing system.

2. A high-parallel optical transmission link communication system for digital images according to claim 1, characterized in that: Image acquisition parallel conversion module, including: The electronic image acquisition sensor unit acquires the original image signal through the electronic image acquisition sensor group; A multi-channel signal conversion unit, using a multi-channel signal conversion group, converts the original image signal into a multi-channel electrical signal; The electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: an LVDS signal, a MIPI signal, a USB signal, an EtherMAC signal, an SPI signal and a SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN signal, a USB signal and an EtherMAC signal; the CMOS image sensor includes: an on-chip microlens, a color filter, a photosensitive diode and a silicon-based logic control circuit; the silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED modulation and drive control circuit; the multi-type LED modulation and drive control circuit setting includes: the multi-type LED modulation and drive control circuit is set on an intermediate layer, and the multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

3. A high-parallel optical transmission link communication system for digital images according to claim 1, characterized in that: The electro-optic array conversion module comprises: The electric signal array drive conversion unit converts the multi-channel electric signal into a multi-type LED array modulation signal through a signal drive conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; The wavelength range of the light emitted by the multi-type LED array is 390nm-2000nm; LED light source modulation unit, controlling multiple types of LED light sources according to multiple types of LED array modulation signals; The multi-type LED light source array unit controls the multi-type LED light source array to emit light according to the multi-type LED light source modulation signal, and converts the multi-channel electrical signal into an array light signal; The silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED modulation and drive control circuit.

4. A high-parallel optical transmission link communication system for digital images according to claim 1, characterized in that: Optical signal passive transmission module, including: The optical waveguide transmission unit performs waveguide passive transmission of optical signals through multiple combined optical waveguides; A free-space optical transmission unit performs free-space passive transmission of optical signals through obstacle-monitoring spatial pathways; The multiple combinations of optical waveguides include: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides.

5. The high-parallel optical transmission link communication system for digital images according to claim 1, characterized in that: Photoelectric detection signal processing module, including: Restore and combine the photoelectric detection units, and construct a photoelectric detection diode array by restore and combine; convert the array optical signal into an electrical signal by the photoelectric detection diode array; A receiving and processing unit performs signal processing on the restored electrical signal through a signal processing system; The photodetection diode array detects wavelengths in the range of 390nm-2000nm; The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination.

6. A high-parallel optical transmission link communication method for digital images, characterized in that: include: S100, collecting original image signals through an image sensor and converting the original image signals into multi-channel electrical signals; S200, modulating a multi-type LED array by a multi-channel electrical signal, and converting the multi-channel electrical signal into an array optical signal by electro-optical conversion; S300, transmitting the array optical signal to the photodetection diode array by passive transmission of the optical signal; S400, converting the array optical signal into a restored electrical signal through a photodetection diode array, and performing signal processing on the restored electrical signal through a signal processing system.

7. A high-parallel optical transmission link communication method for digital images according to claim 6, characterized in that: S100 includes: S101, collecting original image signals through an electronic image collection sensor group; S102, using a multi-channel signal conversion group to convert the original image signal into a multi-channel electrical signal; The electronic image acquisition sensor group includes: a CMOS image sensor or a CCD image sensor or an organic image sensor or a quantum dot image sensor or an infrared image sensor; the multi-channel electrical signal includes: a parallel digital image signal, a serial digital image signal and an interface signal; the parallel digital image signal includes: a frame synchronization signal, a line synchronization signal, a clock signal, an image data signal, a data enable signal and a data flag signal; the serial digital image signal includes: an LVDS signal, a MIPI signal, a USB signal, an EtherMAC signal, an SPI signal and a SerDes signal; the interface signal includes: a serial bus I2C signal, a UART signal, a SIO signal, a SSP / SPI signal, a CAN signal, a USB signal and an EtherMAC signal; the CMOS image sensor includes: an on-chip microlens, a color filter, a photosensitive diode and a silicon-based logic control circuit; the silicon-based logic control circuit includes: an image sensor control circuit and a multi-type LED array modulation and drive control circuit; the multi-type LED modulation and drive control circuit setting includes: the multi-type LED modulation and drive control circuit is set on the intermediate layer, and the multi-type LED modulation and drive control circuit is integrated in the silicon-based logic control circuit.

8. The high-parallel optical transmission link communication method for digital images according to claim 6, characterized in that: S200 includes: S201, converting the multi-channel electrical signal into a multi-type LED array modulation signal through a signal driving conversion circuit; the multi-type LED array includes: a Micro-LED array, a mini-LED array or a general LED array; the wavelength range of the emission light of the multi-type LED array is 390nm-2000nm; S202, controlling multiple types of LED light sources according to the modulation signals of the multiple types of LED arrays; S203, controlling the multi-type LED light source array according to the modulation signal of the multi-type LED light source, and converting the multi-channel electrical signal into an array light signal.

9. The high-parallel optical transmission link communication method for digital images according to claim 6, characterized in that: S300 includes: S301, performing waveguide passive transmission of optical signals through multiple combined optical waveguides; S302, performing free space passive transmission of optical signals through an obstacle monitoring space path; The multiple combinations of optical waveguides include: a one-to-one combination of multiple types of LEDs and optical waveguides or a many-to-one combination of multiple types of LEDs and optical waveguides.

10. The high-parallel optical transmission link communication method for digital images according to claim 6, characterized in that: S400 includes: S401, constructing a photodetection diode array through reduction combination; converting the array optical signal into a reduction electrical signal through the photodetection diode array; S402, performing signal processing on the restored electrical signal by a signal processing system; The photodetection diode array detects wavelengths in the range of 390nm-2000nm; The reduction combination construction of the photodetection diode array includes: when the multi-combination optical waveguides are a one-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are constructed as a one-to-one combination or a one-to-many extended combination; when the multi-combination optical waveguides are a many-to-one combination of multiple types of LEDs and optical waveguides, the number of optical waveguides and the number of photodiodes are a one-to-many reduction combination; the photodetection diode array is a silicon-based photodetection diode array.

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