Temperature-controllable cast aluminum heating plate structure
By using die -casting methods in the wafer heating disc, directly cast into the cooling layer and heating layer, eliminate the welding interface, and set the thermal insulation layer, solve the problem of insufficient sealing and temperature uniformity of the existing heating disk, realize high accuracy, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision, and achieve high precision. The heating effect of a high -yield wafer.
Patent Information
- Application Number
- CN202411468089.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-01-24
AI Technical Summary
Existing wafer heating disks have problems with sealing and temperature uniformity, resulting in low yield and manufacturing accuracy of wafers.
The cooling layer and heating layer are cast directly into the cast aluminum base plate using die-casting to eliminate the welding interface, improve sealing, and optimize heat transfer by setting up a heat insulation layer.
The high secrets and temperature uniformity of the heating disc are realized, and the yield and manufacturing accuracy of the wafer is improved, and the manufacturing cost and manufacturing cycle is reduced.
Smart Images
Figure CN119364576A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wafer heating plates, and in particular to a temperature-controllable cast aluminum heating plate structure. Background Art
[0002] In the semiconductor manufacturing industry, the heating plate plays a vital role as a core component for heating wafers to meet the temperature requirements of the manufacturing process. It not only ensures the accuracy and yield of the wafers during the manufacturing process, but also meets the needs of complex temperature control scenarios such as wafer heating / cooling, which often occur in vacuum and special gas environments.
[0003] Traditional heating plates usually use vacuum brazing to weld the upper and lower plates together to ensure their sealing. However, this welding method has significant problems: poor contact between the heating wire and the plate body often leads to poor temperature uniformity on the working surface of the heating plate, which in turn affects the yield of the wafer, such as Figure 3 In addition, vacuum brazing is not only costly but also has a long cycle, which increases manufacturing cost and time cost.
[0004] Furthermore, conventional wafer heating plates have a single function, which is only a heating function, and cannot accurately control the temperature at a certain point. In order to achieve the temperature control function, the existing technology has to add a flow channel layer between the cover plate and the base, thus forming a complex structure including five modules: the cover plate, the base, the partition, the flow channel layer and the shaft column. This structure integrates the modules into a whole through welding, in which a metal electric heater is embedded in the base, and together with the partition and the flow channel layer, it forms a heating and cooling system.
[0005] However, this multi-module welding structure has more than two welding interfaces, which places extremely high demands on the brazing connection rate. Once the welding is poor, it may cause the disc to leak air and water, and the sealing problem will occur, which will affect the overall performance of the heating disc and the manufacturing quality of the wafer. In addition, due to the gap between the electric heating wire and the cooling layer and the disc after installation, this structure is also prone to uneven heating of the disc, poor temperature uniformity of the working surface, and ultimately reduce the yield rate of the wafer.
[0006] In summary, the existing wafer heating plate structure has many problems in terms of sealing and temperature uniformity, and a new temperature-controllable heating plate structure is urgently needed to solve these problems. Therefore, the present invention proposes a temperature-controllable cast aluminum heating plate structure, which aims to improve the sealing and temperature uniformity of the heating plate by optimizing the structural design, so as to meet the semiconductor manufacturing industry's demand for high-precision, high-yield wafer heating plates. Summary of the invention
[0007] In order to solve the above problems, the present invention provides a temperature-controllable cast aluminum heating plate structure, which shows significant advantages in sealing, temperature uniformity, manufacturing cost and cycle, heat transfer, structural stability and durability, etc., and meets the semiconductor manufacturing industry's demand for high-precision, high-yield wafer heating plates.
[0008] The technical solution of the present invention is as follows: A temperature-controllable cast aluminum heating plate structure, in which a cooling layer and a heating layer are directly cast in a cast aluminum base plate by die-casting, the heating layer and the cooling layer are parallel to the surface in contact with the cast aluminum base plate and the wafer, and the positive and negative electrodes of the heating layer and the inlet and outlet of the cooling layer extend out of the cast aluminum base plate respectively; a shaft column is fixed on the other side of the cast aluminum base plate in contact with the wafer.
[0009] The cooling layer is a coolant pipe.
[0010] The heating layer is a heating wire.
[0011] Optionally, the cast aluminum base plate and the shaft column are integrally cast.
[0012] Optionally, the cast aluminum base plate and the Shaft column are separately cast and then fixedly connected.
[0013] A thermal insulation layer is provided between the cooling layer and the heating layer.
[0014] The beneficial effects of the present invention are: 1. The present invention discloses a temperature-controllable cast aluminum heating plate structure. The temperature-controllable cast aluminum heating plate structure directly casts a cooling layer and a heating layer in a cast aluminum base plate by die-casting, thereby realizing one-piece molding of the heating plate. This method completely avoids the risk of poor sealing of the plate body because there is no welding interface, thereby avoiding air leakage and water leakage problems caused by poor welding. The heating layer is parallel to the surface in contact with the cast aluminum base plate and the wafer, and the heating wire fits well with the metal around the plate body, so that the plate body is heated more evenly, which can greatly improve the temperature uniformity of the working surface, thereby improving the yield and manufacturing accuracy of the wafer.
[0015] 2. The present invention discloses a temperature-controllable cast aluminum heating plate structure, wherein the cast aluminum base plate and the shaft column of the temperature-controllable cast aluminum heating plate structure can be cast as one piece, or can be cast separately and then fixedly connected, which provides flexible manufacturing options, especially the split casting method, so that the plate body mold can be used as a universal mold. As long as the size is met, there are no requirements for the layout design of the embedded metal tubes (heating wires and coolant tubes), which greatly improves the versatility and reusability of the mold, thereby reducing the cost and time of mold making. Compared with the welding method, the casting process saves the processing of the plate body heating wire groove and the welding process, further shortens the production cycle, and improves production efficiency.
[0016] 3. The present invention discloses a temperature-controllable cast aluminum heating plate structure, which has an insulating layer between the heating layer and the cooling layer (or adds a cavity between the heating wire tube and the coolant tube), which can effectively prevent the heat generated by the heating wire from being carried away by the coolant in large quantities, thereby increasing the proportion of heat transferred toward the top wafer, thereby accelerating the heating rate of the wafer and improving the heating efficiency.
[0017] 4. The present invention discloses a temperature-controllable cast aluminum heating plate structure. Since the casting mold of the temperature-controllable cast aluminum heating plate structure can be compatible with any arrangement of heating wires and coolant pipes, the heating plate structure has high flexibility and scalability. Different projects can share the same set of molds, realize platformization and generalization, and further reduce manufacturing costs and manufacturing cycles. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] By reading the detailed description of the preferred embodiment below, the scheme and advantages of the present application will become clear to those skilled in the art. The accompanying drawings are only for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention.
[0019] In the attached picture: Figure 1 This is a schematic cross-sectional structure diagram of a temperature-controllable cast aluminum heating plate structure according to Example 1 of the present invention; Figure 2 This is a schematic cross-sectional view of a temperature-controllable cast aluminum heating plate structure according to Example 2 of the present invention; Figure 3 This is an X-ray image of a poor connection between an insert and a body before the structure optimization of a temperature-controllable cast aluminum heating plate of the present invention; Figure 4 This is an X-ray image of a temperature-controllable cast aluminum heating plate of the present invention, in which the insert and the body are well bonded after the structure is optimized; The components represented by the reference numerals in the figure are: The present invention comprises: 1. a cast aluminum base plate, 2. a coolant pipe, 3. a heating wire, 4. a shaft column, and 5. a heat insulating layer. DETAILED DESCRIPTION
[0020] like Figure 1 As shown, in Example 1, the temperature-controllable cast aluminum heating plate structure consists of a cast aluminum base plate 1, a heating layer, a cooling layer and a Shaft column 4. The cast aluminum base plate 1 is the main structure of the heating plate and is made of high-quality aluminum alloy material, having good thermal conductivity and mechanical strength.
[0021] The heating layer is composed of a heating wire 3, which is made of a high temperature resistant and corrosion resistant alloy material, and is directly embedded in the cast aluminum base 1 by die casting, and is parallel to the contact surface of the cast aluminum base and the wafer. The positive and negative electrodes of the heating wire extend out of the cast aluminum base respectively, and are used to connect the power supply and the control circuit.
[0022] The cooling layer is composed of a coolant pipe 3, which is made of corrosion-resistant, high-strength metal materials such as stainless steel or copper. It is also directly embedded in the cast aluminum base 1 by die-casting and is parallel to the contact surface between the cast aluminum base and the wafer. The inlet and outlet of the coolant pipe 3 extend out of the cast aluminum base for connecting to the coolant circulation system.
[0023] The shaft column 4 is fixed to the other side of the cast aluminum base 1 that contacts the wafer, and is used to support the wafer and connect other devices. The shaft column can be integrally cast with the cast aluminum base, or it can be cast separately and then fixedly connected by bolts or other connection methods.
[0024] In Example 2, a heat insulating layer 5 is provided between the heating layer and the cooling layer, and the heat insulating layer is made of a material resistant to high temperatures and having low thermal conductivity, such as ceramic or aerogel, etc. The function of the heat insulating layer is to increase the thermal resistance between the heating layer and the cooling layer, reduce the heat transfer between the two layers, and thus improve the efficiency and uniformity of wafer heating.
[0025] When in use, the wafer is placed on the working surface of the cast aluminum heating plate and connected to other devices through the Shaft column 4. By controlling the current of the heating wire and the flow of the coolant, precise temperature control of the wafer can be achieved. The heat generated by the heating wire is transferred to the wafer through the cast aluminum base plate, while the coolant circulates through the coolant pipe, taking away the heat inside the heating plate and keeping the temperature of the heating plate stable. The function of the thermal insulation layer is to reduce the transfer of heat between the heating layer and the cooling layer, and improve the efficiency and uniformity of wafer heating.
[0026] like Figure 4 As shown, the temperature-controllable cast aluminum heating plate structure is manufactured by die-casting and is formed in one piece, which completely avoids the risk of poor sealing of the plate body; the heating wire fits well with the metal around the plate body, so that the plate body is heated evenly, which can greatly improve the temperature uniformity of the working surface; by setting a thermal insulation layer, the heat transfer between the heating layer and the cooling layer is reduced, and the efficiency and uniformity of wafer heating are improved; the casting mold can be compatible with any arrangement of heating wires and coolant pipe designs, realizing platformization and generalization, and greatly reducing manufacturing costs and manufacturing cycles; the cast aluminum heating plate has a simple and compact structure, is easy to install and maintain, and is suitable for various semiconductor manufacturing equipment.
Claims
1. A temperature-controllable cast aluminum heating plate structure, characterized in that: The cooling layer and the heating layer are directly cast in the cast aluminum base (1) by die casting, the heating layer and the cooling layer are parallel to the contact surface of the cast aluminum base (1) and the wafer, and the positive and negative electrodes of the heating layer and the inlet and outlet of the cooling layer extend out of the cast aluminum base (1) respectively; the shaft column (4) is fixed on the other side of the cast aluminum base (1) that contacts the wafer.
2. The temperature-controllable cast aluminum heating plate structure according to claim 1, characterized in that: The cooling layer is a cooling liquid pipe (3).
3. The temperature-controllable cast aluminum heating plate structure according to claim 1, characterized in that: The heating layer is a heating wire (3).
4. The temperature-controllable cast aluminum heating plate structure according to claim 1, characterized in that: The cast aluminum base plate (1) and the shaft column (4) are integrally cast.
5. The temperature-controllable cast aluminum heating plate structure according to claim 1, characterized in that: The cast aluminum base plate (1) and the shaft column (4) are cast separately and then fixedly connected.
6. The temperature-controllable cast aluminum heating plate structure according to claim 1, characterized in that: A heat insulation layer (5) is arranged between the cooling layer and the heating layer.