Electronic control device and method for manufacturing electronic control device

Abstract

The electronic control device includes a circuit board on which an electronic component is mounted, a conductive housing that houses the circuit board, and an electromagnetic wave shielding layer that is interposed between the circuit board and the housing. The housing has a substrate base for fixing the circuit substrate, and the electromagnetic wave shielding layer has a compressed region pressed by the circuit substrate at a position separated from the substrate base by a predetermined distance.

Description

Technical Field

[0001] The present invention relates to an electronic control device and a method for manufacturing the electronic control device. Background Art

[0002] In recent years, the demand for advanced driver assistance systems (hereinafter referred to as ADAS) and automatic driving (hereinafter referred to as AD) systems has increased. The operating frequency of semiconductor components such as CPU (central processing unit) mounted on electronic control devices for ADAS or AD is high, and the generation of electromagnetic wave noise has become a problem. As an example of a shielding structure for reducing electromagnetic wave noise radiated to the external environment, a structure is known in which a circuit substrate and a metal frame for protecting the circuit substrate are electrically connected. In addition, patent document 1 discloses a shielding structure using an electromagnetic wave shielding sheet, which has a conductive layer and a buffer layer containing an adhesive resin and a conductive filler. Prior art literature Patent Literature

[0003] Patent Document 1: Japanese Patent Application Publication No. 2020-057711 Summary of the invention Problem that the invention aims to solve

[0004] The processing speed of in-vehicle electronic control devices, including those for ADAS and AD, tends to increase due to the advancement of autonomous driving, etc. Therefore, there is a strong demand for improved shielding performance against electromagnetic wave noise in in-vehicle electronic control devices.

[0005] An object of the present invention is to provide an electronic control device capable of improving the shielding performance against electromagnetic wave noise. Technical means of solving problems

[0006] In order to solve the above-mentioned problems, for example, the configuration described in the claims is adopted. The present application includes a plurality of means for solving the above-mentioned problems. If one of them is listed, an electronic control device can be listed, which includes: a circuit substrate on which electronic components are mounted; a conductive frame that accommodates the circuit substrate; and an electromagnetic wave shielding layer between the circuit board and the frame. The frame has a substrate base for fixing the circuit substrate, and the electromagnetic wave shielding layer has a compression area that is pressed by the circuit substrate at a position separated from the substrate base by a predetermined distance. Effects of the Invention

[0007] According to the present invention, the shielding performance against electromagnetic wave noise can be improved. The other objects, structures, and effects than those described above will become clear from the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a perspective view of the electronic control device according to the first embodiment. Figure 2 It is a top view of the electronic control device according to the first embodiment. Figure 3 It is an exploded perspective view of the electronic control device according to the first embodiment. Figure 4 It is a schematic plan view of the circuit board according to the first embodiment. Figure 5 yes Figure 2 VV cross-sectional view of the electronic control device shown. Figure 6 yes Figure 5 An enlarged view of part VI of the electronic control device shown. Figure 7 This is a flowchart for explaining the method for manufacturing the electronic control device according to the first embodiment. Figure 8 This is an enlarged cross-sectional view of a main part of the electronic control device according to the first embodiment. Fig. 9 It is a cross-sectional view of an electronic control device according to a second embodiment. Fig.10 This is an enlarged cross-sectional view of a main part of the electronic control device according to the second embodiment. Fig.11 It is a cross-sectional view of an electronic control device according to a third embodiment. Fig.12 This is an enlarged cross-sectional view of a main part of the electronic control device according to the third embodiment. Fig.13 It is a cross-sectional view of an electronic control device according to a fourth embodiment. Fig.14 This is an enlarged cross-sectional view of a main part of an electronic control device according to a fourth embodiment. Fig.15 It is a cross-sectional view of an electronic control device according to a fifth embodiment. Fig.16 This is an enlarged cross-sectional view of a main part of the electronic control device according to the fifth embodiment. Fig.17 It is a cross-sectional view of an electronic control device according to a sixth embodiment. Fig.18 It is a cross-sectional view of an electronic control device according to a seventh embodiment. Fig.19 It is a cross-sectional view of an electronic control device according to an eighth embodiment. Fig. 20 It is a plan view showing the main part of the electronic control device according to the ninth embodiment. Fig.21 It is a plan view showing a main part of an electronic control device according to a tenth embodiment. DETAILED DESCRIPTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification and the drawings, elements having substantially the same function or configuration are denoted by the same reference numerals, and repeated descriptions are omitted.

[0010] (First Embodiment) Figure 1 It is a perspective view of the electronic control device according to the first embodiment. Figure 2 It is a top view of the electronic control device according to the first embodiment. Figure 3 1 is an exploded perspective view of the electronic control device of the first embodiment. Figure 1 and Figure 3 In the figure, the connector described later is omitted.

[0011] like Figure 1 to Figure 3 As shown, the electronic control device 10 includes: a circuit board 11 ( Figure 3 ) for mounting electronic components described later, and a conductive frame 12 for housing a circuit board 11. The electronic control device 10 is mounted on a vehicle such as an automobile as an ADAS or AD.

[0012] The frame 12 is formed into a so-called flat, generally rectangular parallelepiped shape with a small height dimension (thickness dimension). The frame 12 has an opening 13 for connecting a connector. The frame 12 is composed of a metal frame base 15 and a metal frame cover 16. The frame base 15 and the frame cover 16 are fixed to each other by a plurality of screws 31.

[0013] Further details, such as Figure 3 As shown, a plurality of cover bases 30 are formed on the frame base 15. The cover bases 30 are formed integrally with the frame base 15. A threaded hole 34 is provided on each cover base 30. On the other hand, a plurality of cover fixing holes 35 are formed on the frame cover 16. The cover fixing holes 35 are through holes for fixing the frame cover 16 to the frame base 15. The plurality of screws 31 mentioned above are engaged with the threaded holes 34 of the cover base 30 through the cover fixing holes 35 corresponding to each other. The frame cover 16 is fixed to the frame base 15 by tightening each screw 31. In this way, by fixing the frame cover 16 to the frame base 15 using the screws 31, the frame base 15 and the frame cover 16 are electrically and mechanically connected.

[0014] The frame base 15 and the frame cover 16 may be made of the same metal material or different metal materials. When the frame base 15 and the frame cover 16 are made of different metal materials, the frame base 15 is made of aluminum, for example, and the frame cover 16 is made of rust-proofed iron, for example.

[0015] In this specification, for the sake of convenience, the side where the frame base 15 is arranged is set as the lower side, and the side where the frame cover 16 is arranged is set as the upper side. When the electronic control device 10 is mounted on a vehicle, the electronic control device 10 can be mounted in any direction. Generally, it is preferred to install the electronic control device 10 on the vehicle in a manner such that the frame base 15 faces upward and the frame cover 16 faces downward.

[0016] The circuit board 11 is surrounded from above and below by a housing base 15 and a housing cover 16. The circuit board 11 is formed of, for example, a printed wiring board using glass epoxy resin as a base material. The circuit board 11 is formed in a substantially rectangular shape.

[0017] Figure 4 It is a schematic plan view of the circuit board according to the first embodiment. like Figure 4 As shown, three electronic components 17, 18, 19 and two connectors 21, 22 are mounted on the circuit board 11. The circuit board 11 has a circuit region 25 and a ground pattern 26. The electronic components 17, 18, 19 are mounted on the circuit region 25 of the circuit board 11. The connectors 21, 22 are mounted on the ends of the circuit board 11.

[0018] The electronic components 17, 18, and 19 are, for example, LSI components. LSI is an abbreviation for Large Scale Integration. Each LSI component 17, 18, and 19 is a heat source and a noise source. Electronic components other than LSI components are also mounted on the circuit region 25 of the circuit substrate 11, but Figure 4 Electronic components other than LSI components, circuit wiring, etc. are omitted. Connectors 21 and 22 are mounted on the ends of the circuit substrate 11. The connectors 21 and 22 can be connected through the opening 13 ( Figure 1 ) is connected to a cable-side connector (not shown).

[0019] The ground pattern 26 is formed around the circuit region 25. The ground pattern 26 is a pattern formed of, for example, copper foil. The ground pattern 26 is formed in a ring shape so as to surround the four sides of the circuit region 25. The ground pattern 26 may be formed so as to surround the three sides of the circuit region 25.

[0020] like Figure 3As shown in FIG. 1 , the circuit board 11 is fixed to the frame base 15 by a plurality of screws 32. The screws 32 are provided as an example of a fixing member. Next, the mounting structure of the circuit board 11 using the screws 32 will be described in detail.

[0021] First, a plurality of substrate bases 36 are formed on the frame base 15. The substrate bases 36 are formed integrally with the frame base 15. A screw hole 37 is provided on the upper surface of each substrate base 36. On the other hand, a plurality of substrate fixing holes 33 are provided on the circuit substrate 11. The plurality of substrate fixing holes 33 are through holes for fixing the circuit substrate 11 on the frame base 15. Each substrate fixing hole 33 is formed on the ground pattern 26. In the portion where the substrate fixing hole 33 is formed, a portion of the ground pattern 26 is formed into a circle that is one circle larger than the inner diameter of the substrate fixing hole 33, and the substrate fixing hole 33 is formed in the area of ​​the circle.

[0022] The plurality of screws 32 are engaged with the threaded holes 37 of the substrate base 36 through the corresponding substrate fixing holes 33. The circuit substrate 11 is fixed to the frame base 15 by tightening the screws 32. In addition, a convex portion 38 ( Figure 3 A plurality of protrusions 38 are formed at appropriate positions of the frame base 15. The circuit board 11 is screwed to the frame base 15 while being positioned by the plurality of protrusions 38.

[0023] Bosses 27, 28, and 29 for heat dissipation are integrally formed on the frame base 15. The boss 27 is connected to the electronic component 17 via a heat dissipation paste. In addition, the boss 28 is connected to the electronic component 18 via a heat dissipation paste, and the boss 29 is connected to the electronic component 19 via a heat dissipation paste. Thus, the heat generated by each electronic component 17, 18, and 19 is transferred to the frame base 15 via the heat dissipation paste and is released from the outer surface of the frame base 15.

[0024] Figure 5 yes Figure 2 VV cross-sectional view of the electronic control device shown. Figure 6 It is magnified Figure 5 FIG. VI of the electronic control device shown. Figure 5 and Figure 6 The state before the screw 32 is tightened is shown. like Figure 5 and Figure 6 As shown, the electromagnetic wave shielding layer 41 is interposed between the circuit substrate 11 and the frame base 15. Figure 3As shown, the electromagnetic wave shielding layer 41 is formed by supplying the electromagnetic wave shielding material 40 to the setting table 39 formed on the frame base 15. The electromagnetic wave shielding material 40 is a shielding material having conductivity. The setting table 39 is formed on the frame base 15 in order to set the electromagnetic wave shielding layer 41. The setting table 39 is formed along Figure 4 The shape of the ground pattern 26 of the circuit substrate 11 is formed. Therefore, by forming an electromagnetic wave shielding layer 41 on the setting table 39 using the electromagnetic wave shielding material 40, the electromagnetic wave shielding layer 41 is interposed between the circuit substrate 11 and the frame base 15, and the ground pattern 26 of the circuit substrate 11 and the frame base 15 can be electrically connected.

[0025] The electromagnetic wave shielding material 40 is, for example, a liquid or paste adhesive provided as a CIPG (Cured In-Place Gasket). The electromagnetic wave shielding material 40 is a shielding material containing a conductive filler. As the conductive filler, for example, a metal filler can be used, and more preferably, a metal filler subjected to electroplating treatment can be used. The base material of the electromagnetic wave shielding material 40 is, for example, silicone, polyurethane, etc.

[0026] Here, use Figure 7 A method for manufacturing the electronic control device according to the first embodiment will be described. like Figure 7 As shown, the manufacturing method of the electronic control device includes: a coating step S1 of coating the electromagnetic wave shielding material 40 on the setting table 39 of the frame base 15; a substrate fixing step S2 of fixing the circuit substrate 11 on the substrate base 36 of the frame base 15; and a cover fixing step S3 of fixing the frame cover 16 on the cover base 30 of the frame base 15.

[0027] (Coating process) In the coating step S1, the electromagnetic wave shielding material 40 is coated on the installation table 39 of the frame base 15 by, for example, a coating nozzle (not shown). Figure 5 and Figure 6As shown, the electromagnetic wave shielding material 40 is applied in a manner that a part 40a of the electromagnetic wave shielding material 40 is higher than the substrate base 36. The height of the setting table 39 and the height of the electromagnetic wave shielding material 40 are respectively defined with the upper surface of the setting table 39 as the reference (zero). The electromagnetic wave shielding material 40 is applied in a manner that is lower than the substrate base 36 near the substrate base 36. In addition, the electromagnetic wave shielding material 40 is applied in a manner that is higher than the substrate base 36 except near the substrate base 36 (in other words, away from the substrate base 36). In addition, the electromagnetic wave shielding material 40 is applied thinly near the substrate base 36 and is applied thickly at a place away from the substrate base 36. Therefore, the applied electromagnetic wave shielding material 40 has a portion 40a with a thick coating thickness and higher than the substrate base 36 (hereinafter also referred to as the "first portion") and a portion 40b with a thin coating thickness and lower than the substrate base 36 (hereinafter also referred to as the "second portion") . The coating thickness of the electromagnetic shielding material 40 may be adjusted by, for example, changing the coating pressure (coating amount per unit time) of the coating nozzle or changing the number of coating times of the coating nozzle.

[0028] In this way, after the electromagnetic wave shielding material 40 is applied on the setting table 39 of the frame base 15, the electromagnetic wave shielding material 40 is cured to a predetermined hardness before the substrate fixing step S2 described later is performed. The predetermined hardness refers to the hardness of the degree to which the first part 40a of the electromagnetic wave shielding material 40 can be compressed and deformed by the pressing force of the circuit substrate 11 when the first part 40a of the electromagnetic wave shielding material 40 is pressed by the circuit substrate 11 in the substrate fixing step S2 described later. The electromagnetic wave shielding layer 41 is a shielding layer formed by the electromagnetic wave shielding material 40 applied on the setting table 39.

[0029] (Substrate fixing process) In the substrate fixing step S2, the circuit substrate 11 is mounted on the substrate base 36 of the frame base 15 using screws 32. At this time, the circuit substrate 11 is fixed by the screws 32 so that the circuit substrate 11 presses the first portion 40a of the electromagnetic shielding material 40. This will be described in detail below.

[0030] First, the first portion 40a of the electromagnetic wave shielding material 40 is higher than the substrate base 36. Therefore, the ground pattern 26 of the circuit substrate 11 contacts the first portion 40a of the electromagnetic wave shielding material 40. In addition, the screw 32 is screwed into the threaded hole 37 of the substrate base 36 through the substrate fixing hole 33 of the circuit substrate 11, and the screw 32 is tightened in this state to fix the circuit substrate 11 on the frame base 15. In this state, Figure 8As shown, the first portion 40a of the electromagnetic shielding material 40 is pressed by the circuit board 11, and the pressed portion becomes the compressed region 41a. In addition, the ground pattern 26 of the circuit board 11 is electrically connected to the housing base 15 via the electromagnetic shielding layer 41.

[0031] On the other hand, the second portion 40b of the electromagnetic wave shielding material 40 is lower than the substrate base 36. Therefore, even when the circuit substrate 11 is fixed to the frame base 15 by the screws 32, the second portion 40b of the electromagnetic wave shielding material 40 is not pressed by the circuit substrate 11, and the portion that is not pressed becomes the non-compressed region 41b. The non-compressed region 41b is formed closer to the substrate base 36 than the compressed region 41a, and the compressed region 41a is formed at a position farther from the substrate base 36 than the non-compressed region 41b. Due to the presence of the non-compressed region 41b, the compressed region 41a is formed at a predetermined distance La ( Figure 8 ). The predetermined distance La is less than half the wavelength of the noise frequency to be shielded. However, if the predetermined distance La is too short, the deformation amount of the circuit substrate 11 near the substrate base 36 increases when the screw 32 is tightened. Therefore, the predetermined distance La is preferably set so that the deformation amount of the circuit substrate 11 near the substrate base 36 does not become too large when the screw 32 is tightened.

[0032] (Cover fixing process) In the cover fixing step S3, the housing cover 16 is mounted on the cover base 30 of the housing base 15 using the screws 31. Thus, the circuit board 11 is housed inside the housing 12.

[0033] In the electronic control device 10 and the manufacturing method thereof of the first embodiment described above, the first part 40a of the electromagnetic wave shielding material 40 applied to the setting table 39 of the frame base 15 higher than the substrate base 36 forms a compressed area 41a pressed by the circuit substrate 11. In the compressed area 41a, the density of the conductive filler contained in the electromagnetic wave shielding material 40 is higher than that in the non-compressed area 41b. Therefore, compared with the case where the electromagnetic wave shielding layer 41 does not have the compressed area 41a, the impedance of the electromagnetic wave shielding layer 41 is reduced. Therefore, the shielding performance of the electromagnetic wave shielding layer 41 against electromagnetic wave noise can be improved.

[0034] In the first embodiment, the circuit board 11 presses the electromagnetic wave shielding layer 41 at a position separated from the board base 36 by a predetermined distance La. Therefore, deformation of the circuit board 11 caused by tightening of the screws 32 can be suppressed.

[0035] In addition, in the first embodiment, the distance La from the substrate base 36 to the compression region 41a is less than half the wavelength of the noise frequency to be shielded. Therefore, even if the non-compression region 41b is between the substrate base 36 and the compression region 41a, the electromagnetic wave noise to be shielded can be effectively blocked by the electromagnetic wave shielding layer 41.

[0036] In the first embodiment, the ground pattern 26 of the circuit board 11 and the housing base 15 are electrically connected via the electromagnetic wave shielding layer 41. Thus, the potential of the ground pattern 26 is maintained at the same level as the potential of the housing 12. Therefore, the potential of the ground pattern 26 in the circuit board 11 can be stabilized.

[0037] In addition, in the first embodiment, by adjusting the coating height when the electromagnetic wave shielding material 40 is coated on the setting table 39 of the frame base 15, the second part 40b of the electromagnetic wave shielding material 40 becomes a non-compressed area 41b that is not pressed by the circuit substrate 11. The non-compressed area 41b is formed near the substrate base 36. Thus, near the substrate base 36, the stress generated on the electromagnetic wave shielding layer 41 due to the tightening of the screws 32 can be reduced. In addition, near the substrate base 36, the deformation of the circuit substrate 11 caused by the tightening of the screws 32 and the deformation of the solder part of the electronic component caused by the deformation of the circuit substrate 11 can be reduced.

[0038] In the first embodiment, the electromagnetic shielding layer 41 is formed by applying the electromagnetic shielding material 40 on the mounting base 39 of the frame base 15. Thus, the cost required to form the electromagnetic shielding layer can be reduced compared to the case where the electromagnetic shielding layer is formed by attaching components such as an electromagnetic shielding sheet and an EMI gasket.

[0039] In addition, in the first embodiment, the electromagnetic wave shielding material 40 is applied near the substrate base 36 in a manner such that the second portion 40b is lower than the substrate base 36, but not limited to this, the electromagnetic wave shielding material 40 may also be applied near the substrate base 36 in a manner such that the second portion 40b is at the same height as the substrate base 36.

[0040] (Second Embodiment) Fig. 9 It is a cross-sectional view of an electronic control device according to a second embodiment. Fig.10 This is an enlarged cross-sectional view of a main part of the electronic control device according to the second embodiment. like Fig. 9 and Fig.10 As shown, the electronic control device 10A of the second embodiment is different from that of the first embodiment ( Figure 5) is different in that the compression region 41a of the electromagnetic wave shielding layer 41 includes a high compression region H and a low compression region L.

[0041] The high compression region H is a region pressed by the circuit substrate 11 at a higher compression rate than the low compression region L when the circuit substrate 11 is mounted on the frame base 15 by the screws 32. The low compression region L is a region pressed by the circuit substrate 11 at a lower compression rate than the high compression region H, or a region not pressed by the circuit substrate 11 like the non-compression region 41b.

[0042] The high compression region H is a region where the electromagnetic wave shielding material 40 is applied higher than the substrate base 36 when the electromagnetic wave shielding material 40 is applied on the setting table 39 of the frame base 15 in the above-mentioned coating step S1. In contrast, the low compression region L is a region where the electromagnetic wave shielding material 40 is applied lower than the high compression region H. Therefore, the coating thickness of the electromagnetic wave shielding material 40 in the low compression region L is thinner than the coating thickness of the electromagnetic wave shielding material 40 in the high compression region H. Therefore, at the stage before the circuit substrate 11 is mounted, a recessed portion 49 ( Fig. 9 ). In addition, the coating thickness of the electromagnetic wave shielding material 40 in the low compression region L may be the same as or different from the coating thickness of the electromagnetic wave shielding material 40 in the non-compression region 41b.

[0043] Thus, by configuring the compressed region 41a of the electromagnetic shielding layer 41 to include the high compression region H and the low compression region L, the amount of the electromagnetic shielding material 40 required for forming the electromagnetic shielding layer 41 can be reduced. This can reduce the cost of the electronic control device 10A.

[0044] (Third Embodiment) Fig.11 It is a cross-sectional view of an electronic control device according to a third embodiment. Fig.12 This is an enlarged cross-sectional view of a main part of the electronic control device according to the third embodiment. like Fig.11 and Fig.12 As shown, the electronic control device 10B of the third embodiment is different from that of the first embodiment ( Figure 5 ) is different in that the electromagnetic wave shielding layer 41 is arranged at a position other than near the substrate base 36.

[0045] The electromagnetic wave shielding layer 41 does not have the non-compressed region 41b ( Figure 5), having only a compressed area 41a. In order to form such an electromagnetic wave shielding layer 41, in the above-mentioned coating step S1, when the electromagnetic wave shielding material 40 is coated on the setting table 39, it is sufficient to coat the electromagnetic wave shielding material 40 at a position other than near the substrate base 36. That is, the electromagnetic wave shielding material 40 is not coated near the substrate base 36, but the electromagnetic wave shielding material 40 is coated at a position away from the substrate base 36. As a result, there is an area 50 near the substrate base 36 where the electromagnetic wave shielding layer 41 is not formed. In this area 50, the upper surface of the setting table 39 is not covered by the electromagnetic wave shielding material 40 (electromagnetic wave shielding layer 41).

[0046] As described above, in the third embodiment, the electromagnetic wave shielding layer 41 is arranged at a position other than the vicinity of the substrate base 36 by limiting the application area of ​​the electromagnetic wave shielding material 40 to a position away from the substrate base 36. Thus, the amount of the electromagnetic wave shielding material 40 required for forming the electromagnetic wave shielding layer 41 can be reduced, thereby achieving low cost of the electronic control device 10B.

[0047] (Fourth Embodiment) Fig.13 It is a cross-sectional view of an electronic control device according to a fourth embodiment. Fig.14 This is an enlarged cross-sectional view of a main part of an electronic control device according to a fourth embodiment. like Fig.13 and Fig.14 As shown, the electronic control device 10C of the fourth embodiment is different from that of the third embodiment ( Fig.11 , Fig.12 ) is different in that the compressed region 41a of the electromagnetic wave shielding layer 41 includes a high compression region H and a low compression region L. Thus, compared with the third embodiment, the amount of the electromagnetic wave shielding material 40 used can be further reduced.

[0048] (Fifth Embodiment) Fig.15 It is a cross-sectional view of an electronic control device according to a fifth embodiment. Fig.16 This is an enlarged cross-sectional view of a main part of the electronic control device according to the fifth embodiment. like Fig.15 and Fig.16 As shown, the electronic control device 10D of the fifth embodiment is different from that of the first embodiment ( Figures 5 to 8 ), the difference is that a height difference is set on the setting platform 39 of the frame base 15. Specifically, the setting platform 39 of the frame base 15 has a first setting base 39a away from the substrate base 36 and a second setting base 39b closer to the substrate base 36 than the first setting base 39a. In addition, the height of the first setting base 39a is higher than the height of the second setting base 39b.

[0049] In contrast, the electromagnetic wave shielding layer 41 has a compression region 41a provided on the first setting base 39a and a non-compression region 41b provided on the second setting base 39b. The compression region 41a and the non-compression region 41b are formed by applying the electromagnetic wave shielding material 40 to the first setting base 39a and the second setting base 39b with a uniform thickness in the above-mentioned coating step S1, and fixing the circuit substrate 11 to the substrate base 36 using the screws 32 in the subsequent substrate fixing step S2.

[0050] The height of the first installation base 39a only needs to be such that when the circuit board 11 is mounted on the board base 36 by the screws 32, the electromagnetic wave shielding material 40 applied on the first installation base 39a is pressed by the circuit board 11 to form a compressed area 41a.

[0051] Thus, by providing the step on the installation table 39 of the housing base 15, it is possible to reduce the amount of the electromagnetic shielding material 40 required for forming the electromagnetic shielding layer 41. In addition, in the coating step S1, the coating thickness of the electromagnetic shielding material 40 can be made uniform.

[0052] (Sixth Embodiment) Fig.17 It is a cross-sectional view of an electronic control device according to a sixth embodiment. like Fig.17 As shown, the electronic control device 10E of the sixth embodiment is different from that of the fifth embodiment ( Fig.15 ), the difference is that an inclined portion 39c is formed at the boundary between the first setting base 39a and the second setting base 39b. The inclination angle of the inclined portion 39c is an angle determined based on the upper surface of the second setting base 39b, for example, set within a range of 15 degrees to 75 degrees.

[0053] In this way, by forming an inclined portion 39c on the boundary between the first setting base 39a and the second setting base 39b, in the above-mentioned substrate fixing step S2, when the circuit substrate 11 is installed on the substrate base 36 of the frame base 15 using the screws 32, the stress generated on the electromagnetic wave shielding layer 41 can be further reduced.

[0054] (Seventh Embodiment) Fig.18 It is a cross-sectional view of an electronic control device according to a seventh embodiment. like Fig.18 As shown, the electronic control device 10F of the seventh embodiment is different from that of the fifth embodiment ( Fig.15), the difference is that: there are multiple protrusions 39d on the setting surface (upper surface) of the first setting base 39a on which the electromagnetic wave shielding layer 41 is provided. In this embodiment, as an example, two protrusions 39d are formed on the setting surface of the first setting base 39a. Each protrusion 39d is formed in a convex shape on the setting surface of the first setting base 39a. In addition, the interval P1 between adjacent protrusions 39d on the setting surface of the first setting base 39a is set to be less than half the wavelength of the noise frequency to be shielded. In addition, the interval P2 between the screw 32 for fixing the circuit substrate 11 and the protrusion 39d closest to the screw 32 is also set to be less than half the wavelength of the noise frequency to be shielded.

[0055] When a plurality of protrusions 39d are formed on the installation surface of the first installation base 39a, the electromagnetic wave shielding material 40 is applied to the first installation base 39a and the second installation base 39b with a uniform thickness in the above-mentioned coating step S1, and in the subsequent substrate fixing step S2, the circuit substrate 11 is fixed to the substrate base 36 with the screws 32, thereby forming a high compression area H within the range of the compression area 41a due to the presence of the protrusions 39d. The high compression area H is a compression area formed by the electromagnetic wave shielding material 40 applied in a manner covering the protrusions 39d being pressed against the circuit substrate 11.

[0056] In the seventh embodiment, a plurality of protrusions 39d are provided on the installation surface of the first installation base 39a, and a high compression area H is formed within the range of the compression area 41a due to the presence of each protrusion 39d, so that the shielding performance of the electromagnetic wave shielding layer 41 against electromagnetic wave noise can be further improved. In addition, in the seventh embodiment, since the interval P1 between adjacent protrusions 39d and the interval P2 between the screw 32 and the protrusion 39d are respectively set to be less than half the wavelength of the noise frequency to be shielded, the shielding performance against the electromagnetic wave noise to be shielded can be further improved.

[0057] (Eighth Embodiment) Fig.19 It is a cross-sectional view of an electronic control device according to an eighth embodiment. like Fig.19 As shown, the electronic control device 10G of the eighth embodiment is different from that of the fifth embodiment ( Fig.15 ) is different in that the compression area 41a of the electromagnetic wave shielding layer 41 disposed on the first setting base 39a includes a first compression area h1 and a second compression area h2 with different compression rates. The first compression area h1 is an area with a higher compression rate than the second compression area h2.

[0058] The first compressed area h1 and the second compressed area h2 are formed by the following method. First, in the coating step S1, when the electromagnetic wave shielding material 40 is coated on the first setting base 39a, the coating thickness is thickened at the position corresponding to the first compression area h1, and the coating thickness is thinned at the position corresponding to the second compression area h2. Thus, a concave portion is formed on the surface (upper surface) of the electromagnetic wave shielding material 40 coated on the first setting base 39a. Then, in the substrate fixing step S2, when the circuit substrate 11 is mounted on the substrate base 36 by the screws 32, the electromagnetic wave shielding material 40 covering the first setting base 39a is pressed by the circuit substrate 11. At this time, the portion where the electromagnetic wave shielding material 40 is applied with a thicker thickness becomes the first compression area h1, and the portion where the electromagnetic wave shielding material 40 is applied with a thinner thickness becomes the second compression area h2.

[0059] In this way, by providing the first compressed region h1 and the second compressed region h2 on the electromagnetic shielding layer 41 provided on the first installation base 39 a , it is possible to reduce the amount of the electromagnetic shielding material 40 required when forming the electromagnetic shielding layer 41 .

[0060] (Ninth Embodiment) Fig. 20 1 is a top view showing the main part of the electronic control device of the ninth embodiment. Fig. 20 Is cut out Figure 2 However, in Fig. 20 In the figure, the circuit board and the housing cover are omitted. like Fig. 20 As shown, in the electronic control device 10H of the ninth embodiment, compared with the case of the fifth embodiment ( Fig.15 ), characterized in that the setting width w1 of the electromagnetic wave shielding layer 41 near (closest to) the substrate base 36 is wider than the setting width w2 of the electromagnetic wave shielding layer 41 in the portion other than the vicinity of the substrate base 36. In more detail, on the first setting base 39a away from the substrate base 36, a compressed area 41a of the electromagnetic wave shielding layer 41 is formed with a uniform setting width w2. In contrast, on the second setting base 39b close to the substrate base 36, a non-compressed area 41b of the electromagnetic wave shielding layer 41 is formed with different setting widths w1 and w2. Specifically, in the second setting base 39b, the setting width of the electromagnetic wave shielding layer 41 closest to the substrate base 36 is w1, and the setting width of the electromagnetic wave shielding layer 41 away from the substrate base 36 is w2.

[0061] In the above-mentioned coating process S1, the electromagnetic wave shielding material 40 is coated with a first coating width corresponding to the above-mentioned setting width w1 near (closest to) the substrate base 36, and the electromagnetic wave shielding material 40 is coated with a second coating width corresponding to the above-mentioned setting width w2 in a portion other than the vicinity of the substrate base 36, thereby obtaining an electronic control device 10H of the ninth embodiment.

[0062] In this way, by making the setting width w1 of the electromagnetic wave shielding layer 41 near the substrate base 36 wider than the setting width w2 of the electromagnetic wave shielding layer 41 in the portion other than the substrate base 36, in the substrate fixing step S2, when the circuit substrate 11 is mounted on the substrate base 36 of the frame base 15 using the screws 32, a wider contact area between the circuit substrate 11 and the electromagnetic wave shielding layer 41 can be ensured near the substrate base 36. Therefore, the stress generated on the electromagnetic wave shielding layer 41 can be further reduced.

[0063] (Tenth Embodiment) Fig.21 1 is a top view showing the main part of the electronic control device according to the tenth embodiment. Fig.21 Is cut out Figure 2 However, in Fig.21 In the figure, the circuit board and the housing cover are omitted. like Fig.21 As shown, in the electronic control device 10J of the tenth embodiment, compared with the case of the fifth embodiment ( Fig.15 ), characterized in that the setting width w3 of the electromagnetic wave shielding layer 41 at the boundary between the first setting base 39a and the second setting base 39b is wider than the setting width w4 of the electromagnetic wave shielding layer 41 at the portion other than the boundary. In more detail, on the first setting base 39a away from the substrate base 36, a compressed area 41a of the electromagnetic wave shielding layer 41 is formed in a manner that the width of both ends becomes wider. On the other hand, on the second setting base 39b close to the substrate base 36, a non-compressed area 41b of the electromagnetic wave shielding layer 41 is formed in a manner that the width of one end close to the first setting base 39a becomes wider.

[0064] In the above-mentioned coating step S1, the electromagnetic wave shielding material 40 is coated in a manner such that the coating width of the electromagnetic wave shielding material 40 at the boundary between the first setting base 39a and the second setting base 39b is wider than the coating width of the electromagnetic wave shielding material 40 at the portion other than the boundary, thereby obtaining the electronic control device 10J of the tenth embodiment.

[0065] In this way, by making the setting width w3 of the electromagnetic wave shielding layer 41 at the boundary between the first setting base 39a and the second setting base 39b wider than the setting width w4 of the electromagnetic wave shielding layer 41 at the portion other than the boundary, in the substrate fixing step S2, when the circuit substrate 11 is mounted on the substrate base 36 of the frame base 15 using the screws 32, a wider contact area between the circuit substrate 11 and the electromagnetic wave shielding layer 41 can be ensured at the boundary. Therefore, the stress generated on the electromagnetic wave shielding layer 41 can be further reduced.

[0066] <Modifications, etc.> In addition, the present invention is not limited to the above-mentioned embodiments, and includes various modified examples. For example, in the above-mentioned embodiments, detailed descriptions are given to facilitate understanding of the contents of the present invention, but the present invention is not limited to having all the structures described in the above-mentioned embodiments. In addition, a part of the structure of a certain embodiment can be replaced by the structure of other embodiments. In addition, the structure of other embodiments can also be added to the structure of a certain embodiment. In addition, for a part of the structure of each embodiment, it can also be deleted, or other structures can be added, or replaced by other structures.

[0067] For example, in the above embodiment, the electromagnetic wave shielding layer 41 is interposed between the housing base 15 and the circuit board 11 , but the present invention is not limited thereto, and the electromagnetic wave shielding layer 41 may be interposed between the housing cover 16 and the circuit board 11 .

[0068] In addition, the electronic components may be mounted on only one surface of the circuit board 11 , or may be mounted on both surfaces of the circuit board 11 . Explanation of symbols

[0069] 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10J…electronic control device, 11…circuit board, 12…frame, 15…frame base, 16…frame cover, 17, 18, 19…electronic components, 32…screws (fixing parts), 39…setting table, 39a…first setting base, 39b…second setting base, 39c…inclined portion, 39d…protrusion, 40…electromagnetic wave shielding material, 41…electromagnetic wave shielding layer, 41a…compression area, 41b…non-compression area, 49…recess, H…high compression area, h1…first compression area, h2…second compression area, L…low compression area, w1, w2, w3, w4…setting width.

Claims

1. An electronic control device, characterized in that: have: A circuit board having electronic components mounted thereon; a conductive frame that accommodates the circuit substrate; and an electromagnetic wave shielding layer, which is interposed between the circuit substrate and the frame, The frame has a substrate base for fixing the circuit substrate. The electromagnetic wave shielding layer has a compression region pressed by the circuit board at a position separated by a predetermined distance from the board base.

2. The electronic control device according to claim 1, characterized in that: The predetermined distance is equal to or less than half the wavelength of the frequency of the noise to be shielded.

3. The electronic control device according to claim 1, characterized in that: The electromagnetic wave shielding layer has a non-compressed region near the substrate base.

4. The electronic control device according to claim 1, characterized in that: The compression region of the electromagnetic wave shielding layer includes a high compression region and a low compression region.

5. The electronic control device according to claim 1, characterized in that: The electromagnetic wave shielding layer is arranged at a position other than the vicinity of the substrate base.

6. The electronic control device according to claim 1, characterized in that: The frame body has a base for setting the electromagnetic wave shielding layer. The setting base includes a first setting base far away from the substrate base and a second setting base closer to the substrate base than the first setting base, and the height of the first setting base is higher than the height of the second setting base.

7. The electronic control device according to claim 6, characterized in that: An inclined portion is formed on a boundary between the first setting base and the second setting base.

8. The electronic control device according to claim 6, characterized in that: The frame body has a plurality of protrusions, which are portions formed in a convex shape on the installation surface of the first installation base and form a high compression area within the range of the compression area.

9. The electronic control device according to claim 8, characterized in that: The interval between adjacent protrusions among the plurality of protrusions is equal to or smaller than a half wavelength of the frequency of noise to be shielded.

10. The electronic control device according to claim 8, characterized in that: The circuit substrate is fixed on the substrate base of the frame through a fixing member. The interval between the protrusion closest to the fixing member among the plurality of protrusions and the fixing member is equal to or smaller than a half wavelength of the frequency of noise to be shielded.

11. The electronic control device according to claim 6, characterized in that: The electromagnetic wave shielding layer disposed on the first setting base includes a first compressed area and a second compressed area having a lower compression rate than that of the first compressed area.

12. The electronic control device according to claim 1, characterized in that: The electromagnetic wave shielding layer has a wider installation width in the vicinity of the substrate base than in a portion other than the vicinity of the substrate base.

13. The electronic control device according to claim 6, characterized in that: The installation width of the electromagnetic wave shielding layer at the boundary portion between the first installation base and the second installation base is wider than the installation width of the electromagnetic wave shielding layer at a portion other than the boundary portion.

14. A method for manufacturing an electronic control device, the electronic control device comprising a circuit substrate on which electronic components are mounted, a conductive frame for accommodating the circuit substrate, and an electromagnetic wave shielding layer interposed between the circuit substrate and the frame, the method for manufacturing the electronic control device comprising: A coating step of coating the electromagnetic wave shielding material on a setting base of the frame body in such a manner that at least a portion of the electromagnetic wave shielding material is higher than a substrate base formed on the frame body for fixing the circuit substrate; as well as The substrate fixing step is to fix the circuit substrate to the substrate base of the frame body in such a manner that the circuit substrate presses at least a portion of the electromagnetic wave shielding material applied to the installation base of the frame body.

15. The method for manufacturing an electronic control device according to claim 14, characterized in that: In the coating step, the electromagnetic wave shielding material is coated in a manner such that the electromagnetic wave shielding material is at the same height as the substrate base or lower than the substrate base in the vicinity of the substrate base.

16. The method for manufacturing an electronic control device according to claim 14, characterized in that: In the coating step, the electromagnetic wave shielding material is coated so as to form a recessed portion on the surface of the electromagnetic wave shielding material coated higher than the substrate base.

17. The method for manufacturing an electronic control device according to claim 14, characterized in that: In the coating step, the electromagnetic wave shielding material is coated at a location other than the vicinity of the substrate base.

18. The method for manufacturing an electronic control device according to claim 14, characterized in that: In the coating step, the electromagnetic wave shielding material is coated with a first coating width near the substrate base, and is coated with a second coating width narrower than the first coating width in a portion other than the substrate base.

19. The method for manufacturing an electronic control device according to claim 14, characterized in that: The setting base of the frame body includes a first setting base far from the substrate base and a second setting base closer to the substrate base than the first setting base. In the coating step, the electromagnetic wave shielding material is coated so that the coating width of the electromagnetic wave shielding material at the boundary between the first setting base and the second setting base is wider than the coating width of the electromagnetic wave shielding material at a portion other than the boundary.

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