Welding method

Abstract

The invention discloses a welding method. The welding method comprises the steps that a heating device is controlled to heat a welding raw material to a liquid welding material; the liquid welding material is controlled to reach the connecting position of the first metal workpiece and the second metal workpiece, and the liquid welding material moves in the extending direction of the connecting position; and cooling the liquid welding material to the solid welding material so as to connect the first metal workpiece and the second metal workpiece. Welding raw materials are directly heated by controlling the heating device, a heat source is prevented from making direct contact with a metal workpiece, the problem that heat input is too large is solved, the stirring problem of a molten pool is solved, the dilution rate of base metal is conveniently controlled, the probability of later crack generation is reduced, and high-quality welding is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of welding, and in particular to a welding method. Background Art

[0002] Welding is a popular material processing technology. Welding is a process of connecting two separate solid objects into one by using heat, pressure, or both, and with or without filler materials, to generate atomic bonding forces. However, in the current welding process, the heat source usually directly heats the metal workpiece, resulting in a large heat input to the metal workpiece, severe stirring of the molten pool, and a high probability of cracking in the later stage. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a welding method, which reduces the probability of late crack generation and achieves high-quality welding.

[0004] A welding method according to an embodiment of the present invention includes: controlling a heating device to heat a welding raw material to a liquid solder; controlling the liquid solder to a connection position between a first metal workpiece and a second metal workpiece, wherein the liquid solder moves along an extension direction of the connection position; and cooling the liquid solder to a solid solder to connect the first metal workpiece and the second metal workpiece.

[0005] According to the welding method of the embodiment of the present invention, the welding raw materials are directly heated by controlling the heating device, so that the heat source is prevented from directly contacting the metal workpiece, the problem of excessive heat input is avoided, the problem of molten pool stirring is improved, the dilution rate of the base material is conveniently controlled, the probability of later cracks is reduced, and high-quality welding is achieved.

[0006] In some embodiments, the connection position is configured as a receiving groove, and controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece includes: controlling the liquid solder to be poured into the receiving groove.

[0007] In some embodiments, the first metal workpiece is configured as a first plate-shaped member, the second metal workpiece is configured as a second plate-shaped member, the edge of the first plate-shaped member facing the second plate-shaped member is configured as a first surface, the edge of the second plate-shaped member facing the first plate-shaped member is configured as a second surface, and the first surface and the second surface jointly define the accommodating groove; or, the first metal workpiece is configured as a first circular tube, the second metal workpiece is configured as a second circular tube, the first circular tube is provided with a first removal portion at one end facing the second circular tube, and the second circular tube is provided with a second removal portion at one end facing the first circular tube, and the first removal portion and the second removal portion jointly define the accommodating groove.

[0008] In some embodiments, the heating device includes: a container and a coil, wherein a heating space is provided in the container, and the coil is wound around the outer wall of the container to inductively heat the welding raw material. The controlling the heating device to heat the welding raw material to liquid solder includes: controlling the coil to operate, heating the welding raw material to liquid solder and to a set temperature.

[0009] In some embodiments, a liquid cooling channel is provided on the container member, and the liquid cooling channel is connected to a cooling medium supply member. The controlling the heating device to heat the welding raw material to the liquid solder also includes: controlling the cooling medium supply member to supply cooling medium to the liquid cooling channel to cool the liquid solder to the set temperature; or, the controlling the heating device to heat the welding raw material to the liquid solder also includes: controlling the air cooling device to guide the air flow to the heating space to control the liquid solder to the set temperature.

[0010] In some embodiments, a thermocouple is provided on the container member, the thermocouple is electrically connected to a control member, the control member is electrically connected to the coil, the control member is electrically connected to the cooling medium supply member or the air cooling device, and the controlling heating device to heat the welding raw material to liquid solder also includes: according to the detection information of the thermocouple, controlling one of the coil, the cooling medium supply member, and the air cooling device to operate, and adjusting the liquid solder to the set temperature.

[0011] In some embodiments, the coil is electrically connected to a control component, the control component is electrically connected to the cooling medium supply component or the air cooling device, the control component is electrically connected to an infrared detection device, and the control of the heating device to heat the welding raw material to liquid solder also includes: controlling the infrared detection device to detect the temperature of the liquid solder, and controlling one of the coil, the cooling medium supply component, and the air cooling device to operate according to the detection information of the infrared detection device to adjust the liquid solder to the set temperature.

[0012] In some embodiments, controlling the liquid solder to the connection point between the first metal workpiece and the second metal workpiece further includes: controlling the nozzle of the protective gas supply device to correspond to the liquid solder to generate a protective barrier around the liquid solder; or, controlling the liquid solder to the connection point between the first metal workpiece and the second metal workpiece further includes: controlling the liquid solder to the connection point between the first metal workpiece and the second metal workpiece in a sealed space, wherein the sealed space is configured as a vacuum space, or the sealed space is configured as a protective gas space.

[0013] In some embodiments, cooling the liquid solder into a solid solder includes: guiding a cooling medium to cool the liquid solder so that the liquid solder solidifies into a solid solder.

[0014] In some embodiments, cooling the liquid solder to a solid solder further comprises: controlling a pressurizing device to apply pressure to the solid solder.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 is a flow chart of a welding method in an embodiment of the present invention;

[0018] Figure 2 A specific flow chart of the welding method in an embodiment of the present invention;

[0019] Figure 3 It is a schematic diagram of a welding method implemented on a first plate-shaped member and a second plate-shaped member in an embodiment of the present invention;

[0020] Figure 4 It is a schematic diagram of the welding method implemented on the first round tube and the second round tube in the embodiment of the present invention, wherein the first round tube and the second round tube have been partially welded;

[0021] Figure 5 Schematic diagram of the cross section of the weld after the welding method is implemented in the embodiment of the present invention Figure 1 , wherein the temperature of the liquid solder is lower than the base material (i.e., the melting point of the first metal workpiece and the second metal workpiece);

[0022] Figure 6 Schematic diagram of the cross section of the weld after the welding method is implemented in the embodiment of the present invention Figure 2 , wherein the temperature of the liquid solder is higher than the base material (i.e., the melting point of the first metal workpiece and the second metal workpiece), and the overlapping portion is a schematic diagram of the molten pool between the liquid solder and the metal workpiece;

[0023] Figure 7 Schematic diagram of the cross section of the weld after fusion welding-brazing in the embodiment of the present invention Figure 3 , where the overlapping part is a schematic diagram of the molten pool between the liquid solder and the metal workpiece.

[0024] Reference numerals:

[0025] 100. Heating device;

[0026] 10. Container; 20. Coil;

[0027] 200, first metal workpiece; 210, first surface; 220, first removal portion; 300, second metal workpiece; 310, second surface; 320, second removal portion; 400, liquid solder. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0030] In addition, features defined as “first” or “second” may explicitly or implicitly include one or more such features, and are used to distinguish and describe features, without any distinction in order or importance.

[0031] In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] A welding method according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0034] Reference Figure 1 , according to an embodiment of the present invention, a welding method comprises:

[0035] S2: Control the heating device to heat the soldering material to liquid solder.

[0036] The liquid solder 400 is a liquid solder. For example, the soldering material is solid and the soldering material is heated by the heating device 100 and melted into the liquid solder 400 .

[0037] S3: Controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece, wherein the liquid solder moves along the extension direction of the connection position.

[0038] Among them, the first metal workpiece 200 and the second metal workpiece 300 can be in contact, and the connection position between the first metal workpiece 200 and the second metal workpiece 300 is the space around the contact position between the two. The first metal workpiece 200 and the second metal workpiece 300 can also be in indirect contact, and the space between the two is constructed as the connection position. It can be understood that after the liquid welding material 400 is cooled to solid welding material, the solid welding material is located at the connection position to connect the first metal workpiece 200 and the second metal workpiece 300.

[0039] Specifically, the heating device 100 is a heat source, and the heating device 100 heats the welding raw material into liquid welding material 400. The liquid welding material 400 contacts the first metal workpiece 200 and the second metal workpiece 300. That is to say, the heat source does not directly contact the first metal workpiece 200 and the second metal workpiece 300, so that the heat input of the metal workpieces is controllable, thereby avoiding the problem of excessive heat input, improving the problem of molten pool stirring, facilitating the control of the base material dilution rate, reducing the probability of later cracks, and achieving high-quality welding.

[0040] For example, the liquid solder 400 is in a crucible, and the liquid solder 400 is poured onto the connection position.

[0041] At the same time, the liquid solder 400 moves along the extension direction of the connection position. That is, the connection position has a larger size, and the liquid solder 400 moves while being poured. For example, the liquid solder 400 is in a crucible, and the liquid solder 400 is poured on the connection position while the crucible is moved.

[0042] S4: Cooling the liquid solder to solid solder to connect the first metal workpiece and the second metal workpiece.

[0043] The solid solder is in a solid state, and the temperature of the liquid solder 400 decreases to become the solid solder, and the first metal workpiece 200 is welded to the second metal workpiece 300 .

[0044] In the related art, the direct fusion welding method using a heat source has a high temperature and a high probability of cracks.

[0045] Specifically, in the related art, the fusion welding method has a high temperature, such as laser welding or argon arc welding, and the two metal workpieces are melted and mixed to produce a large amount of intermetallic compounds. For example, aluminum alloy and magnesium alloy produce Al3Mg2 after fusion welding. Intermetallic compounds usually have high hardness and brittleness, which may cause brittle cracking and strength loss in the weld area. During the later cooling, a large amount of intermetallic compounds will produce more cracks.

[0046] The welding method of the embodiment of the present invention controls the temperature of the liquid solder 400 to be higher than the melting point of the first metal workpiece 200, and controls the temperature of the liquid solder 400 to be lower than the melting point of the second metal workpiece 300. The second metal workpiece 300 will not melt, thereby reducing intermetallic compounds and reducing the probability of later cracks. At the same time, the first metal workpiece 200 melts, and the molten first metal workpiece 200 and the liquid solder 400 are mixed with each other, thereby improving the connection stability.

[0047] Reference Figure 5 , Figure 6 and Figure 7 As shown, it can be seen that the welding quality after the welding method of the embodiment of the present invention is implemented is higher.

[0048] According to the welding method of the embodiment of the present invention, by controlling the temperature of the liquid solder 400 to be higher than the melting point of the first metal workpiece 200 and the temperature of the liquid solder 400 to be lower than the melting point of the second metal workpiece 300, the first metal workpiece 200 is melted and mixed into the liquid solder 400, thereby improving the connection stability. At the same time, the second metal workpiece 300 will not melt, thereby reducing intermetallic compounds, reducing the probability of later cracks, and achieving high-quality welding.

[0049] In some embodiments, the liquid solder 400 and the metal workpiece are dissimilar materials, the temperature of the liquid solder 400 is higher than the melting point of the first metal workpiece and lower than the melting point of the second metal workpiece, and fusion welding-brazing is performed to achieve connection. In special cases, when the liquid solder 400 is heated to a very high temperature, which is higher than the melting point or liquidus of the first and second metal workpieces, part of the metal workpieces can also be melted, and connection can be achieved through fusion welding. The dilution rate of the parent material (metal workpiece) can be controlled by controlling the temperature of the liquid solder 400.

[0050] In the related art, the direct fusion welding method using a heat source has a high temperature and a high probability of cracks.

[0051] Specifically, in the related technology, the fusion welding method has a high temperature, such as laser welding or argon arc welding. The two metal workpieces are melted and mixed to produce a large amount of intermetallic compounds, such as Al3Mg2. Intermetallic compounds usually have high hardness and brittleness, which may cause brittle cracking and strength loss in the weld area. During the later cooling, a large amount of intermetallic compounds will produce more cracks.

[0052] The welding method of the embodiment of the present invention controls the temperature of the liquid solder 400 to be higher than the melting point of the first metal workpiece 200, and controls the temperature of the liquid solder 400 to be lower than the melting point of the second metal workpiece 300. The second metal workpiece 300 will not melt, thereby reducing intermetallic compounds and reducing the probability of later cracks. At the same time, the first metal workpiece 200 melts, and the molten first metal workpiece 200 and the liquid solder 400 are mixed with each other, thereby improving the connection stability.

[0053] In other embodiments, the liquid solder 400 and the metal workpiece are dissimilar materials, and the temperature of the liquid solder 400 is higher than the melting point of the metal workpiece, that is, the temperature of the liquid solder is higher than the melting points of the first metal workpiece and the second metal workpiece, and the connection is achieved by fusion welding. The dilution rate of the base material (metal workpiece) can be controlled by controlling the temperature of the liquid solder 400.

[0054] In other embodiments, the liquid solder 400 and the metal workpiece are dissimilar materials, and the temperature of the liquid solder 400 is lower than the melting point of the metal workpiece, that is, the temperature of the liquid solder is lower than the melting points of the first metal workpiece and the second metal workpiece, thereby avoiding the generation of bubbles, thereby improving the crack situation and improving the overall performance.

[0055] It should be noted that the melting point of the solder may be greater than or less than the melting point of the metal workpiece, and the liquid solder 400 may be heated to a temperature higher than the melting point of the metal workpiece.

[0056] In some other embodiments, the liquid solder 400 and the metal workpiece are made of the same material, and the temperature of the liquid solder 400 is controlled to control the dilution rate of the base material and the metal workpiece, that is, to control the melting amount of the metal workpiece, which is also to control the heat input.

[0057] In some embodiments, the connection position between the first metal workpiece 200 and the second metal workpiece 300 is configured as a receiving groove, and controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece includes:

[0058] S31: Control the liquid solder to be poured into the receiving tank.

[0059] A containing groove is provided between the first metal workpiece 200 and the second metal workpiece 300 , and the containing groove is used to contain the liquid solder 400 .

[0060] In the above solution, by providing a receiving tank to receive the liquid solder 400, the liquid solder 400 is prevented from flowing randomly, thereby avoiding waste.

[0061] In other embodiments, the first metal workpiece 200 is overlapped on the second metal workpiece 300, and the liquid solder 400 is poured between the gap between the first metal workpiece 200 and the second metal workpiece 300, which simplifies the operation.

[0062] Reference Figure 3 In some embodiments, the first metal workpiece 200 is configured as a first plate-shaped member, the second metal workpiece 300 is configured as a second plate-shaped member, the edge of the first plate-shaped member facing the second plate-shaped member is configured as a first surface 210, and the edge of the second plate-shaped member facing the first plate-shaped member is configured as a second surface 310, and the first surface 210 and the second surface 310 together define a receiving groove.

[0063] The first plate-like member is a plate-like structure as a whole, the second plate-like member is a plate-like structure as a whole, the first metal workpiece 200 is in contact with the second metal workpiece 300 , and the first surface 210 and the second surface 310 jointly define a receiving groove.

[0064] In the above solution, the first surface 210 and the second surface 310 jointly define the receiving groove, and no additional components are required, which simplifies the structure and reduces the cost.

[0065] For example, the receiving groove is configured as a V-shaped groove, and the first surface 210 and the second surface 310 are two inner walls of the V-shaped groove respectively.

[0066] Of course, it is understandable that the first surface and the second surface can be straight surfaces, the edge of the first plate-like member facing the second plate-like member can also be constructed as a curved surface or other shapes, and the edge of the second plate-like member facing the first plate-like member can also be constructed as a curved surface or other shapes, which will not be repeated here.

[0067] Specifically, during the welding process of the flat plate weld, the plate-like member and the container member 10 are relatively moved to control the matching relationship between the amount of liquid solder 400 flowing into the weld position per unit time and the moving speed of the plate-like member to achieve welding.

[0068] A=S×v

[0069] In the above formula: A is the amount of liquid solder 400 flowing into the weld position per unit time; S is the cross-sectional area of ​​the weld; v is the weld moving speed. The actual weld moving speed can be fine-tuned according to the working conditions.

[0070] Reference Figure 4In other embodiments, the first metal workpiece 200 is configured as a first circular tube, and the second metal workpiece 300 is configured as a second circular tube. A first removal portion is provided at one end of the first circular tube facing the second circular tube, and a second removal portion is provided at one end of the second circular tube facing the first circular tube. The first removal portion and the second removal portion jointly define a receiving groove.

[0071] It can be understood that the outer wall of the complete circular tube is flat, and the groove structure left by the removed part of the circular tube is the removed portion, wherein the first removed portion is the space where the removed part of the first circular tube was originally located, and the second removed portion is the space where the removed part of the second circular tube was originally located, the first removed portion corresponds to and is connected to the second removed portion, and the accommodating groove is the space where the first removed portion and the second removed portion are combined.

[0072] In the above solution, the first removal portion and the second removal portion are provided to define a receiving groove together, and the liquid solder 400 is partially located in the first removal portion and the other part is located in the second removal portion, thereby increasing the contact area and improving the welding stability.

[0073] Specifically, during the annular weld welding process, the annular member and the container member 10 are relatively rotated to control the matching relationship between the amount of liquid solder 400 flowing into the weld position per unit time and the rotation speed of the annular member to achieve welding.

[0074] A=S×w×R

[0075] In the above formula: A is the amount of liquid solder 400 flowing into the weld position per unit time; S is the cross-sectional area of ​​the weld; w is the rotation speed of the ring member, and R is the diameter of the ring member. For thicker welds, R takes the middle value of the weld. The actual rotation speed of the ring member can be fine-tuned according to the working conditions.

[0076] Reference Figure 3 , Figure 4 In some embodiments, the heating device 100 includes: a container 10 and a coil 20, wherein the container 10 is provided with a heating space, and the coil 20 is wound around the outer wall of the container 10 to inductively heat the welding material, and controlling the heating device to heat the welding material to liquid welding material includes:

[0077] S21: The control coil operates to heat the welding raw material into liquid welding material to the set temperature.

[0078] The coil 20 is wound around the outer wall of the container 10. When the coil 20 is powered on, it generates an alternating magnetic field, which induces an electromotive force in the welding material, thereby generating eddy currents inside the welding material. When the eddy currents flow in the welding material, the welding material will be heated up rapidly due to the resistance of the welding material.

[0079] At the same time, a thermocouple is added to the container 10 or the temperature of the liquid solder is measured by a non-contact infrared temperature measurement method (not shown in the figure) to achieve accurate control of the temperature of the liquid solder.

[0080] In the above scheme, the welding raw materials are heated by induction heating by setting the coil 20, which is efficient, fast and accurate, thereby increasing the control over the temperature of the liquid solder 400. The embodiment of the present invention provides a welding method for controlling the dilution rate of the weld, which is convenient for the later control of the weld dilution rate and is beneficial to improving the problem of cracks.

[0081] Specifically, the first metal workpiece 200 and the second metal workpiece 300 are parent materials, and the weld dilution rate (DilutionRate) refers to the proportion of the parent material melted and mixed into the filler metal (solid welding material) during welding. The dilution rate reflects the influence of the parent material on the chemical composition and performance of the weld, and is an important parameter for evaluating welding quality.

[0082] Of course, the heating device 100 can also be other containers or other heat sources, as long as the liquid metal can be heated to the required temperature and the container can ensure the stability of the structure.

[0083] In some specific embodiments, the set temperature is greater than the melting point of the first metal workpiece 200 , and the set temperature is less than the melting point of the second metal workpiece 300 .

[0084] In some embodiments, a liquid cooling channel is provided on the container 10, and the liquid cooling channel is connected to the cooling medium supply member, and controlling the heating device to heat the welding raw material to the liquid welding material further includes:

[0085] S22: Control the cooling medium supply component to supply cooling medium to the liquid cooling channel to cool the liquid solder to a set temperature.

[0086] Among them, the cooling medium supply component supplies cooling medium to the liquid cooling channel. The cooling medium can be water, oil, ethylene glycol solution, etc. The cooling medium flows in the liquid cooling channel to cool the container component 10, thereby indirectly cooling the liquid solder 400 to achieve control of the temperature of the liquid solder 400.

[0087] In the above scheme, the liquid solder 400 is cooled by liquid cooling to control the temperature of the liquid solder 400, thereby improving the control ability. When the liquid solder 400 is overheated, the liquid solder 400 is cooled to avoid excessive temperature loss of the alloy elements in the first metal workpiece 200, the second metal workpiece 300 and the liquid solder 400, thereby further improving the accuracy and welding quality.

[0088] In some other embodiments, controlling the heating device to heat the solder material to liquid solder further comprises:

[0089] S23: Control the air cooling device to operate, guide the air flow to the heating space, and control the liquid solder to a set temperature.

[0090] The air cooling device generates a flowing airflow when in operation, and the flowing airflow blows to the liquid solder 400 to cool the liquid solder 400 .

[0091] In the above scheme, the liquid solder 400 is cooled by air cooling to control the temperature of the liquid solder 400, thereby improving the control ability. The liquid solder 400 is cooled when it is overheated, thereby avoiding excessive temperature loss of the alloy elements in the first metal workpiece 200, the second metal workpiece 300 and the liquid solder 400, and further improving the accuracy and welding quality. In addition, the air cooling method is simple, low-cost and easy to implement.

[0092] In some embodiments, a thermocouple is provided on the container 10, the thermocouple is electrically connected to the control component, the control component is electrically connected to the coil 20, the control component is electrically connected to the cooling medium supply component or the air cooling device, and controlling the heating device to heat the welding raw material to the liquid welding material also includes:

[0093] S24: According to the detection information of the thermocouple, one of the control coil, the cooling medium supply component and the air cooling device is controlled to work, and the liquid solder is adjusted to the set temperature.

[0094] Among them, the thermocouple is installed on the container part 10, and the thermocouple obtains the temperature of the liquid solder 400. The detection information includes the temperature. The thermocouple transmits the detection information to the control part. The control part controls the coil 20 to heat the liquid solder 400 according to the detection information, or controls one of the cooling medium supply part and the air cooling device to work to cool the liquid solder 400 to prevent the liquid solder 400 from overheating or overcooling.

[0095] In the above solution, by setting a thermocouple to detect the temperature of the liquid solder 400 , the accuracy of controlling the temperature of the liquid solder 400 is improved, and the liquid solder 400 is precisely controlled.

[0096] In other embodiments, the coil 20 is electrically connected to the control element, the control element is electrically connected to the cooling medium supply element or the air cooling device, the control element is electrically connected to the infrared detection device, and controlling the heating device to heat the welding raw material to the liquid welding material also includes:

[0097] S25: Control the infrared detection device to detect the temperature of the liquid solder, and control one of the coil, the cooling medium supply component, and the air cooling device to operate according to the detection information of the infrared detection device to adjust the liquid solder to the set temperature.

[0098] Among them, the infrared detection device is used to obtain the temperature of the liquid solder 400, and the detection information includes the temperature. The infrared detection device transmits the detection information to the control component. The control component controls the coil 20 to energize and heat the liquid solder 400 according to the detection information, or controls one of the cooling medium supply component and the air cooling device to work to cool the liquid solder 400 to prevent the liquid solder 400 from overheating or overcooling.

[0099] In the above scheme, an infrared detection device is provided to detect the temperature of the liquid solder 400, thereby improving the accuracy of controlling the temperature of the liquid solder 400 and accurately controlling the liquid solder 400. The infrared detection device detects the temperature in a non-contact manner, thereby avoiding the influence of excessive temperature on the infrared detection device and increasing the service life.

[0100] In some embodiments, controlling the liquid solder to the connection point between the first metal workpiece and the second metal workpiece further includes:

[0101] S32: Control the nozzle of the protective gas supply device to correspond to the liquid solder to generate a protective barrier around the liquid solder.

[0102] Among them, the protective gas supply device has a nozzle, and the protective gas is sprayed out from the nozzle. The protective gas is sprayed in the direction of the liquid solder 400. The protective gas surrounds the liquid solder 400 to form a protective barrier. The protective barrier isolates the liquid solder 400 from the external atmospheric environment to avoid chemical reactions, thereby increasing the stability of the liquid solder 400 and improving the welding quality.

[0103] For example, the shielding gas is argon or other inert gas that does not react with the liquid metal to avoid chemical reactions. Or others, such as nitrogen.

[0104] In some other embodiments, controlling the liquid solder to the connection point between the first metal workpiece and the second metal workpiece further includes:

[0105] S33: In the sealed space, controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece, wherein the sealed space is configured as a vacuum space, or the sealed space is configured as an inert gas space.

[0106] The first metal workpiece 200 and the second metal workpiece 300 are welded in a sealed space, and the sealed space can be evacuated to form a vacuum space, or an inert gas can be filled into the sealed space to form an inert gas space.

[0107] In the above scheme, by welding in a vacuum space or welding in an inert gas space, external interference to welding is reduced, thereby improving welding quality.

[0108] In some embodiments, cooling the liquid solder to a solid solder includes:

[0109] S41: Guide the cooling medium to cool the liquid solder into solid solder.

[0110] The cooling medium cools the liquid solder 400 , and the liquid solder 400 is cooled and solidified into a solid solder.

[0111] In the above solution, by providing a cooling medium to cool the liquid solder 400, the cooling efficiency is improved and the soldering time is shortened.

[0112] In some embodiments, cooling the liquid solder to a solid solder further comprises:

[0113] S42: Control the pressurizing device to apply pressure to the solid solder.

[0114] Among them, the pressure device applies pressure to the solid welding material to achieve the purpose of rolling or forging.

[0115] In the above scheme, a pressure-applying device is provided to apply pressure to the surface of the super-solid welding material, so as to achieve the purpose of rolling or forging, thereby increasing the density of the weld and the interface bonding performance.

[0116] Other structures and operations of the welding method according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0117] In the description of this specification, the description with reference to the terms "embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0118] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A welding method, characterized in that: include: Controlling the heating device to heat the welding raw material into liquid welding material; Controlling the liquid solder to a connection position between the first metal workpiece and the second metal workpiece, wherein the liquid solder moves along an extension direction of the connection position; The liquid solder is cooled to a solid solder to connect the first metal workpiece and the second metal workpiece.

2. The welding method according to claim 1, characterized in that: The connection position is configured as a receiving groove, and controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece includes: controlling the liquid solder to be poured into the receiving groove.

3. The welding method according to claim 2, characterized in that: The first metal workpiece is configured as a first plate-shaped member, the second metal workpiece is configured as a second plate-shaped member, the edge of the first plate-shaped member facing the second plate-shaped member is configured as a first surface, the edge of the second plate-shaped member facing the first plate-shaped member is configured as a second surface, and the first surface and the second surface jointly define the accommodating groove; or, the first metal workpiece is configured as a first circular tube, the second metal workpiece is configured as a second circular tube, the first circular tube is provided with a first removal portion at one end facing the second circular tube, and the second circular tube is provided with a second removal portion at one end facing the first circular tube, and the first removal portion and the second removal portion jointly define the accommodating groove.

4. The welding method according to claim 1, characterized in that: The heating device comprises: a container and a coil, wherein a heating space is provided in the container, and the coil is wound around the outer wall of the container to inductively heat the welding material, and the controlling heating device to heat the welding material to liquid welding material comprises: The coil is controlled to work, and the welding raw material is heated to a liquid welding material and to a set temperature.

5. The welding method according to claim 4, characterized in that: The container is provided with a liquid cooling channel, the liquid cooling channel is connected to a cooling medium supply component, and the controlling the heating device to heat the welding raw material to a liquid welding material further comprises: controlling the cooling medium supply component to supply cooling medium to the liquid cooling channel, cooling the liquid welding material to the set temperature; or, The controlling the heating device to heat the welding raw material to liquid welding material also includes: The air cooling device is controlled to work and the air flow is guided to the heating space to control the liquid solder to the set temperature.

6. The welding method according to claim 5, characterized in that: The container is provided with a thermocouple, the thermocouple is electrically connected to the control component, the control component is electrically connected to the coil, the control component is electrically connected to the cooling medium supply component or the air cooling device, and the control heating device heats the welding raw material to liquid welding material and further includes: According to the detection information of the thermocouple, one of the coil, the cooling medium supply component and the air cooling device is controlled to operate, and the liquid solder is adjusted to the set temperature.

7. The welding method according to claim 5, characterized in that: The coil is electrically connected to the control member, the control member is electrically connected to the cooling medium supply member or the air cooling device, the control member is electrically connected to an infrared detection device, and the control heating device heats the welding raw material to liquid welding material and further comprises: The infrared detection device is controlled to detect the temperature of the liquid solder, and according to the detection information of the infrared detection device, one of the coil, the cooling medium supply component and the air cooling device is controlled to operate so as to adjust the liquid solder to the set temperature.

8. The welding method according to claim 1, characterized in that: The controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece further comprises: Controlling the nozzle of the protective gas supply device to correspond to the liquid solder to generate a protective barrier around the liquid solder; or controlling the liquid solder to the connection position between the first metal workpiece and the second metal workpiece further includes: In a sealed space, the liquid solder is controlled to flow to the connection point between the first metal workpiece and the second metal workpiece, wherein the sealed space is configured as a vacuum space or as a protective gas space.

9. The welding method according to claim 1, characterized in that: The cooling of the liquid solder to a solid solder comprises: A cooling medium is guided to cool the liquid solder so that the liquid solder solidifies into a solid solder.

10. The welding method according to claim 1, characterized in that: The cooling of the liquid solder to a solid solder further comprises: The pressurizing device is controlled to pressurize the solid solder.

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