Grinding equipment

Abstract

The invention provides grinding equipment, and belongs to the technical field of semiconductors. Comprising a support; the rotating assembly comprises a shaft sleeve and a grinding main shaft, and the shaft sleeve is fixedly installed on the support and arranged on the grinding main shaft in a sleeving mode; the grinding wheel is fixedly connected with the grinding main shaft; the wafer bearing table is used for placing a silicon wafer to be processed; the driving mechanism is used for driving the grinding main shaft to drive the grinding wheel to rotate so as to grind the silicon wafer; the angle detection mechanism is connected with the grinding main shaft, and the angle detection mechanism is used for detecting angle data between the axis of the grinding main shaft and the axis of the wafer bearing table; and the angle adjusting mechanism is respectively connected with the angle detection mechanism and the grinding main shaft and is used for acquiring the angle data and calibrating the grinding main shaft according to the angle data. According to the technical scheme, the angle of the grinding spindle can be automatically calibrated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a grinding device. Background Art

[0002] At present, the quality of the crystal rod is usually tested by sampling the wafer at a fixed position of the crystal rod and then testing it.

[0003] Among them, before the wafer is tested (such as defects, minority carrier lifetime, carbon oxygen value, EG, Res, etc.), it is necessary to first perform a thinning process on the wafer sample. This process particularly involves equipment for grinding the wafer sample. The processing principle of this equipment is: the grinding spindle cooperates with the wafer support table (5) to rotate with each other to achieve thinning of the wafer sample.

[0004] The angle between the grinding spindle of the grinding equipment and the wafer stage will seriously affect the total thickness variation (TTV) of the wafer surface and the size of the damaged layer, so this angle needs to be strictly controlled. In practical applications, the grinding spindle of the equipment needs to be calibrated regularly to ensure the stability of the equipment processing.

[0005] However, the prior art usually adopts a manual calibration method, that is, using tools such as micrometers and wrenches to manually calibrate the equipment. This method is time-consuming and labor-intensive, and there may still be slight errors after calibration, which will subsequently affect the pattern on the surface of the processed sample, resulting in deviations in subsequent inspections, and will also have an adverse effect on the life of the spindle grinding wheel. Summary of the invention

[0006] The invention provides a grinding device capable of automatically calibrating the angle of a grinding spindle.

[0007] In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:

[0008] A grinding device, comprising:

[0009] Bracket;

[0010] The rotating assembly comprises: a shaft sleeve and a grinding spindle, wherein the shaft sleeve is fixedly mounted on the bracket and sleeved on the grinding spindle;

[0011] A grinding wheel, fixedly connected to the grinding spindle;

[0012] Wafer stage, used to place silicon wafers to be processed;

[0013] A driving mechanism, used for driving the grinding spindle to drive the grinding wheel to rotate, so as to grind the silicon wafer;

[0014] An angle detection mechanism connected to the grinding spindle, the angle detection mechanism is used to detect the angle data between the axis of the grinding spindle and the axis of the wafer stage;

[0015] The angle adjustment mechanism is connected to the angle detection mechanism and the grinding spindle respectively, and is used to obtain the angle data and calibrate the grinding spindle according to the angle data.

[0016] In some embodiments, the angle detection mechanism includes:

[0017] A first telescopic assembly, disposed on the grinding spindle;

[0018] a second telescopic assembly, arranged on the first telescopic assembly;

[0019] a first connecting rod, a first end of which is movably connected to the first telescopic assembly;

[0020] An angle detection probe is installed at the second end of the first connecting rod, and the angle detection probe is used to detect the angle data of the grinding spindle;

[0021] a second connecting rod, wherein a movable end of the second connecting rod is connected to the second telescopic assembly, and a fixed end of the second connecting rod is connected to the first connecting rod;

[0022] When the first telescopic assembly telescopes in the vertical direction, it drives the first connecting rod to move in the vertical direction, and the vertical direction is perpendicular to the horizontal plane;

[0023] When the second telescopic assembly performs telescopic movement in the vertical direction, it drives the first connecting rod to perform folding movement or unfolding movement relative to the first telescopic assembly.

[0024] In some embodiments, the first telescopic component includes:

[0025] a first cylinder barrel, a first piston and a first piston rod;

[0026] Wherein, the first piston is disposed in the first cylinder barrel;

[0027] The first end of the first piston rod is connected to the first piston, and the second end of the first piston rod is movably connected to the first end of the first connecting rod;

[0028] When the first piston moves in the first cylinder barrel, it drives the first piston rod to perform telescopic movement relative to the first cylinder barrel.

[0029] In some embodiments, the second telescopic assembly is disposed on the first piston rod, and the second telescopic assembly includes:

[0030] a second cylinder barrel, a second piston, and a second piston rod;

[0031] Wherein, the second piston is disposed in the second cylinder barrel;

[0032] The first end of the second piston rod is connected to the second piston;

[0033] The movable end of the second connecting rod is connected to the second piston rod;

[0034] When the second piston moves in the second cylinder barrel, it drives the second piston rod to perform telescopic movement relative to the second cylinder barrel, so as to drive the first connecting rod to perform folding movement or unfolding movement relative to the first piston rod.

[0035] In some embodiments, a receiving space with one end open is provided in the grinding spindle along the axis of the grinding spindle, and the opening direction faces the grinding wheel;

[0036] Wherein, the first cylinder barrel and the second cylinder barrel are both installed in the accommodating space;

[0037] The first piston rod and the second piston rod are arranged along the axis of the grinding spindle.

[0038] In some embodiments, a mounting channel is provided in the grinding wheel along the axis of the grinding wheel;

[0039] When the first piston rod performs telescopic movement relative to the first cylinder barrel, the first connecting rod is driven to extend to the outside of the grinding wheel or to be retracted into the installation channel.

[0040] In some embodiments, the grinding spindle is provided with an adjusting screw, and the adjusting screw comprises:

[0041] Nuts and bolts;

[0042] Wherein, the nut is fixed on the grinding spindle;

[0043] The first end of the bolt is inserted into the nut, and the second end of the bolt is connected to the angle adjustment mechanism.

[0044] In some embodiments, the angle adjustment mechanism includes:

[0045] The transmission gear comprises: a driving wheel and a driven wheel, the driving wheel and the driven wheel are meshed, and the driven wheel is connected to the second end of the bolt;

[0046] A servo motor, wherein the output shaft of the servo motor is connected to the driving wheel;

[0047] Wherein, the servo motor is used to drive the driving wheel to drive the driven wheel to rotate, so as to drive the bolt to rotate in the nut.

[0048] In some embodiments, a mounting hole is provided on the shaft sleeve, and the second end of the bolt passes through the mounting hole and is connected to the driven wheel.

[0049] In some embodiments, when the angle adjustment mechanism is used to calibrate the grinding spindle according to the angle data, it is specifically used to:

[0050] Determining a step angle corresponding to the servo motor according to the angle data and preset angle data;

[0051] A target signal is sent to the servo motor, where the target signal is used to control the servo motor to rotate according to the step angle to calibrate the grinding spindle.

[0052] The beneficial effects of the present invention are:

[0053] In this embodiment, the grinding device is provided with an angle detection mechanism and an angle adjustment mechanism, wherein the angle detection mechanism can detect the angle data between the axis of the grinding spindle and the axis of the wafer stage, and the angle adjustment mechanism can obtain the angle data and calibrate the grinding spindle according to the angle data. In this way, the angle of the grinding spindle can be automatically calibrated, which improves the calibration efficiency and accuracy, thereby ensuring the grinding accuracy of the grinding device. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic diagram showing the structure of a grinding device according to an embodiment of the present invention;

[0055] Figure 2 A schematic diagram showing the structure of an angle detection mechanism and a wafer stage according to an embodiment of the present invention;

[0056] Figure 3 A schematic diagram showing the structure of a grinding wheel and a wafer carrier according to an embodiment of the present invention;

[0057] Figure 4 A schematic diagram showing the structure of a rotating assembly and an angle adjustment mechanism according to an embodiment of the present invention;

[0058] Figure 5 A schematic diagram showing the trajectory of the angle detection mechanism on the wafer stage according to an embodiment of the present invention;

[0059] Figure 6 A schematic diagram showing the working principle of the grinding device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0061] There are many defects in the existing manual calibration of the grinding spindle. For example, manual calibration relies on human visual judgment, which is affected by factors such as light, angle, and reflection, making it difficult to ensure the accuracy of calibration, resulting in poor grinding accuracy. Moreover, before the wafer undergoes back-end inspection (Res, defects, minority carrier lifetime, EG), it must first undergo grinding. The traces on the grinding surface will directly affect the etched surface, thereby affecting the accuracy of the inspection data.

[0062] In order to solve the above technical problems, an embodiment of the present invention provides a grinding device that can automatically calibrate the angle of the grinding spindle.

[0063] like Figure 1 As shown, an embodiment of the present invention provides a grinding device, comprising:

[0064] A bracket 1, a rotating assembly, a grinding wheel 4, a wafer carrier 5, a driving mechanism, an angle detection mechanism and an angle adjustment mechanism.

[0065] The rotating assembly includes: a sleeve 2 and a grinding spindle 3 . The sleeve 2 is fixedly mounted on the bracket 1 and sleeved on the grinding spindle 3 .

[0066] The grinding wheel 4 is fixedly connected to the grinding spindle 3 .

[0067] The wafer stage 5 is used to place the silicon wafer to be processed.

[0068] The driving mechanism is used to drive the grinding spindle 3 to drive the grinding wheel 4 to rotate so as to grind the silicon wafer.

[0069] The angle detection mechanism is connected to the grinding spindle 3 , and is used to detect the angle data between the axis of the grinding spindle 3 and the axis of the wafer stage 5 .

[0070] The angle adjustment mechanism is connected to the angle detection mechanism and the grinding spindle 3 respectively, and is used to obtain the angle data and calibrate the grinding spindle 3 according to the angle data.

[0071] In this embodiment, the grinding device is provided with an angle detection mechanism and an angle adjustment mechanism, wherein the angle detection mechanism can detect the angle data between the axis of the grinding spindle and the axis of the wafer stage, and the angle adjustment mechanism can obtain the angle data and calibrate the grinding spindle according to the angle data. In this way, the angle of the grinding spindle can be automatically calibrated, which improves the calibration efficiency and accuracy, thereby ensuring the grinding accuracy of the grinding device.

[0072] like Figure 2-Figure 3 As shown, in some embodiments, the angle detection mechanism includes: a first telescopic assembly 6, a second telescopic assembly 7, a first connecting rod 8, an angle detection probe 9 and a second connecting rod 10.

[0073] The first telescopic component 6 is arranged on the grinding spindle 3 ; the second telescopic component 7 is arranged on the first telescopic component 6 .

[0074] The first end of the first connecting rod 8 is movably connected to the first telescopic assembly 6 ; the angle detection probe 9 is installed at the second end of the first connecting rod 8 , and the angle detection probe 9 is used to detect the angle data of the grinding spindle 3 .

[0075] The second connecting rod 10 , the movable end 1001 of the second connecting rod 10 is connected to the second telescopic assembly 7 , and the fixed end 1002 of the second connecting rod 10 is connected to the first connecting rod 8 .

[0076] When the first telescopic component 6 performs telescopic movement in the vertical direction, it drives the first connecting rod 8 to move in the vertical direction, and the vertical direction is perpendicular to the horizontal plane; when the second telescopic component 7 performs telescopic movement in the vertical direction, it drives the first connecting rod 8 to fold or unfold relative to the first telescopic component 6.

[0077] In this embodiment, the first connecting rod 8 can be controlled through the telescopic movement of the first telescopic assembly 6 and the first connecting rod 8, thereby controlling the position of the angle detection probe 9 on the first connecting rod 8, thereby detecting and obtaining the angle data between the axis of the grinding spindle 3 and the axis of the wafer table 5.

[0078] like Figure 2 As shown, in a specific example, the first telescopic assembly 6 includes: a first cylinder barrel 601, a first piston and a first piston rod 602. The first piston is arranged in the first cylinder barrel 601; the first end of the first piston rod 602 is connected to the first piston, and the second end of the first piston rod 602 is movably connected to the first end of the first connecting rod 8; when the first piston moves in the first cylinder barrel 601, it drives the first piston rod 602 to perform telescopic movement relative to the first cylinder barrel 601.

[0079] It should be noted that the structure of the first telescopic assembly 6 in this embodiment is only an optional example, and only the main components of the first telescopic assembly 6 are described. It can be understood that the specific composition of the first telescopic assembly 6 is not limited to this example. In some optional embodiments of the present invention, the first telescopic assembly 6 can be specifically a first cylinder. The structure and working principle of the first telescopic assembly 6 can refer to the cylinder, and will not be repeated here.

[0080] In this embodiment, when the first piston moves in the first cylinder 601, it drives the first piston rod 602 to perform telescopic movement relative to the first cylinder 601. For example, when the first piston rod 602 moves downward, under the action of the first telescopic assembly 6, the first connecting rod 8 connected to the first piston rod 602 moves downward accordingly, and the first connecting rod 8 gradually extends out of the grinding spindle 3.

[0081] like Figure 4 As shown, in a specific example, the second telescopic assembly 7 is arranged on the first piston rod 602, and the second telescopic assembly 7 includes: a second cylinder barrel 701, a second piston and a second piston rod 702. The second piston is arranged in the second cylinder barrel 701; the first end of the second piston rod 702 is connected to the second piston; the moving end 1001 of the second connecting rod 10 is connected to the second piston rod 702; when the second piston moves in the second cylinder barrel 701, it drives the second piston rod 702 to perform telescopic movement relative to the second cylinder barrel 701, so as to drive the first connecting rod 8 to perform folding movement or unfolding movement relative to the first piston rod 602.

[0082] It should be noted that, in some optional embodiments of the present invention, the second telescopic assembly 7 may be a second cylinder, and its structure and working principle are similar to those of the first cylinder, which will not be described in detail here.

[0083] In this embodiment, when the second piston moves in the second cylinder barrel 701, it drives the second piston rod 702 to perform telescopic movement relative to the second cylinder barrel 701. Since the movable end 1001 of the second connecting rod 10 is connected to the second piston rod 702, the movable end 1001 of the second connecting rod 10 will move with the second piston rod 702, and the fixed end 1002 of the second connecting rod 10 is connected to the first connecting rod 8. Therefore, when the second piston rod 702 performs telescopic movement (that is, when it moves up and down in the vertical direction), it will drive the first connecting rod 8 to perform folding movement or unfolding movement relative to the first piston rod 602. Among them, when the second piston rod 702 moves downward, the angle between the first connecting rod 8 and the first piston rod 602 gradually increases, that is, the first connecting rod 8 gradually unfolds relative to the first piston rod 602; on the contrary, when the second piston rod 702 moves downward, the first connecting rod 8 gradually retracts (i.e., folds) relative to the first piston rod 602.

[0084] In some embodiments, a receiving space with one end opened is provided in the grinding spindle 3 along the axis of the grinding spindle 3, and the opening direction faces the grinding wheel 4. The first cylinder barrel 601 and the second cylinder barrel 701 are both installed in the receiving space; the first piston rod 602 and the second piston rod 702 are arranged along the axis of the grinding spindle 3.

[0085] In some embodiments, an installation channel is opened inside the grinding wheel 4 along the axis of the grinding wheel 4; wherein, when the first piston rod 602 performs telescopic movement relative to the first cylinder barrel 601, it drives the first connecting rod 8 to extend to the outside of the grinding wheel 4 or retract to the installation channel.

[0086] In a specific example, an adjusting screw 301 is provided on the grinding spindle 3, and the adjusting screw 301 includes: a nut 3011 and a bolt 3012; wherein the nut 3011 is fixed on the grinding spindle 3; the first end of the bolt 3012 is passed through the nut 3011, and the second end of the bolt 3012 is connected to the angle adjustment mechanism.

[0087] It should be noted that if Figure 1 As shown, the grinding spindle 3 includes: a fixed part 302 and a rotating part 303, the fixed part 302 is sleeved on the rotating part 303, the shaft sleeve 2 is sleeved on the fixed part 302, the adjusting screw 301 is arranged on the outer surface of the fixed part 302, and the grinding wheel 4 is installed on the rotating part 303. When the grinding equipment is working, the driving mechanism drives the rotating part 303 to rotate in the fixed part 302, driving the grinding wheel 4 to rotate, so as to grind the silicon wafer placed on the wafer stage 5.

[0088] In some embodiments, the angle adjustment mechanism includes: a transmission gear 11 and a servo motor 12 .

[0089] The transmission gear 11 includes a driving wheel 1101 and a driven wheel 1102 . The driving wheel 1101 and the driven wheel 1102 are meshed with each other, and the driven wheel 1102 is connected to the second end of the bolt 3012 .

[0090] A servo motor 12 , wherein the output shaft of the servo motor 12 is connected to the driving wheel 1101 ; wherein the servo motor 12 is used to: drive the driving wheel 1101 to drive the driven wheel 1102 to rotate, so as to drive the bolt 3012 to rotate in the nut 3011 .

[0091] In this embodiment, the servo motor 12 can drive the driving wheel 1101 to rotate, drive the driven wheel 1102 to rotate, and thus drive the bolt 3012 to rotate in the nut 3011 to tighten or loosen the adjusting screw 301. When the adjusting screw 301 is gradually tightened, the force of the bolt 3012 on the nut 3011 to drag downward gradually increases; when the adjusting screw 301 is loosened, the force decreases accordingly. Since the adjusting screw 301 is set on the fixing portion 302 of the grinding spindle 3, by tightening or loosening the adjusting screw 301, it can act on the fixing portion 302 of the grinding spindle 3, thereby adjusting the setting angle of the grinding spindle 3 and realizing the calibration of the grinding spindle 3.

[0092] In some embodiments, a mounting hole is provided on the shaft sleeve 2 , and the second end of the bolt 3012 passes through the mounting hole and is connected to the driven wheel 1102 .

[0093] Here, the mounting hole on the sleeve 2 can limit the bolt 3012 and strengthen the stability of the connection between the bolt 3012 and the rotating assembly, providing support for the adjusting screw 301 to adjust the grinding spindle 3.

[0094] In some embodiments, when the angle adjustment mechanism is used to calibrate the grinding spindle 3 according to the angle data, it is specifically used to: determine the step angle corresponding to the servo motor 12 according to the angle data and preset angle data; send a target signal to the servo motor 12, and the target signal is used to control the servo motor 12 to rotate according to the step angle to calibrate the grinding spindle 3.

[0095] In this embodiment, the angle adjustment mechanism can process the angle data obtained by the angle detection mechanism, and determine the step angle corresponding to the servo motor 12 with reference to the preset angle data, that is, determine the angle at which the servo motor 12 needs to be controlled to rotate in order to calibrate the grinding spindle 3. In this way, a target signal can be sent to the servo motor 12 to control the servo motor 12 to rotate according to the step angle, thereby achieving the purpose of calibrating the grinding spindle 3.

[0096] The following is a specific example of the solution provided in the embodiments of the present application.

[0097] In a specific example, a display may be provided for relevant staff to view the calibration process of the grinding equipment. The process may be specifically divided into two stages: an automatic detection stage and an automatic calibration stage. For example, in the display page of the display, a detection window and / or a calibration window of the grinding spindle angle may be displayed.

[0098] (I) Automatic detection stage:

[0099] The staff can start the detection function by clicking the automatic spindle angle detection button, and the angle detection mechanism starts working.

[0100] Specifically, after the detection function is activated, the first telescopic assembly 6 starts to work: when the first piston moves in the first cylinder 601, it drives the first piston rod 602 to perform telescopic movement relative to the first cylinder 601 (please refer to Figure 1 , specifically refers to the downward movement of the first piston rod 602). Under the action of the first telescopic assembly 6, the first connecting rod 8 connected to the first piston rod 602 moves downward accordingly, and the first connecting rod 8 gradually extends out of the grinding spindle 3 and passes through the installation channel in the grinding wheel 4 until the moving end 1001 of the second connecting rod 10 is exposed outside the grinding wheel 4; then, the second telescopic assembly 7 starts to work: when the second piston moves in the second cylinder barrel 701, it drives the second piston rod 702 to perform telescopic movement relative to the second cylinder barrel 701 (please refer to Figure 1 , specifically referring to the upward movement of the second piston rod 702), since the movable end 1001 of the second connecting rod 10 is connected to the second piston rod 702, the movable end 1001 of the second connecting rod 10 will move upward with the second piston rod 702, and the fixed end 1002 of the second connecting rod 10 is connected to the first connecting rod 8, so when the second piston rod 702 moves upward in the vertical direction, it will drive the first connecting rod 8 to fold relative to the first piston rod 602.

[0101] In this way, through the action of the first telescopic component 6 and the second telescopic component 7, the high-precision angle detection probe 9 can be adjusted to the center position of the wafer stage 5. After that, the grinding spindle 3 is started, so that the rotating part 303 of the grinding spindle 3 can rotate, driving the first connecting rod 8 to rotate, so that the angle detection probe 9 will move with the first connecting rod 8 (passing through the center of the wafer stage 5) to detect the angle data corresponding to each position passed by the angle detection probe 9. In addition, if Figure 6 As shown, the angle data detected by the angle detection probe 9 can be displayed on the interface of the display through the screen angle display module, which is convenient for relevant personnel to observe.

[0102] (II) Automatic calibration stage:

[0103] The staff clicks the spindle angle automatic calibration button to start the calibration function and the angle adjustment mechanism will work.

[0104] Specifically, key data can be screened out from the angle data detected by the angle detection probe 9 (i.e., the angle detection head), for example, Figure 5 As shown, when the first connecting rod 8 rotates, the track of the angle detection probe 9 on the wafer stage 5 is S, wherein the key points on the wafer stage 5 are: A, B, C, D, E, and the angle data corresponding to these points are: a, b, c, d, e, respectively, and a, b, c, d, e are used as key data. Among them, point A is the point when the angle detection probe 9 just touches the wafer stage 5; point B is the intersection of the track S of the angle detection probe 9 and the radius center of the wafer stage 5; point C is the center point of the wafer stage 5; point D is the intersection of the track S of the angle detection probe 9 and the radius center of the wafer stage 5; point E is the point when the angle detection probe 9 is about to leave the wafer stage 5 (that is, the intersection of the track S and the edge of the wafer stage 5).

[0105] like Figure 6 As shown, the angle adjustment mechanism can process the key data (a, b, c, d, e) (that is, the angle values ​​corresponding to points A, B, C, D, and E respectively) and the built-in target angle {that is, the preset angle data, generally (0, 0, 0, -15, -30)} by the algorithm through the data processing module, and transmit the command output by the algorithm (that is, the target signal) to the PLC (that is, the PLC module); the PLC transmits the target signal to the servo motor 12 (that is, the servo driver). After receiving the target signal, the servo motor 12 rotates the corresponding step angle, and under the action of the transmission gear 11, the angle of the grinding spindle 3 (that is, the angle between the axis of the grinding spindle 3 and the axis of the wafer table 5) will be adjusted to the target angle. In addition, after the adjustment, the PLC will feedback a signal to the servo motor 12, indicating that the grinding spindle 3 has been adjusted to the right position. At this time, the calibration of the grinding spindle 3 is completed, and the corresponding digital signal (that is, the target angle) can also be output on the interface of the display.

[0106] It should be noted that the current wafer detection equipment mainly uses lasers, probes and other methods, and the detection data is easily affected by the wafer surface, and the requirements for the wafer surface are relatively high. In the embodiment of the present invention, real-time automatic detection and calibration of the grinding spindle 3 are realized, the detection accuracy and calibration accuracy are improved, which is more accurate and reliable than the manual calibration method, ensuring the stability of the grinding equipment processing, and can effectively reduce the difference between the center thickness and the edge thickness of the wafer surface. Therefore, the TTV and damage layer of the wafer surface are reduced, and the grinding surface accuracy is significantly improved, and the measurement accuracy is higher. Among them, the relevant information in the calibration process can be displayed to relevant personnel through a display, realizing visual calibration of the grinding equipment.

[0107] It should be noted that in the prior art, when manually calibrating the grinding spindle, multiple adjustments are usually required to achieve the desired effect, and each adjustment requires the grinding wheel to be corrected, resulting in consumption of the grinding wheel thickness. In the embodiment of the present invention, automatic calibration of the grinding spindle is achieved, which can effectively save grinding wheel consumption and increase the service life of the grinding wheel.

[0108] In addition, in the manual calibration method, processing tests are required after each adjustment. The samples processed in this process are invalid outputs, and such repeated adjustments and multiple processing tests will waste a lot of time and affect the processing capacity of the equipment. In the embodiment of the present invention, the program only needs to execute an automatic adjustment action once to automatically calibrate the grinding spindle of the grinding equipment, which can save a lot of time and effectively improve the processing efficiency of the grinding equipment. In addition, during the manual calibration process, the staff needs to use their hands to operate under the grinding spindle, which poses certain safety hazards. The automatic adjustment of the grinding spindle by the grinding equipment can effectively avoid the risk of personal injury and improve the safety performance of the grinding equipment.

[0109] In the embodiment of the present invention, the grinding device is provided with an angle detection mechanism and an angle adjustment mechanism, wherein the angle detection mechanism can detect the angle data between the axis of the grinding spindle and the axis of the wafer stage, and the angle adjustment mechanism can obtain the angle data and calibrate the grinding spindle according to the angle data. In this way, the angle of the grinding spindle can be automatically calibrated, which improves the calibration efficiency and accuracy, thereby ensuring the grinding accuracy of the grinding device.

[0110] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0111] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0112] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0113] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0114] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A grinding device, characterized in that: include: Bracket (1); The rotating assembly comprises: a shaft sleeve (2) and a grinding spindle (3), wherein the shaft sleeve (2) is fixedly mounted on the bracket (1) and sleeved on the grinding spindle (3); A grinding wheel (4) fixedly connected to the grinding spindle (3); A wafer stage (5) for placing silicon wafers to be processed; A driving mechanism, used for driving the grinding spindle (3) to drive the grinding wheel (4) to rotate, so as to grind the silicon wafer; An angle detection mechanism connected to the grinding spindle (3), the angle detection mechanism being used to detect angle data between the axis of the grinding spindle (3) and the axis of the wafer stage (5); The angle adjustment mechanism is connected to the angle detection mechanism and the grinding spindle (3) respectively, and is used to obtain the angle data and calibrate the grinding spindle (3) according to the angle data.

2. The grinding device according to claim 1, characterized in that The angle detection mechanism comprises: A first telescopic assembly (6) is arranged on the grinding spindle (3); A second telescopic component (7) is arranged on the first telescopic component (6); a first connecting rod (8), wherein a first end of the first connecting rod (8) is movably connected to the first telescopic assembly (6); An angle detection probe (9) is installed at the second end of the first connecting rod (8), and the angle detection probe (9) is used to detect angle data of the grinding spindle (3); A second connecting rod (10), wherein a movable end (1001) of the second connecting rod (10) is connected to the second telescopic assembly (7), and a fixed end (1002) of the second connecting rod (10) is connected to the first connecting rod (8); When the first telescopic component (6) performs telescopic movement in the vertical direction, it drives the first connecting rod (8) to move in the vertical direction, and the vertical direction is perpendicular to the horizontal plane; When the second telescopic assembly (7) performs telescopic movement in the vertical direction, it drives the first connecting rod (8) to perform folding movement or unfolding movement relative to the first telescopic assembly (6).

3. The grinding device according to claim 2, characterized in that: The first telescopic assembly (6) comprises: A first cylinder barrel (601), a first piston and a first piston rod (602); Wherein, the first piston is arranged in the first cylinder barrel (601); The first end of the first piston rod (602) is connected to the first piston, and the second end of the first piston rod (602) is movably connected to the first end of the first connecting rod (8); When the first piston moves in the first cylinder barrel (601), it drives the first piston rod (602) to perform telescopic movement relative to the first cylinder barrel (601).

4. The grinding device according to claim 3, characterized in that The second telescopic assembly (7) is arranged on the first piston rod (602), and the second telescopic assembly (7) comprises: A second cylinder barrel (701), a second piston and a second piston rod (702); Wherein, the second piston is arranged in the second cylinder barrel (701); The first end of the second piston rod (702) is connected to the second piston; The movable end (1001) of the second connecting rod (10) is connected to the second piston rod (702); When the second piston moves in the second cylinder barrel (701), it drives the second piston rod (702) to perform telescopic movement relative to the second cylinder barrel (701), thereby driving the first connecting rod (8) to perform folding movement or unfolding movement relative to the first piston rod (602).

5. The grinding device according to claim 4, characterized in that: An accommodating space with an opening at one end is provided in the grinding spindle (3) along the axis of the grinding spindle (3), and the opening direction faces the grinding wheel (4); Wherein, the first cylinder barrel (601) and the second cylinder barrel (701) are both installed in the accommodating space; The first piston rod (602) and the second piston rod (702) are arranged along the axis of the grinding spindle (3).

6. The grinding device according to claim 5, characterized in that An installation channel is provided inside the grinding wheel (4) along the axis of the grinding wheel (4); When the first piston rod (602) performs telescopic movement relative to the first cylinder barrel (601), it drives the first connecting rod (8) to extend to the outside of the grinding wheel (4) or to retract into the installation channel.

7. The grinding device according to claim 1, characterized in that The grinding spindle (3) is provided with an adjusting screw (301), and the adjusting screw (301) comprises: Nuts (3011) and bolts (3012); Wherein, the nut (3011) is fixed on the grinding spindle (3); The first end of the bolt (3012) is inserted into the nut (3011), and the second end of the bolt (3012) is connected to the angle adjustment mechanism.

8. The grinding device according to claim 7, characterized in that The angle adjustment mechanism comprises: The transmission gear (11) comprises: a driving wheel (1101) and a driven wheel (1102), wherein the driving wheel (1101) and the driven wheel (1102) are meshed, and the driven wheel (1102) is connected to the second end of the bolt (3012); A servo motor (12), wherein an output shaft of the servo motor (12) is connected to the driving wheel (1101); The servo motor (12) is used to drive the driving wheel (1101) to drive the driven wheel (1102) to rotate, thereby driving the bolt (3012) to rotate in the nut (3011).

9. The grinding device according to claim 8, characterized in that The shaft sleeve (2) is provided with a mounting hole, and the second end of the bolt (3012) passes through the mounting hole and is connected to the driven wheel (1102).

10. The grinding device according to claim 8, characterized in that When the angle adjustment mechanism is used to calibrate the grinding spindle (3) according to the angle data, it is specifically used to: Determining a step angle corresponding to the servo motor (12) according to the angle data and preset angle data; A target signal is sent to the servo motor (12), wherein the target signal is used to control the servo motor (12) to rotate according to the step angle so as to calibrate the grinding spindle (3).

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