Optical coupling structure for optoelectronic integrated circuit

Abstract

An optical coupling structure for an optoelectronic integrated circuit includes a first connector and an optical fiber device. The first connector is arranged on the photoelectric integrated circuit and comprises a base with a lower surface and a front end and a waveguide device assembled on the base, and the waveguide device comprises a first surface, a first guide surface adjacent to the first surface and located at the front end and a plurality of optical waveguide channels extending to the first guide surface. The fiber optic device includes a second connector including a connection surface and detachably connected to the first connector such that the connection surface and the first guide surface directly face each other, so that the fiber optic device can implement a variety of applications.

Description

Technical Field

[0001] The present application relates to the technical field of optoelectronic integrated circuits (OEIC), and more particularly to an optical coupling structure for optoelectronic integrated circuits. Background Art

[0002] Optoelectronic integrated circuits (OEICs) use photons instead of electrons to perform calculations and data transmission in integrated circuits, bringing great benefits to the development of industries that require high-efficiency data exchange, long-distance interconnection, 5G facilities and computing equipment. OEICs are configured with photonic integrated circuits (PICs) and electronic integrated circuits (EICs), and can be co-packaged as co-packaged optical components (CPOs).

[0003] Optical data transmission between the OEIC and the equipment connected to the OEIC is carried out through optical components such as optical fibers. Currently, the optical fiber is connected to the PIC by an adhesive method, specifically, a reflective or focusing component such as an optical lens, a zone plate, etc. is set at the end of the optical fiber to propagate the light beam. In other words, the optical fiber and the PIC are permanently and fixedly connected to achieve a permanent connection. However, the above-mentioned permanent connection is performed before at least one reflow process or back-end process, which is usually performed at a temperature exceeding 220°C. Therefore, the optical fiber not only needs to undergo the above-mentioned process, but is also easily damaged by high temperature. In addition, this permanent connection between the optical fiber and the PIC also makes maintenance difficult. Summary of the invention

[0004] The object of the present application is to provide an optical coupling structure which is detachably connected to a photonic integrated circuit of an optoelectronic integrated circuit.

[0005] To achieve the above-mentioned object, one aspect of the present application provides an optical coupling structure for an optoelectronic integrated circuit, comprising a first connector disposed on the optoelectronic integrated circuit, the first connector comprising a base, the base comprising a lower surface and a front end, and a waveguide device assembled on the base, comprising a first surface, a first guide surface, and a plurality of optical waveguide channels, wherein the first guide surface is adjacent to the first surface and is located at the front end, and the plurality of optical waveguide channels extend to the first guide surface. The optical fiber device comprises a second connector, the second connector comprises a connection surface and is detachably connected to the first connector, so that the connection surface and the first guide surface directly face each other.

[0006] Optionally, the base further includes a recessed portion, the recessed portion penetrates part of the front end and part of the lower surface of the base, and the waveguide device is disposed in the recessed portion.

[0007] Optionally, the optoelectronic integrated circuit includes a photonic integrated circuit, the first connector is fixedly disposed on the photonic integrated circuit and includes a plurality of positioning members, and the plurality of positioning members are disposed on the base.

[0008] Optionally, the base further includes a retaining wall, which extends downward from the lower surface and bends, and is disposed adjacent to an edge of the photonic integrated circuit so that the retaining wall abuts against the edge of the photonic integrated circuit.

[0009] Optionally, the plurality of positioning members are spaced apart from each other on the retaining wall and are located at the front end of the base.

[0010] Optionally, the positioning member is pin-shaped and extends outward from the front end.

[0011] Optionally, the second connector further includes a plurality of engaging portions, and the plurality of engaging portions are detachably connected to the positioning member of the first connector.

[0012] Optionally, the optical waveguide channels of the waveguide device are arranged in an array and configured to spatially correspond to a signal transmission portion included in the photonic integrated circuit.

[0013] Optionally, the optical fiber device further comprises a plurality of optical fibers, the plurality of optical fibers are arranged corresponding to the optical waveguide channels of the waveguide device, and comprise a plurality of optical fiber ends, and the plurality of optical fiber ends are terminated at the second connector. The first guide surface of the waveguide device and the connection surface of the second connector are located directly in front of the optical fiber ends of the plurality of optical fibers or coincide with the optical fiber ends.

[0014] Optionally, a plurality of the first connectors are arranged on the same side of the photonic integrated circuit, each of the first connectors is connected to a fiber optic device, and the plurality of first connectors are spaced apart from each other by a spacing that is greater than or equal to a spacing between two adjacent second connectors.

[0015] Optionally, the optical coupling structure further comprises a housing, wherein the plurality of optical fiber devices are accommodated in the housing and are simultaneously and detachably connected to the first connector together with the housing.

[0016] Optionally, the optoelectronic integrated circuit further comprises an electronic integrated circuit and a carrier, and the electronic integrated circuit and the photonic integrated circuit are packaged together with the carrier.

[0017] Another aspect of the present application provides a method for forming an optical coupling structure for an optoelectronic integrated circuit, the optoelectronic integrated circuit comprising a photonic integrated circuit and a carrier, and the method comprises providing a first connector that is detachably connected to a second connector of an optical fiber device. The first connector comprises a base and a waveguide device disposed in the base; the first connector connected to the optical fiber device is disposed on the photonic integrated circuit, and the first connector is actively aligned with a signal transmission portion of the photonic integrated circuit through optical monitoring, so that signal transmission can be performed between the optical fiber device and the signal transmission portion through the waveguide device. The optical fiber device is removed from the first connector; the photonic integrated circuit is disposed on the carrier, and the optical fiber device is fixed to the first connector through the second connector.

[0018] Optionally, after the photonic integrated circuit is disposed on the carrier, and without attaching the optical fiber device, at least one reflow process or back-end process is performed on the first connector and the photonic integrated circuit combined with the carrier.

[0019] Optionally, the step of providing the first connector, which is detachably connected to the second connector of the optical fiber device, includes: placing the waveguide device in the base; and actively aligning the waveguide device and the optical fiber device through the optical monitoring to enable signal transmission between the optical fiber device and the waveguide device, so as to position the waveguide device in the base and form the first connector.

[0020] Optionally, after the step of actively aligning the first connector with the signal transmission portion of the photonic integrated circuit through the optical monitoring, a curing process is performed on the base to fix the first connector to the optoelectronic integrated circuit.

[0021] The optical coupling structure provided in the embodiment of the present application utilizes the first connector including the base and the waveguide device to be separately arranged from the optical fiber device including the second connector, so as to realize a detachable connection between the optical fiber device and the photonic integrated circuit. In this way, only the base and the waveguide device are retained on the photonic integrated circuit, and the photonic integrated circuit having only the first connector can be packaged together with the carrier and continue other processes. Accordingly, the optical fiber device will not be damaged by the high temperature in the above process, and can meet a variety of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to describe the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings used in the description of the embodiments. The drawings in the following description only illustrate some embodiments of the present invention, and those skilled in the art can also derive other drawings based on these drawings without creative work.

[0023] Figure 1 A schematic structural diagram of a base and an optical fiber device of an optical coupling structure provided in an embodiment of the present application.

[0024] Figure 2 It is a three-dimensional schematic diagram of the process of assembling a waveguide device and the base according to an embodiment of the present application.

[0025] FIG3 is a schematic diagram of the structure of a waveguide device provided in an embodiment of the present application.

[0026] Figure 3A A schematic structural diagram of a waveguide device provided in an embodiment of the present application.

[0027] Figure 4 It is a schematic diagram of assembling a first connector and the optical fiber device according to an embodiment of the present application.

[0028] Figure 5 for Figure 4 A three-dimensional schematic diagram of the optical fiber device detached from the first connector.

[0029] Figure 6 A schematic diagram of the structure of a photonic integrated circuit provided in an embodiment of the present invention.

[0030] Figure 7 It is a three-dimensional assembly diagram of the optical coupling structure and the photonic integrated circuit according to an embodiment of the present application.

[0031] Figure 8 for Figure 7 An assembly diagram of the first connector and the photonic integrated circuit, wherein the optical fiber device is not attached.

[0032] Fig. 8A for Figure 7 A top view of the first connector and the photonic integrated circuit assembly.

[0033] Figure 8B This is a top view of an assembly of a first connector and a photonic integrated circuit according to another embodiment of the present application.

[0034] Fig. 9A Reason Fig. 8A Schematic diagram of the cross-section taken along line segment AA.

[0035] Fig. 9B is a cross-sectional schematic diagram of another embodiment of the present application, which is similar to Fig. 9AA cross-section of a first connector and photonic integrated circuit assembly is shown.

[0036] Fig. 9C Reason Figure 8B Schematic diagram of the cross section taken along line segment BB.

[0037] Fig.10 It is a schematic top plan view of a photonic integrated circuit with a first connector and a carrier packaged together according to an embodiment of the present application.

[0038] Fig.11 This is a top plan view of an optical coupling structure according to an embodiment of the present application, which is connected to a carrier through a photonic integrated circuit.

[0039] Fig.12 A schematic structural diagram of a first connector of an optical coupling structure provided in an embodiment of the present application. Fig.13A , Fig. 13B and Fig. 13C Respectively by Fig.11 Schematic cross-sectional view of different embodiments of the optical fiber device taken along the CC line segment.

[0040] Fig.14 FIG. 1 is a schematic top view of a light coupling structure according to another embodiment of the present application.

[0041] Fig.15 This is a schematic structural diagram of a first connector according to another embodiment of the present application.

[0042] Fig.16 It is a side plan view schematically showing the assembly process of a first connector and an optical fiber device according to another embodiment of the present application.

[0043] Fig.17 Schematic diagram of some applications of the optical coupling structure according to the embodiment of the present application.

[0044] Fig.18 for Fig.17 A perspective schematic diagram of the assembly of multiple optical fiber devices and a first connector is shown.

[0045] Fig.19 It is a three-dimensional schematic diagram of another application of the light coupling structure of the embodiment of the present application.

[0046] Fig. 20 The present invention is a flowchart of a method for forming an optical coupling structure for an optoelectronic integrated circuit according to an embodiment of the present invention.

[0047] Fig.21 It is a partial flow chart of a method for forming an optical coupling structure for an optoelectronic integrated circuit according to an embodiment of the present application. DETAILED DESCRIPTION

[0048] The following embodiments will illustrate specific practicable embodiments of the present application with reference to the accompanying drawings. Directional terms described in the present application, such as up, down, front, back, left, right, inside, outside, side, etc., are only referenced to the directions of the accompanying drawings, so the directional terms used are intended to be used to describe and understand the present application, but the present application is not limited thereto.

[0049] It should be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. Unless otherwise specified, these terms are only used to distinguish one component from another component. Thus, for example, the first component, first part, or first portion discussed below may be referred to as a second component, second part, or second portion without departing from the teachings of the present application.

[0050] The present application provides an optical coupling structure for an optoelectronic integrated circuit. Figure 1 and Figure 2 . Reference Figure 1 and Figure 2 . Figure 1 A schematic structural diagram of a base 10 and an optical fiber device 3 of an optical coupling structure 100 provided in an embodiment of the present application. Figure 2 FIG. 2 is a three-dimensional schematic diagram of the process of assembling a waveguide device 20 and a base 10 according to an embodiment of the present application. Figure 2 As shown, the optical coupling structure 100 includes a first connector 1 and an optical fiber device 3. The first connector 1 includes a base 10 and a waveguide device 20. The base 10 is rectangular, and includes a lower surface 111, an upper surface 112, and a front end 11 connected between the lower surface 111 and the upper surface 112. Preferably, the front end 11 is defined as: formed between corresponding edges of the lower surface 111 and the upper surface 112. In some embodiments, a recessed portion 12 is formed on the base 10, which is recessed from the front end 11. Specifically, the recessed portion 12 is configured to penetrate a portion of the lower surface 111, a portion of the upper surface 112, and a portion of the front end 11 of the base 10. In some embodiments, referring to Figure 1 , a plurality of positioning members 13 are symmetrically arranged at the front end 11 of the base 10 relative to the middle part of the base 10, and are spaced at opposite sides of the recessed portion 12 and the waveguide device 20. A retaining wall 14 is formed on the base 10, and the retaining wall 14 extends downward from the lower surface 111 and bends, so that the base 10 has an inverted L-shaped cross-sectional profile. In this embodiment, the number of the positioning members 13 is two, and the positioning members 13 are pin-shaped and extend outward from the front end 11 on the retaining wall 14. In some embodiments, the base 10 is made of a material with high temperature resistance, such as ceramic or metal, such as zirconium dioxide (ZrO2). Alternatively, the base 10 can be made of a non-metallic material, such as an organic binder (such as a resin), a polymer or a plastic.

[0051] Referring to FIG. 3 , FIG. 3 is a schematic diagram of the structure of the waveguide device 20. As shown in FIG. 3 , the waveguide device 20 includes a waveguide substrate 21, a first surface 22 disposed on the top of the waveguide substrate 21, a plurality of optical waveguide channels 23, a second surface 25 disposed at the bottom of the waveguide substrate 21, a first guide surface 24 adjacent to the first surface 22 and the second surface 25, and a second guide surface 27 set opposite to the first guide surface 24. In some embodiments, the optical waveguide channels 23 are groove-shaped, arranged in an array along the first surface 22 or the second surface 25, and extend to the first guide surface 24 to propagate the light beam. Figure 3A , Figure 3A FIG. 2 is a schematic diagram of the structure of a waveguide device 20 according to another embodiment of the present application. Figure 3A As shown, the optical waveguide channel 23 may be formed in the waveguide device 20 and located between the first surface 22 and the second surface 25. It should be noted that the optical waveguide channel 23 is not limited to the above-mentioned types.

[0052] Preferably, the waveguide device 20 is made of a material including, for example, silicon dioxide. Alternatively, the waveguide device 20 may be made of a material including silicon-on-insulator (SOI), lithium niobate (LiNbO 3) or a polymer. In some embodiments, the waveguide device 20 may be formed using materials such as fused quartz, quartz, glass, borosilicate glass, etc. It should be noted that the waveguide device 20 includes a planar lightwave circuit (PLC). In some embodiments, the planar lightwave can be configured in a variety of ways, including but not limited to a straight line circuit, a splitter circuit, an arrayed waveguide grating wavelength multiplexer, and a cross connect-type circuit. The planar lightwave in the embodiment of the present application may use different types of waveguide circuits or devices.

[0053] like Figure 1 and Figure 2 As shown, the optical fiber device 3 is detachably connected to the first connector 1. The optical fiber device 3 includes a plurality of optical fibers 31 and a second connector 32 for connecting to the first connector 1. Figures 1 to 4 , Figure 4 FIG. 1 is a schematic diagram of assembling the first connector 1 and the optical fiber device 3 according to an embodiment of the present application. Specifically, the optical fiber 31 is configured to correspond to the optical waveguide channel 23 of the waveguide device 20, and has a plurality of optical fiber ends 310 (such as Figure 4In this embodiment, the second connector 32 is an optical multi-channel connector, which includes a connection surface 321 disposed facing the front end 11 of the base 10, and a plurality of engagement portions 322 (such as Figure 1 Each joint portion 322 is in the shape of a channel, into which a pin-shaped positioning member 13 can be inserted, so that the joint portion 322 and the positioning member 13 are closely matched, thereby achieving a close connection between the second connector 32 and the first connector 1. In this configuration, the fiber ends 310 of the plurality of optical fibers 31 are positioned to directly face the recessed portion 12 at the front end 11 of the base 10.

[0054] Reference Figure 2 , Figure 4 and Figure 5 . Figure 5 For optical fiber device 3 from Figure 1 A perspective schematic diagram of a first connector removed as shown. Figure 2 As shown, in order to position the waveguide device 20 in the base 10, the base 10 and the optical fiber device 3 are first detachably connected together. Then, the waveguide device 20 is placed in the recessed portion 12, and the waveguide device 20 is actively aligned with the optical fiber 31 of the optical fiber device 3 through optical monitoring to achieve signal transmission between the optical fiber 31 and the waveguide device 20. Once the waveguide device 20 is accurately positioned, the waveguide device 20 is permanently fixed to the recessed portion 12 of the base 10 by applying an adhesive or a curing substance or by other fixing means. Figure 4 As shown, the base 10 and the waveguide device 20 together constitute the first connector 1. After the first connector 1 is prepared, Figure 5 As shown, the optical fiber device 3 can be removed from the base 10 of the first connector 1. In some embodiments, when multiple waveguide devices 20 need to be respectively arranged on multiple bases 10, the arrangement of the waveguide devices 20 in the bases 10 can be completed in sequence by repeating the above process.

[0055] Refer to Figure 3 and Figure 4In some embodiments, the optical fibers 31 are arranged in parallel to each other in a single row or multiple rows, and extend to and are exposed at the connection surface 321 to directly propagate the light beam to the waveguide device 20. In some embodiments, the optical fiber 31 can be, for example, a single-mode optical fiber, a multi-mode optical fiber, or a polarization-maintaining fiber. When connected in place, the first guide surface 24 of the waveguide device 20 and the connection surface 321 of the second connector 32 are located in front of the optical fiber end 310 of the optical fiber 31 or overlap with each other. It should be noted that in some embodiments, no reflective or focusing components such as optical lenses and wave zone plates are provided at the optical fiber end 310 of the optical fiber 31 between the first guide surface 24 and the connection surface 321. In other embodiments, the optical fiber end 310 of the optical fiber 31 between the first guide surface 24 and the connection surface 321 can also be coated with optical glue to avoid a sharp change in the refractive index. Alternatively, an anti-reflection coating (not shown) may be applied to one side of the optical fiber end 310 or the first guide surface 24 or both sides of the optical fiber end 310 and the first guide surface 24 to prevent signal loss caused by misalignment at the boundary between the optical fiber end 310 and the first guide surface 24. In some embodiments, for the same reasons as above, an optical lens may also be provided at the boundary between the optical fiber end 310 and the first guide surface 24. In another embodiment, no component or substance is provided at the boundary between the optical fiber end 310 and the first guide surface 24, so that the optical fiber end 310 and the first guide surface 24 are in direct physical contact with each other.

[0056] Reference Figure 6 , which shows a photonic integrated circuit 51 of an embodiment of the present application. The photonic integrated circuit 51 includes two or more photonic components 512 forming a functional circuit. In some embodiments, the photonic integrated circuit 51 is a silicon photonic integrated circuit, preferably a silicon nitride photonic integrated circuit. In detail, the photonic integrated circuit 51 includes at least a signal transmission part 511 for transmitting optical signals with the waveguide device 20.

[0057] Figure 7 It is a three-dimensional assembly diagram of the optical coupling structure 100 and the photonic integrated circuit 51 according to an embodiment of the present application. Figure 8 for Figure 7 The first connector 1 is shown assembled with the photonic integrated circuit 51, but without the additional optical fiber device 3. Figures 6 to 8When the first connector 1 is set on the photonic integrated circuit 51, the first connector 1 provided with the waveguide device 20 in the base 10 and the optical fiber device 3 are actively aligned with the signal transmission part 511 through optical monitoring, so that the optical signal can be transmitted between the optical fiber device 3 and the signal transmission part 511 through the waveguide device 20. After the first connector 1 is set on the photonic integrated circuit 51, the base 10 is cured on the signal transmission part 511 to firmly fix the first connector 1 on the photonic integrated circuit 51. In some embodiments, when multiple first connectors 1 need to be set on one or different photonic integrated circuits 51, the above process can be repeated to complete the setting of each first connector 1 on the corresponding photonic integrated circuit 51.

[0058] In this embodiment, the vertical projection of the base 10 on a horizontal plane does not overlap with the vertical projection of the second connector 32 on the horizontal plane, thereby achieving a thinner photonic integrated circuit 51 having the first connector 1. It is worth noting that the propagation range of the light beam from the optical transceiver module (not shown) of the photonic integrated circuit 51 through the optical waveguide channel 23 of the waveguide device 20 can be expanded from about 2 microns to 8 microns, so that the light beam can completely pass through the optical fiber 31 without causing signal loss.

[0059] Reference Figures 7 to 9A , Fig. 8A yes Figure 8 A top view of Fig. 9A is along Figure 8 Schematic diagram of the cross section taken by the AA line segment. Figure 8 and Fig. 8A As shown, after the first connector 1 is arranged on the photonic integrated circuit 51, the optical fiber device 3 is removed from the first connector 1. At this stage, as shown in FIG. Fig. 9A As shown, part of the waveguide device 20 faces the signal transmission portion 511, and the positioning member 13 extends outward from the first guide surface 24 and is substantially perpendicular to the first guide surface 24. It should be noted that Figure 6 The outline of the signal transmission portion 511 is shown for illustration purposes only, and it may have a larger size or a more diverse layout according to the actual design of the photonic integrated circuit 51. Fig. 9A As shown, the second guide surface 27 is located above the signal transmission part 511, and an inclined micro-reflective component (not shown) may be provided in each optical waveguide channel 23 corresponding to the waveguide device 20 to guide the light beam from the optical fiber 31 to the signal transmission part 511, and vice versa. In some embodiments, a reflective coating may be applied to the inclined micro-reflective component. In addition, as shown in FIG. Figure 7 As shown, when the second connector 32 is inserted into the first connector 1 , the retaining wall 14 abuts against the edge of the photonic integrated circuit 51 to prevent the first connector 1 from being displaced.

[0060] Reference Fig. 9B , Fig. 9B is a cross-sectional schematic diagram of another embodiment of the present application, which is similar to Fig. 9A The cross section of the first connector and the photonic integrated circuit assembly shown. In this embodiment, the second guide surface 27 of the waveguide device 20 assembled with the base 10 is obliquely formed above the signal transmission part 511 and forms an acute angle with the signal transmission part 511. In some embodiments, the second guide surface 27 can be coated with a reflective layer (not shown). Through the second guide surface 27, the light beam from the optical fiber 31 and passing through the optical waveguide channel 23 of the waveguide device 20 can be reflected and guided to the signal transmission part 511, and vice versa.

[0061] Reference Fig. 9C . Fig. 9C is along Figure 8B In the present embodiment, the second guide surface 27' of the waveguide device 20' assembled with the base 10 is located in front of the signal transmission part 511, and the portion of the second guide surface 27' facing the signal transmission part 511 is located at the boundary between the second guide surface 27' and the photonic integrated circuit 51, so that the light beam from the optical fiber 31 passes straight through the signal transmission part 511. In some embodiments, the waveguide device 20' extends outward from the base 10 to facilitate accurate alignment with the optical fiber 31 of the second connector 32.

[0062] Reference Fig.10 , Fig.10 1 is a top view schematic diagram showing a photonic integrated circuit 51 with a first connector 1 and a carrier 50 packaged together. In some embodiments, the carrier 50 may be a multi-chip module (MCM) as a substrate for multiple chips. For example, an electronic integrated circuit 52 and a photonic integrated circuit 51 are fixed on the carrier 50 that performs various electrical and optical functions. Since the optical fiber device 3 can be removed from the first connector 1, a detachable connection between the optical fiber device 3 and the photonic integrated circuit 51 can be achieved. In this way, only the base 10 and the waveguide device 20 are retained on the photonic integrated circuit 51, and the photonic integrated circuit 51 with only the first connector 1 can be packaged together with the carrier 50 and undergo other processes, such as a reflow process or a back-end process, such as wire bonding, molding, to form an optoelectronic integrated circuit 5. Accordingly, the optical fiber device 3 will not be damaged by the high temperature in the above process.

[0063] Reference Fig.11 When the photonic integrated circuit 51 with the first connector 1 is packaged together with the carrier board 50 , the optical fiber device 3 can be fixedly connected to the first connector 1 for transmission or reception of optical signals.

[0064] Reference Fig.12 , Fig.12 Schematic diagram of the structure of the first connector 1 of the optical coupling structure 100 of the embodiment of the present application. The main difference between this embodiment and the previous embodiment is that the number of the positioning members 13 is four, and the four positioning members 13 are respectively arranged on opposite sides of the front end 11, so that the waveguide device 20 is located between the plurality of positioning members 13.

[0065] Reference FIG. 13A to FIG. 13C , FIG. 13A to FIG. 13C The optical fiber devices 3 of different embodiments of the present application are respectively Fig.11 The cross-sectional diagram of the CC segment. Fig.13A As shown, the two joint portions 322 are exposed at opposite sides of the second connector 32 and extend inwardly to be closely matched with the corresponding positioning members. In this embodiment, the fiber ends 310 of the plurality of optical fibers 31 are arranged in a row between the two joint portions 322 .

[0066] like Fig. 13B As shown, two engaging portions 322 are exposed at opposite sides of the second connector 32, and the aperture size of each engaging portion 322 is larger than Fig.13A The aperture size of the joint 322 is shown. Fig. 13B In the embodiment shown, the optical fiber ends 310 are arranged in a row above the joint portion 322. Fig. 13B The configuration of the joint portion 322 provided on the same side below the optical fiber end 310 as shown, or as Fig. 13C The configuration of the joint portion 322 disposed at the corner of the second connector 32 can be used to arrange a larger number of optical fibers 31 to meet the requirements of high-density data transmission of the co-packaged optical assembly.

[0067] like Fig. 13C As shown, four engaging portions 322 are exposed at opposite sides of the second connector 32, and the aperture size of each engaging portion 322 is smaller than Fig.13A and Fig. 13B The aperture size of the joint 322 is shown. Fig. 13C In the illustrated embodiment, the fiber ends 310 are arranged in a single row between the four joints 322. It should be noted that the positions of the fiber ends 310 and the joints 322 are not limited to the above embodiment, but can be changed according to the configuration of the waveguide device 20 and the positioning member 13.

[0068] Reference Fig.14 , Fig.14 This embodiment differs from the previous embodiment mainly in that the joint portion 322' of the second connector 32 has a cantilever locking structure to cooperate with the corresponding positioning member 13' to connect the optical fiber device 3 to the first connector 1.

[0069] Reference Fig.15 , Fig.15 1 is a schematic diagram of the structure of a first connector 1' of another embodiment of the present application. The main difference between this embodiment and the previous embodiment is that the entire bottom of the base 10', that is, the lower surface 111 is arranged on the upper surface of the photonic integrated circuit 51, and the base 10' is arranged adjacent to the edge of the photonic integrated circuit 51 and does not have a retaining wall 14. In some embodiments, the base 10' can be set back from the edge of the photonic integrated circuit 51 according to the circuit layout of the photonic integrated circuit 51.

[0070] Reference Fig.16 , Fig.16 FIG. 1 is a side plan view schematic diagram of the assembly process of the first connector 1″ and the optical fiber device 3 according to another embodiment of the present invention. The difference between this embodiment and the previous embodiment mainly lies in the structure of the first connector 1″. Fig.16 As shown, the first connector 1" includes a base 10" and a waveguide device 20", and the waveguide device 20" includes a first guide surface 24" inclined relative to the first surface 22, so that the optical waveguide channel 23 ends at the first guide surface 24. Through the inclined structure of the first guide surface 24", it is possible to prevent light reflection at the boundary between the first guide surface 24" and the optical fiber end 310 of the optical fiber 31 when the light beam passes through, thereby improving the problem of signal loss during the optical signal transmission process. Fig.17 , Fig.17 This is a three-dimensional schematic diagram of the application of the first connector provided in the embodiment of the present application. Fig.17 As shown, the silicon photonic integrated circuit 51' includes four signal transmission parts (not shown) respectively configured to correspond to the first connectors 1. In detail, the number of the first connectors 1 is four, which are respectively arranged on the signal transmission parts and adjacent to the same edge of the photonic integrated circuit 51'. Each first connector 1 is configured to be connected to the optical fiber device 3 (for clarity, the first connector 1 is not shown in FIG. 1 ). Fig.17 In this embodiment, the spacing between the first connectors 1 is greater than or equal to the spacing between two adjacent second connectors 32, so as to facilitate the connection with the optical fiber 31.

[0071] like Fig.17 As shown, a housing 53 is provided to shield the photonic integrated circuit 51'. In detail, the housing 53 includes a front opening 531 located in front of the first connector 1, so that the second connector 32 can pass through and plug into the first connector 1. In some embodiments, the housing 53 includes a stopper 532, which is adjacent to the front opening 531 and extends downward to abut against the carrier 50 (for clarity, Fig.17In other words, the function of the stopper 532 is similar to that of the stopper wall 14 of the base 10. In another embodiment, the housing 53 further includes a top opening 533 formed at the top of the housing 53 to facilitate observation of the assembly of the first connector 1 and the second connector 32.

[0072] Reference Fig.18 and Fig.19 , Fig.18 for Fig.17 The schematic three-dimensional diagram of the assembly of multiple optical fiber devices 3 and a housing 53 is shown. Fig.19 yes Fig.18 Schematic diagram of another application of the optical coupling structure shown. A housing 33 is provided for a plurality of optical fiber devices 3. In detail, the housing 33 is configured to accommodate the plurality of optical fiber devices 3, so that the optical fiber devices 3 are spaced apart from each other, and the second connectors 32 are aligned with each other and face the first connectors respectively. Through the provision of the housing 33, the optical fiber device 3 can be moved together with the housing 33, so as to be detachably connected to the first connector 1 at the same time. Therefore, the transmission capacity of the photonic integrated circuit 51 can be significantly increased through the optical coupling structure 100.

[0073] Reference Fig.19 In some embodiments, each optical fiber device 3 may include a plurality of docking connectors 34, and the plurality of docking connectors 34 are disposed at the end of the optical fiber 31 relative to the second connector 32. In some embodiments, the docking connector 34 of each optical fiber device 3 may have different connection interfaces for connecting to various compatible interfaces, thereby achieving rich and diverse usability.

[0074] Reference Fig. 20 The present application also provides a method 110 for forming an optical coupling structure for an optoelectronic integrated circuit. It should be understood that the order of the steps of the method is merely exemplary, and the steps can be performed in a variety of orders according to actual needs. The description of the structural components used in each step of the method of the present application can refer to the above embodiments and drawings, and will not be repeated here. Fig. 20 As shown, the steps of method 110 include steps S111 to S119, which will be described in detail below.

[0075] Step S111: Provide a first connector, which is detachably connected to a second connector of an optical fiber device. The first connector includes a base and a waveguide device disposed in the base. In detail, Figure 4 and Figure 5 As shown, the first connector 1 including the base 10 and the waveguide device 20 is connected to the second connector 32 of the optical fiber device 3 .

[0076] Step S113: placing a first connector connected to the optical fiber device on the photonic integrated circuit, and actively aligning the first connector with the signal transmission part of the photonic integrated circuit through optical monitoring, so that the optical fiber device and the signal transmission part can transmit signals through the waveguide device. Figure 6 and Figure 7 As shown, the optical transceiver module (not shown) of the photonic integrated circuit 51 is turned on to enable it to be in a state of transmitting or receiving optical signals. Then, the first connector 1 is placed on the photonic integrated circuit 51 together with the optical fiber device 3, and moved to be precisely aligned until it is in a position where the optical transceiver module can transmit or receive optical signals with the highest signal amplitude. Figure 8 and Fig. 8A As shown, a portion of the waveguide device 20 faces the signal transmission portion 511 and is precisely aligned with the signal transmission portion 511. In this way, the position where the first connector 1 is set on the photonic integrated circuit 51 is confirmed. Then, the base 10 is subjected to a curing process to fix the first connector 1 to the photonic integrated circuit 51, thereby fixing the base 10 on the photonic integrated circuit 51.

[0077] Step S115: Remove the optical fiber device from the first connector. Figure 8 and Fig. 8A , detach the optical fiber device 3 from the first connector 1.

[0078] Step S117: placing the photonic integrated circuit on the carrier. Fig.10 As shown, the optoelectronic integrated circuit 5 includes a carrier board 50 and an electronic integrated circuit 52. After the photonic integrated circuit is placed on the carrier board, and without the additional optical fiber device 3, at least a reflow process or a wire bonding, molding and other back-end processes are performed on the first connector 1 and the photonic integrated circuit 51 combined with the carrier board 50. In other words, the photonic integrated circuit 51 with the first connector 1 is packaged together with the carrier board 50 and the electronic integrated circuit 52 to form the optoelectronic integrated circuit 5.

[0079] Step S119: Fix the optical fiber device to the first connector through the second connector. Specifically, after the photonic integrated circuit 51 with the first connector 1 is packaged with the carrier 50, the optical fiber device 3 can be connected to the first connector 1 again to be fixedly connected and transmit or receive optical signals.

[0080] In particular, refer to Fig.21, providing the first connector, which is detachably connected to the second connector of the optical fiber device, step S111 also includes steps S1111, S1112 and S1113. In detail, step S111: connecting the second connector of the optical fiber device to a base without the waveguide device. At this stage, if Figure 1 As shown, the waveguide device 20 is not disposed in the base 10. Step S1112: placing the waveguide device in the base. Figure 2 As shown, after the base 10 and the second connector 32 are detachably connected together, the waveguide device 20 is disposed in the recessed portion 12 of the base 10. Step S1113: Actively aligning the waveguide device and the optical fiber device through the optical monitoring to enable signal transmission between the optical fiber device and the waveguide device, so as to position the waveguide device in the base and form the first connector as shown in FIG. Figure 4 As shown, when the waveguide device 20 is accurately positioned, an adhesive is used to permanently fix the waveguide device 20 on the base 10, thereby forming a first connector 1 by the base 10 and the waveguide device 20. In some embodiments, the waveguide device 20 can be fixed to the base 10 by welding, fusion or heat curing materials.

[0081] In summary, the optical coupling structure provided in the embodiment of the present application utilizes the first connector including the base and the waveguide device to be separately arranged from the optical fiber device including the second connector, so as to realize a detachable connection between the optical fiber device and the photonic integrated circuit. In this way, only the base and the waveguide device are retained on the photonic integrated circuit, and the photonic integrated circuit having only the first connector can be packaged together with the carrier and continue other processes. Accordingly, the optical fiber device will not be damaged by the high temperature in the above process, and can meet a variety of applications.

[0082] The above embodiments are used to illustrate the technical ideas of the present disclosure, but not to limit the technical ideas of the present disclosure. Therefore, the scope of rights of the present disclosure is not limited to the embodiments. The protection scope of the present disclosure shall be interpreted by the claims, and shall be interpreted as all technical ideas that are the same or equivalent to the above protection scope are included in the scope of rights of the present disclosure.

Claims

1. An optical coupling structure for an optoelectronic integrated circuit, characterized in that: include: The first connector is arranged on the optoelectronic integrated circuit, comprising: A base, including a lower surface and a front end; and a waveguide device assembled on the base and comprising a first surface, a first guide surface and a plurality of optical waveguide channels, wherein the first guide surface is adjacent to the first surface and located at the front end, and the plurality of optical waveguide channels extend to the first guide surface, and An optical fiber device includes a second connector including a connection surface, wherein the second connector is detachably connected to the first connector so that the connection surface and the first guide surface directly face each other.

2. The optical coupling structure for optoelectronic integrated circuit according to claim 1, characterized in that: The base further includes a recessed portion, which penetrates part of the front end and part of the lower surface of the base, and the waveguide device is disposed in the recessed portion.

3. The optical coupling structure for optoelectronic integrated circuit according to claim 1, characterized in that: The optoelectronic integrated circuit includes a photonic integrated circuit, the first connector is fixedly arranged on the photonic integrated circuit and includes a plurality of positioning members, and the plurality of positioning members are arranged on the base.

4. The optical coupling structure for optoelectronic integrated circuit according to claim 3, characterized in that: The base further includes a blocking wall, which extends downward from the lower surface and is bent, and is arranged adjacent to an edge of the photonic integrated circuit so that the blocking wall abuts against the edge of the photonic integrated circuit.

5. The optical coupling structure for optoelectronic integrated circuit according to claim 4, characterized in that: The plurality of positioning members are arranged at intervals on the retaining wall and are located at the front end of the base.

6. The optical coupling structure for optoelectronic integrated circuit according to claim 5, characterized in that: The positioning member is pin-shaped and extends outward from the front end.

7. The optical coupling structure for optoelectronic integrated circuit according to claim 6, characterized in that: The second connector further includes a plurality of engaging portions, and the plurality of engaging portions are detachably connected to the positioning member of the first connector.

8. The optical coupling structure for optoelectronic integrated circuit according to claim 3, characterized in that: The optical waveguide channels of the waveguide device are arranged in an array and configured to spatially correspond to a signal transmission portion included in the photonic integrated circuit.

9. The optical coupling structure for optoelectronic integrated circuit according to claim 3, characterized in that: The optical fiber device also includes a plurality of optical fibers, which are arranged corresponding to the optical waveguide channels of the waveguide device and include a plurality of optical fiber ends, and the plurality of optical fiber ends are terminated in the second connector, wherein the first guiding surface of the waveguide device and the connecting surface of the second connector are located directly in front of the optical fiber ends of the plurality of optical fibers or overlap with the optical fiber ends.

10. The optical coupling structure for optoelectronic integrated circuit according to claim 3, characterized in that: A plurality of first connectors are disposed on the same side of the photonic integrated circuit, each of the first connectors is connected to a fiber optic device, and the plurality of first connectors are spaced apart from each other by a spacing greater than or equal to a spacing between two adjacent second connectors.

11. The optical coupling structure for optoelectronic integrated circuits according to claim 10, further comprising a housing, wherein the plurality of optical fiber devices are accommodated in the housing and are simultaneously and detachably connected to the first connector together with the housing.

12. The optical coupling structure for optoelectronic integrated circuit according to claim 3, characterized in that: The optoelectronic integrated circuit further comprises an electronic integrated circuit and a carrier board, wherein the electronic integrated circuit and the photonic integrated circuit are packaged together with the carrier board.

13. A method for forming an optical coupling structure for an optoelectronic integrated circuit, the optoelectronic integrated circuit comprising a photonic integrated circuit and a carrier, characterized in that: The method comprises: providing a first connector detachably connected to a second connector of the optical fiber device, wherein the first connector comprises a base and a waveguide device disposed in the base; Disposing a first connector connected to the optical fiber device on the photonic integrated circuit, and actively aligning the first connector with a signal transmission portion of the photonic integrated circuit through optical monitoring, so that signal transmission can be performed between the optical fiber device and the signal transmission portion through the waveguide device; removing the optical fiber device from the first connector; placing the photonic integrated circuit on the carrier; and The optical fiber device is fixed to the first connector through the second connector.

14. The method of forming an optical coupling structure for an optoelectronic integrated circuit according to claim 13, wherein: After the photonic integrated circuit is disposed on the carrier, and without the optical fiber device being attached, at least one reflow process or back-end process is performed on the first connector and the photonic integrated circuit combined with the carrier.

15. The method of forming an optical coupling structure for an optoelectronic integrated circuit according to claim 13, wherein: The step of providing the first connector to be detachably connected to the second connector of the optical fiber device comprises: connecting a second connector of the optical fiber device to a base that does not contain the waveguide device; placing the waveguide device in the base; and The waveguide device and the optical fiber device are actively aligned through the optical monitoring to enable signal transmission between the optical fiber device and the waveguide device, so as to position the waveguide device in the base and form the first connector.

16. The method of forming an optical coupling structure for an optoelectronic integrated circuit according to claim 13, wherein: The first connector includes a plurality of positioning members arranged on the base, and the second connector also includes a plurality of engaging portions detachably connected to the positioning members.

17. The method of forming an optical coupling structure for an optoelectronic integrated circuit according to claim 13, wherein: After the step of actively aligning the first connector with the signal transmission portion of the photonic integrated circuit through the optical monitoring, a curing process is performed on the base to fix the first connector to the optoelectronic integrated circuit.

Images