Server with novel heat dissipation device and heat dissipation control method

Abstract

The invention relates to a server with a novel heat dissipation device and a heat dissipation control method, the server comprises a case, a mainboard is arranged in the case, and the mainboard is at least provided with a baseboard management controller (BMC), a central processing unit (CPU) and a graphics processing unit (GPU); the heat dissipation device is arranged in the case, the heat dissipation device is electrically connected with the BMC, and the heat dissipation device comprises an air compressor, a condensation pipeline, an electronic expansion valve and a heat dissipation cold plate which are sequentially connected through pipelines; wherein the cooling cold plates are used for cooling the CPU and the GPU, the number of the cooling cold plates is the sum of the number of the CPU and the number of the GPU, and the cooling cold plates are tightly attached to the CPU and the GPU.

Description

Technical Field

[0001] The present invention relates to the field of servers, and in particular to a server with a novel heat dissipation device and a heat dissipation control method. Background Art

[0002] With the development of the digital economy, the market share of AI servers is growing. At the same time, the increasing power consumption of servers is accompanied by huge heat dissipation challenges. The traditional air-cooled heat dissipation system of servers can no longer meet the heat dissipation needs, and also brings about the problem of poor environmental noise pollution. Therefore, liquid (water) cooling systems have occupied an increasingly large stage in the server market and are very popular with server suppliers. However, the environmental cost of building a liquid-cooled server system is extremely high, with an investment cost of hundreds of thousands of yuan, and its CDU and cooling tower require a large space. For small server rooms of small companies or institutions, it is not appropriate to choose such liquid-cooled servers. To this end, this paper proposes a new server heat dissipation system design. It can not only abandon the noise and energy-saving problems caused by the air-cooled system, but also avoid the problem of huge heat dissipation system investment required to choose mainstream liquid-cooled servers. Summary of the invention

[0003] The present invention provides a server with a novel heat dissipation device and a heat dissipation control method, aiming to solve at least one of the technical problems existing in the prior art.

[0004] The technical solution of the present invention is a server with a novel heat dissipation device, comprising: A chassis, wherein a mainboard is arranged in the chassis, and the mainboard is provided with at least a baseboard management controller BMC, a central processing unit CPU and a graphics processing unit GPU; A heat dissipation device, the heat dissipation device is arranged in the chassis, the heat dissipation device is electrically connected to the baseboard management controller BMC, and the heat dissipation device includes an air compressor, a condensation pipeline, an electronic expansion valve and a heat dissipation cold plate connected in sequence through pipelines; Among them, the heat dissipation cold plate is used to dissipate heat for the central processing unit CPU and the graphics processing unit GPU. The number of the heat dissipation cold plates is the sum of the number of the central processing unit CPU and the graphics processing unit GPU. The heat dissipation cold plate is closely installed on the central processing unit CPU and the graphics processing unit GPU.

[0005] Furthermore, the condensation pipe of the heat dissipation device is arranged in a serpentine shape.

[0006] Furthermore, the heat dissipation device also includes a dedicated fan for dissipating heat for the condensation pipe, and the dedicated fan is installed close to the condensation pipe and arranged on the side of the chassis.

[0007] Furthermore, the heat dissipation device also includes at least two temperature control sensors, which are respectively installed on heat dissipation cold plates arranged on the central processing unit CPU and the graphics processing unit GPU.

[0008] Furthermore, the heat dissipation device also includes a control circuit board, The baseboard management controller BMC, air compressor, temperature control sensor, special fan, electronic expansion valve, central processing unit CPU and graphics processing unit GPU of the mainboard are electrically connected to the control circuit board respectively.

[0009] Furthermore, the refrigerant medium of the heat dissipation device is Freon.

[0010] Furthermore, the pipe arranged between the electronic expansion valve and the heat dissipation cold plate, the top of the heat dissipation cold plate and the pipe arranged between the heat dissipation cold plate and the air compressor are wrapped with plastic pipes for blocking condensed water.

[0011] Furthermore, the plastic tube is made of polyvinyl chloride (PVC).

[0012] Furthermore, the chassis also includes a partition for separating the motherboard and the heat dissipation device, a power supply device and an external interface are installed on the upper side of the partition, multiple hard disks and dust grilles are installed on the lower side of the partition, and a dedicated fan is arranged on the rear side of the dust grille.

[0013] Furthermore, the present invention also proposes a server heat dissipation control method, which is applied to the server with the novel heat dissipation device, and the server heat dissipation control method comprises the following steps: S100, the server is turned on, and the baseboard management controller BMC obtains and determines whether the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the starting operating temperature threshold of 50° C. of the heat dissipation device; S200, if the central processing unit CPU and / or the graphics processing unit GPU is higher than 50° C., the baseboard management controller BMC controls the heat dissipation device to start up and operate with the first working state parameters, wherein the first working state parameters include that the working frequency of the air compressor is 50% of the maximum working frequency, the speed of the dedicated fan is 50% of the maximum speed, and the opening of the expansion valve is level 1; S300 and the baseboard management controller BMC monitor the temperature changes of the central processing unit CPU and the graphics processing unit GPU in real time by collecting the electrical signal changes of the temperature control sensor set on the heat dissipation cold plate in real time; S400, if the baseboard management controller BMC monitors that the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the first high temperature alarm threshold of 70°C, the baseboard management controller BMC controls the heat dissipation device to operate with the second working state parameters, wherein the second working state parameters include that the working frequency of the air compressor is 70% of the maximum working frequency, the speed of the dedicated fan is 70% of the maximum speed, and the opening of the expansion valve is level 2; S500: If the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than the first high temperature alarm threshold of 70° C. after the heat dissipation device runs with the second working state parameters for a preset time of 5 minutes, the heat dissipation device continues to run with the second working state parameters until the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than 20° C., and the baseboard management controller BMC controls the heat dissipation device to run with the first working state parameters; S600: If the temperature of the central processing unit CPU or / and the graphics processing unit GPU is between the first high temperature alarm threshold of 70°C and the second high temperature alarm threshold of 90°C after the heat dissipation device runs with the second working state parameter for a preset time of 5 minutes, the baseboard management controller BMC controls the heat dissipation device to run with the third working state parameter, wherein the third working state parameter includes that the working frequency of the air compressor is 85% of the maximum working frequency, the speed of the dedicated fan is the maximum speed, and the opening of the expansion valve is level 3. If the temperature of the central processing unit CPU or / and the graphics processing unit GPU is lower than 20°C after the heat dissipation device runs with the third working state parameter for a preset time of 5 minutes, the baseboard management controller BMC controls the heat dissipation device to run with the first working state parameter; S700: If the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the second high temperature alarm threshold of 90° C. after the heat dissipation device operates with the second working state parameters for a preset time of 5 minutes, the baseboard management controller BMC controls the heat dissipation device to operate with the fourth working state parameters, wherein the fourth working state parameters include that the working frequency of the air compressor is the maximum working frequency, the speed of the dedicated fan is the maximum speed, and the opening of the expansion valve is level 4; S800, in the step S600, if the heat dissipation device operates with the third working state parameter for a preset time of 5 minutes, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the second high temperature alarm threshold of 90° C., the baseboard management controller BMC controls the heat dissipation device to operate with the fourth working state parameter; S900, in steps S700 and S800, after the fourth working state parameter is run for 5 minutes, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU gradually decreases, the fourth working state parameter is continued to be run until the temperature drops below 20° C., the baseboard management controller BMC controls the heat dissipation device to operate with the first working state parameter, and if the temperature of the central processing unit CPU and / or the graphics processing unit GPU does not decrease after the fourth working state parameter is run for 5 minutes, the baseboard management controller BMC records the log event and sends an alarm signal; S1000, at the first working state parameter, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than 10°C, the baseboard management controller BMC controls the cooling device to shut down and returns to step S200 to start a new cycle detection.

[0014] The beneficial effects of the present invention include: the server with the novel heat dissipation device is light, highly mobile, has a low use cost, and is a more intelligent liquid-cooled server; the liquid cooling system and the server are integrated into a whole, without increasing the environmental site cost, and are not restricted by the use site; the server and the heat dissipation system interact, and the heat dissipation system is included in the BMC intelligent management range; it is more energy-efficient, and can accurately and effectively control the cooling capacity to prevent the server from being over-cooled or ineffectively cooled.

[0015] In addition, additional aspects and advantages of the present invention will be given in part in the following description, and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the overall structure of a server with a novel heat dissipation device according to an embodiment of the present invention.

[0017] Figure 2 Schematic diagram of the overall structure of a server with a novel heat dissipation device according to an embodiment of the present invention (without the outer shell).

[0018] Figure 3 Schematic diagram of the working principle of a server with a novel heat dissipation device according to an embodiment of the present invention.

[0019] Figure 4 It is a schematic diagram of the existing server liquid cooling system.

[0020] Figure 5 1 is a schematic diagram of a system working process of a server with a novel heat dissipation device according to an embodiment of the present invention.

[0021] The above drawings include the following figure marks: 100, chassis; 110, motherboard; 120, partition; 130, power supply unit; 140, external interface; 150, hard disk; 160, dustproof grille; 200, air compressor; 300, condensation pipe; 400, electronic expansion valve; 500, heat dissipation cold plate; 600, special fan. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0023] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, top, bottom, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0024] In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments, not for limiting the present invention. The term "and / or" used herein includes any combination of one or more related listed items.

[0025] It should be understood that, although the terms first, second, third, etc. may be used to describe various elements in the present disclosure, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from each other. For example, without departing from the scope of the present disclosure, the first element may also be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0026] Reference Figures 1 to 5 In some embodiments, according to the server with a novel heat dissipation device of the present invention, reference is made to Figures 1 to 3 , comprising: a chassis 100, wherein a mainboard 110 is arranged in the chassis 100, and the mainboard 110 is at least provided with a baseboard management controller BMC, a central processing unit CPU and a graphics processing unit GPU; A heat dissipation device, which is disposed in the chassis 100 and is electrically connected to the baseboard management controller BMC. The heat dissipation device includes an air compressor 200, a condensation pipeline 300, an electronic expansion valve 400, and a heat dissipation cold plate 500 which are sequentially connected through pipelines; The heat dissipation cold plate 500 is used to dissipate heat for the central processing unit CPU and the graphics processing unit GPU. The number of the heat dissipation cold plates 500 is the sum of the number of the central processing unit CPU and the graphics processing unit GPU. The heat dissipation cold plate 500 is closely installed on the central processing unit CPU and the graphics processing unit GPU.

[0027] The beneficial effects of the present invention include: the server with the novel heat dissipation device is light, highly mobile, has a low cost of use, and is a more intelligent liquid-cooled server; the liquid cooling system and the server are integrated into a whole, without increasing the cost of the environmental site, and are not restricted by the site of use; the server and the heat dissipation system interact, and the heat dissipation system is included in the intelligent management range of the baseboard management controller BMC; it is more energy-efficient, and can accurately and effectively control the cooling capacity to prevent the server from being over-cooled or ineffectively cooled.

[0028] Specifically, the server with a new type of heat dissipation device described in the present invention introduces a small air compressor 200 into the AI ​​server, plus components such as pipelines, special fans 600, electronic expansion valves 400, temperature control sensors, and heat dissipation cold plates 500, combined with the server's internal control circuit board and the baseboard management controller BMC of the core management controller chip, to form a complete cold plate server heat dissipation cooling system solution. In this solution, Freon, a common refrigerant medium in life, plays a major role. The refrigerant Freon is injected into the compressor. Driven by the operation of the compressor, Freon circulates in the pipeline, and when it flows through the heat dissipation cold plates 500 of heat-generating devices such as the central processing unit CPU and the graphics processing unit GPU, it takes away most of its heat, thereby achieving the purpose of cooling and dissipating the central processing unit CPU and the graphics processing unit GPU.

[0029] Reference Figure 4At present, the mainstream cold plate liquid cooling server in the market is mainly composed of outdoor cooling tower, CDU (cold capacity distribution unit), rack + water collector + quick connector, etc. The total cost of these cooling system components is not cheap, and the cooling tower also takes up a lot of storage space. The main principle of this type of cooling system is that CDU provides cooling water to the terminal server equipment through the rack and quick connector. The cooling water flows in the cold plate + pipe inside the server, and takes away the heat of the heat-generating components inside the server through the cold plate. The water that heats up after flowing through the cold plate then flows back to the CDU through the quick connector as shown by the red line in the figure. The heated water is cooled down by the heat exchange unit inside the CDU and the outdoor cooling tower. The cooled water flows out from the outlet of the CDU again to dissipate heat for the server, and the cycle continues. This liquid cooling solution has the following disadvantages: the cost of building a water cooling system facility is high, often hundreds of thousands, and is not the best choice for small businesses; it occupies a large area and has poor mobility; servers and other equipment are passive and cannot participate in controlling the water cooling system's operating mode to adjust the cooling capacity; there is a risk of leakage; ordinary water contains a large amount of impurities and dirt, which will accumulate inside the pipes over time and cannot be cleaned, affecting the heat conduction effect.

[0030] Further, refer to Figure 1 and Figure 2 The condensing pipe 300 of the heat dissipation device is arranged in a serpentine shape.

[0031] Further, refer to Figure 1 and Figure 2 The heat dissipation device also includes a dedicated fan 600 for dissipating heat for the condensation duct 300 . The dedicated fan 600 is installed close to the condensation duct 300 and is arranged on the side of the chassis 100 .

[0032] Further, refer to Figure 1 and Figure 2 The heat dissipation device also includes at least two temperature control sensors, which are respectively installed on the heat dissipation cold plate 500 arranged on the central processing unit CPU and the graphics processing unit GPU.

[0033] Further, refer to Figure 1 and Figure 2 , the heat dissipation device also includes a control circuit board, The baseboard management controller BMC of the mainboard 110 , the air compressor 200 , the temperature control sensor, the dedicated fan 600 , the electronic expansion valve 400 , the central processing unit CPU and the graphics processing unit GPU are electrically connected to the control circuit board respectively.

[0034] Further, refer to Figure 1 and Figure 2 The refrigerant medium of the heat dissipation device is Freon.

[0035] Further, refer to Figure 1 and Figure 2 The pipe between the electronic expansion valve 400 and the heat dissipation cold plate 500, the top of the heat dissipation cold plate 500, and the pipe between the heat dissipation cold plate 500 and the air compressor 200 are wrapped with plastic tubes for blocking condensed water.

[0036] Further, refer to Figure 1 and Figure 2 The material of the plastic tube is polyvinyl chloride (PVC).

[0037] Further, refer to Figure 1 and Figure 2 The chassis 100 also includes a partition 120 for separating the motherboard 110 and the heat dissipation device, a power supply device 130 and an external interface 140 are installed on the upper side of the partition 120, a plurality of hard disks 150 and a dustproof grille 160 are installed on the lower side of the partition 120, and a dedicated fan 600 is arranged on the rear side of the dustproof grille 160.

[0038] In a specific embodiment, the outlet of the air compressor 200 is connected to the condensation pipe 300 through a pipe. The condensation pipe 300 is also a surrounding pipe for cooling and condensing the high-temperature and high-pressure gas from the air compressor 200. A special fan 600 is provided on one side of the condensation pipe 300 for dissipating heat from the condensation pipe 300. The condensation pipe 300 is then connected to the electronic expansion valve 400 through a pipe, and then connected to the central processing unit CPU and the graphics processing unit GPU heat dissipation cold plate 500 after passing through the electronic expansion valve 400, and finally returns to the air inlet of the compressor. In addition, the internal circuit control board of the server is respectively connected to the air compressor 200, the temperature control sensor, the special fan 600, the electronic expansion valve 400, the central processing unit CPU and the graphics processing unit GPU, etc., to achieve the purpose of controlling these components in turn. The baseboard management controller BMC controller chip of the server can realize real-time monitoring of the above components.

[0039] In principle, based on the thermodynamic principle of physics, the refrigerant in the pipeline is compressed, condensed and evaporated, and the liquid evaporates from liquid to gas, which will take away the surrounding heat. The refrigerant Freon is allowed to boil and evaporate in the closed pipeline, so as to take away the heat on the heat dissipation cold plate 500 of the central processing unit CPU and the graphics processing unit GPU, thereby achieving the purpose of reducing the temperature of the central processing unit CPU and the graphics processing unit GPU. The air compressor 200 uses the refrigerant in the compressed cylinder to become a high-temperature and high-pressure gas. After being discharged through the pipeline, it is acted on by a dedicated fan 600 in the condensation pipeline 300 component, and the refrigerant is cooled and releases heat to become a high-pressure liquid, which flows to the electronic expansion valve 400. The expansion valve uses the internal narrow area. When the high-pressure refrigerant liquid passes through, the pressure is instantly released, just like the nozzle pot used for spraying flowers in life. The liquid sprayed out is misty, and the temperature also drops suddenly. The temperature of the refrigerant passing through the expansion valve is already extremely low. When it flows through the heat dissipation cold plate 500 of the central processing unit CPU and the graphics processing unit GPU, it evaporates and takes away the heat on its cold plate. The refrigerant flowing through the heat dissipation cold plate 500 is then transported back to the internal cylinder of the compressor through the pipeline, thereby achieving the purpose of circulating refrigeration and heat dissipation.

[0040] At the same time, refer to Figure 3 In order to improve the reliability of the cooling system and prevent the cooling plate 500 and the pipes (blue) through which the low-temperature refrigerant passes from contacting the air and forming water droplets on their surfaces, the top of the cooling plate 500 and the blue pipes in the figure can be sealed with a thick layer of soft PVC plastic, similar to the sealing strip of a refrigerator, to isolate the air from the cold plate and the refrigeration pipes, which can effectively prevent the problem of condensed water. On the other hand, it can also protect the stored cold, prevent the loss of cold, and improve energy efficiency.

[0041] In the scheme, a temperature control sensor is attached to the heat dissipation cold plate 500. The temperature control sensor converts the collected temperature into an electrical signal and transmits it to the control circuit board. The baseboard management controller BMC adjusts the switch of the expansion valve according to the electrical signal, and then promotes its internal valve structure to make the channel opening of the expansion valve larger or smaller, so as to increase or reduce the flow of refrigerant to the heat dissipation cold plate 500. The more the flow of refrigerant, the more obvious the cooling and heat dissipation effect; conversely, the less the flow of refrigerant, the higher the cooling temperature. Therefore, the expansion valve plays a role in controlling the flow and flow rate of the refrigerant in this system to achieve the regulation and control of the cooling and heat dissipation temperature. In addition, it can be seen from the figure that the baseboard management controller BMC monitors the temperature of the heat-generating components such as the central processing unit CPU and the graphics processing unit GPU in real time. The baseboard management controller BMC can actively send the valve adjustment command to the electronic expansion valve 400 through the control circuit board. In the server system, the baseboard management controller BMC plays an important role in management and monitoring. When it finds that the heat dissipation effect is not obvious, it can accurately adjust the flow of the refrigerant and adjust the heat dissipation system in a timely and effective manner.

[0042] With the participation of the intelligent management of the baseboard management controller BMC, in addition to being able to accurately adjust the flow of the refrigerant, the refrigeration system can also be made more energy-efficient. The traditional cold plate water-cooled server system does not have the participation of the intelligent management of the baseboard management controller BMC, that is, there is no interactive dialogue between the cooling system and the server. When the server workload does not require so much cooling capacity, there is no way to notify the cooling system to make adjustments. In this case, the server is overcooled and dissipated. This causes a waste of resources such as power supply, and also affects the life of the CDU and cooling tower in the cooling system. In the solution of the present invention, the baseboard management controller BMC monitors the temperature of the heat-generating devices such as the central processing unit CPU and the graphics processing unit GPU and their heat-dissipating cold plate 500 in real time. When the server workload is light, or the central processing unit CPU and the graphics processing unit GPU continue to be low for a long time and far below the high temperature alarm threshold, the BMC can control the operating frequency of the compressor, the speed of the dedicated fan 600, and even intermittently shut down the compressor to achieve energy-saving effects. Users can also set the temperature threshold of the heat-generating devices such as the central processing unit CPU and the graphics processing unit GPU through the baseboard management controller to control the operating frequency of the compressor or turn it on and off, making the management of the server more intelligent.

[0043] Further, refer to Figure 3 and Figure 4 The present invention also proposes a server heat dissipation control method, which is applied to the server with the novel heat dissipation device. The server heat dissipation control method comprises the following steps: S100, the server is turned on, and the baseboard management controller BMC obtains and determines whether the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the starting operating temperature threshold of 50° C. of the heat dissipation device; S200, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than 50° C., the baseboard management controller BMC controls the cooling device to start up and operate with the first working state parameters, wherein the first working state parameters include that the working frequency of the air compressor 200 is 50% of the maximum working frequency, the speed of the dedicated fan 600 is 50% of the maximum speed, and the opening of the expansion valve is level 1; S300, the baseboard management controller BMC monitors the temperature changes of the central processing unit CPU and the graphics processing unit GPU in real time by collecting the electrical signal changes of the temperature control sensor set on the heat dissipation cold plate 500 in real time; S400, if the baseboard management controller BMC monitors that the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the first high temperature alarm threshold of 70°C, the baseboard management controller BMC controls the heat dissipation device to operate with the second working state parameters, wherein the second working state parameters include that the working frequency of the air compressor 200 is 70% of the maximum working frequency, the speed of the dedicated fan 600 is 70% of the maximum speed, and the opening of the expansion valve is level 2; S500: If the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than the first high temperature alarm threshold of 70° C. after the heat dissipation device runs with the second working state parameters for a preset time of 5 minutes, the heat dissipation device continues to run with the second working state parameters until the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than 20° C., and the baseboard management controller BMC controls the heat dissipation device to run with the first working state parameters; S600, if the temperature of the central processing unit CPU or / and the graphics processing unit GPU is between the first high temperature alarm threshold of 70°C and the second high temperature alarm threshold of 90°C after the heat dissipation device runs for a preset time of 5 minutes with the second working state parameter, the baseboard management controller BMC controls the heat dissipation device to run with the third working state parameter, wherein the third working state parameter includes that the working frequency of the air compressor 200 is 85% of the maximum working frequency, the speed of the dedicated fan 600 is the maximum speed, and the opening of the expansion valve is level 3, if the temperature of the central processing unit CPU or / and the graphics processing unit GPU is lower than 20°C after the heat dissipation device runs for a preset time of 5 minutes with the third working state parameter, the baseboard management controller BMC controls the heat dissipation device to run with the first working state parameter; S700: If the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the second high temperature alarm threshold of 90° C. after the heat dissipation device operates with the second working state parameters for a preset time of 5 minutes, the baseboard management controller BMC controls the heat dissipation device to operate with the fourth working state parameters, wherein the fourth working state parameters include that the working frequency of the air compressor 200 is the maximum working frequency, the speed of the dedicated fan 600 is the maximum speed, and the opening of the expansion valve is level 4; S800, in the step S600, if the heat dissipation device operates with the third working state parameter for a preset time of 5 minutes, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the second high temperature alarm threshold of 90° C., the baseboard management controller BMC controls the heat dissipation device to operate with the fourth working state parameter; S900, in steps S700 and S800, after the fourth working state parameter is run for 5 minutes, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU gradually decreases, the fourth working state parameter is continued to be run until the temperature drops below 20° C., the baseboard management controller BMC controls the heat dissipation device to operate with the first working state parameter, and if the temperature of the central processing unit CPU and / or the graphics processing unit GPU does not decrease after the fourth working state parameter is run for 5 minutes, the baseboard management controller BMC records the log event and sends an alarm signal; S1000, at the first working state parameter, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than 10°C, the baseboard management controller BMC controls the cooling device to shut down and returns to step S200 to start a new cycle detection.

[0044] The above is only a preferred embodiment of the present invention. The present invention is not limited to the above implementation. As long as the technical effect of the present invention is achieved by the same means, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the scope of protection of the present disclosure. All should belong to the protection scope of the present invention. Within the protection scope of the present invention, its technical scheme and / or implementation method can have various modifications and changes.

Claims

1. A server with a novel heat dissipation device, characterized in that: include: A chassis (100), wherein a mainboard (110) is arranged in the chassis (100), and the mainboard (110) is provided with at least a baseboard management controller BMC, a central processing unit CPU, and a graphics processing unit GPU; A heat dissipation device, the heat dissipation device being arranged in the chassis (100), the heat dissipation device being electrically connected to the baseboard management controller BMC, the heat dissipation device comprising an air compressor (200), a condensation pipeline (300), an electronic expansion valve (400) and a heat dissipation cold plate (500) which are sequentially connected via pipelines; The heat dissipation cold plate (500) is used to dissipate heat for a central processing unit (CPU) and a graphics processing unit (GPU), the number of the heat dissipation cold plates (500) being the sum of the number of the central processing unit (CPU) and the graphics processing unit (GPU), and the heat dissipation cold plates (500) being closely mounted on the central processing unit (CPU) and the graphics processing unit (GPU).

2. The server with the novel heat dissipation device according to claim 1, characterized in that: The condensation pipe (300) of the heat dissipation device is arranged in a serpentine shape.

3. The server with the novel heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises a dedicated fan (600) for dissipating heat for the condensation pipe (300); the dedicated fan (600) is installed close to the condensation pipe (300) and is arranged on a side of the chassis (100).

4. The server with the novel heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises at least two temperature control sensors, which are respectively mounted on heat dissipation cold plates (500) arranged on a central processing unit (CPU) and a graphics processing unit (GPU).

5. The server with the novel heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a control circuit board, The baseboard management controller BMC of the mainboard (110), the air compressor (200), the temperature control sensor, the dedicated fan (600), the electronic expansion valve (400), the central processing unit CPU and the graphics processing unit GPU are electrically connected to the control circuit board respectively.

6. The server with the novel heat dissipation device according to claim 1, characterized in that: The refrigerant medium of the heat dissipation device is Freon.

7. The server with the novel heat dissipation device according to claim 1, characterized in that: The pipe arranged between the electronic expansion valve (400) and the heat dissipation cold plate (500), the top of the heat dissipation cold plate (500), and the pipe arranged between the heat dissipation cold plate (500) and the air compressor (200) are wrapped with a plastic tube for blocking condensed water.

8. The server with the novel heat dissipation device according to claim 7, characterized in that: The material of the plastic tube is polyvinyl chloride (PVC).

9. The server with a novel heat dissipation device according to claim 1, characterized in that: The chassis (100) further comprises a partition (120) for separating the mainboard (110) and the heat dissipation device; a power supply device (130) and an external interface (140) are mounted on the upper side of the partition (120); a plurality of hard disks (150) and a dustproof grille (160) are mounted on the lower side of the partition (120); and a dedicated fan (600) is arranged on the rear side of the dustproof grille (160).

10. A server heat dissipation control method, applied to a server with a novel heat dissipation device as claimed in any one of claims 1 to 9, characterized in that: The server heat dissipation control method comprises the following steps: S100, the server is turned on, and the baseboard management controller BMC obtains and determines whether the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the starting operating temperature threshold of 50° C. of the heat dissipation device; S200, if the central processing unit CPU and / or the graphics processing unit GPU is higher than 50° C., the baseboard management controller BMC controls the cooling device to start up and operate with first working state parameters, wherein the first working state parameters include that the working frequency of the air compressor (200) is 50% of the maximum working frequency, the rotation speed of the dedicated fan (600) is 50% of the maximum rotation speed, and the opening degree of the expansion valve is level 1; S300 and the baseboard management controller BMC monitor the temperature changes of the central processing unit CPU and the graphics processing unit GPU in real time by collecting the electrical signal changes of the temperature control sensor arranged on the heat dissipation cold plate (500) in real time; S400, if the baseboard management controller BMC monitors that the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than a first high temperature alarm threshold of 70°C, the baseboard management controller BMC controls the heat dissipation device to operate with second working state parameters, wherein the second working state parameters include that the working frequency of the air compressor (200) is 70% of the maximum working frequency, the rotation speed of the dedicated fan (600) is 70% of the maximum rotation speed, and the opening degree of the expansion valve is level 2; S500: If the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than the first high temperature alarm threshold of 70° C. after the heat dissipation device runs with the second working state parameters for a preset time of 5 minutes, the heat dissipation device continues to run with the second working state parameters until the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than 20° C., and the baseboard management controller BMC controls the heat dissipation device to run with the first working state parameters; S600: If, after the heat dissipation device has been running for a preset time of 5 minutes with the second working state parameter, the temperature of the central processing unit CPU or / and the graphics processing unit GPU is between a first high temperature alarm threshold of 70°C and a second high temperature alarm threshold of 90°C, the baseboard management controller BMC controls the heat dissipation device to be run with a third working state parameter, wherein the third working state parameter includes that the working frequency of the air compressor (200) is 85% of the maximum working frequency, the rotation speed of the dedicated fan (600) is the maximum rotation speed, and the opening degree of the expansion valve is level 3; if, after the heat dissipation device has been running for a preset time of 5 minutes with the third working state parameter, if the temperature of the central processing unit CPU or / and the graphics processing unit GPU is lower than 20°C, the baseboard management controller BMC controls the heat dissipation device to be run with the first working state parameter; S700: If the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than a second high temperature alarm threshold of 90° C. after the heat dissipation device operates at the second operating state parameter for a preset time of 5 minutes, the baseboard management controller BMC controls the heat dissipation device to operate at the fourth operating state parameter, wherein the fourth operating state parameter includes that the operating frequency of the air compressor (200) is the maximum operating frequency, the rotation speed of the dedicated fan (600) is the maximum rotation speed, and the opening degree of the expansion valve is level 4; S800, in the step S600, if the heat dissipation device operates with the third working state parameter for a preset time of 5 minutes, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is higher than the second high temperature alarm threshold of 90° C., the baseboard management controller BMC controls the heat dissipation device to operate with the fourth working state parameter; S900, in steps S700 and S800, after the fourth working state parameter is run for 5 minutes, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU gradually decreases, the fourth working state parameter is continued to be run until the temperature drops below 20° C., the baseboard management controller BMC controls the heat dissipation device to operate with the first working state parameter, and if the temperature of the central processing unit CPU and / or the graphics processing unit GPU does not decrease after the fourth working state parameter is run for 5 minutes, the baseboard management controller BMC records the log event and sends an alarm signal; S1000, at the first working state parameter, if the temperature of the central processing unit CPU and / or the graphics processing unit GPU is lower than 10°C, the baseboard management controller BMC controls the cooling device to shut down and returns to step S200 to start a new cycle detection.

Images